CN113453417A - 具有两个互连的射频组件的射频装置 - Google Patents
具有两个互连的射频组件的射频装置 Download PDFInfo
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Abstract
本发明的实施例提供了一种射频装置。该射频装置包括第一射频组件、第二射频组件和布线基板,该布线基板具有形成在布线基板上的同轴射频线,其中,第一射频组件和第二射频组件经由同轴射频线进行连接。
Description
技术领域
本发明的实施例涉及一种射频装置,具体地涉及一种包括两个互连的射频组件的射频装置。进一步的实施例涉及一种用于制造射频装置的方法。
背景技术
图1示出了根据[1]的包括两个互连的射频组件(基带板和天线板)12和14在内的常规射频装置的示意性电路框图。
如图1所示,通常,当建立移动通信系统时,经由同轴电缆16和同轴端子将射频组件12(诸如基带板,例如,与PCB(印刷电路板)上的其他电路一起的基带处理器)与至少一个其他电子组件14(诸如天线板(通常为天线、RFIC等))之间的电连接实现为射频连接(通常能够处理60GHz)。这里的图2和图3示出了根据[1]的实现为基带系统级封装的基带板12的同轴端子18和20以及天线板14。
然而,在生产中,这种常规的射频装置需要相对较高的制造成本。当与用于制造要连接的电子组件的常规使用的现代高度集成的所谓的系统级封装技术相比,使用的同轴元件(插座和电缆)以及到电子组件的相应金属化平面的端子或连接的成本相当可观。
发明内容
因此,本发明所基于的目的是提供一种允许廉价地连接射频组件的构思。
该目的通过独立权利要求来实现。
有利的进一步的发展是从属权利要求的主题。
实施例提供了一种射频装置。该射频装置包括第一射频组件、第二射频组件和布线基板,该布线基板具有形成在布线基板上的同轴射频线,第一射频组件和第二射频组件经由同轴射频线进行连接。
在实施例中,第一射频组件是基带板。
在实施例中,第二射频组件是天线板。
在实施例中,同轴射频线包括至少一个内部导体、和用于射频屏蔽至少一个内部导体的至少一个外部导体,至少一个外部导体围绕至少一个内部导体,至少一个外部导体和至少一个内部导体彼此绝缘。
在实施例中,第一射频组件的至少一个射频信号端子经由至少一个内部导体与第二射频组件的至少一个射频信号端子连接,第一射频组件的至少一个射频屏蔽端子经由至少一个外部导体与第二射频组件的至少一个射频屏蔽端子连接。
在实施例中,至少一个内部导体在布线基板中横向穿过,使得至少一个内部导体与布线基板的与第一射频组件和/或第二射频组件相邻的表面平行布置,其中,至少一个内部导体经由在布线基板中竖直穿过的至少两个相互隔开的连接导体而被引导到布线基板的表面,其中,至少两个连接导体中的第一连接导体与第一射频组件的至少一个射频信号端子连接,其中,至少两个连接导体中的第二连接导体与第二射频组件的至少一个射频信号端子连接。
在实施例中,围绕至少一个内部导体的至少一个外部导体在至少两个连接导体的区域中是打开的。
进一步的实施例提供了一种移动无线电通信设备,该移动无线电通信设备包括本文/上面描述的射频装置。
进一步的实施例提供了一种用于制造射频装置的方法。该方法包括提供第一射频组件。此外,该方法包括提供第二射频组件。此外,该方法包括提供布线基板,该布线基板具有形成在布线基板中的同轴射频线。此外,该方法包括经由布线基板来连接第一射频组件和第二射频组件。
在实施例中,第一射频组件是基带板。
在实施例中,第二射频组件是天线板。
在实施例中,同轴射频线包括至少一个内部导体和用于射频屏蔽至少一个内部导体的至少一个外部导体,至少一个外部导体围绕至少一个内部导体,至少一个外部导体和至少一个内部导体彼此绝缘。
在实施例中,当经由布线基板来连接第一射频组件和第二射频组件时,第一射频组件的至少一个射频信号端子经由至少一个内部导体与第二射频组件的至少一个射频信号端子连接,其中,当经由布线基板来连接第一射频组件和第二射频组件时,第一射频组件的至少一个射频屏蔽端子经由至少一个外部导体与第二射频组件的至少一个射频屏蔽端子连接。
在实施例中,至少一个内部导体在布线基板中横向穿过,使得至少一个内部导体与布线基板的与第一射频组件和第二射频组件相邻的表面平行布置,其中,至少一个内部导体经由在布线基板中竖直穿过的至少两个相互隔开的连接导体而被引导到布线基板的表面,其中,当经由布线基板来连接第一射频组件和第二射频组件时,至少两个连接导体中的第一连接导体与第一射频组件的至少一个射频信号端子连接,其中,当经由布线基板来连接第一射频组件和第二射频组件时,至少两个连接导体中的第二连接导体与第二射频组件的至少一个射频信号端子连接。
在实施例中,提供布线基板包括提供基板并在该基板中形成同轴射频线。
进一步的实施例提供了一种设备。该设备包括至少两个电射频组件,每个电射频组件包括用于射频信号的至少一个端子焊盘,并且每个电射频组件包括用于射频屏蔽的至少一个外部导体的至少一个端子焊盘。此外,该设备包括布线基板,该布线基板包括屏蔽的射频传输线结构,该屏蔽的射频传输线结构包括至少一个内部导体、至少一个外部导体、围绕至少一个内部导体的绝缘体、以及围绕至少一个外部导体的绝缘层。此外,该设备包括在第一射频组件的至少一个端子焊盘与布线基板中的屏蔽的射频传输线结构的至少一个内部导体之间的至少一个导电连接。此外,该设备包括在第二射频组件的至少一个端子焊盘与布线基板中的屏蔽的射频传输线结构的至少一个外部导体之间的至少一个导电连接。
进一步的实施例提供了一种用于连接至少两个电射频组件的方法。该方法包括提供至少两个电射频组件的步骤,每个电射频组件包括用于射频信号的至少一个端子焊盘,并且每个电射频组件包括用于射频屏蔽的至少一个外部导体的至少一个端子焊盘。此外,该方法包括提供布线基板的步骤。此外,该方法包括生产屏蔽的射频传输线结构的步骤,该屏蔽的射频传输线结构包括在布线基板中的至少一个内部导体、至少一个外部导体、围绕至少一个内部导体的绝缘体、以及围绕至少一个外部导体的绝缘体。此外,该方法包括在第一射频组件的至少一个端子焊盘与布线基板中的屏蔽的射频传输线结构的至少一个内部导体之间产生至少一个导电连接的步骤。此外,该方法包括在第二射频组件的至少一个端子焊盘与布线基板中的屏蔽的射频传输线结构的至少一个外部导体之间产生至少一个导电连接的步骤。
本发明的实施例借助于具有集成传输线的布线基板来提供组件的射频电连接。
本发明的实施例提供了一种用于制造电子射频系统的方法,特别是用于制造用于移动通信的高度集成的所谓的系统级封装的方法。
本发明的实施例经由特定布线基板实现了至少两个电射频组件的电连接,该特定布线基板具有集成的射频传输线结构和到射频组件的金属化平面的合适的端子连接。
附图说明
下面将参考附图更详细地描述本发明的实施例,在附图中:
图1是根据[1]的包括两个互连的射频组件(基带板和天线板)在内的常规射频装置的示意性电路框图,
图2示出了根据[1]的具有同轴端子插座的基带板(基带系统级封装)的示意性截面图,
图3示出了根据[1]的具有同轴端子插座的天线板的示意图,
图4示出了根据本发明的实施例的射频装置的示意性截面图,
图5示出了根据本发明的另一实施例的射频装置的示意性截面图,
图6示出了根据实施例的图5的射频装置的示意性截面图,以及沿着在两个射频组件之间的区域中垂直穿过同轴射频线的截面的布线基板106的示意性截面图,
图7示出了图5的射频装置的示意性截面图,沿着在第一射频组件的射频屏蔽端子的区域中垂直穿过同轴射频线的截面的布线基板的示意性截面图,沿着在第一射频组件的射频信号端子的区域中垂直穿过同轴射频线的截面图的布线基板的示意性截面图,以及在第一射频组件的区域中的布线基板的俯视图,
图8示出了根据本发明的实施例的具有射频装置的移动无线电通信系统的参与方的示意性电路框图,
图9示出了根据本发明的实施例的用于制造射频装置的方法的流程图,以及
图10示出了根据实施例的用于连接至少两个电射频组件的方法的流程图。
具体实施方式
在本发明的实施例的以下描述中,在附图中,相同的元件或效果相同的元件设置有相同的附图标记,使得它们的描述可以互换。
图4示出了根据本发明的实施例的射频装置100的示意性截面图。射频装置100包括第一射频组件102、第二射频组件104和布线基板106,布线基板106具有形成在布线基板106中的同轴射频线108,第一射频组件102和第二射频组件104经由同轴射频线108进行连接。
图5示出了根据本发明的另一实施例的射频装置100的示意性截面图。换句话说,图5示出了实现形成在布线基板106中的同轴射频线108的方式。
与在图4中出于比较目的而示例性地示出的常规同轴电缆60的情况一样,在实施例中,同轴射频线108可以包括至少一个内部导体110和用于屏蔽(诸如射频屏蔽)至少一个内部导体110的至少一个外部导体112,至少一个外部导体112围绕至少一个内部导体110,并且至少一个外部导体112和至少一个内部导体110例如借助于绝缘体114(例如电介质(诸如SiO2))而彼此绝缘。另外,至少一个外部导体112也可以例如借助于绝缘体116(例如电介质(诸如SiO2))而被绝缘。
在实施例中,至少一个内部导体110可以由导电材料(例如,铜、银或金)制成。
在实施例中,至少一个外部导体112可以由导电材料(例如,铜、银或金)制成。优选地,至少一个外部导体112可以处于参考电位,例如,接地。
在实施例中,第一射频组件102的至少一个射频信号端子130可以经由至少一个内部导体110与第二射频组件104的至少一个射频信号端子132连接,其中,第一射频组件102的至少一个射频屏蔽端子134(和可选的136)经由至少一个外部导体112与第二射频组件104的至少一个射频屏蔽端子138(和可选的140)连接。
在实施例中,至少一个内部导体110可以与布线基板106的与第一射频组件102和/或第二射频组件104相邻的表面142平行地布置,其中,至少一个内部导体110经由布线基板106中的竖直穿过的至少两个相互间隔的连接导体而被引导到布线基板106的表面142,其中,至少两个连接导体中的第一连接导体与第一射频组件102的至少一个射频信号端子130连接,以及其中,至少两个连接导体中的第二连接导体与第二射频组件104的至少一个射频信号端子132连接。
在实施例中,第一射频组件102可以是基带板。
在实施例中,第二射频组件104可以是天线板。
换句话说,图5示出了两个组件102和104借助于具有集成传输线108(当与具有内部导体(芯部)、绝缘体和射频屏蔽的常规同轴电缆120相比时)的布线基板106进行射频电连接的示例。
换句话说,图5示出了根据本发明的实施例的设备100的示意图。设备100包括至少两个电射频组件102和104,电射频组件各自包括用于射频信号的至少一个端子焊盘130和132并且各自包括用于射频屏蔽的至少一个外部导体112的至少一个端子焊盘134(和可选的136)和138(和可选的140)。此外,设备100包括布线基板106,该布线基板106包括屏蔽的射频传输线结构108,该屏蔽的射频传输线结构108包括至少一个内部导体110、至少一个外部导体112、围绕至少一个内部导体110的绝缘体114、以及围绕至少一个外部导体112的绝缘层116。此外,设备100包括第一射频组件102的至少一个端子焊盘130与布线基板106中的屏蔽的射频传输线结构108的至少一个内部导体110之间的至少一个导电连接。此外,设备100包括第二射频组件104的至少一个端子焊盘132与布线基板106中的屏蔽的射频传输线结构108的至少一个外部导体112之间的至少一个导电连接。
图6示出了根据实施例的来自图5的射频装置100的示意性截面图160,以及沿着在两个射频组件102和104之间的区域中垂直穿过同轴射频线108的截面150的布线基板106的示意性截面图162。换句话说,图6示出了实现同轴射频线108的方式的实施例。
如图6的截面图162所示,同轴射频线108可以包括内部导体110和外部导体112,外部导体112围绕内部导体110,外部导体112和内部导体110例如借助于绝缘体114而彼此绝缘,并且绝缘体116也围绕外部导体112。
图7示出了图5的射频装置100的示意性截面图160,沿着在第一射频组件102的射频屏蔽端子134的区域中垂直穿过同轴射频线108的截面152的布线基板106的示意性截面图164,沿着在第一射频组件102的射频信号端子130的区域中垂直穿过同轴射频线108的截面图154的布线基板106的示意性截面图166,以及在第一射频组件102的区域156中的布线基板的俯视图。换句话说,图7示出了实现端子的方式的实施例。
如图7所示,在实施例中,同轴射频线108的内部导体110可以被引导到布线基板106的表面142(参见俯视图168)以用于经由在布线基板106中竖直穿过的连接导体170(参见截面图166)与第一射频组件102的射频信号端子130连接。在实施例中,同轴射频线108的围绕内部导体110的至少一个外部导体112可以在竖直穿过的连接导体170的区域172中是打开的。
还如图7所示,在实施例中,同轴射频线108的外部导体112可以被引导到布线基板106的表面142(参见俯视图168)以用于经由在布线基板106中竖直穿过的连接导体174(参见截面164)与第一射频组件102的屏蔽端子134连接。
图8示出了根据本发明的实施例的具有射频装置100的移动无线电通信系统(例如,3G、LTE或5G)的参与方180的示意性电路框图。
参与方180可以例如是移动终端设备(用户设备)或IoT(物联网)节点。
图9示出了根据本发明的实施例的用于制造射频装置100的方法200的流程图。方法200包括提供第一射频组件的步骤202。此外,该方法包括提供第二射频组件的步骤204。此外,该方法包括步骤206:提供具有形成在布线基板中的同轴射频线的布线基板。此外,该方法包括步骤208:经由布线基板来连接第一射频组件和第二射频组件。
图10示出了根据实施例的用于连接至少两个电射频组件的方法220的流程图。方法220包括提供至少两个电射频组件的步骤,电射频组件各自包括用于射频信号的至少一个端子焊盘并且各自包括用于射频屏蔽的至少一个外部导体的至少一个端子焊盘。此外,方法220包括提供布线基板的步骤224。此外,方法220包括生产屏蔽的射频传输线结构的步骤226,该屏蔽的射频传输线结构包括在布线基板中的至少一个内部导体、至少一个外部导体、围绕至少一个内部导体的绝缘体、以及围绕至少一个外部导体的绝缘体。此外,方法220包括步骤228:在第一射频组件的至少一个端子焊盘与布线基板中的屏蔽的射频传输线结构的至少一个内部导体之间产生至少一个导电连接。此外,方法220包括步骤230:在第二射频组件的至少一个端子焊盘与布线基板中的屏蔽的射频传输线结构的至少一个外部导体之间产生至少一个导电连接。
例如,本文描述的实施例用作组件(例如,移动通信中的基带板和天线板)之间的常规同轴连接的替代。
如在描述的开头部分所述,本发明的实施例克服了经由常规同轴电缆进行连接的缺点。
本发明的实施例允许借助于填充(populating)技术来高生产率地大规模生产多功能射频模块。
尽管已经结合设备描述了一些方面,但是应当理解的是,这些方面也表示对相应方法的描述,使得设备的块或元件也被理解为对应的方法步骤或方法步骤的特征。类比地,结合方法步骤描述或被描述为方法步骤的方面也表示对对应设备的对应块或细节或特征的描述。一些或全部方法步骤可以由硬件设备(或使用硬件设备)来执行,例如微处理器、可编程计算机或电子电路。在一些实施例中,最重要的方法步骤中的某一些或数个可以由这种设备来执行。
上述实施例仅表示对本发明的原理的说明。清楚的是,本文所述的装置和细节的修改和变形对于本领域其他技术人员将是显而易见的。因此,本发明旨在仅由所附权利要求的范围来限制,而非使用对实施例的描述和讨论所已经提出的具体细节来限制。
参考文献列表
Claims (15)
1.一种射频装置(100),包括:
第一射频组件(102),
第二射频组件(104),以及
布线基板(106),具有形成在所述布线基板(106)上的同轴射频线(108),
其中,所述第一射频组件(102)和所述第二射频组件(104)经由所述同轴射频线(108)进行连接。
2.根据权利要求1所述的射频装置(100),
其中,所述第一射频组件(102)是基带板。
3.根据权利要求1所述的射频装置(100),
其中,所述第二射频组件(104)是天线板。
4.根据权利要求1所述的射频装置(100),
其中,所述同轴射频线(108)包括至少一个内部导体(110)和用于射频屏蔽所述至少一个内部导体(110)的至少一个外部导体(112),
其中,所述至少一个外部导体(112)围绕所述至少一个内部导体(110),
其中,所述至少一个外部导体(112)和所述至少一个内部导体(110)彼此绝缘。
5.根据权利要求4所述的射频装置(100),
其中,所述第一射频组件(102)的至少一个射频信号端子(130)经由所述至少一个内部导体(110)与所述第二射频组件(104)的至少一个射频信号端子(132)连接,
其中,所述第一射频组件(102)的至少一个射频屏蔽端子(134、136)经由所述至少一个外部导体(112)与所述第二射频组件(104)的至少一个射频屏蔽端子(138、140)连接。
6.根据权利要求5所述的射频装置(100),
其中,所述至少一个内部导体(110)在所述布线基板(106)中横向穿过,使得所述至少一个内部导体(110)与所述布线基板(106)的与所述第一射频组件(102)和/或所述第二射频组件(104)相邻的表面(142)平行布置,
其中,所述至少一个内部导体(110)经由在所述布线基板(106)中竖直穿过的至少两个相互隔开的连接导体(170)而被引导到所述布线基板(106)的表面(142),
其中,所述至少两个连接导体(170)中的第一连接导体与所述第一射频组件(102)的至少一个射频信号端子(130)连接,
其中,所述至少两个连接导体(170)中的第二连接导体与所述第二射频组件(104)的至少一个射频信号端子(132)连接。
7.根据权利要求6所述的射频装置(100),
其中,围绕所述至少一个内部导体(110)的所述至少一个外部导体(112)在所述至少两个连接导体(170)的区域(172)中是打开的。
8.一种移动通信系统的参与方,
其中,所述参与方包括根据权利要求1所述的射频装置(100)。
9.一种用于制造射频装置(100)的方法(200),所述方法包括:
提供(202)第一射频组件(102),
提供(204)第二射频组件(104),
提供(206)布线基板(106),所述布线基板(106)具有形成在所述布线基板(106)中的同轴射频线(108),以及
经由所述布线基板(106)来连接(210)所述第一射频组件(104)。
10.根据权利要求9所述的方法(200),
其中,所述第一射频组件(102)是基带板。
11.根据权利要求9所述的方法(200),
其中,所述第二射频组件(104)是天线板。
12.根据权利要求9所述的方法(200),
其中,所述同轴射频线(108)包括至少一个内部导体(110)和用于射频屏蔽所述至少一个内部导体(110)的至少一个外部导体(112),
其中,所述至少一个外部导体(112)围绕所述至少一个内部导体(110),
其中,所述至少一个外部导体(112)和所述至少一个内部导体(110)彼此绝缘。
13.根据权利要求12所述的方法(200),
其中,当经由所述布线基板(106)连接(208)所述第一射频组件(102)和所述第二射频组件(104)时,所述第一射频组件(102)的至少一个射频信号端子(130)经由所述至少一个内部导体(110)与所述第二射频组件(104)的至少一个射频信号端子(132)连接,
其中,当经由所述布线基板(106)连接(208)所述第一射频组件(102)和所述第二射频组件(104)时,所述第一射频组件(102)的至少一个射频屏蔽端子(134、136)经由所述至少一个外部导体(112)与所述第二射频组件(104)的至少一个射频屏蔽端子(138、140)连接。
14.根据权利要求13所述的方法(200),
其中,所述至少一个内部导体(110)在所述布线基板(106)中横向穿过,使得所述至少一个内部导体(110)与所述布线基板(106)的与所述第一射频组件(102)和/或所述第二射频组件(104)相邻的表面(142)平行布置,
其中,所述至少一个内部导体(110)经由在所述布线基板(106)中竖直穿过的至少两个相互隔开的连接导体(170)而被引导到所述布线基板(106)的表面(142),
其中,当经由所述布线基板(106)连接(208)所述第一射频组件(102)和所述第二射频组件(104)时,所述至少两个连接导体(170)中的第一连接导体与所述第一射频组件(102)的至少一个射频信号端子(130)连接,
其中,当经由所述布线基板(106)连接(208)所述第一射频组件(102)和所述第二射频组件(104)时,所述至少两个连接导体(170)中的第二连接导体与所述第二射频组件(104)的至少一个射频信号端子(132)连接。
15.根据权利要求9所述的方法(200),
其中,提供(206)所述布线基板(106)包括:
提供基板,
在所述基板中形成所述同轴射频线(108)。
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