CN113411949A - Method for manufacturing PCB (printed Circuit Board) crimping hole - Google Patents
Method for manufacturing PCB (printed Circuit Board) crimping hole Download PDFInfo
- Publication number
- CN113411949A CN113411949A CN202110374900.2A CN202110374900A CN113411949A CN 113411949 A CN113411949 A CN 113411949A CN 202110374900 A CN202110374900 A CN 202110374900A CN 113411949 A CN113411949 A CN 113411949A
- Authority
- CN
- China
- Prior art keywords
- hole
- crimping
- pcb
- center coordinate
- drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002788 crimping Methods 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000005553 drilling Methods 0.000 claims abstract description 48
- 238000007781 pre-processing Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000000151 deposition Methods 0.000 claims description 17
- 230000008021 deposition Effects 0.000 claims description 14
- 238000001465 metallisation Methods 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 230000008054 signal transmission Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application relates to a method for manufacturing a PCB crimping hole. The method comprises the following steps: acquiring a PCB (printed circuit board), wherein the PCB comprises a first hole center coordinate, and the first hole center coordinate is a hole center position coordinate of a crimping hole; determining a second hole center coordinate according to the first hole center coordinate, wherein the second hole center coordinate is the hole center coordinate of the shielding hole; drilling the PCB for one time according to the second hole center coordinate to obtain a first connecting hole which is a shielding hole to be processed; preprocessing the first connecting hole to obtain a second connecting hole, wherein the second connecting hole is a signal shielding hole; and on the basis of the second connecting hole, carrying out secondary drilling on the PCB according to the first hole center coordinate to obtain a crimping hole, wherein the second connecting hole is intersected with the crimping hole. The scheme that this application provided can make the shielding hole have signal shielding function, and then reduces the signal transmission loss in crimping hole, improves the signal transmission efficiency in crimping hole.
Description
Technical Field
The application relates to the technical field of manufacture of crimping holes, in particular to a method for manufacturing a PCB (printed circuit board) crimping hole.
Background
Printed Circuit Boards (PCB) are one of the important components in the electronics industry, and almost every electronic device, as small as electronic watches, calculators, as large as computers, communication electronics, and military weapon systems, uses printed boards; with the development of various technical devices, the quality requirements on printed circuit boards are higher and higher, and especially the signal transmission quality requirements on PCB circuits are higher.
The crimping hole is a special through hole on the PCB, does not need welding, is a hole which can be fixed by directly inserting components, and conducts current through the contact of pins and the hole wall, thereby realizing signal transmission. In actually making PCB crimping hole, the crimping hole design generally is single hole, and the design structure in single hole is simple relatively, does not have the signal shielding function, can not satisfy the requirement of crimping hole high-speed transmission signal gradually, can not reach the effect that the customer required. In the design of a PCB for high-speed signal transmission, the requirement on a crimping hole needs to have certain signal anti-interference capability, and the signal loss is reduced.
Disclosure of Invention
In order to overcome the problems in the related art, the application provides a method for manufacturing a PCB (printed circuit board) crimping hole, and the method reduces the signal transmission loss of the crimping hole and improves the transmission efficiency by arranging a signal shielding hole beside the crimping hole.
The application provides a method for manufacturing a PCB (printed circuit board) crimping hole, which comprises the following steps:
acquiring a PCB (printed circuit board), wherein the PCB comprises a first hole center coordinate, and the first hole center coordinate is a hole center position coordinate of a crimping hole; determining a second hole center coordinate according to the first hole center coordinate, wherein the second hole center coordinate is the hole center coordinate of the shielding hole; drilling the PCB for one time according to the second hole center coordinate to obtain a first connecting hole which is a shielding hole to be processed; preprocessing the first connecting hole to obtain a second connecting hole, wherein the second connecting hole is a signal shielding hole; and on the basis of the second connecting hole, carrying out secondary drilling on the PCB according to the first hole center coordinate to obtain a crimping hole, wherein the second connecting hole is intersected with the crimping hole.
In one implementation, the determining the second hole center coordinate comprises: the linear distance between the second hole center coordinate and the first hole center coordinate is greater than the radius of the crimping hole and smaller than the diameter of the crimping hole; the second hole center coordinates are at least two, and the second hole center coordinates are symmetrical by taking the first hole center coordinates as a center origin.
In one implementation, the PCB board is drilled once, including: the number of the drill holes of one drill hole is equal to the number of the second hole center coordinates; the bore diameter of the primary bore is greater than or equal to 0.35 mm.
In one embodiment, the pre-treating comprises: sequentially carrying out metallization treatment and resin hole plugging treatment on the first connecting hole; the metallization treatment is to plate metal into the hole wall of the first connecting hole; the resin hole plugging process is to fill the first connection hole with epoxy resin without leaving a gap.
In one embodiment, the metallization process comprises: sequentially carrying out copper deposition and electroplating; the copper deposition is used for depositing a layer of chemical thin copper on the wall of the non-conductive hole of the first connecting hole; the electroplating is used to plate a thin layer of other metals or alloys on the surface of the chemically thin copper.
In one embodiment, the method of drilling the PCB board twice according to the first hole center coordinate comprises: sequentially carrying out pre-drilling and direct drilling; the pre-drilling hole adopts a first cutter diameter, the direct drilling hole adopts a second cutter diameter, and the second cutter diameter is larger than the first cutter diameter.
In one implementation, the method, after obtaining the crimp hole, includes: the press contact hole is metallized to obtain a metallized press contact hole.
In one implementation, the PCB includes: the thickness of the PCB printed circuit board is less than or equal to 3.3 mm.
In one implementation, the metallized crimp hole comprises: the diameter of the metallized crimp hole is greater than or equal to 0.31mm and less than or equal to 0.41 mm.
The technical scheme provided by the application can comprise the following beneficial effects:
through set up signal shielding hole by crimping hole, carry out metallization processing and epoxy in proper order to this signal shielding hole and fill out the hole processing to make the shielding hole have signal shielding function, and then reduce the signal transmission loss in crimping hole, improve the signal transmission efficiency in crimping hole.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application, as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the application.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a PCB crimping hole according to an embodiment of the present application;
FIG. 2 is a schematic structural view of a metallized crimp hole according to an embodiment of the present application;
fig. 3 is a schematic structural view of a crimp hole according to an embodiment of the present application.
Detailed Description
Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In view of the above problems, embodiments of the present application provide a method for manufacturing a PCB crimping hole, which can reduce loss of signal transmission in the crimping hole and improve transmission efficiency.
The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a PCB crimping hole according to an embodiment of the present application.
Referring to fig. 1, the technical scheme provided by the present application is a method for manufacturing a PCB crimping hole, and is used for reducing signal transmission loss of the crimping hole, thereby improving signal transmission efficiency of the crimping hole;
one embodiment of the method for manufacturing the PCB crimping hole in the embodiment of the application comprises the following steps:
101. acquiring a PCB (printed circuit board), wherein the PCB comprises a first hole center coordinate, and the first hole center coordinate is a hole center position coordinate of a crimping hole;
in the embodiment of the application, before the method is implemented, the position of the PCB crimping holes is required to be determined, wherein the number of the crimping holes is more than one in the PCB, the number of the crimping holes and the position coordinates are determined according to the designed circuit of the PCB, and the circuit of the PCB is specifically constructed according to the purpose of the PCB; acquiring a PCB (printed Circuit Board), calculating the number of crimping holes according to a design circuit diagram of the PCB, and determining the positions of the crimping holes, wherein the positions of the crimping holes are position coordinates determined by an established plane rectangular coordinate system, and the positions of the crimping holes can be determined by determining the circle center coordinates of the crimping holes due to the fact that the crimping holes are circular through holes; it is noted that the rectangular plane coordinate system can have any point as the origin of the coordinate system, but once the rectangular plane coordinate system is determined, the coordinate positions of all the PCB boards should be determined by the unified rectangular plane coordinate system.
Therefore, in the embodiment, the PCB is obtained, the positions of the crimping holes and the number of the crimping holes are determined according to the design circuit diagram of the PCB, and the hole center position coordinates of each crimping hole are determined by establishing the rectangular plane coordinate system.
102. Determining a second hole center coordinate according to the first hole center coordinate, wherein the second hole center coordinate is the hole center coordinate of the shielding hole;
in the embodiment of the present application, the crimping hole is a single-hole structure, and the single-hole structure does not have a signal shielding function, so that in order to enable the crimping hole to have the signal shielding function, shielding holes with the signal shielding function need to be arranged around the crimping hole, and further, the hole center coordinates of the shielding holes need to be determined; therefore, a second hole center coordinate (i.e., a hole center coordinate of the shielding hole) is determined based on the first hole center coordinate (i.e., a hole center coordinate of the crimping hole), for example, if a distance between the first hole center coordinate and the second hole center coordinate is actually required according to a use requirement of the crimping hole by a customer, the second hole center coordinate is determined according to the requirement of the customer, and if the distance between the first hole center coordinate and the second hole center coordinate is a constant value, the distance between the first hole center coordinate and the second hole center coordinate is determined by the constant value.
In the embodiment of the present application, determining the second hole center coordinate requires consideration of other conditions, because the meaning of the shielding hole is not existed when the distance between the second hole center coordinate and the first hole center coordinate exceeds the signal shielding range of the shielding hole.
Thus, in determining the second hole center coordinate, there are included: the linear distance between the second hole center coordinate and the first hole center coordinate is greater than the radius of the crimping hole and smaller than the diameter of the crimping hole; the number of the second hole center coordinates is at least two, and the second hole center coordinates are symmetrical by taking the first hole center coordinates as a center origin; because the shielding hole is established around the crimping hole, when the radius of crimping hole is greater than the straight-line distance of second hole heart coordinate and first hole heart coordinate, the crimping hole will cover the shielding hole completely, can't play the effect of shielding signal, when the straight-line distance of second hole heart coordinate and first hole heart coordinate is greater than during the diameter of crimping hole, the crimping hole can't with the shielding hole links up, can lead to shielding signal ability weak, not strong, and the effect is poor.
In order to enable the crimping hole to have stronger signal shielding capability, at least 2 shielding holes (i.e. at least two second hole center coordinates) should be arranged beside the crimping hole, and in order to enable the signal shielding capability to be covered more uniformly, the second hole center coordinates should be symmetrical with the first hole center coordinates as a central origin, and the shielding holes corresponding to the second hole center coordinates can uniformly surround the crimping hole.
For example, in an embodiment, two shielding holes are arranged around the crimping hole, that is, 2 second hole center coordinates need to be determined, and the 2 second hole center coordinates are centrosymmetric with the first hole center coordinate as an origin; the aperture of the crimping hole is preset to be 0.45mm, namely the radius is 0.225mm, the distance between the second hole center coordinate and the first hole center coordinate is larger than 0.225mm and smaller than 0.45mm, and in the range, the shielding holes can provide a signal shielding function for the crimping hole.
103. Drilling the PCB for one time according to the second hole center coordinate to obtain a first connecting hole, wherein the first connecting hole is a shielding hole to be processed;
in the embodiment of the application, the second hole center coordinate (i.e. the hole center coordinate of the shielding hole) and the first hole center coordinate (i.e. the hole center coordinate of the crimping hole) are determined, and according to the second hole center coordinate position, a drill is used for drilling to align the second hole center coordinate position, so as to obtain the shielding hole; it is noted that the one-time drilling refers to a drilling method of drilling once by using a drill; considering that the size of the drill bit influences the size of the drilled hole, the undersize of the drilled hole causes undersize of the shielding hole, and further the signal shielding range is shortened, so that the size range of the drill bit needs to be defined, and the size range of the drill bit is greater than or equal to 0.35 mm; in this embodiment, the drill bit is 0.35, the number of the second hole center coordinates is 2, and the 2 hole center coordinates are symmetrical with the first hole center coordinate as a center origin.
104. Preprocessing the first connecting hole to obtain a second connecting hole, wherein the second connecting hole is a signal shielding hole;
in this embodiment, the first connection hole (i.e., the shielding hole to be processed) is a through hole that has not yet had a signal shielding effect, and the second connection hole (i.e., the signal shielding hole) is a through hole that has a signal shielding function; because the first connecting hole has no signal shielding function, the first connecting hole needs to be preprocessed, so that the first connecting hole has the signal shielding capability and is convenient for shielding the signal of the second connecting hole; the pretreatment is to carry out metallization treatment and resin hole plugging treatment on the first connecting hole in sequence; the metallization treatment is to plate metal in the hole wall of the drill hole of the first connecting hole by utilizing chemical reaction, so that the hole wall of the drill hole which does not have the original power-on capacity has the power-on capacity and is used for transmitting signals; the resin hole plugging treatment is to fill the first connection hole by one hundred percent with epoxy resin, so that no gap is left in the hole of the first connection hole, and the resin hole plugging treatment is performed on the first connection hole to prevent the metal layer of the shielding hole (namely the first connection hole) from being stripped by force when the crimping hole is manufactured, so that the shielding hole loses the signal shielding capability.
It is noted that the epoxy resin is a high molecular polymer having the formula (C)11H12O3)nIt is a generic name of a polymer containing more than two epoxy groups in the molecule; is prepared from epoxy chloropropane and bisphenol A or polynaryThe polycondensation product of alcohol can be subjected to ring opening by using various compounds containing active hydrogen due to the chemical activity of the epoxy group, and is cured and crosslinked to form a network structure, so that the epoxy resin is a thermosetting resin.
In this embodiment, when the metallization processing is performed on the first connection hole, the metallization processing includes copper deposition and electroplating, the copper deposition is performed on the first connection hole, and after the copper deposition is completed, the electroplating is performed; the copper deposition method in the prior art includes, for example, firstly, treating the copper deposition substrate with an activating agent to enable the surface of the insulating substrate to adsorb a layer of active metal palladium particles, reducing copper ions in the active metal palladium particles, enabling the active metal palladium particles to become a catalytic layer of the copper ions, continuing the reduction reaction of the copper, finally, metalizing the resin surface of the non-conductor part, and completing the copper deposition; the electroplating refers to a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing an electrolysis principle, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by utilizing an electrolysis effect; the electroplating is mainly used for preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate) and improving the appearance.
105. And on the basis of the second connecting hole, carrying out secondary drilling on the PCB according to the first hole center coordinate to obtain a crimping hole, wherein the second connecting hole is intersected with the crimping hole.
In this embodiment, the second connection hole already has a signal shielding capability, and the shielding hole (i.e., the second connection hole) has already been preprocessed, after the processing of the shielding hole is completed, a drilling position needs to be determined according to the first hole center coordinate (i.e., the hole center coordinate corresponding to the crimping hole), and the PCB board is drilled for a second time, so as to obtain the crimping hole, wherein after the secondary drilling is completed, since the manufacturing of the crimping hole is after the manufacturing of the shielding hole, the shielding hole needs to be outside the crimping hole, so as to enable the crimping hole to have a signal shielding effect, the second connection hole (i.e., the shielding hole) and the crimping hole intersect; for example, the present embodiment is provided with 2 shielding holes having a hole diameter of 0.35mm and a hole diameter of a crimping hole of 0.45, as shown in fig. 3, the 2 shielding holes 302 are located on both sides of the crimping hole 301, and the crimping hole intersects with the 2 shielding holes; the hole centers corresponding to the 2 shielding holes are centrosymmetric by taking the hole center corresponding to the crimping hole as an origin; it is noted that the shielding hole 3 is plated with a metal layer 303 through a pretreatment, and the shielding hole is completely filled with the epoxy resin 304.
The crimping hole manufactured by the method has a signal shielding function, the signal transmission loss of the crimping hole can be reduced, and the signal transmission efficiency is improved.
One embodiment of the method for manufacturing the PCB crimping hole in the embodiment of the application comprises the following steps: the secondary drilling of the PCB board according to the first hole center coordinate of the crimping hole comprises the following steps: sequentially carrying out pre-drilling and direct drilling; the pre-drilling hole adopts a first cutter diameter, the direct drilling hole adopts a second cutter diameter, and the second cutter diameter is larger than the first cutter diameter.
In this embodiment, since the crimping hole is an insert hole, the requirement for the aperture longitude is high, the crimping hole can directly insert the pin of the original, and the current is conducted through the contact between the pin and the hole wall without welding; therefore, pre-drilling and direct drilling are required to be sequentially carried out when the press connection hole is drilled, and the phenomenon that the drilled hole is too large due to direct drilling is avoided, so that the drilled hole does not meet the use requirement; for example, in this embodiment, the diameter of the cutter used for pre-drilling is 0.35mm, the diameter of the cutter used for direct drilling is 0.45mm, the cutter with the diameter of 0.35mm is used to drill the hole center, after the through hole is obtained, the position of the through hole is checked to determine whether the position is accurate, and if the position is accurate, the cutter with the diameter of 0.45mm is used to drill the hole directly; and if the drilling position is inaccurate, adjusting the direct drilling position, determining a new direct drilling position, and then performing direct drilling, so that the drilled crimping hole meets the use requirement.
In practical application, the smaller the tool diameter of the drill is, the easier the coordinate position of the drill hole can be accurately determined; therefore, the cutter diameter (i.e. the first cutter diameter) of the pre-drilled hole is often required to be smaller than the cutter diameter (i.e. the second cutter diameter) of the direct drilling hole, because the cutter diameter of the pre-drilled hole can better determine the position of the hole center of the drilling hole, and the accuracy of fixed-point drilling is relatively high, so that the drilling error position is avoided, and unnecessary waste is caused; furthermore, if the pre-drilling hole is wrong, the pressure welding hole drilled by the direct drilling hole cannot be used.
Fig. 2 is a schematic view of a metallized crimp hole structure shown in an embodiment of the present application.
Referring to fig. 2, one embodiment of making a metallized crimp hole in an embodiment of the present application includes:
performing metallization treatment on the crimping hole to obtain a metallized crimping hole; the diameter of the metallized crimping hole is greater than or equal to 0.31mm and less than or equal to 0.41 mm.
In this embodiment, the crimping hole has no function of transmitting signals by electrifying, so that the crimping hole needs to be metallized, and the metallization refers to sequentially performing copper deposition and electroplating processes, so that a metal layer is attached to the crimping hole to meet the use requirement; firstly, carrying out copper deposition on the crimping hole, and then carrying out electroplating after the copper deposition is finished to obtain a metalized crimping hole; the copper deposition is also called chemical copper plating, is a self-catalyzed oxidation-reduction reaction and is mainly used for exposing copper rings which need to be connected with each other on each layer, improving the hole wall and enhancing the adhesion of electroplated copper; the electroplating refers to a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing an electrolysis principle, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by utilizing an electrolysis effect; the electroplating is mainly used for preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate) and improving the appearance.
It is worth noting that the metalized crimping holes are directly conducted with current through the contact of the pins and the hole walls, and welding is not needed, so that the use of the crimping holes is directly influenced by the aperture size of the metalized crimping holes; therefore, the aperture size of the metalized crimping hole needs to be limited, so that the aperture is within a reasonable use range, and the phenomenon that the aperture is too large or too small due to carelessness when copper deposition and electroplating are carried out is avoided, so that the metalized crimping hole is not suitable for use, and in the embodiment, the aperture of the metalized crimping hole is between 0.31mm and 0.41 mm.
One embodiment of the method for manufacturing the PCB crimping hole in the embodiment of the application comprises the following steps: the thickness of the PCB printed circuit board is less than or equal to 3.3 mm.
In the embodiment, the thickness of the PCB printed circuit board is closely related to the drilling, when the thickness of the PCB is too thick, the difficulty of drilling is increased, the PCB is damaged, and meanwhile, the drilled through hole cannot meet the use requirement; in order to further embody the technical effects brought by the method, the thickness of the PCB is defined in this embodiment, and the thickness of the PCB should be less than or equal to 3.3 mm.
The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. Those skilled in the art should also appreciate that the acts and modules referred to in the specification are not necessarily required in the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application may be sequentially adjusted, combined, and deleted according to actual needs.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of the present application. It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved.
Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (9)
1. A method for manufacturing a PCB (printed Circuit Board) crimping hole is characterized by comprising the following steps:
acquiring a PCB (printed circuit board), wherein the PCB comprises a first hole center coordinate, and the first hole center coordinate is a hole center position coordinate of a crimping hole;
determining a second hole center coordinate according to the first hole center coordinate, wherein the second hole center coordinate is the hole center coordinate of the shielding hole;
drilling the PCB for one time according to the second hole center coordinate to obtain a first connecting hole, wherein the first connecting hole is a shielding hole to be processed;
preprocessing the first connecting hole to obtain a second connecting hole, wherein the second connecting hole is a signal shielding hole;
and on the basis of the second connecting hole, carrying out secondary drilling on the PCB according to the first hole center coordinate to obtain a crimping hole, wherein the second connecting hole is intersected with the crimping hole.
2. The method of claim 1, wherein determining second hole center coordinates comprises:
the linear distance between the second hole center coordinate and the first hole center coordinate is greater than the radius of the crimping hole and smaller than the diameter of the crimping hole;
the second hole center coordinates are at least two, and the second hole center coordinates are symmetrical by taking the first hole center coordinates as a center origin.
3. The method of claim 1, wherein drilling the PCB once comprises:
the number of the drill holes of one drill hole is equal to the number of the second hole center coordinates;
the hole diameter of the primary drilling hole is larger than or equal to 0.35 mm.
4. The method of claim 1, wherein the pre-processing comprises:
sequentially carrying out metallization treatment and resin hole plugging treatment on the first connecting hole;
the metallization treatment is to plate metal into the hole wall of the first connecting hole;
the resin hole plugging treatment is to fill the first connecting hole with epoxy resin without leaving a gap.
5. The method of claim 4, wherein the metallization process comprises:
sequentially carrying out copper deposition and electroplating;
the copper deposition is used for depositing a layer of chemical thin copper on the wall of the non-conductive hole of the first connecting hole;
the electroplating is used to plate a thin layer of other metals or alloys on the surface of the chemically thin copper.
6. The method of claim 1, wherein said secondary drilling of said PCB board according to said first hole center coordinate comprises:
sequentially carrying out pre-drilling and direct drilling;
the pre-drilling hole adopts a first cutter diameter, the direct drilling hole adopts a second cutter diameter, and the second cutter diameter is larger than the first cutter diameter.
7. The method of claim 1, wherein after obtaining the crimp hole, comprising:
and carrying out metallization treatment on the crimping hole to obtain a metallized crimping hole.
8. The method of claim 1, wherein the PCB printed circuit board comprises:
the thickness of the PCB printed circuit board is less than or equal to 3.3 mm.
9. The method of claim 7, wherein the metallizing the crimp hole comprises:
the diameter of the metallized crimping hole is greater than or equal to 0.31mm and less than or equal to 0.41 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110374900.2A CN113411949A (en) | 2021-04-08 | 2021-04-08 | Method for manufacturing PCB (printed Circuit Board) crimping hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110374900.2A CN113411949A (en) | 2021-04-08 | 2021-04-08 | Method for manufacturing PCB (printed Circuit Board) crimping hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113411949A true CN113411949A (en) | 2021-09-17 |
Family
ID=77677836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110374900.2A Pending CN113411949A (en) | 2021-04-08 | 2021-04-08 | Method for manufacturing PCB (printed Circuit Board) crimping hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113411949A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001332327A (en) * | 2000-05-19 | 2001-11-30 | Denso Corp | Terminal connecting method |
| CN103987197A (en) * | 2014-05-26 | 2014-08-13 | 杭州华三通信技术有限公司 | Machining method for PCB and PCB |
| CN204157162U (en) * | 2014-10-17 | 2015-02-11 | 杭州华三通信技术有限公司 | The crimping pore structure of pcb board |
| CN105704928A (en) * | 2016-03-28 | 2016-06-22 | 华为技术有限公司 | Printed circuit board |
| CN108076580A (en) * | 2016-11-15 | 2018-05-25 | 中兴通讯股份有限公司 | The method and device of crosstalk between a kind of isolation signals via |
| CN110730558A (en) * | 2019-09-09 | 2020-01-24 | 华为机器有限公司 | Printed circuit board and communication device |
-
2021
- 2021-04-08 CN CN202110374900.2A patent/CN113411949A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001332327A (en) * | 2000-05-19 | 2001-11-30 | Denso Corp | Terminal connecting method |
| CN103987197A (en) * | 2014-05-26 | 2014-08-13 | 杭州华三通信技术有限公司 | Machining method for PCB and PCB |
| CN204157162U (en) * | 2014-10-17 | 2015-02-11 | 杭州华三通信技术有限公司 | The crimping pore structure of pcb board |
| CN105704928A (en) * | 2016-03-28 | 2016-06-22 | 华为技术有限公司 | Printed circuit board |
| CN108076580A (en) * | 2016-11-15 | 2018-05-25 | 中兴通讯股份有限公司 | The method and device of crosstalk between a kind of isolation signals via |
| CN110730558A (en) * | 2019-09-09 | 2020-01-24 | 华为机器有限公司 | Printed circuit board and communication device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6630743B2 (en) | Copper plated PTH barrels and methods for fabricating | |
| US3357099A (en) | Providing plated through-hole connections with the plating resist extending to the hole edges | |
| CN104185377A (en) | Fine-line PCB manufacturing method | |
| EP1443810A1 (en) | Multilayer backplane with vias for pin connection | |
| AU593887B2 (en) | Process for providing a landless through-hole connection | |
| ATE213510T1 (en) | METHOD FOR METALLIC COATING OF SUBSTRATES | |
| CN111278232B (en) | PCB board multiple surface treatment process | |
| CN113411949A (en) | Method for manufacturing PCB (printed Circuit Board) crimping hole | |
| CN110366318B (en) | Processing technology for reducing distance from V-CUT line to lead | |
| CN111405774A (en) | Circuit board and manufacturing method thereof | |
| TWI533526B (en) | Electroplated metallic ceramic layer for electrical connector terminal | |
| US7341490B2 (en) | Design and method for plating PCI Express (PCIE) edge connector | |
| CN115835531A (en) | Direct blind co-plating method for HDI (high Density interconnection) board | |
| CN112423477B (en) | High-precision stepped press connection hole machining method | |
| CN108738379B (en) | Metallized hole forming method, circuit board manufacturing method and circuit board | |
| CN107889359A (en) | Multi-layer PCB preparation method | |
| CN112004331B (en) | Circuit board and preparation method thereof | |
| CN115915646A (en) | Processing method for thickening conducting hole of circuit board | |
| CN114449763B (en) | Production method for non-metallization of bottom of metallized counter bore | |
| CN113411991B (en) | PCB pattern transfer alignment target method | |
| CN114980500B (en) | PCB structure for double-sided crimping element and manufacturing method thereof | |
| CN211792238U (en) | Circuit board and electronic device | |
| CN116156763A (en) | Control method for manufacturing crimping holes, manufacturing method of circuit board and printed circuit board | |
| CN115474350A (en) | Circuit board surface treatment method and gold finger manufacturing method | |
| CN114980501A (en) | Hole plugging structure, manufacturing method of double-sided compression joint hole and PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210917 |
|
| RJ01 | Rejection of invention patent application after publication |