CN115915646A - Processing method for thickening conducting hole of circuit board - Google Patents
Processing method for thickening conducting hole of circuit board Download PDFInfo
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- CN115915646A CN115915646A CN202211367986.7A CN202211367986A CN115915646A CN 115915646 A CN115915646 A CN 115915646A CN 202211367986 A CN202211367986 A CN 202211367986A CN 115915646 A CN115915646 A CN 115915646A
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- via hole
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Abstract
The invention discloses a processing method for thickening a conducting hole of a circuit board, which comprises the following steps: s1: manufacturing a via hole: drilling a through hole on a multilayer board to be processed; s2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition adhesion mode; s3: preparation of a resin layer: filling resin into the conductive holes, and polishing the resin; s4: manufacturing an insulating layer: coating an insulating layer on the polished resin surface; s5: calculating the thickness of the copper plating: calculating the thickness of the required copper according to the surface area of the via hole coated with the insulating layer; s6: and (3) manufacturing a copper layer: copper plating thickening is carried out on the inner wall of the conducting hole in an acid copper plating mode; s7: the whole thickening of the circuit board: electroplating and thickening the whole circuit board; s8: and detecting the conduction performance. According to the invention, the thickness of the via hole is increased through the whole electroplating of the conductive layer, the resin layer, the insulating layer, the copper plating layer and the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a processing method for thickening a conducting hole of a circuit board.
Background
Thick copper circuit board products are generally used for carrying large current to provide power for related equipment, and the current carrying lines designed by the thick copper circuit board products are most commonly designed by adopting through holes as current conversion crimping holes and heat dissipation holes.
In order to make the through hole carry large current, the hole copper thickness of the through hole needs to be increased to more than 40um (the hole copper thickness of the through hole is 18-20um in general). In order to make different through holes carry different large currents and save the wiring space of the board, different hole copper thickness requirements need to be designed on the same circuit board, for example, the hole copper thickness of most of the through holes is 18-20um, the hole copper thickness of the small current-carrying heat dissipation holes is 30-50um, and the hole copper thickness of the large current-carrying heat dissipation holes is 60-80um. The circuit board with various through holes and different hole copper thicknesses can be called a multi-step hole copper differential circuit board.
At present, the output of thin copper plates on the market is less and less, and more copper-clad plates used in PCB production and processing are thick copper plates; the copper-clad plate processing process comprises a drilling process and a PTH process, wherein the PTH process carries out chemical copper plating on the hole wall of the drilled hole to conduct base copper on two sides of the copper-clad plate; the thickness of the thick copper plate is thick, and the copper plating thickness of the hole wall needs to be increased so as to improve the stability of the conduction of the base copper on the two sides.
Disclosure of Invention
The invention aims to provide a processing method for thickening a conducting hole of a circuit board, which aims to solve the problems that the output of a thin copper plate on the market is less and less at present, and more copper clad plates are used as thick copper plates during PCB production and processing; the copper-clad plate processing process comprises a drilling process and a PTH process, wherein the PTH process carries out chemical copper plating on the hole wall of the drilled hole to conduct base copper on two sides of the copper-clad plate; the thickness of the thick copper plate is thick, and the copper plating thickness of the hole wall needs to be increased so as to improve the stability of the conduction of the base copper on the two sides.
In order to achieve the purpose, the invention provides the following technical scheme: a processing method for thickening a conducting hole of a circuit board comprises the following steps:
s1: manufacturing a via hole: drilling a through hole on a multilayer board to be processed;
s2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition and adhesion manner;
s3: preparation of a resin layer: filling resin into the conductive holes, and polishing the resin;
s4: manufacturing an insulating layer: coating an insulating layer on the polished resin surface;
s5: calculating the thickness of the needed copper plating: calculating the thickness of the needed copper according to the surface area of the via hole coated with the insulating layer;
s6: and (3) manufacturing a copper layer: copper plating thickening is carried out on the inner wall of the conducting hole in an acid copper plating mode;
s7: the whole thickening of the circuit board: electroplating and thickening the whole circuit board;
s8: and (3) conducting performance detection: and testing the conduction performance of the processed circuit board on the base material through a testing machine, and removing unqualified circuit boards.
Preferably, in S1, the through hole required for design is formed in the substrate by punching, numerical control drilling or laser drilling.
Preferably, in S2, a conductive layer is formed on the surface of the via hole by chemical deposition and adhesion using a chemical copper deposition or polymer conductive film process.
Preferably, the insulating layer in S4 is an ink layer.
Preferably, the surface area of the via hole coated with the insulating layer in S5 is multiplied by the plating density and time to plate the thickness of the via copper, and the current density value required for plating the via copper is calculated.
Preferably, the thickness of the resin layer and the thickness of the insulating layer are both set to be 10-20mm.
Compared with the prior art, the invention has the beneficial effects that: 2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition adhesion mode; s3: preparation of the resin layer: filling resin into the conductive holes, and polishing the resin; s4: manufacturing an insulating layer: coating an insulating layer on the polished resin surface; s5: calculating the thickness of the needed copper plating: calculating the thickness of the required copper according to the surface area of the via hole coated with the insulating layer; s6: and (3) manufacturing a copper layer: copper plating and thickening are carried out on the inner wall of the conducting hole in an acid copper plating mode; s7: the whole thickening of the circuit board: electroplating and thickening the whole circuit board; in summary, the thickness of the via hole is increased by the overall plating of the conductive layer, the resin layer, the insulating layer, the copper plating layer, and the circuit board.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a flow chart of a first embodiment of the present invention;
FIG. 2 is a flow chart of a second embodiment of the present invention;
FIG. 3 is a flow chart of a third embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Example one
Referring to fig. 1, in an embodiment of the present invention, a processing method for thickening a via hole of a circuit board, S1: manufacturing a via hole: drilling a through hole on a multilayer board to be processed;
s2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition adhesion mode;
s3: preparation of the resin layer: filling resin into the conductive holes, and polishing the resin;
s4: manufacturing an insulating layer: coating an insulating layer on the polished resin surface;
s5: calculating the thickness of the copper plating: calculating the thickness of the required copper according to the surface area of the via hole coated with the insulating layer;
s6: and (3) manufacturing a copper layer: copper plating thickening is carried out on the inner wall of the conducting hole in an acid copper plating mode;
s7: the whole thickening of the circuit board: electroplating and thickening the whole circuit board;
s8: and (3) conducting performance detection: and testing the conduction performance of the processed circuit board on the base material through a testing machine, and removing unqualified circuit boards.
Preferably, in S1, the through holes required for design are formed in the substrate by punching, numerical control drilling or laser drilling.
Preferably, in S2, a conductive layer is formed on the surface of the via hole by a chemical deposition and adhesion method using a chemical copper deposition or polymer conductive film process.
Preferably, the insulating layer in S4 is an ink layer.
Preferably, the surface area of the via hole coated with the insulating layer in S5 is multiplied by the plating density and time to plate the thickness of the via copper, and the current density value required for plating the via copper is calculated.
Preferably, the thickness of the resin layer and the insulating layer is set to be 10-20mm.
The working principle of the invention is as follows: s1: manufacturing a via hole: drilling a through hole on a multilayer board to be processed; s2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition and adhesion manner; s3: preparation of the resin layer: filling resin in the conductive hole, and polishing the resin; s4: manufacturing an insulating layer: coating an insulating layer on the polished resin surface; s5: calculating the thickness of the copper plating: calculating the thickness of the required copper according to the surface area of the via hole coated with the insulating layer; s6: and (3) manufacturing a copper layer: copper plating thickening is carried out on the inner wall of the conducting hole in an acid copper plating mode; s7: the whole thickening of the circuit board: electroplating and thickening the whole circuit board;
s8: and (3) conducting performance detection: the processed circuit board is tested for the conduction performance of the base material through the testing machine, unqualified circuit boards are removed, and the thickness of the conducting hole is increased through the integral electroplating of the conducting layer, the resin layer, the insulating layer, the copper plating layer and the circuit board.
Example two
Referring to fig. 2, in an embodiment of the present invention, a processing method for thickening a via hole of a circuit board, S1: manufacturing a via hole: drilling a through hole on a multilayer board to be processed;
s2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition adhesion mode;
s3: manufacturing an insulating layer: coating an insulating layer on the polished resin surface;
s4: calculating the thickness of the copper plating: calculating the thickness of the needed copper according to the surface area of the via hole coated with the insulating layer;
s5: manufacturing a copper layer: copper plating thickening is carried out on the inner wall of the conducting hole in an acid copper plating mode;
s6: the whole thickening of the circuit board: electroplating and thickening the whole circuit board;
s7: and (3) detecting the conduction performance: and testing the conduction performance of the processed circuit board on the base material through a testing machine, and removing unqualified circuit boards.
Preferably, in S1, the through holes required for design are formed in the substrate by punching, numerical control drilling or laser drilling.
Preferably, in S2, a conductive layer is formed on the surface of the via hole by a chemical deposition and adhesion method using a chemical copper deposition or polymer conductive film process.
Preferably, the insulating layer in S3 is an ink layer.
Preferably, the surface area of the via hole coated with the insulating layer in S4 is multiplied by the plating density and time to be plated to reach the thickness of the hole copper, and the current density value required by the plated hole copper is calculated.
Preferably, the thickness of the resin layer and the thickness of the insulating layer are both set to be 10-20mm.
The working principle of the invention is as follows: s1: manufacturing a via hole: drilling a through hole on a multilayer board to be processed; s2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition adhesion mode; s3: manufacturing an insulating layer: coating an insulating layer on the polished resin surface; s4: calculating the thickness of the copper plating: calculating the thickness of the required copper according to the surface area of the via hole coated with the insulating layer; s5: manufacturing a copper layer: copper plating thickening is carried out on the inner wall of the conducting hole in an acid copper plating mode; s6: the whole thickening of the circuit board: electroplating and thickening the whole circuit board; s7: and (3) detecting the conduction performance: the processed circuit board is tested for the conduction performance of the base material through the testing machine, unqualified circuit boards are removed, and the thickness of the conducting hole is increased through the integral electroplating of the conducting layer, the insulating layer, the copper plating layer and the circuit board.
EXAMPLE III
Referring to fig. 1, in an embodiment of the present invention, a processing method for thickening a via hole of a circuit board, S1: manufacturing a via hole: drilling a through hole on a multilayer board to be processed;
s2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition and adhesion manner;
s3: preparation of the resin layer: filling resin into the conductive holes, and polishing the resin;
s4: manufacturing an insulating layer: coating an insulating layer on the polished resin surface;
s5: calculating the thickness of the copper plating: calculating the thickness of the required copper according to the surface area of the via hole coated with the insulating layer;
s6: and (3) manufacturing a copper layer: copper plating thickening is carried out on the inner wall of the conducting hole in an acid copper plating mode;
s7: and (3) conducting performance detection: and testing the conductivity of the base material of the processed circuit board through a testing machine, and removing unqualified circuit boards.
Preferably, in S1, the through hole required for design is formed in the substrate by punching, numerical control drilling or laser drilling.
Preferably, in S2, a conductive layer is formed on the surface of the via hole by a chemical deposition and adhesion method using a chemical copper deposition or polymer conductive film process.
Preferably, the insulating layer in S4 is an ink layer.
Preferably, the surface area of the via hole coated with the insulating layer in S5 is multiplied by the plating density and time to plate the thickness of the via copper, and the current density value required for plating the via copper is calculated.
Preferably, the thickness of the resin layer and the thickness of the insulating layer are both set to be 10-20mm.
The working principle of the invention is as follows: s1: manufacturing a via hole: drilling a through hole on a multilayer board to be processed; s2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition adhesion mode; s3: preparation of the resin layer: filling resin into the conductive holes, and polishing the resin; s4: manufacturing an insulating layer: coating an insulating layer on the polished resin surface; s5: calculating the thickness of the copper plating: calculating the thickness of the required copper according to the surface area of the via hole coated with the insulating layer;
s6: and (3) manufacturing a copper layer: copper plating and thickening are carried out on the inner wall of the conducting hole in an acid copper plating mode; s7: and (3) detecting the conduction performance: the processed circuit board is tested for the conduction performance of the base material through the testing machine, unqualified circuit boards are removed, and the thickness of the conducting hole is increased through the integral electroplating of the conducting layer, the resin layer, the insulating layer, the copper plating layer and the circuit board.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A processing method for thickening a conducting hole of a circuit board is characterized by comprising the following steps: the method comprises the following steps:
s1: manufacturing a via hole: drilling a through hole on a multilayer board to be processed;
s2: manufacturing a conductive layer: forming a conductive layer on the surface of the via hole in a chemical deposition and adhesion manner;
s3: preparation of the resin layer: filling resin into the conductive holes, and polishing the resin;
s4: manufacturing an insulating layer: coating an insulating layer on the polished resin surface;
s5: calculating the thickness of the copper plating: calculating the thickness of the required copper according to the surface area of the via hole coated with the insulating layer;
s6: and (3) manufacturing a copper layer: copper plating thickening is carried out on the inner wall of the conducting hole in an acid copper plating mode;
s7: and (3) integrally thickening the circuit board: electroplating and thickening the whole circuit board;
s8: and (3) conducting performance detection: and testing the conduction performance of the processed circuit board on the base material through a testing machine, and removing unqualified circuit boards.
2. The processing method for thickening a via hole of a circuit board according to claim 1, wherein: in the step S1, the through holes required by design are manufactured on the base material in a punching mode, a numerical control drilling mode or a laser drilling mode.
3. The processing method for thickening a via hole of a circuit board according to claim 1, wherein: in S2, a conductive layer is formed on the surface of the via hole by adopting a chemical copper deposition or polymer conductive film process and a chemical deposition adhesion mode.
4. The processing method for thickening a via hole of a circuit board according to claim 1, wherein: and the insulating layer in the S4 is an ink layer.
5. The processing method for thickening a via hole of a circuit board according to claim 4, wherein: the ink viscosity of the ink layer is 120-130.
6. The processing method for thickening a via hole of a circuit board according to claim 1, wherein: and in the step S5, multiplying the surface area of the via hole coated with the insulating layer by the plating density and time for plating the via hole to reach the thickness of the via hole copper, and calculating the current density value required by the plated via hole copper.
7. The processing method for thickening a via hole of a circuit board according to claim 1, wherein: the thicknesses of the resin layer and the insulating layer are both set to be 10-20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211367986.7A CN115915646A (en) | 2022-11-03 | 2022-11-03 | Processing method for thickening conducting hole of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211367986.7A CN115915646A (en) | 2022-11-03 | 2022-11-03 | Processing method for thickening conducting hole of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115915646A true CN115915646A (en) | 2023-04-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211367986.7A Pending CN115915646A (en) | 2022-11-03 | 2022-11-03 | Processing method for thickening conducting hole of circuit board |
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| CN (1) | CN115915646A (en) |
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- 2022-11-03 CN CN202211367986.7A patent/CN115915646A/en active Pending
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