CN219335106U

CN219335106U - Cleaning machine for cleaning double surfaces of wafer

Info

Publication number: CN219335106U
Application number: CN202222544888.8U
Authority: CN
Inventors: 肖真方
Original assignee: Wuhan Zhenxin Semiconductor Equipment Co ltd
Current assignee: Wuhan Zhenxin Semiconductor Equipment Co ltd
Priority date: 2022-09-26
Filing date: 2022-09-26
Publication date: 2023-07-14
Anticipated expiration: 2032-09-26

Abstract

The utility model relates to the technical field of wafers, in particular to a cleaning machine for cleaning two sides of a wafer, which comprises a cleaning box, wherein the lower end of the cleaning box is fixedly connected with a supporting seat, two sides of the cleaning box are fixedly connected with a plurality of supporting parts at equal distances, a plurality of supporting parts are provided with limiting grooves, the wafer is placed in the limiting grooves, two sides of the wafer are provided with connecting cylinders, the inner sides of the connecting cylinders are provided with leak holes, the connecting cylinders are connected with a liquid supply mechanism, and the lower ends of the wafer are provided with rotating mechanisms. The utility model can simultaneously clean the two sides of the wafer, and the wafer is rotated by the rotating mechanism to clean different positions, thereby ensuring the cleaning speed and the cleaning effect.

Description

Cleaning machine for cleaning double surfaces of wafer

Technical Field

The utility model relates to the technical field of wafers, in particular to a cleaning machine for cleaning two surfaces of a wafer.

Background

A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. In the process of continuously processing, forming and polishing a wafer, the surface of the wafer needs to be cleaned due to pollutants generated by contact with various organic matters, particles and metals, so that the surface of the wafer is prevented from being remained with impurities.

Disclosure of Invention

The utility model aims to solve the defect of slow cleaning speed in the prior art, and provides a cleaning machine for cleaning two sides of a wafer.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a two-sided cleaning of wafer is with cleaning machine, includes washs the case, washs case lower extreme fixedly connected with supporting seat, it is a plurality of supporting parts to washs equal distance in case both sides, and is a plurality of all offer the spacing groove on the supporting part, it is a plurality of to place the wafer in the spacing groove, a plurality of the both sides of wafer all are provided with the connecting cylinder, it is a plurality of to the connecting cylinder relatively inboard has all offered the leak opening, and is a plurality of to the connecting cylinder is connected with liquid feed mechanism, a plurality of the wafer lower extreme is provided with rotary mechanism.

Preferably, the liquid supply mechanism comprises a connecting pipe, a connecting pump and a liquid storage cylinder, wherein the liquid storage cylinder is arranged on the supporting seat, one end of the connecting pipe is communicated with a plurality of the connecting cylinders, the other end of the connecting pipe is communicated with the liquid storage cylinder, and the connecting pipe is provided with the connecting pump.

Preferably, the rotating mechanism comprises a motor, a butt ring and a rotating shaft, the motor is arranged on the cleaning box, the rotating shaft is rotationally connected with the cleaning box through a sealing bearing, a plurality of butt rings are fixedly connected to the rotating shaft at equal intervals, the butt rings are in butt joint with the wafer, and the rotating shaft is in transmission connection with an output shaft of the motor.

Preferably, a liquid collecting mechanism is arranged at the lower end of the cleaning box.

Preferably, the liquid collecting mechanism comprises a liquid collecting tank and a discharge valve, wherein the liquid collecting tank is communicated with the cleaning tank, and the discharge valve is communicated with the liquid collecting tank.

The utility model provides a cleaning machine for cleaning double surfaces of wafers, which has the beneficial effects that: through set up the connecting cylinder in the both sides of wafer, when dashing the washing liquid to spout the wafer from the leak, wash the both sides of wafer simultaneously to rotate the wafer through slewing mechanism, wash different positions, also guaranteed abluent effect when having guaranteed the washing speed.

Drawings

FIG. 1 is a schematic diagram of a cleaning machine for cleaning both sides of a wafer according to the present utility model;

FIG. 2 is a side view of a dual-sided wafer cleaning machine according to the present utility model;

fig. 3 is a perspective view of a cleaning machine (hidden in a cleaning tank) for cleaning both sides of a wafer according to the present utility model.

In the figure: the cleaning tank 1, the motor 2, the connecting cylinder 3, the connecting pipe 4, the supporting seat 5, the connecting pump 6, the liquid storage cylinder 7, the collecting tank 8, the supporting part 9, the abutting ring 10, the rotating shaft 11 and the discharge valve 12.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Example 1

Referring to fig. 1-3, a cleaning machine for cleaning two sides of a wafer comprises a cleaning box 1, wherein the lower end of the cleaning box 1 is fixedly connected with a supporting seat 5, two sides of the cleaning box 1 are fixedly connected with a plurality of supporting parts 9 at equal distances, limiting grooves are formed in the supporting parts 9, the wafer is placed in the limiting grooves, connecting cylinders 3 are arranged on two sides of the wafer, leakage holes are formed in the inner sides of the connecting cylinders 3, the connecting cylinders 3 are connected with a liquid supply mechanism, rotating mechanisms are arranged at the lower ends of the wafer, the two sides of the wafer are simultaneously cleaned when cleaning liquid is sprayed onto the wafer from the leakage holes through the connecting cylinders 3, and the wafer is rotated through the rotating mechanisms, so that the cleaning speed is ensured, and the cleaning effect is ensured.

The liquid supply mechanism comprises a connecting pipe 4, a connecting pump 6 and a liquid storage barrel 7, wherein the liquid storage barrel 7 is placed on a supporting seat 5, one end of the connecting pipe 4 is communicated with a plurality of connecting barrels 3, the other end of the connecting pipe is communicated with the liquid storage barrel 7, the connecting pipe 4 is provided with the connecting pump 6, and the connecting pump 6 is used for pumping cleaning liquid to supply liquid to the connecting barrels 3.

The rotating mechanism comprises a motor 2, an abutting ring 10 and a rotating shaft 11, wherein the motor 2 is arranged on a cleaning box 1, the rotating shaft 11 is rotationally connected with the cleaning box 1 through a sealing bearing, a plurality of abutting rings 10 are fixedly connected to the rotating shaft 11 at equal intervals, the abutting rings 10 are abutted to a wafer, the rotating shaft 11 is in transmission connection with an output shaft of the motor 2, the rotating shaft 11 is driven to rotate through the motor 2, the abutting rings 10 are driven to rotate, and the abutting rings 10 and the wafer are abutted to enable the abutting rings 10 to drive the wafer to rotate, so that different positions of the wafer are cleaned.

When the cleaning device is used, the cleaning liquid is pumped through the connecting pump 6, the connecting cylinder 3 is supplied with the cleaning liquid, the cleaning liquid is sprayed onto the wafer from the leak holes, the two sides of the wafer are simultaneously cleaned, meanwhile, the motor 2 rotates to drive the rotating shaft 11 to rotate, so that the abutting ring 10 is driven to rotate, and the abutting ring 10 drives the wafer to rotate at different positions of the wafer to clean.

Example 2

Referring to fig. 1 to 3, as another preferred embodiment of the present utility model, a liquid collecting mechanism is provided at the lower end of the purge bin 1 on the basis of embodiment 1.

The liquid collecting mechanism comprises a collecting liquid tank 8 and a discharge valve 12, wherein the collecting liquid tank 8 is communicated with the cleaning tank 1, the discharge valve 12 is communicated with the collecting liquid tank 8, and the design of the collecting liquid tank 8 is adopted to open the discharge valve 12 so as to collect and discharge cleaning liquid collected by the collecting liquid tank 8.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a two-sided cleaning of wafer is with cleaning machine, includes washs case (1), washs case (1) lower extreme fixedly connected with supporting seat (5), its characterized in that, equal distance in washs case (1) both sides fixedly connected with a plurality of supporting parts (9), a plurality of all seted up the spacing groove on supporting part (9), it is a plurality of to place the wafer in the spacing groove, a plurality of the both sides of wafer all are provided with connecting cylinder (3), a plurality of pairs the leak opening has all been seted up to the relative inboard of connecting cylinder (3), a plurality of pairs connecting cylinder (3) are connected with feed mechanism, a plurality of wafer lower extreme is provided with rotary mechanism.

2. The wafer double-sided cleaning machine according to claim 1, wherein the liquid supply mechanism comprises a connecting pipe (4), a connecting pump (6) and a liquid storage barrel (7), the liquid storage barrel (7) is placed on the supporting seat (5), one end of the connecting pipe (4) is communicated with a plurality of the connecting barrels (3), the other end of the connecting pipe is communicated with the liquid storage barrel (7), and the connecting pipe (4) is provided with the connecting pump (6).

3. The cleaning machine for double-sided cleaning of wafers according to claim 1, characterized in that the rotating mechanism comprises a motor (2), an abutting ring (10) and a rotating shaft (11), the motor (2) is installed on the cleaning box (1), the rotating shaft (11) is rotationally connected with the cleaning box (1) through a sealing bearing, a plurality of abutting rings (10) are fixedly connected to the rotating shaft (11) at equal intervals, the abutting rings (10) are abutted to the wafers, and the rotating shaft (11) is in transmission connection with an output shaft of the motor (2).

4. A cleaning machine for double-sided cleaning of wafers according to any one of claims 1-3, characterized in that the lower end of the cleaning tank (1) is provided with a liquid collecting mechanism.

5. The wafer double-sided cleaning machine according to claim 4, wherein the liquid collecting mechanism comprises a liquid collecting tank (8) and a discharge valve (12), the liquid collecting tank (8) is arranged in communication with the cleaning tank (1), and the discharge valve (12) is arranged in communication with the liquid collecting tank (8).