CN114980500B - PCB structure for double-sided crimping element and manufacturing method thereof - Google Patents
PCB structure for double-sided crimping element and manufacturing method thereof Download PDFInfo
- Publication number
- CN114980500B CN114980500B CN202210590291.9A CN202210590291A CN114980500B CN 114980500 B CN114980500 B CN 114980500B CN 202210590291 A CN202210590291 A CN 202210590291A CN 114980500 B CN114980500 B CN 114980500B
- Authority
- CN
- China
- Prior art keywords
- cavity
- layer
- diameter
- hole
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002788 crimping Methods 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 claims abstract description 65
- 239000010949 copper Substances 0.000 claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000005553 drilling Methods 0.000 claims description 43
- 230000006835 compression Effects 0.000 claims description 12
- 238000007906 compression Methods 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 23
- 230000008569 process Effects 0.000 abstract description 13
- 238000013461 design Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 144
- 238000003860 storage Methods 0.000 description 7
- 238000004590 computer program Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application provides a PCB structure for a double-sided crimping element and a manufacturing method thereof, and relates to the technical field of PCB processes. The structure comprises: adjacent first and second crimp holes parallel to a thickness direction of the PCB; the first and second crimp holes are formed with first, second and third cavities, and copper layers are attached to the inner walls of the first and second cavities, which enable the crimp holes to be in telecommunication connection with the corresponding inner layer signal layers through which the crimp holes penetrate. By implementing the PCB structure for the double-sided crimping element and the manufacturing method thereof, the hole wall spacing between adjacent crimping holes is increased, so that the hole wall spacing accords with the reliability design, and the yield and the reliability of the PCB double-sided crimping optical module are ensured.
Description
Technical Field
The application relates to the technical field of PCB (printed circuit board) processes, in particular to a PCB structure for a double-sided crimping element and a manufacturing method thereof.
Background
The PCB (Printed Circuit Board ) is widely applied to modern electronic equipment, and the application of the PCB improves the accuracy of wiring and assembly of electronic circuits, saves the volume of the electronic equipment, and promotes the production automation level and labor efficiency. Along with the complicating of circuit functions, the PCB gradually develops from a single-layer board into a double-sided board or even a multi-layer board, so that the number and the variety of electronic elements on the PCB can be increased, meanwhile, the PCB can be compatible with electronic elements in different packaging forms, and for the electronic elements in different packaging, different processes can be selected to realize the electrical connection between the electronic elements. Taking an optical module of the switch as an example, an SMT (Surface Mounted Technology, surface mount technology) or a crimping process can be used to realize the electrical connection between the element and the circuit. In order to increase the density of the optical module, the prior art generally adopts a double-sided SMT method to weld the optical module. The optical module welded by adopting SMT has high unit cost, high fault maintenance difficulty and low repair success rate, and is not suitable for later maintenance of products. If the existing process technology is adopted to carry out double-sided crimping on the optical module, the problems of poor CAF, even cracking of the hole wall and the like caused by too small spacing between crimping holes can occur. To avoid the above problems, a single-sided press-bonding process is generally used for assembling the optical module, and further, in consideration of EMI design of the circuit board, the back surface of the single-sided optical module is not subjected to other circuit designs, so that area waste of the circuit board is caused, and the density of the optical module is reduced by at least half. Therefore, a PCB structure for a double-sided pressure bonding element and a method for manufacturing the same are needed, which can guarantee the yield of a circuit board; on the other hand, the integration density of the optical module can be improved. Finally, for double-sided assembly of the PCB optical module, the replacement of the SMT process by the crimping process is realized.
Disclosure of Invention
In order to solve the problems in the prior art, the embodiment of the application provides a PCB structure for a double-sided crimping element and a manufacturing method thereof, so as to solve the problems of low optical module density, reduced PCB area utilization rate and the like caused by a PCB single-sided crimping optical module in the prior art.
In order to solve one or more of the above technical problems, the technical solution adopted by the present application is as follows:
in a first aspect, a PCB structure for a double-sided crimp element is provided, adapted for a multi-layer PCB, the multi-layer PCB comprising: the first surface 100, the second surface 200, at least one signal layer, the first surface 100 and the second surface 200 have a predetermined thickness therebetween, and the structure comprises:
adjacent first and second press-fit holes 1 and 2 are formed parallel to the thickness direction of the PCB, the first press-fit hole 1 penetrating at least one inner layer signal layer, among the inner layer signal layers penetrated by the first press-fit hole 1, the inner layer signal layer farthest from the first surface 100 being the first signal layer 31;
the second press-fit hole 2 penetrates at least one inner layer signal layer, and among the inner layer signal layers penetrated by the second press-fit hole 2, the inner layer signal layer farthest from the second surface 200 is the second signal layer 32;
the first crimp hole 1 is formed with a first cavity 11, a second cavity 12 and a third cavity 13 in sequence along an inward direction perpendicular to the first surface 100;
the second crimp hole 2 is formed with a fourth cavity 21, a fifth cavity 22 and a sixth fourth cavity 23 in this order in an inward direction perpendicular to the second surface 200;
the copper layer 4 with preset thickness is attached to the inner wall of the first cavity 11 and the inner wall of the second cavity 12, and the copper layer 4 is electrically connected with the inner layer signal layer penetrated by the first crimping hole;
the inner wall of the fourth cavity 21 and the inner wall of the fifth cavity 22 are attached with copper layers 4 with preset thickness, and the copper layers 4 are electrically connected with an inner layer signal layer penetrated by the second compression joint holes;
the first cavity 11 is used for accommodating a first connector 51 of the double-sided crimping element, and the first connector 51 is electrically connected with the copper layer 4 attached to the inner wall of the first cavity 11 after being crimped;
the fourth cavity 21 is used for accommodating the second connector 52 of the double-sided crimping element, and the second connector 52 is electrically connected with the copper layer 4 attached to the inner wall of the fourth cavity 21 after being crimped.
Further, the first cavity 11 and the fourth cavity 21 are cylindrical cavities having an inner diameter of a first diameter, the second cavity 12 and the fifth cavity 22 are cylindrical cavities having an inner diameter of a second diameter, and the third cavity 13 and the sixth cavity 23 are cylindrical cavities having an inner diameter of a third diameter; wherein the first diameter and the third diameter are both greater than the second diameter;
the central axis of the first cavity 11, the central axis of the second cavity 12 and the central axis of the third cavity 13 are collinear to form a first crimping hole central axis;
the central axis of the fourth cavity 21, the central axis of the fifth cavity 22 and the central axis of the sixth cavity 23 are collinear to form a second crimping hole central axis;
the intersection point of the first crimp hole center axis and the first surface 100 is a first position, and the intersection point of the first crimp hole center axis and the second surface 200 is a second position;
the intersection point of the second crimp hole center axis and the first surface 100 is the third position, and the intersection point of the second crimp hole center axis and the second surface 200 is the fourth position.
Further, a first cavity depth h 11 The method comprises the following steps:
h 11 ＝l c1 +t
wherein l c1 Representing the length of the first connector 51, t is a tolerance;
fourth cavity depth h 21 The method comprises the following steps:
h 21 ＝l c2 +t
wherein l c2 Representing the length of the second connector 52.
Further, a third cavity depth h 13 The method comprises the following steps:
h 13 ＝H-(h 1 +t)-t
wherein h is 1 ＝max(l c1 ，h s1 )，h s1 Indicating the distance from the first surface 100 to the first signal layer 31, H indicating a preset thickness;
depth h of sixth cavity 23 The method comprises the following steps:
h 23 ＝H-(h 2 +t)-t
wherein h is 2 ＝max(l c2 ，h s2 )，h s2 Representing the distance of the second surface 200 from the second signal layer 32.
Further, the inner layer of the PCB between the first crimp hole 1 and the second crimp hole 2 is further provided with an inner layer trace 6.
In a second aspect, there is provided a method for manufacturing a PCB structure for a double-sided pressure-bonding element, for manufacturing any one of the PCB structures for a double-sided pressure-bonding element described in the first aspect, the method comprising:
drilling a signal via hole for forming a first via hole 122 having a second diameter as an inner diameter and a second via hole 222 having a second diameter as an inner diameter, and forming a first cavity 11 and a fourth cavity 21;
electroless copper plating and electroplating, which are used for attaching copper layers 4 with preset thickness on the inner walls of the first through hole 122, the second through hole 222, the first cavity 11 and the fourth cavity 21;
the signal back-drilled holes are drilled for forming the third cavity 13 and the sixth cavity 23.
Further, drilling the signal via includes:
drilling in a direction perpendicular to the first surface 100 inward at a first location to form a first through hole 122 having an inner diameter of a second diameter;
in a third position, drilling in an inward direction perpendicular to the first surface 100 to form a second through hole 222 having an inner diameter of a second diameter;
in a first position, drilling is performed in an inward direction perpendicular to the first surface 100 to form a first cavity having an inner diameter of a first diameter and a depth of a first cavity depth h 11 Is arranged in the first cavity 11;
in the fourth position, the bore is drilled in an inward direction perpendicular to the second surface 200 to form a first diameter with a depth of a fourth cavity depth h 21 A fourth cavity 21 of (a);
the first position is the intersection point of the central axis of the first pressure welding hole and the first surface (100), the third position is the intersection point of the central axis of the second pressure welding hole and the first surface (100), and the fourth position is the intersection point of the central axis of the second pressure welding hole and the second surface (200).
Further, drilling the signal back borehole includes:
in a third position, drilling is performed in an inward direction perpendicular to the first surface 100 to form a third diameter with a depth of a sixth cavity depth h 23 Is arranged in the sixth cavity 23;
in the second position, drilling is performed in an inward direction perpendicular to the second surface 200 to form a third cavity having an inner diameter of a third diameter and a depth of a third cavity depth h 13 Is provided, the third cavity 13 of (c).
Wherein the second position is the intersection point of the central axis of the first crimp hole and the second surface (200).
Further, the method further comprises the steps of manufacturing an outer layer graph after electroless copper deposition and electroplating; making an outer layer pattern for forming a first preset pattern on the first surface 100 of the PCB and a second preset pattern on the second surface 200 of the PCB;
further, before drilling the signal via hole, the method further comprises: the inner layer pattern is produced and laminated with a board for forming an inner layer signal layer and an inner layer trace 6.
The technical scheme provided by the embodiment of the application has the beneficial effects that:
1. by implementing the PCB structure for the double-sided crimping element and the manufacturing method thereof disclosed by the embodiment of the application, the hole wall spacing between adjacent crimping holes is increased, so that the hole wall spacing accords with the reliability design, and the yield and the reliability of the PCB double-sided crimping optical module are ensured;
2. the PCB structure for the double-sided crimping element and the manufacturing method thereof are adopted to assemble the optical module of the PCB, so that the density of the optical module and the utilization rate of the area of the PCB are improved;
3. compared with an SMT (surface mounted technology) process, the optical module assembled by the double-sided crimping process has lower unit cost, higher convenience in fault maintenance and greatly improved maintenance success rate;
4. because the hole wall distance between adjacent crimping holes is increased, metal wiring can be laid on the inner layer of the adjacent crimping holes, and the flexibility of PCB design is further increased.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a PCB structure for a two-sided crimp element according to an embodiment of the present application;
FIG. 2 is a schematic illustration of the dimensions of various portions of a crimp aperture provided by an embodiment of the present application;
FIG. 3 is a schematic view of a crimp hole location provided by an embodiment of the present application;
FIG. 4 is a schematic view of first, second, third and fourth cavity depths provided by an embodiment of the present application;
FIG. 5 is a schematic diagram of a PCB structure for a two-sided crimp element including an inner trace provided in an embodiment of the present application;
FIG. 6 is a schematic diagram of a method for manufacturing a PCB structure for a two-sided crimp element according to an embodiment of the present application;
FIG. 7 is a schematic cross-sectional view of a PCB including an inner signal layer according to an embodiment of the present application;
FIG. 8 is a schematic view of a first via and a second via according to an embodiment of the present application;
FIG. 9 is a schematic view of a first chamber provided by an embodiment of the present application;
FIG. 10 is a schematic view of a first cavity and a fourth cavity provided by an embodiment of the present application;
FIG. 11 is a schematic view of copper adhesion inside a plated through hole according to an embodiment of the present application;
FIG. 12 is a schematic view of a pattern near a through hole after an outer pattern is formed according to an embodiment of the present application;
FIG. 13 is a schematic view of a sixth chamber provided by an embodiment of the present application;
FIG. 14 is a schematic view of a third chamber and a sixth chamber provided by an embodiment of the present application;
FIG. 15 is a schematic cross-sectional view of a PCB including inner traces and an inner signal layer according to an embodiment of the present application;
FIG. 16 is a schematic view of a PCB structure for a two-sided compression element including inner traces and inner signal layers provided in accordance with an embodiment of the present application;
fig. 17 is a schematic diagram of a PCB structure for a double-sided compression element including inner signal layers of different depths according to an embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some examples of the present application, not all examples. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The numerals in the drawings of the specification merely denote distinction of respective functional components or modules, and do not denote logical relationships between the components or modules. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
Hereinafter, various embodiments according to the present disclosure will be described in detail with reference to the accompanying drawings. Note that in the drawings, the same reference numerals are given to constituent parts having substantially the same or similar structures and functions, and repeated description thereof will be omitted.
Aiming at the problems that in the prior art, the PCB optical module is low in yield and poor in reliability and is forced to be assembled by adopting a single-sided crimping process, and the optical module density is limited and the PCB area utilization rate is reduced due to the low-reliability single-sided crimping process, the embodiment of the application discloses a PCB structure for a double-sided crimping element and a manufacturing method thereof, which ensure that the hole wall spacing between adjacent crimping holes accords with the reliability design and improve the PCB yield and the reliability; further improving the density of the optical module and the utilization rate of the PCB area. The specific technical scheme is as follows:
in one embodiment, as shown in fig. 1, a PCB structure for a double-sided crimp element is adapted for a multi-layer PCB, the multi-layer PCB comprising: the first surface 100, the second surface 200, at least one signal layer, and a predetermined thickness H between the first surface 100 and the second surface 200. Typically, the first surface 100 has copper sheet 101 attached thereto and the second surface 200 has copper sheet 201 attached thereto. If the copper sheets are not attached to the surfaces of the first surface 100 and the second surface 200, the preset thickness H represents the distance from the outer surface of the first surface 100 to the outer surface of the second surface 200; when copper sheets are attached to the surfaces of the first surface 100 and the second surface 200, the preset thickness H represents the distance between the outer surfaces of the copper sheets on both sides.
The above-mentioned PCB structure for a double-sided compression bonding element includes: adjacent first and second press-fit holes 1 and 2 are formed parallel to the thickness direction of the PCB, the first press-fit hole 1 penetrating at least one inner layer signal layer, among the inner layer signal layers penetrated by the first press-fit hole 1, the inner layer signal layer farthest from the first surface 100 being the first signal layer 31;
the second press-fit hole 2 penetrates at least one inner layer signal layer, and among the inner layer signal layers penetrated by the second press-fit hole 2, the inner layer signal layer farthest from the second surface 200 is the second signal layer 32;
the first crimp hole 1 is formed with a first cavity 11, a second cavity 12 and a third cavity 13 in sequence along an inward direction perpendicular to the first surface 100;
the second crimp hole 2 is formed with a fourth cavity 21, a fifth cavity 22 and a sixth cavity 23 in this order in an inward direction perpendicular to the second surface 200;
the copper layer 4 with preset thickness is attached to the inner wall of the first cavity 11 and the inner wall of the second cavity 12, and the copper layer 4 is electrically connected with the inner layer signal layer penetrated by the first crimping hole;
the inner wall of the fourth cavity 21 and the inner wall of the fifth cavity 22 are attached with copper layers 4 with preset thickness, and the copper layers 4 are electrically connected with an inner layer signal layer penetrated by the second compression joint holes;
the first cavity 11 is used for accommodating a first connector 51 of the double-sided crimping element, and the first connector 51 is electrically connected with the copper layer 4 attached to the inner wall of the first cavity 11 after being crimped;
the fourth cavity 21 is used for accommodating the second connector 52 of the double-sided crimping element, and the second connector 52 is electrically connected with the copper layer 4 attached to the inner wall of the fourth cavity 21 after being crimped.
As shown in fig. 2, the first cavity 11 and the fourth cavity 21 are cylindrical cavities having an inner diameter of a first diameter, the second cavity 12 and the fifth cavity 22 are cylindrical cavities having an inner diameter of a second diameter, and the third cavity 13 and the sixth cavity 23 are cylindrical cavities having an inner diameter of a third diameter; wherein the first diameter and the third diameter are both greater than the second diameter;
as shown in fig. 3, the central axes of the first cavity 11, the second cavity 12 and the third cavity 13 are collinear to form a first crimp hole central axis;
the central axis of the fourth cavity 21, the central axis of the fifth cavity 22 and the central axis of the sixth cavity 23 are collinear to form a second crimping hole central axis;
the intersection point of the first crimp hole center axis and the first surface 100 is a first position, and the intersection point of the first crimp hole center axis and the second surface 200 is a second position;
the intersection point of the second crimp hole center axis and the first surface 100 is the third position, and the intersection point of the second crimp hole center axis and the second surface 200 is the fourth position.
As shown in fig. 4, a first cavity depth h 11 The method comprises the following steps:
h 11 ＝l c1 +t
where lc1 represents the length of the first connector 51, t is a tolerance, and the tolerance t is typically 10 mils;
fourth cavity depth h 21 The method comprises the following steps:
h 21 ＝l c2 +t
wherein l c2 Representing the length of the second connector 52.
The length specifications of the connectors are different, and the lengths of the connectors corresponding to the adjacent crimping holes are not required to be uniform. Respectively by l c1 The length of the first connector 51 is denoted by l c2 Representing the length of the second connector 52.
Third cavity depth h 13 The method comprises the following steps:
h 13 ＝H-(h 1 +t)-t
wherein h is 1 ＝max(l c1 ，h s1 )，h s1 Indicating the distance from the first surface 100 to the first signal layer 31, H indicating a preset thickness; since the first signal layer 31 has a certain thickness, the distance h s1 Including the thickness of the first signal layer 31
Depth h of sixth cavity 23 The method comprises the following steps:
h 23 ＝H-(h 2 +t)-t
wherein h is 2 ＝max(l c2 ，h s2 )，h s2 Representing the distance of the second surface 200 from the second signal layer 32, the distance h due to the thickness of the second signal layer 32 s2 Including the thickness of the second signal layer 32.
Max () represents a larger value operation. Since the depths of the signal layers of the inner layers of the different PCBs are different, the copper plated through holes must be electrically connected to the corresponding signal layers of the inner layers, which results in the depths of the third and sixth cavities determining the corresponding signal layers of the inner layers.
In another embodiment, as shown in fig. 5, the PCB inner layer between the first crimp hole 1 and the second crimp hole 2 is further provided with an inner layer trace 6.
In another embodiment, as shown in fig. 6, a method for manufacturing a PCB structure for a double-sided pressure-bonding element, for manufacturing any one of the PCB structures for double-sided pressure-bonding elements described in the first aspect, includes:
step S1: drilling a signal conducting hole;
for forming a first through hole 122 having a second diameter as an inner diameter and a second through hole 222 having a second diameter as an inner diameter, and forming a first cavity 11 and a fourth cavity 21;
step S2: electroless copper deposition and electroplating;
the copper layer 4 with preset thickness is attached to the inner walls of the first through hole 122, the second through hole 222, the first cavity 11 and the fourth cavity 21;
step S3: drilling a signal back hole;
for forming the third cavity 13 and the sixth cavity 23.
To ensure high quality of the signal, the inner wall of the back-drilled hole is not attached with a copper layer. The first and second through holes 122 and 222 after copper plating are directly drilled and formed.
In the whole PCB manufacturing process, the condition of multiple times of PCB overturning occurs. Thus, the location of the bore needs to correspond exactly to the bore that has been formed to ensure that the central axis of each cavity of the crimp hole is collinear with the central axis of the crimp hole. The application is not limited to the specific manner of drilling.
In another embodiment, step S1: the drilling signal via hole specifically comprises:
step S11: drilling in a direction perpendicular to the first surface 100 inward at a first location to form a first through hole 122 having an inner diameter of a second diameter;
step S12: in a third position, drilling in an inward direction perpendicular to the first surface 100 to form a second through hole 222 having an inner diameter of a second diameter;
for the initial form PCB as shown in fig. 7, the first and second through holes 122 and 222 are formed by performing steps S11 and S12; as shown in fig. 8.
In general, the first position where the first through hole 122 is drilled and the third position where the second through hole 222 is drilled may be positioned according to the positioning holes provided outside the PCB, and the present application is not limited to a specific manner of determining the first position and the third position. The diameter of the bore may be selected as desired to be 8mil diameter or 6mil diameter drill pins to drill the corresponding apertures of the first and second vias 122 and 222. While drilling the first tub 122 and the second through hole 222, 4 in-board positioning holes are drilled at the side of the PCB for positioning at the second and fourth positions when the second surface 200 performs the drilling operation.
Step S13: in a first position, drilling is performed in an inward direction perpendicular to the first surface 100 to form a first cavity having an inner diameter of a first diameter and a depth of a first cavity depth h 11 Is arranged in the first cavity 11; as shown in fig. 9.
Step S14: in the fourth position, the bore is drilled in an inward direction perpendicular to the second surface 200 to form a first diameter with a depth of a fourth cavity depth h 21 A fourth cavity 21 of (a); as shown in fig. 10.
The first position is the intersection point of the central axis of the first pressure welding hole and the first surface (100), the third position is the intersection point of the central axis of the second pressure welding hole and the first surface (100), and the fourth position is the intersection point of the central axis of the second pressure welding hole and the second surface (200).
Step S2: electroless copper deposition and electroplating; the copper layer 4 with preset thickness is attached to the inner walls of the first through hole 122, the second through hole 222, the first cavity 11 and the fourth cavity 21; as shown in fig. 11. Through the execution of the step, the inner walls of the first through hole and the second through hole are respectively adhered with the copper layer 4
Electroless copper plating, after electroplating, also includes:
step S21: manufacturing an outer layer graph;
for forming a first preset pattern on the first surface 100 of the PCB and a second preset pattern on the second surface 200 of the PCB; fig. 12 shows the variation of the copper sheet around the crimp holes on the first surface 100 and the second surface 200, via step S21. Since fig. 12 shows only a schematic view of a part of the crimp hole, the effect of patterning the outer layer by a variation reaction of the copper layer pattern on the surface of the PCB in the vicinity of the crimp hole is shown.
The 4 locating holes in the PCB are all non-through holes, copper in the holes is required to be avoided, and redundant copper attached to the locating holes in the edges of the PCB can be removed by corroding metal copper when an outer layer pattern is manufactured, so that copper is not arranged in the locating holes in the edges of the 4 PCB.
Step S3: drilling the signal back borehole specifically includes:
step S31: in a third position, drilling is performed in an inward direction perpendicular to the first surface 100 to form a third diameter with a depth of a sixth cavity depth h 23 Is arranged in the sixth cavity 23; as shown in fig. 13.
Step S32: in the second position, drilling is performed in an inward direction perpendicular to the second surface 200 to form a third cavity having an inner diameter of a third diameter and a depth of a third cavity depth h 13 A third cavity 13 of (a); as shown in fig. 14.
Wherein the second position is the intersection point of the central axis of the first crimp hole and the second surface (200).
In another embodiment, the drilling of the signal via further comprises:
step S0: the inner layer pattern is produced and laminated with a board for forming an inner layer signal layer and an inner layer trace 6. The inner signal layer and the inner trace 6 are formed inside the PCB through step S0, as shown in fig. 7 and 15. Wherein in fig. 7, the interior of the PCB contains only the inner signal layer; the interior of the PCB in fig. 15 includes an inner signal layer and an inner trace. Fig. 16 shows a PCB structure for a double-sided crimp element formed through steps S0-S3.
In another embodiment, step S3: the method further comprises the following steps of:
step S4: and (5) surface coating and manufacturing.
Any combination of the above optional solutions may be adopted to form an optional embodiment of the present application, which is not described herein.
Example 1
A PCB structure for a two-sided crimp element is specifically described below in connection with fig. 1-4.
As shown in fig. 1, a PCB structure for a double-sided pressure bonding element is adapted to a multi-layer PCB, the multi-layer PCB comprising: the first surface 100, the second surface 200, at least one signal layer, and a predetermined thickness H between the first surface 100 and the second surface 200. Typically, the first surface 100 has copper sheet 101 attached thereto and the second surface 200 has copper sheet 201 attached thereto. If the copper sheets are not attached to the surfaces of the first surface 100 and the second surface 200, the preset thickness H represents the distance from the outer surface of the first surface 100 to the outer surface of the second surface 200; when copper sheets are attached to the surfaces of the first surface 100 and the second surface 200, the preset thickness H represents the distance between the outer surfaces of the copper sheets on both sides.
The above-mentioned PCB structure for a double-sided compression bonding element includes: adjacent first and second press-fit holes 1 and 2 are formed parallel to the thickness direction of the PCB, the first press-fit hole 1 penetrating at least one inner layer signal layer, among the inner layer signal layers penetrated by the first press-fit hole 1, the inner layer signal layer farthest from the first surface 100 being the first signal layer 31;
the second press-fit hole 2 penetrates at least one inner layer signal layer, and among the inner layer signal layers penetrated by the second press-fit hole 2, the inner layer signal layer farthest from the second surface 200 is the second signal layer 32;
the first crimp hole 1 is formed with a first cavity 11, a second cavity 12 and a third cavity 13 in sequence along an inward direction perpendicular to the first surface 100;
the second crimp hole 2 is formed with a fourth cavity 21, a fifth cavity 22 and a sixth cavity 23 in this order in an inward direction perpendicular to the second surface 200;
the copper layer 4 with preset thickness is attached to the inner wall of the first cavity 11 and the inner wall of the second cavity 12, and the copper layer 4 is electrically connected with the inner layer signal layer penetrated by the first crimping hole;
the inner wall of the fourth cavity 21 and the inner wall of the fifth cavity 22 are attached with copper layers 4 with preset thickness, and the copper layers 4 are electrically connected with an inner layer signal layer penetrated by the second compression joint holes;
the first cavity 11 is used for accommodating a first connector 51 of the double-sided crimping element, and the first connector 51 is electrically connected with the copper layer 4 attached to the inner wall of the first cavity 11 after being crimped;
the fourth cavity 21 is used for accommodating the second connector 52 of the double-sided crimping element, and the second connector 52 is electrically connected with the copper layer 4 attached to the inner wall of the fourth cavity 21 after being crimped.
As shown in fig. 2, the first cavity 11 and the fourth cavity 21 are cylindrical cavities having an inner diameter of a first diameter, the second cavity 12 and the fifth cavity 22 are cylindrical cavities having an inner diameter of a second diameter, and the third cavity 13 and the sixth cavity 23 are cylindrical cavities having an inner diameter of a third diameter; wherein the first diameter and the third diameter are both greater than the second diameter;
as shown in fig. 3, the central axes of the first cavity 11, the second cavity 12 and the third cavity 13 are collinear to form a first crimp hole central axis;
the central axis of the fourth cavity 21, the central axis of the fifth cavity 22 and the central axis of the sixth cavity 23 are collinear to form a second crimping hole central axis;
the intersection point of the first crimp hole center axis and the first surface 100 is a first position, and the intersection point of the first crimp hole center axis and the second surface 200 is a second position;
the intersection point of the second crimp hole center axis and the first surface 100 is the third position, and the intersection point of the second crimp hole center axis and the second surface 200 is the fourth position.
As shown in fig. 4, a first cavity depth h 11 The method comprises the following steps:
h 11 ＝l c1 +t
wherein l c1 Representing the length of the first connector 51, t is a tolerance;
fourth cavity depth h 21 The method comprises the following steps:
h 21 ＝l c2 +t
wherein l c2 Representing the length of the second connector 52.
Third cavity depth h 13 The method comprises the following steps:
h 13 ＝H-(h 1 +t)-t
wherein h is 1 ＝max(l c1 ，h s1 )，h s1 Indicating the distance from the first surface 100 to the first signal layer 31, H indicating a preset thickness;
depth h of sixth cavity 23 The method comprises the following steps:
h 23 ＝H-(h 2 +t)-t
wherein h is 2 ＝max(l c2 ，h s2 )，h s2 Representing the distance of the second surface 200 from the second signal layer 32.
Example two
A method of manufacturing a PCB structure for a two-sided crimp element is described in detail below in connection with fig. 6-14.
As shown in fig. 6, a method for manufacturing a PCB structure for a double-sided pressure-bonding element, for manufacturing any one of the PCB structures for double-sided pressure-bonding elements described in the first aspect, includes:
step S1: drilling a signal conducting hole;
for forming a first through hole 122 having a second diameter as an inner diameter and a second through hole 222 having a second diameter as an inner diameter, and forming a first cavity 11 and a fourth cavity 21;
step S2: electroless copper deposition and electroplating;
the copper layer 4 with preset thickness is attached to the inner walls of the first through hole 122, the second through hole 222, the first cavity 11 and the fourth cavity 21;
step S3: drilling a signal back hole;
for forming the third cavity 13 and the sixth cavity 23.
Step S1: the drilling signal via hole specifically comprises:
step S11: drilling in a direction perpendicular to the first surface 100 inward at a first location to form a first through hole 122 having an inner diameter of a second diameter;
step S12: in a third position, drilling in an inward direction perpendicular to the first surface 100 to form a second through hole 222 having an inner diameter of a second diameter;
for the initial form PCB as shown in fig. 7, the first and second through holes 122 and 222 are formed by performing steps S11 and S12; as shown in fig. 8.
Step S13: in a first position, drilling is performed in an inward direction perpendicular to the first surface 100 to form a first cavity having an inner diameter of a first diameter and a depth of a first cavity depth h 11 Is arranged in the first cavity 11; as shown in fig. 9.
Step S14: in the fourth position, the bore is drilled in an inward direction perpendicular to the second surface 200 to form a first diameter with a depth of a fourth cavity depth h 21 A fourth cavity 21 of (a); as shown in fig. 10.
The first position is the intersection point of the central axis of the first pressure welding hole and the first surface (100), the third position is the intersection point of the central axis of the second pressure welding hole and the first surface (100), and the fourth position is the intersection point of the central axis of the second pressure welding hole and the second surface (200).
Step S2: electroless copper deposition and electroplating; the copper layer 4 with preset thickness is attached to the inner walls of the first through hole 122, the second through hole 222, the first cavity 11 and the fourth cavity 21; as shown in fig. 11.
Electroless copper plating, after electroplating, also includes:
step S21: manufacturing an outer layer graph;
for forming a first preset pattern on the first surface 100 of the PCB and a second preset pattern on the second surface 200 of the PCB; fig. 12 shows the variation of the copper sheet around the crimp holes on the first surface 100 and the second surface 200, via step S21. Since fig. 12 only shows a schematic view of a part of the crimp hole, the change of the copper sheet pattern on the PCB surface is the reaction step S21: and (3) the effect of manufacturing an outer layer pattern.
Step S3: drilling the signal back borehole specifically includes:
step S31: in a third position, the holes are drilled in an inward direction perpendicular to the first surface 100Forming a third cavity with a third inner diameter and a sixth cavity depth h 23 Is arranged in the sixth cavity 23; as shown in fig. 13.
Step S32: in the second position, drilling is performed in an inward direction perpendicular to the second surface 200 to form a third cavity having an inner diameter of a third diameter and a depth of a third cavity depth h 13 A third cavity 13 of (a); as shown in fig. 14.
Wherein the second position is the intersection point of the central axis of the first crimp hole and the second surface (200).
Example III
Another method of manufacturing a PCB structure for a two-sided crimp element is described below in conjunction with fig. 15, 16, comprising:
step S0: making an inner layer pattern and laminating a matching plate;
step S1: drilling a signal conducting hole;
step S2: electroless copper deposition and electroplating;
step S3: drilling a signal back hole;
the steps S1 to S3 are described in detail in the second embodiment, and are not described herein.
Step S0: making an inner layer pattern and laminating a matching plate; for forming an inner signal layer and an inner trace 6. The inner signal layer and the inner trace 6 formed inside the PCB through step S0 are shown in fig. 15.
Then the steps S1-S3 are carried out. A PCB structure for a double sided crimp element was manufactured as shown in fig. 16 with inner layer traces.
Example IV
Fig. 17 shows another PCB structure for a two-sided crimp element. A PCB structure for a double-sided compression element as set forth in this embodiment is: when the first crimp hole 1 passes through two signal layers and the second crimp hole 2 passes through one signal layer, which is different from the depth of the signal layer through which the second crimp hole 2 passes in the first embodiment, the positions of the first signal layer 31 and the second signal layer 32, and a PCB structure for a double-sided crimp element finally formed through steps S1 to S3. It should be noted that, in this embodiment, the second conductive layer penetrated by the second press-connection hole 2 is shallower, and its depth is smaller than that of the two sidesThe length of the second connector 52 of the crimping element, therefore, when the second crimp aperture 2 is drilled, equation h 23 ＝H-(h 2 In +t) -t, h 2 ＝max(l c2 ，h s2 ) The value of h s2 ＝l c2 。
In particular, according to embodiments of the present application, the processes described above with reference to flowcharts may be implemented as computer software programs. For example, embodiments of the present application include a computer program product comprising a computer program loaded on a computer readable medium, the computer program comprising program code for performing the method shown in the flowcharts. In such an embodiment, the computer program may be downloaded and installed from a network via a communication device, or from memory, or from ROM. The above-described functions defined in the method of the embodiment of the present application are performed when the computer program is executed by an external processor.
It should be noted that, the computer readable medium of the embodiments of the present application may be a computer readable signal medium or a computer readable storage medium, or any combination of the two. The computer readable storage medium can be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples of the computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In embodiments of the present application, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. In contrast, in embodiments of the present application, the computer-readable signal medium may comprise a data signal propagated in baseband or as part of a carrier wave, with the computer-readable program code embodied therein. Such a propagated data signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination of the foregoing. A computer readable signal medium may also be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to: electrical wires, fiber optic cables, RF (Radio Frequency), and the like, or any suitable combination thereof.
The computer readable medium may be contained in the server; or may exist alone without being assembled into the server. The computer readable medium carries one or more programs which, when executed by the server, cause the server to: acquiring a frame rate of an application on the terminal in response to detecting that a peripheral mode of the terminal is not activated; when the frame rate meets the screen-extinguishing condition, judging whether a user is acquiring screen information of the terminal; and controlling the screen to enter an immediate dimming mode in response to the judgment result that the user does not acquire the screen information of the terminal.
Computer program code for carrying out operations for embodiments of the present application may be written in any combination of one or more programming languages, including an object oriented programming language such as Java, smalltalk, C++ or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any kind of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or may be connected to an external computer (for example, through the Internet using an Internet service provider).
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for a system or system embodiment, since it is substantially similar to a method embodiment, the description is relatively simple, with reference to the description of the method embodiment being made in part. The systems and system embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present application without undue burden.
The foregoing has outlined rather broadly the more detailed description of the application in order that the detailed description of the application that follows may be better understood, and in order that the present principles and embodiments may be better understood; also, it is within the scope of the present application to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the application.
The foregoing description of the preferred embodiments of the application is not intended to limit the application to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the application are intended to be included within the scope of the application.
Claims (9)
1. A PCB structure for a double-sided crimp element, adapted for a multi-layer PCB, the multi-layer PCB comprising: -a first surface (100), -a second surface (200), -at least one inner signal layer, -said first surface (100) and said second surface (200) having a predetermined thickness therebetween, characterized in that said structure comprises:
adjacent first compression joint holes (1) and second compression joint holes (2) are formed in parallel to the thickness direction of the PCB, the first compression joint holes (1) penetrate through at least one inner layer signal layer, and among the inner layer signal layers penetrated by the first compression joint holes (1), the inner layer signal layer farthest from the first surface (100) is a first signal layer (31);
the second press-connection hole (2) penetrates through at least one inner layer signal layer, and the inner layer signal layer farthest from the second surface (200) in the inner layer signal layers penetrated by the second press-connection hole (2) is a second signal layer (32);
the first pressure welding hole (1) is sequentially provided with a first cavity (11), a second cavity (12) and a third cavity (13) along the inward direction perpendicular to the first surface (100);
the second crimping hole (2) is sequentially formed with a fourth cavity (21), a fifth cavity (22) and a sixth cavity (23) along the inward direction perpendicular to the second surface (200);
the inner wall of the first cavity (11) and the inner wall of the second cavity (12) are attached with copper layers (4) with preset thickness, and the copper layers (4) are electrically connected with an inner layer signal layer penetrating through the first crimping holes;
the inner wall of the fourth cavity (21) and the inner wall of the fifth cavity (22) are attached with copper layers (4) with preset thickness, and the copper layers (4) are electrically connected with an inner layer signal layer penetrating through the second crimping holes;
the first cavity (11) is used for accommodating a first connector (51) of the double-sided crimping element, and the first connector (51) is electrically connected with a copper layer (4) attached to the inner wall of the first cavity (11) after being crimped;
the fourth cavity (21) is used for accommodating a second connector (52) of the double-sided crimping element, and the second connector (52) is electrically connected with a copper layer (4) attached to the inner wall of the fourth cavity (21) after being crimped;
wherein the first cavity depth h 11 The method comprises the following steps: h is a 11 ＝l c1 +t，l c1 Representing the length of the first connector (51), t being a tolerance;
fourth cavity depth h 21 The method comprises the following steps: h is a 21 ＝l c2 +t，l c2 Representing the length of the second connector (52).
2. A PCB structure for a double sided crimp element according to claim 1, characterized in that the first (11) and fourth (21) cavities are cylindrical cavities of a first diameter, the second (12) and fifth (22) cavities are cylindrical cavities of a second diameter, the third (13) and sixth (23) cavities are cylindrical cavities of a third diameter; wherein the first diameter and the third diameter are both greater than the second diameter;
the central axes of the first cavity (11), the second cavity (12) and the third cavity (13) are collinear to form a first crimping hole central axis;
the central axis of the fourth cavity (21), the central axis of the fifth cavity (22) and the central axis of the sixth cavity (23) are collinear to form a second crimping hole central axis.
3. A PCB structure for a two-sided crimp element according to claim 1, characterized in that the third cavity depth h 13 The method comprises the following steps:
h 13 ＝H-(h 1 +t)-t
wherein h is 1 ＝max(l c1 ，h s1 )，h s1 Represents the distance of the first surface (100) to the first signal layer (31), H represents a preset thickness;
depth h of sixth cavity 23 The method comprises the following steps:
h 23 ＝H-(h 2 +t)-t
wherein h is 2 ＝max(l c2 ，h s2 )，h s2 Represents the distance of the second surface (200) from the second signal layer (32).
4. A PCB structure for a double sided crimp element according to any of claims 1-3, characterized in that the PCB inner layer between the first crimp hole (1) and the second crimp hole (2) is further provided with an inner layer trace (6).
5. A method of manufacturing a PCB structure for a double-sided crimp element, for manufacturing a PCB structure for a double-sided crimp element according to any one of claims 1-4, characterized in that the manufacturing method comprises: drilling a signal via for forming a first via (122) having an inner diameter of a second diameter and a second via (222) having an inner diameter of the second diameter, and forming a first cavity depth h 11 And a depth of the first cavity (11) is a depth h of the fourth cavity 21 A fourth cavity (21) of (a);
electroless copper deposition and electroplating, wherein a copper layer (4) with preset thickness is attached to the inner walls of the first through hole (122), the second through hole (222), the first cavity (11) and the fourth cavity (21);
and drilling a signal back drill hole for forming a third cavity (13) and a sixth cavity (23).
6. The method of manufacturing a PCB structure for a double-sided crimp element of claim 5, wherein the drilling the signal via comprises:
drilling in a first position along an inward direction perpendicular to the first surface (100) to form a first through hole (122) with an inner diameter of a second diameter;
drilling in a third position in an inward direction perpendicular to the first surface (100) to form a second through hole (222) with an inner diameter of a second diameter;
in a first position, drilling in an inward direction perpendicular to the first surface (100) to form a first cavity having an inner diameter of a first diameter and a depth of a first cavity depth h 11 Is provided with a first cavity (11);
in a fourth position, drilling in an inward direction perpendicular to the second surface (200) to form a first diameter with a depth of a fourth cavity depth h 21 A fourth cavity (21) of (a);
the first position is an intersection point of the first crimp hole center axis and the first surface (100), the third position is an intersection point of the second crimp hole center axis and the first surface (100), and the fourth position is an intersection point of the second crimp hole center axis and the second surface (200).
7. A method of manufacturing a PCB structure for a two-sided crimp element according to claim 5, wherein the drilling the signal back borehole comprises:
in a third position, drilling in an inward direction perpendicular to the first surface (100) to form a third diameter with a depth of a sixth cavity depth h 23 A sixth cavity (23) of (a);
in a second position, drilling in an inward direction perpendicular to the second surface (200) to form a third cavity having an inner diameter of a third diameter and a depth of a third cavity depth h 13 A third cavity (13) of (a);
wherein the second position is an intersection of the first crimp hole center axis and the second surface (200).
8. The method of manufacturing a PCB structure for a two-sided crimp element of claim 5, wherein the electroless copper plating further comprises patterning an outer layer; the outer layer pattern is formed for forming a first preset pattern on a first surface (100) of the PCB and a second preset pattern on a second surface (200) of the PCB.
9. The method of manufacturing a PCB structure for a double-sided crimp element of claim 8, further comprising, prior to drilling the signal via: and the inner layer pattern is manufactured and laminated by a matching board, and is used for forming an inner layer signal layer and an inner layer wire (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210590291.9A CN114980500B (en) | 2022-05-26 | 2022-05-26 | PCB structure for double-sided crimping element and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210590291.9A CN114980500B (en) | 2022-05-26 | 2022-05-26 | PCB structure for double-sided crimping element and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114980500A CN114980500A (en) | 2022-08-30 |
| CN114980500B true CN114980500B (en) | 2023-08-11 |
Family
ID=82958162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210590291.9A Active CN114980500B (en) | 2022-05-26 | 2022-05-26 | PCB structure for double-sided crimping element and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114980500B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595789A (en) * | 2011-01-08 | 2012-07-18 | 上海美维电子有限公司 | Production method of cavity PCB plate |
| CN107172800A (en) * | 2017-06-08 | 2017-09-15 | 鹤山市中富兴业电路有限公司 | A kind of pcb board transmitted for antenna rf and preparation method thereof |
| CN109890149A (en) * | 2019-04-02 | 2019-06-14 | 生益电子股份有限公司 | A kind of production method and PCB of two-sided crimping PCB |
| CN111417271A (en) * | 2020-04-20 | 2020-07-14 | 深圳市汇和精密电路有限公司 | Multilayer PCB and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI252721B (en) * | 2004-09-10 | 2006-04-01 | Nan Ya Printed Circuit Board C | Method of manufacturing double-sided printed circuit board |
-
2022
- 2022-05-26 CN CN202210590291.9A patent/CN114980500B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595789A (en) * | 2011-01-08 | 2012-07-18 | 上海美维电子有限公司 | Production method of cavity PCB plate |
| CN107172800A (en) * | 2017-06-08 | 2017-09-15 | 鹤山市中富兴业电路有限公司 | A kind of pcb board transmitted for antenna rf and preparation method thereof |
| CN109890149A (en) * | 2019-04-02 | 2019-06-14 | 生益电子股份有限公司 | A kind of production method and PCB of two-sided crimping PCB |
| CN111417271A (en) * | 2020-04-20 | 2020-07-14 | 深圳市汇和精密电路有限公司 | Multilayer PCB and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114980500A (en) | 2022-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2424338B1 (en) | Multilayer printed wiring boards with holes requiring copper wrap plate | |
| CN102438413B (en) | Second-order ladder groove bottom graphical printed board and processing method thereof | |
| US7356923B2 (en) | Rigid flex interconnect via | |
| US9661758B2 (en) | Methods of segmented through hole formation using dual diameter through hole edge trimming | |
| CN103369868B (en) | A kind of manufacture method of pcb board and pcb board | |
| US20180317327A1 (en) | Methods of forming segmented vias for printed circuit boards | |
| JP5007746B2 (en) | Component built-in board | |
| US20140166355A1 (en) | Method of manufacturing printed circuit board | |
| KR20170118780A (en) | Printed wiring board and method for manufacturing same | |
| CN103517581B (en) | A kind of multi-layer PCB board manufacture method and multi-layer PCB board | |
| CN107645853B (en) | Manufacturing method of multilayer circuit board and multilayer circuit board | |
| CN105657965A (en) | Printed circuit boards having profiled conductive layer and methods of manufacturing same | |
| CN114980500B (en) | PCB structure for double-sided crimping element and manufacturing method thereof | |
| CN103781292A (en) | Circuit board and manufacturing method thereof | |
| CN103167722A (en) | Flexible printed circuit board and method for manufacturing flexible printed circuit board provided with terminals | |
| CN214413126U (en) | Circuit board | |
| CN108738379B (en) | Metallized hole forming method, circuit board manufacturing method and circuit board | |
| KR20140073758A (en) | Printed circuit board | |
| CN220733071U (en) | Printing Circuit board | |
| CN216565702U (en) | Printed circuit board with electric thick gold and electronic equipment | |
| CN113301716B (en) | Multilayer PCB with special-shaped holes and processing method | |
| CN115767882B (en) | Differential signal transmission circuit, circuit board, electronic device, and circuit manufacturing method | |
| CN112888163A (en) | Circuit board and manufacturing method thereof | |
| CN115103514A (en) | PCB component and processing method thereof | |
| CN116761332A (en) | Printed circuit board and setting method and device thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |