CN113446749A - Dual-temperature control system and control method and device thereof - Google Patents

Dual-temperature control system and control method and device thereof Download PDF

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Publication number
CN113446749A
CN113446749A CN202110677921.1A CN202110677921A CN113446749A CN 113446749 A CN113446749 A CN 113446749A CN 202110677921 A CN202110677921 A CN 202110677921A CN 113446749 A CN113446749 A CN 113446749A
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temperature
adjusting
branch
difference value
value
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CN113446749B (en
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刘紫阳
胡文达
靳李富
芮守祯
何茂栋
曹小康
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Beijing Jingyi Automation Equipment Co Ltd
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Beijing Jingyi Automation Equipment Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F25B1/005—Compression machines, plants or systems with non-reversible cycle of the single unit type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • F25B29/003—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously of the compression type system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/31—Expansion valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F25B2600/2513—Expansion valves

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Feedback Control In General (AREA)

Abstract

The invention provides a dual-temperature control system and a control method and device thereof. The control method of the double temperature control systems comprises the steps of obtaining a first difference value of a load outlet set temperature and a load outlet actual temperature of a branch loop, and adjusting the duty ratio of a heater of the branch loop based on the first difference value; acquiring a second difference value of the set temperature of the water tank inlet of the branch circuit and the actual temperature of the water tank inlet, and adjusting the opening degree of an expansion valve of the branch circuit based on the second difference value; and acquiring a third difference value of the preset evaporation temperature mean value and the actual evaporation temperature of the branch loop, and adjusting the opening of the suction side three-way valve based on the third difference value. The control method of the double temperature control systems controls the precision of outlet temperature by adjusting the duty ratio of a heater in each branch loop by using a PID algorithm; the opening degree of the expansion valve is adjusted by using another set of PID algorithm, and the temperature of the inlet of the water tank is controlled to tend to be stable; and adjusting the opening degree of the three-way valve at the suction side by using another set of PID algorithm so as to enable the third difference value to be consistent with the target value.

Description

Dual-temperature control system and control method and device thereof
Technical Field
The invention relates to the field of temperature control, in particular to a dual-temperature control system and a control method and device thereof.
Background
In the semiconductor wafer processing process, temperature control is extremely important to the processing yield of the wafer, and the more advanced process, the higher the constant temperature requirement in the processing process. For the mainstream temperature control device for the semiconductor in the current industry, temperature control is generally realized by adopting two modes of a fluorine refrigeration system and cooling water heat exchange according to different temperature control ranges. The factory cooling water provided by the semiconductor processing factory is generally 15-20 ℃, and the temperature control range of the temperature control device can be changed from-20 ℃ to 90 ℃. When the lower limit of the temperature control range is higher than 25 ℃, the temperature control device generally utilizes a plate heat exchanger, factory cooling water and circulating liquid entering the processing cavity respectively circulate at two sides of the heat exchanger, and the factory cooling water is used for cooling the circulating liquid entering the processing cavity for temperature control; when the lower limit of the temperature control range is lower than 25 ℃, the temperature control device generally uses a fluorine refrigerating system, a fluorine refrigerant is used for cooling the circulating liquid entering the processing cavity in the evaporator, and factory cooling water enters the condenser for cooling superheated steam of the refrigerant.
The etching process is one of the most important processes in semiconductor processing, and in the development stage of the current etching process, the current advanced etching process adopts a plasma dry etching method, and the process method needs to control the temperature of a processing cavity (a lower electrode) and simultaneously cool an upper electrode part, namely, two groups of constant temperature pipelines need to be simultaneously provided for a single processing cavity and a temperature control device to respectively cool the lower electrode and the upper electrode.
In order to improve the wafer processing efficiency, part of mainstream etching equipment adopts a design scheme of double processing cavities, namely one processing unit, can process wafers in two cavities simultaneously, and a temperature control device matched with the processing unit also needs to provide two paths of temperature control simultaneously.
For the requirements of dual temperature control of the two temperature control devices, two independent temperature control hardware systems are adopted for the common temperature control devices. When the lower limit of two temperature control ranges is lower than that of factory cooling water, two independent fluorine refrigerating systems are needed for temperature control, so that the overall power consumption of the temperature control device is large, the size is large, and the cost is high.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a control method of a double temperature control system, which can reduce average power consumption and reduce cost.
The embodiment of the invention provides a control method of a double temperature control system, which comprises the following steps:
acquiring a first difference value of a load outlet set temperature and a load outlet actual temperature of a branch loop, and adjusting the duty ratio of a heater of the branch loop based on the first difference value;
acquiring a second difference value of the set temperature of the water tank inlet of the branch circuit and the actual temperature of the water tank inlet, and adjusting the opening degree of an expansion valve of the branch circuit based on the second difference value;
and acquiring a third difference value of the preset evaporation temperature mean value and the actual evaporation temperature of the branch loop, and adjusting the opening degree of a three-way valve at the suction side based on the third difference value.
According to the control method of the double temperature control systems provided by the embodiment of the first aspect of the invention, the duty ratio of the heater is adjusted by using a PID algorithm in each branch loop, so that the outlet temperature precision is controlled; the opening degree of the expansion valve is adjusted by using another set of PID algorithm, and the temperature of the inlet of the water tank is controlled to tend to be stable; and adjusting the opening degree of the three-way valve at the suction side by using another set of PID algorithm so as to enable the third difference value to be consistent with the target value. Therefore, the purposes of reducing energy consumption and saving cost can be achieved.
According to an embodiment of the present invention, the branch circuit includes a first branch circuit and a second branch circuit connected in parallel, the first branch circuit and the second branch circuit being connected to the suction-side three-way valve.
According to an embodiment of the present invention, the step of adjusting the duty cycle of the heater of the branch circuit based on the first difference value includes:
and the first difference is divided equally and corresponds to the output quantity of a first PID regulator, and the duty ratio of the heater corresponds to the output quantity of the first PID regulator based on the output quantity of the first PID regulator.
According to an embodiment of the present invention, the adjusting the opening degree of the expansion valve of the branch circuit based on the second difference includes:
adjusting the opening degree of the expansion valve to calculate the evaporation temperature of the branch loop by corresponding the second difference value to the output quantity of a second PID regulator;
Th＝min(m，T0’)-a；
Tl＝min(m，T0’)-b；
th is the upper limit value of the evaporation temperature of the branch loop, Tl is the lower limit value of the evaporation temperature of the branch loop, and T0' is the actual temperature of the inlet of the water tank; the value of a is 10-15, the value of b is 8-12, and the value of m is about 10-20 ℃ lower than the inlet temperature of cooling water of the condenser.
According to an embodiment of the present invention, the adjusting the opening degree of the suction-side three-way valve based on the third difference includes:
Tev1＝(Th1+Tl1)/2；
Tev2＝(Th2+Tl2)/2；
setting SV as Tev1-Tev2 as the output quantity of the third PID regulator;
PV＝Te1-Te2；
te1 and Te2 are actual values of evaporating temperatures of the first branch circuit and the second branch circuit, respectively;
and adjusting the opening degree of the suction side three-way valve to make PV equal to SV.
According to an embodiment of the present invention, further comprising:
selecting a loop with small Th from the first branch loop and the second branch loop;
increasing the compressor frequency by a fixed value per unit time when Te > Th so that Te < Th;
selecting a loop with a small Tl in the first branch loop and the second branch loop;
when Te < Tl, the compressor frequency is reduced by a fixed value per unit time so that Te > Tl.
The invention also provides a control device of the double temperature control system, which comprises:
the first acquisition module is used for acquiring a first difference value of the set temperature of the load outlet and the actual temperature of the load outlet of the branch loop;
a first adjusting module for adjusting a duty cycle of a heater of the branch circuit based on the first difference;
the second acquisition module is used for acquiring a second difference value of the set temperature of the water tank inlet of the branch loop and the actual temperature of the water tank inlet;
a second adjusting module, configured to adjust an opening degree of an expansion valve of the branch circuit based on the second difference;
the third obtaining module is used for obtaining a preset evaporation temperature mean value of the branch loop and a third difference value of the actual evaporation temperature;
and the third adjusting module is used for adjusting the opening of the suction side three-way valve based on the third difference.
The invention also provides a double-temperature control system, which comprises the control device of the double-temperature control system.
The invention also provides an electronic device, which comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the processor executes the program to realize the steps of the control method of the temperature control system.
The invention also provides a non-transitory computer-readable storage medium on which a computer program is stored which, when being executed by a processor, carries out the steps of the control method of the temperature control system described above.
One or more technical solutions in the present invention have at least one of the following technical effects:
according to the control method of the double temperature control systems provided by the embodiment of the first aspect of the invention, the duty ratio of the heater is adjusted by using a PID algorithm in each branch loop, so that the outlet temperature precision is controlled; the opening degree of the expansion valve is adjusted by using another set of PID algorithm, and the temperature of the inlet of the water tank is controlled to tend to be stable; and adjusting the opening degree of the three-way valve at the suction side by using another set of PID algorithm so as to enable the third difference value to be consistent with the target value. Therefore, the purposes of reducing energy consumption and saving cost can be achieved.
Drawings
FIG. 1 is a schematic flow chart of a control method of a dual temperature control system according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a dual temperature control system according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Reference numerals:
100. a heater; 101. a compressor; 102. a main-path electronic expansion valve; 103. an evaporator; 104. the hot gas bypasses the electronic expansion valve; 105. a cold bypass electronic expansion valve; 106. a temperature sensor; 107. an inlet temperature sensor; 108. a water tank; 109. a low pressure sensor; 110. a three-way valve; 200. a processor; 202. a memory; 204. a communication interface; 206. a communication bus.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
With reference to fig. 1 and fig. 2 in combination, an embodiment of the first aspect of the present invention provides a control method for a dual temperature control system, including:
step 100, obtaining a first difference value of a load outlet set temperature and a load outlet actual temperature of the branch loop, and adjusting the duty ratio of the heater 100 of the branch loop based on the first difference value;
step 200, obtaining a second difference value of the set temperature of the inlet of the water tank 108 of the branch loop and the actual temperature of the inlet of the water tank 108, and adjusting the opening degree of an expansion valve of the branch loop based on the second difference value;
and 300, acquiring a third difference value of the preset evaporation temperature average value and the actual evaporation temperature of the branch loop, and adjusting the opening of the suction side three-way valve 110 based on the third difference value.
According to the control method of the dual temperature control system provided by the embodiment of the first aspect of the invention, the duty ratio of the heater 100 is adjusted by using a PID algorithm in each branch loop, so that the outlet temperature precision is controlled; the opening degree of the expansion valve is adjusted by using another set of PID algorithm, and the temperature of the inlet of the water tank 108 is controlled to tend to be stable; the opening degree of the suction-side three-way valve 110 is adjusted using another set of PID algorithm so that the third difference value coincides with the target value. Therefore, the purposes of reducing energy consumption and saving cost can be achieved.
In the embodiment of the present invention, the branch circuit includes a first branch circuit and a second branch circuit connected in parallel, and the first branch circuit and the second branch circuit are connected to the suction-side three-way valve 110.
Specifically, in step 100, the method further includes:
and step 110, dividing the first difference equally and corresponding to the output quantity of the first PID regulator, and corresponding to the duty ratio of the heater 100 based on the output quantity of the first PID regulator.
That is, in step 100 and step 110, the related regulating devices include a heater 100, a main circuit electronic expansion valve 102, and a hot gas bypass electronic expansion valve 104, and the control logics thereof are independent from the second branch circuit, and the control logics of the devices are described below by taking the device of the first branch circuit as an example:
setting the set value of the outlet temperature of the first branch loop as T1, collecting a measured value T1 'of a temperature sensor 106 of the outlet, calculating a first difference DT1 between the set temperature of the outlet of the load and the actual temperature of the outlet of the load to be T1-T1', and taking DT1 as the input quantity of a first PID regulator, wherein the upper limit and the lower limit of the output quantity of the first PID regulator are defined to be 0-100 and respectively correspond to 0-100% of the output duty ratio of a heater 100, so that the constant temperature control of the outlet temperature is realized.
The set point T0 for the inlet temperature of the tank 108 is given in combination with the first outlet temperature set point T1, based on the circulating fluid flow Q. The heater 100 can be ensured to heat the circulating liquid temperature from T0 to T1 at the output of about 50%. On the premise that the value T0' of the inlet temperature sensor 107 of the water tank 108 is stable, the adjustment amplitude of the first outlet temperature by the heater 100 is strong, and the temperature control precision of the first outlet temperature is improved.
In step 200, the method also includes:
step 210, corresponding the second difference value to the output quantity of the second PID regulator, and adjusting the opening degree of the expansion valve to calculate the evaporation temperature of the branch loop;
Th＝min(m，T0’)-a；
Tl＝min(m，T0’)-b；
th is the upper limit value of the evaporation temperature of the branch loop, Tl is the lower limit value of the evaporation temperature of the branch loop, and T0' is the actual inlet temperature of the water tank 108; the value of a is 10-15, the value of b is 8-12, and the value of m is about 10-20 ℃ lower than the inlet temperature of cooling water of the condenser.
Specifically, the difference DT0 ' between the measured value T0 ' of the inlet temperature of the water tank 108 and the set value T0 is T0-T0 ' and is collected as the input quantity of the second PID controller, and the output quantity range of the second PID controller is 0-100 and corresponds to the lower limit and the upper limit of the range set by the opening degree of the main electronic expansion valve 102. The opening degree of the main electronic expansion valve 102 is adjusted to control the flow of the refrigerant entering the evaporator 103, and the output of the refrigerating capacity is adjusted, so that the constant temperature control of the inlet temperature T0' of the water tank 108 is realized.
The inlet temperature T0' of the collection tank 108 may be given by the following equation for the range of first loop evaporating temperatures:
Th＝min(m,T0’)-a
Tl＝min(m,T0’)-b
in the formula, Th is the upper limit value of the evaporation temperature of the branch circuit, Tl is the lower limit value of the evaporation temperature of the branch circuit, and T0' is the actual inlet temperature of the water tank 108; the value of a is 10-15, the value of b is 8-12, and the value of m is about 10-20 ℃ lower than the inlet temperature of cooling water of the condenser.
Collecting the measured value of the low-pressure sensor 109, determining the evaporating temperature Te according to the corresponding relation of the refrigerant pressure and the evaporating temperature, simultaneously calculating the upper and lower limits Th and Tl of the obtained evaporating temperature in real time, and reducing a hot gas bypass opening value of | Te-Th | d1 in each unit time when Te is greater than Th, wherein d1 is a constant value; when Te is less than Tl, the hot gas bypass opening value of Te-Th is increased in unit time, so that Te is maintained in the range of (Tl, Th).
In the above calculation formula of Th and Tl, according to the matching condition of the devices in the refrigerating system, the value of m is generally 10-20 ℃ lower than the inlet temperature of the cooling water of the condenser. a is generally 10-15, b is generally 8-12, and the difference value of a-b is generally controlled within the range of 3-5 in order to ensure the timely feedback of evaporation temperature regulation to load change under the no-load state (namely T-in-T0' is close to 0).
Within the temperature range in which the temperature control device can operate, T0' is divided into a plurality of continuous areas, and each area can be set with different values of a and b to adapt to requirements under different working conditions. The value of m is obtained by debugging according to system configuration, generally setting the compressor 101 to operate at the minimum frequency, setting the heater 100 to output at a proportion of 50%, setting the hot gas bypass valve to have an opening degree of 50%, and then adjusting the opening degree of the main path expansion valve to stabilize the outlet temperature, wherein the actually measured T0' is m. The above is a constant value rule of each constant. The determination of each item value is that the optimal value is determined according to the test condition in the debugging process of the product research and development prototype.
In step 300, the method also includes:
step 310, Tev1 ═ Th1+ Tl 1)/2; tev2 ═ Th2+ Tl 2)/2;
setting SV as Tev1-Tev2 as the output quantity of the third PID regulator;
PV＝Te1-Te2；
te1 and Te2 are actual values of the evaporating temperature of the first branch circuit and the second branch circuit, respectively;
adjusting the opening degree of the suction-side three-way valve 110 so that PV becomes SV;
selecting a loop with small Th from the first branch loop and the second branch loop;
when Te > Th, the compressor 101 frequency is increased by a fixed value per unit time so that Te < Th;
selecting a loop with a small Tl from the first branch loop and the second branch loop;
when Te < Tl, the compressor 101 frequency is reduced by a fixed value per unit time so that Te > Tl.
The evaporating temperature range (Tl1, Th1) of the first branch circuit and the evaporating temperature range (Tl2, Th2) of the second branch circuit are determined according to the above formula, then the evaporating temperature range intermediate value Tev1 of the first branch circuit and the second branch circuit is obtained as (Th1+ Tl1)/2, Tev2 is obtained as (Th2+ Tl2)/2, and SV-Tev 1-Tev2 is set as the control target value of the third PID regulator.
And PV is Te1-Te2 which is an actual value, the opening ratio of two sides of the suction side three-way valve 110 is adjusted by utilizing the algorithm of a third PID adjuster, and the relative ratio of the outlet of the evaporator 103 in the first branch circuit and the second branch circuit to the suction pipe of the compressor 101 is further controlled, so that PV is consistent with SV.
Comparing Th1 with Th2, selecting a circuit with smaller Th, and increasing the frequency of the compressor 101 at a fixed value per unit time to reduce Te to be less than Th when Te in the circuit is greater than Th. Comparing Tl1 with Tl2, selecting a loop with smaller Tl, and when Te in the loop is less than Tl, reducing the frequency of the compressor 101 by a fixed value per unit time to enable Te to be increased to be more than Tl.
Setting the exhaust temperature range (x, y) of the compressor 101, wherein x is generally controlled to be higher than the highest condensation temperature by more than 20 ℃ and y is generally controlled to be lower than 120 ℃ according to actual conditions, and when the exhaust temperature measured value Td > y, the opening degree of the cold bypass electronic expansion valve 105 of (Td-y) × d2 is increased per unit time; when Td < x, the opening degree of (x-Td) × d2 is reduced per unit time, d2 being a constant.
According to the above control logic, the Tin temperature value increases as the external load increases gradually. Meanwhile, the heat load in the evaporator 103 is increased, which causes the inlet of the water tank 108 to be raised, the output quantity of the second PID regulator is increased, i.e. the opening degree of the main circuit electronic expansion valve 102 is increased, the mass flow of the refrigerant is increased, and the cooling capacity is improved.
Meanwhile, the evaporation temperature is gradually increased in the process, the heat exchange temperature difference in the evaporator 103 is gradually reduced to reach the limit, the heat exchange amount is not increased any more, and liquid passing at the outlet of the evaporator 103 may occur. And reasonable values of a, b and m are set, so that Te exceeds Th before liquid passing occurs, the opening of the hot gas bypass valve is gradually reduced, the temperature of Te is reduced, and the heat exchange temperature difference in the evaporator 103 is increased. After that, the opening degree of the main electronic expansion valve 102 can be continuously increased, the heat exchange capacity of the evaporator 103 can be continuously increased, and the inlet temperature control of the water tank 108 can be realized. When the external load is gradually reduced, the change of each process and the action direction of the devices are opposite to the process, and finally, the heat exchange quantity of the evaporator 103 is gradually reduced, and the temperature control of the inlet temperature of the water tank 108 is completed.
The frequency of the compressor 101 always takes the evaporation temperature state in the loop with the low evaporation temperature value limit value as the adjusting basis, namely the frequency adjustment of the compressor 101 is consistent with the control of the hot gas bypass valve in the loop with the low evaporation temperature. According to the average difference of the evaporation temperature limit values, the pressure difference between the pressure sensors is changed by adjusting the three-way valve 110, so that the actual evaporation temperature Te in a higher evaporation temperature loop is between the corresponding Tl and Th, and the requirement of evaporation pressure is met.
An embodiment of a second aspect of the present invention provides a control device for a dual temperature control system, including:
the first acquisition module is used for acquiring a first difference value of the set temperature of the load outlet and the actual temperature of the load outlet of the branch loop;
a first adjusting module for adjusting a duty ratio of the heater 100 of the branch circuit based on the first difference;
the second obtaining module is used for obtaining a second difference value between the set temperature of the inlet of the water tank 108 of the branch loop and the actual temperature of the inlet of the water tank 108;
the second adjusting module is used for adjusting the opening degree of the expansion valve of the branch circuit based on the second difference value;
the third acquisition module is used for acquiring a preset evaporation temperature mean value of the branch loop and a third difference value of the actual evaporation temperature;
and a third adjusting module for adjusting the opening of the suction-side three-way valve 110 based on the third difference.
In the control device of the dual temperature control system provided by the embodiment of the second aspect of the invention, the duty ratio of the heater 100 is adjusted by using a PID algorithm in each branch loop, so as to control the outlet temperature precision; the opening degree of the expansion valve is adjusted by using another set of PID algorithm, and the temperature of the inlet of the water tank 108 is controlled to tend to be stable; the opening degree of the suction-side three-way valve 110 is adjusted using another set of PID algorithm so that the third difference value coincides with the target value.
As shown in fig. 2, a dual temperature control system according to a third embodiment of the present invention includes the control device of the dual temperature control system.
In the control device of the dual temperature control system provided by the embodiment of the third aspect of the invention, the duty ratio of the heater 100 is adjusted by using a PID algorithm in each branch loop, so as to control the outlet temperature precision; the opening degree of the expansion valve is adjusted by using another set of PID algorithm, and the temperature of the inlet of the water tank 108 is controlled to tend to be stable; the opening degree of the suction-side three-way valve 110 is adjusted using another set of PID algorithm so that the third difference value coincides with the target value.
Fig. 3 illustrates a physical structure diagram of an electronic device, which may include, as shown in fig. 3: a processor 200(processor), a communication Interface 204(Communications Interface), a memory 202(memory), and a communication bus 206, wherein the processor 200, the communication Interface 204, and the memory 202 complete communication with each other through the communication bus 206. The processor 200 may call logic instructions in the memory 202 to perform the following method:
acquiring a first difference value of a load outlet set temperature and a load outlet actual temperature of the branch circuit, and adjusting the duty ratio of the heater 100 of the branch circuit based on the first difference value;
acquiring a second difference value between the set temperature of the inlet of the water tank 108 of the branch circuit and the actual temperature of the inlet of the water tank 108, and adjusting the opening degree of an expansion valve of the branch circuit based on the second difference value;
and acquiring a third difference value of the preset evaporation temperature average value and the actual evaporation temperature of the branch circuit, and adjusting the opening degree of the suction side three-way valve 110 based on the third difference value.
Furthermore, the logic instructions in the memory 202 may be implemented in software functional units and stored in a computer readable storage medium when sold or used as a stand-alone product. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory 202 (ROM), a Random Access Memory 202 (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The non-transitory computer readable storage medium according to the fifth embodiment of the present invention has a computer program stored thereon, and the computer program is executed by the processor 200 to implement the above-mentioned gravity difference obtaining method for the goods in the storage cabinet, for example, the method includes:
acquiring a first difference value of a load outlet set temperature and a load outlet actual temperature of the branch circuit, and adjusting the duty ratio of the heater 100 of the branch circuit based on the first difference value;
acquiring a second difference value between the set temperature of the inlet of the water tank 108 of the branch circuit and the actual temperature of the inlet of the water tank 108, and adjusting the opening degree of an expansion valve of the branch circuit based on the second difference value;
and acquiring a third difference value of the preset evaporation temperature average value and the actual evaporation temperature of the branch circuit, and adjusting the opening degree of the suction side three-way valve 110 based on the third difference value.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods of the various embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (10)

1. A control method of a double temperature control system is characterized by comprising the following steps:
acquiring a first difference value of a load outlet set temperature and a load outlet actual temperature of a branch loop, and adjusting the duty ratio of a heater of the branch loop based on the first difference value;
acquiring a second difference value of the set temperature of the water tank inlet of the branch circuit and the actual temperature of the water tank inlet, and adjusting the opening degree of an expansion valve of the branch circuit based on the second difference value;
and acquiring a third difference value of the preset evaporation temperature mean value and the actual evaporation temperature of the branch loop, and adjusting the opening degree of a three-way valve at the suction side based on the third difference value.
2. The control method of a dual temperature control system according to claim 1, wherein the branch circuit includes a first branch circuit and a second branch circuit connected in parallel, the first branch circuit and the second branch circuit being connected to the suction-side three-way valve.
3. The method for controlling a dual temperature control system according to claim 2, wherein the step of adjusting the duty ratio of the heater of the branch circuit based on the first difference value comprises:
and the first difference is divided equally and corresponds to the output quantity of a first PID regulator, and the duty ratio of the heater corresponds to the output quantity of the first PID regulator based on the output quantity of the first PID regulator.
4. The method of controlling a dual temperature control system according to claim 2, wherein the step of adjusting the opening degree of the expansion valve of the branch circuit based on the second difference includes:
adjusting the opening degree of the expansion valve to calculate the evaporation temperature of the branch loop by corresponding the second difference value to the output quantity of a second PID regulator;
Th＝min(m，T0’)-a；
Tl＝min(m，T0’)-b；
th is the upper limit value of the evaporation temperature of the branch loop, Tl is the lower limit value of the evaporation temperature of the branch loop, and T0' is the actual temperature of the inlet of the water tank; the value of a is 10-15, the value of b is 8-12, and the value of m is about 10-20 ℃ lower than the inlet temperature of cooling water of the condenser.
5. The method of controlling a dual temperature control system according to claim 2, wherein the step of adjusting the opening degree of the intake-side three-way valve based on the third difference includes:
Tev1＝(Th1+Tl1)/2；
Tev2＝(Th2+Tl2)/2；
setting SV as Tev1-Tev2 as the output quantity of the third PID regulator;
PV＝Te1-Te2；
te1 and Te2 are actual values of evaporating temperatures of the first branch circuit and the second branch circuit, respectively;
and adjusting the opening degree of the suction side three-way valve to make PV equal to SV.
6. The control method of the dual temperature control system according to claim 5, further comprising:
selecting a loop with small Th from the first branch loop and the second branch loop;
increasing the compressor frequency by a fixed value per unit time when Te > Th so that Te < Th;
selecting a loop with a small Tl in the first branch loop and the second branch loop;
when Te < Tl, the compressor frequency is reduced by a fixed value per unit time so that Te > Tl.
7. A control device for a dual temperature control system, comprising:
the first acquisition module is used for acquiring a first difference value of the set temperature of the load outlet and the actual temperature of the load outlet of the branch loop;
a first adjusting module for adjusting a duty cycle of a heater of the branch circuit based on the first difference;
the second acquisition module is used for acquiring a second difference value of the set temperature of the water tank inlet of the branch loop and the actual temperature of the water tank inlet;
a second adjusting module, configured to adjust an opening degree of an expansion valve of the branch circuit based on the second difference;
the third obtaining module is used for obtaining a preset evaporation temperature mean value of the branch loop and a third difference value of the actual evaporation temperature;
and the third adjusting module is used for adjusting the opening of the suction side three-way valve based on the third difference.
8. A dual temperature control system comprising the control device of the dual temperature control system according to claim 7.
9. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the steps of the control method of a temperature control system according to any one of claims 1 to 7 are implemented when the processor executes the program.
10. A non-transitory computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of a control method of a temperature control system according to any one of claims 1 to 7.
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