JP6736869B2 - Copper alloy material - Google Patents

Description

The present invention relates to a copper alloy material suitable for a member used in a high temperature environment such as a casting mold material and a welding member such as a contact tip.

Conventionally, Cu-Cr-Zr-based alloys such as C18150 have excellent heat resistance and electrical conductivity, and therefore, as shown in Patent Documents 1-3, casting mold materials and welding in which the use environment becomes high temperature. It is used as a material for manufacturing materials.
Such a Cu-Cr-Zr-based alloy is usually obtained by subjecting a Cu-Cr-Zr-based alloy ingot to plastic working, for example, a holding temperature of 950 to 1050°C and a holding time of 0.5 to 1.5 hours. It is manufactured by a manufacturing process in which a solution treatment and, for example, an aging treatment with a holding temperature of 400 to 500° C. and a holding time of 2 to 4 hours are performed, and finally a predetermined shape is finished by machining. Further, the solution treatment step in the Cu-Cr-Zr alloy can be performed in combination with the plastic working step, and the solution treatment is performed instead of the so-called in-line solution treatment in which the solution treatment is performed simultaneously with the hot rolling. It may be done.
Then, in the Cu-Cr-Zr-based alloy, Cr and Zr are solid-solved in the matrix of Cu by the solution treatment, and the precipitates of Cr and Zr are finely dispersed by the aging treatment. We are trying to improve

JP-A-62-182238 JP-A-62-182239 JP 04-210438 A

By the way, although the above-mentioned Cu-Cr-Zr-based alloy has excellent heat resistance, when it is exposed to a use environment having a peak temperature of 500°C or higher, re-dissolution of precipitates starts, and accordingly. As a result, the strength and the conductivity may decrease and the crystal grains may become coarse.
If the crystal grains become coarse, the propagation speed of cracks may increase and the product life may be shortened. Further, there is a problem that mechanical properties such as strength and elongation are remarkably reduced due to local coarsening of crystal grains.

The present invention has been made in view of the above-mentioned circumstances, and even when used in a high temperature environment of 500°C or higher, coarsening of crystal grains can be suppressed, characteristics are stable, and The object is to provide a copper alloy material having an excellent service life.

In order to solve the above problems, the copper alloy material of the present invention has a Cr content of 0.1 mass% or more and 1.5 mass% or less, a Zr content of 0.05 mass% or more and 0.25 mass% or less, and a P content of 0.005 mass% or more. 0.10 mass% or less, Co in the range of 0.02 mass% or more and 0.15 mass% or less, and the balance of Cu and inevitable impurities, and the mass ratio [Co]/[P] of Co and P. Is within the range of 0.5≦[Co]/[P]≦5.0, and there is a Cr—Zr—P compound containing Cr, Zr, and P. The area ratio of the P compound is in the range of 0.5% or more and 5.0% or less,
The Cr-Zr-P compound is in the form of needles or particles, and is characterized in that the longest side length is 100 μm or less.

In the copper alloy material of this configuration, Cr is 0.1 mass% or more and 1.5 mass% or less, Zr is 0.05 mass% or more and 0.25 mass% or less, P is 0.005 mass% or more and 0.10 mass% or less, and Co is It is contained in the range of 0.02 mass% or more and 0.15 mass% or less, and the balance is composed of Cu and unavoidable impurities. Therefore, by precipitating fine precipitates by aging treatment, strength (hardness) and The conductivity can be improved.
In the copper alloy material of the present invention, a Cr-Zr-P compound containing Cr, Zr, and P is present, and the area ratio of the Cr-Zr-P compound is 0.5% or more and 5.0 in the structure observation. It is within the range of% or less. Since the Cr-Zr-P compound containing Cr, Zr, and P does not disappear even under a high temperature condition of about 1000°C, even when used in a high temperature environment, the crystal grains of the Cr-Zr-P compound The grain pinning effect can suppress the coarsening of crystal grains.
In addition, since the Cr-Zr-P compound has a needle-like or granular form and the length of the longest side is 100 μm or less, the pinning effect described above can be reliably achieved. ..
Further, in addition to Cr and Zr, it further contains Co in the range of 0.02 mass% or more and 0.15 mass% or less, so that the CoP compound and the Co ₂ P compound are present, and the above-mentioned Cr-Zr- Along with the P compound, the pinning effect of the crystal grain boundaries can be exhibited, and the coarsening of the crystal grains can be surely suppressed even when used in a high temperature environment.
Further, since the atomic ratio [Co]/[P] of Co and P is within the range of 0.5≦[Co]/[P]≦5.0, surplus Co and P are present in the parent phase. The solid solution can be suppressed, and the decrease in conductivity can be suppressed.

Here, in the copper alloy material of the present invention, it is preferable that the average crystal grain size after the heat treatment of holding at 1000° C. for 30 minutes is 200 μm or less.
In this case, even after the heat treatment of holding at 1000° C. for 30 minutes, the crystal grains were not coarsened, and even when used in a high temperature environment of 500° C. or higher, the mechanical properties and conductivity were stable.

Furthermore, in the copper alloy material of the present invention containing Co, it is preferable that the total content of Ti and Hf which are inevitable impurities is 0.10 mass% or less.
In this case, since the total content of Ti and Hf, which are elements forming a compound with P, is limited to 0.10 mass% or less, the CoP compound and the Co ₂ P compound are reliably formed, and the crystal grain boundary pin is formed. The stopping effect can be effectively exhibited, and the coarsening of crystal grains can be suppressed.

According to the present invention, it is possible to provide a copper alloy material that can suppress the coarsening of crystal grains even when used in a high temperature environment of 500° C. or higher, has stable characteristics, and has an excellent service life. be able to.

It is a flow figure of a manufacturing method of a copper alloy material which is one embodiment of the present invention. It is a structure observation photograph in an example. (A) is Inventive Example 2 and (b) is Comparative Example 1. It is a structure observation photograph after heat-processing which hold|maintains at 1000 degreeC for 30 minutes. (A) is Inventive Example 2 and (b) is Comparative Example 1. It is a SEM-EPMA image of the example 2 of the present invention. 9 is an SEM-EPMA image of Comparative Example 2. It is an example of a SEM-EPMA image when calculating the area ratio of a Cu-Zr-P compound.

Below, the copper alloy material which is one embodiment of the present invention is explained.
The copper alloy material according to the present embodiment is used for a member used in a high temperature environment such as a casting mold or a welding member.

The copper alloy material of the present embodiment includes Cr in an amount of 0.1 mass% to 1.5 mass%, Zr in an amount of 0.05 mass% to 0.25 mass%, and P in an amount of 0.005 mass% to 0.10 mass%. The balance has a composition of Cu and inevitable impurities.
In the copper alloy material of the present embodiment, if necessary, further contains Co in the range of 0.02 mass% or more and 0.15 mass% or less, and the mass ratio of Co and P [Co]/[P]. May be within a range of 0.5≦[Co]/[P]≦5.0. When Co is contained, the total content of Ti and Hf which are inevitable impurities is preferably 0.10 mass% or less.

In the copper alloy material of the present embodiment, a Cr-Zr-P compound containing Cr, Zr, and P exists, and the area ratio of the Cr-Zr-P compound is 0.5% or more in the structure observation. It is set within the range of 0% or less. Further, the Cr-Zr-P compound described above has a needle-like or granular form, and the longest side length is set to 100 μm or less.
Further, in the copper alloy material of the present embodiment, the average crystal grain size after the heat treatment of holding at 1000° C. for 30 minutes is 200 μm or less.

Hereinafter, the reasons for defining the component composition, the crystal structure, etc. in the copper alloy material of the present embodiment as described above will be described.

(Cr: 0.1 mass% or more and 1.5 mass% or less)
Cr is an element having the effect of improving strength (hardness) and conductivity by finely depositing a Cr-based precipitate in the crystal grains of the mother phase by aging treatment.
Here, when the content of Cr is less than 0.1 mass %, the amount of precipitation becomes insufficient in the aging treatment, and the effect of improving the strength (hardness) may not be sufficiently obtained. Further, if the Cr content exceeds 1.5 mass %, coarse Cr crystallized substances are formed, and the workability may deteriorate.
From the above, in the present embodiment, the Cr content is set within the range of 0.1 mass% or more and 1.5 mass% or less. In order to surely bring out the above-mentioned effects, the lower limit of the Cr content is preferably 0.3 mass% or more, and the upper limit of the Cr content is preferably 1.0 mass% or less. ..

(Zr: 0.05 mass% or more and 0.25 mass% or less)
Zr is an element having the effect of improving the strength (hardness) and the conductivity by finely depositing Zr-based precipitates on the crystal grain boundaries of the mother phase by the aging treatment.
Here, when the content of Zr is less than 0.05 mass%, the amount of precipitation becomes insufficient in the aging treatment, and the effect of improving the strength (hardness) may not be sufficiently obtained. Moreover, when the content of Zr exceeds 0.25 mass %, the electrical conductivity and the thermal conductivity may decrease. Further, even if Zr is contained in an amount of more than 0.25 mass %, the effect of further improving the strength may not be obtained.
From the above, in the present embodiment, the Zr content is set within the range of 0.05 mass% or more and 0.25 mass% or less. In order to surely bring out the above-described effects, the lower limit of the Zr content is preferably 0.07 mass% or more, and the upper limit of the Zr content is preferably 0.15 mass% or less. ..

(P: 0.005 mass% or more and 0.10 mass% or less)
By adding P to the Cu-Cr-Zr alloy, a Cr-Zr-P compound containing Cr, Zr and P is produced. Since this Cr-Zr-P compound does not disappear even under a high temperature condition of 1000°C, even when used in a high temperature environment, the pinning effect of the crystal grain boundaries is exerted, and the crystal coarsening can be suppressed. Become.
Here, if the content of P is less than 0.005 mass%, the above-mentioned Cr-Zr-P compound may not be sufficiently formed. On the other hand, when the content of P exceeds 0.10 mass %, the conductivity decreases and the Cr—Zr—P compound becomes coarse, and the pinning effect may not be sufficiently exhibited.
From the above, in the present embodiment, the P content is set within the range of 0.005 mass% or more and 0.10 mass% or less. In order to surely bring out the above-mentioned effects, the lower limit of the P content is preferably 0.01 mass% or more, and the upper limit of the P content is preferably 0.05 mass% or less. ..

(Co: 0.02 mass% or more and 0.15 mass% or less)
By adding Co, is formed CoP compounds and Co ₂ P compound, by the these CoP compounds and Co ₂ P compounds with the above-mentioned Cr-Zr-P compound, the pinning effect of crystal grain boundary is exhibited, a high temperature Even when used in an environment, it is possible to reliably suppress coarsening of crystal grains.
Here, when the Co content is less than 0.02 mass%, the CoP compound and the Co ₂ P compound cannot be sufficiently formed, and the pinning effect is further improved despite the addition of Co. May not be able to On the other hand, when the Co content exceeds 0.15 mass %, the CoP compound and the Co ₂ P compound become coarse, and although the Co is added, the pinning effect may not be further improved. is there.
From the above, in the present embodiment, when Co is added, the Co content is set within the range of 0.02 mass% or more and 0.15 mass% or less. In order to surely achieve the above-mentioned effects, the lower limit of the Co content is preferably 0.03 mass% or more, and the upper limit of the Co content is preferably 0.1 mass% or less. .. Moreover, when Co is not intentionally added, Co may be contained as an impurity in an amount of less than 0.02 mass %.

( Mass ratio of Co and P [Co]/[P]: 0.5 or more and 5.0 or less)
When Co is added, the mass ratio [Co]/[P] of Co and P is in the range of 0.5≦[Co]/[P]≦5.0. By defining the mass ratio [Co]/[P] of Co and P in this way, excess Co and P that do not contribute to the formation of the CoP compound and the Co ₂ P compound are solid-dissolved in the matrix and the conductivity is increased. Can be suppressed. In order to surely bring out the above effects, the lower limit of the mass ratio [Co]/[P] of Co and P is preferably 1.0 or more, and the mass ratio [Co] of Co and P [Co]. The upper limit of /[P] is preferably 3.0 or less.

(Total of Ti.Hf: 0.10 mass% or less)
Furthermore, when Co is added, it is preferable that the total content of Ti and Hf which are inevitable impurities is 0.10 mass% or less. Since these elements such as Ti and Hf easily form a compound with Co, there is a possibility that a CoP compound and a Co ₂ P compound cannot be sufficiently formed. Therefore, by defining the total content of Ti and Hf which are unavoidable impurities as described above, the CoP compound and the Co ₂ P compound can be reliably formed and the pinning effect can be exhibited. In order to surely bring out the above-mentioned effects, it is preferable that the total content of Ti and Hf which are unavoidable impurities is 0.03 mass% or less.

(Other unavoidable impurities: 0.05 mass% or less)
Other unavoidable impurities other than the above-mentioned Cr, Zr, P, Co, Ti, and Hf include B, Al, Fe, Sn, Zn, Si, Mg, Ag, Ca, Te, Mn, Ni, and Sr. , Ba, Sc, Y, V, Nb, Ta, Mo, W, Re, Ru, Os, Se, Rh, Ir, Pd, Pt, Au, Cd, Ga, In, Li, Ge, As, Sb, Tl , Pb, Be, N, H, Hg, Tc, Na, K, Rb, Cs, Po, Bi, lanthanoid, O, S, C and the like. Since these unavoidable impurities may reduce the electrical conductivity and the thermal conductivity, the total amount is preferably 0.05 mass% or less.

(Area ratio of Cr-Zr-P compound: 0.5% or more and 5.0% or less)
When the area ratio of the Cr-Zr-P compound is less than 0.5%, the pinning effect of the crystal grain boundaries by the Cr-Zr-P compound becomes insufficient, and it becomes impossible to suppress the coarsening of the crystal grains. There is a risk. On the other hand, if the area ratio of the Cr-Zr-P compound exceeds 5.0%, the workability may decrease.
From the above, in the present embodiment, the area ratio of the Cr-Zr-P compound is specified to be 0.5% or more and 5.0% or less. The lower limit of the area ratio of the Cr-Zr-P compound is preferably 1.0% or more, and the upper limit of the area ratio of the Cr-Zr-P compound is preferably 3.0% or less.

(Length of the longest side of the acicular or granular Cr-Zr-P compound: 100 μm or less)
When the length of the longest side of the needle-like or granular Cr-Zr-P compound exceeds 100 μm, the pinning effect described above may not be sufficiently exhibited.
From the above, in the present embodiment, the length of the longest side of the Cr-Zr-P compound is specified to be 100 μm or less. The upper limit of the length of the longest side of the Cr-Zr-P compound is preferably 80 μm or less.

(Average crystal grain size after heat treatment of holding at 1000° C. for 30 minutes: 200 μm or less)
By setting the average crystal grain size after heat treatment of holding at 1000° C. for 30 minutes to 200 μm or less, coarsening of crystal grains when used in a high temperature environment of, for example, 500° C. or more is reliably suppressed, and The characteristics will be stable.
From the above, in the present embodiment, the average crystal grain size after the heat treatment of holding at 1000° C. for 30 minutes is set to 200 μm or less.

Next, a method for manufacturing a copper alloy material according to an embodiment of the present invention will be described with reference to the flowchart of FIG.

(Melting/casting process S01)
First, a copper raw material made of oxygen-free copper having a copper purity of 99.99 mass% or more is charged into a carbon crucible and melted using a vacuum melting furnace to obtain a molten copper. Next, the above-mentioned additional elements are added to the obtained molten metal so as to have a predetermined concentration, the components are prepared, and a molten copper alloy is obtained.
Here, as a raw material of Cr, Zr, and P which are additive elements, a high purity one is used, for example, a Cr raw material having a purity of 99.99 mass% or more is used, and a Zr raw material has a purity of 99.95 mass%. % Or more, and the raw material of P has a purity of 99.99 mass% or more. Moreover, Co is added as needed. A mother alloy with Cu may be used as a raw material for Cr, Zr, Co, and P.
Then, the ingot is obtained by pouring the copper alloy molten metal whose components are prepared into a mold.

(Homogenization process step S02)
Next, heat treatment is performed to homogenize the obtained ingot.
Specifically, the ingot is subjected to a homogenization treatment in an air atmosphere under the conditions of 950° C. or higher and 1050° C. or lower for 1 hour or longer.

(Hot working step S03)
Then, the ingot is hot-rolled at a working rate of 50% to 99% within a temperature range of 900°C to 1000°C to obtain a rolled material. The hot working method may be hot forging. Immediately after this hot working, it is cooled by water cooling.

(Solution treatment step S04)
Next, the rolled material obtained in the hot working step S03 is subjected to heat treatment under the conditions of 920° C. or higher and 1050° C. or lower for 0.5 hours or longer and 5 hours or shorter, and solution treatment is performed. The heat treatment is performed, for example, in the atmosphere or an inert gas atmosphere, and the cooling after the heating is performed by water cooling.

The hot working step S03 and the solution treatment step S04 may be performed simultaneously by performing the in-line solution treatment.
Specifically, the ingot is hot-rolled at a working rate of 50% to 99% in a temperature range of 900°C to 1000°C, and immediately cooled by water cooling from a temperature of 920°C to 1050°C. By doing so, solution treatment is performed.

(Aging treatment step S05)
Next, after the solution treatment step S04, an aging treatment is carried out to finely precipitate Cr-based precipitates and Zr-based precipitates to obtain an aging-treated material.
Here, the aging treatment is performed, for example, under the conditions of 400° C. or higher and 530° C. or lower and 0.5 hours or longer and 5 hours or shorter.
The heat treatment method during the aging treatment is not particularly limited, but it is preferably performed in an inert gas atmosphere. The cooling method after the heat treatment is not particularly limited, but water cooling is preferable.
Through such steps, the copper alloy material of this embodiment is manufactured.

According to the copper alloy material according to the present embodiment configured as described above, Cr is 0.1 mass% or more and 1.5 mass% or less, Zr is 0.05 mass% or more and 0.25 mass% or less, and P is 0. Since it has a composition of 005 mass% or more and 0.10 mass% or less and the balance of Cu and unavoidable impurities, it improves strength (hardness) and conductivity by precipitating fine precipitates by aging treatment. be able to.

And in this embodiment, the Cr-Zr-P compound containing Cr, Zr, and P exists, and the area ratio of the Cr-Zr-P compound is 0.5% or more and 5.0% or less in the structure observation. Therefore, even when used in a high temperature environment, the Cr—Zr—P compound does not disappear, and the pinning effect of this Cr—Zr—P compound can suppress the coarsening of crystal grains. ..

In addition, in the present embodiment, the Cr-Zr-P compound has a needle-like or granular form, and the longest side length is 100 μm or less, so that the pinning effect described above is reliably achieved. It is possible to blame.
Further, in the present embodiment, the average crystal grain size after the heat treatment of holding at 1000° C. for 30 minutes is set to 200 μm or less, so that even when used in a high temperature environment of 500° C. or more. , The crystal grains do not become coarse, and the mechanical properties and conductivity are stable.

Further, in the present embodiment, Co is further included in the range of 0.02 mass% or more and 0.15 mass% or less, and the mass ratio [Co]/[P] of Co and P is 0.5≦[Co]/[ P]≦5.0, a CoP compound and a Co ₂ P compound are formed and, together with the above-mentioned Cr—Zr—P compound, a pinning effect of crystal grain boundaries may be exhibited. This makes it possible to reliably suppress coarsening of crystal grains even when used in a high temperature environment. Further, since the mass ratio [Co]/[P] of Co and P is within the range of 0.5≦[Co]/[P]≦5.0, surplus Co and P are in the parent phase. The solid solution can be suppressed, and the decrease in conductivity can be suppressed.
Further, when Co is contained, the total content of Ti and Hf which are inevitable impurities is 0.10 mass% or less, whereby the CoP compound and the Co ₂ P compound can be reliably formed, and the crystal is formed. It becomes possible to effectively exert the pinning effect of the grain boundaries and suppress the coarsening of the crystal grains.

Although the embodiment of the present invention has been described above, the present invention is not limited to this, and can be appropriately modified without departing from the technical idea of the invention.

The results of confirmation experiments conducted to confirm the effects of the present invention will be described below.
A copper raw material made of oxygen-free copper having a purity of 99.99 mass% or more was prepared, charged into a carbon crucible, and melted in a vacuum melting furnace (vacuum degree 10 ⁻² Pa or less) to obtain a copper melt. Various additive elements were added to the obtained molten copper to prepare the component composition shown in Table 1, which was held for 5 minutes, and then the molten copper alloy was poured into a cast iron mold to obtain an ingot. The ingot had a width of about 80 mm, a thickness of about 50 mm, and a length of about 130 mm.
The raw material of Cr, which is an additional element, had a purity of 99.99 mass% or more, and the raw material of Zr had a purity of 99.95 mass% or more.

Next, a homogenizing treatment was performed in the atmosphere at 1000° C. for 1 hour, and then hot rolling was performed. The rolling reduction during hot rolling was set to 80% to obtain a hot rolled material having a width of about 100 mm×a thickness of about 10 mm×a length of about 520 mm.
In the present example, the so-called in-line solution treatment was performed by cooling at the cooling rate shown in Table 1 at the end of hot rolling, which also serves as solution treatment.
Next, an aging treatment was carried out under the condition of 500 (±15)° C. for 3 hours. Thereby, a copper alloy material was obtained.

With respect to the obtained copper alloy material, the structure of the copper alloy material after the aging treatment was observed, and the Cr-Zr-P compound was evaluated. Further, the electrical conductivity and the tensile strength of the copper alloy material after the aging treatment were measured.
Furthermore, the copper alloy material after the aging treatment was subjected to a heat treatment after holding at 1000° C. for 30 minutes, and then the water-cooled copper alloy material was evaluated for the average crystal grain size and the tensile strength.

(Composition analysis)
The component composition of the obtained copper alloy material was measured by ICP-MS analysis. The measurement results are shown in Table 1.

(Cr-Zr-P compound)
A sample having a thickness of the obtained copper alloy material and having a thickness of 10 mm×15 mm was cut out from the center of the plate width, and the surface in the rolling direction (RD direction) was polished and then microetched.
This sample was observed by SEM, and in the SEM-EPMA image (field of view of 250 μm×250 μm), the region having a higher Cr, Zr, P concentration than the parent phase was judged to be the “Cr-Zr-P compound”, and it was determined as the longest The length of the side was measured. Then, the area ratio of the Cu-Zr-P compound was determined by the following formula.
Area ratio=(area occupied by Cr-Zr-P compound)/(250 μm×250 μm)
FIG. 4 shows the SEM-EPMA image of Inventive Example 2, and FIG. 5 shows the SEM-EPMA image of Comparative Example 1. Moreover, an example of the SEM-EPMA image (the visual field of 250 μm×250 μm) when calculating the area ratio of the Cu—Zr—P compound is shown in FIG.

(Average grain size)
A sample having a thickness of the copper alloy material and having a thickness of 10 mm×15 mm was cut out from the center of the plate width, the surface in the rolling direction (RD direction) was polished, and then microetching was performed.
This sample was observed, and the average crystal grain size was measured by the cutting method specified in JIS H0501.

(conductivity)
Using SIGMA TEST D2.068 (probe diameter φ6 mm) manufactured by Nippon Forster Co., the center of the cross section of a 10×15 mm sample was measured three times, and the average value was obtained.

(Tensile strength)
JIS Z 2241 No. 2 test pieces were sampled using the rolling direction as the tensile direction and subjected to the test using a 100 kN tensile tester.

In Comparative Example 1 in which P was not added, a needle-like or granular Cr-Zr-P compound was not formed, so that the tensile strength was significantly reduced after the heat treatment at 1000°C for 30 minutes.
In Comparative Example 2 in which the area ratio of the acicular or granular Cr-Zr-P compound exceeded the range of the present invention, the tensile strength greatly decreased after the heat treatment at 1000°C for 30 minutes.
In Comparative Example 3 in which the Zr content exceeded the range of the present invention, the conductivity was low, and the tensile strength was significantly reduced after the heat treatment at 1000° C. for 30 minutes.
In Comparative Example 4 in which the Co content exceeded the range of the present invention, the conductivity was low.
In Comparative Example 5 in which the area ratio of the acicular or granular Cr—Zr—P compound was less than the range of the present invention, the tensile strength was significantly reduced after the heat treatment at 1000° C. for 30 minutes.

On the other hand, in Inventive Examples 2 , 5 , and 6 , the electrical conductivity was high, and the tensile strength was not significantly reduced even after the heat treatment at 1000° C. for 30 minutes. Further, in Examples 5 and 6 of the present invention in which the crystal grain size after the heat treatment at 1000° C. for 30 minutes was 200 μm or less, the decrease in the tensile strength after the heat treatment at 1000° C. for 30 minutes was further suppressed.

From the above, according to the example of the present invention, even when used in a high temperature environment of 500° C. or higher, coarsening of crystal grains can be suppressed, the characteristics are stable, and the service life is excellent. It was confirmed that a copper alloy material could be provided.

Claims (3)

Cr 0.1 mass% or more and 1.5 mass% or less, Zr 0.05 mass% or more and 0.25 mass% or less, P 0.005 mass% or more and 0.10 mass% or less, Co 0.02 mass% or more and 0.15 mass% It has a composition in which the balance is Cu and unavoidable impurities, and the mass ratio [Co]/[P] of Co and P is 0.5≦[Co]/[P]≦5.0. Is within the range of
There is a Cr-Zr-P compound containing Cr, Zr, and P, and the area ratio of the Cr-Zr-P compound is determined to be within the range of 0.5% or more and 5.0% or less in the structure observation.
The Cr-Zr-P compound has a needle-like or granular form, and has a longest side length of 100 μm or less, which is a copper alloy material. The copper alloy material according to claim 1, which has an average crystal grain size of 200 μm or less after a heat treatment of holding at 1000° C. for 30 minutes. The copper alloy material according to claim 1 or 2, wherein the total content of Ti and Hf which are inevitable impurities is 0.10 mass% or less.