CN107846819A - Heat abstractor is airtight to run through structure - Google Patents

Heat abstractor is airtight to run through structure Download PDF

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Publication number
CN107846819A
CN107846819A CN201711087177.XA CN201711087177A CN107846819A CN 107846819 A CN107846819 A CN 107846819A CN 201711087177 A CN201711087177 A CN 201711087177A CN 107846819 A CN107846819 A CN 107846819A
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CN
China
Prior art keywords
airtight
run
heat abstractor
hollow cylinder
plate body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711087177.XA
Other languages
Chinese (zh)
Other versions
CN107846819B (en
Inventor
沈庆行
张富贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201711087177.XA priority Critical patent/CN107846819B/en
Publication of CN107846819A publication Critical patent/CN107846819A/en
Application granted granted Critical
Publication of CN107846819B publication Critical patent/CN107846819B/en
Active legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

A kind of heat abstractor is airtight to run through structure, comprising:One first plate body, one second plate body, a hollow cylinder;First and second plate body correspondingly covers and forms an airtight chamber, run through first and second plate body through the hollow cylinder, and the hollow cylinder has flanged structure in place of first and second plate body is contacted, and reach the airtight effect of airtight chamber in place of first and second plate body through the closed hollow cylinder of the flanged structure.

Description

Heat abstractor is airtight to run through structure
【Technical field】
A kind of heat abstractor is airtight to run through structure, espespecially a kind of to run through through the hollow cylinder with flanged structure with gas The heat abstractor of close chamber is simultaneously combined by the hollow cylinder and its flanged structure with the heat abstractor, and then provides a kind of radiating Device is airtight to run through structure.
【Background technology】
Existing electronic equipment improves with efficiency, wherein as processing signal and computing electronic component it is relative also compared with Preceding electronic component produces higher heat, and the general heat dissipation element being most often used includes heat pipe, radiator, temperature-uniforming plate etc. Element, and through heat dissipation is further increased after the electronic component contact of direct participant heating, prevent electronic component temperature mistake It is high and the facts such as burn.
Temperature-uniforming plate is a kind of face in a big way and the heat transfer application in face, and it is different from the point-to-point heat transfer side of heat pipe Formula, and used suitable for the more narrow part in space.
It is known that temperature-uniforming plate and a substrate are used in combination and passed through the heat that temperature-uniforming plate conducts the heater element on the substrate, Known technology mainly avoids the position of the chamber in temperature-uniforming plate, i.e., at the samming plate closing four outer couplings respectively formed with perforation simultaneously Wearing one has the copper post of internal screw thread, and substrate sets the position of copper post to open up an at least hole, then through one with respect to the temperature-uniforming plate The temperature-uniforming plate is fixed on the substrate by screw lock element by wearing the copper post and hole simultaneously in a manner of screw lock, but this fixation Mode is distant with the heater element because copper post is arranged at four couplings of the temperature-uniforming plate, and the temperature-uniforming plate is first with heating after fixing Part can not be brought into close contact, and then produce thermal chocking;To improve the foregoing problem that can not be brought into close contact, then dealer is straight by copper post The adjacent place for being correspondingly arranged in the position that the temperature-uniforming plate is sticked with heater element is connect, therefore the copper post directly has through temperature-uniforming plate The position of chamber, though tight ness rating prevents thermal chocking from producing when can increase assembling, the chamber of the temperature-uniforming plate is run through by the copper post Air-tightness is lost after destruction, its chamber interior no longer has vacuum state, and destroys the chamber because copper post runs through, then in it The flow path of the working fluid in portion is possible therefore interrupted, causes hot transfer efficiency to reduce, or even seriously also there may be let out Leakage, and then make the temperature-uniforming plate lose heat and pass effectiveness.
Furthermore U.S. Patent number 7066240 and 6302192 and a kind of equalizing plate structure 5 of 7,100,680 3 cases announcement, one Body 51 has the first flat board 511 and the second flat board 512 being separated from each other, and is provided with an outer protuberance 513 in the body periphery, So that the outer protuberance 513 is connected and forms a closed chamber 514;One groove 5111 is located on the first flat board 511 and remote The outer protuberance 513, and be connected with second flat board 512;One opening 52 penetrate first flat board 511 groove 5111 and Second flat board 512, and the groove 5111 includes an outer annular surface 5112, and with corresponding ring one of on the second flat board 512 Shape edge surface 5121 is connected so that the opening 52 is independently isolated from outside the body 51;The extension of one spacer portion 53 is contacted with the Between one flat board 511, the second flat board 512;One capillary fiber structure 54 is located at the closed chamber 514, though this structure by The design of groove 5111 and with supporting construction and with airtight effect, but because the setting of groove is made inside the temperature-uniforming plate The cavity space of steam-condensate circulating is greatly reduced, and the relative setting because of groove causes the contact area of temperature-uniforming plate and thermal source to diminish, Therefore not only hot transfer efficiency reduces contact area and also greatly reduced, and such a it is through structure and the position that can not confirm to run through It is no to keep airtight really.
Therefore known have the disadvantage that:
1. it is also easy to produce thermal chocking;
2. heat transfer area is reduced;
3. hot transfer efficiency reduces.
【The content of the invention】
Therefore, it is the shortcoming that solves above-mentioned known technology, the main purpose of the present invention, there is provided run through known to a kind of solution The heat abstractor for causing vacuum tight to leak with air-tight chamber runs through airtight construction.
For up to above-mentioned purpose, the present invention provides a kind of heat abstractor and runs through airtight construction, comprising:One first plate body, one Second plate body;
First plate body has one first side and one second side and one first hole, first hole through this first First and second side of plate body;Second plate body has one the 3rd side and one the 4th side and one second hole, the 3rd side with Foregoing first side is corresponding to be covered, and first and second plate body defines an airtight chamber jointly, second hole through this second Third and fourth side of plate body;Free end is in the hollow cylinder both ends and has one first flange and one second flange respectively, and The hollow cylinder wears first and second hole, and first and second flange be sticked respectively with second, four side and seal this First, the periphery of two holes.
For up to above-mentioned purpose, the present invention provides a kind of heat abstractor and runs through airtight construction, comprising:One first plate body, one Second plate body;
First plate body has one first side and one second side and one first hole, first hole through this first First and second side of plate body;Second plate body has one the 3rd side and one the 4th side and a hollow cylinder, the 3rd side with Foregoing first side is corresponding to be covered, and first and second plate body defines an airtight chamber jointly, and the hollow cylinder is by the 3rd side Integrally extend to first plate body, and correspondingly wear foregoing first hole, the hollow cylinder is through one end of first hole Free end, and have one first flange, first flange, which is sticked, second side and seals the periphery of first hole.
It is can ensure that through the airtight structure that runs through of heat abstractor of the present invention when heat abstractor is carried out through the setting of structure The air-tightness of heat sink interior airtight chamber can still be possessed really.
【Brief description of the drawings】
Fig. 1 is known technology heat abstractor top view;
Fig. 2 is known technology combination of radiating device sectional view;
Fig. 3 is the airtight first embodiment three-dimensional exploded view through structure of heat abstractor of the present invention;
Fig. 4 is the airtight first embodiment assembled sectional view through structure of heat abstractor of the present invention;
Fig. 5 is the airtight second embodiment assembled sectional view through structure of heat abstractor of the present invention;
Fig. 6 is the airtight 3rd embodiment assembled sectional view through structure of heat abstractor of the present invention;
Fig. 7 is the airtight fourth embodiment assembled sectional view through structure of heat abstractor of the present invention;
Fig. 8 is airtight the 5th embodiment assembled sectional view through structure of heat abstractor of the present invention.
Primary symbols explanation:
Heat abstractor is airtight to run through structure 1
First plate body 11
First side 111
Second side 112
First hole 113
First convex body 114
Second plate body 12
3rd side 121
4th side 122
Second hole 123
Hollow cylinder 13
First flange 131
Second flange 132
Through hole 133
Airtight chamber 14
Hydrophilic layer 141
Hydraulic fluid 2
Capillary structure 3.
【Embodiment】
Fig. 3,4 are referred to, are that the airtight first embodiment stereo decomposing through structure of heat abstractor of the present invention combines section view Figure, as illustrated, heat abstractor of the present invention is airtight to run through structure 1, comprising:In one first plate body 11, one second plate body 12, one Void column body 13;
First plate body 11 has one first side 111 and one second side 112 and one first hole 113, first hole 113 run through first and second side 111,112 of first plate body 11, and first and second side 111,112 sets up first plate body 11 separately Upper and lower both sides.
Second plate body 12 has one the 3rd side 121 and one the 4th side 122 and one second hole 123, the described 3rd, Four sides 121,122 set up the upper and lower both sides of second plate body 12 separately, and the 3rd side 121 is corresponding with foregoing first side 111 Cover, and first and second plate body 11,12 defines an airtight chamber 14 jointly, second hole 123 runs through second plate body 12 Third and fourth side 121,122.
The both ends of hollow cylinder 13 are free end and have one first flange 131 and one second flange 132, institute respectively First and second flange 131,132 is stated to set up two ends of the hollow cylinder 13 separately and set in being mutually perpendicular to extension with the hollow cylinder 13 Put, and the hollow cylinder 13 wears first and second hole 113,123, and first and second flange 131,132 respectively with this 2nd, four sides 112,122 are sticked and trim second, four side 112,122 surfaces and the week for sealing first and second hole 113,123 Edge, make the part of first and second hole 113,123 of the hollow cylinder 13 and first and second plate body 11,12 keep airtight, keep Airtight permeable welding or diffusion engagement or bonding any of which mode are carried out, and the hollow cylinder 13 has pass through aperture 133, through the both ends of hollow cylinder 13, and the through hole 133 can be set internal thread (not shown) and be carried out for screw lock element Screw lock uses.
The material of first and second plate body 11,12 is copper or aluminium or stainless steel or titanium matter any of which, first and second plate Phase same material can be selected or in a manner of mashed up with the use of all may be used in body 11,12.
The position that first side 111 of first plate body 11 is correspondingly arranged in the airtight chamber 14 is provided with a hydrophilic layer 141, and through the steam-condensate circulating efficiency of hydraulic fluid 2 in the hydrophilic layer 141 increase airtight chamber 14.
Referring to Fig. 5, it is the airtight second embodiment assembled sectional view through structure of heat abstractor of the present invention, as schemed institute Show, the present embodiment part-structure is identical with aforementioned first embodiment therefore will not be described in great detail herein, only the present embodiment and foregoing first The 3rd side 121 that the difference of embodiment is in the second plate body 12 in the airtight chamber 14 has a capillary structure 3, institute The outer rim that capillary structure 3 does not contact the hollow cylinder 13 is stated, the capillary structure 3 is grid body or corpus fibrosum or had more The structure any of which of porous, electrochemical deposition or electricity are can pass through when the capillary structure 3 is the structure of porous property Casting or 3D are printd or mode of printing is formed in a manner of the part or lamination.
When selection forms the structure of porous property through electrochemical deposition mode, its material for copper or nickel or aluminium or is led The good metal any of which of thermal property.
If during from grid body as capillary structure the material of the grid body be copper or aluminium or stainless steel or titanium matter its In it is any, also can pass through the mashed up mode of laminated material certainly and set.
Referring to Fig. 6, it is the airtight 3rd embodiment assembled sectional view through structure of heat abstractor of the present invention, as schemed institute Show, the present embodiment part-structure is identical with aforementioned second embodiment therefore will not be described in great detail herein, only the present embodiment and foregoing second The difference of embodiment is in plural first convex body 114 and a capillary structure 3, and first convex body 114 is by first plate First side 111 of body 11 extends institute's configuration to the 3rd side 121 of second plate body 12, and the capillary structure 3 is created on the 3rd Side 121, first convex body 114 abut the side of capillary structure 3 in one end of free end, and first convex body 114 is relative to the Be in depression shape in place of two side 112.
Referring to Fig. 7, it is the airtight fourth embodiment assembled sectional view through structure of heat abstractor of the present invention, as schemed institute Show, the present embodiment part-structure is identical with aforementioned first embodiment therefore will not be described in great detail herein, only the present embodiment and foregoing first The difference of embodiment is in the hollow cylinder 13 from the 3rd side 121 of second plate body 12 to first plate body 11 The one extension configuration of the first side 111, and the free end of the hollow cylinder 13 is provided with one first flange 131, and described first is convex Edge 13 be formed at the hollow cylinder 13 be in free end one end, and with the perpendicular extension configuration of the hollow cylinder 13, and this first The first hole 113 that plate body 11 opens up is corresponding with said hollow cylinder 13, and the hollow cylinder 13 wears first hole 113 to the second side 112 of first plate body 11, the first flange 131 of the hollow cylinder 13 be sticked second side 112 with this The surface of two side 112 trims and seals the periphery of first hole 113, make the airtight chamber 14 keep air-tightness, described first Flange 131 extends vertically setting with the hollow cylinder 13.
Referring to Fig. 8, it is airtight the 5th embodiment assembled sectional view through structure of heat abstractor of the present invention, as schemed institute Show, the present embodiment part-structure is identical with foregoing fourth embodiment therefore will not be described in great detail herein, only the present embodiment and the foregoing 4th The difference of embodiment is in extends plural number in the first side 111 of first plate body 11 to the 3rd side 121 of second plate body 12 First convex body 114, the capillary structure 3 are created on the 3rd side 121, and first convex body 114 abuts the side of capillary structure 3, It is recessed at corresponding second side 112 of first convex body 114.
Present invention is primarily aimed at provide a kind of heat abstractor with vacuum tight chamber to set when needs run through When putting screw lock element, have what is run through and keeps vacuum-tightness to run through structure, use maintenance heat sink interior hydraulic fluid Steam-condensate circulating be all that normal operation and the collocation through hydrophilic layer and capillary structure use the internal steam-condensate circulating effect of lifting Rate.

Claims (21)

1. a kind of heat abstractor is airtight to run through structure, it is characterised in that includes:
One first plate body, has one first side and one second side and one first hole, first hole through first plate body it First and second side;
One second plate body, has one the 3rd side and one the 4th side and one second hole, and the 3rd side is relative with foregoing first side It should cover, and first and second plate body defines an airtight chamber jointly, second hole runs through third and fourth side of second plate body;
One hollow cylinder, the hollow cylinder both ends are free end and have one first flange and one second flange respectively, and are somebody's turn to do Hollow cylinder wears first and second hole, and first and second flange be sticked respectively with second, four side and seal this first and second The periphery of hole.
2. heat abstractor according to claim 1 is airtight to run through structure, it is characterised in that hollow cylinder has one to run through Hole, through the hollow cylinder, first and second flange sets up two ends of the hollow cylinder separately and with the hollow cylinder in mutually vertical It is straight to be extended.
3. heat abstractor according to claim 1 is airtight to run through structure, it is characterised in that the first side surface is hydrophilic with one Property layer.
4. heat abstractor according to claim 1 is airtight to run through structure, it is characterised in that the generation of the 3rd side surface has one mao Fine texture.
5. heat abstractor according to claim 4 is airtight to run through structure, it is characterised in that capillary structure is grid body or fibre Tie up body or the structure any of which with porous property.
6. heat abstractor according to claim 4 is airtight to run through structure, it is characterised in that capillary structure sinks through electrochemistry Product or electroforming or 3D prints or mode of printing is formed.
7. heat abstractor according to claim 6 is airtight to run through structure, it is characterised in that the material system of electrochemical deposition is The metal any of which of copper or nickel or aluminium or thermal conductive property well.
8. heat abstractor according to claim 5 is airtight to run through structure, it is characterised in that the material of grid body is copper or aluminium Or stainless steel or titanium matter any of which.
9. heat abstractor according to claim 1 is airtight to run through structure, it is characterised in that first and second plate body is copper or aluminium Or stainless steel or titanium matter any of which.
10. heat abstractor according to claim 4 is airtight to run through structure, it is characterised in that capillary structure does not contact described Hollow cylinder.
11. heat abstractor according to claim 1 is airtight to run through structure, wherein with plural first convex body and a capillary knot Structure, first convex body extend institute's configuration, the capillary knot by the 3rd side of the first lateral second plate body of first plate body Structure is created on the 3rd side, and first convex body abuts the capillary structure side in one end of free end, and first convex body is relative The second side answered is recessed.
12. a kind of heat abstractor is airtight to run through structure, it is characterised in that includes:
One first plate body, has one first side and one second side and one first hole, first hole through first plate body it First and second side;
One second plate body, has one the 3rd side and one the 4th side and a hollow cylinder, and the 3rd side is relative with foregoing first side It should cover, and first and second plate body defines an airtight chamber jointly, the hollow cylinder is by the 3rd lateral first plate body one Extension, and correspondingly wears foregoing first hole, and the hollow cylinder be free end through one end of first hole, and has one the One flange, first flange, which is sticked, second side and seals the periphery of first hole.
13. heat abstractor according to claim 12 is airtight to run through structure, it is characterised in that hollow cylinder has one to run through Hole, through the hollow cylinder, first flange sets the end of the hollow cylinder and is in be mutually perpendicular to extend with the hollow cylinder Set.
14. heat abstractor according to claim 12 is airtight to run through structure, it is characterised in that first and third side has a parent Aqueous layer.
15. heat abstractor according to claim 12 is airtight to run through structure, it is characterised in that first and third side surface generates There is a capillary structure.
16. heat abstractor according to claim 15 is airtight to run through structure, it is characterised in that capillary structure be grid body or Corpus fibrosum or the structure any of which with porous property.
17. heat abstractor according to claim 12 is airtight to run through structure, it is characterised in that capillary structure passes through electrochemistry Deposition or electroforming or 3D prints or mode of printing is formed.
18. heat abstractor according to claim 17 is airtight to run through structure, it is characterised in that the material of electrochemical deposition is The metal any of which of copper or nickel or aluminium or thermal conductive property well.
19. heat abstractor according to claim 16 is airtight to run through structure, it is characterised in that the material of grid body be copper or Aluminium or stainless steel or titanium matter any of which.
20. heat abstractor according to claim 12 is airtight to run through structure, it is characterised in that first and second plate body be copper or Aluminium or stainless steel or titanium matter any of which.
21. heat abstractor according to claim 15 is airtight to run through structure, it is characterised in that capillary structure does not contact described Hollow cylinder.
CN201711087177.XA 2017-11-07 2017-11-07 Airtight penetrating structure of heat dissipation device Active CN107846819B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711087177.XA CN107846819B (en) 2017-11-07 2017-11-07 Airtight penetrating structure of heat dissipation device

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Application Number Priority Date Filing Date Title
CN201711087177.XA CN107846819B (en) 2017-11-07 2017-11-07 Airtight penetrating structure of heat dissipation device

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CN107846819A true CN107846819A (en) 2018-03-27
CN107846819B CN107846819B (en) 2021-01-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110572985A (en) * 2019-08-20 2019-12-13 奇鋐科技股份有限公司 heat sink combination structure
WO2020073905A1 (en) * 2018-10-12 2020-04-16 广州力及热管理科技有限公司 Method for manufacturing ultrathin heat tube plate with printed capillary structure

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
CN101614499A (en) * 2008-06-27 2009-12-30 超众科技股份有限公司 Temperature-uniforming plate and preparation method thereof
CN102479972A (en) * 2010-11-30 2012-05-30 比亚迪股份有限公司 Lithium ion secondary battery
CN103025118A (en) * 2011-09-21 2013-04-03 奇鋐科技股份有限公司 Radiating device and manufacturing method thereof
CN205726823U (en) * 2016-04-11 2016-11-23 奇鋐科技股份有限公司 Equalizing plate structure
CN106838313A (en) * 2017-04-10 2017-06-13 新乡市宏伟换热器有限公司 A kind of cooling water tank finned tube sealing ring and the finned tube fixed plate using the sealing ring
CN207854364U (en) * 2017-11-07 2018-09-11 奇鋐科技股份有限公司 Radiator is airtight to run through structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
CN101614499A (en) * 2008-06-27 2009-12-30 超众科技股份有限公司 Temperature-uniforming plate and preparation method thereof
CN102479972A (en) * 2010-11-30 2012-05-30 比亚迪股份有限公司 Lithium ion secondary battery
CN103025118A (en) * 2011-09-21 2013-04-03 奇鋐科技股份有限公司 Radiating device and manufacturing method thereof
CN205726823U (en) * 2016-04-11 2016-11-23 奇鋐科技股份有限公司 Equalizing plate structure
CN106838313A (en) * 2017-04-10 2017-06-13 新乡市宏伟换热器有限公司 A kind of cooling water tank finned tube sealing ring and the finned tube fixed plate using the sealing ring
CN207854364U (en) * 2017-11-07 2018-09-11 奇鋐科技股份有限公司 Radiator is airtight to run through structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020073905A1 (en) * 2018-10-12 2020-04-16 广州力及热管理科技有限公司 Method for manufacturing ultrathin heat tube plate with printed capillary structure
CN110572985A (en) * 2019-08-20 2019-12-13 奇鋐科技股份有限公司 heat sink combination structure

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