CN112611140A - Temperature control device and method - Google Patents
Temperature control device and method Download PDFInfo
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- CN112611140A CN112611140A CN202011511750.7A CN202011511750A CN112611140A CN 112611140 A CN112611140 A CN 112611140A CN 202011511750 A CN202011511750 A CN 202011511750A CN 112611140 A CN112611140 A CN 112611140A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
- F24H1/18—Water-storage heaters
- F24H1/20—Water-storage heaters with immersed heating elements, e.g. electric elements or furnace tubes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/18—Arrangement or mounting of grates or heating means
- F24H9/1809—Arrangement or mounting of grates or heating means for water heaters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/20—Arrangement or mounting of control or safety devices
- F24H9/2007—Arrangement or mounting of control or safety devices for water heaters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/10—Efficient use of energy, e.g. using compressed air or pressurized fluid as energy carrier
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- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The invention provides a temperature control device and a method, wherein the temperature control device comprises a plant water circulation pipeline, a cooling circulation pipeline and a residual cold utilization circulation pipeline, the plant water circulation pipeline is connected with the cooling circulation pipeline, plant water of the plant water circulation pipeline cools coolant of the cooling circulation pipeline, and the residual cold utilization circulation pipeline is respectively connected with the plant water circulation pipeline and the cooling circulation pipeline and is used for utilizing redundant refrigerating capacity of the cooling circulation pipeline. The invention sets a plant water circulation pipeline, a cooling circulation pipeline and a residual cold utilization circulation pipeline, wherein the plant water circulation pipeline is connected with the cooling circulation pipeline, the plant water of the plant water circulation pipeline cools the coolant of the cooling circulation pipeline, and the residual cold utilization circulation pipeline is respectively connected with the plant water circulation pipeline and the cooling circulation pipeline and is used for utilizing the residual refrigerating capacity of the cooling circulation pipeline and carrying out heat exchange cooling with the plant water, thereby reducing the return water temperature of the plant water, improving the energy efficiency ratio, saving energy and reducing consumption.
Description
Technical Field
The invention relates to the technical field of semiconductor processing temperature control, in particular to a temperature control device and a temperature control method.
Background
In the etching process of semiconductor production, the attached temperature control equipment is required to provide an accurate working temperature for the etching temperature control cavity. In the actual production process, the device has two states of no-load and load, the two states both need the auxiliary temperature control equipment to provide stable and accurate ambient temperature for the etching temperature control cavity, and the load of the temperature control equipment is smaller when the device is no-load.
At present, most of refrigerating capacity is generally offset by adopting a hot gas bypass technology, so that the outlet temperature of the refrigerator in an unloaded state is consistent and stable with the outlet temperature of the refrigerator in a loaded state. The mode leads the energy consumption of the temperature control equipment in the no-load state and the load state to be basically consistent, and is not beneficial to energy conservation and consumption reduction.
Disclosure of Invention
The invention provides a temperature control device and a temperature control method, which are used for solving the defects that in the prior art, the energy consumption of a temperature control device in a load state is the same as that of a no-load state, and energy conservation and consumption reduction are not facilitated, and the energy efficiency ratio of the temperature control device in the no-load state is effectively improved.
The invention provides a temperature control device which comprises a plant water circulation pipeline, a cooling circulation pipeline and a residual cold utilization circulation pipeline, wherein the plant water circulation pipeline is connected with the cooling circulation pipeline, plant water of the plant water circulation pipeline cools a coolant of the cooling circulation pipeline, and the residual cold utilization circulation pipeline is respectively connected with the plant water circulation pipeline and the cooling circulation pipeline and is used for utilizing redundant refrigerating capacity of the cooling circulation pipeline.
According to the temperature control device provided by the invention, the plant water circulating pipeline comprises a first pipeline of a condenser and a first pipeline of a first evaporator along the flow direction of the plant water, the inlet of the first pipeline of the condenser is used for being connected with a plant water system, the outlet of the first pipeline of the condenser is connected with the inlet of the first pipeline of the first evaporator, and the outlet of the first pipeline of the first evaporator is connected with the plant water system.
According to the temperature control device provided by the invention, a first temperature sensor is arranged on a first connecting pipeline between the first pipeline of the first evaporator and the plant water system.
According to the temperature control device provided by the invention, the cooling circulation pipeline comprises a second pipeline of the condenser and a first pipeline of a second evaporator which are circularly communicated, a second connecting pipeline between an inlet of the first pipeline of the second evaporator and an outlet of the second pipeline of the condenser is sequentially provided with a dry filter, a liquid viewing mirror and a first electronic expansion valve along the flowing direction of a refrigerant, and a third connecting pipeline between the outlet of the first pipeline of the second evaporator and the inlet of the second pipeline of the condenser is provided with a compressor.
According to the temperature control device provided by the invention, the residual cold utilization circulating pipeline comprises a second pipeline of the first evaporator, an inlet of the second pipeline of the first evaporator is communicated with the second connecting pipeline between the liquid sight glass and the first electronic expansion valve through a fourth connecting pipeline, and the fourth connecting pipeline is provided with a second electronic expansion valve;
and an outlet of the second pipeline of the first evaporator is communicated with the third connecting pipeline between the compressor and the first pipeline of the second evaporator through a fifth connecting pipeline, and the fifth connecting pipeline is provided with an evaporation pressure regulating valve.
According to the temperature control device provided by the invention, a sixth connecting pipeline used for being connected with the etching temperature control cavity is arranged at an inlet of a second pipeline of the second evaporator, and a second temperature sensor is arranged on the sixth connecting pipeline;
and a seventh connecting pipeline is arranged at the outlet of the second pipeline of the second evaporator, and a third temperature sensor is arranged on the seventh connecting pipeline.
According to the temperature control device provided by the invention, the seventh connecting pipeline is connected with the liquid return port of the water tank, and the liquid outlet of the water tank is provided with an eighth connecting pipe used for being connected with the etching temperature control cavity.
According to the temperature control device provided by the invention, the heater is arranged in the water tank.
According to the temperature control device provided by the invention, the eighth connecting pipeline is provided with the water pump and the fourth temperature sensor.
The invention also provides a temperature control method, which comprises the following steps:
judging the working state of the cooling circulation pipeline;
when the cooling circulation pipeline is in a load state, closing the residual cold utilization circulation pipeline, and performing heat exchange operation on the plant water circulation pipeline and the cooling circulation pipeline;
and when the cooling circulation pipeline is in an idle state, the residual cold utilization circulation pipeline is opened, and the redundant cold energy of the cooling circulation pipeline exchanges heat with the plant service water of the plant service water circulation pipeline, so that the return water temperature of the plant service water is reduced.
The invention provides a temperature control device and a temperature control method, wherein a plant water circulation pipeline, a cooling circulation pipeline and a residual cold utilization circulation pipeline are arranged, the plant water circulation pipeline is connected with the cooling circulation pipeline, plant water of the plant water circulation pipeline cools coolant of the cooling circulation pipeline, and the residual cold utilization circulation pipeline is respectively connected with the plant water circulation pipeline and the cooling circulation pipeline and is used for utilizing redundant refrigerating capacity of the cooling circulation pipeline and performing heat exchange cooling with the plant water, so that the return water temperature of the plant water is reduced, the energy efficiency ratio is improved, and energy is saved and consumption is reduced.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic view of a process structure of a micro-control device provided by the present invention.
Reference numerals:
1. a compressor; 2. a condenser; 3. drying the filter; 4. a liquid viewing mirror; 5. a first temperature sensor; 6. a first evaporator; 7. a second electronic expansion valve; 8. a first electronic expansion valve; 9. a third temperature sensor; 10. a water pump; 11. a fourth temperature sensor; 12. a second temperature sensor; 13. a water tank; 14. a second evaporator; 15. the evaporation pressure regulating valve.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The temperature control device according to the present invention is described with reference to fig. 1, and includes a plant water circulation pipeline, a cooling circulation pipeline, and a residual cold utilization circulation pipeline, wherein the plant water circulation pipeline is connected to the cooling circulation pipeline, the plant water of the plant water circulation pipeline cools the coolant of the cooling circulation pipeline, and the residual cold utilization circulation pipeline is respectively connected to the plant water circulation pipeline and the cooling circulation pipeline, and is configured to utilize excess cooling capacity of the cooling circulation pipeline. It can be understood that the plant water circulation pipeline is used for conveying low-temperature plant water, and endothermic cooling is carried out on the coolant in the cooling circulation pipeline. The residual cold utilization circulating pipeline is used for exchanging heat between the refrigerant in the residual cold utilization circulating pipeline and the plant water when the corrosion process is suspended immediately during no-load, so that the plant water is cooled, the return water temperature of the plant water is reduced, the requirement of the client on the plant water cooling capacity is reduced, the energy efficiency ratio is improved, and energy conservation and consumption reduction are realized.
According to the temperature control device provided by the invention, the plant water circulating pipeline comprises a first pipeline of a condenser 2 and a first pipeline of a first evaporator 6 along the flow direction of the plant water, the inlet of the first pipeline of the condenser 2 is used for being connected with a plant water system, the outlet of the first pipeline of the condenser 2 is connected with the inlet of the first pipeline of the first evaporator 6, and the outlet of the first pipeline of the first evaporator 6 is connected with the plant water system.
According to the temperature control device provided by the invention, a first temperature sensor 5 is arranged on a first connecting pipeline between a first pipeline of the first evaporator 6 and the plant water system. It is understood that the first temperature sensor 5 is used to detect the return water temperature of the plant water.
According to the temperature control device provided by the invention, the cooling circulation pipeline comprises a second pipeline of the condenser 2 and a first pipeline of the second evaporator 14 which are circularly communicated, a second connecting pipeline between an inlet of the first pipeline of the second evaporator 14 and an outlet of the second pipeline of the condenser 2 is sequentially provided with the dry filter 3, the liquid viewing mirror 4 and the first electronic expansion valve 8 along the flowing direction of the refrigerant, and a third connecting pipeline between the outlet of the first pipeline of the second evaporator 14 and the inlet of the second pipeline of the condenser 2 is provided with the compressor 1. It can be understood that the first pipeline of the condenser 2 is used for conveying low-temperature plant water, and the second pipeline of the condenser 2 is used for conveying high-temperature refrigerant, so that the cooling of the refrigerant by the plant water is realized. The dry filter 3 filters impurities in the refrigerant, and the liquid scope 4 observes a state of the refrigerant in the second connection line. The first electronic expansion valve 8 regulates and controls the flow rate of the refrigerant in the second connecting pipe by adjusting the opening degree of the first electronic expansion valve. The compressor 1 provides a certain power for the flow of the refrigerant.
According to the temperature control device provided by the invention, the residual cold utilization circulation pipeline comprises a second pipeline of the first evaporator 6, an inlet of the second pipeline of the first evaporator 6 is communicated with the second connecting pipeline between the liquid sight glass 4 and the first electronic expansion valve 8 through a fourth connecting pipeline, and the fourth connecting pipeline is provided with a second electronic expansion valve 7;
the outlet of the second pipeline of the first evaporator 6 is communicated with the third connecting pipeline between the compressor 1 and the first pipeline of the second evaporator 14 through a fifth connecting pipeline, and the fifth connecting pipeline is provided with an evaporation pressure regulating valve 15. It can be understood that the second electronic expansion valve 7 is used to regulate the flow rate of the refrigerant in the first evaporator 6, and thus regulate the cooling effect of the first evaporator 6 on the plant water. The evaporation pressure regulating valve 15 is used to bring the first evaporator 6 to a stable evaporation pressure.
According to the temperature control device provided by the invention, a sixth connecting pipeline used for connecting with the etching temperature control cavity is arranged at the inlet of the second pipeline of the second evaporator 14, and the sixth connecting pipeline is provided with a second temperature sensor 12;
and a seventh connecting pipeline is arranged at the outlet of the second pipeline of the second evaporator 14, and a third temperature sensor 9 is arranged on the seventh connecting pipeline. It is to be understood that the second temperature sensor 12 is configured to detect the temperature of the coolant flowing into the second evaporator 14, and the third temperature sensor 9 is configured to detect the temperature of the coolant cooled by the coolant in the second evaporator 14.
According to the temperature control device provided by the invention, the seventh connecting pipeline is connected with the liquid return port of the water tank 13, and the liquid outlet of the water tank 13 is provided with an eighth connecting pipe used for being connected with the etching temperature control cavity. It can be understood that the water tank 13 is used for stabilizing and equalizing the flow and temperature, so as to deliver the coolant with uniform temperature to the etching temperature control cavity, thereby realizing the processing of the semiconductor.
According to the temperature control device provided by the invention, a heater is arranged in the water tank 13. It can be appreciated that the heater is configured to adjust the temperature of the coolant in the water tank 13 to achieve a temperature profile of the coolant in the water tank 13 that is compatible with the temperature of the etching process.
According to the temperature control device provided by the invention, the eighth connecting pipeline is provided with the water pump 10 and the fourth temperature sensor 11. It will be appreciated that the water pump 10 is used to power the flow of coolant within the tank 13. The fourth temperature sensor 11 is used for detecting the temperature of the coolant output from the water tank 13 and adjusting the temperature in cooperation with the heater. The operating state is judged to be no-load or load by the difference between the temperature value detected by the second temperature sensor 12 and the temperature value detected by the fourth temperature sensor 11.
The temperature control method provided by the present invention is described below, and the temperature control method described below and the temperature control device described above may be referred to correspondingly.
The invention also provides a temperature control method, which comprises the following steps:
judging the working state of the cooling circulation pipeline;
when the cooling circulation pipeline is in a load state, closing the residual cold utilization circulation pipeline, and performing heat exchange operation on the plant water circulation pipeline and the cooling circulation pipeline;
and when the cooling circulation pipeline is in an idle state, the residual cold utilization circulation pipeline is opened, and the redundant cold energy of the cooling circulation pipeline exchanges heat with the plant service water of the plant service water circulation pipeline, so that the return water temperature of the plant service water is reduced.
The temperature control method provided by the invention specifically comprises the following steps:
before the semiconductor etching process starts, the initial stable running state of the temperature control device is an idle load state, the temperature values detected by the fourth temperature sensor 11 and the second temperature sensor 12 are read, and the difference value between the two temperature values is set as T;
after the semiconductor etching process is started, if the difference value between the temperature value detected by the fourth temperature sensor 11 and the temperature value detected by the second temperature sensor 12 is greater than T, judging that the temperature control device is in a load state;
the second electronic expansion valve 7 is closed, the first electronic expansion valve 8 is opened, and the opening degree of the first electronic valve is adjusted in real time according to the temperature value detected by the third temperature sensor 9, at the moment, the plant service water exchanges heat with the refrigerant flowing through the second evaporator 14 through the condenser 2, the plant service water absorbs heat, the refrigerant exchanges heat with the secondary refrigerant through the second evaporator 14 after being cooled, and the secondary refrigerant is cooled by the refrigerant;
adjusting the working state of a heater in a water tank 13 (the water tank 13 plays a role in stabilizing flow and equalizing temperature) according to the temperature value detected by the fourth temperature sensor 11, so that the temperature value detected by the fourth temperature sensor 11 meets the temperature value requirement required by the etching temperature control cavity;
if the difference value between the temperature value detected by the fourth temperature sensor 11 and the temperature value detected by the second temperature sensor 12 is equal to T, judging that the temperature control device is in an idle state;
simultaneously opening a second electronic expansion valve 7 and a first electronic expansion valve 8, and adjusting the opening degree of the first electronic valve in real time according to the temperature value detected by a third temperature sensor 9, wherein the target value of the first temperature sensor 5 is set to 10 ℃ because the medium to be cooled in the first evaporator 6 is plant water, and the opening degree of the second electronic expansion valve 7 is judged by comparing the temperature value actually detected by the first temperature sensor 5 with the target value;
at this time, after the refrigerant cooled by the plant water in the condenser 2 flows back to the second evaporator 14, heat exchange is performed with the coolant, and since the coolant does not participate in the process, the degree of heat exchange in the second evaporator 14 is lower than that in the load, that is, the temperature of the refrigerant flowing out of the second evaporator 14 in the idle state is lower than that in the load state;
a part of low-temperature refrigerant, namely redundant refrigerating capacity, is conveyed into the first evaporator 6 and exchanges heat with the plant water flowing out of the condenser 2 to cool the plant water, and the cooled plant water flows back to the plant water system, so that the return water temperature of the plant water is reduced, the requirement of the client plant water cooling capacity is reduced, the energy efficiency ratio is improved, and energy conservation and consumption reduction are realized.
The invention provides a temperature control device and a temperature control method, wherein a plant water circulation pipeline, a cooling circulation pipeline and a residual cold utilization circulation pipeline are arranged, the plant water circulation pipeline is connected with the cooling circulation pipeline, plant water of the plant water circulation pipeline cools coolant of the cooling circulation pipeline, and the residual cold utilization circulation pipeline is respectively connected with the plant water circulation pipeline and the cooling circulation pipeline and is used for utilizing redundant refrigerating capacity of the cooling circulation pipeline and performing heat exchange cooling with the plant water, so that the return water temperature of the plant water is reduced, the energy efficiency ratio is improved, and energy is saved and consumption is reduced.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
The above embodiments are merely illustrative of the present invention and are not to be construed as limiting the invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications or equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and the technical solution of the present invention is covered by the claims of the present invention.
Claims (10)
1. The utility model provides a temperature control device, its characterized in that, utilizes circulating line including the water circulation pipeline of factory affairs, cooling cycle pipeline and residual cold, the water circulation pipeline of factory affairs with cooling cycle tube coupling, the water of factory affairs of water circulation pipeline of factory affairs is right cooling cycle pipeline's coolant cools off, residual cold utilize circulating line respectively with the water circulation pipeline of factory affairs with cooling cycle tube coupling is used for right cooling cycle pipeline's unnecessary refrigeration capacity utilizes.
2. The temperature control device according to claim 1, wherein the plant water circulation pipeline comprises a first pipeline of a condenser and a first pipeline of a first evaporator in a flow direction of the plant water, an inlet of the first pipeline of the condenser is used for connecting with a plant water system, an outlet of the first pipeline of the condenser is connected with an inlet of the first pipeline of the first evaporator, and an outlet of the first pipeline of the first evaporator is connected with the plant water system.
3. The temperature control device according to claim 2, wherein a first temperature sensor is provided on a first connection pipe between the first pipe of the first evaporator and the plant water system.
4. The temperature control device according to claim 2, wherein the cooling circulation line includes a second line of the condenser and a first line of a second evaporator that are in circulation communication, a second connection line between an inlet of the first line of the second evaporator and an outlet of the second line of the condenser is provided with a dry filter, a sight glass, and a first electronic expansion valve in order along a flow direction of the refrigerant, and a third connection line between the outlet of the first line of the second evaporator and the inlet of the second line of the condenser is provided with a compressor.
5. The temperature control device according to claim 4, wherein the residual heat utilization circulation line includes a second line of the first evaporator, an inlet of the second line of the first evaporator is communicated with the second connection line between the liquid sight glass and the first electronic expansion valve through a fourth connection line, and the fourth connection line is provided with a second electronic expansion valve;
and an outlet of the second pipeline of the first evaporator is communicated with the third connecting pipeline between the compressor and the first pipeline of the second evaporator through a fifth connecting pipeline, and the fifth connecting pipeline is provided with an evaporation pressure regulating valve.
6. The temperature control device according to claim 4, wherein the inlet of the second pipeline of the second evaporator is provided with a sixth connecting pipeline for connecting with the etching temperature control chamber, and the sixth connecting pipeline is provided with a second temperature sensor;
and a seventh connecting pipeline is arranged at the outlet of the second pipeline of the second evaporator, and a third temperature sensor is arranged on the seventh connecting pipeline.
7. The temperature control device according to claim 6, wherein the seventh connecting pipeline is connected with a liquid return port of a water tank, and an eighth connecting pipeline for connecting with the etching temperature control chamber is arranged at a liquid outlet of the water tank.
8. The temperature control device of claim 7, wherein a heater is provided in the water tank.
9. The temperature control device according to claim 7, wherein the eighth connecting line is provided with a water pump and a fourth temperature sensor.
10. A temperature control method based on the temperature control device according to any one of claims 1 to 9, comprising the steps of:
judging the working state of the cooling circulation pipeline;
when the cooling circulation pipeline is in a load state, closing the residual cold utilization circulation pipeline, and performing heat exchange operation on the plant water circulation pipeline and the cooling circulation pipeline;
and when the cooling circulation pipeline is in an idle state, the residual cold utilization circulation pipeline is opened, and the redundant cold energy of the cooling circulation pipeline exchanges heat with the plant service water of the plant service water circulation pipeline, so that the return water temperature of the plant service water is reduced.
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| CN202011511750.7A CN112611140A (en) | 2020-12-18 | 2020-12-18 | Temperature control device and method |
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| CN202011511750.7A CN112611140A (en) | 2020-12-18 | 2020-12-18 | Temperature control device and method |
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Cited By (3)
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| CN106403333A (en) * | 2016-12-01 | 2017-02-15 | 无锡溥汇机械科技有限公司 | Energy-saving heat exchange system for refrigerator |
| CN113654256A (en) * | 2021-08-19 | 2021-11-16 | 合肥亦威科技有限公司 | Single-compressor dual-system precise temperature control system suitable for factory cooling water |
| CN114489175A (en) * | 2021-12-31 | 2022-05-13 | 北京京仪自动化装备技术股份有限公司 | Temperature control system |
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| CN103574954A (en) * | 2013-11-12 | 2014-02-12 | 无锡溥汇机械科技有限公司 | Energy feedback type heat exchange system |
| CN203642544U (en) * | 2013-11-12 | 2014-06-11 | 无锡溥汇机械科技有限公司 | Multi-temperature heat exchange system controlled by refrigerant of single compressor |
| CN106403333A (en) * | 2016-12-01 | 2017-02-15 | 无锡溥汇机械科技有限公司 | Energy-saving heat exchange system for refrigerator |
| CN207264217U (en) * | 2017-06-09 | 2018-04-20 | 北京京仪自动化装备技术有限公司 | Semiconductor production temperature control device |
| CN109032201A (en) * | 2017-06-09 | 2018-12-18 | 北京京仪自动化装备技术有限公司 | Semiconductor production temperature control device |
| CN111023606A (en) * | 2019-12-27 | 2020-04-17 | 无锡溥汇机械科技有限公司 | Large-flow small-temperature-difference precise temperature control heat exchange system |
| CN111538360A (en) * | 2020-07-07 | 2020-08-14 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106403333A (en) * | 2016-12-01 | 2017-02-15 | 无锡溥汇机械科技有限公司 | Energy-saving heat exchange system for refrigerator |
| CN113654256A (en) * | 2021-08-19 | 2021-11-16 | 合肥亦威科技有限公司 | Single-compressor dual-system precise temperature control system suitable for factory cooling water |
| CN114489175A (en) * | 2021-12-31 | 2022-05-13 | 北京京仪自动化装备技术股份有限公司 | Temperature control system |
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