CN109981052A - The double-deck thermostat crystal oscillator configuration and its manufacturing method - Google Patents
The double-deck thermostat crystal oscillator configuration and its manufacturing method Download PDFInfo
- Publication number
- CN109981052A CN109981052A CN201910306909.2A CN201910306909A CN109981052A CN 109981052 A CN109981052 A CN 109981052A CN 201910306909 A CN201910306909 A CN 201910306909A CN 109981052 A CN109981052 A CN 109981052A
- Authority
- CN
- China
- Prior art keywords
- circuit
- internal layer
- connection
- outer layer
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 87
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000919 ceramic Substances 0.000 claims abstract description 40
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 38
- 230000003750 conditioning effect Effects 0.000 claims abstract description 34
- 230000003321 amplification Effects 0.000 claims abstract description 20
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 20
- 239000010453 quartz Substances 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000005476 soldering Methods 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 241000218202 Coptis Species 0.000 claims description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 239000004575 stone Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 151
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/02—Details
- H03B5/04—Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention discloses a kind of double-deck thermostat crystal oscillator configurations, including outer layer assembling structure and the internal layer modular unit being placed in outer layer assembling structure, internal layer modular unit includes ceramic base seat slot, multiple quartz resonator oscillator electrodes, quartz-crystal resonator, internal layer oscillating circuit, temperature sensing circuit and internal layer capping；Outer layer assembling structure includes outer layer pedestal, outer circuit plate, at least one temperature control circuit, amplification conditioning circuit, voltage regulator circuit and package casing.Advantage, this bilayer thermostat crystal oscillator configuration, encapsulating structure in the prior art is not used, but use unencapsulated quartz-crystal resonator, it is in the same seal chamber with internal layer oscillating circuit, temperature sensing circuit, internal layer oscillating circuit, to reduce from chip to temperature sensing circuit, the thermal gradient of internal layer oscillating circuit, the temperature performance of crystal oscillator is preferably improved.
Description
Technical field
The present invention relates to the designs of novel crystal oscillator structure, specifically design a kind of double-deck thermostat crystal oscillator structure.
Background technique
Thermostat crystal oscillator abbreviation constant-temperature crystal oscillator, English abbreviation OCXO (Oven Controlled
Crystal Oscillator), it is the temperature for controlling temperature sensitive quartz-crystal resonator using thermostat, it is made to keep steady
Fixed, the variation of crystal oscillator frequency caused by avoiding because of variation of ambient temperature reaches higher frequency temperature stability.Constant temperature
Crystal oscillator is high-precision frequency source device, and the difference between non-constant-temperature crystal oscillator is: temperature sensitive
Primary Component using thermostat control, keep temperature it is constant, reach high-frequency temperature stability index.
Constant-temperature crystal oscillator is divided into single layer constant-temperature crystal oscillator and the double-deck constant temperature is brilliant according to the difference of its frequency accuracy
Oscillation body device.Single layer constant-temperature crystal oscillator mainly assembles the designs such as crystal resonator, temperature-control circuit, oscillating circuit
In single layer constant temperature slot structure, the variation of temperature sensors sense environmental temperature in structure, the corresponding work for changing heating module
Electric current, so that the temperature of structure be kept to stablize.Heating module, oscillating circuit, the temperature sensor of single layer constant-temperature crystal oscillator
It is difficult although this temperature gradient can be optimized by the design of reasonable heat structure etc. there are certain temperature gradients
Further to be promoted, the application field of especially wide temperature working range, frequency temperature stability is difficult to reach 10-9 amount
Grade or less.Frequency temperature stability enters 10-9 magnitude, general using the double-deck thermostat technology.
It is divided into internal thermostat and external thermostat, internal thermostat and outside in traditional double-deck constant-temperature crystal oscillator
The temperature-adjusting circuit principle of thermostat is identical, and external thermostat carries out secondary constant temperature to internal thermostat, frequency temperature stability
Improvement factor is generally up to 10 times.The frequency temperature stability finally obtained is directly related with internal thermostat circuit and structure.
The AT that crystal is all made of encapsulation in traditional single layer constant-temperature crystal oscillator and bimorph crystal oscillator is cut or SC cuts crystal resonant
Device, temperature sensor, heating module are individual packages device, certainly exist thermal gradient, especially crystal resonator and temperature
Thermal gradient influence between sensor becomes apparent, and Thermal structures design can reduce thermal gradient bring frequency fluctuation, but from temperature control
It is difficult to be promoted in principle.
Summary of the invention
The technical problem to be solved by the present invention is to, for the prior art constant-temperature crystal oscillator structure in temperature range
In (- 20 DEG C to+70 DEG C) when fluctuation, since crystal resonator uses individual packages in printed board and temperature sensing circuit, temperature
Sensitive circuit, temperature-control circuit are spent there are heat transfer, and output frequency precision magnitude has close with temperature range, rate of temperature change
Cut relationship, the technical issues of prior art construction limits the further promotion of final output frequency accuracy.
To solve the above problems, the technical solution used in the present invention is:
A kind of bilayer thermostat crystal oscillator configuration, including outer layer assembling structure and in being placed in outer layer assembling structure
Layer modular unit,
Internal layer modular unit includes the ceramic base seat slot of integral forming process production, is integrally formed together with ceramic base seat slot
The pad that technique is fabricated to, pad are located at the back side of ceramic base seat slot slot bottom, and circuits assembly slot, electricity are formed in ceramic base seat slot
Internal layer is printed in the fitting groove of road and connects circuit, and multiple circuit connecting terminals of internal layer connection circuit are located at circuits assembly slot slot bottom
Edge, all circuit connecting terminals are bonded connection using gold thread with internal layer connection circuit and realize conducting, all circuit connecting terminals
It is connect with pad gold wire bonding；
Multiple quartz resonator oscillator electrodes are integrally formed with ceramic base seat slot and are arranged, quartz resonator oscillator electrode point
Circuit connection is not connect with internal layer；
Quartz-crystal resonator is assemblied in the top of all quartz resonator oscillator electrodes using conductive adhesive, quartz
The connection terminal of crystal resonator connect circuit connection with internal layer；Quartz-crystal resonator is unencapsulated bare crystalline body；
Internal layer oscillating circuit is assemblied on internal layer connection circuit, the component of internal layer oscillating circuit using conductive adhesive
Terminal connect circuit connection with internal layer, and internal layer oscillating circuit is located at around quartz-crystal resonator；
Temperature sensing circuit is assemblied on internal layer connection circuit using conductive adhesive and is located at quartz-crystal resonator
Underface is used to detect the environment temperature on quartz-crystal resonator periphery, and the component terminal of temperature sensing circuit is connect with internal layer
Circuit connection；
Internal layer capping, is placed in ceramic base seat slot and vacuumizes ceramic base seat slot inner cavity to form internal layer sealing structure；
Outer layer assembling structure includes outer layer pedestal；
Outer circuit plate is placed on outer layer pedestal and by the pad hole on outer circuit plate and the metal on outer layer pedestal
Pin connects, and printing outer layer connects circuit on outer circuit plate, and internal layer modular unit is placed on outer circuit plate by pad；
At least one temperature control circuit is placed in the surrounding of internal layer modular unit for adding to quartz-crystal resonator surrounding enviroment
Heat heating, temperature control circuit are assemblied on outer layer connection circuit using high-temperature soldering mode, the component terminal of temperature control circuit and outer
Layer connection circuit connection；
Amplify conditioning circuit, be placed in around internal layer modular unit, amplification conditioning circuit is assembled using high-temperature soldering mode
On outer layer connection circuit, the component terminal for amplifying conditioning circuit connect circuit connection with outer layer；
Voltage regulator circuit, is placed in the outside of amplification conditioning circuit component, and voltage regulator circuit is assemblied in using high-temperature soldering mode
Outer layer connects on circuit, and the component terminal of voltage regulator circuit connect circuit connection with outer layer；The output end of voltage regulator circuit is connected to
Temperature control circuit, the feeder ear for amplifying conditioning circuit and internal layer oscillating circuit；
Package casing, covers on outer layer pedestal and soldering and sealing connects.
The present invention also proposes a kind of manufacturing method of constant-temperature crystal oscillator, includes the following steps:
Step 1) makes ceramic base seat slot using integral forming process, and the back side of ceramic base seat slot slot bottom is integrally formed with weldering
Disk is integrally formed to form multiple quartz resonator oscillator electrodes in ceramic base seat slot slot bottom, forms circuit in ceramic base seat slot
Fitting groove, printing internal layer connects circuit in circuits assembly slot；
Multiple circuit connecting terminals are arranged at the edge of ceramic base seat slot slot bottom in step 2), all circuit connecting terminals all with
Internal layer connects circuit and realizes conducting using gold thread bonding connection；
Step 3) assembles quartz-crystal resonator, using conducting resinl by quartz-crystal resonator adhesive asserably in all quartz
The top of resonator oscillator electrode, the connection terminal of quartz-crystal resonator connect circuit connection with internal layer；
Step 4) assembles internal layer oscillating circuit, and internal layer oscillating circuit adhesive asserably is connected circuit in internal layer using conducting resinl
It goes up and is arranged in around quartz-crystal resonator, the component terminal of internal layer oscillating circuit connect circuit connection with internal layer；
Temperature sensing circuit adhesive asserably is connected circuit in internal layer using conducting resinl by step 5) fitting temperature detection circuit
And it is arranged in the underface of quartz-crystal resonator, the component terminal of temperature sensing circuit connect circuit connection with internal layer；
Step 6) test；
Internal layer capping is assembled after step 7) test passes, internal layer capping lid closes in ceramic base seat slot, after inner cavity is taken out it is true
Sky forms internal layer sealing structure；
Step 8) prepares outer layer pedestal and outer circuit plate, and printing outer layer connects circuit on outer circuit plate；
Step 9) assembles internal layer sealing structure, and internal layer sealing structure is fixed on outer layer using high-temperature soldering mode by pad
On circuit board；
Step 10) assembles temperature control circuit, is assembled temperature control circuit on outer layer connection circuit using high-temperature soldering mode, temperature
Circuit arrangement is controlled in the surrounding of internal layer modular unit, the component terminal of temperature control circuit connect circuit connection with outer layer；
Step 11) assembly amplification conditioning circuit, will amplify conditioning circuit assembly using high-temperature soldering mode and connect in outer layer
On circuit, amplification conditioning circuit is arranged in around internal layer modular unit, and the component terminal and outer layer for amplifying conditioning circuit connect
Connect circuit connection；
Step 12) assembles voltage regulator circuit, is assembled voltage regulator circuit on outer layer connection circuit using high-temperature soldering mode, surely
Volt circuit is arranged in the outside of amplification conditioning circuit component, and the component terminal of voltage regulator circuit connect circuit connection with outer layer,
The feeder ear that the output end of voltage regulator circuit is connected to temperature control circuit, amplifies conditioning circuit and internal layer oscillating circuit；
Step 13) assembles outer layer pedestal and outer circuit plate, and outer circuit plate is placed on outer layer pedestal and by outer layer electricity
Pad hole on the plate of road is connect with the metal pin on outer layer pedestal；
Step 14) assembles package casing, and package casing covers on outer layer pedestal and soldering and sealing connection.
The beneficial effects of the present invention are:
This bilayer thermostat crystal oscillator configuration does not use encapsulating structure in the prior art, but uses unencapsulated
Quartz-crystal resonator and internal layer oscillating circuit, temperature sensing circuit, internal layer oscillating circuit be in the same seal chamber,
To reduce from chip to temperature sensing circuit, the thermal gradient of internal layer oscillating circuit, crystal oscillator is preferably improved
Temperature performance.
Detailed description of the invention
Fig. 1 is internal layer encapsulation first structure diagram (before crystal resonator assembly).
Fig. 2 is that internal layer encapsulates the second structural schematic diagram (unassembled internal layer capping after crystal resonator assembly).
Fig. 3 is internal layer encapsulation third structural schematic diagram (assembly internal layer capping after crystal resonator assembly).
Fig. 4 is outer envelope structural schematic diagram (unassembled package casing).
Fig. 5 is the schematic diagram of crystal oscillator.
Specific embodiment
Technical solution of the present invention is described in detail below, but protection scope of the present invention is not limited to the implementation
Example.
To keep the contents of the present invention more obvious and easy to understand, done further below in conjunction with attached drawing 1- Fig. 5 and specific embodiment
Description.
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
As shown in figure 5, the double-deck thermostat crystal oscillator configuration in the present embodiment, including outer layer assembling structure and it is placed in outer
Internal layer modular unit 11 in layer assembling structure.
As shown in Figure 1,2 and 3, internal layer modular unit 11 includes the ceramic base seat slot 3 of integral forming process production, with ceramics
The pad that integral forming process is fabricated to together of base seat groove 3, pad is located at the back side of 3 slot bottom of ceramic base seat slot, in base of ceramic
Circuits assembly slot 7 is formed in slot 3, printing internal layer connects circuit 5 in circuits assembly slot 7, and multiple circuits that internal layer connects circuit 5 connect
Connecting terminal 6 is located at the edge of 7 slot bottom of circuits assembly slot, and all circuit connecting terminals 6 are bonded with internal layer connection circuit 5 using gold thread
Conducting is realized in connection, and all circuit connecting terminals 6 are connect with pad gold wire bonding.
Multiple quartz resonator oscillator electrodes 1 are integrally formed with ceramic base seat slot 3 and are arranged, quartz resonator oscillator electrode 1
The connection of circuit 5 is connect with internal layer respectively.
Quartz-crystal resonator 8 is assemblied in the top of all quartz resonator oscillator electrodes 1, stone using conductive adhesive
The connection terminal of English crystal resonator 8 connect the connection of circuit 5 with internal layer.Quartz-crystal resonator 8 is using not in the present embodiment
The quartz-crystal resonator of encapsulation, quartz-crystal resonator in endothecium structure, temperature sensor and internal layer oscillating circuit are mounted on
One thermal conductivity space.
Internal layer oscillating circuit 2 is assemblied on internal layer connection circuit 5, first device of internal layer oscillating circuit 2 using conductive adhesive
Part terminal connect the connection of circuit 5 with internal layer, and internal layer oscillating circuit 2 is located at around quartz-crystal resonator 8.
Temperature sensing circuit 4 is assemblied on internal layer connection circuit 5 using conductive adhesive and is located at quartz-crystal resonator
8 underface is used to detect the environment temperature on 8 periphery of quartz-crystal resonator, the component terminal of temperature sensing circuit 4 with it is interior
Layer connection circuit 5 connects.
Internal layer capping 9, is placed in ceramic base seat slot 3 and vacuumizes 3 inner cavity of ceramic base seat slot to form internal layer sealing structure.
The internal layer sealing structure of the present embodiment, contains the main element that may cause frequency fluctuation.Quartz crystal resonant
Device, temperature sensing circuit and internal layer oscillating circuit, to ensure that the stability of final output frequency.
As shown in figure 4, outer layer assembling structure includes outer layer pedestal 12；
Outer circuit plate 13 is placed on outer layer pedestal 12 and by the pad hole 17 and outer layer pedestal on outer circuit plate 13
Metal pin 16 on 12 connects, and metal pin 16 and outer layer pedestal 12 pass through glass insulator insulation processing.Outer circuit plate
Outer layer is printed on 13 and connects circuit 18, and internal layer modular unit 11 is placed on outer circuit plate 13 by pad；
At least one temperature control circuit 10, the surrounding for being placed in internal layer modular unit 11 are used for 8 periphery of quartz-crystal resonator
Environment heat temperature raising, temperature control circuit 10 are assemblied on outer layer connection circuit 18 using high-temperature soldering mode, the member of temperature control circuit 10
Device terminal connect the connection of circuit 18 with outer layer.As shown in figure 4, in the present embodiment temperature control circuit 10 be three be distributed in quartz-crystal
The surrounding of body resonator 8, temperature control circuit 10 can control internal layer modular unit 11 in the fast-changing situation of environment temperature
Temperature keeps relative constant.
Amplify conditioning circuit 14, be placed in around internal layer modular unit 11, amplification conditioning circuit 14 uses high-temperature soldering side
Formula is assemblied on outer layer connection circuit 18, and the component terminal of amplification conditioning circuit 14 connect the connection of circuit 18 with outer layer.
Voltage regulator circuit 15, is placed in the outside of amplification conditioning circuit component 14, and voltage regulator circuit 15 uses high-temperature soldering mode
It is assemblied on outer layer connection circuit 18, the component terminal of voltage regulator circuit 15 connect the connection of circuit 18 with outer layer；Voltage regulator circuit 15
Output end be connected to temperature control circuit 10, amplify conditioning circuit 14 and internal layer oscillating circuit 2 feeder ear.
Package casing 19, covers on outer layer pedestal 12 and soldering and sealing connects.
A kind of manufacturing method of constant-temperature crystal oscillator, internal layer modular unit 11 uses semiconductor electronic in this manufacturing method
Assembly technology.Outer layer assembling structure uses discrete circuit plate assembly technology.Specially include the following steps:
Step 1) makes ceramic base seat slot 3 using integral forming process, the back side of 3 slot bottom of ceramic base seat slot integrally formed with
Pad is integrally formed to form multiple quartz resonator oscillator electrodes 1 in 3 slot bottom of ceramic base seat slot, be formed in ceramic base seat slot 3
Circuits assembly slot 7, printing internal layer connects circuit 5 in circuits assembly slot 7；
Multiple circuit connecting terminals 6, all circuit connecting terminals 6 are arranged at the edge of 3 slot bottom of ceramic base seat slot in step 2)
Connection is all bonded using gold thread with internal layer connection circuit 5 and realizes conducting；
Step 3) assembles quartz-crystal resonator 8, using conducting resinl by 8 adhesive asserably of quartz-crystal resonator in all stones
The top of English resonator oscillator electrode 1, the connection terminal of quartz-crystal resonator 8 connect the connection of circuit 5 with internal layer；
Step 4) assembles internal layer oscillating circuit 2, and 2 adhesive asserably of internal layer oscillating circuit is connected electricity in internal layer using conducting resinl
It on road 5 and is arranged in around quartz-crystal resonator 8, the component terminal of internal layer oscillating circuit 2 connect the company of circuit 5 with internal layer
It connects；
4 adhesive asserably of temperature sensing circuit is connected electricity in internal layer using conducting resinl by step 5) fitting temperature detection circuit 4
Road 5 and the underface for being arranged in quartz-crystal resonator 8, the component terminal of temperature sensing circuit 4 connect the company of circuit 5 with internal layer
It connects；
Step 6) test；
After step 7) test passes assemble internal layer capping 9, internal layer capping 9 lid close in ceramic base seat slot 3, after inner cavity is taken out
It is vacuum formed internal layer sealing structure 11；
Step 8) prepares outer layer pedestal 12 and outer circuit plate 13, and printing outer layer connects circuit 18 on outer circuit plate 13；
Step 9) assembles internal layer sealing structure 11, and internal layer sealing structure 11 is fixed on by pad using high-temperature soldering mode
On outer circuit plate 13；
Step 10) assembles temperature control circuit 10, assembles temperature control circuit 10 using high-temperature soldering mode and connects circuit in outer layer
On 18, temperature control circuit 10 is arranged in the surrounding of internal layer modular unit 11, and the component terminal of temperature control circuit 10 connect electricity with outer layer
Road 18 connects；
Step 11) assembly amplification conditioning circuit 14 will amplify the assembly of conditioning circuit 14 in outer layer using high-temperature soldering mode
It connects on circuit 18, amplification conditioning circuit 14 is arranged in around internal layer modular unit 11, amplifies the component of conditioning circuit 14
Terminal connect the connection of circuit 18 with outer layer；
Step 12) assembles voltage regulator circuit 15, assembles voltage regulator circuit 15 using high-temperature soldering mode and connects circuit in outer layer
On 18, voltage regulator circuit 15 is arranged in the outside of amplification conditioning circuit component 14, the component terminal and outer layer of voltage regulator circuit 15
It connects circuit 18 to connect, the output end of voltage regulator circuit 15 is connected to temperature control circuit 10, amplification conditioning circuit 14 and internal layer and is vibrated
The feeder ear of circuit 2；
Step 13) assembly outer layer pedestal 12 and outer circuit plate 13, outer circuit plate 13 are placed on outer layer pedestal 12 and lead to
The pad hole 17 crossed on outer circuit plate 13 is connect with the metal pin 16 on outer layer pedestal 12；
Step 14) assembles package casing 19, and package casing 19 covers on outer layer pedestal 12 and soldering and sealing connection.
The working principle of the present embodiment bilayer thermostat crystal oscillator is as follows:
Quartz-crystal resonator 8 in crystal oscillator generates strain under driving voltage effect, connects electricity by internal layer
Road switchs to frequency output signal.Temperature sensing circuit 4 detects quartz-crystal resonator and the environment temperature of internal layer oscillating circuit 2 becomes
Change, when temperature sensing circuit 4 detects that environment temperature reduces, the temperature control circuit 10 in outer layer assembling structure starts, heated current
Increase, whole heating is carried out to internal layer modular unit 11.When temperature sensing circuit 4 detects that environment temperature increases, temperature control is reduced
The operating current of circuit 10 reduces the temperature of internal layer modular unit 11, to compensate internal layer under ambient operating temperature situation of change
The temperature fluctuation of module 11.
What is be not specifically noted in all description of the invention is the prior art or can be realized by existing technology,
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description, and it is all this
A little modifications and variations should all belong to the protection domain of appended claims of the present invention.
Claims (2)
1. a kind of bilayer thermostat crystal oscillator configuration, it is characterised in that: including outer layer assembling structure and be placed in outer layer assembly
Internal layer modular unit (11) in structure,
Internal layer modular unit (11) includes the ceramic base seat slot (3) of integral forming process production, with ceramic base seat slot (3) together one
The pad that body formed technique is fabricated to, pad are located at the back side of ceramic base seat slot (3) slot bottom, are formed in ceramic base seat slot (3)
Circuits assembly slot (7), middle printing internal layer connection circuit (5) of circuits assembly slot (7), multiple circuits that internal layer connects circuit (5) connect
Connecting terminal (6) is located at the edge of circuits assembly slot (7) slot bottom, and all circuit connecting terminals (6) connect circuit (5) use with internal layer
Conducting is realized in gold thread bonding connection, and all circuit connecting terminals (6) connect with pad gold wire bonding；
Multiple quartz resonator oscillator electrodes (1) are integrally formed with ceramic base seat slot (3) and are arranged, quartz resonator oscillator electrode
(1) circuit (5) connection is connect with internal layer respectively；
Quartz-crystal resonator (8) is assemblied in the top of all quartz resonator oscillator electrodes (1), stone using conductive adhesive
The connection terminal of English crystal resonator (8) connect circuit (5) connection with internal layer；Quartz-crystal resonator (8) is unencapsulated naked
Crystal；
Internal layer oscillating circuit (2) is assemblied in internal layer connection circuit (5), the member of internal layer oscillating circuit (2) using conductive adhesive
Device terminal connect circuit (5) connection with internal layer, and internal layer oscillating circuit (2) is located at around quartz-crystal resonator (8)；
Temperature sensing circuit (4) is assemblied in internal layer connection circuit (5) using conductive adhesive and is located at quartz-crystal resonator
(8) underface is used to detect the environment temperature on quartz-crystal resonator (8) periphery, the component end of temperature sensing circuit (4)
Son connect circuit (5) connection with internal layer；
Internal layer covers (9), is placed on ceramic base seat slot (3) and vacuumizes ceramic base seat slot (3) inner cavity to form internal layer sealing knot
Structure；
Outer layer assembling structure includes outer layer pedestal (12)；
Outer circuit plate (13) is placed on outer layer pedestal (12) and by the pad hole (17) and outer layer on outer circuit plate (13)
Metal pin (16) on pedestal (12) connects, printing outer layer connection circuit (18), internal layer module list on outer circuit plate (13)
First (11) are placed on outer circuit plate (13) by pad；
At least one temperature control circuit (10), the surrounding for being placed in internal layer modular unit (11) were used for quartz-crystal resonator (8) week
Surrounding environment heat temperature raising, temperature control circuit (10) are assemblied in outer layer connection circuit (18) using high-temperature soldering mode, temperature control circuit
(10) component terminal connect circuit (18) connection with outer layer；
Amplify conditioning circuit (14), be placed in around internal layer modular unit (11), amplification conditioning circuit (14) uses high-temperature soldering
Mode is assemblied in outer layer connection circuit (18), and the component terminal of amplification conditioning circuit (14) connect circuit (18) with outer layer even
It connects；
Voltage regulator circuit (15), is placed in the outside of amplification conditioning circuit component (14), and voltage regulator circuit (15) uses high-temperature soldering side
Formula is assemblied in outer layer connection circuit (18), and the component terminal of voltage regulator circuit (15) connect circuit (18) connection with outer layer；Surely
The power supply that the output end of volt circuit (15) is connected to temperature control circuit (10), amplifies conditioning circuit (14) and internal layer oscillating circuit (2)
End；
Package casing (19), covers on outer layer pedestal (12) and soldering and sealing connects.
2. a kind of manufacturing method of constant-temperature crystal oscillator, which comprises the steps of:
Step 1) using integral forming process production ceramic base seat slot (3), the back side of ceramic base seat slot (3) slot bottom integrally formed with
Pad is integrally formed to form multiple quartz resonator oscillator electrodes (1) in ceramic base seat slot (3) slot bottom, in ceramic base seat slot (3)
Interior formation circuits assembly slot (7), middle printing internal layer connection circuit (5) of circuits assembly slot (7)；
Multiple circuit connecting terminals (6), all circuit connecting terminals are arranged at the edge of ceramic base seat slot (3) slot bottom in step 2)
(6) connection is all bonded using gold thread with internal layer connection circuit (5) and realizes conducting；
Step 3) assembles quartz-crystal resonator (8), using conducting resinl by quartz-crystal resonator (8) adhesive asserably in all stones
The top of English resonator oscillator electrode (1), the connection terminal of quartz-crystal resonator (8) connect circuit (5) connection with internal layer；
Step 4) assembles internal layer oscillating circuit (2), and internal layer oscillating circuit (2) adhesive asserably is connected electricity in internal layer using conducting resinl
It on road (5) and is arranged in around quartz-crystal resonator (8), the component terminal of internal layer oscillating circuit (2) is connect with internal layer
Circuit (5) connection；
Temperature sensing circuit (4) adhesive asserably is connected electricity in internal layer using conducting resinl by step 5) fitting temperature detection circuit (4)
Road (5) and the underface for being arranged in quartz-crystal resonator (8), the component terminal of temperature sensing circuit (4) are connect with internal layer
Circuit (5) connection；
Step 6) test；
Internal layer capping (9) is assembled after step 7) test passes, internal layer covers (9) lid and closes on ceramic base seat slot (3), after by inner cavity
It vacuumizes to form internal layer sealing structure (11)；
Step 8) prepares outer layer pedestal (12) and outer circuit plate (13), and printing outer layer connects circuit on outer circuit plate (13)
(18)；
Step 9) assembles internal layer sealing structure (11), and internal layer sealing structure (11) is fixed on by pad using high-temperature soldering mode
On outer circuit plate (13)；
Step 10) assembles temperature control circuit (10), and temperature control circuit (10) is assemblied in outer layer connection circuit using high-temperature soldering mode
(18) on, temperature control circuit (10) is arranged in the surrounding of internal layer modular unit (11), the component terminal of temperature control circuit (10) and outer
Layer connection circuit (18) connection；
Step 11) assembly amplification conditioning circuit (14) will amplify conditioning circuit (14) using high-temperature soldering mode and be assemblied in outer layer
It connects on circuit (18), amplification conditioning circuit (14) is arranged in around internal layer modular unit (11), is amplified conditioning circuit (14)
Component terminal connect with outer layer circuit (18) connection；
Step 12) assembles voltage regulator circuit (15), and voltage regulator circuit (15) is assemblied in outer layer connection circuit using high-temperature soldering mode
(18) on, voltage regulator circuit (15) is arranged in the outside of amplification conditioning circuit component (14), the component end of voltage regulator circuit (15)
Son connect circuit (18) connection with outer layer, and the output end of voltage regulator circuit (15) is connected to temperature control circuit (10), amplification conditioning electricity
The feeder ear on road (14) and internal layer oscillating circuit (2)；
Step 13) assembly outer layer pedestal (12) and outer circuit plate (13), outer circuit plate (13) are placed on outer layer pedestal (12)
And it is connect by the pad hole (17) on outer circuit plate (13) with the metal pin (16) on outer layer pedestal (12)；
Step 14) assembles package casing (19), and package casing (19) covers on outer layer pedestal (12) and soldering and sealing connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910306909.2A CN109981052A (en) | 2019-04-17 | 2019-04-17 | The double-deck thermostat crystal oscillator configuration and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910306909.2A CN109981052A (en) | 2019-04-17 | 2019-04-17 | The double-deck thermostat crystal oscillator configuration and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109981052A true CN109981052A (en) | 2019-07-05 |
Family
ID=67084957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910306909.2A Pending CN109981052A (en) | 2019-04-17 | 2019-04-17 | The double-deck thermostat crystal oscillator configuration and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109981052A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110441550A (en) * | 2019-09-06 | 2019-11-12 | 北京信息科技大学 | A kind of embedded 12 electrode quartz accelerometer of circuit |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719384A (en) * | 1985-09-24 | 1988-01-12 | Centre National De La Recherche Scientifique | Miniature thermostatted oscillator |
| CN1716656A (en) * | 2004-06-29 | 2006-01-04 | 日本电波工业株式会社 | Crystal oscillator |
| JP2007295159A (en) * | 2006-04-24 | 2007-11-08 | Nippon Dempa Kogyo Co Ltd | Temperature compensated crystal oscillator for surface mounting |
| CN102739159A (en) * | 2012-07-04 | 2012-10-17 | 上海鸿晔电子科技有限公司 | Digital temperature control type high-temperature constant-temperature crystal oscillator |
| CN103189974A (en) * | 2011-06-15 | 2013-07-03 | 株式会社大真空 | Electronic-part package and piezoelectric vibration device |
| JP2014171184A (en) * | 2013-03-05 | 2014-09-18 | Nippon Dempa Kogyo Co Ltd | Temperature control type crystal oscillator |
| JP2015088811A (en) * | 2013-10-29 | 2015-05-07 | 株式会社大真空 | Temperature compensation crystal oscillator |
| JP2015211334A (en) * | 2014-04-25 | 2015-11-24 | 京セラクリスタルデバイス株式会社 | Piezoelectric device with thermostat, and manufacturing method of piezoelectric device with thermostat |
| CN105811965A (en) * | 2016-03-14 | 2016-07-27 | 西安工业大学 | High-precision quartz crystal oscillator and realization method thereof |
| CN206135824U (en) * | 2016-11-04 | 2017-04-26 | 河北鸿捷电子科技有限公司 | Two thermotank oven controlled crystal oscillator of little volume |
| CN106953631A (en) * | 2016-01-06 | 2017-07-14 | 精工爱普生株式会社 | Circuit arrangement, oscillator, electronic equipment and moving body |
| CN107196646A (en) * | 2017-07-07 | 2017-09-22 | 唐山国芯晶源电子有限公司 | Ceramic package chip self-heating low-power consumption constant-temperature crystal oscillator |
| JP2017208798A (en) * | 2016-05-13 | 2017-11-24 | 日本電波工業株式会社 | Crystal oscillator and method of manufacturing crystal oscillator |
| CN107508595A (en) * | 2016-11-03 | 2017-12-22 | 台湾晶技股份有限公司 | The crystal oscillator with constant temperature control being made up of embedded heating ceramic package |
| CN207460132U (en) * | 2017-07-18 | 2018-06-05 | 成都世源频控技术股份有限公司 | A kind of compact double-groove constant temperature crystal oscillator |
| CN209881734U (en) * | 2019-04-17 | 2019-12-31 | 南京信息职业技术学院 | Double-layer constant temperature bath crystal oscillator structure |
-
2019
- 2019-04-17 CN CN201910306909.2A patent/CN109981052A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719384A (en) * | 1985-09-24 | 1988-01-12 | Centre National De La Recherche Scientifique | Miniature thermostatted oscillator |
| CN1716656A (en) * | 2004-06-29 | 2006-01-04 | 日本电波工业株式会社 | Crystal oscillator |
| JP2007295159A (en) * | 2006-04-24 | 2007-11-08 | Nippon Dempa Kogyo Co Ltd | Temperature compensated crystal oscillator for surface mounting |
| CN103189974A (en) * | 2011-06-15 | 2013-07-03 | 株式会社大真空 | Electronic-part package and piezoelectric vibration device |
| CN102739159A (en) * | 2012-07-04 | 2012-10-17 | 上海鸿晔电子科技有限公司 | Digital temperature control type high-temperature constant-temperature crystal oscillator |
| JP2014171184A (en) * | 2013-03-05 | 2014-09-18 | Nippon Dempa Kogyo Co Ltd | Temperature control type crystal oscillator |
| JP2015088811A (en) * | 2013-10-29 | 2015-05-07 | 株式会社大真空 | Temperature compensation crystal oscillator |
| JP2015211334A (en) * | 2014-04-25 | 2015-11-24 | 京セラクリスタルデバイス株式会社 | Piezoelectric device with thermostat, and manufacturing method of piezoelectric device with thermostat |
| CN106953631A (en) * | 2016-01-06 | 2017-07-14 | 精工爱普生株式会社 | Circuit arrangement, oscillator, electronic equipment and moving body |
| CN105811965A (en) * | 2016-03-14 | 2016-07-27 | 西安工业大学 | High-precision quartz crystal oscillator and realization method thereof |
| JP2017208798A (en) * | 2016-05-13 | 2017-11-24 | 日本電波工業株式会社 | Crystal oscillator and method of manufacturing crystal oscillator |
| CN107508595A (en) * | 2016-11-03 | 2017-12-22 | 台湾晶技股份有限公司 | The crystal oscillator with constant temperature control being made up of embedded heating ceramic package |
| CN206135824U (en) * | 2016-11-04 | 2017-04-26 | 河北鸿捷电子科技有限公司 | Two thermotank oven controlled crystal oscillator of little volume |
| CN107196646A (en) * | 2017-07-07 | 2017-09-22 | 唐山国芯晶源电子有限公司 | Ceramic package chip self-heating low-power consumption constant-temperature crystal oscillator |
| CN207460132U (en) * | 2017-07-18 | 2018-06-05 | 成都世源频控技术股份有限公司 | A kind of compact double-groove constant temperature crystal oscillator |
| CN209881734U (en) * | 2019-04-17 | 2019-12-31 | 南京信息职业技术学院 | Double-layer constant temperature bath crystal oscillator structure |
Non-Patent Citations (2)
| Title |
|---|
| L. FREDERIC等: "A new kind of view for a Double oven Crystal Oscillator", 《2007 IEEE INTERNATIONAL FREQUENCY CONTROL SYMPOSIUM JOINT WITH THE 21ST EUROPEAN FREQUENCY AND TIME FORUM》, 1 October 2007 (2007-10-01), pages 784 - 789 * |
| 杨磊 秦玉浩: "5MHz超稳定晶体振荡器(USO)设计与实现", 《节 欢迎来自国家知识产... 的您，个人账户 登录 充值 会员 第九届中国卫星导航学术年会论文集——S06 时空基准与时频技术》, 23 May 2018 (2018-05-23), pages 3 - 8 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110441550A (en) * | 2019-09-06 | 2019-11-12 | 北京信息科技大学 | A kind of embedded 12 electrode quartz accelerometer of circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10715058B2 (en) | Piezoelectric device and electronic apparatus | |
| CN101741314B (en) | Constant-temperature type crystal oscillator | |
| US8232845B2 (en) | Packaged device with acoustic resonator and electronic circuitry and method of making the same | |
| JP4955042B2 (en) | Constant temperature crystal oscillator | |
| JP4629744B2 (en) | Constant temperature crystal oscillator | |
| US8013683B2 (en) | Constant-temperature type crystal oscillator | |
| US8076983B2 (en) | Constant-temperature type crystal oscillator | |
| JP5624864B2 (en) | Temperature controlled crystal oscillator and crystal oscillator | |
| CN101895270A (en) | The oscillator arrangement that comprises the thermally-controlled piezoelectric resonator device | |
| CN102158194A (en) | Surface mounted oven controlled type crystal oscillator | |
| CN116545382B (en) | MEMS oscillator | |
| JP2011091702A (en) | Piezoelectric oscillator, and frequency control method of the same | |
| CN209881734U (en) | Double-layer constant temperature bath crystal oscillator structure | |
| CN109981052A (en) | The double-deck thermostat crystal oscillator configuration and its manufacturing method | |
| US10179730B2 (en) | Electronic sensors with sensor die in package structure cavity | |
| JP2009284372A (en) | Constant temperature structure of crystal unit | |
| US11689184B2 (en) | Resonator device | |
| US20220037579A1 (en) | Oscillator | |
| CN112994644B (en) | Constant temperature crystal oscillator | |
| US20220345106A1 (en) | Resonator Device | |
| JP2022146150A (en) | vibration device | |
| JP2008306480A (en) | Piezoelectric oscillator | |
| US20230163702A1 (en) | Piezoelectric device | |
| US20220393643A1 (en) | Oven-controlled crystal oscillator | |
| JP2009232239A (en) | Constant-temperature crystal oscillator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |