CN213519874U - Semiconductor temperature control device using deionized water as circulating medium - Google Patents
Semiconductor temperature control device using deionized water as circulating medium Download PDFInfo
- Publication number
- CN213519874U CN213519874U CN202022303418.3U CN202022303418U CN213519874U CN 213519874 U CN213519874 U CN 213519874U CN 202022303418 U CN202022303418 U CN 202022303418U CN 213519874 U CN213519874 U CN 213519874U
- Authority
- CN
- China
- Prior art keywords
- temperature control
- temperature
- loop
- deionized water
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Control Of Temperature (AREA)
Abstract
The utility model provides a semiconductor temperature control device taking deionized water as a circulating medium, which comprises at least one semiconductor temperature control module which is mutually independent, wherein the semiconductor temperature control module comprises a refrigeration main loop, a cooling liquid circulating loop and a control unit; the refrigeration main loop comprises a compressor, a condenser, a drying filter, a liquid viewing mirror, a first electronic expansion valve, an evaporator and a gas-liquid separator which are connected in sequence; the cooling liquid circulation loop comprises a circulation liquid tank loaded with deionized water, a circulation pump, a resistance instrument sensor, a deionized water filtering device and a one-way valve which are sequentially connected; the control unit comprises a programmable logic controller, a relay, a plurality of circuit breakers and contactors. The semiconductor temperature control device can adopt a plurality of same semiconductor temperature control modules to be matched for use so as to realize the independent control of the temperature of each link in the semiconductor processing process, meet the requirement of the temperature of the process chamber of the main equipment, and has low energy consumption in operation.
Description
Technical Field
The utility model belongs to the technical field of semiconductor temperature control device, in particular to use semiconductor temperature control device of deionized water as circulating medium.
Background
The semiconductor temperature control device is used as an auxiliary device for producing semiconductors, different temperatures need to be output in the manufacturing process of wafers and liquid crystal panels, and a certain cooling capacity needs to be controlled in the process of maintaining the temperatures so as to offset the heat load in the process (such as a semiconductor processing reaction chamber and a liquid crystal panel processing reaction chamber) and provide high-precision and stable outlet temperature of circulating liquid. In the existing wafer and panel production process, the number of channels for connecting the temperature control devices in the main equipment process cavity is large, and the problems of low control precision, high operation energy consumption and the like exist.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming prior art's weak point, providing a semiconductor temperature control device who uses the deionized water as the circulation medium, temperature control device complete machine design has the three routes passageway, three routes refrigerating system and circulation system, and the modularization system installation, control components and parts are rationally arranged in a box, satisfy the whole output of each passageway. The temperature control precision is high: +/-0.2-0.5 ℃, the temperature range is 15-80 ℃, the temperature range can meet different required temperature sections, the loading capacity is strong, and the energy consumption is low. The cascade control idea is adopted to effectively control the electronic expansion valve, the temperature control requirement of any occasion can be met, the fuzzy PID control is combined to accurately control the temperature, and finally the circulating liquid outlet outputs constant temperature to meet the requirement of the semiconductor production process on the temperature.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a pair of use semiconductor temperature control device of deionized water as circulation medium, a serial communication port, including at least one semiconductor temperature control module of mutual independence, semiconductor temperature control module includes:
the refrigeration main loop comprises a compressor, a condenser, a drying filter, a liquid sight glass, a first electronic expansion valve, an evaporator and a gas-liquid separator which are connected in sequence; a first temperature sensor and a second temperature sensor are respectively arranged on an inlet pipeline and an outlet pipeline of the compressor; a first pressure sensor is arranged on a connecting pipeline between the evaporator and the inlet of the gas-liquid separator; a protection branch consisting of a first pressure display instrument, a compressor high-low pressure protection device and a second pressure display instrument which are sequentially connected in series is connected in parallel on the outlet of the compressor and the inlet pipeline of the gas-liquid separator; the first electronic expansion valve is connected with a pipeline connected with the evaporator and the inlet of the compressor through a pipeline provided with a second electronic expansion valve to serve as a hot by-pass passage, and the liquid sight glass is connected with the inlet of the gas-liquid separator through a pipeline provided with a third electronic expansion valve to serve as a cold by-pass passage; the condenser is connected with the inlet and the outlet of the plant cooling water;
the cooling liquid circulation loop comprises a circulation liquid tank loaded with deionized water, a circulation pump, a resistance instrument sensor, a deionized water filtering device and a one-way valve which are sequentially connected; a load is connected in parallel to two ends of the deionized water filtering device and the one-way valve; a third temperature sensor is arranged on a connecting pipeline between the outlet at the hot side of the evaporator and the inlet of the circulating liquid tank; a flow sensor, a fourth temperature sensor and a second pressure sensor are sequentially arranged on a connecting pipeline between the outlet of the circulating pump and the resistance instrument sensor; a fifth temperature sensor is arranged on a connecting pipeline between the one-way valve and the inlet at the hot side of the evaporator; the bottom of the circulating liquid tank is provided with a heater;
the control unit comprises a programmable logic controller, a relay, a plurality of circuit breakers and contactors; the first circuit breaker, the first contactor and the frequency converter of control compressor are connected and are formed a first loop, the second circuit breaker, the second contactor and the frequency converter of control circulating liquid pump are connected and are formed a second loop, the third circuit breaker, the third contactor and the relay form a third loop for controlling the heater, and the programmable logic controller is connected with the first loop, the second loop and the third loop respectively through power lines and utilizes PID control to enable the outlet temperature of the circulating pump to be kept stable.
The utility model discloses a characteristics and beneficial effect:
1. the circulating liquid medium of the circulating system in the temperature control device is deionized water.
Deionized water refers to pure water from which impurities in the form of ions are removed, and anions and cations through which the water passes are removed through resin. The deionized water has good insulating property, electrons in water are removed, and the deionized water is mainly used for PVD (Physical Vapor Deposition), CVD (chemical Vapor Deposition) and Track process technologies in the manufacturing process of wafers and panels, wherein the process has higher insulating requirement on a process cavity, and a DI water circulating pipeline of a semiconductor temperature control device is connected into the wafer and a panel main equipment production process cavity for temperature control accurate control, so that the process requirement is met;
2. the semiconductor temperature control device can adopt a plurality of same semiconductor temperature control modules for matching use, the temperature control device adopts a plurality of semiconductor temperature control modules to independently operate, and outputs a multipath deionized water circulating pipeline to be connected with the main equipment process cavity which consists of a plurality of chambers, the bottom of a wafer placed in each chamber is provided with a temperature control device pipeline for temperature control, so that the substrate temperature of semiconductor wafers such as silicon wafers is increased to a target temperature or decreased to the target temperature at a high speed, the manufacturing time of the semiconductor wafers is shortened, the temperature distribution precision in the surfaces of the semiconductor wafers is good and expected, the surfaces are uniform or the temperatures in the surfaces are different in each part, and the semiconductor wafers can be manufactured with high quality;
3. the semiconductor temperature control device has high temperature control precision which can reach +/-0.2 ℃, and the control load can reach 12 kW;
4. the temperature control range of the semiconductor temperature control device is 15-80 ℃, and the temperature control range is large, so that different requirements of the process temperature section are met;
5. the semiconductor temperature control device has the advantages that the output energy consumption is low and the energy is saved while the normal operation meets the target temperature; specifically, the compressor and the circulating pump are controlled to output at low frequency under the condition of meeting the working condition through frequency conversion, the heating quantity of the heater is controlled by adopting PID (proportion integration differentiation), and the heating quantity is output according to the change of the target temperature, so that the aim of reducing the energy consumption is fulfilled;
6. the semiconductor special temperature control device meets the high-precision output of temperature, flow and pressure through programmable logic control PLC and PID control; the HMI human-computer interface is visually displayed and controlled, so that the temperature of a circulating liquid inlet of the temperature control equipment is accurately controlled to meet working conditions of different temperatures;
7. two-stage control based on PID, control accuracy is high, and the noise is little, and control is nimble, and response speed is fast, uses the longevity.
Drawings
Fig. 1 is a schematic view of an overall structure of a semiconductor temperature control device using deionized water as a circulating medium according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a control unit in a semiconductor temperature control device according to an embodiment of the present invention.
Fig. 3 is the temperature curve measured by the temperature sensor TS1 during no-load and on-load operation of the semiconductor temperature control device (the on-load power is 2.5kW, 5kW and 7.5kW, respectively, and the control accuracy is within ± 0.2 ℃).
Fig. 4 is the temperature curve measured by the temperature sensor TS2 during no-load and on-load operation of the semiconductor temperature control device (the on-load power is 2.5kW, 5kW and 7.5kW, respectively, and the control accuracy is within ± 0.2 ℃).
Fig. 5 is a flow curve measured by the flow sensor FS1, a pressure curve measured by the pressure sensor P1, an opening curve of the expansion valves EEV1, EEV2, and EEV3, and a temperature curve of the heater HT1 of the semiconductor temperature control device according to the embodiment of the present invention during operation.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
In order to better understand the present invention, the following detailed description provides an application example of a semiconductor temperature control device using deionized water as a circulating medium.
The semiconductor temperature control device using deionized water as a circulating medium in the embodiment comprises at least one semiconductor temperature control module which is mutually independent, and the temperature of each link in the semiconductor processing process can be independently controlled through the cooperation of a plurality of semiconductor temperature control modules (in the embodiment, three semiconductor temperature control modules with the same structure are included). The structures of the semiconductor temperature control modules are the same, and now, a description is given by taking one of the semiconductor temperature control modules as an example, with reference to fig. 1, the semiconductor temperature control module includes:
the refrigeration main loop comprises a compressor COMP1, a condenser CON1, a drying filter DR1, a liquid viewing mirror SG1, an electronic expansion valve EEV1, an evaporator EVA1 and a gas-liquid separator ACU1 which are sequentially connected; a temperature sensor TS4 and a temperature sensor TS5 are respectively arranged on an inlet pipeline and an outlet pipeline of the compressor COMP1 and are used for measuring the temperature of an inlet and an outlet of the compressor COMP 1; a pressure sensor PS1 is arranged on a connecting pipeline between the evaporator EVA1 and the inlet of the gas-liquid separator ACU1 and is used for measuring the suction pressure at the outlet of the evaporator EVA 1; a protection branch consisting of a pressure display instrument P2, a compressor high-low pressure protection device PSW1 and a pressure display instrument P3 which are sequentially connected in series is connected in parallel with an outlet of the compressor COMP1 and an inlet pipeline of the gas-liquid separator ACU1, so that damage to a system pipeline caused by overhigh/low pressure in the system operation is prevented, and the system pressure is ensured to operate within a certain range; the electronic expansion valve EEV1 is connected with a pipeline connected with inlets of an evaporator EVA1 and a compressor COMP1 through a pipeline provided with the electronic expansion valve EEV2 to serve as a hot bypass, and the electronic expansion valve EEV3 is connected between the liquid sight glass SG1 and an inlet of a gas-liquid separator ACU1 to serve as a cold bypass; the condenser CON1 is connected with a plant cooling water inlet PCW IN and a plant cooling water outlet PCW OUT;
the cooling liquid circulation loop comprises an evaporator EVA1, a circulation liquid TANK TANK1 loaded with deionized water, a circulation PUMP PUMP1, a resistance meter sensor R1, a deionized water filtering device FL1 and a one-way valve SF1 which are sequentially connected; load is connected in parallel at two ends of the deionized water filtering device FL1 and the check valve SF 1; a temperature sensor TS3 is arranged on a pipeline between the outlet of the hot side of the evaporator EVA1 and the inlet of the circulating liquid TANK TANK1 and is used for measuring the temperature of circulating liquid at the outlet of the hot side of the evaporator EVA 1; a flow sensor FS1, a temperature sensor TS1 and a pressure sensor P4 are sequentially arranged on a connecting pipeline between the outlet of the circulating PUMP PUMP1 and the resistance meter sensor R1 and are respectively used for measuring the flow rate, the temperature and the pressure of circulating liquid at the outlet of the circulating PUMP PUMP 1; a temperature sensor TS2 is arranged on a connecting pipeline between the check valve SF1 and the evaporator EVA1 and is used for measuring the temperature of circulating liquid at the hot side inlet of the evaporator EVA 1; a heater HT1 is arranged at the bottom of the circulating liquid TANK TANK 1; the deionized water filtering device FL1 is used for filtering charged ions in the deionized water in real time to ensure that the water resistance value of the deionized water is within a required range, thereby meeting the process requirements of main equipment;
and the control unit comprises a Programmable Logic Controller (PLC), a human-machine interface (HMI), a plurality of circuit breakers, contactors and relays. Referring to fig. 2, a first circuit breaker, a first contactor and a frequency converter INV2 for controlling a compressor are connected to form a first loop, a second circuit breaker, a second contactor and a frequency converter INV1 for controlling a circulating liquid PUMP are connected to form a second loop, a third circuit breaker, a third contactor and a relay form a third loop for controlling a heater HT1, a programmable logic controller PLC is respectively connected with the first loop, the second loop and the third loop through power lines and utilizes PID control to keep the outlet temperature of a circulating PUMP pamp 1 stable, and a man-machine interface HM1 is connected with the programmable logic controller PLC for displaying and operating a man-machine interface and storing data. Specifically, the programmable logic controller PLC outputs a first control value PID1 by comparing the inlet temperature of the circulating TANK1 (i.e., the temperature measured by the temperature sensor TS 3) with its target temperature TS3SV, and controls the opening degree of the electronic expansion valve EEV1 when the first control value PID1 outputs a value of 0 to 100, so that the opening degree of the electronic expansion valve EEV1 is increased, the cooling capacity is increased, the opening degree of the electronic expansion valve EEV1 is decreased, and the cooling capacity is decreased. Meanwhile, the inverter INV2 of the compressor is controlled to operate at 39HZ when the first control value PID1 outputs 0-50 values, and the inverter INV2 of the compressor is controlled to operate at 39-61HZ when the first control value PID1 outputs 50-100 values. By comparing the outlet temperature of the circulation PUMP1 (i.e., the temperature measured by the temperature sensor TS 1) with its target temperature TS1SV, a second control value PID2 is outputted, and the amount of heating of the heater HT1 is controlled by the second control value PID 2. By comparing the outlet flow of the circulation PUMP1 (i.e. the flow measured by the flow sensor FS 1) with its target flow FS1SV, a third control value PID3 is output, the third control value PID3 outputs values of 0-100, the inverter INV1 controlling the circulation PUMP operates at 30HZ when the output is a value of 0-50, and the inverter INV1 controlling the circulation PUMP operates at 30-50HZ when the output is a value of 50-100. Meanwhile, the opening degrees of the electronic expansion valves EEV3 and EEV2 in the system are set according to different target temperature sections (for example, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80 ℃ and the like can be set), the suction superheat degree of the compressor COMP1 is calculated through the measured values of the pressure sensor PS1 and the temperature sensor TS4, and the compressor COMP1 is protected from liquid accumulation.
The components of the semiconductor temperature control module are conventional products in the field.
The working principle of the semiconductor temperature control module is as follows:
when the semiconductor temperature control module is connected to load, the temperature measured by the temperature sensor TS2 is increased, the opening degree of the electronic expansion valve EEV1 is increased, the cooling capacity is increased, heat exchange is performed through the evaporator EVA1, the temperature of the temperature sensor TS3 is maintained in a certain temperature range, when the semiconductor temperature control module is in operation, the temperature is balanced and controlled through the heater HT1 (specifically, as described above, the temperature measured by the temperature sensor TS1 is compared with the target temperature TS1SV to output the first control value PID1, and the heating capacity of the heater HT1 is controlled by the first control value PID1 to balance the temperature), and finally, the temperature of the cold-side circulating liquid outlet of the evaporator EVA1 is kept at constant output. Thus, the substrate temperature of a semiconductor wafer such as a silicon wafer is raised to a target temperature or lowered to the target temperature at a high speed, the manufacturing time of the semiconductor wafer is shortened, the temperature distribution in the surface of the semiconductor wafer is accurately set to a desired temperature distribution, the temperature distribution in the surface is made uniform, or the temperature distribution in the surface is made different in each portion, and the semiconductor wafer can be manufactured with high quality. Specifically, the method comprises the following steps:
the semiconductor temperature control module can be simply divided into a refrigerating part and a circulating liquid part, wherein a compressor COMP1, a condenser CON1, an electronic expansion valve EEV1 and a condenser CON1 IN the refrigerating part are sequentially connected through pipelines to form a closed system, a refrigerant continuously circulates and flows IN the closed system, state change occurs, and heat exchange is carried OUT between the refrigerant and the outside through a plant cooling water inlet PCW IN and a plant cooling water outlet PCW OUT. In the circulating liquid part, a circulating PUMP PUMP1, a flow sensor FS1, a load, an evaporator EVA1 and a circulating liquid TANK TANK1 are sequentially connected by pipelines to form a closed system, and circulating liquid is uninterruptedly circulated in the closed system under the action of the circulating PUMP. The operation and the starting of the semiconductor temperature control module consist of two parts, one part is a compressor COMP1, and the other part is a circulating PUMP PUMP 1; after the circulation pump is started, the refrigerating capacity of the refrigerating part is controlled according to the change of each target temperature and the actually measured temperature, the flow of the circulation liquid part is controlled according to the change of the target flow and the actually measured flow, the heating capacity of the heater HT1 is controlled according to the change of the actually measured temperature and the target temperature of the outlet of the circulation pump, and finally the stable outlet temperature of the circulation liquid output is finished.
In order to verify the control effect of the semiconductor temperature control device of the present embodiment, at a target temperature of 40 ℃, the measured temperature curves and the target temperature curves of the temperature sensors TS1 and TS2 under the no-load and loaded temperature control device condition are respectively obtained, as shown in fig. 3 and 4 (in the figure, SV represents the target temperature curve and PV represents the measured temperature curve), and the flow rate (measured by FS 1), pressure (measured by the pressure sensor P1), opening degree curves of the expansion valves EEV1, EEV2 and EEV3, and the temperature curve of the heater HT1 are obtained, as shown in fig. 5. As can be seen from fig. 3 to 5, when the temperature control device operates at a set temperature of 40 degrees, the no-load and on-load operation accuracy can reach within ± 0.2 ℃.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (1)
1. A semiconductor temperature control device using deionized water as a circulating medium is characterized by comprising at least one semiconductor temperature control module which is independent from each other, wherein the semiconductor temperature control module comprises:
the refrigeration main loop comprises a compressor, a condenser, a drying filter, a liquid sight glass, a first electronic expansion valve, an evaporator and a gas-liquid separator which are connected in sequence; a first temperature sensor and a second temperature sensor are respectively arranged on an inlet pipeline and an outlet pipeline of the compressor; a first pressure sensor is arranged on a connecting pipeline between the evaporator and the inlet of the gas-liquid separator; a protection branch consisting of a first pressure display instrument, a compressor high-low pressure protection device and a second pressure display instrument which are sequentially connected in series is connected in parallel on the outlet of the compressor and the inlet pipeline of the gas-liquid separator; the first electronic expansion valve is connected with a pipeline connected with the evaporator and the inlet of the compressor through a pipeline provided with a second electronic expansion valve to serve as a hot by-pass passage, and the liquid sight glass is connected with the inlet of the gas-liquid separator through a pipeline provided with a third electronic expansion valve to serve as a cold by-pass passage; the condenser is connected with the inlet and the outlet of the plant cooling water;
the cooling liquid circulation loop comprises a circulation liquid tank loaded with deionized water, a circulation pump, a resistance instrument sensor, a deionized water filtering device and a one-way valve which are sequentially connected; a load is connected in parallel to two ends of the deionized water filtering device and the one-way valve; a third temperature sensor is arranged on a connecting pipeline between the outlet at the hot side of the evaporator and the inlet of the circulating liquid tank; a flow sensor, a fourth temperature sensor and a second pressure sensor are sequentially arranged on a connecting pipeline between the outlet of the circulating pump and the resistance instrument sensor; a fifth temperature sensor is arranged on a connecting pipeline between the one-way valve and the inlet at the hot side of the evaporator; the bottom of the circulating liquid tank is provided with a heater;
the control unit comprises a programmable logic controller, a relay, a plurality of circuit breakers and contactors; the first circuit breaker, the first contactor and the frequency converter of control compressor are connected and are formed a first loop, the second circuit breaker, the second contactor and the frequency converter of control circulating liquid pump are connected and are formed a second loop, the third circuit breaker, the third contactor and the relay form a third loop for controlling the heater, and the programmable logic controller is connected with the first loop, the second loop and the third loop respectively through power lines and utilizes PID control to enable the outlet temperature of the circulating pump to be kept stable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022303418.3U CN213519874U (en) | 2020-10-16 | 2020-10-16 | Semiconductor temperature control device using deionized water as circulating medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022303418.3U CN213519874U (en) | 2020-10-16 | 2020-10-16 | Semiconductor temperature control device using deionized water as circulating medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213519874U true CN213519874U (en) | 2021-06-22 |
Family
ID=76397885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022303418.3U Active CN213519874U (en) | 2020-10-16 | 2020-10-16 | Semiconductor temperature control device using deionized water as circulating medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213519874U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113666455A (en) * | 2021-08-19 | 2021-11-19 | 合肥亦威科技有限公司 | Pure water generation system for semiconductor temperature control system |
| CN115307229A (en) * | 2022-08-05 | 2022-11-08 | 西安稳能微电子科技有限公司 | Energy-saving constant temperature and humidity equipment and method suitable for semiconductor production process |
-
2020
- 2020-10-16 CN CN202022303418.3U patent/CN213519874U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113666455A (en) * | 2021-08-19 | 2021-11-19 | 合肥亦威科技有限公司 | Pure water generation system for semiconductor temperature control system |
| CN115307229A (en) * | 2022-08-05 | 2022-11-08 | 西安稳能微电子科技有限公司 | Energy-saving constant temperature and humidity equipment and method suitable for semiconductor production process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213519874U (en) | Semiconductor temperature control device using deionized water as circulating medium | |
| CN109032201B (en) | Temperature control equipment for semiconductor production | |
| CN112414000B (en) | Temperature control system and control method thereof | |
| CN112379704B (en) | Temperature control system for semiconductor production | |
| CN112306116B (en) | Semiconductor temperature control system | |
| CN112416029B (en) | Temperature control system and temperature control method for semiconductor production | |
| CN101311867A (en) | Constant temperature keeping device | |
| CN102954639B (en) | Temperature control device and temperature control method thereof | |
| CN112797656B (en) | Extremely high and extremely low temperature control system | |
| KR20180051423A (en) | Method of controlling circulated liquid temperature using parameter control system chiller for each area by remote control and maintenance method | |
| CN113446749B (en) | Dual-temperature control system and control method and device thereof | |
| CN103868300A (en) | Method for controlling energy-saving and constant-temperature water-cooling machine of dual-refrigeration control system | |
| CN114396734A (en) | Control method of temperature control system and temperature control system | |
| CN113007926B (en) | Refrigeration system and temperature control method | |
| CN110220322B (en) | Ultra-low temperature precise temperature control heat exchange system | |
| CN112594980A (en) | Refrigerating system and temperature control system | |
| CN217642121U (en) | Wide accuse temperature vehicle laser ware temperature control device of self-adaptation operation | |
| US7044213B2 (en) | Constant temperature refrigeration system for extensive temperature range application and control method thereof | |
| TW201022602A (en) | Temperature control of inverter refrigeration apparatus | |
| CN216385872U (en) | Circulating liquid tank liquid level detection structure of low-temperature semiconductor temperature control device | |
| CN115289705A (en) | Temperature control system and temperature control method | |
| CN114183884B (en) | Double-module refrigerating system, air conditioner and control method of air conditioner | |
| CN113091348B (en) | Semiconductor TEC ultralow-temperature refrigeration auxiliary circulation system and method | |
| CN201917154U (en) | Cooling-water machine used for cooling recirculated water of medical equipment | |
| CN212253245U (en) | Water cooling machine with multiple water outlet temperature regulation and control functions |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 100176 floor 3, building a, building 14, yard 8, Liangshuihe Second Street, Beijing Economic Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi automation equipment Technology Co.,Ltd. Address before: 100176 3rd floor, block a, building 14, yard 8, Liangshuihe 2nd Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. |
|
| CP03 | Change of name, title or address |