CN113447793A - Device and method for testing circuit board - Google Patents
Device and method for testing circuit board Download PDFInfo
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- CN113447793A CN113447793A CN202110707780.3A CN202110707780A CN113447793A CN 113447793 A CN113447793 A CN 113447793A CN 202110707780 A CN202110707780 A CN 202110707780A CN 113447793 A CN113447793 A CN 113447793A
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- circuit board
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
Abstract
The invention discloses a device and a method for testing a circuit board, wherein the device comprises a shielding box and a power supply: the power supply is used for supplying power to the equipment in the shielding box; the shielding box is internally provided with a first circuit board to be tested and a second circuit board to be tested, communication connection is established between the first circuit board to be tested and the second circuit board to be tested, the first circuit board to be tested is used for sending first test information to the second circuit board to be tested during testing, the first test information is used for enabling the second circuit board to be tested to generate a first state parameter, and the first state parameter is used for determining whether the first circuit board to be tested and the second circuit board to be tested are abnormal or not. The invention tests by utilizing the mutual pairing of the circuit boards to be tested, and can save the use of a professional test instrument, thereby effectively reducing the test cost; in addition, the test of at least two circuit boards to be tested can be realized simultaneously, and the test efficiency can be greatly improved.
Description
Technical Field
The invention relates to the technical field of product testing, in particular to a device and a method for testing a circuit board.
Background
In order to ensure the product quality, in the mass production process of communication products, a product is required to be separately externally connected with a professional test instrument to detect and intercept defective products, and a circuit board of the communication product is taken as an example, and an external comprehensive tester is required to be connected to carry out communication test.
As shown in fig. 1, when testing the circuit board, each circuit board to be tested needs to be independently equipped with a corresponding shielding box clamp and a corresponding comprehensive tester, the computer is connected with a power supply and connected to the motherboard to be tested through a GPIB Interface (General-Purpose-voltage Interface Bus), and is connected to the USB deceleration box and connected to the circuit board to be tested through a USB Interface, and the computer is further communicatively connected with a scanning gun for realizing the barcode recognition of the circuit board to be tested, thereby realizing the testing of the communication function of the product motherboard.
The test scheme is mature and stable, the accuracy of the test result can be ensured, but the test efficiency is lower due to the fact that each circuit board to be tested needs to be correspondingly provided with one comprehensive tester respectively, and the test cost is not reduced easily.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method and a system for testing a circuit board, which solve the problems of higher test cost and lower efficiency of communication products in the mass production process in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
an apparatus for testing a circuit board, comprising a shielding cage and a power supply:
the power supply is used for supplying power to the equipment in the shielding box;
the shielding box is internally provided with a first circuit board to be tested and a second circuit board to be tested, communication connection is established between the first circuit board to be tested and the second circuit board to be tested, the first circuit board to be tested is used for sending first test information to the second circuit board to be tested during testing, the first test information is used for enabling the second circuit board to be tested to generate a first state parameter, and the first state parameter is used for determining whether the first circuit board to be tested and the second circuit board to be tested are abnormal or not.
Optionally, the apparatus further comprises:
and the switching module is used for establishing communication connection between the first circuit board to be tested and the second circuit board to be tested.
Optionally, the switching module is further configured to connect a first standard circuit board and a second standard circuit board, the first standard circuit board and the second standard circuit board are arranged in the shielding box, and the connection between the first circuit board to be tested and the first standard circuit board and the connection between the second circuit board to be tested and the second standard circuit board are established when at least one of the first circuit board to be tested and the second circuit board to be tested is abnormal;
the first standard circuit board is used for receiving second test information sent by the first circuit board to be tested, the second test information is used for enabling the first standard circuit board to generate a second state parameter, and the second state parameter is used for determining whether the first circuit board to be tested is abnormal or not; the second standard circuit board is used for sending third test information to the second circuit board to be tested, the third test information is used for enabling the second circuit board to be tested to generate a third state parameter, and the third state parameter is used for determining whether the second circuit board to be tested is abnormal or not.
Optionally, the apparatus further comprises:
and the processing module is used for determining whether the first circuit board to be detected and the second circuit board to be detected are abnormal or not according to the first state parameter, determining whether the first circuit board to be detected is abnormal or not according to the second state parameter under the condition that at least one of the first circuit board to be detected and the second circuit board to be detected is abnormal, and determining whether the second circuit board to be detected is abnormal or not according to the third state parameter.
Optionally, the first state parameter comprises one or more of a power value, a sensitivity value and a current value, the second state parameter comprises one or more of a power value, a sensitivity value and a current value, and the third state parameter comprises one or more of a power value, a sensitivity value and a current value.
Optionally, the apparatus further comprises:
the scanning gun is used for scanning the identification code of the circuit board to be detected, and the identification code is used for identifying the circuit board to be detected.
Optionally, the device further comprises a clamp, and the at least two circuit boards to be tested and the at least two standard circuit boards are fixed on the clamp.
The invention also provides a method for testing the circuit board, which is realized based on the device for testing the circuit board, and comprises the following steps:
a first circuit board to be tested in the device sends first test information to a second circuit board to be tested;
the second circuit board to be tested generates a first state parameter according to the first test information;
and determining whether the first circuit board to be tested and the second circuit board to be tested are abnormal or not according to the first state parameter.
Optionally, the method further comprises:
when the first circuit board to be tested and the second circuit board to be tested are abnormal;
the first circuit board to be tested sends second test information to the first standard circuit board;
the first standard circuit board generates a second state parameter according to the second test information;
the second standard circuit board sends third test information to the second circuit board to be tested;
the second circuit board to be tested generates a third state parameter according to the third test information;
determining whether the first circuit board to be tested is abnormal or not according to the second state parameter;
and determining whether the second circuit board to be tested is abnormal or not according to the third state parameter.
Optionally, the first state parameter comprises one or more of a power value, a sensitivity value and a current value, the second state parameter comprises one or more of a power value, a sensitivity value and a current value, and the third state parameter comprises one or more of a power value, a sensitivity value and a current value.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a device and a method for testing a circuit board, which are used for testing by utilizing mutual pairing of the circuit boards to be tested, and can save the use of a special test instrument, thereby effectively reducing the test cost; in addition, the test of at least two circuit boards to be tested can be realized simultaneously, and the test efficiency can be greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic diagram of a test system for a motherboard to be tested in the prior art;
fig. 2 is a diagram illustrating uplink and downlink frequencies and time intervals in a TDD communication mode according to the prior art;
FIG. 3 is a schematic structural diagram of a device for testing a circuit board according to the present invention
FIG. 4 is a flow chart of a method of testing a circuit board according to the present invention;
FIG. 5 is another flow chart of a method for testing a circuit board according to the present invention
FIG. 6 is a schematic diagram of a first test in a method of testing a circuit board according to the present invention;
FIG. 7 is a schematic diagram of a second test in a method of testing a circuit board according to the present invention;
fig. 8 is a flowchart of a method for testing a circuit board according to the present invention.
In the above figures: 10. a computer; 111. a first circuit board to be tested; 112. a second circuit board to be tested; 121. a first standard circuit board; 122. a second standard circuit board; 13. a clamp; 14. a shielding box; 15. a switching module; 16. a GPIB interface; 161. a first power supply; 162. a second power supply; 171. a first USB interface; 172. a second USB interface; 173. a third USB interface; 18. a gun is scanned.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to facilitate understanding of the technical solution of the present invention, a brief introduction is made to the application scenario of the present invention:
the communication mode of the communication product generally includes FDD (frequency division duplex) or TDD (time division duplex), as shown in fig. 2, TDD has the same uplink and downlink frequency in the frequency dimension, and separates uplink and downlink data by a guard interval in the time dimension, so as to prevent interference between uplink and downlink common frequencies. Under the condition that the frequency spectrum resources are more and more in short supply, the working mode of the TDD saves the bandwidth, so that the TDD communication mode can be widely used in most general products, such as short-distance communication products like WIFI and BT, and the communication modes widely used at present are TDD.
The invention aims to provide a test scheme, which can save the use of test equipment such as a comprehensive tester and the like on the premise of ensuring the test effect, thereby achieving the purposes of reducing the cost and improving the efficiency.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
As shown in fig. 3, the embodiment of the present invention provides an apparatus for testing a circuit board, which includes a power supply and a shielding box 14. Optionally, the apparatus may further comprise a processing module, a transfer module 15, a processing module, a scanning gun 18, and a clamp 13.
Alternatively, two power supplies are provided, namely a first power supply 161 and a second power supply 162. The first power supply 161 and the second power supply 162 are both connected to the computer 10 through the GPIB interface 16, the first power supply 161 is connected to at least two circuit boards to be tested, and the second power supply 162 is connected to at least two standard circuit boards, so that power is supplied to the circuit boards to be tested and the standard circuit boards, and the test can be smoothly performed.
Alternatively, the processing module may be a stand-alone computer 10, or may be a chip built in the device, which is not limited in this application.
The scanning gun 18 is connected to the computer 10 through the third USB interface 173, and the scanning gun 18 is used for scanning an identification code, such as a barcode, of the circuit board to be tested, so as to facilitate subsequent tracing of the circuit board to be tested.
The circuit board testing device comprises a shielding box 14 and a clamp 13, wherein at least two circuit boards to be tested and at least two standard circuit boards are fixed on the clamp 13 and are arranged in the shielding box 14. The shielding box 14 can be made of wave-absorbing material, so that the test can be prevented from being influenced by interference signals.
And the switching module 15 is connected with the computer 10, the at least two circuit boards to be tested and the at least two standard circuit boards.
In this embodiment, the switching module 15 is a switch, and can be switched to two communication states: in the first communication state, the communication paths between every two circuit boards to be tested are communicated; in the second communication state, the communication passage of one of the two circuit boards to be tested is communicated with one of the standard circuit boards, and the communication passage of the other circuit board to be tested is communicated with the other standard circuit board.
For convenience of describing the technical solution of the present invention, the present embodiment takes two circuit boards to be tested as an example of a test set, and further description is made on the technical solution of the present invention and a case where two standard circuit boards are used as examples.
The computer 10 is connected to the first circuit board to be tested 111 and the second circuit board to be tested through the first USB interface 171, and connected to the first standard circuit board 121 and the second standard circuit board 122, which correspond to the first circuit board to be tested 111 and the second circuit board to be tested one by one, through the second USB interface 172.
The computer 10 is used for controlling the switching module 15 to enter a first communication state to perform a first test; the first circuit board to be tested 111 is configured to send first test information to the second circuit board to be tested 112 during a first test, where the first test information is used to enable the second circuit board to be tested 112 to generate a first state parameter, and the first state parameter is used to determine whether the first circuit board to be tested 111 and the second circuit board to be tested 112 are abnormal.
The computer 10 is further configured to control the switching module 15 to switch to the second connection state when the first test is abnormal, establish a connection between the first circuit board to be tested 111 and the first standard circuit board 121, establish a connection between the second circuit board to be tested 112 and the second standard circuit board 122, and perform a second test in groups.
The first standard circuit board 121 is configured to receive second test information sent by the first circuit board to be tested 111, where the second test information is used to enable the first standard circuit board 121 to generate a second state parameter, and the second state parameter is used to determine whether the first circuit board to be tested 111 is abnormal; the second standard circuit board 122 is configured to send third test information to the second circuit board 112 to be tested, where the third test information is used to enable the second circuit board 112 to be tested to generate a third state parameter, and the third state parameter is used to determine whether the second circuit board 112 to be tested is abnormal.
And the processing module is connected with the computer 10, the circuit board to be tested and the standard circuit board, and is used for detecting the state parameters of the circuit board to be tested and the standard circuit board which are used as receiving ends after receiving data, comparing the state parameters with preset state indexes, and judging whether the first test or the second test is abnormal or not according to comparison results.
Specifically, the processing module is configured to determine whether the first circuit board to be tested 111 and the second circuit board to be tested 112 are abnormal according to a first state parameter, determine whether the first circuit board to be tested 111 is abnormal according to the second state parameter when at least one of the first circuit board to be tested 111 and the second circuit board to be tested 112 is abnormal, and determine whether the second circuit board to be tested 112 is abnormal according to the third state parameter.
It will be appreciated that the processing module may be part of the means for testing the circuit board or may be an external stand-alone computer.
Further, in the present embodiment, the state parameter includes one or more of power, sensitivity, and current value.
Referring to fig. 4, an embodiment of the present invention provides a method for testing a circuit board, which is implemented based on the foregoing device for testing a circuit board, and includes:
s11, sending first test information to a second circuit board to be tested by a first circuit board to be tested in the device;
s12, the second circuit board to be tested generates a first state parameter according to the first test information;
and S13, determining whether the first circuit board to be tested and the second circuit board to be tested are abnormal or not according to the first state parameter.
It can be understood that, based on step S1, a test group is formed by establishing communication connection between two of the circuit boards to be tested, so that simultaneous testing of multiple test groups can be realized. And when the first state parameter exceeds a preset state parameter threshold value, the first state parameter represents that one of the first circuit board to be tested and the second circuit board to be tested is abnormal.
Referring to fig. 5, further, in the method for testing a circuit board provided in this embodiment, when one of the first circuit board to be tested and the second circuit board to be tested is abnormal, the method further includes the following steps:
s21, the first circuit board to be tested sends second test information to the first standard circuit board;
s22, generating a second state parameter by the first standard circuit board according to the second test information;
s23, the second standard circuit board sends third test information to the second circuit board to be tested;
s24, the second circuit board to be tested generates a third state parameter according to the third test information;
s25, determining whether the first circuit board to be tested is abnormal or not according to the second state parameter; and determining whether the second circuit board to be tested is abnormal or not according to the third state parameter.
Based on the steps S21 to S25, the circuit boards to be tested having abnormality can be checked out by establishing one-to-one correspondence communication connection between the preset standard circuit board and each of the two circuit boards to be tested in the test set.
Therefore, in this embodiment, two or more standard circuit boards of even number may be provided. The standard circuit board is a qualified product which passes the test, so that the standard circuit board can be used as a reference object, and the circuit board to be tested can be determined to be a defective product when any circuit board to be tested and the standard circuit board are abnormal during the second test.
Specifically, in this embodiment, when performing the first test, one of the circuit boards to be tested is used as a sending end to be tested, and the other circuit board to be tested is used as a receiving end to be tested; and controlling the tested sending end to send data to the tested receiving end and controlling the tested receiving end to receive the data.
In step S2, when performing the second test, one of the standard circuit boards is used as a standard sending end, and the other standard circuit board is used as a standard receiving end; and controlling the standard sending terminal to send data to the tested receiving terminal and controlling the standard receiving terminal to receive the data, and controlling the standard sending terminal to send data to the tested receiving terminal and controlling the tested receiving terminal to receive the data.
As shown in fig. 6 to 8, during the first test, the circuit board B to be tested is controlled to be used as the sending end to be tested to send data to the circuit board a to be tested, and the circuit board a to be tested is controlled to be used as the receiving end to be tested to receive the data sent by the circuit board B to be tested. Meanwhile, the standard circuit board 2 is controlled to serve as a standard sending end to send data to the standard circuit board 1, and the standard circuit board 1 is controlled to serve as a standard receiving end to receive the data sent by the standard circuit board 2, so that rapid performance of subsequent tests is facilitated.
When the first test is abnormal, starting a switching operation, and switching a circuit board B to be tested which is used as a tested sending end to a standard circuit board 1 which is used as a standard receiving end; and switching the circuit board A to be tested which is used as the tested receiving end to be connected with the standard circuit board 2 which is used as the standard sending end. Based on the switching relation, the second test of the two test groups can be rapidly started, so that the test efficiency is effectively improved.
Further, during the first test, detecting the state parameter after the tested receiving end receives the data; and comparing the state parameters with preset state indexes, and judging whether the first test is abnormal or not according to a comparison result.
When a second test is carried out, state parameters after the standard receiving end and the tested receiving end receive data are respectively detected; and comparing the state parameters of the standard receiving terminal and the tested receiving terminal with preset state indexes respectively, and judging whether two groups of second tests are abnormal or not according to comparison results.
It can be understood that the state parameter includes one or more of power, sensitivity and current value, and the state parameter is detected and compared with the preset state index, so as to determine whether the circuit board to be tested has the process problem.
And finally, determining the circuit board to be tested in the test group with the abnormality in the second test as a defective product.
It can be understood that, during testing between the circuit boards to be tested, based on the TDD communication mode, after one test pairing is completed through one uplink and downlink time interval, the circuit boards to be tested, which are used as the sending end and the receiving end to be tested, will perform role exchange, and perform the opposite action with the previous pairing to perform the testing again, so that the testing accuracy can be effectively improved.
The embodiment of the invention can realize quick and effective link test by utilizing mutual pairing between the circuit boards to be tested without adopting testing instruments such as a comprehensive tester and the like, thereby effectively reducing the testing cost.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. An apparatus for testing a circuit board, comprising a shielding box and a power supply:
the power supply is used for supplying power to the equipment in the shielding box;
the shielding box is internally provided with a first circuit board to be tested and a second circuit board to be tested, communication connection is established between the first circuit board to be tested and the second circuit board to be tested, the first circuit board to be tested is used for sending first test information to the second circuit board to be tested during testing, the first test information is used for enabling the second circuit board to be tested to generate a first state parameter, and the first state parameter is used for determining whether the first circuit board to be tested and the second circuit board to be tested are abnormal or not.
2. The apparatus of claim 1, further comprising:
and the switching module is used for establishing communication connection between the first circuit board to be tested and the second circuit board to be tested.
3. The device of claim 2, wherein the adapter module is further configured to connect a first standard circuit board and a second standard circuit board, the first standard circuit board and the second standard circuit board are disposed in the shielding box, and when at least one of the first circuit board to be tested and the second circuit board to be tested is abnormal, the adapter module establishes a connection between the first circuit board to be tested and the first standard circuit board and establishes a connection between the second circuit board to be tested and the second standard circuit board;
the first standard circuit board is used for receiving second test information sent by the first circuit board to be tested, the second test information is used for enabling the first standard circuit board to generate a second state parameter, and the second state parameter is used for determining whether the first circuit board to be tested is abnormal or not; the second standard circuit board is used for sending third test information to the second circuit board to be tested, the third test information is used for enabling the second circuit board to be tested to generate a third state parameter, and the third state parameter is used for determining whether the second circuit board to be tested is abnormal or not.
4. The apparatus of claim 3, further comprising:
and the processing module is used for determining whether the first circuit board to be detected and the second circuit board to be detected are abnormal or not according to the first state parameter, determining whether the first circuit board to be detected is abnormal or not according to the second state parameter under the condition that at least one of the first circuit board to be detected and the second circuit board to be detected is abnormal, and determining whether the second circuit board to be detected is abnormal or not according to the third state parameter.
5. The apparatus of claim 4, wherein the first state parameter comprises one or more of a power, sensitivity, and current value, wherein the second state parameter comprises one or more of a power, sensitivity, and current value, and wherein the third state parameter comprises one or more of a power, sensitivity, and current value.
6. The apparatus of any one of claims 1 to 5, further comprising:
the scanning gun is used for scanning the identification code of the circuit board to be detected, and the identification code is used for identifying the circuit board to be detected.
7. The apparatus according to any one of claims 1 to 6, further comprising a jig to which the at least two circuit boards to be tested and the at least two standard circuit boards are fixed.
8. A method for testing a circuit board, implemented on the basis of the apparatus for testing a circuit board according to any one of claims 1 to 7, comprising:
a first circuit board to be tested in the device sends first test information to a second circuit board to be tested;
the second circuit board to be tested generates a first state parameter according to the first test information;
and determining whether the first circuit board to be tested and the second circuit board to be tested are abnormal or not according to the first state parameter.
9. The method of claim 1, further comprising:
when the first circuit board to be tested and the second circuit board to be tested are abnormal:
the first circuit board to be tested sends second test information to the first standard circuit board;
the first standard circuit board generates a second state parameter according to the second test information;
the second standard circuit board sends third test information to the second circuit board to be tested;
the second circuit board to be tested generates a third state parameter according to the third test information;
determining whether the first circuit board to be tested is abnormal or not according to the second state parameter;
and determining whether the second circuit board to be tested is abnormal or not according to the third state parameter.
10. The method of claim 9, wherein the first state parameter comprises one or more of a power, sensitivity, and amperage, wherein the second state parameter comprises one or more of a power, sensitivity, and amperage, and wherein the third state parameter comprises one or more of a power, sensitivity, and amperage.
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| CN202110707780.3A CN113447793B (en) | 2021-06-24 | 2021-06-24 | Device and method for testing circuit board |
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| CN202110707780.3A CN113447793B (en) | 2021-06-24 | 2021-06-24 | Device and method for testing circuit board |
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