TWI533526B - Electroplated metallic ceramic layer for electrical connector terminal - Google Patents

Description

Electrical connector coated with metallized ceramic plating

The invention relates to an electrical connector for coating a metallized ceramic plating layer, which is coated with a metallized ceramic on the surface of the electrical connector of the electrical connector by using an electroplating method, so that the electrical connector has high wear resistance. Characteristics such as properties, high corrosion resistance, and low contact resistance to improve the surface properties of electrical connectors.

A metallic ceramic is a ceramic-like co-structure formed by a non-metallic element mixed with a metal element, which has hardness and corrosion resistance of a general ceramic, and also has metallic luster and electrical conductivity. A frequently used method is to form a non-metal element and a metal element together on a substrate surface; metallized ceramics such as titanium nitride (TiN), graphite, tungsten carbide, zirconium carbide, chromium carbide, carbonization, which can be used for electronic components. Hey. Among them, Chromium Carbide (CrC) is a kind of compound which belongs to ceramics and has excellent mechanical strength and chemical stability. It has high hardness, high melting point, good corrosion resistance and wear resistance. Carbonization The chrome coating has been exposed in many industrial applications in the 1990s. For example, Japanese Patent JP2010248595 discloses that a layer of 45-55 wt.% chromium carbide and 30-40 wt.% cobalt (Co) may be coated on the substrate. Good wear resistance can still be obtained under the conditions of use at 1000 ° C; US Pat. No. 6,068,568 discloses that the use of chromium carbide on the chain of the car can increase the wear resistance of the chain; EPO patent EP1878943 discloses the use of diffusion The chromizing method causes the steel to penetrate into the inner layer to contain Cr ₇ C ₃ and the outer layer to contain Cr ₂₃ C ₆ on the chain, which can also increase the mechanical properties of the chain.

In conductive applications, such as the use of spattering, vapor deposition (CVD) or plasma CVD, tungsten carbide, chromium carbide or zirconium carbide is disclosed in U.S. Patent No. 4,925,394. The conductive ceramic layer is sprayed on the conductive substrate to increase the mechanical properties of the connector terminal. However, since the conductivity of the ceramic such as tungsten carbide, chromium carbide or zirconium carbide is not good, the electrical component directly used for the conductive requirement has There is a limitation, and therefore, US Pat. No. 5,516,995 discloses the use of a mixture of silver and chromium carbide to increase the conductivity of the chromium carbide ceramic, but because the amount of silver particles added cannot be too low (eg, 50 to 60%), in addition to the high price, silver and carbonization. The mixture of chromium is also difficult to form; the method of forming metallized ceramics on the substrate is mainly divided into a dry method and a wet method, such as a plasma-assisted chemical deposition method, a vapor deposition method (CVD), a high-energy micro-arc technique, High temperature carbonization, low temperature carbonization, physical vapor deposition (PVD), powder bath, etc.; such as the sputtering method or vapor deposition method of the aforementioned US Pat. No. 4,925,394, the diffusion chromization method of EP 1878943; Taiwan Patent Publication No. TW201101565 discloses the use of powder Bath method, Taiwan patent TW I297365 discloses the use of chromium carbide powder material to produce chromium carbide-based alloy material by sputtering method; Chinese patent application number CN201110064876.9 The use of the spray method, etc.; however, these dry methods are expensive to manufacture and difficult to mass produce, while the spray method and the powder bath method are relatively inexpensive, but need to be heated, which may change the mechanical properties of the substrate and is difficult to apply. Precision and high mechanical performance components (such as the terminals of the connector). In the wet method, Chinese Patent Application No. CN200810142997.9 discloses the use of a trivalent chromium plating method to produce a chromium-carbon nanotube composite coating having high hardness, abrasion resistance and corrosion resistance, but the conductivity of the coating is poor and cannot be For electronic components; Chinese Patent Application No. CN201220185401.5 and CN201210114284.8 disclose the use of hexavalent chromium plating method to form an amorphous chromium carbide alloy coating on the piston ring, but because the carbon content is too low, the conductivity is poor, and can not be used. Electronic component; Taiwan Patent Publication No. TW201339373 discloses a method of electroplating using trivalent chromium to form a chromium carbide plating layer on a conductive substrate, and the conductivity of the chromium carbide plating layer can be improved by a higher carbon content. The specific resistance is 120 mΩ or less, which is suitable for use in electrical components, and because of the method of electroplating, the temperature of less than 100 ° C can be used so that the substrate does not change its mechanical strength, and can be mass-produced at a low cost.

Connectors are used in a wide range of applications, especially on 3C products, home appliances or electrical connectors used in automotive power connections. The electrical connector provides a mechanical connection between the detachable interface and the electrical connection to connect the two secondary electronic systems. Typically, but not by way of limitation, the connector may be a male connector and a female connector, such as a terminal using a mechanical spring, which is biased by the spring force to bias the terminal A force is generated on the touch of the contact such that a metallic contact is made between the joint faces of the contacts to create an electrical connection. Usually, the terminal is made of copper, copper alloy, steel or the like as a substrate for the purpose of preventing corrosion or increasing conductivity, so that the contacts maintain good electrical conduction, and a plating layer such as tin is often plated on the substrate. Nickel, precious metal, gold, silver, gold-nickel alloy, palladium alloy (palladium to nickel ratio of 80/20% or 60/40%), palladium phosphorus, palladium boron, selenium (Se) or thallium (Tal) Etc., or first plating an interposer on the substrate, and then plating a layer of plating, while the interposer is mainly tin, nickel or its alloy. The interposer is intended to reduce pore corrosion, provide a coating for transferring corrosion objects, Limiting the diffusion of the copper substrate to the surface and improving the durability of the coating.

Due to the wide range of applications, there are two main types of power transmission and signal transmission. The power transmission is mainly for electrical conduction, while the signal transmission is divided into low frequency analog signals and high frequency digital signals, and digital signals are transmitted. The speed is much faster than the analog signal. Some digital signals are transmitted in the connector at a speed close to one hundredth of a second, so the conductivity and characteristic impedance of the connector are quite important. In order to make the connector terminals have good electrical conductivity and to avoid the occurrence of oxides and reduce the conduction of the contacts (the oxide causes the contact resistance to increase), it is necessary to coat a layer of plating, as described above, the precious metal plating ( Gold, gold-nickel alloy, palladium alloy, etc.) have excellent electrical and thermal conductivity, and have good corrosion resistance in almost any environment. They are commonly used in connectors with high conductivity and corrosion resistance; The requirements are divided into soft gold, hard gold (gold and cobalt ratio of 99.9/0.1%), palladium, gold-palladium alloy (for example, gold/palladium ratio of 80/20%) and palladium-nickel alloy (eg, palladium-nickel ratio). For 80/20%) and so on.

Please refer to Figure 1. Figure 1 shows the international gold price chart for ten years. In the past ten years, the price of precious metals has become higher and higher. For example, the price of gold has soared from $270 per ounce in 2000 to $1,850 per ounce in 2011. The highest, and by 2013, it fell to $1,300 per ounce, and its average price could be calculated at $1,470 per ounce, making the connector more expensive. Since the noble metal plating of the connector (especially the gold plating) can maintain low contact resistance, corrosion resistance, wear resistance, good electrical conductivity, and high temperature resistance, conventional connector electrical connectors for high conduction and corrosion resistance are often plated. A layer of gold plating, or a layer of gold plating on the pin connector of the board, commonly known as the Gold Finger. However, the main components of gold-plated baths for electroplating gold are potassium cyanide and sodium cyanide. Cyanide is highly toxic and is currently banned in several major countries; and the cost of gold plating is originally high. Plus gold prices soared in recent years, reducing gold plating The thickness or finding alternatives has been a fairly important trend.

Moreover, the aforementioned Taiwan Patent Publication No. TW201339373 discloses a method of electroplating using trivalent chromium, which can be plated on a substrate to form a chromium carbide cermet layer for use in applications requiring high precision, high hardness, wear resistance, and good electrical conductivity. Workpieces and the like; however, the prior art discloses that the linearly polarized corrosion current of the chromium carbide cermet layer can reach a corrosion resistance of 1×10 ^-5 ampere or less, and there is still a lack of an industrial corrosion-resistant and wear-resistant solution. And use this technology to convert into industrial applications; therefore, based on this method, it is possible to continue to develop connector electrical connectors that can meet the high corrosion resistance required by environmental corrosion, have low contact resistance values, and are highly wear-resistant, and can replace The connector electrical connector of the precious metal plating is an urgent problem to be solved.

In view of the above problems of the prior art, one of the main objects of the present invention is to provide an electrical connector covering a metallized ceramic plating layer, the electrical connector being composed of a connector housing and one or more The electrical connector is composed of, or simplified, a connector body and N electrical connectors, and N is greater than or equal to 1.

The electrical contact (contact or terminal) is coated on a substrate with a metallized ceramic plating layer; the material of the substrate of the electrical connector may be a conductive material or a non-conductive material to be coated with a conductive layer by electroplating or electroless plating: 1) Conductive material: one or a combination of conductive ceramics, iron, stainless steel, copper, chromium, tin, nickel, silver, gold or alloys thereof; (2) non-conductive material: one of plastic, ceramic and glass Or a combination thereof, and coating a conductive layer by electroplating or electroless plating, the conductive layer being selected from the group consisting of iron, copper, chromium, tin, nickel, silver, gold or alloys thereof.

The metallized ceramic plating layer is formed by a wet method (such as electroplating method), and a metallized ceramic is coated on the substrate of the electrical connector. Although different metallized ceramics may be used, it is preferred in the present invention. In an embodiment, in order to achieve high corrosion resistance and good electrical conductivity, the metallized ceramic plating layer is a metallized ceramic composed of a Chromium Carbide base (CrC base), and an amorphous phase of chromium carbide is formed by electroplating. An amorphous type microstructure of CrC adheres to all or a part of the surface of the substrate; the composition thereof comprises chromium, carbon and oxygen, and is mainly composed of chromium and carbon, and the amorphous phase structure includes at least six One or a combination of carbon trioxide (Cr ₂₃ C ₆ ), chromium trichrome (Cr ₃ C ₂ ) or triple carbon trioxide (Cr ₇ C ₃ ), in order to achieve high corrosion resistance, wear resistance and Good conductivity, preferably carbon content is greater than 25 At%, where At% is atomic percent.

In terms of electrical conductivity, when the average thickness of the metallized ceramic plating layer of the chromium carbide-based component ranges from 0.5 μm to 35 μm, the contact resistance is 60 mΩ or less, wherein the contact resistance value is 10 The resistance value under g load.

In the corrosion resistance, when the average thickness of the metallized ceramic plating layer is 0.5~3μm, the electrical connection member is covered with the metallized ceramic plating layer, and the environmental corrosion resistance is exposed to the salt spray for more than 300 hours without Corrosion phenomenon, or sulfur corrosion resistance, is not corrosive for more than 72 hours in exposure to sulfur dioxide mist; or acid gas corrosion is corrosion-free for exposure to sulfurous acid mist for more than 36 hours; when the average thickness of the metallized ceramic plating layer is 3 ~8μm, the electrical connector is covered with the metallized ceramic plating part of the environmental corrosion resistance for exposure to salt spray for more than 500 hours without corrosion, or sulfur corrosion resistance for exposure to sulfur dioxide mist for more than 128 hours without corrosion Phenomenon, or acid and acid corrosion is no corrosion caused by exposure to sulfurous acid mist for more than 72 hours; when the average thickness of the metallized ceramic plating layer is greater than 8 μm, the electrical connector is covered with the metallized ceramic plating portion Environmental corrosion is no corrosion caused by exposure to salt spray for more than 1000 hours, or sulfur corrosion resistance is exposed to sulfur dioxide for 300 hours. No corrosion phenomenon, or acid and gas corrosion resistance for exposure to sulfurous acid mist for more than 128 hours without corrosion; wherein exposure to salt spray is tested according to ASTM B117 test specification, exposure to sulfur dioxide mist is tested according to ASTM B799 test specification, exposure It is tested in the sulfurous acid mist according to the ASTM B799 test specification.

The surface hardness of the metallized ceramic plating layer is 800 Hv or more, and for the preferred embodiment, it is 1285 Hv, wherein the surface hardness is tested according to ASTM 578 at a loading pressure of 100 gf.

The metallized ceramic plating layer has an average coefficient of friction of less than 0.9, preferably 0.3 to 0.6 for a preferred embodiment, or a wear loss of about 0.1 to 1 mg. Among them, the friction coefficient is tested according to ASTM D 3702-94 with a load of 300 Newtons. The wear loss was tested in accordance with ASTM D 3702-94.

The adhesion of the metallized ceramic plating layer is within 1% in terms of adhesion characteristics, and the adhesion is tested in accordance with ASTM D3359.

In the high frequency loss characteristic, an electrical connector is coated with a metallized ceramic plating layer, wherein the electrical connection has a contact loss of less than 1 dB at a transmission frequency of up to about 10 GHz.

Another main object of the present invention is to provide an electrical connector coated with a metallized ceramic plating layer, the electrical connector being composed of a connector body and N electrical connectors; the electrical connector is a base The material is first coated with an interposer, and the metallization ceramic plating layer is further coated on the interposer, that is, the electrical connector further comprises an interposer between the substrate and the metallized ceramic plating layer.

Wherein, the material of the substrate of the electrical connector may be a conductive material or a non-conductive material, as described above. The interposer is coated on the surface of the substrate by electroless plating or electroplating, dry vapor deposition (CVD) or physical vapor deposition (PVD), and other non-limiting deposition methods or coatings. Formed by the method, the material of the interposer is selected from the group consisting of iron, copper, nickel, nickel phosphorus, tin, silver, gold, palladium, cobalt, precious metals or alloys thereof; or non-conductive materials may be selected on the non-conductive material. Coating iron, copper, nickel, nickel phosphorus, tin, silver, gold, palladium, cobalt, noble metal or alloy thereof; and then coating the metallized ceramic plating layer on the interposer, the metallized ceramic plating layer is coated on All or part of the intermediation layer.

For different applications, the interposer is two or more layers.

Thereby, the electrical connector having the interposer has the aforementioned electrical conductivity, environmental corrosion resistance, sulfur corrosion resistance, acid corrosion resistance, abrasion resistance, adhesion, and high frequency of the electrical connector of the metallized ceramic plating layer. The loss characteristics are the same as described above and will not be repeated here.

In view of the above, an electrical connector coated with a metallized ceramic plating layer according to the present invention may have one or more of the following advantages:

(1) The present invention uses the electroplating method disclosed in Taiwan Patent Publication No. TW201339373 to successfully form a metallized ceramic plating layer on a substrate by forming a chromium carbide-based component, and improves the conventional technique by high temperature permeation method, vapor deposition method. Other dry methods such as (CVD) or physical vapor deposition (PVD) can be used to coat metallized ceramics on the electrical connectors of electrical connectors. In addition to greatly reducing the cost, high-temperature coatings are also avoided. Environment causes electrical connectors to anneal and lose mechanical properties The shortcomings of ability.

(2) The present invention improves the electroplating method disclosed in Taiwan Patent Publication No. TW201339373, and adjusts the process and formulation thereof so that the cermet plating layer formed by electroplating on the substrate improves conductivity, corrosion resistance, high frequency loss and adhesion, In order to meet the functional characteristics of the electrical connector, it can replace the conventional gold-plated (precious metal) electrical connector, in addition to greatly reducing the cost, and also avoid the environment from cyanide poisoning.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

1‧‧‧Electrical connector

2, 21, 22‧‧‧ connector body

3, 3A, 3B, 3N‧‧‧ electrical connectors

301‧‧‧Electrical connector plug-in

302‧‧‧Electrical connector socket

31‧‧‧Substrate

32‧‧‧Intermediary

33‧‧‧Metalized ceramic plating

331‧‧‧carbon elements

332‧‧‧Chromium

4‧‧‧PCB board

41‧‧‧Gold Fingers

5‧‧‧welding feet

S1~S5‧‧‧ method steps

1 is a schematic diagram of an international gold price chart for ten years; FIG. 2 is a step view of a method for fabricating an electrical connector of a metallized ceramic plating layer of the present invention; and FIG. 3 is a cladding metallized ceramic of the present invention; A schematic view of a first embodiment of an electrical connector of a plating layer; and FIG. 4A is a photograph of a surface topography of a metallized ceramic plating layer of an electrical connector coated with a metallized ceramic plating layer according to a first embodiment of the present invention; The compositional analysis map of the metallized ceramic plating layer of the electrical connector of the metallized ceramic plating layer according to the first embodiment of the present invention; FIG. 4C is the electricity of the metallized ceramic plating layer of the first embodiment of the present invention; Photograph of the cross-section of the metallized ceramic plating layer of the connector; FIG. 4D is a graph showing the relationship between the wear distance and the coefficient of friction of the wear test of the coated metallized ceramic layer according to the first embodiment of the present invention; The figure is a surface photograph of the coated metallized ceramic plating layer after the abrasion test of the first embodiment of the present invention; and FIG. 5 is a schematic view showing the second embodiment of the electrical connector of the coated metallized ceramic plating layer of the present invention; The picture shows the drape of the present invention 6 metallized ceramic plating layer is electrically connected to a third embodiment of the embodiment shown 7 is a schematic view of a fourth embodiment of an electrical connector for coating a metallized ceramic plating layer of the present invention; FIG. 8 is a fifth embodiment of an electrical connector for coating a metallized ceramic plating layer of the present invention; FIG. 9 is a schematic view showing a sixth embodiment of an electrical connector for coating a metallized ceramic plating layer according to the present invention; and FIG. 10 is a seventh embodiment of an electrical connector for coating a metallized ceramic plating layer according to the present invention; 1A is a schematic view of an electrical connector insert of an eighth embodiment of an electrical connector of a metallized ceramic plating layer of the present invention; and FIG. 11B is an electrical connection of the coated metallized ceramic plating layer of the present invention; FIG. 12A is a schematic diagram of an electrical connector insert of a ninth embodiment of an electrical connector of a metallized ceramic plating layer according to the present invention; FIG. 12B is a schematic view of the electrical connector of the ninth embodiment of the present invention; A schematic diagram of an electrical connector socket of a ninth embodiment of an electrical connector overlying a metallized ceramic plating.

The above and other technical contents, features and advantages of the present invention will be apparent from the following description of the drawings and the appended claims.

Please refer to FIG. 2, which is a step diagram of a method for fabricating an electrical connector for a metallized ceramic plating layer according to the present invention, which is illustrated as follows:

Step S1: providing an electrical connector to be used for the electrical connector, the electrical connector is made of a substrate, and the electrical connector is designed and manufactured according to the purpose of the need, and is usually manufactured by a large number of production systems. Or further heat-treated to increase its mechanical properties; in practical industrial applications, the tape of the electrical connector is often made, and is continuously punched on a relatively long metal plate (corresponding to the substrate of the electrical connector). And making a continuous plurality of electrical connectors;

Step S21: determining which material is the material of the connecting member, and determining whether it is a guide Electrical material; for different substrate materials, in steps S31 and S32 should be adjusted different operating conditions; if the substrate of the connector is non-conductive material, proceed to step S22;

Step S22: if the substrate of the connecting member is a non-conductive material, first coating a conductive layer by electroplating or electroless plating, so that the substrate of the connecting member is electrically conductive, and the conductive material may be coated with iron, copper, chromium or tin. Nickel, silver, gold or alloys thereof; although the dry method can also coat the conductive layer, in practical applications, the dry method usually uses high temperature, which causes the joint to be damaged by heat, so the wet method is still used. Or electroless plating;

Step S23: For different applications, after step S1, one or more interposer layers may be directly coated, and the material of the interposer may be: iron, copper, nickel, nickel phosphorus, tin, silver, gold, palladium, cobalt. , precious metal or alloy thereof; or non-conductive material coated with iron, copper, nickel, nickel phosphorus, tin, silver, gold, palladium, cobalt, precious metals or alloys thereof; the main purpose of covering the interposer is to increase the electrical connection Corrosion resistance, electrical properties or better adhesion of the outermost plating layer.

Step S31: according to the substrate (or the interposer) of the different electrical connectors, the degreasing solution, the pickling solution, and the trivalent chromium plating bath of the electroplating process of step S32 are prepared; the purpose of the degreasing solution is to remove the grease on the surface of the electrical connector. An organic solvent, a neutral degreaser, an alkaline degreaser or an acidic degreaser may be used; the purpose of the pickling solution is to remove oxides on the surface of the electrical connector and activate the surface of the electrical connector, and dilute sulfuric acid or thinner may be used. Hydrochloric acid, dilute nitric acid, dilute phosphoric acid or a mixed acid solution thereof; the trivalent chromium electroplating bath is further described as follows;

Step S32: forming a metallized ceramic plating layer on the electrical connector (or the material of the electrical connector) by electroplating. Since the above-mentioned trivalent chromium plating bath is used, a chromium carbide group can be formed under appropriate operating conditions. Metallized ceramics; before electroplating, for parts that are not plated with metallized ceramics, such as parts for assembly or soldering, tools such as anti-painting, anti-plating, anti-plating, etc. The part of the ceramic is shaded first. In the subsequent embodiments, after the analysis, the formed metallized ceramic plating layer is adhered to the amorphous phase of the chromium carbide structure, and the metallized ceramic plating layer component is composed of the chromium element, the carbon element, the oxygen element, etc. Composition, and the chromium carbide structure of the amorphous phase is composed of chromium and carbon, and at least includes chromium trichloride (Cr ₂₃ C ₆ ), chromium trichrome (Cr ₃ C ₂ ) or three carbonized seven chromium. One or a combination of (Cr ₇ C ₃ ), in order to meet the characteristics of corrosion resistance and electrical conductivity of the electrical connector, it is preferred that the metallized ceramic plating layer has a carbon element content of more than 25 At%.

Step S41: preparing a connector body, the connector body is usually made of engineering plastic, metal, ceramic or a combination thereof, and can accommodate N electrical connectors according to the structure;

Step S42: assembling N electrical connectors coated with a metallized ceramic plating layer to the connector body, or further connecting or soldering the wires to the electrical connectors;

Step S5: Thus, an electrical connector covering the metallized ceramic plating layer can be formed.

The electrical connector for coating the metallized ceramic plating layer of the present invention, the trivalent chromium plating bath (prepared in step S31) used for electroplating in the foregoing step S32 is mainly composed of a trivalent chromium salt, a carbon source complexing agent and pH adjustment. The aqueous solution formed by the agent; the source of the trivalent chromium salt may be a water-soluble salt such as a sulfuric acid trivalent chromium salt, a chloric acid trivalent chromium salt or another acid trivalent chromium salt; a sulfuric acid trivalent chromium salt such as sulfuric acid. One or a combination of chromium, ammonium sulphate, potassium sulphate, or the like, chloric acid is a trivalent chromium salt such as chromium chloride, chromium perchlorate or the like; the carbon source complexing agent is formic acid, ammonium formate, sodium formate , one of acetic acid, ammonium acetate, sodium acetate or a combination thereof to provide a carbon source and increase chelation; the purpose of the pH adjuster is to make the solution have a buffer function, and the commonly used pH adjuster 7 is an organic salt. Halogen salts such as boric acid, ammonium sulfate, ammonium chloride, ammonium bromide, borate, chloride, bromide, ammonium and the like.

Generally, chromic acid (hexavalent chromium, Cr ⁶⁺ ) is used in electroplating baths containing chromium ions, but hexavalent chromium of chromic acid is very toxic (about 100 times more than trivalent chromium), which is a serious carcinogenicity. The waste water and products produced by hexavalent chromium chrome plating cannot be naturally degraded and eliminated in nature. When the chromium concentration in the air is 0.15~0.3 mg/m ³ , the diaphragm in the nose is perforated, and the drinking water contains six. When the valence chromium concentration is above 0.1 mg/l, it will cause vomiting, invade the intestines and kidneys, and accumulate in the living body, which has a long incubation period. Governments around the world have enacted relevant laws and regulations on hexavalent chromium plating to gradually limit the use of hexavalent chromium and reduce its emissions. The present invention excludes the use of hexavalent chromium plating (as disclosed in the prior art, Chinese Patent Application No. CN201220185401.5 and CN201210114284.8, which disclose the use of a hexavalent chromium plating method to form an amorphous chromium carbide alloy coating on a piston ring), while using non-toxic, Green environmentally-friendly trivalent chromium plating technology (such as the method of trivalent chromium plating disclosed in Taiwan Patent Publication No. TW201339373), which effectively increases carbon content and increases wear resistance and corrosion resistance by the above-mentioned method steps, and is suitable for industrial use. Connector.

The formulations used in the various embodiments of the present invention are shown in Table 1, which is only the embodiment. Ming, but not limited to this. In the subsequent examples, the performance verification samples were prepared by using the sulfate electroplating bath and the chlorosulfate electroplating bath of Table 1, respectively, and verified by comparison with each other. The performance test results in each example were taken as the average value of each sample or The lowest value will not be explained one by one in the embodiment.

The electroplated layer of the electrical connector of the electrical connector, the main requirements of the seven items are Depth Purity, Hardness, Appearance, Thickness, Adhesion, Plating Integrity ( Plating Integrity) and Ductility; if the plating layer is gold-plated, the quality and inspection method are based on ASTM-B488-01, but the main characteristics of the electrical connector are film thickness, surface hardness, electrical conductivity, Resistance to environmental corrosion, sulfur corrosion, acid corrosion, abrasion resistance, adhesion, etc., in the following examples, the samples were verified and the values of the properties were listed. The following examples are various embodiments of the electrical connector of the coated metallized ceramic plating layer of the present invention, but the actual aspect is not limited thereto.

<Example 1>

3 is a schematic view of the electrical connector 1 of the coated metallized ceramic plating layer of the present invention. The connector body 2 (not shown) is an AMP connector, and the connector body 2 is mounted. There are N electrical connectors 3; in this embodiment, an interposer 32 is formed on the surface of the substrate 31 of the electrical connector 3 by electroplating, and a metallization is formed on the interposer 32 by electroplating. The ceramic plating layer 33 allows the electrical connector 3 to have electrical conductivity, good surface hardness and corrosion resistance to replace the gold plating of the prior art.

The substrate 31 of the electrical connector 3 is made of a copper alloy, and the interposer 32 coated on the substrate 31 is a nickel plating layer formed by electroless plating, and has a thickness of 1.25 to 5 μm, which can be used for different manufacturing methods. It is not limited to use a nickel plating layer formed by electroplating or a tin plating layer.

The electrical connector 1 of the metallized ceramic plating layer of this embodiment is formed by electroplating to form a metallized ceramic plating layer 33 formed by depositing a chromium carbide structure on the interposer 32 of the electrical connector 3, see FIG. 4A. For the surface topography of the metallized ceramic plating layer 33 of the chromium carbide-based composition of the present embodiment, the metallized ceramic plating layer 33 formed by the photo is an amorphous phase structure, uniformly and densely coated on the interposer 32; Please refer to FIG. 4B , which is a composition analysis diagram of the metallized ceramic plating layer 33 of the present embodiment. It can be seen that the metallized ceramic plating layer 33 is an amorphous phase chromium carbide structure, and the composition thereof is mainly chrome element 332 and carbon element 331 . The composition includes carbon trioxide (Cr ₂₃ C ₆ ), chromium trichrome (Cr ₃ C ₂ ) or heptachrome (Cr ₇ C ₃ ).

The trivalent chromium plating solution used in this embodiment is a chlorate plating bath, and its composition and operating conditions are as shown in Table 1. When the metallized ceramic plating layer 33 is plated, the current density is 10 A/dm ^{2 and the} operating temperature is 25 ° C, and the operation time is For 10 minutes, after electroplating, the carbon content in the plating layer was measured by EPMA to be 35 At%, and the obtained chromium carbide-based metallized ceramic plating layer 33 was flat, and the plating layer was plated to a thickness of about 1.5 μm (see FIG. 4C, The cross-section of the metallized ceramic plating layer of the present embodiment), the coefficient of friction (COF) is 0.5 at the wear distance of 55 meters, and the average is 0.414 (see FIGS. 4D and 4E, respectively. The metallized ceramic plating layer 33 wear test record map and the surface photograph after the abrasion test); and according to the relevant specifications, the characteristics of the electrical connection member 3 of the metallized ceramic plating layer 33 coated with the chromium carbide-based component are as follows. Table 2 shows that the electrical connector 3 of the coated metallized ceramic plating layer 33 of the present invention has high corrosion resistance, wear resistance and good electrical conductivity, and can be assembled for use in the electrical connector 1.

The average value of the friction coefficient is in the wear test distance of 0~60m, and the sampling frequency is 10 points/m. The hardness of the coating is judged as the Knoop Hardness of the coating, and the hardness is measured according to ASTM B578. Standard Test Method for Microhardness of Electroplated Coatings), tested at a loading pressure of 100 gf (0.981 N). The following embodiments are the same and will not be repeated.

<Example 2>

FIG. 5 is a schematic diagram of a USB connector (Universal Serial Bus) of the electrical connector 1 of the metallized ceramic plating layer of the present invention, and the connector body 2 of the embodiment (not As shown in the figure, it is a USB Type-A connector. The USB connector is widely used in the interface of personal computers and peripheral devices. It has become the mainstream of the current PC I/O interface. The transmission speed of USB 2.0 can reach 480Mbps. Now it is upgraded to USB 3.0.

In Fig. 5, only the shielded electrical connector 3 of the USB Type-A connector is shown. The base material 31 of the electrical connector 3 is made of medium carbon steel, and the intermediate layer 32 is formed by electroplating nickel. The thickness of the nickel plating layer is 15~25μm; in this embodiment, a metallized ceramic plating layer 33 formed by plating a chromium carbide structure on the interposer 32 of the electrical connector 3 is formed by electroplating, and the metallized ceramic plating layer 33 is an amorphous phase chromium carbide structure. The composition is mainly composed of the chrome element 332 and the carbon element 331, which is the same as that of the first embodiment, and will not be described herein. 3 pairs of shielded electrical connectors of the USB Type-A connector In order to increase the surface hardness, the metallized ceramic plating layer 33 is plated with slower speed plating, and the plated metallized ceramic plating layer 33 is baked in an oven at 80 ° C for 4 hours. In order to increase the hardness; and to increase the corrosion resistance, the thickness of the metallized ceramic plating layer 33 is also increased to 15 to 25 μm.

According to the relevant specifications, the characteristic test results of the electrical connecting member 3 of the metallized ceramic plating layer 33 coated with the chromium carbide-based component are as shown in Table 3, and the electrical connecting member 3 of the coated metallized ceramic plating layer of the present embodiment is proved. It has high corrosion resistance, wear resistance and good electrical conductivity and can be assembled into the electrical connector 1 of the USB Type-A connector.

<Example 3>

Figure 6 is a schematic view of the electrical connector 1 of the coated metallized ceramic plating layer of the present invention, which is applied to a SIM smart card connector for communication and mobile phones, and the electrical connector 1 of the SIM smart card is The connector body 2 and the six electrical connectors 3 (only three are shown in the figure, respectively 3A, 3B and 3C), the connector body 2 is made of ABS plastic material, and the substrate 31 of the electrical connector 3 Made of a copper alloy; this embodiment forms a chromium carbide structure via electroplating A metallized ceramic plating layer 33 formed on the substrate 31 of the electrical connector 3, the metallized ceramic plating layer 33 is an amorphous phase chromium carbide structure, the composition of which is mainly composed of the chromium element 332 and the carbon element 331, In the first embodiment, details are not described herein again.

Since the electrical connector 1 of the SIM smart card needs to be frequently inserted and removed and requires high conductivity, the carbon element 331 of the metallized ceramic plating layer 33 is increased to increase conductivity, and the metallized ceramic plating layer 33 is completed after plating. It was further baked in an oven at 80 ° C for 4 hours to increase the hardness. According to the relevant specifications, the characteristic test results of the electrical connecting member 3 of the metallized ceramic plating layer 33 coated with the chromium carbide-based component are as shown in Table 4, and the electrical connecting member 3 of the coated metallized ceramic plating layer 33 of the present embodiment is proved. It has good electrical conductivity and wear resistance and can be assembled into the electrical connector 1 of the SIM smart card.

<Example 4>

7 is a schematic view of the electrical connector 1 of the metallized ceramic plating layer of the embodiment, which is an electrical connector plug-in 301 (commonly known as a banana plug connector Banana Plug) Connector) and electrical connector socket 302 (commonly known as banana socket connector), used for audio lines, high-frequency transmission lines, audio-visual connectors, earphones, speaker cables, speaker terminals and so on.

The electrical connector insert 301 and the electrical connector receptacle 302 are paired. In use, the electrical connector insert 301 is inserted into the electrical connector receptacle 302 to generate electricity by contact of the electrical connector insert 301 with the electrical connector receptacle 302. The electrical connection member 301 of the embodiment and the substrate 31 (not shown) of the electrical connector socket 302 are made of ABS plastic material. For the electrical connector insert 301, the contact area and the contact pressure can be increased due to the deformation of the ABS plastic material inserted into the electrical connector socket 302 by the elastic piece outside the electrical connector insert 301, and the contact pressure is generated for the electrical connector socket 302. In other words, the ABS plastic material is slightly expanded due to the insertion of the electrical connector insert 301, which also increases the contact area and the contact pressure. Since the substrate 31 is a non-conductive material, the substrate 31 is coated with 1-3 μm of copper and electrolessly coated with about 10 μm of nickel to form a conductive layer, and the metallized ceramic plating layer 33 is formed by electroplating. On the surface of the conductive layer of the electrical connector insert 301 and the electrical connector receptacle 302, the metallized ceramic plating layer 33 is an amorphous phase chromium carbide structure, the composition of which is mainly chromium element 332 (not shown in the figure) and carbon element. The composition of 331 (not shown in the figure) is the same as that of the first embodiment, and details are not described herein again.

Although in the present embodiment, the electrical connector socket 302 only has the outer surface and the end surface of the metallized ceramic plating layer 33, but for different applications, the metal connector ceramic layer 33 may be coated inside the electrical connector socket 302; Alternatively, only one of the electrical connector insert 301 or the electrical connector receptacle 302 may be coated with a metallized ceramic plating layer 33; these various embodiments are not limited.

Since the electrical connector insert 301 and the electrical connector receptacle 302 need to be frequently inserted and removed and require high wear resistance and adhesion, the metallized ceramic plating layer 33 has a lower carbon element 331 content. According to the relevant specifications, the characteristic test results of the electrical connecting member 3 of the metallized ceramic plating layer 33 coated with the chromium carbide-based component are as shown in Table 5. The electrical connecting member 3 of the coated metallized ceramic plating layer 33 of the present embodiment is proved. With good wear resistance and adhesion, the electrical connector insert 301 and the electrical connector receptacle 302 can be used for non-conductive substrates.

<Example 5>

As shown in FIG. 8, a schematic diagram of the electrical connector 1 of the metallized ceramic plating layer of the present embodiment is an HDMI cable connector, and HDMI is a trend in response to information appliances and digital content. The integrated digital audio and video multimedia interface was established in 2002 by Hitachi, Panasonic, Philips, Silicon Image, Sony, Thomson and Toshiba, and other leading companies in the field of home appliances and IC design and digital content. HDMI transmits video, voice and control signals through the same technology on the same bus. The interface can be made light and short, and the transmission bandwidth can be up to 5Gbps. DVD/STB/DTV/HDTV/LCD TV /Plasma TV is its main application.

In this embodiment, only the HDMI male seat (electrical connector plug-in 301, not shown in the figure) is shown, and the HDMI female socket (electrical connector socket 302, not shown in the figure) can also be applied to the present invention. The electrical connector of the metallized ceramic plating layer is not described in detail here. In use, the HDMI male seat (electric connector plug 301) is inserted into the HDMI female socket (electrical connector socket 302). The electrical connector insert 301 is electrically connected to the electrical connector receptacle 302. The electrical connector insert 301 of the present embodiment includes the electrical connector 3 and the busbar electrical connector 3A, 3B, ... 3N, the substrate 31 of the electrical connector 3 (not shown) is a copper alloy, and the substrate 31 of the electrical connectors 3A, 3B, ..., 3N (not shown) is also a copper alloy; One of the products, the electrical connection 3 of the shielded wire and the electrical connection 3A of the busbar, 3B, ..., 3N is first plated with a nickel-phosphorus alloy as a carrier layer 32 (not shown in the figure) on the copper alloy substrate, and then a hard gold (gold palladium) having a hardness (Knoop) of 250 is applied to the interposer 32. In the present embodiment, the electrical connectors 3 and the busbar electrical connectors 3A, 3B, ..., 3N are connected to the surface of the interposer 32 of the nickel-phosphorus alloy of the copper alloy substrate 31 by electroplating. Metallized ceramic plating layer 33 (not shown in the figure), metallized ceramic plating layer 33 is an amorphous phase of chromium carbide structure, the composition of which is mainly chromium element 332 (not shown in the figure) and carbon element 331 (not labeled In the figure), it will not be described here.

Since the HDMI public seat (electrical connector plug-in 301) and the HDMI female socket (electrical connector socket 302) need to be frequently plugged and unplugged and require high wear resistance and adhesion, the transmission bandwidth requirement is required. The high conductivity and lower contact resistance result in a higher carbon element 331 content for the metallized ceramic plating layer 33. According to the relevant specifications, the characteristic test results of the electrical connector 1 of the metallized ceramic plating layer 33 coated with the chromium carbide-based component are shown in Table 6. The electrical connection of the coated metallized ceramic plating layer 33 of the present embodiment is demonstrated. The device 1 has good corrosion resistance, wear resistance, adhesion, and electrical conductivity, and can be used for an HDMI connector, and can replace a gold plating layer, a palladium-plated nickel alloy layer or other metal layer of a conventional product on a plating layer.

<Example 6>

9 is a schematic view of the electrical connector 1 of the coated metallized ceramic plating layer of the present invention, which is a SMK high frequency coaxial connector (SMK coax connector) which is a small connector with RF/microwave transmission. It can be used up to 40 GHz with a characteristic impedance of less than 50 Ω. The coaxial connector is electrically connected by a pin-male to a contact spring-female. Therefore, the wear-resistant and corrosion-resistant needle and contact spring are the most basic requirements.

In this embodiment, only the male seat (electrical connector 1) of the SMK high frequency coaxial connector is shown, and the female seat of the SMK high frequency coaxial connector (not shown) can also be applied to the coated metal of the present invention. The electrical connector of the ceramic plating layer will not be described in detail herein. The electrical connector comprises an electrical connector 3A connected by a shield wire and an electrical connector 3B of the needle, and the substrate 31 (not shown) of the electrical connectors 3A and 3B are both copper alloys, in the present embodiment, the shielding wire The electrical connection member 3A of the connection and the electrical connection member 3B of the needle are first plated on the copper alloy substrate 31 with the interposer 32 of the nickel-phosphorus alloy, and the surface of the interposer 32 is further plated to form the metallized ceramic plating layer 33 (not As shown in the figure), the metallized ceramic plating layer 33 is an amorphous phase chromium carbide structure, and its composition is mainly chromium element 332 (not shown in the figure) and carbon element 331 (not shown in the figure), not here. Let me repeat.

Since the busbar of the SMK high frequency coaxial connector and the socket of the SMK high frequency coaxial connector need to be frequently inserted and removed and require high wear resistance and adhesion, the metallized ceramic plating layer 33 has a higher hardness composition. According to the relevant specifications, the characteristic test results of the electrical connector 1 of the metallized ceramic plating layer 33 coated with the chromium carbide-based component are shown in Table 7. The electrical connection of the coated metallized ceramic plating layer 33 of the present embodiment is demonstrated. The device 1 has good corrosion resistance and wear resistance and can be used for SMK high frequency coaxial connectors.

<Example 7>

10 is a schematic diagram of an electrical connector 1 of a metallized ceramic plating layer of the present embodiment, which is a PCB edge connector, commonly known as a golden finger, on a gold finger. It contains a lot of bare copper pads. These copper pads are actually part of the PCB layout. They are often used in computer graphics cards, sound cards or other similar interface cards. They are connected to the motherboard by gold fingers. The gold finger is connected to the elastic piece of the slot connector, and the elastic piece is pressed by the elastic piece to make an electrical connection. The gold finger used in practice is often plated with gold, because the gold plating layer is not easy to rust and has good electrical conductivity; the gold plating layer on the gold finger usually has a hardness of 140 Knoop or more and an average thickness of 3 to 8 μm. Due to the continuous rise in gold prices in recent years, the cost of gold plating on PCBs has become more and more expensive, and there is no alternative material available.

In this embodiment, only a part of the PCB board 4 is shown. The gold finger 41 in the PCB board 4 is composed of a plurality of electrical connectors 3A, 3B, ..., 3N, wherein only the electrical connectors are not shown. 3A, 3B are representative; the substrate 31 of the electrical connectors 3A and 3B (not shown in the figure) are formed by electroless plating after the circuit board is etched, and in the present embodiment, on the surface of the copper substrate 31. The metallized ceramic plating layer 33 (not shown in the figure) is formed by electroplating, and the metallized ceramic plating layer 33 is an amorphous phase chromium carbide structure, and the composition thereof is mainly chromium element 332 (not shown in the figure) and carbon element 331 (Not shown in the figure), will not repeat them here.

Since the gold fingers 41 in the PCB board 4 need to be frequently inserted and removed and require high wear resistance and adhesion, the metallized ceramic plating layer 33 also adopts a composition of higher hardness. An electrical connector 1 of a metallized ceramic plating layer 33 coated with a chromium carbide-based component according to relevant specifications The results of the characteristic inspection are shown in Table 8. It is proved that the electrical connector 1 of the coated metallized ceramic plating layer 33 of the present embodiment has good corrosion resistance and wear resistance and can be used for the gold fingers 41 in the PCB board 4.

<Example 8>

FIG. 11A is a schematic view of the electrical connector insert 301 of the electrical connector 1 of the metallized ceramic plating layer of the present embodiment and FIG. 11B, which is the electrical property of the coated metallized ceramic plating layer of the embodiment. Schematic diagram of the electrical connector socket 302 of the connector 1. This embodiment is a crimp cable connector, and the figure shows a male seat (electric connector plug 301) applied to the crimping cable connector. The electrical tape of the electrical connector and the electrical connector of the female connector (electrical connector socket 302) of the cable connector. When the electrical connector is mechanically processed, the punch and the die are punched into a series of wires. The connecting member forms a long strip, after electroplating to form a plating layer, and then cutting the strip by stamping or other mechanical processing and assembling each of the electrical connectors with the connector body (not shown) A crimped cable connector is formed, which is often used for electrical connection of battery cables.

In one of the conventional products, the material of the electrical connector is made of copper alloy in copper. The gold substrate is first plated with a layer of tin and then plated with a layer of nickel as an interposer 32 (not shown), that is, the interposer 32 is a second layer. For corrosion prevention and conduction purposes, a thickness of about 20 is applied to the interposer 32. 30μm gold; in this embodiment, the same product is also used on the copper alloy substrate 31, first plating a layer of tin and then plating a layer of nickel as the interposer 32, and then forming a metallized ceramic plating layer 33 by electroplating (not shown in the figure). Medium), wherein the metallized ceramic plating layer 33 is an amorphous phase chromium carbide structure, the composition of which is mainly chromium element 332 (not shown in the figure) and carbon element 331 (not shown in the figure), no longer Narration. According to the relevant specifications, the characteristic test results of the electrical connector 1 of the metallized ceramic plating layer 33 coated with the chromium carbide-based component are as shown in Table IX, demonstrating the electrical connection of the coated metallized ceramic plating layer 33 of the present embodiment. The device 1 has good corrosion resistance, wear resistance, adhesion, and electrical conductivity, and can be used for a crimped cable connector, and can replace a gold plating layer, a palladium nickel alloy layer or other metal layer of a conventional product on a plating layer.

<Example 9>

12A is a schematic view of the electrical connector insert 301 of the electrical connector 1 of the metallized ceramic plating layer of the embodiment, and FIG. 12B is the electrical property of the coated metallized ceramic plating layer of the embodiment. Schematic diagram of the electrical connector socket 302 of the connector 1; Pin connector for connectors for computer ICs or wiring and SIP Socket Connector. The male connector 1 is composed of a connector body 21 and an electrical connector insert 301, each electrical connector insert 301 corresponding to an electrical connector 3A, 3B, ..., 3N; the connector 1 of the female connector is connected The main body 21 and the electrical connector socket 302 are formed. Each electrical connector socket 302 corresponds to an electrical connector 3A, 3B, ..., 3N; if it is a cable to cable connection, it is a public seat. The electrical connectors 3A, 3B, ..., 3N of the connector 1 correspond to the electrical connectors 3A, 3B, ..., 3N of the connector 1 of the female socket; if it is a board to cable connection, The electrical connectors 3A, 3B, ..., 3N of the connector 1 of the female connector are connected by the gold finger of the IC pin or the PCB; in the present embodiment, only the 1x10 electrical connector array (1.27) is shown. Mm single row), similar structures such as Double Row or Triple Row, SOJ socket, PLCC socket, SMT socket, etc. are all aspects of this embodiment, and will not be repeatedly described.

In one of the conventional products, the connector body 21 is made of nylon 46/66/6T/LCP plastic material, and the substrate 31 of the electrical connectors 3A, 3B, ..., 3N (not shown) is a copper alloy. It is prepared by first plating a layer of 10 μm nickel on a copper alloy substrate, and then plating a layer of tin on the nickel plating layer as an interposer 32 (not shown in the figure), that is, the interposer 32 is a two layer for corrosion prevention and conduction. The purpose is to electroplate a layer of gold having a thickness of about 5 μm on the interposer 32. In the present embodiment, the same product is used on the copper alloy substrate 31, first plating a layer of 10 μm of nickel, and then plating a layer of tin on the nickel plating layer. The surface of the interposer 32 is further electroplated to form a metallized ceramic plating layer 33 (not shown) to replace the gold plating layer, the palladium-plated nickel alloy layer or other metal layer of the conventional product, wherein the metallized ceramic plating layer 33 is The chromium carbide structure of the amorphous phase is mainly composed of chromium element 332 (not shown in the figure) and carbon element 331 (not shown in the figure), and will not be described herein. In order to facilitate the soldering of the electrical connector insert 301 and the electrical connector socket 302, the solder joints of the electrical connector insert 301 and the electrical connector receptacle 30 are shielded by a non-plated metallized ceramic plating layer 33 to make the tin plating layer bare. To facilitate welding. According to the relevant specifications, the characteristic test results of the electrical connector 1 of the metallized ceramic plating layer 33 coated with the chromium carbide-based component are as shown in Table 10, and the electrical connection of the coated metallized ceramic plating layer 33 of the present embodiment is demonstrated. The device 1 has good corrosion resistance, wear resistance, adhesion, and electrical conductivity, and can be used for a connector for an IC or a wiring, replacing a gold plating layer, a palladium-plated nickel alloy layer, or other metal layer of a conventional product.

Although in the present embodiment, the electrical connector 3A of the electrical connector socket 302, The end faces of the electrical connectors of the electrical connector inserts 301 and the portions of the inner holes of the 3B, ..., 3N are covered with a metallized ceramic plating layer 33, and the other ends of the electrical connectors 3A, 3B, ..., 3N are The metallized ceramic plating layer 33 is soldered or otherwise not covered, and the electrical connection members 3A, 3B, ..., 3N of the electrical connector insert 301 are inserted into the electrical connector socket 302 to cover the metallized ceramic plating layer. 33, and the other end of the electrical connectors 3A, 3B, ..., 3N is not covered with a metallized ceramic plating layer 33 for soldering or other purposes; but for different applications, the electrical connector socket 302 can also be electrically connected. The electrical connectors of the component insert 301 are all covered with a metallized ceramic plating 33; these various embodiments are not limited.

In the conventional products, after a period of time, the tin plating layer will grow a dendritic protrusion at a normal temperature, which is called tin whisker (whisker, Whisker). If the tin whisker is too long, it will This creates a short circuit between conductors or components. This problem can be a serious problem in high-density packaged electronics (mobile phones, PDAs, MP3s, automotive electronics, etc.). In the above-mentioned conventional products, a copper alloy substrate is first plated with a layer of 10 μm nickel, and then a nickel plating layer is plated with a layer of tin as an interposer 32. The nickel plating layer and the copper alloy substrate are separated by a nickel plating layer, and The gold plating layer is electroplated on the tin plating layer, and the gold plating layer can have a good covering effect to avoid the problem that the tin plating layer generates tin whisker after a period of time. The general inspection method is that after standing for 1000 hours at normal temperature, if tin whisker Failed when the length reached or exceeded 25 μm . In this embodiment, a nickel plating layer is also spaced between the nickel plating layer and the copper alloy substrate, and a relatively dense metallized ceramic plating layer 33 is formed on the tin plating layer, and the metallized ceramic plating layer 33 also has a good The covering effect was tested under a constant temperature of 21 ° C and a constant humidity of 65%. After 1200 hours, it was observed under a microscope, and no tin whiskers were found in the area covered by the metallized ceramic plating layer 33, which was in accordance with the use requirements.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

3‧‧‧Electrical connectors

31‧‧‧Substrate

32‧‧‧Intermediary

33‧‧‧Metalized ceramic plating

331‧‧‧carbon elements

332‧‧‧Chromium

Claims (7)

An electrical connector covering a metallized ceramic plating layer, comprising a connector body and N electrical connectors, wherein N is greater than or equal to 1; wherein the electrical connector comprises a substrate and a metallized ceramic plating a material; the material of the substrate is selected from one or a combination of the following groups: (1) conductive material: conductive ceramic, iron, stainless steel, copper, chromium, tin, nickel, silver, gold or one of its alloys or (2) non-conductive material: one of plastic, ceramic, glass or a combination thereof, and coated with a conductive layer by electroplating or electroless plating, the conductive layer is selected from the group consisting of iron, copper, chromium, tin, nickel, silver And a metal or a metal thereof; wherein the metallized ceramic plating layer is a metallized ceramic having a chromium carbide-based composition, and a chromium carbide structure formed by electroplating to form an amorphous phase adheres to all or a part of the surface of the substrate, The composition comprises a chromium element and a carbon element, and the amorphous phase structure comprises at least a chromium trichloride (Cr ₂₃ C ₆ ), a chromium trichrome (Cr ₃ C ₂ ) or a three carbonized seven chromium (Cr ₇ C _{3 ).} Or one or a combination thereof; the metallized ceramic plating layer has a carbon content greater than 25At%; when the average thickness of the metallized ceramic plating layer ranges from 0.5 μm to 35 μm, the contact resistance value is less than 60 mΩ at a weight of 10 g; wherein At% is an atomic ratio (atomic) Percent). An electrical connector for coating a metallized ceramic plating layer according to claim 1, wherein the electrical connector further comprises an interposer between the substrate and the metallized ceramic plating layer; wherein the intermediary The layer is coated on the surface of the substrate, and the material of the interposer is selected from one of the following groups or a combination thereof: (1) iron, copper, nickel, nickel phosphorus, tin, silver, gold, palladium, cobalt, a noble metal or an alloy thereof; (2) a non-conductive material coated with iron, copper, nickel, nickel phosphorus, tin, silver, gold, palladium, cobalt, a noble metal or an alloy thereof; the metallized ceramic plating layer is coated on the interposer All or part of the surface. The electrical connector of the metallized ceramic plating layer according to the first or the second aspect of the invention, wherein the metallized ceramic plating layer has an average thickness of 0.5 to 3 μm, and the electrical connector is covered. The environmental corrosion resistance of the portion of the metallized ceramic plating layer is non-corrosive for exposure to salt spray for more than 300 hours; when the average thickness of the metallized ceramic plating layer is 3-8 μm, the electrical connector is covered with metallization The environmental corrosion resistance of the ceramic plating layer is non-corrosive for exposure to salt spray for more than 500 hours; when the average thickness of the metallized ceramic plating layer is greater than 8 μm, the electrical connector is covered with the metallized ceramic plating portion. The environmental corrosion resistance is non-corrosive for exposure to salt spray for more than 1000 hours; wherein exposure to salt spray is tested according to ASTM B117 test specification. The electrical connector of the metallized ceramic plating layer according to the first or the second aspect of the invention, wherein the metallized ceramic plating layer has an average thickness of 0.5 to 3 μm, and the electrical connector is covered. The sulfur-resistant corrosion of the portion of the metallized ceramic plating layer is non-corrosive for exposure to sulfur dioxide mist for more than 72 hours; when the average thickness of the metallized ceramic plating layer is at least 3-8 μm, the electrical connector is covered with metal The sulfur-resistant corrosion of the portion of the ceramic plating layer is non-corrosive for exposure to sulfur dioxide mist for more than 128 hours; when the average thickness of the metallized ceramic plating layer is greater than 8 μm, the electrical connector is coated with the metallized ceramic plating layer Some of the sulfur-resistant corrosion is non-corrosive for more than 300 hours in exposure to sulfur dioxide mist; among them, exposure to sulfur dioxide mist is tested according to ASTM B799 test specification. An electrical connector for coating a metallized ceramic plating layer according to claim 1 or 2, wherein the metallized ceramic plating layer has an average coefficient of friction of less than 0.9; wherein the coefficient of friction is Tested at 300 Newtons weight according to ASTM D 3702-94. The electrical connector of the metallized ceramic plating layer according to claim 1 or 2, wherein the metallized ceramic plating layer has a surface hardness of 800 (Hv) or more, The surface hardness was tested according to ASTM 578 at a loading pressure of 100 gf. An electrical connector for coating a metallized ceramic plating layer according to claim 2, wherein the interposer is two or more layers.