CN113452323A - Double-layer packaged constant temperature crystal oscillator - Google Patents
Double-layer packaged constant temperature crystal oscillator Download PDFInfo
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- CN113452323A CN113452323A CN202110808390.5A CN202110808390A CN113452323A CN 113452323 A CN113452323 A CN 113452323A CN 202110808390 A CN202110808390 A CN 202110808390A CN 113452323 A CN113452323 A CN 113452323A
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- 238000009434 installation Methods 0.000 claims abstract description 5
- 239000000919 ceramic Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 4
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- 239000004831 Hot glue Substances 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/02—Details
- H03B5/04—Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
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Abstract
The invention discloses a double-layer packaged constant temperature crystal oscillator, which comprises a shell, an inner package, a temperature control module, an oscillation module and an oscillation wafer, wherein: the shell comprises a cover plate layer, an inner seal mounting layer and a bottom plate layer which are arranged from the top side to the bottom side and are sequentially connected, and the cover plate layer, the inner seal mounting layer and the bottom plate layer are encircled to form a first vacuum cavity; the inner seal comprises a temperature control layer and an oscillation layer which are connected in sequence, and an oscillation wafer is arranged in the second vacuum cavity. The outer shell and the inner seal both adopt a laminated structure, a sealed first vacuum cavity is formed in the outer shell, the inner seal is installed in the first vacuum cavity, the oscillating wafer is installed in a second vacuum cavity of the inner seal, double-layer packaging greatly weakens the influence of the ambient temperature on the oscillating wafer, the oscillating wafer is at a constant temperature, through holes are formed among all layers, conductive adhesive is injected into the through holes to realize the electric connection among all layers, the structure of the crystal oscillator is simplified, the installation space is saved, and automatic production can be realized.
Description
Technical Field
The invention relates to the technical field of electronic component packaging, in particular to a double-layer packaged constant temperature crystal oscillator.
Background
With the development of 5G communication technology and the application of WIFI6 technology, the capacity and rate of communication increase sharply, the communication frequency band increases, and there are higher requirements for the stability and frequency accuracy of the system clock, and meanwhile, the macro base of wireless communication and the layout of a large number of networks of small base stations require that the crystal oscillator providing the clock signal for the system has high stability and high accuracy and also has small size.
Patent application No. CN200510070833.6, entitled "constant temperature type crystal oscillator", provides a crystal oscillator including: a heat supplying body which supplies heat to a crystal resonator from which a plurality of wires are led out to keep a temperature constant; an oscillation element that constitutes an oscillation circuit together with the crystal resonator; a temperature control element constituting a temperature control circuit for controlling the temperature of the crystal resonator; and a circuit board for mounting the heat supply body, the oscillation element, and the temperature control element, and through which a wire for mounting the crystal resonator passes, the heat supply body comprising: a heat conducting plate having through holes for the wires and mounted on the circuit board, and a surface thereof thermally connected directly to the crystal resonator; and a chip resistor for heating, which is mounted on the circuit board adjacent to the heat conductive plate, and which is thermally connected to the heat conductive plate. The oven-controlled crystal oscillator is large in size and packaged by an iron shell, and due to the complex mounting bracket and the formed space structure, the manufacturing process is complex, and automatic large-scale mass production is not easy to realize.
Therefore, there is a need for an oven controlled crystal oscillator that is easy to automate flow line production, and that simplifies the self-operation process by the structural configuration thereof, and at the same time, ensures the temperature control precision, and realizes the stability and high precision of the oscillator frequency.
Disclosure of Invention
The invention aims to overcome the technical defects and provide a double-layer packaged constant temperature crystal oscillator which is used for solving the problems of complex mounting bracket and complex manufacturing process caused by space structure of the oscillator in the prior art.
In order to achieve the technical purpose, the technical scheme of the invention is as follows: a double-layer packaged constant temperature crystal oscillator comprises a shell, an inner package, a temperature control module, an oscillation module and an oscillation wafer, wherein: the shell is provided with a top side and a bottom side, the shell comprises a cover plate layer, an inner seal mounting layer and a bottom plate layer which are arranged along the top side and point to the bottom side and are sequentially connected, the cover plate layer, the inner seal mounting layer and the bottom plate layer surround to form a first vacuum cavity, the inner seal mounting layer and the bottom plate layer form a first ladder for bearing and connecting the inner seal, and the bottom surface of the bottom plate layer covers an oscillation electrode electrically connected with the oscillation module and a temperature control electrode electrically connected with the temperature control module; the inner seal comprises a temperature control layer and an oscillation layer which are sequentially connected, the oscillation layer forms a second vacuum cavity, the oscillation wafer is arranged in the second vacuum cavity, and the oscillation wafer is electrically connected with the oscillation layer; the temperature control module is fixedly connected with the temperature control layer and electrically connected with the inner sealing installation layer, and heats the temperature control layer to keep the second vacuum cavity at a constant temperature; the oscillation module is electrically connected with the bottom plate layer; the bottom plate layer, the inner seal mounting layer and the oscillation layer are respectively provided with a conducting hole, and a conductive column is formed by injecting conductive adhesive into the conducting hole, so that the bottom plate layer is electrically connected with the inner seal mounting layer, and the oscillation layer is electrically connected with the bottom plate layer.
Preferably, the cover plate layer comprises a cover plate, a first ceramic plate and a first connecting plate which are connected in sequence, the first ceramic plate is provided with a first connecting hole, and the first connecting plate is provided with a second connecting hole.
Preferably, the inner seal mounting layer comprises a second connecting plate, and the second connecting plate is provided with a third connecting hole.
Preferably, the bottom plate layer comprises a third connecting plate, a fourth connecting plate and a bottom plate which are sequentially connected, the third connecting plate is provided with a fourth connecting hole, the fourth connecting plate is provided with a fifth connecting hole, and the first connecting hole, the second connecting hole, the third connecting hole, the fourth connecting hole and the fifth connecting hole are sequentially communicated to form the first vacuum cavity.
Preferably, the oscillating module is disposed in the first vacuum chamber and fixedly connected to the base plate.
Preferably, the fourth connecting plate is provided with a first oscillation via hole, the bottom plate is provided with a second oscillation via hole, the first oscillation via hole, the second oscillation via hole and the oscillation electrode are sequentially connected, and the oscillation module is electrically connected with the oscillation module by injecting conductive adhesive into the oscillation via hole and using a connecting wire to electrically connect the first oscillation via hole and the oscillation module.
Preferably, the control by temperature change layer includes the hot plate, the oscillation layer includes second ceramic plate and mounting panel, the mounting hole is seted up to the second ceramic plate, and with the hot plate and the mounting panel surrounds the formation the second vacuum cavity, temperature control module with hot plate fixed connection, the oscillation wafer with the mounting panel electricity is connected.
Preferably, the second connecting plate is provided with a first temperature control via hole, the third connecting plate is provided with a second temperature control via hole, the fourth connecting plate is provided with a third temperature control via hole, the bottom plate is provided with a fourth temperature control via hole, the first temperature control via hole, the second temperature control via hole, the third temperature control via hole and the fourth temperature control electrode are sequentially connected, and the temperature control module is electrically connected with the first temperature control via hole by injecting conductive adhesive into the first temperature control via hole, the second temperature control via hole, the third temperature control via hole and the fourth temperature control via hole and electrically connecting a connecting wire.
Preferably, the double-layer encapsulated oven controlled crystal oscillator further comprises a connection pole piece, and the connection pole pieces are respectively arranged at two ends of the first oscillation via hole, the second oscillation via hole, the first temperature control via hole, the second temperature control via hole, the third temperature control via hole and the fourth temperature control via hole and are electrically connected with the conductive adhesive injected therein.
Preferably, the double-layer packaged oven controlled crystal oscillator further comprises a conducting pole piece, the conducting pole piece is arranged on two sides of the third connecting plate and is arranged on one side of the fourth connecting plate, the fourth connecting plate is close to one side of the third connecting plate and corresponds to the first oscillating conducting hole, the connecting pole piece is electrically connected with the conducting pole piece, the mounting plate is provided with a wafer conducting hole, and conducting glue is injected into the wafer conducting hole to realize the conducting pole piece and the oscillating wafer are electrically connected.
Compared with the prior art, the invention has the beneficial effects that: the shell and the inner seal both adopt a laminated structure, a sealed first vacuum cavity is formed in the shell, the inner seal is installed in the first vacuum cavity, the oscillating wafer is installed in a second vacuum cavity of the inner seal, the influence of the environmental temperature on the oscillating wafer is greatly weakened through double-layer packaging, the oscillating wafer is at a constant temperature, a via hole is formed between each layer, conductive adhesive is injected into the via hole to realize electric connection between each layer, the structure of the crystal oscillator is simplified, the need of setting a complex mounting bracket is avoided, the mounting space is saved, and automatic production can be realized.
Drawings
FIG. 1 is a simplified structural diagram of a two-layer encapsulated oven-controlled crystal oscillator according to the present invention;
FIG. 2 is an exploded view of a double-encapsulated oven-controlled crystal oscillator provided by the present invention;
FIG. 3a is a top perspective view of a two-layer packaged oven controlled crystal oscillator provided by the present invention;
FIG. 3b is a bottom perspective view of a two-layer packaged oven-controlled crystal oscillator provided by the present invention;
FIG. 3c is a perspective view of a hidden cover plate of a dual-encapsulated oven-controlled crystal oscillator according to the present invention;
FIG. 3d is a perspective view of a portion of the structure of the double-encapsulated oven-controlled crystal oscillator showing the oscillating die according to the present invention;
FIG. 3e is a perspective view of a portion of the structure of the exposed oscillation module of the dual-encapsulated oven-controlled crystal oscillator according to the present invention;
FIG. 4 is a perspective view of a third web of a double-encapsulated oven-controlled crystal oscillator provided in accordance with the present invention;
FIG. 5 is a perspective view of a second ceramic plate of the double-encapsulated oven-controlled crystal oscillator provided by the present invention;
FIG. 6 is a perspective view of a double-encapsulated oven-controlled crystal oscillator mounting board provided by the present invention;
FIG. 7a is a perspective view of a connection structure for electronic components of a double-encapsulated oven-controlled crystal oscillator according to the present invention;
FIG. 7b is a front view of the structure of FIG. 7 a;
FIG. 8 is a schematic circuit diagram of a temperature control module in an oven-controlled crystal oscillator;
FIG. 9 is a schematic circuit diagram of an oscillation module in an oven-controlled crystal oscillator;
reference numerals: 1-shell, 2-inner seal, 3-temperature control module, 4-oscillation module, 5-oscillation wafer, 1 a-first vacuum cavity, 2 a-second vacuum cavity, 6-oscillation electrode, 7-temperature control electrode, 8-connection pole piece, 9-conduction pole piece, 11-cover piece layer, 12-inner seal installation layer, 13-bottom plate layer, 21-temperature control layer, 22-oscillation layer, 111-cover plate, 112-first ceramic plate, 113-first connection plate, 121-second connection plate, 131-third connection plate, 132-fourth connection plate, 133-bottom plate, 211-heating plate, 221-second ceramic plate, 222-installation plate, 112 a-first connection hole, 113 a-second connection hole, 121 a-third connection hole, 131 a-fourth connection hole, 132 a-fifth connection hole, 132 b-first oscillation via hole, 133 b-second oscillation via hole, 121 c-first temperature control via hole, 131 c-second temperature control via hole, 132 c-third temperature control via hole, 133 c-fourth temperature control via hole, 131 d-first step, 132 d-second step, 121 d-third step, 221 a-mounting hole, 222 e-wafer via hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the present embodiment provides a double-layer packaged oven controlled crystal oscillator, which includes a housing 1, an inner package 2, a temperature control module 3, an oscillation module 4, and an oscillation wafer 5, where the housing 1 is used to support and protect components therein, the inner package 2 is used to form a closed cavity to keep the oscillation wafer 5 at a constant temperature, the temperature control module 3 is used to detect the temperature of the inner package 2 and generate heat to keep the inner package 2 at a constant temperature, the oscillation module 4 is used to control the oscillation wafer 5 to generate oscillation, the oscillation wafer 5 generates oscillation under the action of current, where:
the shell 1 has top side and bottom side, the shell 1 includes along the directional bottom side arrangement of top side and the cover plate layer 11 that connects gradually, interior mounting layer 12 and bottom plate layer 13, cover plate layer 11, interior mounting layer 12 and bottom plate layer 13 surround and form first vacuum cavity 1a, bottom plate layer 13, interior mounting layer 12 and oscillation layer 22 offer the via hole respectively, it leads the electrical pillar to form through injecting conductive adhesive in the guide through hole, make bottom plate layer 13 and interior mounting layer 12 electricity be connected, oscillation layer 22 is connected with bottom plate layer 13 electricity.
Specifically, the cover sheet layer 11 includes a cover plate 111, a first ceramic plate 112 and a first connecting plate 113 connected in sequence, the first ceramic plate 112 is provided with a first connecting hole 112a, where a ceramic material is used to improve the heat insulation performance of the housing 1, and the first connecting plate 113 is provided with a second connecting hole 113 a. The inner seal mounting layer 12 includes a second connecting plate 121, and the second connecting plate 121 is provided with a third connecting hole 121 a. The bottom plate layer 13 includes a third connecting plate 131, a fourth connecting plate 132 and a bottom plate 133 which are connected in sequence, the third connecting plate 131 is provided with a fourth connecting hole 131a, the fourth connecting plate 132 is provided with a fifth connecting hole 132a, and the first connecting hole 112a, the second connecting hole 113a, the third connecting hole 121a, the fourth connecting hole 131a and the fifth connecting hole 132a are communicated in sequence to form a first vacuum chamber 1 a.
Also, in order to form a stepped structure between the respective connection plates, the first connection hole 112a, the second connection hole 113a, the third connection hole 121a, the fourth connection hole 131a, and the fifth connection hole 132a are concentrically disposed and have sequentially decreasing diameters.
The oscillation module 4 is electrically connected to the floor layer 13. The oscillating module 4 is disposed in the first vacuum chamber 1a and is fixedly connected to the bottom plate 133, where the oscillating module 4 and the bottom plate 133 can be fixed using hot melt adhesive. Specifically, the fourth connecting plate 132 is provided with a first oscillation via hole 132b, the bottom plate 133 is provided with a second oscillation via hole 133b, the first oscillation via hole 132b, the second oscillation via hole 133b and the oscillation electrode 6 are sequentially connected, and the oscillation module 4 and the oscillation electrode 6 are electrically connected by injecting conductive paste into the oscillation via hole and electrically connecting the first oscillation via hole 132b and the oscillation module 4 with a connecting wire.
It is easy to understand that the oscillation module 4 can be installed at other positions that can be electrically connected to the oscillation electrode 6 of the bottom plate 133, such as the bottom side of the bottom plate 133, and similarly, the oscillation module 4 can also be installed at a position between the inner seal 2 and the cover plate 111 in the first vacuum chamber 1a, and the electrical connection to the oscillation electrode 6 of the bottom plate 133 is realized by opening holes on a plurality of connecting plates and injecting conductive glue and connecting by connecting wires.
The inner package mounting layer 12 and the bottom plate layer 13 form a first step 131d for carrying and connecting the inner package 2, specifically, the first step 131d is formed on one side of the third connecting plate 131 close to the second connecting plate 121, and the bottom surface of the bottom plate layer 13 covers the oscillating electrode 6 electrically connected to the oscillating module 4 and the temperature control electrode 7 electrically connected to the temperature control module 3. The inner seal 2 comprises a temperature control layer 21 and an oscillation layer 22 which are sequentially connected, the oscillation layer 22 forms a second vacuum cavity 2a, an oscillation wafer 5 is arranged in the second vacuum cavity 2a, and the oscillation wafer 5 is electrically connected with the oscillation layer 22. Specifically, the temperature control layer 21 includes a heating plate 211, the oscillation layer 22 includes a second ceramic plate 221 and a mounting plate 222, the second ceramic plate 221 has a mounting hole 221a, and surrounds the heating plate 211 and the mounting plate 222 to form a second vacuum chamber 2a, where the heat insulation performance of the inner seal 2 can be improved by using a ceramic material, the temperature control module 3 is fixedly connected to the heating plate 211, and the oscillation wafer 5 is electrically connected to the mounting plate 222.
As a preferred embodiment, the double-layer packaged oven controlled crystal oscillator further includes a connection pole piece 8, the connection pole pieces 8 are respectively disposed at two ends of the first oscillation via hole 132b, the second oscillation via hole 133b, the first temperature control via hole 121c, the second temperature control via hole 131c, the third temperature control via hole 132c, and the fourth temperature control via hole 133c, and are electrically connected to the conductive adhesive injected therein, and the connection pole piece 8 is used for connecting the conductive adhesive in the adjacent via holes, so as to prevent the conductive adhesive from flowing to the gap between the adjacent connection plates to cause conduction between different via holes.
As a preferred embodiment, a second step 132d is formed on one side of the fourth connecting plate 132 close to the third connecting plate 131, the connecting pole piece 8 connected to the first oscillation via hole 132b at the second step 132d is connected to the oscillation module 4 by a connecting wire to realize electrical connection, the temperature control module 3 is fixedly connected to the temperature control layer 21 and electrically connected to the inner sealing mounting layer 12, and the temperature control module 3 heats the temperature control layer 21 to keep the second vacuum cavity 2a at a constant temperature. In this embodiment, the temperature control module 3 is fixedly connected to the heating plate 211, the second connecting plate 121 is provided with a first temperature control via hole 121c, the third connecting plate 131 is provided with a second temperature control via hole 131c, the fourth connecting plate 132 is provided with a third temperature control via hole 132c, the bottom plate 133 is provided with a fourth temperature control via hole 133c, the first temperature control via hole 121c, the second temperature control via hole 131c, the third temperature control via hole 132c and the fourth temperature control electrode 7 are sequentially connected, and the temperature control module 3 is electrically connected to the first temperature control via hole 121c by injecting conductive paste into the first temperature control via hole 121c, the second temperature control via hole 131c, the third temperature control via hole 132c and the fourth temperature control via hole 133c and by electrically connecting wires. Specifically, a third step 121d is formed on one side of the second connection plate 121 close to the first connection plate 113, and the connection pole piece 8 connected to the first temperature control via hole 121c and the temperature control module 3 in the third step 121d are connected by a connection wire, so as to achieve electrical connection.
In order to realize the electrical connection between the oscillation wafer 5 and the oscillation electrode 6 of the bottom plate 133, the double-layer packaged oven controlled crystal oscillator further includes a conducting pole piece 9, the conducting pole piece 9 is disposed on two sides of the third connecting plate 131, the connecting pole piece 8 disposed on one side of the fourth connecting plate 132 close to the third connecting plate 131 and corresponding to the first oscillation via hole 132b is electrically connected to the conducting pole piece 9, and the mounting plate 222 is provided with a wafer via hole 222e, and the conducting pole piece 9 is electrically connected to the oscillation wafer 5 by injecting conductive adhesive into the wafer via hole 222 e.
The circuit operation principle of the temperature control module 3 is shown in fig. 8, wherein RT is a thermistor, and R1, R2, and R3 form a wheatstone temperature measuring bridge, and unbalanced voltage of the bridge is amplified by an operational amplifier and then sent to a high-precision a/D input end of a system-level MCU; the signal is processed by conversion, software digital filtering and control algorithm, then outputs PWM control signal, in the output channel, PWM drives the base of triode T1, after current is amplified by triode T1, large voltage change is introduced at two ends of R5 load, thus the current change is converted into voltage change, the grid of N-type field effect transistor Q1 is controlled, because Q1 field effect transistor is voltage control device, input impedance is large, the signal can well control the heating current passing R6. The circuit is provided with a temperature signal sensing circuit consisting of a bridge and an operational amplifier, has high sensitivity, generates a PWM (pulse width modulation) signal through MCU (microprogrammed control unit) calculation processing, amplifies the signal through a triode, converts the amplified current signal into electric charge, and passes through a heating resistor to realize high-precision temperature control.
The circuit working principle of the oscillation module 4 is as shown in fig. 9, and the MCU is used to control the capacitor array digital control unit, so as to accurately adjust the oscillation frequency under the control of the digital switch capacitor array, thereby ensuring the stability of the output frequency. For traditional varactor regulation, adopt this mode, calculate through MCU, combine vibration wafer temperature characteristic curve, generate cubic temperature compensation function, accurate adjustment capacitor array again, the adjustment frequency is more accurate.
In summary, according to the double-layer packaged oven controlled crystal oscillator provided by the invention, the outer shell and the inner seal both adopt a laminated structure, the sealed first vacuum cavity is formed in the outer shell, the inner seal is installed in the first vacuum cavity, the oscillating wafer is installed in the second vacuum cavity of the inner seal, the double-layer packaging greatly weakens the influence of the ambient temperature on the oscillating wafer, so that the oscillating wafer is at a constant temperature, the via holes are formed among the layers, and the conductive adhesive is injected into the via holes to realize the electrical connection among the layers, thereby simplifying the structure of the crystal oscillator, avoiding the need of arranging a complex mounting bracket, saving the mounting space, and realizing automatic production.
The above embodiments of the present invention should not be construed as limiting the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. The utility model provides a double-deck encapsulated oven controlled crystal oscillator which characterized in that, includes shell, interior package, temperature control module, oscillation module and oscillation wafer, wherein:
the shell is provided with a top side and a bottom side, the shell comprises a cover plate layer, an inner seal mounting layer and a bottom plate layer which are arranged along the top side and point to the bottom side and are sequentially connected, the cover plate layer, the inner seal mounting layer and the bottom plate layer surround to form a first vacuum cavity, the inner seal mounting layer and the bottom plate layer form a first ladder for bearing and connecting the inner seal, and the bottom surface of the bottom plate layer covers an oscillation electrode electrically connected with the oscillation module and a temperature control electrode electrically connected with the temperature control module;
the inner seal comprises a temperature control layer and an oscillation layer which are sequentially connected, the oscillation layer forms a second vacuum cavity, the oscillation wafer is arranged in the second vacuum cavity, and the oscillation wafer is electrically connected with the oscillation layer;
the temperature control module is fixedly connected with the temperature control layer and electrically connected with the inner sealing installation layer, and heats the temperature control layer to keep the second vacuum cavity at a constant temperature;
the oscillation module is electrically connected with the bottom plate layer;
the bottom plate layer, the inner seal mounting layer and the oscillation layer are respectively provided with a conducting hole, and a conductive column is formed by injecting conductive adhesive into the conducting hole, so that the bottom plate layer is electrically connected with the inner seal mounting layer, and the oscillation layer is electrically connected with the bottom plate layer.
2. The dual-encapsulated oven controlled crystal oscillator of claim 1, wherein said cover sheet layer comprises a cover plate, a first ceramic plate and a first connecting plate connected in series, said first ceramic plate defining a first connecting hole, said first connecting plate defining a second connecting hole.
3. The dual-encapsulated oven controlled crystal oscillator according to any of claims 1 to 2, wherein the inner encapsulation mounting layer comprises a second connection plate, and the second connection plate is provided with a third connection hole.
4. The dual-encapsulated oven-controlled crystal oscillator according to claim 3, wherein the bottom plate layer comprises a third connecting plate, a fourth connecting plate and a bottom plate which are connected in sequence, the third connecting plate is provided with a fourth connecting hole, the fourth connecting plate is provided with a fifth connecting hole, and the first connecting hole, the second connecting hole, the third connecting hole, the fourth connecting hole and the fifth connecting hole are communicated in sequence and form the first vacuum cavity.
5. The dual-encapsulated oven controlled crystal oscillator of claim 4, wherein said oscillation module is disposed in said first vacuum chamber and fixedly attached to said base plate.
6. The double-encapsulated oven-controlled crystal oscillator according to claim 5, wherein the fourth connecting plate is provided with a first oscillation via hole, the bottom plate is provided with a second oscillation via hole, the first oscillation via hole, the second oscillation via hole and the oscillation electrode are connected in sequence, and the oscillation module is electrically connected with the oscillation electrode by injecting conductive adhesive into the oscillation via hole and electrically connecting the first oscillation via hole with the oscillation module by a connecting wire.
7. The dual-encapsulated oven controlled crystal oscillator of claim 1, wherein the temperature control layer comprises a heating plate, the oscillation layer comprises a second ceramic plate and a mounting plate, the second ceramic plate is provided with mounting holes and surrounds the heating plate and the mounting plate to form the second vacuum chamber, the temperature control module is fixedly connected to the heating plate, and the oscillation wafer is electrically connected to the mounting plate.
8. The dual-encapsulated oven controlled crystal oscillator according to any of claims 4, 6, and 7, wherein the second connecting plate is provided with a first temperature control via hole, the third connecting plate is provided with a second temperature control via hole, the fourth connecting plate is provided with a third temperature control via hole, the bottom plate is provided with a fourth temperature control via hole, the first temperature control via hole, the second temperature control via hole, the third temperature control via hole, and the fourth temperature control electrode are sequentially connected, and the temperature control module is electrically connected to the temperature control electrode by injecting conductive paste into the first temperature control via hole, the second temperature control via hole, the third temperature control via hole, and the fourth temperature control via hole and electrically connecting a connecting wire to the temperature control module and the first temperature control via hole.
9. The double-encapsulated oven-controlled crystal oscillator according to claim 8, further comprising a plurality of connection pole pieces, wherein the connection pole pieces are respectively disposed at two ends of the first oscillation via hole, the second oscillation via hole, the first temperature-controlled via hole, the second temperature-controlled via hole, the third temperature-controlled via hole, and the fourth temperature-controlled via hole, and are electrically connected to the conductive adhesive injected therein.
10. The double-encapsulated oven-controlled crystal oscillator of claim 9, characterized in that, the double-encapsulated oven-controlled crystal oscillator further comprises a conducting pole piece, the conducting pole piece is disposed on two sides of the third connecting plate, the connecting pole piece disposed on one side of the fourth connecting plate close to the third connecting plate and corresponding to the first oscillating via hole is electrically connected to the conducting pole piece, and the mounting plate is provided with a wafer via hole for electrically connecting the conducting pole piece to the oscillating wafer by injecting conductive adhesive into the wafer via hole.
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| CN202110808390.5A CN113452323A (en) | 2021-07-16 | 2021-07-16 | Double-layer packaged constant temperature crystal oscillator |
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| CN202110808390.5A CN113452323A (en) | 2021-07-16 | 2021-07-16 | Double-layer packaged constant temperature crystal oscillator |
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| JP2003037441A (en) * | 2001-07-26 | 2003-02-07 | Seiko Epson Corp | Piezoelectric device and electronic equipment |
| CN102916672A (en) * | 2012-11-06 | 2013-02-06 | 广东大普通信技术有限公司 | Constant temperature control crystal oscillator and manufacturing method thereof |
| CN104852728A (en) * | 2015-03-27 | 2015-08-19 | 台湾晶技股份有限公司 | Oven controlled crystal oscillator packaged by embedded heating device |
| CN108964632A (en) * | 2018-08-23 | 2018-12-07 | 应达利电子股份有限公司 | A kind of quartz oscillator and the method for manufacturing the quartz oscillator |
| CN209930205U (en) * | 2019-02-25 | 2020-01-10 | 南京海疆创智科技有限公司 | Heat dissipation type temperature compensation crystal oscillator |
| CN111355448A (en) * | 2020-03-12 | 2020-06-30 | 广东惠伦晶体科技股份有限公司 | Constant temperature crystal oscillator |
| CN112994644A (en) * | 2021-03-01 | 2021-06-18 | 泰晶科技股份有限公司 | Constant temperature crystal oscillator |
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Application publication date: 20210928 |