CN113439128A - Copper alloy material, commutator segment, and electrode material - Google Patents
Copper alloy material, commutator segment, and electrode material Download PDFInfo
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- CN113439128A CN113439128A CN202080014740.4A CN202080014740A CN113439128A CN 113439128 A CN113439128 A CN 113439128A CN 202080014740 A CN202080014740 A CN 202080014740A CN 113439128 A CN113439128 A CN 113439128A
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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Abstract
The copper alloy material is characterized by comprising the following components: the copper alloy material contains Cr in a range of 0.3 to 0.7 mass%, Zr in a range of 0.025 to 0.15 mass%, Sn in a range of 0.005 to 0.04 mass%, P in a range of 0.005 to 0.03 mass%, and the balance of Cu and unavoidable impurities, and the copper alloy material has a Vickers hardness of 149Hv or more at 20 ℃.
Description
Technical Field
The present invention relates to a copper alloy material which is particularly suitable as a base material for a member used in applications requiring wear resistance, such as a commutator or an electrode material of a direct current motor.
The present application claims priority based on patent application No. 2019-.
Background
Conventionally, in a dc motor such as a dc motor or a dc generator, since the above-described commutator is in contact with a power supply brush, excellent wear resistance and high electrical conductivity are required for a commutator segment (commutator segment) constituting the commutator. Further, in addition to wear resistance and electrical conductivity, wear resistance at high temperatures is required for an electrode material for resistance welding or an electrode material for electric discharge machining.
Conventionally, silver-containing copper, oxygen-free copper, tough pitch copper, phosphorus deoxidized copper, and the like have been used as materials constituting the commutator segments or the electrode materials, but various copper alloys disclosed in patent documents 1 to 3, for example, have been proposed in order to further improve the wear resistance.
For example, patent document 1 proposes a composition containing Fe: 0.02-0.5 wt%, P: 0.02-0.15 wt%, Ag: 0.01 to 0.3 wt% of a copper alloy.
Further, patent document 2 proposes a copper alloy containing 0.01 to 0.2 wt% of zirconium (Zr).
Further, patent document 3 proposes a composition containing Si: 0.1 to 1.0 wt% of a copper alloy.
Patent document 1 Japanese patent application laid-open No. Hei 02-025531 (A)
Patent document 2 Japanese patent application laid-open No. Hei 09-071849 (A)
Patent document 3 Japanese patent application laid-open No. Hei 09-263864 (A)
Recently, however, as the dc motor and the dc generator, and the resistance welding machine and the electric discharge machine are reduced in size and increased in output, the commutator pieces and the electrode material used for them are used under severer environments than ever before. Therefore, it is required to have a longer life than the conventional ones by further improving the wear resistance. In addition, in members other than the commutator segments and the electrode materials, improvement of wear resistance is required in order to achieve a longer life. Further, these parts are sometimes used under high temperature conditions, and therefore, stable characteristics are required even at high temperatures.
Here, the copper alloys disclosed in patent documents 1 to 3 are still insufficient in wear resistance, and therefore, the life of the members made of these copper alloys cannot be prolonged.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a copper alloy material, a commutator segment, and an electrode material which are particularly excellent in wear resistance, have stable characteristics even at high temperatures, and can realize a long life of a component.
In order to solve the above problems, a copper alloy material according to the present invention is characterized by comprising: the copper alloy material contains Cr in a range of 0.3 to 0.7 mass%, Zr in a range of 0.025 to 0.15 mass%, Sn in a range of 0.005 to 0.04 mass%, P in a range of 0.005 to 0.03 mass%, and the balance of Cu and unavoidable impurities, and the copper alloy material has a Vickers hardness of 149Hv or more at 20 ℃.
In the copper alloy material having such a structure, Cr is contained in a range of 0.3 to 0.7 mass%, and Zr is contained in a range of 0.025 to 0.15 mass%, respectively, so that fine precipitates can be precipitated by aging treatment, and hardness can be improved by precipitation solidification.
Further, since Sn is contained in a range of 0.005 mass% or more and 0.04 mass% or less, the hardness can be improved by solid solution curing.
Further, since P is contained in a range of 0.005 mass% or more and 0.03 mass% or less, Zr and Cr as described above react with P to form a Zr-P compound or a Cr-Zr-P compound. Since these Zr-P compounds and Cr-Zr-P compounds are stable at high temperatures, the hardness is not lowered even when used under high temperature conditions.
Further, the copper alloy material has a Vickers hardness of 149Hv or more at 20 ℃, and therefore, is particularly excellent in wear resistance.
Therefore, the life of the member made of the copper alloy material can be prolonged.
In the copper alloy material of the present invention, the content [ Zr ] (% by mass) of Zr and the content [ P ] (% by mass) of P may have a relationship [ Zr ]/[ P ] > 5.
In this case, the Zr content [ Zr ] (mass%) and the P content [ P ] (mass%) have a relationship of [ Zr ]/[ P ] > 5, and therefore, even if a Zr-P compound or a Cr-Zr-P compound is produced, the number of Cu-Zr precipitates contributing to the improvement of the hardness can be secured, and the hardness can be surely improved.
In the copper alloy material of the present invention, the content [ Sn ] (% by mass) of Sn and the content [ P ] (% by mass) of P may have a relationship [ Sn ]/[ P ] < 5.
In this case, since the content [ Sn ] (% by mass) of Sn and the content [ P ] (% by mass) of P have a relationship [ Sn ]/[ P ] < 5, it is possible to compensate for the decrease in electrical conductivity due to the solid solution of Sn by the increase in electrical conductivity due to the formation of the Zr-P compound or the Cr-Zr-P compound, and it is possible to secure excellent electrical conductivity (thermal conductivity). Therefore, it can be preferably used for applications requiring electrical conductivity (thermal conductivity).
The copper alloy material of the present invention may further contain 0.005 mass% to 0.03 mass% of Si.
In this case, by dissolving Si in the matrix phase of copper in a solid solution, further improvement in hardness can be achieved by solid solution solidification.
In the copper alloy material of the present invention, the total content of the elements Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti is preferably 0.03 mass% or less.
In this case, since the total content of the elements of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti as impurity elements is limited to 0.03 mass% or less, a decrease in electrical conductivity (thermal conductivity) can be suppressed. Therefore, it can be preferably used for applications requiring electrical conductivity (thermal conductivity).
In the copper alloy material of the present invention, the electrical conductivity is preferably 70% IACS or more.
In this case, since the electrical conductivity is 70% IACS or more, the Cr-based precipitates and the Zr-based precipitates are sufficiently dispersed, and the Zr-P compound or the Cr-Zr-P compound is generated, whereby the hardness can be sufficiently improved. And is particularly suitable for applications requiring electrical conductivity (thermal conductivity).
In the copper alloy material of the present invention, the tensile strength is preferably 470MPa or more.
In this case, the tensile strength is 470MPa or more, and therefore, the resin composition has sufficient strength, can suppress deformation during use, and can be suitably used as a base material for various members.
The rectifying sheet of the present invention is characterized by being made of the above copper alloy material.
According to the rectifying plate having this structure, since it is made of the copper alloy material, it is hard and excellent in wear resistance, and even when it is used under high temperature conditions, the hardness does not decrease, so that it can be stably used and the service life can be extended.
The electrode material of the present invention is characterized by being made of the above copper alloy material.
According to the electrode material having such a configuration, since it is made of the copper alloy material, it is hard and excellent in wear resistance, and even when it is used under high temperature conditions, the hardness does not decrease, so that it can be stably used and the service life can be extended.
According to the present invention, it is possible to provide a copper alloy material, a commutator segment, and an electrode material which are particularly excellent in wear resistance, have stable characteristics even at high temperatures, and can realize a long life of a component.
Drawings
Fig. 1 is a flowchart of a method for producing a copper alloy material according to an embodiment of the present invention.
Detailed Description
Hereinafter, a copper alloy material according to an embodiment of the present invention will be described.
The copper alloy material of the present embodiment is used as a base material for a member requiring particularly excellent wear resistance, such as a commutator segment constituting a commutator of a direct current machine, and an electrode material for electric discharge machining or resistance welding.
The copper alloy material of the present embodiment is shaped in accordance with the processing method used in forming the part, and is formed into, for example, a strip material, a wire rod material, or a pipe material.
The composition of the copper alloy material of the present embodiment is: the alloy material contains Cr in a range of 0.3 to 0.7 mass%, Zr in a range of 0.025 to 0.15 mass%, Sn in a range of 0.005 to 0.04 mass%, P in a range of 0.005 to 0.03 mass%, and the balance of Cu and unavoidable impurities.
In the copper alloy material of the present embodiment, the vickers hardness at 20 ℃ is 149Hv or more.
Here, in the copper alloy material of the present embodiment, it is preferable that the content of Zr [ Zr ] (mass%) and the content of P [ P ] (mass%) have a relationship [ Zr ]/[ P ] > 5.
In the copper alloy material of the present embodiment, it is preferable that the content [ Sn ] (% by mass) of Sn and the content [ P ] (% by mass) of P have a relationship [ Sn ]/[ P ] ≦ 5.
In the copper alloy material of the present embodiment, Si may be contained in a range of 0.005 mass% or more and 0.03 mass% or less.
In the copper alloy material of the present embodiment, the total content of the elements Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti may be 0.03 mass% or less.
In the copper alloy material of the present embodiment, the electrical conductivity is preferably 70% IACS or more.
In the copper alloy material of the present embodiment, the tensile strength is preferably 470MPa or more.
The reason why the composition and properties of the copper alloy material of the present embodiment are defined as described above will be described below.
(Cr of 0.3 to 0.7 mass%)
Cr is an element having the following effects: cr-based precipitates are finely precipitated in grains of the matrix by aging treatment, thereby improving hardness (strength) and electrical conductivity.
When the content of Cr is less than 0.3 mass%, the precipitation amount may become insufficient in the aging treatment, and the effect of improving the hardness (strength) and the electrical conductivity may not be sufficiently obtained. When the content of Cr exceeds 0.7 mass%, relatively coarse Cr crystal products may be formed, which may cause defects.
As described above, in the present embodiment, the content of Cr is set in the range of 0.3 mass% or more and 0.7 mass% or less.
In order to reliably exhibit the above-described effects, the lower limit of the content of Cr is preferably 0.4 mass% or more, and the upper limit of the content of Cr is preferably 0.6 mass% or less.
(Zr: 0.025% by mass or more and 0.15% by mass or less)
Zr is an element with the following function and effect: zr-based precipitates (for example, Cu — Zr) are finely precipitated in the grain boundaries of the matrix by aging treatment, thereby improving the hardness (strength) and the electrical conductivity.
When the Zr content is less than 0.025 mass%, the precipitation amount may become insufficient in the aging treatment, and the effect of improving the hardness (strength) and the electrical conductivity may not be sufficiently obtained. When the Zr content exceeds 0.15 mass%, the electric conductivity may be lowered, and Zr-based precipitates may be coarsened, so that the effect of improving the hardness (strength) may not be obtained.
As described above, in the present embodiment, the Zr content is set in the range of 0.025 mass% or more and 0.15 mass% or less.
In order to reliably exhibit the above-described effects, the lower limit of the Zr content is preferably 0.05 mass% or more, and the upper limit of the Zr content is preferably 0.13 mass% or less.
(Sn: 0.005% by mass or more and 0.04% by mass or less)
Sn is an element having the following effects: the hardness (strength) is increased by solid dissolution in the copper matrix. Further, the effect of raising the peak temperature of the softening property is also obtained.
When the Sn content is less than 0.005 mass%, there is a possibility that the effect of improving the hardness (strength) due to solid solution cannot be sufficiently obtained. When the Sn content exceeds 0.04 mass%, the electrical conductivity (thermal conductivity) may be reduced.
As described above, in the present embodiment, the content of Sn is set in the range of 0.005 mass% or more and 0.04 mass% or less.
In order to reliably exhibit the above-described effects, the lower limit of the Sn content is preferably 0.01 mass% or more, and the upper limit of the Sn content is preferably 0.03 mass% or less.
(P is 0.005 to 0.03 mass%)
P is an element having the following action effects: together with Zr and Cr, a Zr-P compound or a Cr-Zr-P compound which is stable at high temperatures is produced, and coarsening of the crystal grain size in a high temperature state is suppressed. Therefore, when used at high temperatures, the hardness can be suppressed from decreasing.
When the content of P is less than 0.005% by mass, the Zr-P compound or the Cr-Zr-P compound may not be sufficiently produced, and the effect of suppressing coarsening of the crystal grain size in a high-temperature state may not be sufficiently obtained. When the content of P exceeds 0.03 mass%, an excessive amount of Zr-P compounds or Cr-Zr-P compounds is produced, and the number of Cu-Zr precipitates contributing to the improvement of hardness (strength) is insufficient, so that there is a possibility that the improvement of hardness (strength) cannot be achieved.
As described above, in the present embodiment, the content of P is set in the range of 0.005 mass% or more and 0.03 mass% or less.
In order to reliably exhibit the above-described effects, the lower limit of the content of P is preferably 0.008 mass% or more, and the upper limit of the content of P is preferably 0.020 mass% or less.
(Vickers hardness at 20 ℃ C.: 149Hv or higher)
The copper alloy material of the present embodiment is used as a base material for a member used in applications requiring wear resistance. Therefore, the Vickers hardness must be sufficiently increased.
Here, when the vickers hardness at 20 ℃ is less than 149Hv, sufficient wear resistance may not be secured.
As described above, in the copper alloy material of the present embodiment, the vickers hardness is set to 149Hv or more.
The vickers hardness of the copper alloy material according to the present embodiment is preferably 155Hv or more, and more preferably 160Hv or more.
The upper limit of the vickers hardness is not particularly limited, and in the copper alloy material of the present embodiment, the vickers hardness at 20 ℃ is 220Hv or less, and more preferably 200Hv or less.
([ Zr ]/[ P ]) over 5)
As described above, P reacts with Zr to form a Zr-P compound or a Cr-Zr-P compound which is stable at high temperatures.
When the ratio [ Zr ]/[ P ] of the Zr content [ Zr ] (% by mass) to the P content [ P ] (% by mass) exceeds 5, the amount of Zr relative to P can be secured, and the number of Cu-Zr precipitates contributing to the improvement of hardness (strength) can be secured by forming a Zr-P compound or a Cr-Zr-P compound, thereby achieving the improvement of hardness (strength).
As described above, in the present embodiment, it is preferable to set the ratio [ Zr ]/[ P ] of the Zr content to the P content to exceed 5.
In order to reliably secure the number of Cu — Zr precipitates contributing to an improvement in hardness (strength), it is further preferable that the ratio [ Zr ]/[ P ] of the Zr content to the P content is 7 or more.
([ Sn ]/[ P ]: less than 5)
As described above, Sn is dissolved in the copper matrix to reduce electrical conductivity (thermal conductivity). On the other hand, P improves electrical conductivity (thermal conductivity) by forming a Zr-P compound or a Cr-Zr-P compound.
Here, when the ratio [ Sn ]/[ P ] of the Sn content [ Sn ] (% by mass) to the P content [ P ] (% by mass) is 5 or less, the amount of Sn to P can be suppressed, and the decrease in electrical conductivity (thermal conductivity) due to the solid solution of Sn can be compensated for by the increase in electrical conductivity (thermal conductivity) due to the formation of the Zr — P compound or Cr — Zr — P compound.
In view of the above, when electrical conductivity (thermal conductivity) is required, it is preferable to set the ratio [ Sn ]/[ P ] of the Sn content to the P content to 5 or less.
In order to reliably improve the electrical conductivity (thermal conductivity), it is further preferable that the ratio [ Sn ]/[ P ] of the Sn content to the P content is 3 or less.
(Si not less than 0.005 mass% and not more than 0.03 mass%)
Si is an element having the following effects: the hardness (strength) is enhanced by solid dissolution in the copper matrix phase, and may be added as needed.
When the content of Si is less than 0.005% by mass, there is a possibility that the effect of improving the hardness (strength) due to solid solution cannot be sufficiently obtained. When the content of Si exceeds 0.03 mass%, the electrical conductivity (thermal conductivity) may be reduced.
As described above, in the present embodiment, when Si is added, the content of Si is preferably set to be in the range of 0.005 mass% or more and 0.03 mass% or less.
In order to reliably exhibit the above-described effects, the lower limit of the content of Si is preferably 0.010 mass% or more, and the upper limit of the content of Si is preferably 0.025 mass% or less. If the above-mentioned action and effect are not expected without intentionally adding Si, Si may be contained in an amount of less than 0.005 mass%.
(total content of Mg, Al, Fe, Ni, Zn, Mn, Co and Ti: 0.03 mass% or less)
Elements such as Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti may greatly reduce electrical conductivity (thermal conductivity). Therefore, when high electrical conductivity (thermal conductivity) is required, the total content of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti is preferably limited to 0.03 mass% or less.
Further, the total content of Mg, Al, Fe, Ni, Zn, Mn, Co and Ti is preferably limited to 0.01 mass% or less.
(other inevitable impurities)
Examples of unavoidable impurities other than the above-mentioned Mg, Al, Fe, Ni, Zn, Mn, Co and Ti include B, Ag, Ca, Te, Sr, Ba, Sc, Y, Ti, Hf, V, Nb, Ta, Mo, W, Re, Ru, Os, Se, Rh, Ir, Pd, Pt, Au, Cd, Ga, In, Li, Ge, As, Sb, Tl, Pb, Be, N, H, Hg, Tc, Na, K, Rb, Cs, Po, Bi, lanthanoid, O, S, C and the like. These inevitable impurities may lower the electrical conductivity (thermal conductivity), and are preferably 0.05 mass% or less in total.
(conductivity: more than 70% IACS)
In the copper alloy material of the present embodiment, when the electrical conductivity is 70% IACS or more, the Cr-based precipitates and the Zr-based precipitates are sufficiently dispersed, and the Zr — P compound or the Cr — Zr — P compound is generated. Therefore, the strength and electrical conductivity (thermal conductivity) are excellent, and the coarsening of the crystal grain diameter can be suppressed even when used under high-temperature conditions.
As described above, in the copper alloy material according to the present embodiment, the electrical conductivity is preferably 70% IACS or more.
Further, the electrical conductivity of the copper alloy material of the present embodiment is preferably 75% IACS or more.
The upper limit of the electrical conductivity is not particularly limited, and in the copper alloy material of the present embodiment, the electrical conductivity of the copper alloy material is 90% IACS or less, more preferably 87% IACS or less, and still more preferably 85% IACS or less.
(tensile Strength: 470MPa or more)
In the copper alloy material of the present embodiment, when the tensile strength is 470MPa or more, sufficient strength can be secured, and deformation during use can be suppressed.
As described above, in the copper alloy material according to the present embodiment, the tensile strength is preferably 470MPa or more.
Further, the tensile strength of the copper alloy material of the present embodiment is preferably 510MPa or more.
The upper limit of the tensile strength is not particularly limited, but in the copper alloy material of the present embodiment, the tensile strength of the copper alloy material is 620MPa or less, and more preferably 600Hv or less.
Next, a method for producing a copper alloy material according to an embodiment of the present invention will be described with reference to a flowchart of fig. 1.
(melting/casting step S01)
First, a copper raw material made of oxygen-free copper having a copper purity of 99.99 mass% or more is charged into a carbon crucible, and melted in a vacuum melting furnace to obtain a copper melt. Next, the above additive elements are added to the obtained melt so as to have a predetermined concentration, and a copper alloy melt is obtained by preparing the components.
Here, as the raw materials of Cr, Zr, Sn, and P as the additive elements, for example, a raw material of Cr having a purity of 99.9 mass% or more, a raw material of Zr having a purity of 99 mass% or more, a raw material of Sn having a purity of 99.9 mass% or more, and a master alloy with Cu are preferably used for P. Further, Si may be added as needed. When Si is added, a master alloy with Cu is preferably used.
And, the copper alloy melt prepared by the composition is poured into a casting mold to obtain a copper alloy ingot.
(Hot working Process S02)
Subsequently, the obtained copper alloy ingot was subjected to hot working. Here, the conditions for hot working are preferably temperature: a processing rate of 500 ℃ to 1000 ℃ inclusive: 30% or more and 95% or less. Immediately after the hot working, the steel sheet is cooled by water cooling.
The processing method in the hot working step S02 is not particularly limited, and rolling may be applied when the final shape is a plate or a bar. When the final shape is a wire or a rod, extrusion or groove rolling may be applied. When the final shape is a block, forging or pressing may be applied.
(solution treatment step S03)
Next, the hot worked material obtained in the hot working process S02 is heated at a holding temperature: a holding time at a holding temperature of 900 ℃ or more and 1050 ℃ or less: the heating is performed under the condition of 0.5 hours to 6 hours, and then the solution treatment is performed by water cooling. The heating is preferably performed, for example, in the atmosphere or in an inert gas atmosphere.
(first Cold working Process S04)
Next, the material subjected to the solutionizing treatment in step S03 is subjected to cold working. Here, in the first cold working step S04, the reduction ratio is preferably set to be in the range of 30% to 90%.
The working method in the first cold working step S04 is not particularly limited, and rolling may be applied when the final shape is a plate or a strip. When the final shape is a wire or a rod, drawing or groove rolling may be applied. When the final shape is a block, forging or pressing may be applied.
(aging treatment Process S05)
Next, the cold worked material obtained in the cold working step S04 is subjected to an aging treatment to finely precipitate precipitates such as Cr-based precipitates and Zr-based precipitates.
Here, the aging treatment conditions are preferably at a holding temperature: a holding time at a holding temperature of 400 ℃ or more and 600 ℃ or less: is carried out for 0.5 to 6 hours.
The heat treatment method in the aging treatment is not particularly limited, and is preferably performed in an inert gas atmosphere. The cooling method after heating is not particularly limited, but rapid cooling by water cooling is preferable.
(second Cold working Process S06)
Next, cold working is performed on the aged material having undergone the aging step S05. Here, in the second cold working step S06, the reduction ratio is preferably set to be in the range of 10% to 80%.
The working method in the second cold working step S06 is not particularly limited, and rolling may be applied when the final shape is a plate or a strip. When the final shape is a wire or a rod, drawing or groove rolling may be applied. When the final shape is a block, forging or pressing may be applied.
Through such a process, the copper alloy material of the present embodiment can be manufactured.
According to the copper alloy material according to the present embodiment having the above-described structure, Cr is contained in a range of 0.3 to 0.7 mass%, and Zr is contained in a range of 0.025 to 0.15 mass%, so that fine precipitates can be precipitated by aging treatment, and hardness can be improved by precipitation solidification.
Further, since Sn is contained in a range of 0.005 mass% or more and 0.04 mass% or less, the hardness can be improved by solid solution curing.
Further, since P is contained in a range of 0.005 mass% or more and 0.03 mass% or less, Zr and Cr as described above react with P to form a Zr-P compound or a Cr-Zr-P compound. Since these Zr-P compounds and Cr-Zr-P compounds are stable at high temperatures, the hardness is not lowered even when used under high temperature conditions.
In addition, in the copper alloy material according to the present embodiment, the vickers hardness at 20 ℃ is set to 149Hv or more, and therefore, the wear resistance is particularly excellent.
In the copper alloy material of the present embodiment, when the Zr content [ Zr ] (mass%) and the P content [ P ] (mass%) have a relationship of [ Zr ]/[ P ] > 5, the number of Cu — Zr precipitates contributing to the improvement of the hardness can be secured even if the Zr — P compound or the Cr — Zr — P compound is produced, and the hardness can be improved.
In the copper alloy material of the present embodiment, when the content [ Sn ] (% by mass) of Sn and the content [ P ] (% by mass) of P have a relationship of [ Sn ]/[ P ] < 5, the decrease in electrical conductivity due to the solid solution of Sn can be compensated for by the increase in electrical conductivity due to the formation of the Zr — P compound or the Cr — Zr — P compound, and excellent electrical conductivity (thermal conductivity) can be ensured.
Therefore, when used for applications requiring electrical conductivity (thermal conductivity), it preferably has a relationship [ Sn ]/[ P ]. ltoreq.5.
In the case where the copper alloy material of the present embodiment further contains 0.005 mass% or more and 0.03 mass% or less of Si, the hardness can be further improved by solid-solution solidification because Si is solid-dissolved in the matrix phase of copper.
In the copper alloy material of the present embodiment, when the total content of the elements of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti as impurity elements is 0.03 mass% or less, the decrease in electrical conductivity (thermal conductivity) can be suppressed.
Therefore, when used in applications requiring electrical conductivity (thermal conductivity), the total content of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti is preferably limited to 0.03 mass% or less.
In the copper alloy material of the present embodiment, when the electrical conductivity is 70% IACS or more, the Cr-based precipitates and the Zr-based precipitates are sufficiently dispersed, and the Zr — P compound or the Cr-Zr-P compound is generated, so that the hardness can be sufficiently increased.
Further, since electrical conductivity is ensured, it is particularly suitable for applications requiring electrical conductivity (thermal conductivity).
In addition, in the copper alloy material of the present embodiment, when the tensile strength is 470MPa or more, sufficient strength can be secured, deformation during use can be suppressed, and the copper alloy material can be suitably used as a base material for various members.
The current tab and the electrode material made of the copper alloy material according to the present embodiment are hard and excellent in wear resistance, and can be stably used without lowering the hardness even when used under high-temperature conditions, and can have a prolonged service life.
Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and can be modified as appropriate without departing from the scope of the technical idea of the present invention.
For example, the method for producing the copper alloy material is not limited to the present embodiment, and may be produced by other production methods. For example, a continuous casting apparatus may be used in the melting/casting step.
Examples
The following description will be made of the results of a confirmation experiment performed to confirm the effects of the present invention.
(example 1)
A copper raw material comprising oxygen-free copper having a purity of 99.99 mass% or more was prepared, and the raw material was charged into a carbon crucible and placed in a vacuum melting furnace (degree of vacuum 10)-2Pa or less) to obtain a molten copper. To the obtained copper melt, various additive elements were added to prepare a composition shown in table 1, and after holding for 5 minutes, the copper alloy melt was poured into a cast iron mold to obtain a copper alloy ingot. The cross-sectional dimension of the copper alloy ingot was set to about 60mm in width and about 100mm in thickness.
In addition, the additive elements used were Cr having a purity of 99.99 mass% or more, Zr having a purity of 99.95 mass% or more, and Sn having a purity of 99.99 mass% or more. P is a Cu-P master alloy.
Then, the obtained copper alloy ingots were hot-rolled under the conditions shown in table 2 to obtain hot-rolled materials.
The hot rolled material was subjected to a solution treatment by heating and holding under the conditions shown in table 2 and then water-cooling.
Next, the solutionized material was cut, and cold working (drawing) was performed under the conditions shown in table 2 to obtain a cold worked material.
The cold worked material was subjected to aging treatment by heating and holding the material in an air furnace under the conditions shown in table 2 and then water-cooling the material.
The obtained aging-treated materials were subjected to cold working (drawing) under the conditions shown in table 2 to obtain various copper alloy materials.
The obtained copper alloy material was evaluated for composition, vickers hardness, electric conductivity, tensile strength, and wear resistance.
(composition of ingredients)
The composition of the obtained copper alloy material was determined by ICP-MS analysis. As a result, the compositions shown in table 1 were confirmed.
(Vickers hardness)
The vickers hardness was measured at 9 points of the test piece by a vickers hardness tester manufactured by Akashi co., Ltd in accordance with JIS Z2244, and the average of 7 measured values excluding the maximum value and the minimum value was obtained. The evaluation results are shown in table 3.
(conductivity)
SIGMA TEST D2.068.068 (Probe diameter) manufactured by FOERSTER JAPAN LIMITED
) The center of the cross section of the sample 10X 15mm was measured 3 times, and the average value was determined. The evaluation results are shown in table 3.
(tensile Strength)
After the distance between the points was set to 250mm using AG-X250 kN manufactured by Shimadzu Corporation, 2 or more tensile tests were carried out at a crosshead speed of 100mm/min to obtain an average value. The evaluation results are shown in table 3.
(abrasion resistance)
An AMSLER type abrasion tester manufactured by TOKYO KOKI CO. LTD. was used to rotate a test load of 50kgf, a rotation speed of 188rpm at the upper part and a rotation speed of 209rpm at the lower part in a rolling sliding abrasion manner
Upper copper alloy test piece of (2) and SUS
The abrasion weight was measured on the lower test piece of (1). The evaluation results are shown in table 3.
[ Table 1]
[ Table 2]
[ Table 3]
In comparative examples 1 to 9 in which the contents of Cr, Zr, Sn and P were outside the range of the present invention, the wear amounts were increased and the wear resistance was insufficient.
On the other hand, in examples 1 to 13 of the present invention in which the contents of Cr, Zr, Sn and P were within the ranges of the present invention and the Vickers hardness was 130Hv or more, the wear amount was small and the wear resistance was excellent.
(example 2)
In the same manner as in example 1, copper alloy materials having the compositions shown in table 4 were obtained. The production conditions are shown in table 5.
The obtained copper alloy material was evaluated for vickers hardness at each temperature. The evaluation results are shown in table 6.
[ Table 4]
[ Table 5]
[ Table 6]
In comparative example 21 in which the second cold working was not performed without adding Sn, the vickers hardness at 20 ℃ was as low as 120 Hv. Furthermore, the Vickers hardness at 600 ℃ is 89Hv, the Vickers hardness at 700 ℃ is 65Hv, and the Vickers hardness at high temperature is insufficient.
In comparative example 22 in which the second cold working (reduction ratio 13%) was performed without Sn addition, the vickers hardness at 20 ℃ was 148 Hv. Further, the Vickers hardness at 600 ℃ is 110Hv, the Vickers hardness at 700 ℃ is 85Hv, and the Vickers hardness at high temperature is insufficient.
On the other hand, in the composition range of the present invention, in invention example 21 in which the second cold working (working ratio 13%) was performed, the vickers hardness at 20 ℃ was extremely high and 181 Hv. Furthermore, the Vickers hardness at 600 ℃ is 130Hv, and the Vickers hardness at 700 ℃ is 106Hv, and the Vickers hardness at high temperature can be sufficiently maintained.
As described above, according to the present invention, it has been confirmed that a copper alloy material which is particularly excellent in wear resistance, has stable characteristics even at high temperatures, and can realize a long life of a component can be provided.
Industrial applicability
According to the present invention, it is possible to provide a copper alloy material, a commutator segment, and an electrode material which are particularly excellent in wear resistance, have stable characteristics even at high temperatures, and can realize a long life of a component.
Claims (9)
1. A copper alloy material, characterized in that it consists of:
cr is contained in a range of 0.3 to 0.7 mass%, Zr is contained in a range of 0.025 to 0.15 mass%, Sn is contained in a range of 0.005 to 0.04 mass%, P is contained in a range of 0.005 to 0.03 mass%, and the balance is Cu and unavoidable impurities,
the Vickers hardness of the copper alloy material at 20 ℃ is 149Hv or more.
2. The copper alloy material according to claim 1,
the Zr content [ Zr ] has the following relationship with the P content [ P ]:
〔Zr〕/〔P〕＞5，
the unit of the Zr content and the P content is mass%.
3. The copper alloy material according to claim 1 or 2,
the Sn content [ Sn ] and the P content [ P ] have the following relationship:
〔Sn〕/〔P〕≤5，
wherein the unit of the Sn content and the P content is mass%.
4. The copper alloy material according to any one of claims 1 to 3,
the copper alloy material further contains Si in a range of 0.005 to 0.03 mass%.
5. The copper alloy material according to any one of claims 1 to 4,
the total content of Mg, Al, Fe, Ni, Zn, Mn, Co and Ti in the copper alloy material is less than 0.03 mass%.
6. The copper alloy material according to any one of claims 1 to 5,
the copper alloy material has an electrical conductivity of 70% IACS or more.
7. The copper alloy material according to any one of claims 1 to 6,
the tensile strength of the copper alloy material is more than 470 MPa.
8. A commutator segment is characterized in that,
consists of the copper alloy material according to any one of claims 1 to 7.
9. An electrode material characterized in that,
consists of the copper alloy material according to any one of claims 1 to 7.
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| JP2019-028048 | 2019-02-20 | ||
| JP2019028048 | 2019-02-20 | ||
| JP2020004203A JP2020133000A (en) | 2019-02-20 | 2020-01-15 | Copper alloy material, commutator segment, and electrode material |
| JP2020-004203 | 2020-01-15 | ||
| PCT/JP2020/005731 WO2020170956A1 (en) | 2019-02-20 | 2020-02-14 | Copper alloy material, commutator segment, and electrode material |
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- 2020-02-14 KR KR1020217025151A patent/KR20210129045A/en active Search and Examination
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