CN220290767U - Silicon wafer cleaning mechanism - Google Patents
Silicon wafer cleaning mechanism Download PDFInfo
- Publication number
- CN220290767U CN220290767U CN202321959640.6U CN202321959640U CN220290767U CN 220290767 U CN220290767 U CN 220290767U CN 202321959640 U CN202321959640 U CN 202321959640U CN 220290767 U CN220290767 U CN 220290767U
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- China
- Prior art keywords
- cleaning
- silicon wafer
- sucker
- communicated
- fixedly connected
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- 238000004140 cleaning Methods 0.000 title claims abstract description 128
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 54
- 239000010703 silicon Substances 0.000 title claims abstract description 54
- 238000007664 blowing Methods 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 238000003860 storage Methods 0.000 claims description 10
- 238000007605 air drying Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 3
- 239000000284 extract Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Abstract
The utility model provides a silicon wafer cleaning mechanism, and particularly relates to the technical field of silicon wafer cleaning. The silicon wafer cleaning mechanism comprises a cleaning cylinder and further comprises: the hollow rotating shaft is rotationally connected to the center of the cleaning cylinder; the sucker is fixedly connected to the top end of the hollow rotating shaft; the rotating assembly is fixedly connected to the outer surface of the cleaning cylinder, and the rotating end of the rotating assembly is fixed with the bottom end of the hollow rotating shaft; the cleaning assembly is fixedly connected to the outer surface of the cleaning cylinder, and the output ends of the cleaning assembly face the top and bottom ends of the sucker respectively; the blowing piece is fixedly connected to the outer surface of the cleaning cylinder, and the output ends of the blowing piece face to the top end and the bottom end of the sucker respectively. The utility model is beneficial to increasing the device functionality and the efficiency of cleaning and air drying the silicon wafer.
Description
Technical Field
The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning mechanism.
Background
The silicon rod is cut, ground, polished and the like to obtain the silicon wafer used for manufacturing the semiconductor device. Due to factors such as the silicon wafer itself or the external environment, the process can generate impurities such as particle pollutants or metal ions on the surface of the silicon wafer, and the impurities can pollute the silicon wafer, so that the production yield of semiconductor devices is reduced. Currently, in order to reduce the influence of these impurities on the silicon wafer, cleaning equipment is generally used for cleaning the silicon wafer;
the existing silicon wafer cleaning equipment is single in structure function, often has only a single-side cleaning function on the silicon wafer, and after the silicon wafer is cleaned, the silicon wafer is air-dried by being matched with an air-drying equipment, so that the silicon wafer cleaning mechanism is multiple in equipment and complex in cleaning process of the front side and the back side of the silicon wafer.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a silicon wafer cleaning mechanism.
The silicon wafer cleaning mechanism provided by the utility model comprises: the cleaning barrel further comprises: the hollow rotating shaft is rotationally connected to the center of the cleaning cylinder; the sucker is fixedly connected to the top end of the hollow rotating shaft; the rotating assembly is fixedly connected to the outer surface of the cleaning cylinder, and the rotating end of the rotating assembly is fixed with the bottom end of the hollow rotating shaft; the cleaning assembly is fixedly connected to the outer surface of the cleaning cylinder, and the output ends of the cleaning assembly face the top and bottom ends of the sucker respectively; the blowing piece is fixedly connected to the outer surface of the cleaning cylinder, and the output ends of the blowing piece face to the top end and the bottom end of the sucker respectively.
Preferably, the rotating assembly includes: the motor is fixedly connected to the outer surface of the cleaning cylinder; the driving rotating wheel is fixedly connected to the output end of the motor; the driven rotating wheel is fixedly connected to the bottom end of the hollow rotating shaft; and the belt is wrapped on the outer surfaces of the driven rotating wheel and the driving rotating wheel.
Preferably, the cleaning component is a water pump, the row end of the water pump is respectively communicated with a bottom cleaning pipe and a top cleaning pipe, one end of the bottom cleaning pipe, which is far away from the water pump, is communicated with the inner cavity of the cleaning cylinder towards the bottom end of the sucker, and one end of the top cleaning pipe, which is far away from the water pump, is communicated with the inner cavity of the cleaning cylinder towards the top end of the sucker.
Preferably, the blowing piece is a fan, the air outlet end of the fan is respectively communicated with a bottom air pipe and a top air pipe, one end of the bottom air pipe far away from the fan is communicated with the inner cavity of the cleaning cylinder towards the bottom end of the sucker, and one end of the top air pipe far away from the fan is communicated with the inner cavity of the cleaning cylinder towards the top end of the sucker.
Preferably, the air outlet end of the fan is also communicated with a straight air pipe, and one end of the straight air pipe far away from the fan is communicated with the inner cavity of the cleaning cylinder and the top surface of the sucker to be in the same horizontal line.
Preferably, the bottom end of the cleaning cylinder is fixed with a supporting frame, the inside of the cleaning cylinder is communicated with a drain pipe, the bottom end of the cleaning cylinder is fixed with a water storage cylinder, and the water storage cylinder is communicated with the drain pipe.
Compared with the related art, the silicon wafer cleaning mechanism provided by the utility model has the following beneficial effects: the silicon wafer cleaning mechanism is used for fixedly adsorbing the silicon wafer on the top end of the sucker, then driving the rotating assembly and the cleaning assembly, and driving the hollow rotating shaft to link the sucker and the silicon wafer to rotate by the rotating assembly; the cleaning component extracts cleaning fluid, the extracted cleaning fluid is sprayed to the top and bottom surfaces of the silicon wafer adsorbed and fixed on the top end of the sucker respectively through the output end of the cleaning component, so that double-sided synchronous cleaning is performed, then the blowing component is driven, the cleaning component is stopped being driven, wind power is conveyed to the top and bottom surfaces of the silicon wafer adsorbed and fixed on the top end of the sucker through the output end of the blowing component, the silicon wafer is integrally air-dried by matching with the rotation of the rotating component, and the cleaning and air-drying efficiency of the device on the silicon wafer is increased while the functionality of the device is improved.
Drawings
FIG. 1 is a schematic view of a silicon wafer cleaning mechanism according to a preferred embodiment of the present utility model;
FIG. 2 is a schematic top view of the overall structure of the present utility model;
fig. 3 is a schematic view of the internal structure of the rotating assembly according to the present utility model.
Reference numerals in the drawings:
1. a cleaning cylinder; 2. a rotating assembly; 3. a hollow rotating shaft; 4. a suction cup; 5. a bottom washing pipe; 6. cleaning the assembly; 7. a top washing pipe; 8. an air blowing member; 9. a bottom air pipe; 10. a straight air pipe; 11. a support frame; 12. a top air pipe; 13. a water storage cylinder; 14. a drain pipe; 21. a motor; 22. a driving rotating wheel; 23. a driven rotating wheel; 24. a belt.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. In the present specification, "plurality" means two or more.
In the description of the present specification, the descriptions of the terms "embodiment," "one embodiment," and the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or embodiment is included in at least one embodiment or illustrated embodiment of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same examples or implementations. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or implementations.
Referring to fig. 1-3, an embodiment of the present utility model provides a silicon wafer cleaning mechanism, including: the cleaning cartridge 1 further comprises: the hollow rotating shaft 3 is rotatably connected to the center of the cleaning cylinder 1; the sucker 4 is fixedly connected to the top end of the hollow rotating shaft 3; the rotating assembly 2 is fixedly connected to the outer surface of the cleaning cylinder 1, and the rotating end of the rotating assembly 2 is fixed with the bottom end of the hollow rotating shaft 3; the cleaning component 6 is fixedly connected to the outer surface of the cleaning cylinder 1, and the output ends of the cleaning component 6 face the top and bottom ends of the sucker 4 respectively; the blowing piece 8 is fixedly connected to the outer surface of the cleaning cylinder 1, and the output ends of the blowing piece 8 face the top and bottom ends of the sucker 4 respectively.
It should be noted that: the silicon wafer cleaning mechanism is characterized in that a silicon wafer is fixedly adsorbed on the top end of a sucker 4, then a rotating assembly 2 and a cleaning assembly 6 are driven, and at the moment, the rotating assembly 2 drives a hollow rotating shaft 3 to link the sucker 4 and the silicon wafer to rotate along with the silicon wafer; the cleaning component 6 extracts cleaning liquid, the extracted cleaning liquid is sprayed to the top and bottom surfaces of the silicon wafer adsorbed and fixed at the top end of the sucker 4 respectively through the output end of the cleaning component, so that double-sided synchronous cleaning is performed, then the blowing piece 8 is driven, the cleaning component 6 is stopped being driven, wind power is conveyed to the top and bottom surfaces of the silicon wafer adsorbed and fixed at the top end of the sucker 4 through the output end of the blowing piece 8, and the rotation component 2 is matched for rotating the silicon wafer, so that the whole air drying is performed on the silicon wafer, and the cleaning and air drying efficiency of the device on the silicon wafer is increased while the functionality of the device is improved;
specific: the rotating assembly 2 includes: a motor 21 fixedly connected to the outer surface of the cleaning cylinder 1; the driving rotating wheel 22 is fixedly connected to the output end of the motor 21; the driven rotating wheel 23 is fixedly connected to the bottom end of the hollow rotating shaft 3; the belt 24 is wrapped on the outer surfaces of the driven rotating wheel 23 and the driving rotating wheel 22;
also to be described is: when the rotating assembly 2 is used, the motor 21 drives the driving rotating wheel 22 to rotate in a following way, and then the belt 24 links the driven rotating wheel 23, the hollow rotating shaft 3, the sucker 4 and the silicon wafer to rotate in a following way, so that the cleaning area of the silicon wafer is increased by matching with the cleaning assembly 6 when the cleaning assembly is used; when the air blowing piece 8 is used, the air blowing piece is matched with the air blowing piece to throw out redundant water on the surface of the silicon wafer, so that the air drying efficiency of the air blowing piece is further improved.
Specific: the cleaning component 6 is a water pump, the row end of the water pump is respectively communicated with a bottom cleaning pipe 5 and a top cleaning pipe 7, one end of the bottom cleaning pipe 5 far away from the water pump is communicated with the inner cavity of the cleaning cylinder 1 towards the bottom end of the sucker 4, and one end of the top cleaning pipe 7 far away from the water pump is communicated with the inner cavity of the cleaning cylinder 1 towards the top end of the sucker 4;
also to be described is: when the cleaning component 6 is used, the water pump discharges the extracted cleaning liquid to the bottom cleaning pipe 5 and the top cleaning pipe 7 which are communicated with the water pump respectively, and then the bottom cleaning pipe 5 and the top cleaning pipe 7 spray the cleaning liquid to the top and bottom surfaces of the silicon wafer which are adsorbed and fixed at the top end of the sucker 4 respectively.
Specific: the air blowing piece 8 is a fan, the air outlet end of the fan is respectively communicated with a bottom air pipe 9 and a top air pipe 12, the end, far away from the fan, of the bottom air pipe 9 is communicated with the inner cavity of the cleaning cylinder 1 towards the bottom end of the sucker 4, and the end, far away from the fan, of the top air pipe 12 is communicated with the inner cavity of the cleaning cylinder 1 towards the top end of the sucker 4;
further: the air outlet end of the fan is also communicated with a straight air pipe 10, and the end, far away from the fan, of the straight air pipe 10 is communicated with the inner cavity of the cleaning cylinder 1 and the top surface of the sucker 4 are positioned on the same horizontal line;
also to be described is: when the blowing piece 8 is used, the fan discharges wind power to the two sides of the top and the bottom of the silicon wafer through the bottom air pipe 9 and the top air pipe 12 which are respectively communicated with the blowing piece, and the straight air pipe 10 discharges the wind power to the top surface of the sucker 4 so as to air-dry the sucker 4 of the silicon wafer after being taken.
Referring to fig. 1, a supporting frame 11 is fixed at the bottom end of the cleaning barrel 1, a drain pipe 14 is communicated with the interior of the cleaning barrel 1, a water storage barrel 13 is fixed at the bottom end of the cleaning barrel 1, and the water storage barrel 13 is communicated with the drain pipe 14.
It should be noted that: the support frame 11 is fixed at the bottom end of the cleaning barrel 1 so as to increase the use stability of the cleaning barrel 1, and the water storage barrel 13 is communicated with the drain pipe 14, so that the silicon wafer cleaning liquid separated from the water storage barrel 13 enters the water storage barrel 13 through the drain pipe 14 to be collected in a concentrated manner.
Although the present disclosure is described above, the scope of protection of the present disclosure is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the scope of the utility model.
Claims (6)
1. A silicon wafer cleaning mechanism comprising: the cleaning barrel (1) is characterized by further comprising:
the hollow rotating shaft (3) is rotationally connected to the center of the cleaning cylinder (1);
the sucker (4) is fixedly connected to the top end of the hollow rotating shaft (3);
the rotating assembly (2) is fixedly connected to the outer surface of the cleaning cylinder (1), and the rotating end of the rotating assembly (2) is fixed with the bottom end of the hollow rotating shaft (3);
the cleaning assembly (6) is fixedly connected to the outer surface of the cleaning cylinder (1), and the output ends of the cleaning assembly (6) face the two ends of the top and the bottom of the sucker (4) respectively;
the blowing piece (8) is fixedly connected to the outer surface of the cleaning cylinder (1), and the output ends of the blowing piece (8) face the top and bottom ends of the sucker (4) respectively.
2. The wafer cleaning mechanism according to claim 1, wherein the rotating assembly (2) comprises:
the motor (21) is fixedly connected to the outer surface of the cleaning cylinder (1);
the driving rotating wheel (22) is fixedly connected to the output end of the motor (21);
the driven rotating wheel (23) is fixedly connected to the bottom end of the hollow rotating shaft (3);
and the belt (24) is wrapped on the outer surfaces of the driven rotating wheel (23) and the driving rotating wheel (22).
3. The silicon wafer cleaning mechanism according to claim 1, wherein the cleaning assembly (6) is a water pump, the row ends of the water pump are respectively communicated with a bottom cleaning pipe (5) and a top cleaning pipe (7), one end of the bottom cleaning pipe (5) far away from the water pump is communicated with the inner cavity of the cleaning cylinder (1) towards the bottom end of the sucker (4), and one end of the top cleaning pipe (7) far away from the water pump is communicated with the inner cavity of the cleaning cylinder (1) towards the top end of the sucker (4).
4. The silicon wafer cleaning mechanism according to claim 1, wherein the air blowing piece (8) is a fan, the air outlet end of the fan is respectively communicated with a bottom air pipe (9) and a top air pipe (12), one end of the bottom air pipe (9) far away from the fan is communicated with the inner cavity of the cleaning cylinder (1) towards the bottom end of the sucker (4), and one end of the top air pipe (12) far away from the fan is communicated with the inner cavity of the cleaning cylinder (1) towards the top end of the sucker (4).
5. The silicon wafer cleaning mechanism according to claim 4, wherein the air outlet end of the fan is further communicated with a straight air pipe (10), and the end, far away from the fan, of the straight air pipe (10) is communicated with the inner cavity of the cleaning cylinder (1) and the top surface of the sucker (4) to be in the same horizontal line.
6. The silicon wafer cleaning mechanism according to claim 1, wherein a supporting frame (11) is fixed at the bottom end of the cleaning barrel (1), a drain pipe (14) is communicated with the interior of the cleaning barrel (1), a water storage barrel (13) is fixed at the bottom end of the cleaning barrel (1), and the water storage barrel (13) is communicated with the drain pipe (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321959640.6U CN220290767U (en) | 2023-07-25 | 2023-07-25 | Silicon wafer cleaning mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321959640.6U CN220290767U (en) | 2023-07-25 | 2023-07-25 | Silicon wafer cleaning mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220290767U true CN220290767U (en) | 2024-01-02 |
Family
ID=89339374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321959640.6U Active CN220290767U (en) | 2023-07-25 | 2023-07-25 | Silicon wafer cleaning mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220290767U (en) |
-
2023
- 2023-07-25 CN CN202321959640.6U patent/CN220290767U/en active Active
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