CN107801358A - The bypass structure of heat-sink unit - Google Patents
The bypass structure of heat-sink unit Download PDFInfo
- Publication number
- CN107801358A CN107801358A CN201711098570.9A CN201711098570A CN107801358A CN 107801358 A CN107801358 A CN 107801358A CN 201711098570 A CN201711098570 A CN 201711098570A CN 107801358 A CN107801358 A CN 107801358A
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- Prior art keywords
- plate body
- heat
- recess
- sink unit
- hole
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of bypass structure of heat-sink unit, comprising：One first plate body, one second plate body；This first, two plate bodys, which correspondingly cover, to be formed an airtight chamber surface and is provided with a hydrophilic layer, and a capillary structure is provided with airtight chamber, and first plate body is to forming one first recess and one first hole and one second recess at second plate body, first recess engages capillary structure set on the 3rd side of second plate body, support the capillary structure in one end of second recess, the capillary structure does not contact first recess, second plate body has one second hole corresponding with the first hole, can be provided when heat-sink unit needs and run through by the bypass structure of heat-sink unit of the present invention can still keep vacuum-tightness.
Description
Technical field
The present invention relates to a kind of bypass structure of heat-sink unit, espespecially a kind of one kind that provides ensures heat-sink unit through rear interior
The bypass structure that portion's air-tight chamber possesses the heat-sink unit of vacuum tight airtight runs through structure.
Background technology
Existing electronic equipment improves with efficiency, wherein the electronic component as process signal and computing it is relative also compared with
Preceding electronic component produces higher heat, and the general heat dissipation element being most often used includes the members such as heat pipe, radiator, temperature-uniforming plate
Part, and further increase heat dissipation after the electronic component contact generated heat by direct participant, prevent that electronic component temperature is too high
And the facts such as burn.
Temperature-uniforming plate is a kind of heat transfer application in face in a big way and face, and it is different from the point-to-point heat transfer side of heat pipe
Formula, and used suitable for the more narrow place in space.
Temperature-uniforming plate is used in combination and the heat of the heater element on the substrate is conducted by temperature-uniforming plate by existing system with a substrate
Amount, prior art mainly lies in the position that temperature-uniforming plate avoids the chamber, i.e., at the samming plate closing outside four couplings respectively formed with wearing
Hole simultaneously wears a copper post with internal screw thread, and substrate sets the position system of copper post to open up an at least hole with respect to the temperature-uniforming plate, then
These described copper posts are worn simultaneously in a manner of screw lock a screw lock element and the temperature-uniforming plate is fixed on the substrate by hole
On, but this fixed form is arranged at four couplings of the temperature-uniforming plate because of copper post, and distant with the heater element, the temperature-uniforming plate is consolidated
It can not be brought into close contact with heater element after fixed, and then produce thermal chocking；To improve foregoing the problem of can not being brought into close contact, then industry
Copper post is directly correspondingly arranged in the adjacent place at the position that the temperature-uniforming plate and heater element are sticked by person, therefore these described copper post systems
Directly there is the position of chamber through temperature-uniforming plate, though tight ness rating prevents thermal chocking from producing when can increase assembling, the temperature-uniforming plate
Chamber lost air-tightness after destroying by these described copper posts, its chamber interior no longer has a vacuum state, and because
Copper post is through the chamber is destroyed, then the flow path of its internal working fluid is possible therefore interrupted, causes hot transfer efficiency to drop
It is low, or even leakage may also be seriously produced, and then make the temperature-uniforming plate lose heat and pass effectiveness.
Above-mentioned existing temperature-uniforming plate is mainly only capable of being applicable general existing thicker temperature-uniforming plate through structure and run through structure, if use
It can not then be applicable in the temperature-uniforming plate of superthin structure, because ultra-thin temperature-uniforming plate integral thickness is only (below 0.8mm), can not additionally insert
Support column, and if using copper post, the very thin copper post of dimensional thickness certainly will be needed to use, it inserts copper post positioning because thickness is too thin
With difficulty, and the small processing of copper post size is not easy, and after existing temperature-uniforming plate upper plate punching, depressed area and lower plate combine, with reference to
Region does not set capillary structure, then the performance that temperature-uniforming plate heat passes is influenceed, so lid side on the depressed part of the temperature-uniforming plate of thicker
Wall also must be provided with capillary structure, and the capillary structure of the capillary structure connection lower plate of the depressed part side wall of temperature-uniforming plate upper plate is then whole
The existing thicker temperature-uniforming plate of body sight and the temperature-uniforming plate that slimming can not be applied to.
In addition, also there is dealer to carry out manufacturing ultrathin temperature-uniforming plate by etching mode, and it is enterprising in sheet material by etching and processing
Row sets groove or supporting construction except material, and because that need to carry out except the processing of material, therefore sheet metal thickness itself is then that must reserve enough
Thickness begin to carry out except material, furthermore, carry out easily producing the bad situation of structural strength except the position of material and occur, therefore pass through
The processing that the mode of etching carries out ultra-thin temperature-uniforming plate still has the problems such as missing.
The content of the invention
In this way, to solve the shortcomings that above-mentioned prior art, it is a primary object of the present invention to provide one kind to solve existing run through
The bypass structure of the heat-sink unit of vacuum tight leakage missing is caused with air-tight chamber.
In order to achieve the above object, the present invention provides a kind of bypass structure of heat-sink unit, it is characterized in that comprising：
One first plate body, there is one first side, one second side, one first recess, one first hole and one second recess, should
First recess, the second recess are formed by second lateral first side depression, and first hole is located at first depressed part simultaneously
Through first side, the second side；
One second plate body, there is one the 3rd side, one the 4th side and one second hole, the 3rd side and foregoing first side pair
It should cover, first plate body, the second plate body define an airtight chamber jointly, and second hole runs through the 3rd of second plate body
Side, the 4th side, and it is corresponding with first hole；
One hydrophilic layer, located at the first side surface of first plate body；
One capillary structure layer, in the airtight chamber, foregoing second recess supports the capillary structure layer, the capillary knot
Structure layer does not contact first recess.
The bypass structure of described heat-sink unit, wherein：The capillary structure layer is grid body or corpus fibrosum or other tools
There is the structure of porous property.
The bypass structure of described heat-sink unit, wherein：The material of the grid body is copper or aluminium or stainless steel or titanium
Matter.
The bypass structure of described heat-sink unit, wherein：First plate body, the second plate body be copper or aluminium or stainless steel or
Titanium matter.
The bypass structure of described heat-sink unit, wherein：First plate body has a lip and a connecting portion, the lip
Side is located at the periphery of first plate body, and the connecting portion both ends connect first recess and the lip, the connecting portion with this
One recess is recessed.
The bypass structure of described heat-sink unit, wherein：With a heat affected zone, the heat affected zone is convexly equipped in second plate
4th side of body.
It is can ensure that by the bypass structure of the heat-sink unit of the present invention when heat abstractor is carried out through the setting of structure still
The air-tightness of airtight chamber inside heat-sink unit can be possessed really, and this airtight is applied to any samming through structure
Plate, the second recess of the first plate body itself can use as support, substitute the support copper post in existing temperature-uniforming plate to use, enter one
Step, which can improve ultra-thin temperature-uniforming plate, can not set supporting construction, and improve the existing ultrathin samming that groove is opened up by etching mode
Structural strength produced by plate is bad to wait missing, while can keep air-tightness simultaneously through structure in being set on ultrathin temperature-uniforming plate.
Brief description of the drawings
Fig. 1 is the first embodiment three-dimensional exploded view of the bypass structure of heat-sink unit of the present invention；
Fig. 2 is the first embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention；
Fig. 3 is the second embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention；
Fig. 4 is the 3rd embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention.
Description of reference numerals：The bypass structure 1 of heat-sink unit；First plate body 11；First side 111；Second side 112；First
Recess 113；First hole 114；Second recess 115；Second plate body 12；3rd side 121；4th side 122；Second hole 123；The
Two recesses 124；Airtight chamber 13；Hydrophilic layer 14；Capillary structure layer 15；Lip 16；Heat affected zone 17；Connecting portion 18；Thermal source 2.
Embodiment
Fig. 1, Fig. 2 are referred to, is that the airtight first embodiment stereo decomposing combination through structure of heat abstractor of the present invention is cutd open
View, as illustrated, the bypass structure 1 of heat-sink unit of the present invention, comprising：One first plate body 11, one second plate body 12；
First plate body 11 has one first side 111 and one second side 112 and one first recess 113 and one first hole
114 and one second recess 115, first and second recess 113,115 is recessed from second side 112 to first side 111 to be formed,
First hole 114 is located at first recess 113 and runs through first and second side 111,112.
Second plate body 12 has one the 3rd side 121 and one the 4th side 122 and one second hole 123, the 3rd side
121 it is corresponding with foregoing first side 111 cover, and first and second plate body 11,12 defines an airtight chamber 13 jointly, and this second
Hole 123 runs through third and fourth side 121,122 of second plate body 12, and corresponding with first hole 114.
One hydrophilic layer 14 is located at the surface of the first side 111 of first plate body 11.
3rd side 121 of second plate body 12 of one capillary structure layer 15 in the airtight chamber 13, and it is foregoing second recessed
Portion 115 supports one end the capillary structure layer 15, and the capillary structure layer 15 does not contact first recess 113, the capillary structure
Layer 15 is grid body or corpus fibrosum or the structure any of which with porous property.
The periphery of first plate body 11 and the periphery junction of the second plate body 12 have a lip 16, and the lip 16 and preceding
State the first recess 113 to be combined with system of the place of engaging of the 3rd side 121 mode that diffusion is engaged or welded thoroughly of second plate body 12, enter
And closed foregoing airtight chamber 13 keeps vacuum tight, and because first hole 114 and second hole 123 selection are arranged at
The position of foregoing first recess 113 or lip 16, the airtight chamber 13 can be made not to be damaged and possess vacuum-tightness.
First plate body 11 is a position used as condensation effect, and conduction can be combined with other heat-sink units
Heat increase condensation effect, second plate body 12 as absorb heat heated part effect use and can be with an at least thermal source 2
Contact carries out heat transfer.
Referring to Fig. 3, be the second embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention, as illustrated,
The present embodiment part-structure technical characteristic is identical with aforementioned first embodiment therefore will not be described in great detail herein, only the present embodiment with it is foregoing
The difference of first embodiment is in has the hydrophilic layer 14, the projection of a heat affected zone 17 in the surface of the capillary structure layer 15
In the 4th side 122 of second plate body 12, the heat affected zone 17 is as the position directly contacted with thermal source 2, the heat affected zone
17 can be a thick copper sheet or a scale copper any of which, be selected according to the corresponding height of thermal source 2.
Referring to Fig. 4, be the 3rd embodiment assembled sectional view of the bypass structure of heat-sink unit of the present invention, as illustrated,
The present embodiment part-structure technical characteristic is identical with aforementioned first embodiment therefore will not be described in great detail herein, only the present embodiment with it is foregoing
The difference of first embodiment is in has a lip 16 and a connecting portion 18 in first plate body 11, and the lip 16 is located at institute
The periphery of the first plate body 11 is stated, the both ends of connecting portion 18 connect first recess 113 and the lip 16, and the connecting portion 18 is with being somebody's turn to do
It is in direction recess to the 3rd side 121 of second plate body 12 that first recess 113 is identical, and foregoing lip 16 and this is first recessed
Portion 113 is sealingly engaged with the system of connecting portion 18 by way of welding or spreading engagement with second plate body 12.
The system of capillary structure layer 15 is formed by etching groove or sintered copper powder described in foregoing first, second and third embodiment,
The material of the grid body is copper or aluminium or stainless steel or titanium matter any of which, and first and second plate body 11,12 is copper or aluminium
Or stainless steel or titanium matter any of which.
If the material of the grid body is copper or aluminium or stainless steel or titanium matter during from grid body as capillary structure layer
Any of which, it can also be set certainly by the mashed up mode of laminated structure material.
Present invention is primarily aimed at provide a kind of heat-sink unit with vacuum tight chamber to set when needs run through
When putting screw lock element, have and run through and keep the structure that runs through of vacuum-tightness, and due to directly in first and second plate body 11,12
The structure (the first recess 113) for running through and engaging and (the second recess 115) with support effect are formed, can not only be realized super
Slim temperature-uniforming plate has support keeps airtight effect structure when running through simultaneously.
First and second recess 113,115 of first plate body 11 of this case does not limit to be formed with any form processing, can be
Pressure sludge ice or the impact style of embossed are formed, and also can cut the structure that pin is processed or non-traditional processing mode is formed by machinery
Body.
Claims (6)
1. a kind of bypass structure of heat-sink unit, it is characterized in that comprising：
One first plate body, there is one first side, one second side, one first recess, one first hole and one second recess, this first
Recess, the second recess are formed by second lateral first side depression, and first hole is located at first depressed part and runs through
First side, the second side；
One second plate body, there is one the 3rd side, one the 4th side and one second hole, the 3rd side lid corresponding with foregoing first side
Close, first plate body, the second plate body define an airtight chamber jointly, and second hole is through the 3rd side of second plate body, the
Four sides, and it is corresponding with first hole；
One hydrophilic layer, located at the first side surface of first plate body；
One capillary structure layer, in the airtight chamber, foregoing second recess supports the capillary structure layer, the capillary structure layer
First recess is not contacted.
2. the bypass structure of heat-sink unit as claimed in claim 1, it is characterised in that：The capillary structure layer be grid body or
Corpus fibrosum or other there is the structure of porous property.
3. the bypass structure of heat-sink unit as claimed in claim 2, it is characterised in that：The material of the grid body is copper or aluminium
Or stainless steel or titanium matter.
4. the bypass structure of heat-sink unit as claimed in claim 1, it is characterised in that：First plate body, the second plate body are
Copper or aluminium or stainless steel or titanium matter.
5. the bypass structure of heat-sink unit as claimed in claim 1, it is characterised in that：First plate body have a lip and
One connecting portion, the lip are located at the periphery of first plate body, and the connecting portion both ends connect first recess and the lip,
The connecting portion and first recess are recessed.
6. the bypass structure of heat-sink unit as claimed in claim 1, it is characterised in that：With a heat affected zone, the heat affected zone
It is convexly equipped in the 4th side of second plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711098570.9A CN107801358B (en) | 2017-11-09 | 2017-11-09 | The bypass structure of heat-sink unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711098570.9A CN107801358B (en) | 2017-11-09 | 2017-11-09 | The bypass structure of heat-sink unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107801358A true CN107801358A (en) | 2018-03-13 |
| CN107801358B CN107801358B (en) | 2019-09-06 |
Family
ID=61549136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711098570.9A Active CN107801358B (en) | 2017-11-09 | 2017-11-09 | The bypass structure of heat-sink unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107801358B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882644A (en) * | 2018-07-25 | 2018-11-23 | 奇鋐科技股份有限公司 | Heat-sink unit |
| CN111010858A (en) * | 2019-12-30 | 2020-04-14 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN113464871A (en) * | 2021-06-30 | 2021-10-01 | 江西展耀微电子有限公司 | Lamp film, preparation method thereof and electronic equipment |
| US11910574B2 (en) | 2018-08-05 | 2024-02-20 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
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| US20080224019A1 (en) * | 2007-03-14 | 2008-09-18 | Shi-Ping Luo | Support device for heat dissipation module |
| CN201904323U (en) * | 2010-11-17 | 2011-07-20 | 深圳东桥华瀚科技有限公司 | Heat homogenizing plate |
| CN106813525A (en) * | 2017-02-08 | 2017-06-09 | 锘威科技(深圳)有限公司 | A kind of flat-plate heat pipe structure and its manufacture method |
| CN207491438U (en) * | 2017-11-09 | 2018-06-12 | 奇鋐科技股份有限公司 | The bypass structure of heat-sink unit |
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2017
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080224019A1 (en) * | 2007-03-14 | 2008-09-18 | Shi-Ping Luo | Support device for heat dissipation module |
| CN201904323U (en) * | 2010-11-17 | 2011-07-20 | 深圳东桥华瀚科技有限公司 | Heat homogenizing plate |
| CN106813525A (en) * | 2017-02-08 | 2017-06-09 | 锘威科技(深圳)有限公司 | A kind of flat-plate heat pipe structure and its manufacture method |
| CN207491438U (en) * | 2017-11-09 | 2018-06-12 | 奇鋐科技股份有限公司 | The bypass structure of heat-sink unit |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882644A (en) * | 2018-07-25 | 2018-11-23 | 奇鋐科技股份有限公司 | Heat-sink unit |
| US11910574B2 (en) | 2018-08-05 | 2024-02-20 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
| CN111010858A (en) * | 2019-12-30 | 2020-04-14 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| WO2021136073A1 (en) * | 2019-12-30 | 2021-07-08 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method for heat dissipation device, and electronic apparatus |
| CN111010858B (en) * | 2019-12-30 | 2021-11-16 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN113464871A (en) * | 2021-06-30 | 2021-10-01 | 江西展耀微电子有限公司 | Lamp film, preparation method thereof and electronic equipment |
| CN113464871B (en) * | 2021-06-30 | 2023-08-15 | 江西新菲新材料有限公司 | Lamp film, preparation method thereof and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107801358B (en) | 2019-09-06 |
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