CN113437011B - Rotary vacuum conduction device for high rotating speed - Google Patents
Rotary vacuum conduction device for high rotating speed Download PDFInfo
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- CN113437011B CN113437011B CN202110714867.3A CN202110714867A CN113437011B CN 113437011 B CN113437011 B CN 113437011B CN 202110714867 A CN202110714867 A CN 202110714867A CN 113437011 B CN113437011 B CN 113437011B
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- 238000007789 sealing Methods 0.000 claims description 79
- 238000000576 coating method Methods 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000005086 pumping Methods 0.000 description 12
- 238000005406 washing Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 230000000740 bleeding effect Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L39/00—Joints or fittings for double-walled or multi-channel pipes or pipe assemblies
- F16L39/06—Joints or fittings for double-walled or multi-channel pipes or pipe assemblies of the multiline swivel type, e.g. comprising a plurality of axially mounted modules
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the field of wafer cleaning, in particular to a rotary vacuum conduction device for high rotation speed, which solves the problems that in the wafer cleaning process, the reversing of water columns and high-speed air flow is troublesome, the whole wafer is difficult to clean, and the cleaning efficiency and the cleaning effect of the wafer are affected. The application has the effect of being convenient for the whole and comprehensive cleaning of the wafer.
Description
Technical Field
The application relates to the field of wafer cleaning, in particular to a rotary vacuum conduction device for high rotation speed.
Background
At present, in the production process of chips, the wafer is divided into a plurality of crystal grains through the processes of crystal bar slicing, grinding and polishing, film sealing, wafer cutting, film expanding and the like, and then the crystal grains are etched and processed into the chips. After the wafer is polished and cut and the film is spread, the wafer is required to be cleaned, the smooth and seamless surface of the wafer is ensured, and the influence on the etching processing of the chip is avoided. During cleaning, a wafer is generally fixed on a wafer cleaning disc in a wafer cleaning device, and water columns and high-speed air flows are sprayed to the wafer to clean dirt on the surface of the wafer.
In view of the above related art, the inventors consider that there is a defect that in the wafer cleaning process, the direction change of the water column and the high-speed air flow is troublesome, and it is difficult to clean the whole wafer, which affects the cleaning efficiency and the cleaning effect of the wafer.
Disclosure of Invention
In order to facilitate overall cleaning of the wafer, the application provides a rotary vacuum conduction device for high rotation speed.
The application provides a rotary vacuum conduction device for high rotation speed, which adopts the following technical scheme:
The utility model provides a rotatory vacuum conduction device for high rotational speed, includes the pivot, the blind hole has been seted up along the center pin to the pivot, a plurality of through-holes have been seted up along the radial direction to the pivot, the blind hole communicates with each other with a plurality of the through-hole, the pivot is outer with a plurality of the corresponding position of through-hole is around the center pin rotation of pivot is provided with the chamber shell that takes out, the chamber shell that takes out with form the chamber that takes out between the pivot, the chamber shell that takes out has seted up the first gas vent that is used for taking out.
Through adopting above-mentioned technical scheme, having made things convenient for in installing the wafer belt cleaning device with the pivot, fixed the wafer on the wafer cleaning dish, with wafer cleaning dish and pivot upper end connection, through pivot drive wafer cleaning dish rotation, with first gas vent and evacuation pump intercommunication, made things convenient for applying the suction to the wafer through the evacuation pump, inhale tightly the wafer, improved the stability of being connected between wafer and the pivot, made things convenient for the high-speed rotation and the washing of wafer.
Optionally, the air extraction cavity shell comprises an upper sealing ring and a lower sealing ring which are arranged at two sides of the through holes along the length direction of the rotating shaft, and the inner wall of the upper sealing ring and the inner wall of the lower sealing ring are clung to the outer wall of the rotating shaft; the sealing device comprises a sealing device, and is characterized by further comprising an upper shell and a lower shell, wherein the upper shell is clung to the upper sealing ring, the lower shell is clung to the lower sealing ring, and the upper shell is fixedly connected with the lower shell.
By adopting the technical scheme, the installation and the disassembly between the rotating shaft and the air extraction cavity shell are convenient, and the replacement of the upper sealing ring or the lower sealing ring after the abrasion is convenient.
Optionally, wear-resistant coatings are respectively arranged at the cling positions of the upper sealing ring and the upper shell and the cling positions of the lower sealing ring and the rotating shaft.
Through adopting above-mentioned technical scheme, improved the wearability between upper seal circle and lower sealing washer, guaranteed the leakproofness between chamber shell of bleeding and the pivot, prolonged the life of upper seal circle and lower sealing washer, made things convenient for wafer belt cleaning device's long-term use.
Optionally, the wear-resistant coating is made of boron nitride paint.
Through adopting above-mentioned technical scheme, when guaranteeing the wearability of upper seal circle, lower sealing washer, improved the anticorrosive performance and the lubricity of upper seal circle, lower sealing washer, the washing liquid when preventing that the wafer washs gets into the chamber of bleeding by the blind hole and leads to upper seal circle, lower sealing washer to be corroded, has improved the lubricity when the pivot rotates, has made things convenient for the rotation of pivot.
Optionally, the inner wall of the upper sealing ring and the inner wall of the lower sealing ring are both in clamping connection with the outer wall of the rotating shaft.
By adopting the technical scheme, the stability of connection among the upper sealing ring, the lower sealing ring and the rotating shaft is improved, and the rotating shaft is prevented from being separated from the upper sealing ring or the lower sealing ring when rotating.
Optionally, the upper shell or the lower shell is provided with a second air pumping hole for pumping air.
Through adopting above-mentioned technical scheme, having made things convenient for the wafer to wash when suspending to seal first bleed hole, follow the second bleed hole and take out the washing liquid that flows in blind hole and bleed the intracavity shell, made things convenient for the clearance of pivot and bleed the intracavity shell, prevent that the washing liquid from leading to the evacuation pump damage in flowing into the evacuation pump from first bleed hole.
Optionally, a thrust bearing is arranged between the upper shell and the rotating shaft, the thrust bearing comprises a tight ring above and a movable ring below, the inner wall of the tight ring is in interference fit with the outer wall of the rotating shaft, the outer wall of the movable ring is in interference fit with the inner wall of the upper shell, a lower bearing is arranged between the lower shell and the rotating shaft, the inner wall of the lower bearing is tightly attached to the outer wall of the rotating shaft, and the outer wall of the lower bearing is tightly attached to the inner wall of the lower shell.
Through adopting above-mentioned technical scheme, improved the pivot at last shell and the stability of lower shell internal rotation time, prevent that the pivot from shifting when high-speed rotation, lead to the wafer to shift impaired.
Optionally, a shaft sleeve is arranged between the lower bearing and the lower sealing ring, the inner wall of the shaft sleeve is clung to the outer wall of the rotating shaft, and the upper side edge and the lower side edge of the shaft sleeve are clung to the lower sealing ring and the lower bearing respectively; one side of the lower bearing, which is far away from the shaft sleeve, is provided with a first limiting ring, the inner wall of the first limiting ring is in threaded connection with the outer wall of the rotating shaft, and the first limiting ring is clung to the bottom surface of the lower bearing.
By adopting the technical scheme, the lower bearing is conveniently limited between the shaft sleeve and the first limiting ring, and the lower bearing is prevented from being separated from the original position when the rotating shaft rotates at a high speed.
Optionally, a second limiting ring is arranged between the upper sealing ring and the thrust bearing, and the inner wall of the second limiting ring is in threaded connection with the outer wall of the rotating shaft.
Through adopting above-mentioned technical scheme, spacing in thrust bearing and last sealing washer with the second spacing ring between, made things convenient for spacing the pivot mutually with the chamber shell of bleeding through the second spacing ring, further improved the stability of being connected between pivot and the chamber shell of bleeding, made things convenient for the high-speed rotation of pivot.
Optionally, the diameter of the rotating shaft gradually decreases from top to bottom along the central axis.
Through adopting above-mentioned technical scheme, made things convenient for in inserting the shell with the pivot from the top, made things convenient for the equipment and the dismantlement of each structure, made things convenient for the cleanness and the change of each structure.
In summary, the present application includes at least one of the following beneficial technical effects:
1. The rotary shaft is conveniently installed in the wafer cleaning device, the wafer is fixed on the wafer cleaning disc, the wafer cleaning disc is connected with the upper end of the rotary shaft, the wafer cleaning disc is driven to rotate through the rotary shaft, the first air suction hole is communicated with the vacuum pump, suction force is conveniently applied to the wafer through the vacuum pump, the wafer is sucked tightly, the stability of connection between the wafer and the rotary shaft is improved, and high-speed rotation and cleaning of the wafer are facilitated;
2. The upper shell is tightly attached to the upper sealing ring, the lower shell is tightly attached to the lower sealing ring, and the wear-resistant coating is arranged between the upper shell and the upper sealing ring and between the lower sealing ring and the rotating shaft, so that the stability and the tightness of the connection between the air extraction cavity shell and the rotating shaft are improved, the wear resistance of the upper sealing ring and the lower sealing ring are improved when the rotating shaft rotates at a high speed, the rotating shaft can rotate at a high speed conveniently, and the service life of the rotary vacuum conduction device is prolonged;
3. Through set up thrust bearing between last shell and pivot, set up the lower bearing down between shell and pivot, improved pivot pivoted stability in the chamber shell of bleeding, made things convenient for the high-speed rotation of pivot, through seting up the second gas vent on last shell, made things convenient for the wafer to wash and pause the back and will get into the pivot and pump down the washing liquid suction in the chamber shell through the second gas vent, prevent that the washing liquid from causing the corruption to pivot and pump down the chamber shell, or the washing liquid from getting into the pump from first gas vent and making the pump damage in the pump.
Drawings
Fig. 1 is a cross-sectional view of a rotary vacuum conduction device for high rotational speeds according to an embodiment of the present application.
Fig. 2 is an exploded view of a rotary vacuum conduction device for high rotational speeds according to an embodiment of the present application.
Reference numerals illustrate: 1. a rotating shaft; 11. a blind hole; 12. a through hole; 2. an air pumping chamber shell; 31. an upper housing; 311. a second air-extracting hole; 312. a leakage preventing sheet; 32. a lower housing; 321. a first air extraction hole; 41. an upper sealing ring; 42. a lower sealing ring; 5. a wear-resistant coating; 6. a fixing ring; 7. a thrust bearing; 71. a tight ring; 72. a movable ring; 8. a lower bearing; 81. a shaft sleeve; 82. a first stop collar; 9. and a second limiting ring.
Detailed Description
The application is described in further detail below with reference to fig. 1-2.
The embodiment of the application discloses a rotary vacuum conduction device for high rotation speed. Referring to fig. 1 and 2, a rotary vacuum conduction device for high rotation speed is arranged in a wafer cleaning device and comprises a rotating shaft 1, the lower end of the rotating shaft 1 is connected with a rotation driving part for driving the rotating shaft 1 to rotate around a central shaft, an air pumping cavity shell 2 is arranged outside the rotating shaft 1, the air pumping cavity shell 2 comprises an upper sealing ring 41, a lower sealing ring 42, an upper shell 31 and a lower shell 32, the inner walls of the upper sealing ring 41 and the lower sealing ring 42 are all connected with the outer wall of the rotating shaft 1 in a clamping manner, the sections of the upper sealing ring 41 and the lower sealing ring 42 along the vertical direction are L-shaped, the upper sealing ring 41 is tightly attached to the upper shell 31, the lower sealing ring 42 is tightly attached to the lower shell 32, the annular surface corresponding to the upper shell 31 is tightly attached to the lower shell 32 and is connected with the lower shell through bolts, and a leakage preventing piece 312 for further enhancing the tightness between the upper shell 31 and the rotating shaft 1 is tightly attached to the bottom surface of the upper shell 31, so that a sealed air pumping cavity is formed between the air pumping cavity shell 2 and the rotating shaft 1.
Referring to fig. 1 and 2, a first air suction hole 321 is formed in the lower casing 32, the first air suction hole 321 is communicated with a vacuum pump, a second air suction hole 311 is formed in the upper casing 31, the second air suction hole 311 is communicated with a water pump, four through holes 12 are formed in the rotating shaft 1 between the upper sealing ring 41 and the lower sealing ring 42 along the radial direction of the rotating shaft 1, and blind holes 11 are formed in the four through holes 12 at the central shaft position of the rotating shaft 1 towards the top end of the rotating shaft 1. Placing the wafer cleaning disc above the top end of the rotating shaft 1, fixing the wafer in the wafer cleaning disc, sealing the second air suction hole 311, and enabling the vacuum pump to apply suction to the wafer cleaning disc through the first air suction hole 321, the through hole 12 and the blind hole 11 in sequence, so that the wafer and the top end of the rotating shaft 1 are convenient to limit, the rotating shaft 1 is convenient to drive the wafer to rotate under the driving of the rotating driving piece at the lower part, and the rotation and cleaning of the wafer are convenient.
Referring to fig. 1 and 2, a lower bearing 8 is arranged between a lower shell 32 and a rotating shaft 1, a thrust bearing 7 is arranged between an upper shell 31 and the rotating shaft 1, the thrust bearing 7 comprises a tightening ring 71 above and a movable ring 72 below, the inner wall of the tightening ring 71 is in interference fit with the outer wall of the rotating shaft 1, the outer wall of the movable ring 72 is in interference fit with the inner wall of the upper shell 31, the stability of connection between the thrust bearing 7 and the upper shell 31 and the rotating shaft 1 is ensured, the stability of the rotating shaft 1 during rotation in an air extraction cavity shell 2 is ensured, and high-speed rotation of the rotating shaft 1 is facilitated.
Referring to fig. 1 and 2, a shaft sleeve 81 is arranged between a lower bearing 8 and a lower sealing ring 42, the upper side edge and the lower side edge of the shaft sleeve 81 along the length direction of a rotating shaft 1 are respectively abutted against the lower sealing ring 42 and the lower bearing 8, the inner wall of the shaft sleeve 81 is tightly attached to the outer wall of the rotating shaft 1, a first limiting ring 82 is arranged on one side, far away from the shaft sleeve 81, of the lower bearing 8, the first limiting ring 82 is in threaded connection with the outer wall of the rotating shaft 1, the shaft sleeve 81 and the first limiting ring 82 limit the lower bearing 8, and the lower bearing 8 is prevented from being separated from the rotating shaft 1 when the rotating shaft 1 rotates at a high speed.
Referring to fig. 1 and 2, the positions of the upper sealing ring 41 and the upper shell 31 and the positions of the lower sealing ring 42 and the outer wall of the rotating shaft 1 are respectively provided with a wear-resistant coating 5, and the wear-resistant coatings 5 are made of boron nitride coating in the embodiment of the application, so that when the rotating shaft 1 drives the upper sealing ring 41 to rotate around the central shaft, friction occurs between the outer wall of the upper sealing ring 41 and the inner wall of the upper shell 31, friction occurs between the inner wall of the lower sealing ring 42 and the outer wall of the rotating shaft 1, the wear-resistant coatings 5 improve the wear resistance, the lubricity and the corrosion resistance of the upper sealing ring 41 and the lower sealing ring 42, the tightness of the air extraction cavity shell 2 is improved, the high-speed rotation of the rotating shaft 1 is facilitated, the service lives of the upper sealing ring 41 and the lower sealing ring 42 are prolonged, and the upper sealing ring 41 and the lower sealing ring 42 are prevented from being corroded.
Referring to fig. 1 and 2, the second limiting ring 9 is in threaded connection with the rotating shaft 1, and the second limiting ring 9 is located between the thrust bearing 7 and the upper sealing ring 41, so that the second limiting ring 9 and the rotating shaft 1 are conveniently limited in the air pumping cavity shell 2, and the stability of connection between the rotating shaft 1 and the air pumping cavity shell 2 is further improved.
Referring to fig. 1 and 2, the diameter of the rotating shaft 1 is gradually reduced from the upper end to the lower end, so that the rotating shaft 1 is conveniently installed in the air extraction cavity shell 2 from the upper side of the air extraction cavity shell 2, and the fixing ring 6 is connected to the upper side of the upper shell 31 through bolts, so that the structures such as the rotating shaft 1 and the thrust bearing 7 are conveniently limited in the air extraction cavity shell 2, and the structures such as the rotating shaft 1 and the thrust bearing 7 are conveniently installed.
The implementation principle of the rotary vacuum conduction device for high rotation speed in the embodiment of the application is as follows: the thrust bearing 7 is sleeved outside the rotating shaft 1 from the lower part of the rotating shaft 1, the second limiting ring 9 is connected to the outer wall of the rotating shaft 1 from the lower part of the rotating shaft 1 in a threaded manner, the second limiting ring 9 is tightly attached to the movable ring 72, the upper sealing ring 41 is connected to the outer wall of the rotating shaft 1 in a clamping manner, the upper shell 31 is sleeved outside the rotating shaft 1 from the lower part of the rotating shaft 1, and the upper sealing ring 41 is tightly attached to the upper shell 31.
The anti-leakage sheet 312, the lower sealing ring 42, the shaft sleeve 81 and the lower bearing 8 are sequentially sleeved outside the rotating shaft 1 from the lower part of the rotating shaft 1, so that the anti-leakage sheet 312 is tightly attached to the upper shell 31, the first limiting ring 82 is connected to the outer wall of the rotating shaft 1 from the lower part of the rotating shaft 1 in a threaded manner, the rotating shaft 1 extends into the lower shell 32 from the upper part of the lower shell 32, the lower sealing ring 42 is tightly attached to the lower shell 32, the upper shell 31 is sleeved outside the rotating shaft 1 from the upper part of the rotating shaft 1, the upper shell 31 is connected with the lower shell 32 in a bolt manner, an air pumping cavity is formed between the air pumping cavity shell 2 and the rotating shaft 1, the fixing ring 6 is connected with the upper shell 31 in a bolt manner, and the rotating shaft 1 is limited in the air pumping cavity shell 2.
The lower end of the rotating shaft 1 is connected with a rotating driving piece in the wafer cleaning device, the vacuumizing pump is communicated with the first vacuumizing hole 321, the water suction pump is communicated with the second vacuumizing hole 311, the wafer cleaning disc fixed with the wafer is placed at the upper end of the rotating shaft 1, the vacuumizing pump is started, the wafer cleaning disc is tightly adsorbed at the upper end of the rotating shaft 1, the rotating driving piece is started, the rotating shaft 1 rotates in the air suction cavity shell 2, the wafer is driven to rotate around the central shaft of the rotating shaft 1, and cleaning of the wafer is facilitated.
After the wafer is cleaned, the first air suction hole 321 is closed, the water suction pump is started, water flowing into the rotating shaft 1 and the air suction cavity shell 2 is sucked away, cleaning of the rotating shaft 1 and the air suction cavity shell 2 is facilitated, and the rotating shaft 1 and the air suction cavity shell 2 are prevented from being corroded.
The above is a preferred embodiment of the present application, and is not intended to limit the scope of the present application in this way, therefore: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (7)
1. A rotary vacuum transfer device for high rotational speeds, characterized by: the novel air suction device comprises a rotating shaft (1), wherein a blind hole (11) is formed in the rotating shaft (1) along a central shaft, a plurality of through holes (12) are formed in the rotating shaft (1) along the radial direction, the blind holes (11) are communicated with the through holes (12), an air suction cavity shell (2) is rotatably arranged at positions, corresponding to the through holes (12), outside the rotating shaft (1) around the central shaft of the rotating shaft (1), an air suction cavity is formed between the air suction cavity shell (2) and the rotating shaft (1), and a first air suction hole (321) for air suction is formed in the air suction cavity shell (2);
The air extraction cavity shell (2) comprises an upper sealing ring (41) and a lower sealing ring (42) which are arranged on two sides of the through holes (12) along the length direction of the rotating shaft (1), and the inner wall of the upper sealing ring (41) and the inner wall of the lower sealing ring (42) are tightly attached to the outer wall of the rotating shaft (1); the sealing device further comprises an upper shell (31) and a lower shell (32), wherein the upper shell (31) is clung to the upper sealing ring (41), the lower shell (32) is clung to the lower sealing ring (42), and the upper shell (31) is fixedly connected with the lower shell (32);
the inner wall of the upper sealing ring (41) and the inner wall of the lower sealing ring (42) are both in clamping connection with the outer wall of the rotating shaft (1);
The upper shell (31) or the lower shell (32) is provided with a second air suction hole (311) for sucking air.
2. A rotary vacuum transfer device for high rotational speeds as claimed in claim 1 wherein: the wear-resistant coating (5) is arranged at the cling position of the upper sealing ring (41) and the upper shell (31) and the cling position of the lower sealing ring (42) and the rotating shaft (1).
3. A rotary vacuum transfer device for high rotational speeds as claimed in claim 2, wherein: the wear-resistant coating (5) is made of boron nitride paint.
4. A rotary vacuum transfer device for high rotational speeds as claimed in claim 1 wherein: the novel rotary shaft is characterized in that a thrust bearing (7) is arranged between the upper shell (31) and the rotary shaft (1), the thrust bearing (7) comprises a tight ring (71) above and a movable ring (72) below, the inner wall of the tight ring (71) is in interference fit with the outer wall of the rotary shaft (1), the outer wall of the movable ring (72) is in interference fit with the inner wall of the upper shell (31), a lower bearing (8) is arranged between the lower shell (32) and the rotary shaft (1), the inner wall of the lower bearing (8) is tightly attached to the outer wall of the rotary shaft (1), and the outer wall of the lower bearing (8) is tightly attached to the inner wall of the lower shell (32).
5. A rotary vacuum transfer device for high rotational speeds as claimed in claim 4 wherein: a shaft sleeve (81) is arranged between the lower bearing (8) and the lower sealing ring (42), the inner wall of the shaft sleeve (81) is tightly attached to the outer wall of the rotating shaft (1), and the upper side edge and the lower side edge of the shaft sleeve (81) are tightly attached to the lower sealing ring (42) and the lower bearing (8) respectively; one side of the lower bearing (8) far away from the shaft sleeve (81) is provided with a first limiting ring (82), the inner wall of the first limiting ring (82) is in threaded connection with the outer wall of the rotating shaft (1), and the first limiting ring (82) is tightly attached to the bottom surface of the lower bearing (8).
6. A rotary vacuum transfer device for high rotational speeds as claimed in claim 4 wherein: a second limiting ring (9) is arranged between the upper sealing ring (41) and the thrust bearing (7), and the inner wall of the second limiting ring (9) is in threaded connection with the outer wall of the rotating shaft (1).
7. A rotary vacuum transfer device for high rotational speeds as claimed in claim 1 wherein: the diameter of the rotating shaft (1) gradually decreases from top to bottom along the central shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110714867.3A CN113437011B (en) | 2021-06-25 | 2021-06-25 | Rotary vacuum conduction device for high rotating speed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110714867.3A CN113437011B (en) | 2021-06-25 | 2021-06-25 | Rotary vacuum conduction device for high rotating speed |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113437011A CN113437011A (en) | 2021-09-24 |
| CN113437011B true CN113437011B (en) | 2024-05-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110714867.3A Active CN113437011B (en) | 2021-06-25 | 2021-06-25 | Rotary vacuum conduction device for high rotating speed |
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| Country | Link |
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| CN (1) | CN113437011B (en) |
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| CN212750845U (en) * | 2020-07-23 | 2021-03-19 | 宁波芯健半导体有限公司 | Wafer fixing device and wafer cleaning system |
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2021
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| JPH1057873A (en) * | 1996-08-20 | 1998-03-03 | Dainippon Screen Mfg Co Ltd | Rotary treating device for substrate |
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| KR101627849B1 (en) * | 2015-01-29 | 2016-06-08 | (주)와이티에스 | Vacuum distributing apparatus for display panel cleaning device of turning type |
| CN207595456U (en) * | 2017-10-27 | 2018-07-10 | 东莞东聚电子电讯制品有限公司 | It is a kind of can spinning vacuum adsorption mechanism |
| CN212750845U (en) * | 2020-07-23 | 2021-03-19 | 宁波芯健半导体有限公司 | Wafer fixing device and wafer cleaning system |
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