CN113666455A - Pure water generation system for semiconductor temperature control system - Google Patents
Pure water generation system for semiconductor temperature control system Download PDFInfo
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- CN113666455A CN113666455A CN202110956058.3A CN202110956058A CN113666455A CN 113666455 A CN113666455 A CN 113666455A CN 202110956058 A CN202110956058 A CN 202110956058A CN 113666455 A CN113666455 A CN 113666455A
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- pure water
- temperature control
- temperature
- valve body
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 118
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 39
- 230000008569 process Effects 0.000 claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 238000001914 filtration Methods 0.000 claims abstract description 11
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 5
- 238000005485 electric heating Methods 0.000 claims description 3
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 abstract description 12
- 239000003456 ion exchange resin Substances 0.000 abstract description 12
- 229920003303 ion-exchange polymer Polymers 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 150000002500 ions Chemical class 0.000 abstract description 6
- 238000001179 sorption measurement Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 6
- 238000002242 deionisation method Methods 0.000 description 15
- 238000005265 energy consumption Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005342 ion exchange Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/02—Non-contaminated water, e.g. for industrial water supply
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/02—Temperature
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Treatment Of Water By Ion Exchange (AREA)
Abstract
The invention relates to the technical field of semiconductor wafer production, in particular to a pure water generation system for a semiconductor temperature control system, which comprises: the circulating liquid system comprises a heat release loop consisting of a water tank device, a water pump, a first temperature sensor, a load device, a first precise filtering device and a first plate heat exchanger, and the heat release loop is sequentially connected with the first plate heat exchanger to form a first loop; and second loops are arranged at the outlets of the water pump and the first temperature sensor and at the inlet of the first plate heat exchanger, and are used for a pure water generation system of the temperature control system. The invention solves the problem of the process temperature of the pure water generating device in the temperature control equipment for wafer production in the prior art, provides a constant temperature which meets the process requirement for the ion exchange resin, improves the adsorption speed of the ion exchange resin to ions in water, ensures the physical and chemical stability of the ion exchange resin, improves the exchange capacity of the resin and prolongs the service life of the resin.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer production, in particular to a pure water generation system for a semiconductor temperature control system.
Background
The manufacturing process of the wafer in the semiconductor industry needs the auxiliary temperature control equipment to provide accurate working temperature. The process of the wafer has strict requirements on cleanliness and electrical insulation, which inevitably requires that the circulating liquid used by the temperature control equipment has extremely high purity.
In the prior art, a special deionization device is generally additionally arranged in a temperature control device, and impurities in water are removed in a circulation process through resin filled in the device so as to meet the requirements of a process. The purity of water is measured by using a water resistance value, and the water resistance value is used in the system for measuring the data.
The deionized exchange resin used as a pure water generator has certain process requirements in the use process, particularly the conditions such as the use environment, the use temperature and the like. The maximum effect of the resin can be exerted only when the service condition is satisfied, and the service life of the resin is prolonged.
In the actual process, the temperature range of the original circulating liquid generally changes from-60 ℃ to 90 ℃, in order to meet the temperature range of the change, the prior deionization device adopts resins suitable for different temperature ranges, the replacement is troublesome, and most of the original circulating liquid temperature still can not be operated in the optimal use temperature range of the deionization resin, so that a series of problems of resin strength reduction, thermal decomposition, low ion exchange efficiency, unsatisfactory resin exchange capacity and service life and the like are caused.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a pure water generating system for a semiconductor temperature control system, which solves the problem of the process temperature of a pure water generating device in temperature control equipment for wafer production in the prior art, provides a constant temperature meeting the process requirement for ion exchange resin, improves the adsorption speed of the ion exchange resin on ions in water, ensures the physical and chemical stability of the ion exchange resin, and improves the exchange capacity and the service life of the resin.
(II) technical scheme
In order to solve the technical problems, the invention provides the following technical scheme: a pure water generation system for a semiconductor temperature control system, comprising:
the circulating liquid system comprises a heat release loop consisting of a water tank device, a water pump, a first temperature sensor, a load device, a first precise filtering device and a first plate heat exchanger, and the heat release loop is sequentially connected with the first plate heat exchanger to form a first loop;
a second loop is arranged at the outlet of the water pump and the first temperature sensor and at the inlet of the first plate heat exchanger, and the second loop is used for a pure water generating system of the temperature control system;
the plant water circulating system comprises a heat absorption loop consisting of a plant water temperature control device, a second precise filtering device, a third valve body and a first plate heat exchanger, and the heat absorption loop is sequentially connected to form a plant water circulating system loop;
and a third loop is arranged between the outlet of the second precise filtering device and the inlet of the plant water temperature control device and is used for precisely controlling the process temperature of the pure water generating system.
Further, the first loop is a circulating liquid loop formed by a heat release loop in the circulating liquid system.
Further, the second loop comprises a pure water generating system formed by sequentially connecting a first valve body, a second plate heat exchanger, a second temperature sensor and a deionized resin exchange barrel through pipelines;
the third loop comprises a plant water circulating system loop formed by connecting the second valve body and the second plate heat exchanger with the plant water circulating system.
Further, a heater, a third temperature sensor and a resistance value measuring instrument are arranged in the water tank device.
Furthermore, the third temperature sensor is used for measuring the temperature of the pure water generating system, comparing the temperature with the required supporting temperature and further adopting a microcomputer for control.
Furthermore, the resistance value measuring instrument measures the resistance value of the circulating liquid in the water tank device, compares the measured resistance value with the resin set by the system, and controls the opening degree of the first valve body of the pure water generating system through the microcomputer system.
Further, the heater comprises any one or a combination of two or more of electric heating, solar heating or open fire heating.
Further, the first valve body, the second valve body and the third valve body are all flow proportional valves.
(III) advantageous effects
The invention provides a pure water generation system for a semiconductor temperature control system, which has the following beneficial effects:
1. the invention can control the constant temperature of the circulating liquid entering the deionization exchange resin system, and accurately control the temperature through the plant water circulating system, the third loop, the second valve body and the second plate heat exchanger, thereby providing a constant temperature which meets the process requirement, improving the adsorption speed of the deionization exchange resin to the ions in water, ensuring the physical and chemical stability of the deionization exchange resin, improving the exchange capacity of the resin and prolonging the service life of the resin.
2. The invention accurately controls the opening and the opening of the first valve body through the closed-loop control logic of the microcomputer processing system, so that the system can feed back the resistance value of the circulating liquid in real time, the process requirement is met, and meanwhile, the energy consumption and the loss of the deionized resin are reduced.
3. The pure water generating system of the semiconductor temperature control system provided by the invention has the functions of constant temperature controllability and flow adjustability, and solves the problem that the temperature and the flow are in uncontrollable states in the process of deionized resin exchange in the prior art;
meanwhile, a series of problems that different resins need to be replaced when the pure water generating device faces different working conditions due to different process temperature requirements, the deionization process cannot occur at constant process temperature, the stability of the deionization resin is influenced, and the efficiency of the deionization process is influenced are solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic diagram of a pure water generating system in a semiconductor temperature control system according to the present invention.
In the figure: 100. a circulating fluid system; 110. a water tank device; 111. a heater; 112. a third temperature sensor; 113. a resistance value measuring instrument; 120. a water pump; 130. a first temperature sensor; 140. a first circuit; 150. a load device; 160. a first precision filtration device; 170. a first plate heat exchanger; 180. a second loop; 181. a first valve body; 182. a second plate heat exchanger; 183. a second temperature sensor; 184. a deionizing resin exchange tank; 200. a plant water circulation system; 210. a plant water temperature control device; 220. a second precision filter device; 230. a third circuit; 231. a second valve body; 240. a third valve body.
Detailed Description
Embodiments of the present application will be described in detail with reference to the drawings and examples, so that how to implement technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.
FIG. 1 is an embodiment of the present invention: a pure water generation system for a semiconductor temperature control system, comprising:
the circulating liquid system 100, the circulating liquid system 100 includes a first loop 140 formed by connecting a heat release loop composed of a water tank device 110, a water pump 120, a first temperature sensor 130, a load device 150, a first precise filtering device 160 and a first plate heat exchanger 170 in sequence.
The invention solves the problem of the process temperature of the pure water generating device in the temperature control equipment for wafer production in the prior art, provides a constant temperature which meets the process requirement for the ion exchange resin, improves the adsorption speed of the ion exchange resin to ions in water, ensures the physical and chemical stability of the ion exchange resin, improves the exchange capacity of the resin and prolongs the service life of the resin.
The first loop 140 is a circulating fluid loop formed by a heat release loop in the circulating fluid system 100.
A second loop 180 is arranged at the outlet of the water pump 120 and the first temperature sensor 130 and at the inlet of the first plate heat exchanger 170, and the second loop 180 is used for a pure water generation system of a temperature control system.
The second loop 180 comprises a pure water generating system formed by sequentially connecting a first valve body 181, a second plate heat exchanger 182, a second temperature sensor 183 and a deionized resin exchange barrel 184 through pipelines, when the water resistance value in the water tank is lower than a preset value, the microcomputer processing system controls the first valve body 181 to be opened, and circulating liquid enters the second loop 180, the first valve body 181, the second plate heat exchanger 182, the second temperature sensor 183 and the deionized resin exchange barrel 184 through the water pump 120 and the first temperature sensor 130, so that ion exchange of the circulating liquid is realized.
Meanwhile, the microcomputer processing system controls the opening of the first valve body 181 according to the flow rate preset in the process requirement of the deionized resin, thereby controlling the flow of the circulating liquid entering the second loop 180 and meeting the process requirement of the pure water generating system.
The plant water circulation system 200, the plant water circulation system 200 includes a heat absorption loop composed of a plant water temperature control device 210, a second precise filtering device 220, a third valve 240 and a first plate heat exchanger 170, and the heat absorption loop is connected in sequence to form a plant water circulation loop, when the second temperature sensor 183 is higher than a preset second temperature, the microcomputer processing system controls the second valve 231 to open, and feeds back data in real time through the second temperature sensor 183, and further controls the opening degree of the second valve 231, thereby controlling the water flow of the plant water circulation system 200 entering the third loop 230, and precisely controlling the temperature.
The first valve body 181, the second valve body 231, and the third valve body 240 each employ a flow rate proportional valve.
A third loop 230 is arranged between the outlet of the second precise filtering device 220 and the inlet of the plant water temperature control device 210, the third loop 230 is used for accurately controlling the process temperature of the pure water generation system, when the water resistance value of the water tank meets a preset numerical range, the microcomputer system controls the first valve body 181 to be closed, the second valve body 231 to be closed is controlled, the energy consumption of the system is reduced, meanwhile, the loss of the deionized resin exchange system is reduced, and the service life of the pure water generation system is prolonged.
The third circuit 230 includes a plant water circulation system circuit formed by connecting the second valve 231 and the second plate heat exchanger 182 with the plant water circulation system 200, when the first temperature sensor 130 detects that the value has a deviation from the preset temperature range, the microcomputer processing system controls the opening of the third valve 240 in real time, further controls the flow of the plant water entering the first plate heat exchanger 170, primarily controls the temperature, and then precisely controls the temperature through the heater 111 built in the water tank.
The pure water generating system of the semiconductor temperature control system provided by the invention has the functions of constant temperature controllability and flow adjustability, and solves the problem that the temperature and the flow are in uncontrollable states in the process of deionized resin exchange in the prior art;
meanwhile, a series of problems that different resins need to be replaced when the pure water generating device faces different working conditions due to different process temperature requirements, the deionization process cannot occur at constant process temperature, the stability of the deionization resin is influenced, and the efficiency of the deionization process is influenced are solved.
The water tank device 110 incorporates a heater 111, a third temperature sensor 112, and a resistance meter 113.
The third temperature sensor 112 is used to measure the temperature of the pure water generating system, and compare it with the required supporting temperature, and then use the microcomputer to control.
The resistance meter 113 measures the resistance of the circulating liquid in the water tank device 110, compares the measured resistance with the system setting resin, and controls the opening degree of the first valve 181 of the pure water generating system through the microcomputer system.
The heater 111 includes any one of electric heating, solar heating, and open flame heating, or a combination of two or more of them.
The invention can control the constant temperature of the circulating liquid entering the deionization exchange resin system, and accurately control the temperature through the plant water circulating system 200, the third loop 230, the second valve 231 and the second plate heat exchanger 182, thereby providing a constant temperature meeting the process requirements, improving the adsorption speed of the deionization exchange resin to ions in water, ensuring the physical and chemical stability of the deionization exchange resin, and improving the exchange capacity and service life of the resin.
When the water resistance value in the water tank is lower than a preset value, the microcomputer processing system controls the first valve body 181 to open, and the circulating liquid enters the second loop 180, the first valve body 181, the second plate heat exchanger 182, the second temperature sensor 183 and the deionized resin exchange barrel 184 through the water pump 120 and the first temperature sensor 130, so that the ion exchange of the circulating liquid is realized;
meanwhile, the microcomputer processing system controls the opening of the first valve body 181 according to the flow rate preset in the process requirement of the deionized resin, thereby controlling the flow of the circulating liquid entering the second loop 180 and meeting the process requirement of the pure water generating system.
When the second temperature sensor 183 is higher than the preset second temperature, the microcomputer processing system controls the second valve body 231 to open, and further controls the opening of the second valve body 231 by feeding back data in real time through the second temperature sensor 183, so as to control the water flow rate of the plant water circulation system 200 entering the third loop 230, and precisely control the temperature.
When the water resistance value of the water tank meets the preset value range, the microcomputer system controls the first valve body 181 to close and controls the second valve body 231 to close, so that the energy consumption of the system is reduced, meanwhile, the loss of the deionized resin exchange system is reduced, and the service life of the pure water generation system is prolonged.
When the value detected by the first temperature sensor 130 deviates from the preset temperature range, the microcomputer processing system controls the opening of the third valve 240 in real time, and further controls the flow rate of the service water entering the first plate heat exchanger 170, primarily controls the temperature, and then precisely controls the temperature through the heater 111 arranged in the water tank.
The invention solves the problem of the process temperature of the pure water generating device in the temperature control equipment for wafer production in the prior art, provides a constant temperature which meets the process requirement for the ion exchange resin, improves the adsorption speed of the ion exchange resin to ions in water, ensures the physical and chemical stability of the ion exchange resin, improves the exchange capacity of the resin and prolongs the service life of the resin.
The invention precisely controls the opening and the openness of the first valve body 181 through the closed-loop control logic of the microcomputer processing system, so that the system can feed back the resistance value of the circulating liquid in real time, the process requirement is met, and the energy consumption and the loss of the deionized resin are reduced.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A pure water generation system for a semiconductor temperature control system, comprising:
the circulating liquid system (100) comprises a heat release loop consisting of a water tank device (110), a water pump (120), a first temperature sensor (130), a load device (150), a first precise filtering device (160) and a first plate heat exchanger (170), and the heat release loop is connected in sequence to form a first loop (140);
a second loop (180) is arranged at the outlet of the water pump (120) and the first temperature sensor (130) and at the inlet of the first plate heat exchanger (170), and the second loop (180) is used for a pure water generation system of the temperature control system;
the plant service water circulation system (200), the plant service water circulation system (200) comprises a heat absorption loop consisting of a plant service water temperature control device (210), a second precise filtering device (220), a third valve body (240) and a first plate heat exchanger (170), and the heat absorption loop is sequentially connected to form a plant service water circulation system loop;
a third loop (230) is arranged between the outlet of the second precise filtering device (220) and the inlet of the plant water temperature control device (210), and the third loop (230) is used for precisely controlling the process temperature of the pure water generating system.
2. The pure water generation system for the semiconductor temperature control system according to claim 1, characterized in that: the first loop (140) is a circulating fluid loop formed by a heat release loop in the circulating fluid system (100).
3. The pure water generation system for the semiconductor temperature control system according to claim 1, characterized in that: the second loop (180) comprises a pure water generating system formed by sequentially connecting a first valve body (181), a second plate heat exchanger (182), a second temperature sensor (183) and a deionized resin exchange barrel (184) through pipelines;
the third circuit (230) comprises a plant service water circulation system loop formed by connecting a second valve body (231) and a second plate heat exchanger (182) with the plant service water circulation system (200).
4. The pure water generation system for the semiconductor temperature control system according to claim 1, characterized in that: the water tank device (110) is internally provided with a heater (111), a third temperature sensor (112) and a resistance meter (113).
5. The pure water generation system for the semiconductor temperature control system according to claim 4, wherein: the third temperature sensor (112) is used for measuring the temperature of the pure water generating system, comparing with the required supporting temperature and further adopting a microcomputer for control.
6. The pure water generation system for the semiconductor temperature control system according to claim 4, wherein: the resistance value measuring instrument (113) measures the resistance value of the internal circulation liquid of the water tank device (110), and then compares the resistance value with the resin set by the system, and controls the opening degree of the first valve body (181) of the pure water generating system through the microcomputer system.
7. The pure water generation system for the semiconductor temperature control system according to claim 4, wherein: the heater (111) includes any one or a combination of two or more of electric heating, solar heating, and open flame heating.
8. The pure water generation system for the semiconductor temperature control system according to claim 3, characterized in that: the first valve body (181), the second valve body (231) and the third valve body (240) are all flow proportional valves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110956058.3A CN113666455A (en) | 2021-08-19 | 2021-08-19 | Pure water generation system for semiconductor temperature control system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110956058.3A CN113666455A (en) | 2021-08-19 | 2021-08-19 | Pure water generation system for semiconductor temperature control system |
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| CN113666455A true CN113666455A (en) | 2021-11-19 |
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| CN202110956058.3A Pending CN113666455A (en) | 2021-08-19 | 2021-08-19 | Pure water generation system for semiconductor temperature control system |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103241802A (en) * | 2013-04-19 | 2013-08-14 | 无锡溥汇机械科技有限公司 | Pulse type pure water maintenance system |
| JP2016067975A (en) * | 2014-09-26 | 2016-05-09 | 三浦工業株式会社 | Water treatment system |
| CN109974320A (en) * | 2019-04-22 | 2019-07-05 | 苏州奥德机械有限公司 | A kind of high temperature deionized water cooling device |
| CN209989199U (en) * | 2019-05-23 | 2020-01-24 | 苏州奥德机械有限公司 | High-temperature water deionization device |
| CN212299538U (en) * | 2020-04-15 | 2021-01-05 | 无锡溥汇机械科技有限公司 | Ultrapure water heat exchange system |
| CN112797656A (en) * | 2021-02-03 | 2021-05-14 | 合肥亦威科技有限公司 | Extremely high extremely low temperature control system |
| CN213519874U (en) * | 2020-10-16 | 2021-06-22 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control device using deionized water as circulating medium |
-
2021
- 2021-08-19 CN CN202110956058.3A patent/CN113666455A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103241802A (en) * | 2013-04-19 | 2013-08-14 | 无锡溥汇机械科技有限公司 | Pulse type pure water maintenance system |
| JP2016067975A (en) * | 2014-09-26 | 2016-05-09 | 三浦工業株式会社 | Water treatment system |
| CN109974320A (en) * | 2019-04-22 | 2019-07-05 | 苏州奥德机械有限公司 | A kind of high temperature deionized water cooling device |
| CN209989199U (en) * | 2019-05-23 | 2020-01-24 | 苏州奥德机械有限公司 | High-temperature water deionization device |
| CN212299538U (en) * | 2020-04-15 | 2021-01-05 | 无锡溥汇机械科技有限公司 | Ultrapure water heat exchange system |
| CN213519874U (en) * | 2020-10-16 | 2021-06-22 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control device using deionized water as circulating medium |
| CN112797656A (en) * | 2021-02-03 | 2021-05-14 | 合肥亦威科技有限公司 | Extremely high extremely low temperature control system |
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Application publication date: 20211119 |
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