CN112414001B - Temperature control system for semiconductor and control method thereof - Google Patents

Temperature control system for semiconductor and control method thereof Download PDF

Info

Publication number
CN112414001B
CN112414001B CN202110093690.XA CN202110093690A CN112414001B CN 112414001 B CN112414001 B CN 112414001B CN 202110093690 A CN202110093690 A CN 202110093690A CN 112414001 B CN112414001 B CN 112414001B
Authority
CN
China
Prior art keywords
temperature
real
time
superheat degree
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110093690.XA
Other languages
Chinese (zh)
Other versions
CN112414001A (en
Inventor
刘紫阳
靳李富
胡文达
芮守祯
何茂栋
曹小康
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Jingyi Automation Equipment Co Ltd
Original Assignee
Beijing Jingyi Automation Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Jingyi Automation Equipment Co Ltd filed Critical Beijing Jingyi Automation Equipment Co Ltd
Priority to CN202110093690.XA priority Critical patent/CN112414001B/en
Publication of CN112414001A publication Critical patent/CN112414001A/en
Application granted granted Critical
Publication of CN112414001B publication Critical patent/CN112414001B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus
    • F25D31/005—Combined cooling and heating devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H7/00—Storage heaters, i.e. heaters in which the energy is stored as heat in masses for subsequent release
    • F24H7/02—Storage heaters, i.e. heaters in which the energy is stored as heat in masses for subsequent release the released heat being conveyed to a transfer fluid
    • F24H7/0208—Storage heaters, i.e. heaters in which the energy is stored as heat in masses for subsequent release the released heat being conveyed to a transfer fluid using electrical energy supply
    • F24H7/0233—Storage heaters, i.e. heaters in which the energy is stored as heat in masses for subsequent release the released heat being conveyed to a transfer fluid using electrical energy supply the transfer fluid being water
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H9/00—Details
    • F24H9/20—Arrangement or mounting of control or safety devices
    • F24H9/2007—Arrangement or mounting of control or safety devices for water heaters
    • F24H9/2014—Arrangement or mounting of control or safety devices for water heaters using electrical energy supply
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • F25B49/022—Compressor control arrangements

Abstract

The invention relates to the technical field of temperature control, and discloses a temperature control system for a semiconductor and a control method thereof, wherein the temperature control system comprises: a refrigeration system and a coolant system; a target temperature sensor is arranged at an outlet of a circulating pump of the secondary refrigerant system, an inlet temperature sensor is arranged at an inlet of the second side of the evaporator, an outlet temperature sensor is arranged at the outlet, and a pressure sensor and an air suction temperature sensor are arranged at an outlet of the first side of the evaporator; the refrigerating system and the heating assembly are used for carrying out real-time adjustment according to the deviation of the real-time target temperature and the preset target temperature; the refrigerating system is also used for real-time adjustment according to the real-time outlet temperature, the real-time inlet temperature, the real-time evaporation pressure and the real-time air suction temperature. According to the temperature control system for the semiconductor and the control method thereof, provided by the invention, accurate temperature control can be realized, and the temperature control system can monitor the working conditions of a plurality of parts during regulation and control, so that the stability of the working conditions is favorably maintained, and the precision of temperature regulation is improved.

Description

Temperature control system for semiconductor and control method thereof
Technical Field
The invention relates to the technical field of temperature control, in particular to a temperature control system for a semiconductor and a control method thereof.
Background
In semiconductor wafer fabrication processes, a constant ambient temperature needs to be maintained within the reaction chamber. In the temperature control device of the semiconductor equipment, the temperature control device is required to simultaneously operate a negative temperature working condition and a high temperature working condition, for the temperature control device for the common semiconductor equipment, the lower limit of the possible temperature control range of the secondary refrigerant is less than-20 ℃, the upper limit is more than 80 ℃, and the corresponding evaporation temperature range can be changed within the range of-30 ℃ to 15 ℃.
The temperature control device for semiconductor production currently mainly uses a system structure of 'refrigerating system + electric heating', uses high-insulativity electronic fluorinated liquid as a secondary refrigerant, and controls the temperature of a wafer processing cavity. The existing temperature control device controls and adjusts the refrigerating capacity of a refrigerating system through a PID algorithm in the process of constant temperature control; the electric heating is controlled by a PID algorithm to adjust the heating quantity, so that the temperature control is realized by matching the electric heating and the PID algorithm.
The existing temperature control scheme mainly uses a PID algorithm to regulate and control a system, and the oscillation of working conditions in the system is easily caused in the regulation and control process, so that the temperature control precision is reduced.
Disclosure of Invention
The invention provides a temperature control system for a semiconductor and a control method thereof, which are used for solving the problem that the conventional temperature control scheme is easy to cause the oscillation of working conditions in the system in the regulation and control process so as to reduce the temperature control precision.
The invention provides a temperature control system for a semiconductor, comprising: the refrigerating system comprises a first side of an evaporator, a compressor, a condenser and a main circuit electronic expansion valve which are sequentially connected in series to form a loop, the secondary refrigerant system comprises a second side of the evaporator, a heating assembly and a circulating pump which are sequentially connected in series to form the loop, and a pipeline between an outlet of the circulating pump and the second side of the evaporator is used for flowing through a load component; a target temperature sensor is arranged at an outlet of the circulating pump, an inlet temperature sensor is arranged at an inlet of the second side of the evaporator, an outlet temperature sensor is arranged at an outlet of the second side of the evaporator, and a pressure sensor and an air suction temperature sensor are arranged at an outlet of the first side of the evaporator; the refrigerating system and the heating assembly are used for carrying out real-time adjustment according to the deviation of the real-time target temperature detected by the target temperature sensor and the preset target temperature; the refrigerating system is simultaneously used for adjusting in real time according to the real-time outlet temperature detected by the outlet temperature sensor, the real-time inlet temperature detected by the inlet temperature sensor, the real-time evaporation pressure detected by the pressure sensor and the real-time air suction temperature detected by the air suction temperature sensor.
According to the temperature control system for the semiconductor, a heat bypass pipeline is communicated between the outlet pipeline of the compressor and the inlet pipeline of the first side of the evaporator, and a heat bypass electronic expansion valve is arranged on the heat bypass pipeline.
The invention also provides a control method of the temperature control system for the semiconductor, which is based on the temperature control system for the semiconductor and comprises the following steps: regulating and controlling the heating assembly and the refrigerating system according to the deviation of the real-time target temperature and the preset target temperature, so that the real-time target temperature is consistent with the preset target temperature; and meanwhile, the refrigeration system is regulated and controlled according to the real-time outlet temperature and the real-time inlet temperature in the secondary refrigerant system, and the real-time evaporation pressure and the real-time suction temperature in the refrigeration system.
According to the control method of the temperature control system for the semiconductor, provided by the invention, the regulation and control of the heating assembly and the refrigerating system according to the deviation between the real-time target temperature and the preset target temperature specifically comprises the following steps: and regulating and controlling the heating capacity of the heating assembly and the refrigerating capacity of the refrigerating system by utilizing the PID control logic according to the deviation between the real-time outlet temperature and the preset outlet temperature.
According to the control method of the temperature control system for the semiconductor, provided by the invention, the regulation and control of the refrigerating capacity of the refrigerating system specifically comprise the following steps: and regulating and controlling the opening degree of the thermal bypass electronic expansion valve according to the deviation between the real-time outlet temperature and the preset outlet temperature.
According to the control method of the temperature control system for the semiconductor, provided by the invention, the regulation and control of the refrigerating system according to the real-time outlet temperature and the real-time inlet temperature in the secondary refrigerant system, the real-time evaporation pressure and the real-time suction temperature in the refrigerating system specifically comprise the following steps: acquiring real-time evaporation temperature according to real-time evaporation pressure in a refrigeration system; the real-time evaporation temperature is lower than the preset evaporation temperature by regulating and controlling the refrigeration system.
According to the control method of the temperature control system for the semiconductor, provided by the invention, the regulation and control of the refrigerating system according to the real-time outlet temperature and the real-time inlet temperature in the secondary refrigerant system, the real-time evaporation pressure and the real-time suction temperature in the refrigerating system specifically comprise the following steps: acquiring a real-time superheat degree in the refrigeration system according to a real-time evaporation pressure and a real-time suction temperature in the refrigeration system; the real-time superheat degree is in a preset superheat degree range through regulation and control of the refrigeration system.
According to the control method of the temperature control system for the semiconductor, provided by the invention, the regulation and control of the refrigerating system to enable the real-time multiple heat degree to be within the preset superheat degree range specifically comprises the following steps: the real-time superheat degree is in a preset superheat degree range by adjusting the opening degree of the main-path electronic expansion valve.
According to the control method of the temperature control system for the semiconductor, provided by the invention, the preset superheat degree range is determined by the following formula: SH0 = TInto-min(T，m)+a-c×(TInto-TGo out)；SH1 = TInto-min (T, m) + b; wherein SH0 is the upper limit value of superheat degree; SH1 is the lower limit value of superheat degree; t is a preset target temperature; t isIntoIs the evaporator inlet temperature in the coolant system; t isGo outIs the evaporator outlet temperature in the coolant system; m, a, b and c are constants.
According to the control method of the temperature control system for the semiconductor, provided by the invention, the real-time superheat degree is in a preset superheat degree range by adjusting the opening degree of the electronic expansion valve of the main circuit, and the method comprises the following steps: when the real-time superheat degree is higher than a preset superheat degree range, gradually increasing the opening degree of the main-path electronic expansion valve; and when the real-time superheat degree is lower than the preset superheat degree range, gradually reducing the opening degree of the main-path electronic expansion valve.
According to the temperature control system for the semiconductor and the control method thereof, provided by the invention, the precise temperature control can be realized through the matching regulation and control of the refrigerating system and the heating assembly, in the temperature control process, the power consumption of the temperature control device can be favorably reduced by regulating the refrigerating system, the refrigerating capacity change rate of the temperature control system is simultaneously improved, the temperature control system is better suitable for the rapid change of an external load, the working conditions of a plurality of parts are monitored during the regulation and control of the temperature control system, the stability of the working conditions is favorably maintained, and the precision of the temperature regulation is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a temperature control system for semiconductor according to the present invention;
FIG. 2 is a schematic diagram of a method for controlling a temperature control system for a semiconductor according to the present invention;
fig. 3 is another schematic view of the temperature control system for semiconductor according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The temperature control system for semiconductor and the control method thereof of the present invention will be described below with reference to fig. 1 to 3.
Referring to fig. 1, the present embodiment provides a temperature control system for a semiconductor, including: a refrigeration system and a coolant system. The refrigeration system comprises a first side of an evaporator 6, a compressor 1, a condenser 2 and a main circuit electronic expansion valve 5, which are connected in series in sequence to form a loop. The coolant system includes a second side of the evaporator 6, a heating assembly, and a circulation pump 12 connected in series to form a loop, with piping between the outlet of the circulation pump 12 and the second side of the evaporator 6 being used to flow through a load member 14. The refrigeration system is used for providing cold output and transferring cold to the secondary refrigerant in the secondary refrigerant system through heat exchange in the evaporator 6. The heating assembly is used for providing heat output for the secondary refrigerant. Thereby achieving stable temperature output through the refrigeration system and the heating assembly.
A target temperature sensor 13 is provided at the outlet of the circulation pump 12. Namely, the target temperature sensor 13 is provided between the outlet of the circulation pump 12 and the load part 14. The temperature of the secondary refrigerant at the outlet of the circulating pump 12 is the temperature after heat exchange between the refrigerating system and the heating assembly, namely the outlet temperature of the whole temperature control system. An inlet temperature sensor 15 is arranged at an inlet of the second side of the evaporator 6, an outlet temperature sensor 9 is arranged at an outlet of the second side of the evaporator 6, and a pressure sensor 8 and a suction temperature sensor 7 are arranged at an outlet of the first side of the evaporator 6.
The refrigerating system and the heating assembly are used for adjusting in real time according to the deviation of the real-time target temperature detected by the target temperature sensor and the preset target temperature. The refrigerating system is also used for real-time adjustment according to the real-time outlet temperature detected by the outlet temperature sensor, the real-time inlet temperature detected by the inlet temperature sensor, the real-time evaporation pressure detected by the pressure sensor and the real-time air suction temperature detected by the air suction temperature sensor.
That is, the temperature control system firstly performs comprehensive regulation and control on the refrigeration system and the heating assembly according to the deviation between the preset target temperature and the real-time target temperature, so that the cold quantity generated by the refrigeration system, the heat quantity generated by the heating assembly and the heat load of the load component 14 are balanced, and the real-time target temperature approaches to the preset target temperature. The temperature control system is also provided with a pressure sensor and a plurality of temperature sensors, and is used for monitoring the working conditions of all parts in the system in real time, and specifically monitoring the real-time inlet temperature, the real-time outlet temperature, the real-time evaporation pressure and the real-time air suction temperature. The refrigerating system is regulated and controlled together with the heating assembly by aiming at the fact that the real-time target temperature approaches to the preset target temperature, and meanwhile, the refrigerating system is regulated and controlled according to the real-time inlet temperature, the real-time outlet temperature, the real-time evaporation pressure and the real-time suction temperature in the temperature control system, so that the working condition of the refrigerating system is kept stable in the regulating and controlling process, and the improvement of the temperature regulation precision is facilitated.
The temperature control system for semiconductor that this embodiment provided, cooperation regulation and control through refrigerating system and heating element, can realize accurate temperature control, and at the control by temperature change in-process, through adjusting refrigerating system, still be favorable to reducing temperature control device's consumption, improve temperature control system's refrigerating output rate of change simultaneously, the quick change of better adaptation external load, and this temperature control system still monitors the operating mode at a plurality of positions when the regulation and control, be favorable to maintaining the operating mode stable, improve temperature regulation's precision.
Furthermore, the refrigerating system and the heating assembly can be used for adjusting in real time according to the deviation between the real-time target temperature detected by the target temperature sensor and the preset target temperature under the same PID control logic, so that the real-time target temperature is consistent with the preset target temperature. The refrigerating system is also used for correcting, regulating and controlling according to the real-time superheat degree, so that the real-time superheat degree of the refrigerating system is in a preset superheat degree range; so as to ensure the stability of the working condition and improve the precision of temperature control.
In addition to the above-described embodiments, referring to fig. 1, a hot bypass line is connected between the outlet line of the compressor 1 and the inlet line of the first side of the evaporator 6, and a hot bypass electronic expansion valve 16 is provided on the hot bypass line. One end of the hot bypass line is connected to the line between the compressor 1 and the condenser 2, and the other end is connected to the line between the main electronic expansion valve 5 and the evaporator 6.
Further, referring to fig. 1, in the temperature control system provided in this embodiment, in a specific refrigeration system, a dry filter 3 and a liquid lens 4 are sequentially and serially arranged between an outlet of the condenser 2 and an inlet of the main-path electronic expansion valve 5. In the secondary refrigerant system, the heating assembly comprises a water tank 10, and pipelines of the secondary refrigerant system flow through the water tank 10; a heater 11 may be provided in the water tank 10. The water tank 10 may not be provided with a heater, as shown in fig. 3.
In addition to the above embodiments, the present embodiment provides a method for controlling a temperature control system for a semiconductor, the method for controlling the temperature control system for a semiconductor including: regulating and controlling the heating assembly and the refrigerating system according to the deviation of the real-time target temperature and the preset target temperature, so that the real-time target temperature is consistent with the preset target temperature; and meanwhile, the refrigeration system is regulated and controlled according to the real-time outlet temperature and the real-time inlet temperature in the secondary refrigerant system, and the real-time evaporation pressure and the real-time suction temperature in the refrigeration system.
The control method of the temperature control system for the semiconductor provided by the embodiment mainly comprises the following control ideas: the method comprises the steps of directly detecting the real-time target temperature at the outlet of a circulating pump in a secondary refrigerant system, comparing the real-time target temperature with the preset target temperature, and comprehensively regulating and controlling the refrigerating capacity of a refrigerating system and the heating capacity of a heating assembly according to the deviation of the real-time target temperature and the preset target temperature, wherein the regulation and control aim is to enable the real-time target temperature to approach the preset target temperature.
And the refrigerating system is regulated and controlled together with the heating component by taking the aim that the real-time target temperature approaches to the preset target temperature, and meanwhile, the refrigerating system is also regulated and controlled according to the real-time inlet temperature, the real-time outlet temperature, the real-time evaporation pressure and the real-time suction temperature in the temperature control system, so that the working condition of the refrigerating system is kept stable in the regulating and controlling process, and the improvement of the temperature regulation precision is facilitated.
On the basis of the above embodiment, further, the controlling the heating assembly and the refrigeration system according to the deviation between the real-time target temperature and the preset target temperature specifically includes: and regulating and controlling the heating capacity of the heating assembly and the refrigerating capacity of the refrigerating system by utilizing the PID control logic according to the deviation between the real-time outlet temperature and the preset outlet temperature. The heating assembly and the refrigeration system are regulated and controlled by the same PID control logic, so that the real-time target temperature approaches to the preset target temperature.
On the basis of the above embodiment, further, the controlling of the refrigerating capacity of the refrigerating system specifically includes: and regulating and controlling the opening degree of the thermal bypass electronic expansion valve 16 according to the deviation between the real-time outlet temperature and the preset outlet temperature. In the control method of the temperature control system provided in this embodiment, when it is detected that the real-time target temperature deviates from the preset target temperature, the opening of the thermal bypass electronic expansion valve 16 is adjusted to regulate the cooling capacity of the refrigeration system; the real-time target temperature approaches to the preset target temperature by matching with the heating assembly.
The semiconductor temperature control system has two characteristics in operating condition: one is that the compressor needs to continuously operate without stopping when the quick feedback in the process of quickly changing the load is needed to be realized; the other is that the circulating liquid, namely the secondary refrigerant, is switched to operate at high temperature and low temperature, and the output of low refrigerating output needs to be maintained under the high-temperature working condition, namely the structure needs to be unloaded; for the above two features, the semiconductor temperature control system provided in this embodiment adopts the structure of "main path electronic expansion valve 5+ hot gas bypass electronic expansion valve 16" to realize the functions of fast feedback and unloading of the cooling capacity.
And because the thermal bypass electronic expansion valve 16 and the heating assembly are positioned in two circulating systems, the output change is relatively independent, the adjustment of the refrigerating output and the output of the heating assembly from the maximum value to 0 can be realized by using the same PID, and the mutual interference can be avoided.
On the basis of the above embodiment, further, the controlling the refrigeration system according to the real-time outlet temperature and the real-time inlet temperature in the secondary refrigerant system, the real-time evaporation pressure and the real-time suction temperature in the refrigeration system specifically includes: acquiring real-time evaporation temperature according to real-time evaporation pressure in a refrigeration system; the real-time evaporation temperature is lower than the preset evaporation temperature by regulating and controlling the refrigeration system. In the process that the evaporation temperature is increased along with the increase of the set temperature of the circulating liquid, namely the secondary refrigerant, the refrigerating output is gradually reduced due to the increase of the unloading of the hot gas bypass, the refrigerating output is kept horizontal to the heat loss of other parts of the temperature control device, and the refrigerating output has a lower limit value. Namely, after the evaporation temperature reaches a certain upper limit, the temperature is not continuously increased along with the set temperature of the circulating liquid, namely the refrigerating medium.
On the basis of the above embodiment, further, the controlling the refrigeration system according to the real-time outlet temperature and the real-time inlet temperature in the secondary refrigerant system, the real-time evaporation pressure and the real-time suction temperature in the refrigeration system specifically includes: acquiring a real-time superheat degree in the refrigeration system according to a real-time evaporation pressure and a real-time suction temperature in the refrigeration system; the real-time superheat degree is in a preset superheat degree range through regulation and control of the refrigeration system.
Further, the preset superheat degree range is obtained and determined in real time according to the real-time inlet temperature, the real-time outlet temperature and set parameters of the temperature control system.
On the basis of the above embodiment, further, the controlling the refrigeration system so that the real-time multiple heat degree is within the preset superheat degree range specifically includes: the real-time superheat degree is in a preset superheat degree range by adjusting the opening degree of the main-path electronic expansion valve.
On the basis of the above embodiment, further, the preset superheat range is specifically determined by the following formula:
SH0 = Tinto-min(T，m)+a-c×(TInto-TGo out)；
SH1 = TInto-min(T，m)+b；
Wherein SH0 is the upper limit value of superheat degree; SH1 is the lower limit value of superheat degree; t is a preset target temperature; t isIntoIs the evaporator inlet temperature in the coolant system; t isGo outIs the evaporator outlet temperature in the coolant system; m, a, b and c are constants.
Specifically, the value range of a in the formula is a value between 8 and 15; controlling the no-load superheat degree to be kept above 8 ℃; b is the minimum heat exchange temperature difference of the evaporator plus about 4-6 ℃; so that the evaporator does not experience flooding while simultaneously controlling the maximum load. The values of the two parameters a and b are basically applicable under different system configurations. Then m and c are different according to the system, for the system with high temperature reduction rate requirement, relatively speaking, the total output of the compressor at the middle and high temperature section is much higher than the output of the normal operation, the evaporation temperature at the high temperature section is controlled to be low, and m can be between-10 and 0. For machines with compressor output similar to normal operation output, m may be about 5-15. c is approximately 0.3-0.5; characterised by controlling the maximum output, i.e. TInto-TGo outAt the time of the maximum temperature difference, SH0 is larger than SH 1; namely, the evaporator is ensured not to generate liquid passing when the evaporator is in the maximum loading state. c is understood to mean the higher the maximum load, TInto-TGo outThe larger the temperature difference is, the smaller the value is. Meanwhile, the flow rate of the secondary refrigerant is also related, and the smaller the flow rate is, the larger the load temperature difference is, and the smaller the value is.
Further, the specific values of the constants in the formula can be determined in advance through debugging experiments. Specifically, each constant value can be preset, the temperature control system is subjected to a temperature control test under a simulated working condition, the temperature control system is regulated according to each preset constant value, and fluctuation of the outlet temperature of a circulating pump in the secondary refrigerant system is monitored. The preset constant value when the temperature fluctuation of the outlet of the circulating pump in the secondary refrigerant system is minimum is obtained by replacing and debugging different preset constant values, namely the determined constant value. The temperature fluctuation of the outlet of the circulating pump in the secondary refrigerant system is minimum, namely the temperature control precision is highest. Specifically, the heater may be used to simulate the temperature differential created by the load member 14 to create a simulated operating condition.
On the basis of the above embodiment, further, adjusting the opening degree of the main circuit electronic expansion valve 5 so that the real-time superheat degree is within the preset superheat degree range specifically includes: when the real-time superheat degree is higher than the preset superheat degree range, gradually increasing the opening degree of the main-path electronic expansion valve 5; and when the real-time superheat degree is lower than the preset superheat degree range, gradually reducing the opening degree of the main electronic expansion valve 5.
Because the flow of the secondary refrigerant used by the temperature control device of the semiconductor equipment is small, and the secondary refrigerant is mostly electronic fluorinated liquid with lower specific heat capacity, the temperature difference fluctuation of the secondary refrigerant side inlet and outlet of the evaporator is larger, the outlet temperature of the evaporator on the refrigerant side is influenced by the temperature difference, and the proper range of the superheat degree under different working conditions has larger difference. Through practical operation tests, under a low-temperature working condition, the proper superheat degree control range is approximately 5-15 ℃, and under a high-temperature working condition, the proper superheat degree upper limit can exceed 40 ℃, and different secondary refrigerant temperature control values correspond to different reasonable upper and lower limits of superheat degree. The electronic expansion valve controllers in the current market all use constant range superheat degree control on the control algorithm of the electronic expansion valve, namely, fixed upper and lower limits of superheat degree are set, and when the actual superheat degree exceeds the set range, the opening degree of the electronic expansion valve is adjusted in a stepped mode, so that the superheat degree is maintained in a proper range. Because the upper limit of the superheat degree needs to be correspondingly improved during high-temperature operation, the control scheme cannot meet the requirements of the semiconductor temperature control device.
In the control method of the temperature control system provided in this embodiment, the semiconductor device temperature control system uses the control device of the temperature control system to control the opening of the main electronic expansion valve 5, so as to realize the real-time regulation of the superheat degree, according to the technical requirement that the superheat degree range needs to be adjusted. The control system adjusts the superheat limit value in real time according to the temperature of the secondary refrigerant by introducing the temperature of an inlet and an outlet of the secondary refrigerant side evaporator 6.
On the basis of the above embodiment, further, the currently used temperature control system for semiconductors mainly comprises two parts, wherein the first part is to adjust the refrigeration system, and a set of PID algorithm is used to control a plurality of components in the refrigeration system, such as a compressor, a main circuit electronic expansion valve and a hot gas bypass electronic expansion valve, so that the real-time outlet temperature of the secondary refrigerant side evaporator is consistent with the preset outlet temperature; the second part is to regulate the secondary refrigerant circulating system and use PID to control the output of the heater to make the temperature at the outlet of the temperature control device reach the set value. The specific control logic is as follows: the control scheme uses a PID algorithm and superheat correction under a low-temperature working condition. The specific control concept is as follows: reading a temperature set value of the secondary refrigerant, namely a preset target temperature SV0 and a real-time target temperature PV0, collecting a calculated superheat degree value under a low-temperature working condition, namely when an actual temperature control value of the secondary refrigerant is lower than a set value m, controlling the openness of each electronic expansion valve in the refrigeration system by utilizing a PID algorithm according to a preset outlet temperature target value SV and a real-time outlet temperature PV of an evaporator at the side of the secondary refrigerant and cooperating with superheat degree control to cooperatively adjust the openness of the two electronic expansion valves; when the temperature of the secondary refrigerant is higher than the set value m, the superheat degree is not calculated, and the opening values of the main circuit and the thermal bypass electronic expansion valve are controlled only by using a PID algorithm. And acquiring the real-time target temperature of the temperature control device, and controlling the output of the heater by using a PID algorithm.
In this control mode, the electronic expansion valve control scheme currently has the following disadvantages: firstly, the PID algorithm is used, the debugging workload of PID parameters needs to be increased, and the improper PID parameters can easily cause the oscillation of the temperature of the circulating liquid. And different circulating liquid operating temperatures, PID parameters need to be adjusted correspondingly, namely the operating temperatures need to be divided into a plurality of temperature intervals, and the PID parameters are adjusted respectively. Secondly, because a set of PID parameters are used, one PID output quantity simultaneously controls the main circuit and the hot bypass electronic expansion valve, the main circuit and the hot bypass are in the same circulating system, and output changes thereof are mutually influenced. The upper and lower limits of the opening of the main circuit and the thermal bypass electronic expansion valve need to be set in different temperature intervals, so that the changes of the two expansion valves are matched. The adjustment of the upper and lower limit values of the electronic expansion valve in different temperature ranges also causes the debugging workload and difficulty to be greatly increased. Secondly, the temperature m of the opening of superheat degree control logic is different from the reasonable m values of systems with different configurations, and personnel are required to independently debug and set; and finally, under the working condition that the superheat degree is higher than the m value, the opening degree of the electronic expansion valve is controlled only by PID (proportion integration differentiation), and the evaporator is likely to be overflowed in a short time at the stage of rapid rise of the load.
The embodiment provides a superheat degree control algorithm of an electronic expansion valve, provides a reasonable superheat degree limit value of a refrigeration system which continuously changes in the whole operation temperature, can meet the requirement that the superheat degree control and step algorithm can be used under high and low temperature working conditions, and ensures that the refrigeration system is under reasonable working conditions. The superheat degree algorithm provided by the embodiment is suitable for the temperature control device shown in the attached figure 1. The temperature control device is mainly divided into two parts, namely a refrigerant circulating system and a secondary refrigerant circulating system. The refrigerant circulating system comprises a circulation formed by a compressor 1, a condenser 2, a drying filter 3, a liquid sight glass 4, a main circuit electronic expansion valve 5, an evaporator 6, an evaporator outlet suction temperature sensor 7, a low-pressure sensor 8 and a thermal bypass electronic expansion valve 16; the coolant circulation system includes an evaporator 6, an outlet temperature sensor 9, a water tank 10, a heater 11, a circulation pump 12, a target temperature sensor 13, an external load unit 14, and an inlet temperature sensor 15.
The present embodiment collects the measured value P1 of the refrigerant side evaporator outlet pressure sensor 8 and calculates the corresponding evaporation temperature TeThe measured value T of the refrigerant side evaporator outlet suction temperature sensor 7 is sucked, the measured value T of the brine side evaporator outlet temperature sensor 9 is discharged, and the measured value T of the brine side evaporator inlet temperature sensor 15 is inputted. The main control idea is based on the following: firstly, under the normal operating condition, the heat exchange allowance of the evaporator is large, andthe unloading of the thermal bypass valve enables the heat exchange temperature difference between the T absorption temperature value and the T inlet temperature value to be extremely small. The limit value of the superheat degree can be adjusted through the change of T, and the reasonable limit value of the superheat degree can be adjusted under different working conditions; in addition, the evaporation temperature TeIn the process of increasing along with the increase of the set temperature of the circulating liquid, the refrigerating output is gradually reduced due to the increase of the unloading of the heat bypass, the refrigerating output is kept horizontal to the heat loss of other components of the temperature control device, and the refrigerating output has a lower limit value. I.e. the evaporation temperature TeAfter reaching a certain upper limit, the temperature does not continue to increase along with the set temperature of the circulating liquid. For the upper and lower limits of superheat, reasonable values can be calculated by the following method:
SH0 = Tinto-min(T，m)+a-c×(TInto-TGo out)；
SH1 = TInto-min(T，m)+b；
Wherein SH0 is the upper limit value of superheat degree; SH1 is the lower limit value of superheat degree; t is a preset target temperature; t isIntoIs the evaporator inlet temperature in the coolant system; t isGo outIs the evaporator outlet temperature in the coolant system; m, a, b and c are constants.
The upper and lower limits of the degree of superheat are obtained by the above calculation method, and the opening degree of the main-path electronic expansion valve 5 is adjusted in a stepwise manner according to the variation relationship between the actual degree of superheat SH and SH0, SH 1. The control of the electronic expansion valve of the main circuit can be realized.
Based on the control method of the main-circuit electronic expansion valve, the overall control flow chart of the temperature control device is shown in fig. 2, and the specific control logic is as follows: firstly, the unloading capacity of the thermal bypass electronic expansion valve 16 is controlled, the output change of refrigerating capacity is adjusted, the heat load in the temperature control device is flat and horizontal, and the temperature control is kept stable. Because the heat bypass and the heater are arranged in two circulating systems, the output change is relatively independent, the adjustment of the refrigerating output and the heater output from the maximum value to 0 can be realized by using the same set of PID, and the mutual interference can not be generated. On the basis of the control, according to the superheat degree limit value calculation method provided above, a control method of superheat degree control and stepped correction is used to adjust the opening degree of the main electronic expansion valve 5 within a reasonable range, so as to ensure that the refrigeration system is in a proper operating condition.
The control method of the temperature control device provided by the embodiment is shown in the formula, and the real-time inlet temperature T of the secondary refrigerant side evaporator is determined according to the real-time inlet temperature TIntoReal time outlet temperature TGo outAnd the temperature control set value of the secondary refrigerant, namely the preset target temperature T, and the real-time upper limit value and the real-time lower limit value of the superheat degree are obtained by utilizing the calculation formula provided above. As shown in fig. 2, the opening of the main electronic expansion valve is adjusted according to the real-time upper and lower limits of superheat degree, and the output ratio of the hot bypass electronic expansion valve and the heater is controlled by using the same set of PID, so as to complete the temperature control of the temperature control device.
The system provided by the embodiment has simple control logic, and the temperature control device only uses one set of PID according to the provided control scheme, so that the control logic is simple. The main electronic expansion valve uses superheat degree control and step correction, and the difficulty of the step adjustment quantity parameter setting process is greatly reduced compared with PID parameter setting. The debugging workload is small, and the main-path electronic expansion valve parameter setting is little influenced by the temperature of the circulating liquid, so that a plurality of temperature intervals do not need to be divided for sectional setting. Because the two parts of the heater and the thermal bypass electronic expansion valve are relatively independent, when the same PID algorithm is used, the independent debugging of the upper limit and the lower limit of the opening degree of the expansion valve in different temperature intervals is still not needed. The system has reliable operation and high safety, and the algorithm provided by the embodiment can keep reasonable control of the superheat degree in all operating temperatures, thereby preventing the problems of compressor exhaust temperature protection or compressor oil carbonization and the like caused by overhigh superheat degree. In addition, the electronic expansion valve is controlled by 'superheat degree control + step correction', and the control effect is reliable.
The present embodiment provides another structure of a temperature control system for a semiconductor. The temperature control system of fig. 3, compared to the configuration of fig. 1, has no heater element in its circulation system. At the moment, a PID algorithm is used, the temperature of the outlet of the temperature control device, namely the real-time target temperature, is taken as an input value, the opening of the thermal bypass electronic expansion valve is controlled, the output of the refrigerating output and the heat load balance in the circulating system are adjusted, and the temperature of the outlet of the temperature control device is kept stable. The main electronic expansion valve of the refrigeration system still adopts the superheat degree calculation method provided by the embodiment, and the opening degree of the electronic expansion valve is adjusted in a stepped manner, so that the opening degree of the main electronic expansion valve is consistent with the working condition of the circulating liquid.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (8)

1. A temperature control system for a semiconductor, comprising: the refrigerating system comprises a first side of an evaporator, a compressor, a condenser and a main circuit electronic expansion valve which are sequentially connected in series to form a loop, the secondary refrigerant system comprises a second side of the evaporator, a heating assembly and a circulating pump which are sequentially connected in series to form the loop, and a pipeline between an outlet of the circulating pump and the second side of the evaporator is used for flowing through a load component;
a target temperature sensor is arranged at an outlet of the circulating pump, an inlet temperature sensor is arranged at an inlet of the second side of the evaporator, an outlet temperature sensor is arranged at an outlet of the second side of the evaporator, and a pressure sensor and an air suction temperature sensor are arranged at an outlet of the first side of the evaporator;
the refrigerating system and the heating assembly are used for carrying out real-time adjustment according to the deviation of the real-time target temperature detected by the target temperature sensor and the preset target temperature; the refrigerating system is also used for carrying out real-time adjustment according to the real-time outlet temperature detected by the outlet temperature sensor, the real-time inlet temperature detected by the inlet temperature sensor, the real-time evaporation pressure detected by the pressure sensor and the real-time suction temperature detected by the suction temperature sensor;
the refrigerating system is also used for correcting, regulating and controlling according to the real-time superheat degree, so that the real-time superheat degree of the refrigerating system is in a preset superheat degree range;
the preset superheat range is specifically determined by the following formula:
SH0 = Tinto-min(T，m)+a-c×(TInto-TGo out)；
SH1 = TInto-min(T，m)+b；
Wherein SH0 is the upper limit value of superheat degree; SH1 is the lower limit value of superheat degree; t is a preset target temperature; t isIntoIs the evaporator inlet temperature in the coolant system; t isGo outIs the evaporator outlet temperature in the coolant system; m, a, b and c are constants.
2. The temperature control system for semiconductors according to claim 1, wherein a thermal bypass line is connected between an outlet line of the compressor and an inlet line of the first side of the evaporator, and the thermal bypass line is provided with a thermal bypass electronic expansion valve.
3. A method for controlling a temperature control system for a semiconductor, according to claim 1 or 2, comprising:
regulating and controlling the heating assembly and the refrigerating system according to the deviation of the real-time target temperature and the preset target temperature, so that the real-time target temperature is consistent with the preset target temperature;
meanwhile, the refrigeration system is regulated and controlled according to the real-time outlet temperature and the real-time inlet temperature in the secondary refrigerant system, and the real-time evaporation pressure and the real-time suction temperature in the refrigeration system;
the regulation and control of the refrigerating system according to the real-time outlet temperature and the real-time inlet temperature in the secondary refrigerant system, the real-time evaporation pressure and the real-time suction temperature in the refrigerating system specifically comprise the following steps:
acquiring a real-time superheat degree in the refrigeration system according to a real-time evaporation pressure and a real-time suction temperature in the refrigeration system;
the real-time superheat degree is in a preset superheat degree range through regulation and control of a refrigeration system;
the preset superheat range is specifically determined by the following formula:
SH0 = Tinto-min(T，m)+a-c×(TInto-TGo out)；
SH1 = TInto-min(T，m)+b；
Wherein SH0 is the upper limit value of superheat degree; SH1 is the lower limit value of superheat degree; t is a preset target temperature; t isIntoIs the evaporator inlet temperature in the coolant system; t isGo outIs the evaporator outlet temperature in the coolant system; m, a, b and c are constants.
4. The control method of the temperature control system for the semiconductor as claimed in claim 3, wherein the controlling the heating assembly and the refrigerating system according to the deviation between the real-time target temperature and the preset target temperature specifically comprises:
and regulating and controlling the heating capacity of the heating assembly and the refrigerating capacity of the refrigerating system by utilizing the PID control logic according to the deviation between the real-time outlet temperature and the preset outlet temperature.
5. The control method of the temperature control system for the semiconductor as claimed in claim 4, wherein the controlling of the refrigerating capacity of the refrigerating system specifically comprises:
and regulating and controlling the opening degree of the thermal bypass electronic expansion valve according to the deviation between the real-time outlet temperature and the preset outlet temperature.
6. The control method of the temperature control system for the semiconductor as claimed in claim 4, wherein the controlling the refrigerating system according to the real-time outlet temperature and the real-time inlet temperature in the secondary refrigerant system, the real-time evaporation pressure and the real-time suction temperature in the refrigerating system specifically comprises:
acquiring real-time evaporation temperature according to real-time evaporation pressure in a refrigeration system;
the real-time evaporation temperature is lower than the preset evaporation temperature by regulating and controlling the refrigeration system.
7. The control method of the temperature control system for the semiconductor as claimed in claim 3, wherein the controlling the refrigeration system so that the real-time multiple heat is within the preset superheat degree range includes:
the real-time superheat degree is in a preset superheat degree range by adjusting the opening degree of the main-path electronic expansion valve.
8. The method as claimed in claim 7, wherein the step of adjusting the opening of the electronic expansion valve of the main circuit so that the real-time superheat degree is within a preset superheat degree range comprises:
when the real-time superheat degree is higher than a preset superheat degree range, gradually increasing the opening degree of the main-path electronic expansion valve;
and when the real-time superheat degree is lower than the preset superheat degree range, gradually reducing the opening degree of the main-path electronic expansion valve.
CN202110093690.XA 2021-01-25 2021-01-25 Temperature control system for semiconductor and control method thereof Active CN112414001B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110093690.XA CN112414001B (en) 2021-01-25 2021-01-25 Temperature control system for semiconductor and control method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110093690.XA CN112414001B (en) 2021-01-25 2021-01-25 Temperature control system for semiconductor and control method thereof

Publications (2)

Publication Number Publication Date
CN112414001A CN112414001A (en) 2021-02-26
CN112414001B true CN112414001B (en) 2021-06-22

Family

ID=74783201

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110093690.XA Active CN112414001B (en) 2021-01-25 2021-01-25 Temperature control system for semiconductor and control method thereof

Country Status (1)

Country Link
CN (1) CN112414001B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115615025B (en) * 2022-12-01 2023-05-12 江苏拓米洛环境试验设备有限公司 Refrigerating system control method and device and power battery test equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
CN102954639B (en) * 2011-08-25 2015-03-25 上海微电子装备有限公司 Temperature control device and temperature control method thereof
CN110187726B (en) * 2019-05-17 2020-08-18 安徽京仪自动化装备技术有限公司 Temperature control algorithm for semiconductor temperature control device
CN209992873U (en) * 2019-05-17 2020-01-24 安徽京仪自动化装备技术有限公司 Semiconductor temperature control device test platform
CN211345908U (en) * 2019-07-29 2020-08-25 上海非众制冷设备有限公司 Air-cooled water chilling unit with adjustable water outlet temperature
CN211716757U (en) * 2019-10-24 2020-10-20 浙江国祥股份有限公司 Water-cooling integrated water chiller
CN210776340U (en) * 2019-12-18 2020-06-16 北京京仪自动化装备技术有限公司 Temperature control system for temperature control equipment for semiconductor production

Also Published As

Publication number Publication date
CN112414001A (en) 2021-02-26

Similar Documents

Publication Publication Date Title
CN112414000B (en) Temperature control system and control method thereof
KR101109730B1 (en) Chiller apparatus for semiconductor process and Method for controlling temperature in the same
KR101639174B1 (en) Air conditioner and method for operating the same
CN112856845A (en) Wide-temperature-range temperature control device and control method thereof
CN112414001B (en) Temperature control system for semiconductor and control method thereof
CN109341122B (en) Refrigerating system and control method
WO2021218436A1 (en) Control method for variable-frequency air conditioner
KR20090054597A (en) Chiller apparatus for semiconductor process equipment
CN112083742B (en) Temperature control device, integrated circuit manufacturing equipment and method
CN112611140A (en) Temperature control device and method
CN114396734B (en) Control method of temperature control system and temperature control system
CN112902484B (en) Temperature regulation and control system and temperature regulation and control method
CN113007926B (en) Refrigeration system and temperature control method
KR101501176B1 (en) Chiller device for seminconductor process
KR101501175B1 (en) Method for controlling temperature in chiller device
CN113446749B (en) Dual-temperature control system and control method and device thereof
CN216347147U (en) Carbon dioxide refrigeration system with maintenance unit
CN211146947U (en) Fluid temperature control system based on cascade type closed loop PID adjustment
CN109341126B (en) Refrigerating system and control method
CN110822750A (en) Fluid temperature control system and control method based on cascade closed-loop PID regulation
CN115289704B (en) Temperature control device and temperature control method
CN115289703B (en) Temperature control method
CN116754273B (en) Cold water unit reverse temperature working condition testing system and working condition unit control strategy
CN114593465B (en) Rapid temperature rise and fall air conditioning unit under low-temperature working condition and control method
CN212081426U (en) Air conditioner capable of accurately controlling air supply temperature

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: 100176 block a, 14 / F, courtyard 8, Liangshuihe 2nd Street, Daxing Economic and Technological Development Zone, Beijing

Applicant after: Beijing Jingyi automation equipment Technology Co.,Ltd.

Address before: 3 / F, block a, 14 / F, courtyard 8, Liangshuihe 2nd Street, Daxing Economic and Technological Development Zone, Beijing 100176

Applicant before: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant