CN113437011A - Rotary vacuum conduction device for high rotating speed - Google Patents

Rotary vacuum conduction device for high rotating speed Download PDF

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Publication number
CN113437011A
CN113437011A CN202110714867.3A CN202110714867A CN113437011A CN 113437011 A CN113437011 A CN 113437011A CN 202110714867 A CN202110714867 A CN 202110714867A CN 113437011 A CN113437011 A CN 113437011A
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China
Prior art keywords
shell
wall
pivot
rotating shaft
sealing ring
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Granted
Application number
CN202110714867.3A
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Chinese (zh)
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CN113437011B (en
Inventor
戚孝峰
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Zhengfeng Semiconductor Technology Suzhou Co ltd
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Zhengfeng Semiconductor Technology Suzhou Co ltd
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Publication of CN113437011B publication Critical patent/CN113437011B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L39/00—Joints or fittings for double-walled or multi-channel pipes or pipe assemblies
    • F16L39/06—Joints or fittings for double-walled or multi-channel pipes or pipe assemblies of the multiline swivel type, e.g. comprising a plurality of axially mounted modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model belongs to the technical field of the abluent field of wafer and specifically relates to a be used for high rotational speed rotatory vacuum conduction device has solved the wafer cleaning process, and water column and high velocity air's switching-over is more troublesome, is difficult to carry out comprehensive cleanness to the wafer is whole, influences the cleaning efficiency of wafer and cleaning performance's problem, and it includes the pivot, the pivot has seted up the blind hole along the center pin, a plurality of through-holes have been seted up along the radius to the pivot, the blind hole communicates with each other with a plurality of the through-hole communicates with each other, the pivot is outer with a plurality of the corresponding position of through-hole winds the center pin of pivot rotates and is provided with the chamber shell of bleeding, bleed the chamber shell with form the chamber of bleeding between the pivot, the first aspirating hole that is used for bleeding is seted up to the chamber shell of bleeding. The wafer cleaning device has the effect of facilitating overall cleaning of the wafer.

Description

Rotary vacuum conduction device for high rotating speed
Technical Field
The present application relates to the field of wafer cleaning, and more particularly, to a rotary vacuum conduction apparatus for high rotational speed.
Background
In the production process of the chip, the wafer needs to be divided into a plurality of crystal grains through processes of crystal bar slicing, grinding and polishing, film sealing, wafer cutting, film expanding and the like, and then the crystal grains are etched and processed into the chip. After the wafer is polished and cut to expand the film, the wafer needs to be cleaned, so that the surface of the wafer is smooth and traceless, and the influence on etching processing of a chip is avoided. In cleaning, a wafer is usually fixed on a wafer cleaning disc in a wafer cleaning apparatus, and water column and high-speed air flow are sprayed to the wafer to clean the dirt on the surface of the wafer.
In view of the above-mentioned related technologies, the inventor believes that there are defects that the reversing of water column and high-speed air flow is troublesome in the wafer cleaning process, it is difficult to clean the whole wafer comprehensively, and the cleaning efficiency and cleaning effect of the wafer are affected.
Disclosure of Invention
In order to facilitate overall cleaning of the wafer, the present application provides a rotary vacuum conduction apparatus for high rotational speeds.
The application provides a rotatory vacuum conduction device for high rotational speed adopts following technical scheme:
the utility model provides a rotatory vacuum conduction device for high rotational speed, includes the pivot, the pivot has seted up the blind hole along the center pin, a plurality of through-holes have been seted up along the radius direction to the pivot, the blind hole with a plurality of the through-hole communicates with each other, the pivot outside with a plurality of the corresponding position of through-hole is wound the center pin rotation of pivot is provided with the chamber shell of bleeding, bleed chamber shell with form the chamber of bleeding between the pivot, the chamber shell of bleeding is seted up and is used for the first aspirating hole of bleeding.
Through adopting above-mentioned technical scheme, made things convenient for and installed pivot to wafer cleaning device in, fixed the wafer on the wafer washs the dish, wasing the dish with the wafer and be connected with the pivot upper end, wash the dish through pivot drive wafer and rotate, with first aspirating hole and evacuation pump intercommunication, made things convenient for to apply suction to the wafer through the evacuation pump, inhale the wafer tightly, improved the stability of being connected between wafer and pivot, made things convenient for the high-speed rotation and the washing of wafer.
Optionally, the air pumping cavity shell comprises an upper sealing ring and a lower sealing ring which are arranged on two sides of the plurality of through holes along the length direction of the rotating shaft, and the inner walls of the upper sealing ring and the lower sealing ring are tightly attached to the outer wall of the rotating shaft; the sealing device is characterized by further comprising an upper shell and a lower shell, wherein the upper shell is tightly attached to the upper sealing ring, the lower shell is tightly attached to the lower sealing ring, and the upper shell is fixedly connected with the lower shell.
By adopting the technical scheme, the installation and the disassembly between the rotating shaft and the air exhaust cavity shell are facilitated, and the replacement of the upper sealing ring or the lower sealing ring after being abraded is facilitated.
Optionally, the tight contact part of the upper sealing ring and the upper shell and the tight contact part of the lower sealing ring and the rotating shaft are both provided with wear-resistant coatings.
By adopting the technical scheme, the wear resistance between the upper sealing ring and the lower sealing ring is improved, the sealing property between the air exhaust cavity shell and the rotating shaft is ensured, the service lives of the upper sealing ring and the lower sealing ring are prolonged, and the long-term use of the wafer cleaning device is facilitated.
Optionally, the wear-resistant coating is made of a boron nitride coating.
By adopting the technical scheme, the wear resistance of the upper sealing ring and the lower sealing ring is ensured, the corrosion resistance and the lubrication degree of the upper sealing ring and the lower sealing ring are improved, cleaning liquid is prevented from entering the air suction cavity by the blind hole to corrode the upper sealing ring and the lower sealing ring when the wafer is cleaned, the lubrication degree of the rotating shaft is improved, and the rotating shaft is convenient to rotate.
Optionally, the inner wall of the upper sealing ring and the inner wall of the lower sealing ring are connected with the outer wall of the rotating shaft in a clamping manner.
Through adopting above-mentioned technical scheme, improved the stability of being connected between upper seal circle, lower seal circle and pivot, prevented that the pivot from breaking away from with upper seal circle or lower seal circle when rotating.
Optionally, the upper housing or the lower housing is provided with a second air exhaust hole for exhausting air.
By adopting the technical scheme, the first air exhaust hole is sealed when the wafer cleaning is suspended, the cleaning liquid flowing into the blind hole and the air exhaust cavity shell is pumped out from the second air exhaust hole, the rotating shaft and the air exhaust cavity shell are convenient to clean, and the cleaning liquid is prevented from flowing into the vacuum pump from the first air exhaust hole to cause the damage of the vacuum pump.
Optionally, go up the shell with be equipped with thrust bearing between the pivot, thrust bearing includes the tight circle of top and the movable circle of below, tight circle inner wall with pivot outer wall interference fit, the movable circle outer wall with go up shell inner wall interference fit, down the shell with be equipped with down the bearing between the pivot, down the bearing inner wall with the pivot outer wall is hugged closely, down the bearing outer wall with the shell inner wall is hugged closely down.
By adopting the technical scheme, the stability of the rotating shaft in rotation in the upper shell and the lower shell is improved, and the wafer is prevented from shifting and damaging in high-speed rotation.
Optionally, a shaft sleeve is arranged between the lower bearing and the lower sealing ring, the inner wall of the shaft sleeve is tightly attached to the outer wall of the rotating shaft, and the upper side edge and the lower side edge of the shaft sleeve are respectively tightly attached to the lower sealing ring and the lower bearing; one side of the lower bearing, which is far away from the shaft sleeve, is provided with a first limiting ring, the inner wall of the first limiting ring is in threaded connection with the outer wall of the rotating shaft, and the first limiting ring is tightly attached to the bottom surface of the lower bearing.
Through adopting above-mentioned technical scheme, made things convenient for and limited in axle sleeve and first spacing ring with lower bearing, prevented that lower bearing breaks away from the normal position when the high-speed rotation of pivot.
Optionally, a second limiting ring is arranged between the upper sealing ring and the thrust bearing, and the inner wall of the second limiting ring is in threaded connection with the outer wall of the rotating shaft.
Through adopting above-mentioned technical scheme, spacing the second spacing ring between thrust bearing and upper seal circle, made things convenient for through the second spacing ring with the pivot spacing mutually with the chamber shell of bleeding, further improved the stability of being connected between pivot and the chamber shell of bleeding, made things convenient for the high-speed rotation of pivot.
Optionally, the diameter of the rotating shaft is gradually reduced from top to bottom along the central shaft.
By adopting the technical scheme, the rotating shaft is conveniently inserted into the upper shell from the upper part, the assembly and disassembly of each structure are facilitated, and the cleaning and the replacement of each structure are facilitated.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the rotating shaft is conveniently installed in the wafer cleaning device, the wafer is fixed on the wafer cleaning disc, the wafer cleaning disc is connected with the upper end of the rotating shaft, the wafer cleaning disc is driven to rotate through the rotating shaft, the first air suction hole is communicated with the vacuum-pumping pump, so that the wafer is conveniently sucked tightly by applying suction to the wafer through the vacuum-pumping pump, the stability of connection between the wafer and the rotating shaft is improved, and the high-speed rotation and cleaning of the wafer are facilitated;
2. the upper sealing ring and the lower sealing ring are connected with the rotating shaft in a clamping manner, the upper shell is tightly attached to the upper sealing ring, the lower shell is tightly attached to the lower sealing ring, and wear-resistant coatings are arranged at the tight attachment positions of the upper shell and the upper sealing ring and between the lower sealing ring and the rotating shaft, so that the connection stability and the sealing property between the air pumping cavity shell and the rotating shaft are improved, the wear resistance of the upper sealing ring and the lower sealing ring is improved when the rotating shaft rotates at a high speed, the high-speed rotation of the rotating shaft is facilitated, and the service life of the rotary vacuum conduction device is prolonged;
3. through set up thrust bearing between last shell and pivot, set up down the bearing between shell and pivot down, improved pivot pivoted stability in the chamber shell of bleeding, made things convenient for the high-speed rotation of pivot, through seting up the second extraction opening on last shell, made things convenient for the wafer to wash after the pause will get into the pivot and the washing liquid suction away in the chamber shell of bleeding through the second extraction opening, prevent that the washing liquid from causing the corruption to the pivot and the chamber shell of bleeding, or the washing liquid from making the evacuation pump damage in first extraction opening gets into the evacuation pump.
Drawings
Fig. 1 is a sectional view of a rotary vacuum conduction apparatus for high rotational speed according to an embodiment of the present application.
Fig. 2 is an exploded view of a rotary vacuum conduction device for high rotational speeds in accordance with an embodiment of the present application.
Description of reference numerals: 1. a rotating shaft; 11. blind holes; 12. a through hole; 2. an air pumping cavity shell; 31. an upper housing; 311. a second air extraction hole; 312. a leakproof sheet; 32. a lower housing; 321. a first air extraction hole; 41. an upper sealing ring; 42. a lower seal ring; 5. a wear-resistant coating; 6. a fixing ring; 7. a thrust bearing; 71. tightening a ring; 72. a loop is movable; 8. a lower bearing; 81. a shaft sleeve; 82. a first limit ring; 9. and a second limit ring.
Detailed Description
The present application is described in further detail below with reference to figures 1-2.
The embodiment of the application discloses a rotary vacuum conduction device for high rotating speed. Referring to fig. 1 and 2, a rotary vacuum conduction device for high rotation speed, which is disposed in a wafer cleaning device, includes a rotating shaft 1, a rotary driving member connected to a lower end of the rotating shaft 1 for driving the rotating shaft 1 to rotate around a central axis, an air pumping chamber housing 2 disposed outside the rotating shaft 1, the air pumping chamber housing 2 including an upper seal ring 41 and a lower seal ring 42, go up shell 31 and lower shell 32, go up sealing washer 41 and lower sealing washer 42 inner wall and all be connected with pivot 1 outer wall block, go up sealing washer 41 and lower sealing washer 42 and be L shape along the cross-section of vertical direction, go up sealing washer 41 and go up shell 31 and hug closely, lower sealing washer 42 is hugged closely with lower shell 32, go up shell 31 and the corresponding annular face of lower shell 32 and hug closely and pass through bolted connection, go up shell 31 bottom surface and still hug closely and be equipped with the leak protection piece 312 that further strengthens the leakproofness between shell 31 and pivot 1, make and take out the chamber of forming sealed aspirating between chamber shell 2 and pivot 1.
Referring to fig. 1 and 2, a first air exhaust hole 321 is formed in the lower casing 32, the first air exhaust hole 321 is communicated with a vacuum pump, a second air exhaust hole 311 is formed in the upper casing 31, the second air exhaust hole 311 is communicated with a water suction pump, four through holes 12 are formed in the rotating shaft 1 between the upper sealing ring 41 and the lower sealing ring 42 along the radius direction of the rotating shaft 1, and a blind hole 11 is formed in the central axis of the rotating shaft 1 and in the four through holes 12 towards the top end of the rotating shaft 1. The wafer cleaning disc is placed above the top end of the rotating shaft 1, the wafer is fixed in the wafer cleaning disc, the second air suction hole 311 is sealed, the vacuum pump applies suction to the wafer cleaning disc through the first air suction hole 321, the through hole 12 and the blind hole 11 in sequence, the wafer and the top end of the rotating shaft 1 are convenient to limit, the rotating shaft 1 is convenient to drive the wafer to rotate under the driving of the rotating driving piece below, and the wafer is convenient to rotate and clean.
Referring to fig. 1 and 2, a lower bearing 8 is arranged between the lower housing 32 and the rotating shaft 1, a thrust bearing 7 is arranged between the upper housing 31 and the rotating shaft 1, the thrust bearing 7 comprises a tightening ring 71 above and a loose ring 72 below, the inner wall of the tightening ring 71 is in interference fit with the outer wall of the rotating shaft 1, the outer wall of the loose ring 72 is in interference fit with the inner wall of the upper housing 31, the stability of connection between the thrust bearing 7 and the upper housing 31 as well as between the thrust bearing 7 and the rotating shaft 1 is ensured, the stability of the rotating shaft 1 during rotation in the air suction cavity shell 2 is ensured, and high-speed rotation of the rotating shaft 1.
Referring to fig. 1 and 2, a shaft sleeve 81 is arranged between the lower bearing 8 and the lower seal ring 42, the upper and lower two side edges of the shaft sleeve 81 along the length direction of the rotating shaft 1 respectively contact with the lower seal ring 42 and the lower bearing 8, the inner wall of the shaft sleeve 81 is tightly attached to the outer wall of the rotating shaft 1, a first limit ring 82 is arranged on one side of the lower bearing 8 away from the shaft sleeve 81, the first limit ring 82 is in threaded connection with the outer wall of the rotating shaft 1, the shaft sleeve 81 and the first limit ring 82 limit the lower bearing 8, and the lower bearing 8 is prevented from being separated from the rotating shaft 1 when the rotating shaft 1 rotates at a high speed.
Referring to fig. 1 and 2, the tight adhesion part of the upper seal ring 41 and the upper shell 31, the tight adhesion part of the lower seal ring 42 and the outer wall of the rotating shaft 1 are both provided with a wear-resistant coating 5, and the wear-resistant coating 5 is made of boron nitride coating in the embodiment of the application, so that when the rotating shaft 1 drives the upper seal ring 41 to rotate around the central shaft, friction occurs between the outer wall of the upper seal ring 41 and the inner wall of the upper shell 31, friction occurs between the inner wall of the lower seal ring 42 and the outer wall of the rotating shaft 1, and the wear-resistant coating 5 improves the wear resistance, the lubrication degree and the corrosion resistance of the upper seal ring 41 and the lower seal ring 42, improves the sealing property of the air-pumping cavity shell 2, facilitates the high-speed rotation of the rotating shaft 1, prolongs the service lives of the upper seal ring 41 and the lower seal ring 42, and prevents the upper seal ring 41 and the lower seal ring 42 from being corroded.
Referring to fig. 1 and 2, the rotating shaft 1 is connected with a second limiting ring 9 in a threaded manner, the second limiting ring 9 is located between the thrust bearing 7 and the upper sealing ring 41, the second limiting ring 9 and the rotating shaft 1 are conveniently limited in the air exhaust cavity shell 2, and the stability of connection between the rotating shaft 1 and the air exhaust cavity shell 2 is further improved.
Referring to fig. 1 and 2, the diameter of the rotating shaft 1 is gradually reduced from the upper end to the lower end, so that the rotating shaft 1 is conveniently installed in the air pumping cavity shell 2 from the upper part of the air pumping cavity shell 2, the upper part of the upper shell 31 is connected with the fixing ring 6 through the bolt, the rotating shaft 1, the thrust bearing 7 and other structures are conveniently limited in the air pumping cavity shell 2, and the installation of the rotating shaft 1, the thrust bearing 7 and other structures is facilitated.
The implementation principle of the rotary vacuum conduction device for high rotating speed in the embodiment of the application is as follows: the thrust bearing 7 is sleeved outside the rotating shaft 1 from the lower part of the rotating shaft 1, the second limiting ring 9 is connected to the outer wall of the rotating shaft 1 from the lower part of the rotating shaft 1 through threads, the second limiting ring 9 is tightly attached to the movable ring 72, the upper sealing ring 41 is clamped and connected to the outer wall of the rotating shaft 1, the upper shell 31 is sleeved outside the rotating shaft 1 from the lower part of the rotating shaft 1, and the upper sealing ring 41 is tightly attached to the upper shell 31.
The leakage-proof sheet 312, the lower sealing ring 42, the shaft sleeve 81 and the lower bearing 8 are sequentially sleeved outside the rotating shaft 1 from the lower part of the rotating shaft 1, the leakage-proof sheet 312 is tightly attached to the upper shell 31, the first limiting ring 82 is connected to the outer wall of the rotating shaft 1 from the lower part of the rotating shaft 1 through threads, the rotating shaft 1 extends into the lower shell 32 from the upper part of the lower shell 32, the lower sealing ring 42 is tightly attached to the lower shell 32, the upper shell 31 is sleeved outside the rotating shaft 1 from the upper part of the rotating shaft 1, the upper shell 31 is connected with the lower shell 32 through bolts, an air suction cavity is formed between the air suction cavity shell 2 and the rotating shaft 1, the fixing ring 6 is connected to the upper shell 31 through bolts, and the rotating shaft 1 is limited to the air suction cavity shell 2.
The lower end of the rotating shaft 1 is connected with a rotating driving piece in the wafer cleaning device, a vacuumizing pump is communicated with a first vacuumizing hole 321, the vacuumizing pump is communicated with a second vacuumizing hole 311, a wafer cleaning disc fixed with a wafer is placed at the upper end of the rotating shaft 1, the vacuumizing pump is started, the wafer cleaning disc is tightly adsorbed at the upper end of the rotating shaft 1, the rotating driving piece is started, the rotating shaft 1 rotates in the air pumping cavity shell 2, the wafer is driven to rotate around the central shaft of the rotating shaft 1, and the wafer is convenient to clean.
After the wafer is cleaned, the first pumping hole 321 is closed, the water pump is started to pump away the water flowing into the rotating shaft 1 and the pumping cavity shell 2, so that the rotating shaft 1 and the pumping cavity shell 2 are convenient to clean, and the rotating shaft 1 and the pumping cavity shell 2 are prevented from being corroded.
The above is a preferred embodiment of the present application, and the scope of protection of the present application is not limited by the above, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (10)

1. A rotary vacuum transducing device for use at high rotational speeds, characterized by: including pivot (1), blind hole (11) have been seted up along the center pin in pivot (1), a plurality of through-holes (12) have been seted up along the radius direction in pivot (1), blind hole (11) and a plurality of through-hole (12) communicate with each other, pivot (1) outer with a plurality of the corresponding position of through-hole (12) is wound the center pin of pivot (1) rotates and is provided with air exhaust chamber shell (2), air exhaust chamber shell (2) with form the chamber of bleeding between pivot (1), first aspirating hole (321) that are used for bleeding are seted up in air exhaust chamber shell (2).
2. A rotary vacuum transducing device for high rotational speeds according to claim 1, wherein: the air exhaust cavity shell (2) comprises an upper sealing ring (41) and a lower sealing ring (42) which are arranged at two sides of the through holes (12) along the length direction of the rotating shaft (1), and the inner wall of the upper sealing ring (41) and the inner wall of the lower sealing ring (42) are tightly attached to the outer wall of the rotating shaft (1); still include last shell (31) and lower shell (32), go up shell (31) with go up sealing washer (41) and hug closely, lower shell (32) with lower sealing washer (42) hug closely, go up shell (31) with lower shell (32) fixed connection.
3. A rotary vacuum transducing device for high rotational speeds according to claim 2, wherein: the upper sealing ring (41) and the close place of the upper shell (31) as well as the close place of the lower sealing ring (42) and the rotating shaft (1) are both provided with wear-resistant coatings (5).
4. A rotary vacuum transducing device for high rotational speeds according to claim 3, characterized in that: the wear-resistant coating (5) is made of boron nitride coating.
5. A rotary vacuum transducing device for high rotational speeds according to claim 2, wherein: the inner wall of the upper sealing ring (41) and the inner wall of the lower sealing ring (42) are clamped and connected with the outer wall of the rotating shaft (1).
6. A rotary vacuum transducing device for high rotational speeds according to claim 2, wherein: the upper shell (31) or the lower shell (32) is provided with a second air extraction hole (311) for extracting air.
7. A rotary vacuum transducing device for high rotational speeds according to claim 2, wherein: go up shell (31) with be equipped with thrust bearing (7) between pivot (1), thrust bearing (7) include tight circle (71) of top and loose circle (72) of below, tight circle (71) inner wall with pivot (1) outer wall interference fit, loose circle (72) outer wall with go up shell (31) inner wall interference fit, down shell (32) with be equipped with down bearing (8) between pivot (1), down bearing (8) inner wall with pivot (1) outer wall is hugged closely, down bearing (8) outer wall with shell (32) inner wall is hugged closely down.
8. A rotary vacuum transducing device for high rotational speeds according to claim 7, wherein: a shaft sleeve (81) is arranged between the lower bearing (8) and the lower sealing ring (42), the inner wall of the shaft sleeve (81) is tightly attached to the outer wall of the rotating shaft (1), and the upper side edge and the lower side edge of the shaft sleeve (81) are respectively tightly attached to the lower sealing ring (42) and the lower bearing (8); one side that lower bearing (8) kept away from axle sleeve (81) is equipped with first spacing ring (82), first spacing ring (82) inner wall with pivot (1) outer wall threaded connection, first spacing ring (82) with lower bearing (8) bottom surface is hugged closely.
9. A rotary vacuum transducing device for high rotational speeds according to claim 7, wherein: go up sealing washer (41) with be equipped with second spacing ring (9) between thrust bearing (7), second spacing ring (9) inner wall with pivot (1) outer wall threaded connection.
10. A rotary vacuum transducing device for high rotational speeds according to claim 1, wherein: the diameter of the rotating shaft (1) is gradually reduced from top to bottom along the central shaft.
CN202110714867.3A 2021-06-25 2021-06-25 Rotary vacuum conduction device for high rotating speed Active CN113437011B (en)

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CN202110714867.3A CN113437011B (en) 2021-06-25 2021-06-25 Rotary vacuum conduction device for high rotating speed

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CN113437011A true CN113437011A (en) 2021-09-24
CN113437011B CN113437011B (en) 2024-05-17

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JP2002050601A (en) * 2000-08-07 2002-02-15 Nippei Toyama Corp Spin cleaning apparatus of semiconductor wafer
KR101168753B1 (en) * 2012-05-15 2012-07-26 김정숙 Spin coater
KR101627849B1 (en) * 2015-01-29 2016-06-08 (주)와이티에스 Vacuum distributing apparatus for display panel cleaning device of turning type
CN207595456U (en) * 2017-10-27 2018-07-10 东莞东聚电子电讯制品有限公司 It is a kind of can spinning vacuum adsorption mechanism
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