CN113453491A - Method for producing a heat sink for electronic components - Google Patents
Method for producing a heat sink for electronic components Download PDFInfo
- Publication number
- CN113453491A CN113453491A CN202110312459.5A CN202110312459A CN113453491A CN 113453491 A CN113453491 A CN 113453491A CN 202110312459 A CN202110312459 A CN 202110312459A CN 113453491 A CN113453491 A CN 113453491A
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- sheet
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- copper
- stack
- edge
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 46
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 34
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 238000007788 roughening Methods 0.000 claims description 3
- 238000003486 chemical etching Methods 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims 2
- 238000005507 spraying Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 13
- 239000002826 coolant Substances 0.000 description 9
- 239000002994 raw material Substances 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 210000003027 ear inner Anatomy 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- PQLZZALLLYUAKL-UHFFFAOYSA-N [Au].[Cr].[Ni] Chemical compound [Au].[Cr].[Ni] PQLZZALLLYUAKL-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000000641 cold extrusion Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- -1 containing copper Chemical compound 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
The invention relates to a method for producing a heat sink (10) for electronic components, comprising the steps of: providing a first sheet material section (122) of 1 to 5mm thickness, the first sheet material section being composed of copper or an alloy mainly containing copper; providing an at least equally thick second sheet section (121) made of aluminum or an alloy containing mainly aluminum; -concentrically stacking the two sheet sections (121,122) on top of each other into a sheet stack (12); and forming the sheet stack (12) into a cooling body (10) with a flat upper side (18) and a contoured lower side forming a cooling structure (14) by means of a cold stamping method; wherein the upper side (18) consists of the material of the first sheet metal section (122), with an edge (181) consisting of the material of the second sheet metal section (121), and the lower side consists entirely of the material of the second sheet metal section (121).
Description
Technical Field
The invention relates to a method for producing a heat sink for an electronic component.
Background
Semiconductor components must generally be protected against overheating by an efficient cooling system. This also applies in particular to so-called power modules (IGBTs), as they are used for controlling electric machines in the field of electric drives and hybrid drives in the motor vehicle sector. Such power modules, the specific design of which is not critical in the context of the invention, usually have a layer of a brazable or sinterable material, for example copper, on the underside thereof, via which the power module can be connected in a suitable manner to the heat sink. The heat sink has a cooling structure, usually in the form of pins, lamellae or labyrinths, which in the final state of assembly sinks into the coolant channel through which the coolant flows. In this case, the "Pin Fin" structure or the "Power Shower" structure is referred to in the jargon.
DE 102013207804B 4 discloses such a power module, such a heat sink and a method for the production thereof. In particular, it is proposed in said document to electronically finish the assembled module (which has a base with a lower side made of copper, directly on which pin-shaped cooling structures made of copper are provided), wherein the copper pins are individually soldered. However, it is known that copper is not suitable for direct contact with the usual coolant for corrosion reasons. On the other hand, copper is an almost ideal material for extracting heat from the electronic component into the coolant due to its high thermal conductivity. To resolve this conflict, the mentioned documents propose: the copper pin is additionally provided with a nickel-gold-chromium coating in order to protect the copper pin from direct contact with the coolant. But this approach has proven to be both labor and cost intensive in general.
Disclosure of Invention
The object of the present invention is to provide an improved method for producing a heat sink for electronic components, which results in a heat sink without loss of function compared to the prior art, in particular in a less time-consuming and cost-consuming manner.
The method according to the invention is distinguished by the following steps:
providing a first sheet section of material 1 to 5mm thick, consisting of copper or an alloy mainly containing copper,
providing an at least equally thick second sheet section of aluminum or an alloy containing mainly aluminum,
-concentrically stacking (Aufeinnerpack) the two sheet sections on top of each other into a sheet stack, and
forming the sheet material stack into a cooling body by means of a cold-stamping method (sometimes referred to as the cold-extrusion method), the cooling body having a flat upper side and a contoured lower side forming a cooling structure,
wherein the upper side consists of the material of the first sheet section with an edge portion consisting of the material of the second sheet section and the lower side consists entirely of the material of the second sheet section.
The invention provides, firstly, that the cooling body is produced in one piece in the context of an extrusion method, in particular a cold stamping method. Such a monolithic molding (massivumfonen) is particularly well suited for soft materials. Joining the one-piece cooling body as a whole (for example by soldering or sintering) to the contact surfaces of the electronic component is much simpler than individually fixing the individual cooling structures. The invention is used here in relation to the selection of materials with copper which is tested and is particularly suitable for heat extraction, wherein in the context of the present description "copper" is used in an abbreviated manner for pure copper and alloys which contain mainly copper.
Of course, the corrosion problem of copper in contact with conventional coolants explained above is also within the scope of the invention. But it purposefully avoids the usual way of additional coating. Instead, a particular raw material is selected for the integral molding. In particular, the cooling body is formed from a two-layer material consisting of copper and aluminum, wherein "aluminum" is used in the scope of the invention in the abbreviated form for pure aluminum as well as alloys consisting mainly of aluminum. That is, aluminum is completely similar to copper in thermal conductivity, but without its corrosion problems when in contact with conventional coolants. On the other hand, the complete replacement of copper by aluminum has proven to be difficult to achieve, since this would lead to significant problems when the heat sink is joined to the electronic component, in particular to its copper contact surface. That is, copper and aluminum cannot be brazed or sintered to each other.
Of course, this poor connectability of copper and aluminum also applies to the raw material of the forming method. However, it has been found that only sheet metal sections of copper and aluminum that are pressed one on top of the other, i.e., that are connected to one another without a material fit (which are jointly subjected to cold-stamping), are connected to one another in a tight manner, in part by a force fit, in part by a form fit, and possibly also in part by a material fit, which ensures not only the mechanical stability of the composite material cooling body but also the thermal contact required for the main function of the heat extraction of the composite material cooling body.
The preferred thickness of the stack of sheets of about 2-10mm is determined by the typical structural depth of the cooling structure. In this respect, the present invention is not different from a manufacturing method for a cooling structure formed by unifying raw materials by a molding material. It has proven advantageous within the scope of the invention to provide two sheet types with similar thicknesses. However, it is particularly expedient here for the copper to make up at most 50%, preferably 25% to 45%, of the total thickness of the sheet stack. Thereby, it is ensured in any case that: the upper side is a contact surface made of substantially copper, which can be easily joined, in particular soldered or sintered, to a copper contact surface of the electronic component. On the other hand, light and cost-effective aluminum occupies the largest part of the cooling body volume, so that at the same time effective corrosion protection and significant cost and weight savings are achieved. However, the thickness of the copper sheet cannot be too small, since for the construction of the above-mentioned tight connection between copper and aluminum, which is not yet fully described in detail, as large a surface contact as possible between the two materials is required, so that the copper should be drawn as far as possible into the formed cooling structure. This automatically takes place in the region of the forming, but with the proviso that the copper layer has a certain minimum thickness compared to the structural depth of the cooling structure. As already indicated above, this minimum thickness is about 25% of the thickness of the stack of sheets.
In order to make a sufficiently deep immersion of the cooling structure into the coolant channel possible, it is necessary to also protect the edges of the copper layer of the resulting cooling body from contact with the coolant. In the context of the cold stamping method, it is therefore preferably provided that the material at the edge of the second sheet metal section, i.e. the aluminum layer, is stretched onto the edge of the first sheet metal section, i.e. the copper layer, so that an edge portion is formed at the upper side, which is formed by the material of the first sheet metal section. Especially in the case of thicker copper layers, this is associated with a significant material flow (material flows) of the aluminum, which can lead to undesirably thin portions of the aluminum layer. In order to overcome this, in a development of the invention it is provided that (in the case of a concentric stack of two sheet metal sections) the second sheet metal section projects laterally on all sides beyond the first sheet metal section. This results in that the laterally projecting edge of the aluminum sheet does not have to circulate (umflie β en) the copper sheet in the region of the shaping, but can be at least partially bent.
Preferably, the surfaces of the sheet metal sections facing one another in the sheet metal stack are roughened before the step of stacking the sheet metal sections on one another. The microstructuring improves the mutual engagement of the sheet metal during the forming process. The connection is tighter and therefore more stable and longer lasting. Roughening can be carried out, for example, by means of laser radiation. Corresponding techniques are basically known to the person skilled in the art. Laser roughening is particularly advantageous in terms of equipment expenditure and the avoidance of sheet contamination. Alternatively or additionally, the surface can also be roughened by means of chemical etching and/or blasting techniques, such as sandblasting, sprayed glass or sprayed corundum (korundtrahlen).
The cooling structure formed within the scope of the molding method can have a shape which is customary in the prior art, in particular it can be formed in the form of pins, lamellae and/or labyrinths.
Further details and advantages of the invention emerge from the following detailed description and the accompanying drawings.
Drawings
Here:
figure 1 shows a schematic view of a preferred embodiment of a base material for carrying out the method according to the invention,
FIG. 2 shows a schematic partial cross-sectional view of a cooling body produced according to the invention, an
Fig. 3 shows a schematic top view of a cooling body produced according to the invention.
Detailed Description
In the drawings, like reference characters designate the same or similar elements.
Fig. 1 shows, in a very schematic representation, the raw materials for carrying out the method according to the invention for producing a heat sink 10. A sheet material stack 12 composed of an aluminum sheet material 121 and a copper sheet material 122 is used as a raw material. The two sheets 121,122 have a similar material thickness in the embodiment shown, but with the aluminum sheet 121 projecting laterally beyond the copper sheet 122 on all sides. The sheets 121,122 are not brazed or welded (verserwei beta t) to each other due to the incompatibility of aluminum and copper. Rather, mechanical stabilization is sufficient for their relative positions. The mechanical stability can be improved by point-by-point bonding.
The starting material shown in fig. 1 is subjected to a cold-stamping method according to the invention and is shaped into a cooling body 10, wherein the cross-sectional area at the edge is shown very schematically in fig. 2. The cooling structure 14 is designed in the framework of a molding, which can be designed in the form of pins, lamellae or labyrinths. Terms such as "pin fin" or "Shower-Power" are used for this purpose in the jargon. Each cooling element 14 comprises: an inner body 142, the copper plate 122 being formed into an inner body; and an outer protective layer 141 into which the aluminum plate material 121 is molded. Those skilled in the art will understand that: the forming of the sheet 121,122 into the cooling element structures 141,142 takes place simultaneously.
In the illustrated embodiment, the body 142 of the interior of the cooling element 14 is hollow. Depending on the particular design of the cold stamping process and the desired shape of the cooling element 14, the inner body 142 may also be constructed of a solid material.
In the embodiment shown, which is particularly advantageous, the edge 16 of the heat sink 10 is likewise of two-layer design, wherein the outer edge layer 161 made of aluminum completely covers the inner edge layer 162 made of copper. This can be done either by "drawing high" (Hochziehen) aluminum material or, in particular in the case of the use of the starting material according to fig. 1, by bending (umbigen) aluminum sheet 121 (or by combining both techniques).
A cooling body is produced which, in a plan view of its upper side 18, can have the impression as shown very schematically in fig. 3. The upper side 18 of the heat sink 10 has an inner surface 182 made of copper, which serves in particular to contact a contact surface, not shown, of an electronic component to be cooled, which is usually likewise made of copper or at least can be soldered or sintered to copper. The engagement surface 182 is surrounded by an edge surface 181 made of aluminum, which corresponds to the edge of the cooling body 10 on the outside, which is provided with the reference symbol 161 in fig. 2.
Of course, the embodiments discussed in the specific description and shown in the drawings are merely illustrative of embodiments of the invention. Those skilled in the art, having the benefit of this disclosure, will appreciate a wide variety of alternative possibilities.
List of reference numerals
10 Cooling body
12 sheet Stack
121 aluminum plate
122 copper plate
14 Cooling element
Inner body of 14114
14214 protective layer
16 edge
16116 outer layer
16216 internal layer
1810 upper side of
18118 edge of the container
18218 inner face/engagement face.
Claims (8)
1. A method for producing a heat sink (10) for electronic components, comprising the following steps:
-providing a first sheet material section (122) of 1 to 5mm thickness, consisting of copper or an alloy mainly containing copper;
-providing an at least equally thick second sheet section (121) of aluminium or an alloy mainly comprising aluminium;
-concentrically stacking the two sheet sections (121,122) on top of each other into a sheet stack (12); and is
-shaping the sheet stack (12) into a cooling body (10) with a flat upper side (18) and a contoured lower side forming a cooling structure (14) by means of a cold stamping method;
wherein the upper side (18) consists of the material of the first sheet metal section (122) with an edge (181) consisting of the material of the second sheet metal section (121), and the lower side consists entirely of the material of the second sheet metal section (121).
2. Method according to claim 1, characterized in that in the context of the cold-stamping method, the material at the edge of the second sheet section (121) is stretched onto the edge (162) of the first sheet section (122) so that an edge portion (181) is formed at the upper side (18) which is otherwise composed of the material of the first sheet section (122).
3. Method according to any one of the preceding claims, characterized in that the second sheet section (121) projects laterally beyond the first sheet section (121) on all sides in the stack (12) of sheets.
4. A method according to any of the preceding claims, wherein the surfaces of the sheet sections facing each other in the sheet stack are roughened prior to the step of stacking the sheet sections on top of each other.
5. The method according to claim 4, characterized in that the roughening of the surface is carried out by means of laser irradiation, chemical etching and/or spraying techniques.
6. Method according to any one of the preceding claims, characterized in that the cooling structure (14) is at least partially configured pin-like.
7. Method according to any one of the preceding claims, characterized in that the cooling structure is at least partially configured sheet-like.
8. Method according to any one of the preceding claims, characterized in that the cooling structure is at least partially constructed as a labyrinth.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102020203786.8 | 2020-03-24 | ||
| DE102020203786.8A DE102020203786A1 (en) | 2020-03-24 | 2020-03-24 | Method for manufacturing a heat sink for an electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113453491A true CN113453491A (en) | 2021-09-28 |
Family
ID=77658502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110312459.5A Pending CN113453491A (en) | 2020-03-24 | 2021-03-24 | Method for producing a heat sink for electronic components |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113453491A (en) |
| DE (1) | DE102020203786A1 (en) |
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| Publication number | Publication date |
|---|---|
| DE102020203786A1 (en) | 2021-09-30 |
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