CN113394132A - Wafer cleaning equipment and control method thereof - Google Patents
Wafer cleaning equipment and control method thereof Download PDFInfo
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- CN113394132A CN113394132A CN202110489096.2A CN202110489096A CN113394132A CN 113394132 A CN113394132 A CN 113394132A CN 202110489096 A CN202110489096 A CN 202110489096A CN 113394132 A CN113394132 A CN 113394132A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 137
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 76
- 238000001914 filtration Methods 0.000 claims abstract description 65
- 238000001514 detection method Methods 0.000 claims abstract description 63
- 238000007664 blowing Methods 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 57
- 230000002159 abnormal effect Effects 0.000 claims description 38
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- 238000010586 diagram Methods 0.000 description 12
- 230000006870 function Effects 0.000 description 12
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- 239000004065 semiconductor Substances 0.000 description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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Abstract
The embodiment of the invention provides a wafer cleaning device and a control method of the wafer cleaning device, wherein the device comprises: the air exhaust module, the first detection module and the fan filtering module; the fan filtering module is used for blowing air to the interior of the wafer cleaning equipment after being electrified; the air exhaust module is used for exhausting air to the outside of the wafer cleaning equipment after being electrified; the first detection module is used for detecting the air exhaust pressure information of the air exhaust module and controlling the fan filter module to be electrified when the air exhaust pressure information meets a preset air exhaust condition; and when the air exhaust pressure information does not meet the preset air exhaust condition, controlling the fan filtering module to be powered off. According to the embodiment of the invention, when the exhaust pressure information of the exhaust module is detected to meet the preset exhaust condition, the fan filtering module is controlled to be electrified, so that the chemical reaction pollutants in the equipment can not be diffused to the outside of the equipment.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to wafer cleaning equipment and a control method of the wafer cleaning equipment.
Background
Cleaning techniques are an important part of wafer processing in the semiconductor industry because each step in the wafer processing process can cause contamination of the wafer, which requires cleaning of the wafer before and after each process step. The wet cleaning technology is a main cleaning technology, and the tank cleaning equipment is a wet cleaning equipment which is generally adopted at present.
The exhaust system of the existing tank type cleaning equipment is controlled by a Programmable Logic Controller (PLC for short), when the equipment is abnormal and the PLC cannot normally work, the exhaust system cannot be normally opened, a fan filtering unit in the tank type cleaning equipment still continues to work at the moment, and gas containing acid and alkali in the equipment can be diffused to the outside of the equipment along with wind, so that the physical health of workers is threatened.
Disclosure of Invention
In view of the above problems, embodiments of the present invention have been made to provide a wafer cleaning apparatus and a control method of the wafer cleaning apparatus that overcome or at least partially solve the above problems.
In order to solve the above problem, an embodiment of the present invention discloses a wafer cleaning apparatus, including: the air exhaust module, the first detection module and the fan filtering module;
the fan filtering module is used for blowing air to the interior of the wafer cleaning equipment after being electrified;
the air exhaust module is used for exhausting air to the outside of the wafer cleaning equipment after being electrified;
the first detection module is used for detecting the air exhaust pressure information of the air exhaust module and controlling the fan filter module to be electrified when the air exhaust pressure information meets a preset air exhaust condition; and when the air exhaust pressure information does not meet the preset air exhaust condition, controlling the fan filtering module to be powered off.
Optionally, the wafer cleaning apparatus further comprises: the electric cabinet door, the heating module and the second detection module;
the heating module is used for heating the chemical liquid inside the wafer cleaning equipment after being electrified;
the second detection module is used for detecting the opening and closing state of the cabinet door of the electrical cabinet and controlling the heating module to be electrified when the opening and closing state of the cabinet door of the electrical cabinet is a closed state; and controlling the heating module to be powered off when the electrical cabinet door is in an open state.
Optionally, the wafer cleaning apparatus further comprises: the device comprises a programming control module, a first power supply conversion module, a second power supply conversion module and a standby power supply;
the first power supply conversion module is connected with an external power supply, and is used for converting the voltage provided by the external power supply into voltages which are adaptive to the programming control module, the first detection module and the second detection module and supplying power to the programming control module, the first detection module and the second detection module;
the programming control module is used for outputting a working signal after being electrified and controlling the air exhaust module to be opened and closed;
the standby power supply is connected with the external power supply, the second power supply conversion module is connected with the standby power supply, and the standby power supply is used for supplying power to the second power supply conversion module when the external power supply or the first power supply conversion module fails;
and the second power supply conversion module is used for converting the voltage provided by the standby power supply into the voltage matched with the programming control module and supplying power to the programming control module.
Optionally, the first detection module is configured to control the fan filtering module to be powered on when the pressure value corresponding to the exhaust pressure information is within a normal range and the time of the pressure value within the normal range is greater than a preset time; when the pressure value corresponding to the air exhaust pressure information is in an abnormal range and the time in the abnormal range is longer than the preset time, controlling the fan filtering module to be powered off; and when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is not more than the preset time, maintaining the energization of the fan filtering module.
Optionally, the wafer cleaning apparatus further comprises: a scram key, a start key and a stop key,
and when the button state of the emergency stop button is in a non-pressed state, the button state of the start button is in a pressed state and the button state of the stop button is in a non-pressed state, the fan filtering module, the heating module and/or the standby power supply are powered on.
The embodiment of the invention also discloses a control method of the wafer cleaning equipment, which is applied to the wafer cleaning equipment and comprises the following steps:
after the air exhaust module is electrified, exhausting air to the outside of the wafer cleaning equipment;
detecting air exhaust pressure information of the air exhaust module through the first detection module, and controlling the fan filter module to be electrified to blow air inside the wafer cleaning equipment when the air exhaust pressure information meets preset air exhaust conditions; and when the air exhaust pressure information does not meet the preset air exhaust condition, controlling the fan filtering module to be powered off.
Optionally, the method further includes:
the opening and closing state of the cabinet door of the electric cabinet is detected through the second detection module, and when the opening and closing state of the cabinet door of the electric cabinet is a closed state, the heating module is controlled to be electrified to heat the chemical liquid inside the wafer cleaning equipment; and controlling the heating module to be powered off when the electrical cabinet door is in an open state.
Optionally, after the air exhaust module is powered on, the air exhaust module exhausts air to the outside of the wafer cleaning apparatus, and the air exhaust module includes:
converting the voltage provided by the external power supply into a voltage adapted to the programming control module through the first power supply conversion module, and supplying power to the programming control module;
the programming control module outputs working signals after being electrified to control the opening and closing of the air exhaust module, and the air exhaust module exhausts air to the outside of the wafer cleaning equipment when being opened.
Optionally, after the ventilation module is powered on, the air is exhausted to the outside of the wafer cleaning device, further comprising:
when the external power supply or the first power supply conversion module fails, the standby power supply supplies power to the second power supply conversion module;
and converting the voltage provided by the standby power supply into the voltage matched with the programming control module through the second power supply conversion module, and supplying power to the programming control module.
Optionally, the first detection module detects the air exhaust pressure information of the air exhaust module, and controls the fan filter module to be powered on to blow air to the interior of the wafer cleaning equipment when the air exhaust pressure information meets a preset air exhaust condition; and when the air exhaust pressure information does not satisfy the preset air exhaust condition, controlling the fan filtering module to be powered off, comprising:
when the pressure value corresponding to the air exhaust pressure information is in a normal range and the time in the normal range is longer than preset time, controlling the fan filtering module to be electrified; when the pressure value corresponding to the air exhaust pressure information is in an abnormal range and the time in the abnormal range is longer than the preset time, controlling the fan filtering module to be powered off; and when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is not more than the preset time, maintaining the energization of the fan filtering module.
Optionally, the method further includes:
and when the button state of the emergency stop button is a non-pressed state, the button state of the start button is a pressed state and the button state of the stop button is a non-pressed state, controlling the fan filtering module, the heating module and/or the standby power supply to be electrified.
The embodiment of the invention has the following advantages:
in the embodiment of the invention, the first detection module of the wafer cleaning equipment controls the fan filtering module to be electrified when detecting that the air exhaust pressure information of the air exhaust module meets the preset air exhaust condition, so that chemical reaction pollutants in the wafer cleaning equipment are prevented from being diffused to the outside of the equipment, the corrosion of the chemical pollutants to other equipment can be prevented, and the effective guarantee is provided for the health and safety of workers.
Further, the second detection module of the wafer cleaning equipment controls the heating module to be powered on when detecting that the switch state of the cabinet door of the electric cabinet is in a closed state, otherwise controls the heating module to be powered off.
Furthermore, when an external power supply or the first power supply conversion module fails, the standby power supply can be used for supplying power, and by arranging the redundancy circuit, time can be provided for workers to save process data in the wafer cleaning equipment when the equipment is powered off, so that data loss is avoided.
Drawings
FIG. 1 is a control circuit of a wafer cleaning apparatus;
FIG. 2 is a flowchart of a power-up process for a control circuit of the wafer cleaning apparatus depicted in FIG. 1;
FIG. 3 is a schematic side view of a wafer cleaning apparatus;
FIG. 4 is a block diagram of a wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 5 is a control circuit of a wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 6 is a flowchart of a power-up process for the control circuit of the wafer cleaning apparatus depicted in FIG. 5;
FIG. 7 is a block diagram of another wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 8 is a control circuit of another wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 9 is a flowchart of a power-up process for the control circuitry of the wafer cleaning apparatus depicted in FIG. 8;
FIG. 10 is a control circuit of still another wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 11 is a flowchart illustrating a power-up process of a control circuit of the wafer cleaning apparatus depicted in FIG. 10;
FIG. 12 is a control circuit of still another wafer cleaning apparatus according to an embodiment of the present invention;
FIG. 13 is a flowchart illustrating a power-up process of a control circuit of the wafer cleaning apparatus depicted in FIG. 12;
fig. 14 is a flowchart illustrating a method for controlling a wafer cleaning apparatus according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of them. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present invention.
Cleaning techniques are an important part of wafer processing in the semiconductor industry because each step in the wafer processing process can cause contamination of the wafer, which requires cleaning of the wafer before and after each process step. The wet cleaning technology is a main cleaning technology, and the tank cleaning equipment is a wet cleaning equipment which is generally adopted at present. During the operation of the tank type cleaning equipment, some unsafe conditions such as collision of mechanical parts, leakage of acid and alkali and the like exist, the dangerous factors threaten the safety of personnel and products, and in order to ensure the safety, the power supply of the equipment needs to be effectively cut off when the equipment is in danger, so that the design of a safe and effective interlocking loop is particularly important.
Referring to fig. 1, a control circuit of a wafer cleaning apparatus is shown, wherein a plant power supply 101 is used for supplying an ac voltage to the wafer cleaning apparatus; the first circuit breaker 102 is used for connecting an external power supply for the equipment; the second circuit breaker 103 is used for switching on the fan filtering module 106; the first contactor 104 is used for controlling a power supply loop of the equipment, and power can be supplied to each module in the equipment after the upper electric switch 105 is opened; the power-on switch 105 is used for controlling the coil of the first contactor 104 and controlling the equipment to be powered on; the fan filtering module 106 is used for blowing air inside the equipment after being electrified, so that a microenvironment inside the equipment is ensured to be stable, and the technological effect of the equipment is ensured; the third circuit breaker 107 is used for switching on the first power conversion module 109; the fourth circuit breaker 108 is used to turn on the heating module 110; the first power conversion module 109 is used for converting an externally provided alternating voltage into a direct voltage and supplying the direct voltage to a programming control module 112 and a sensor 113 in the device; the heating module 110 is used for heating the chemical liquid required by the process in the equipment after being electrified; the electromagnetic valve 111 is used for controlling the opening and closing of an exhaust air rotary cylinder in the equipment; the program control module 112 is used for controlling the input and output of the device; the sensors 113 are used to monitor various conditions during operation of the device.
Referring to fig. 2, a flow chart of a power-up process of a control circuit of the wafer cleaning apparatus described in fig. 1 is shown. After the equipment is connected with the plant power supply 101, the first circuit breaker 102 is closed, the second circuit breaker 103 is closed, and at this time, the fan filtering module 106 works normally. In order to ensure the stability of the microenvironment in the device, it is necessary to ensure the normal air exhaust, the power-ON switch 105 is rotated to the ON position, the coil of the first contactor 104 is powered ON, and the corresponding normally open contact is closed. Continuing to close the third circuit breaker 107, the first power conversion module 109 converts the input ac voltage to an adapted dc voltage. The 24 volts output by the first power conversion module 109 may power the programming control module 112, the sensor 113, and the solenoid valve 111. The program control module 112 has digital output DO controlled by the corresponding electromagnetic valve 111, the electromagnetic valve 111 drives the exhaust air cylinder to act, the exhaust baffle is opened, and the exhaust system works normally. When the chemical liquid needs to be heated, the fourth breaker 108 is closed to supply power to the heating module 110, so that the heating module works normally to heat the chemical liquid needed by the finished process.
Referring to fig. 3, a schematic side view of a wafer cleaning apparatus is shown, from which it can be seen that the rear middle part of the apparatus is a chemical region for supplying chemical solutions, gases, etc. to the apparatus; the rear upper part of the equipment is an electrical area which is used for controlling a power supply circuit of the equipment; the front lower part of the equipment is a process reaction area which comprises a plurality of process reaction tank bodies; the front upper part of the device is a Fan filtering area, and a Fan filtering module in the Fan filtering area can be a Fan Filter Unit (FFU) and is a modular tail end air supply device with power and a filtering effect; the rear lower part of the device is an exhaust duct. When equipment normally works, continuously blow for equipment inside through fan filter unit FFU, exhaust pipe continuously outwards airs exhaust, guarantees that the microenvironment of equipment is normal stable to when guaranteeing wafer technological effect, can not lead to the fact the corruption to equipment. The heating modules are located in the chemical zones in fig. 3, with their corresponding power supply breakers located in the electrical zones. When the chemical liquid medicine needs to be heated, the breaker in the electric area needs to be closed to heat the chemical liquid medicine.
It can be known from the above description that the opening of the air exhaust function in the existing wafer cleaning equipment is controlled by the PLC, when the equipment is abnormal, the FFU is continuously opened, when the PLC cannot output DO, the air exhaust function cannot be opened, the pollutants containing acid and alkali in the equipment will be diffused to the outside of the equipment, possibly corrode other equipment, and also have certain influence on the human body. In addition, the power supply circuit breaker of heating module is located the electrical zone of equipment top, and its supply voltage is 220 volts or 380 volts, and when opening the electrical zone regulator cubicle cabinet door of equipment, personnel expose under the dangerous voltage, have the risk of electrocuting. Further, when the equipment is overloaded, over-voltage or short-circuited, in order to protect the equipment, a main breaker connected with an external power supply is disconnected, the power supply of the whole machine is cut off, data in the process is lost, and the problem of the equipment cannot be accurately searched.
Based on this, the present invention intends to provide a wafer cleaning apparatus and a corresponding control method of a wafer cleaning apparatus that overcomes or at least partially solves the above-mentioned problems.
One of the core ideas of the embodiment of the invention is that the first detection module of the wafer cleaning equipment controls the fan filtering module to be electrified when detecting that the air exhaust pressure information of the air exhaust module meets the preset air exhaust condition, so that the chemical reaction pollutants in the wafer cleaning equipment are prevented from being diffused to the outside of the equipment, the chemical pollutants can be prevented from corroding other equipment, and the health and safety of workers are effectively guaranteed.
Referring to fig. 4, a block diagram of a wafer cleaning apparatus 400 according to an embodiment of the present invention is shown, wherein the wafer cleaning apparatus 400 includes: an exhaust module 401, a first detection module 402 and a fan filter module 403.
The blower filter module 403 is used to blow air to the interior of the wafer cleaning apparatus 400 after being powered on.
In an embodiment of the present invention, the Fan filter module 403 may be a Fan Filter Unit (FFU), and the Fan filter module 403 may blow air into the wafer cleaning apparatus 400 to keep the micro-environment inside the apparatus stable.
The exhaust module 401 is used to exhaust air to the outside of the wafer cleaning apparatus 400 after being powered on.
In an embodiment of the present invention, the exhaust module 401 may include an exhaust cylinder and an exhaust fan, and the exhaust module 401 may exhaust air to the outside of the wafer cleaning apparatus 400 after being powered on.
The first detection module 402 is configured to detect exhaust pressure information of the exhaust module 401, and control the fan filter module 403 to be powered on when the exhaust pressure information meets a preset exhaust condition; and controlling the power-off of the fan filtering module 403 when the air exhaust pressure information does not meet the preset air exhaust condition.
In an embodiment of the present invention, the first detecting module 402 may be an exhaust pressure sensor, and the first detecting module 402 is configured to monitor exhaust pressure information of the exhaust module 401. When the exhaust pressure information satisfies the preset exhaust condition, the fan filter module 403 is powered on, otherwise, the fan filter module 403 is powered off. In one example, the first detection module controls the fan filtering module to be powered on when the pressure value corresponding to the exhaust air pressure information is in a normal range and the time in the normal range is longer than preset time; when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is longer than the preset time, controlling the fan filtering module to be powered off; and when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is not more than the preset time, maintaining the energization of the fan filtering module.
The preset air exhaust condition can be set by a user according to actual needs, and the embodiment of the invention is not particularly limited.
In order to enable a person skilled in the art to better understand the embodiments of the present invention, the following description is given by way of an example:
referring to fig. 5, a control circuit of a wafer cleaning apparatus according to an embodiment of the present invention is shown, wherein a factory power supply 501 is used for supplying an ac voltage to the wafer cleaning apparatus; a first circuit breaker 502 is used to switch on an external power supply for the apparatus; the first contactor 503 is used to control the main power supply loop of the device; a relay 504 for a safety interlock control loop; the third breaker 505 is used for switching on the first power conversion module 508; the second circuit breaker 506 is used for switching on the fan filtering module 509; the delay relay 507 is used for switching on or switching off the control loop in a delayed manner; the first power conversion module 508 is configured to convert an externally provided ac voltage into an adapted dc voltage; the fan filtering module 509 is used for blowing air inside the equipment after being electrified, so that a microenvironment inside the equipment is stable, and the technological effect of the equipment is ensured; the first detection module 510 is used for monitoring the exhaust air pressure; the program control module 511 is used for controlling the input and output of the device; the solenoid valve 512 is used to control the opening and closing of the discharge air rotation cylinder in the apparatus.
Referring to fig. 6, a flow chart of a power-up process of a control circuit of the wafer cleaning apparatus described in fig. 5 is shown. When the plant power supply 501 supplies power normally, the first circuit breaker 502 and the third circuit breaker 505 are closed, the first power conversion module 508 outputs direct current voltage (for example, 24 volts), the programming control module 511 supplies power normally, the programming control module 511 has digital output DO corresponding to the control of the electromagnetic valve 512, the electromagnetic valve 512 drives an air exhaust cylinder in the air exhaust module to act, an air exhaust baffle is opened, an air exhaust function is opened, when the first detection module 510 detects that the air exhaust pressure is normal, a coil of the first contactor 503 is powered on after a preset time (for example, 90 seconds) delay, a normally open contact of the first contactor is closed, and after the second circuit breaker 506 is closed, the fan filtering module 509 starts to work when powered on. When the first detection module 510 detects that the exhaust pressure is abnormal, if the abnormal time is less than the delay time set by the delay relay 507 for 90 seconds, the fan filtering module 509 supplies power normally and keeps an open state, and when the first detection module 510 detects that the exhaust pressure is abnormal and the abnormal time is greater than the delay time set by the delay relay 507 for 90 seconds, the coil of the first contactor 503 loses power, the normally open contact thereof is opened, and the fan filtering module 509 is powered off and stops working.
In summary, in the embodiment of the present invention, when the first detection module of the wafer cleaning device detects that the air exhaust pressure information of the air exhaust module meets the preset air exhaust condition, the fan filter module is controlled to be powered on, so as to ensure that the chemical reaction pollutants inside the wafer cleaning device are not diffused to the outside of the device, prevent the chemical pollutants from corroding other devices, and provide effective guarantee for the health and safety of the working personnel. Furthermore, the delay time is set so as not to cause the equipment to be started and stopped frequently, and the reduction of the use efficiency of the equipment is avoided.
Referring to fig. 7, a block diagram of another wafer cleaning apparatus 700 according to an embodiment of the present invention is shown, wherein the wafer cleaning apparatus 700 includes: an air exhaust module 701, a first detection module 702 and a fan filter module 703.
The blower filter module 703 is used to blow air to the interior of the wafer cleaning apparatus 700 after being powered on.
In the embodiment of the present invention, the fan filter module 703 may be a fan filter unit, and the fan filter module 703 may blow air to the inside of the wafer cleaning apparatus 700 to keep the microenvironment inside the apparatus stable.
The exhaust module 701 is used to exhaust air to the outside of the wafer cleaning apparatus 700 after being powered on.
In an embodiment of the present invention, the exhaust module 701 may include an exhaust air cylinder and an exhaust air blower.
The first detection module 702 is configured to detect the exhaust pressure information of the exhaust module 701, and control the fan filtering module 703 to be powered on when a pressure value corresponding to the exhaust pressure information is within a normal range and time of the pressure value within the normal range is greater than preset time; when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is longer than the preset time, controlling the fan filtering module 703 to be powered off; and when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is not more than the preset time, maintaining the energization of the fan filtering module 703.
In an embodiment of the present invention, the first detection module 702 may be an exhaust pressure sensor. The preset time can be the delay time set by the delay relay, and the normal range of the exhaust pressure value can be determined after a large amount of experimental data.
In an alternative embodiment, the wafer cleaning apparatus 700 further comprises: an electrical cabinet door 704, a heating module 705 and a second detection module 706.
The heating module 705 is used to heat the chemical solution inside the wafer cleaning apparatus 700 after being powered on.
In the embodiment of the present invention, referring to fig. 3, chemical solutions required for performing a process on a wafer are stored in a chemical region in the middle of the rear portion of the wafer cleaning apparatus 700, the heating module 704 may be a heater, and the chemical solutions may be heated after the heating module 704 is powered on.
The second detection module 706 is configured to detect an opening/closing state of the electrical cabinet door 704, and control the heating module 705 to be powered on when the opening/closing state of the electrical cabinet door 704 is a closed state; and when the opening and closing state of the electrical cabinet door 704 is an open state, controlling the heating module 705 to be powered off.
In this embodiment of the present invention, the second detecting module 706 may be a device, such as a correlation sensor, for detecting an opening/closing state of the electrical cabinet door 704 in an electrical region of the wafer cleaning apparatus 700, and controls the heating module 705 to be powered on when the opening/closing state of the electrical cabinet door 704 is a closed state; and when the opening and closing state of the electrical cabinet door 704 is an open state, controlling the heating module 705 to be powered off. When the cabinet door is opened, the dangerous voltage of the control heater part in the electric zone is cut off, and the risk of electric shock of personnel is reduced.
Referring to fig. 8, a control circuit of another wafer cleaning apparatus according to an embodiment of the present invention is shown, wherein a factory power supply 801 is used for supplying an ac voltage to the wafer cleaning apparatus; the first circuit breaker 802 is used to switch on the external power supply for the device; the first contactor 803 is used to control the main power supply loop of the device; the third breaker 804 is used to switch on the first power conversion module 807; the fourth circuit breaker 805 is used to turn on the heating module 808; the second detection module 806 is used for detecting the switch state of the electrical area of the equipment; the first power conversion module 807 is configured to convert an externally provided ac voltage into an adapted dc voltage; the heating module 808 is used to heat the chemical solution in the chemical area inside the apparatus.
Referring to fig. 9, a flow chart of a power-up process of a control circuit of the wafer cleaning apparatus described in fig. 8 is shown. When the factory power supply 801 supplies power normally, the first circuit breaker 802 and the third circuit breaker 804 are closed, the first power supply conversion module 807 outputs adaptive direct-current voltage, the second detection module 806 detects the switching state of the current equipment electrical area, when the electrical cabinet door is closed, the coil of the first contactor 803 is electrified, the normally open contact of the coil is closed, after the fourth circuit breaker 805 is closed, the heating module 808 supplies power normally, the heating function can be started, when the electrical cabinet door is opened, the coil of the first contactor 803 loses power, the normally open contact of the first contactor 803 is opened, the heating module 808 stops working when the power is cut off, and the heating function cannot be started.
In an alternative embodiment, the wafer cleaning apparatus 700 further comprises: a program control module 707, a first power conversion module 708, a second power conversion module 709, and a backup power 710.
The first power conversion module 708 is connected to an external power source, and configured to convert a voltage provided by the external power source into voltages adapted to the programming control module 707, the first detection module 702, and the second detection module 706, and supply power to the programming control module 707, the first detection module 702, and the second detection module 706.
In an embodiment of the present invention, the programming control module 707 may be a PLC controller for controlling the input and output of various signals in the wafer cleaning apparatus 700. The external power source may be a power supply for plant services, and the first power conversion module 708 is connected to the external power source, and may convert an ac voltage provided by the external power source into a suitable dc voltage, and then supply power to the programming control module 707, the first detection module 702, and the second detection module 706, so that each module can work normally. In one example, the first power conversion module 708 may convert 380 volts ac provided by an external power source to 24 volts dc.
The program control module 707 is used for outputting a working signal after power is turned on, and controlling the opening and closing of the exhaust module 701.
In the embodiment of the present invention, after the programming control module 707 is powered on, the programming control module may output a working signal for controlling the opening and closing of the exhaust air cylinder in the exhaust module 701, so as to start the exhaust function. In one example, the wafer cleaning apparatus 700 further comprises a solenoid valve for controlling the opening and closing of the exhaust cylinder in the apparatus, the programmable control module 707 has a digital output DO corresponding to the control of the solenoid valve, and when the programmable control module 707 outputs the DO signal, the solenoid valve drives the exhaust cylinder in the exhaust module 701 to operate, and the exhaust damper opens, thereby enabling the exhaust function.
The standby power 710 is connected to an external power source, the second power conversion module 709 is connected to the standby power 710, and the standby power 710 is configured to supply power to the second power conversion module 709 when the external power source or the first power conversion module 708 fails.
In an embodiment of the present invention, the standby Power Supply 710 may be an Uninterruptible Power Supply (UPS) for providing uninterrupted Power. The standby power supply 710 is connected to an external power supply, and when the external power supply is supplying power normally, the standby power supply 710 can be charged from the external power supply and can also supply power to the outside. The backup power source 710 may remain powered externally when the external power source or the first power conversion module 708 fails.
The second power conversion module 709 is used for converting the voltage provided by the standby power 710 into a voltage suitable for the programming control module 707 and supplying power to the programming control module 707.
In the embodiment of the present invention, the second power conversion module 709 is connected to the standby power 710, and can convert the voltage provided by the standby power 710 into an adaptive voltage, and then supply power to the programming control module 707, so that the programming control module can operate normally.
In the embodiment of the invention, in order to ensure that real-time data is not lost when the equipment is abnormally powered off, the standby power supply 710 is arranged in the equipment, when the external power supply fails or the first power supply conversion module 708 connected with the external power supply fails, the standby power supply 710 can supply power in a short time, and a worker can finish storing data in the time.
Referring to fig. 10, a control circuit of a wafer cleaning apparatus according to another embodiment of the present invention is shown, wherein a factory power supply 1001 is used for supplying an ac voltage to the wafer cleaning apparatus; the first circuit breaker 1002 is used for connecting an external power supply for the device; the first contactor 1003 is used for controlling a main power supply loop of the device; the fifth circuit breaker 1004 is used to turn on the backup power supply 1006; the third breaker 1005 is used to switch on the first power conversion module 1007; the standby power supply 1006 is used for temporarily supplying power when the device is powered off; the first power conversion module 1007 is configured to convert an externally provided ac voltage into an adapted dc voltage; the sixth breaker 1008 is used to turn on the second power conversion module 1009; the second power conversion module 1009 is configured to convert an ac voltage provided by the standby power supply 1006 into an adapted dc voltage; the program control module 1010 is used for controlling the input and output of the device.
Referring to fig. 11, a flow chart of a power-up process of a control circuit of the wafer cleaning apparatus described in fig. 10 is shown. When the power supply of the plant power supply 1001 is normal, the first circuit breaker 1002 and the third circuit breaker 1005 are closed, the first power conversion module 1007 outputs adapted dc voltage, and the diode has unidirectional conductivity to provide adapted voltage for the programming control module 1010 and control the device to operate, and at the same time, the coil of the first contactor 1003 is powered on, the normally open contact of the first contactor is closed, and after the fifth circuit breaker 1004 is closed, the backup power supply 1006 is charged. The sixth breaker 1008 is closed and the second power conversion module 1009 converts the uninterrupted voltage provided by the backup power supply 1006 into an adapted dc voltage, also controlling the device action. When the first power conversion module 1007 fails or the first breaker 1002 and the third breaker 1005 are disconnected, the standby power supply 1006 discharges to ensure that the programming control module 1010 supplies power normally in a short time, and enough time is available for storing the existing data; when the second power conversion module 1009 fails, the first power conversion module 1007 can supply power to the programming control module 1010, so as to ensure the normal operation thereof.
In another alternative embodiment, the wafer cleaning apparatus 700 further comprises: a scram key, a start key and a stop key.
The emergency stop key is used for manually cutting off a power supply loop when the equipment is found to be abnormal; the starting key is used for manually controlling equipment to be powered on; the stop key is used for manually controlling the power-off of the equipment.
When the button state of the emergency stop button is not pressed, the button state of the start button is pressed, and the button state of the stop button is not pressed, the fan filtering module 703, the heating module 705 and/or the standby power supply 710 are powered on.
In the implementation of the present invention, when the key status of the emergency stop key is not pressed, the key status of the start key is pressed, and the key status of the stop key is not pressed, the fan filtering module 703, the heating module 705 and/or the standby power supply 710 can be powered on.
In order to enable a person skilled in the art to better understand the embodiments of the present invention, the following description is given by way of an example:
referring to fig. 12, a control circuit of another wafer cleaning apparatus according to an embodiment of the present invention is shown, wherein a factory power supply 1201 is used for supplying an ac voltage to the wafer cleaning apparatus; a first circuit breaker 1202 for switching on an external power supply for the apparatus; the first contactor 1203 is used for controlling a main power supply loop of the device; the second relay 1204 is used for powering on the equipment; the stop button 1205 is used for manually controlling the power off of the equipment; the second contact 1206 is a redundant contact for providing redundancy for the first contact 1203; a start key 1207 is used for powering on the artificial control equipment; the second circuit breaker 1208 is used for switching on the fan filter module 1212; the fifth circuit breaker 1209 is used to turn on the backup power supply 1213; the fourth circuit breaker 1210 is used to turn on the heating module 1214; the emergency stop key 1211 is used for artificially cutting off a power supply loop when the device is found to be abnormal; the fan filtering module 1212 is used for blowing air inside the device after being powered on, so as to ensure a stable microenvironment inside the device and ensure a process effect of the device; the standby power supply 1213 is used for temporary power supply when the device is powered off; the heating module 1214 is used for heating the chemical liquid in the chemical area inside the device; the second detection module 1215 is used for detecting the switch state of the electrical area of the equipment; the third circuit breaker 1216 is used to switch on the first power conversion module 1219; the sixth breaker 1217 is used to turn on the second power conversion module 1220; the first relay 1218 is used for a safety interlock control loop; the first power conversion module 1219 is configured to convert an externally provided ac voltage into an adapted dc voltage; the second power conversion module 1220 is configured to convert an ac voltage provided by the backup power 1213 into an adapted dc voltage; the delay relay 1221 is used for delaying to switch on or switch off the control loop; the first detection module 1222 is used for exhaust pressure monitoring; the programming control module 1223 is used for controlling the input and output of the equipment; the solenoid valve 1224 is used to control the opening and closing of an exhaust rotary cylinder in the apparatus; the air exhaust module 1225 is used for exhausting air to the outside of the equipment so as to exhaust a microenvironment containing acid and alkali inside the equipment.
Referring to fig. 13, a flow chart of a power-up process of a control circuit of the wafer cleaning apparatus described in fig. 12 is shown. When the plant power supply 1201 is supplying power normally, the first circuit breaker 1202 and the third circuit breaker 1216 are closed, the first power conversion module 1219 outputs an adapted direct current voltage, the programming control module 1223 is supplying power normally, the programming control module 1223 has a digital output DO corresponding to the control of the electromagnetic valve 1224, the electromagnetic valve 1224 drives an air exhaust cylinder in the air exhaust module 1225 to act, an air exhaust baffle is opened, an air exhaust function is opened, when the first detection module 1222 detects that the air exhaust pressure is normal, the second detection module 1215 detects that the cabinet door of the electrical cabinet in the electrical area of the equipment is closed, the emergency stop button 1211 is in an un-pressed state, the start button 1207 is pressed and kept self-locking at the moment, the stop button 1205 is kept in an un-pressed state, at the moment, the coil of the first contactor 1203 is electrified, the normally open contact of the coil is closed, meanwhile, the coil of the second contactor 1206 is electrified, the normally open contact of the coil is closed, the second circuit breaker 1208 is closed, After the fourth circuit breaker 1210 and the fifth circuit breaker 1209, the fan filtering module 1212, the heating module 1214 and the standby power supply 1213 are powered normally, the sixth circuit breaker 1217 is closed, and the second power conversion module 1220 outputs the adaptive dc voltage. Thereafter, the first power conversion module 1219 and the second power conversion module 1220 may act together on the power-up circuit, and the power-up circuit may work normally when one power supply is normal. When the first detection module 1222 detects that the exhaust pressure is abnormal and the abnormal time is longer than a preset time (for example, 90 seconds), the normally open contact of the first contactor 1203 is opened, the normally open contact of the second contactor 1206 is opened, and the heating module 1214 and the fan filtering module 1212 are powered off and stop working. When the second detection module 1215 detects that the cabinet door of the electrical cabinet in the electrical area of the equipment is opened, the normally open contact of the first contactor 1203 is opened, the normally open contact of the second contactor 1206 is opened, the heating module 1214 and the fan filtering module 1212 are powered off and stop working, and the equipment cannot normally perform a process. When the device emergency stop button 1211 is pressed manually, the normally open contact of the first contactor 1203 is opened, the normally open contact of the second contactor 1206 is opened, and the heating module 1214 and the fan filtering module 1212 are powered off and stop working.
In summary, in the embodiment of the present invention, when the first detection module of the wafer cleaning device detects that the air exhaust pressure information of the air exhaust module meets the preset air exhaust condition, the fan filter module is controlled to be powered on, so as to ensure that the chemical reaction pollutants inside the wafer cleaning device are not diffused to the outside of the device, prevent the chemical pollutants from corroding other devices, and provide effective guarantee for the health and safety of the working personnel. Further, the second detection module of the wafer cleaning equipment controls the heating module to be powered on when detecting that the switch state of the cabinet door of the electric cabinet is in a closed state, otherwise controls the heating module to be powered off. Furthermore, when an external power supply or the first power supply conversion module fails, the standby power supply can be used for supplying power, and by arranging the redundancy circuit, time can be provided for workers to save process data in the wafer cleaning equipment when the equipment is powered off, so that data loss is avoided. The scheme provides an exhaust air pressure delay monitoring loop, and the fan filtering module can be started only after the exhaust air pressure is stable for a period of time, so that ions in the equipment are not blown to the outside; when the air exhaust pressure fluctuates in a short small range in the normal operation process of the equipment, the normal power supply of the equipment cannot be influenced.
Referring to fig. 14, a flowchart illustrating steps of a method for controlling a wafer cleaning apparatus according to an embodiment of the present invention is shown, and the method is applied to the wafer cleaning apparatus described above, and specifically may include the following steps:
1401, after the air exhaust module is powered on, exhausting air to the outside of the wafer cleaning equipment;
In an embodiment of the present invention, the method further includes:
the opening and closing state of the cabinet door of the electric cabinet is detected through the second detection module, and when the opening and closing state of the cabinet door of the electric cabinet is a closed state, the heating module is controlled to be powered on to heat the chemical liquid inside the wafer cleaning equipment; and when the switch state of the cabinet door of the electric cabinet is an opening state, controlling the heating module to power off.
In an embodiment of the present invention, the exhausting the air to the outside of the wafer cleaning apparatus after the air exhausting module is powered on includes:
converting the voltage provided by the external power supply into the voltage adaptive to the programming control module through the first power supply conversion module, and supplying power to the programming control module;
the programming control module outputs working signals after being electrified to control the opening and closing of the air exhaust module, and when the air exhaust module is opened, air is exhausted to the outside of the wafer cleaning equipment.
In an embodiment of the present invention, the above-mentioned exhausting module exhausts air to the outside of the wafer cleaning apparatus after being powered on, further comprising:
when the external power supply or the first power supply conversion module fails, the standby power supply supplies power to the second power supply conversion module;
and the voltage provided by the standby power supply is converted into the voltage of the adaptive programming control module through the second power supply conversion module, and the voltage is supplied to the programming control module.
In the embodiment of the invention, the first detection module detects the air exhaust pressure information of the air exhaust module, and controls the fan filter module to be electrified to blow air to the interior of the wafer cleaning equipment when the air exhaust pressure information meets the preset air exhaust condition; and when the pressure information of airing exhaust does not satisfy the preset condition of airing exhaust, control the outage of fan filter module, include:
when the pressure value corresponding to the air exhaust pressure information is in the normal range and the time in the normal range is longer than the preset time, controlling the fan filtering module to be electrified; when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is longer than the preset time, controlling the fan filtering module to be powered off; and when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is not more than the preset time, maintaining the energization of the fan filtering module.
In an embodiment of the present invention, the method further includes:
and when the key state of the emergency stop key is in a non-pressed state, the key state of the start key is in a pressed state and the key state of the stop key is in a non-pressed state, controlling the fan filtering module, the heating module and/or the standby power supply to be electrified.
In summary, in the embodiment of the present invention, when the first detection module of the wafer cleaning device detects that the air exhaust pressure information of the air exhaust module meets the preset air exhaust condition, the fan filter module is controlled to be powered on, so as to ensure that the chemical reaction pollutants inside the wafer cleaning device are not diffused to the outside of the device, prevent the chemical pollutants from corroding other devices, and provide effective guarantee for the health and safety of the working personnel. Further, the second detection module of the wafer cleaning equipment controls the heating module to be powered on when detecting that the switch state of the cabinet door of the electric cabinet is in a closed state, otherwise controls the heating module to be powered off. Furthermore, when an external power supply or the first power supply conversion module fails, the standby power supply can be used for supplying power, and by arranging the redundancy circuit, time can be provided for workers to save process data in the wafer cleaning equipment when the equipment is powered off, so that data loss is avoided.
It should be noted that, for simplicity of description, the method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the illustrated order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments of the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
As for the method embodiment, since it is basically similar to the apparatus embodiment, the description is simple, and the relevant points can be referred to the partial description of the apparatus embodiment.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, apparatus, or computer program product. Accordingly, embodiments of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, embodiments of the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
Embodiments of the present invention are described with reference to flowchart illustrations and/or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing terminal to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing terminal to cause a series of operational steps to be performed on the computer or other programmable terminal to produce a computer implemented process such that the instructions which execute on the computer or other programmable terminal provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The wafer cleaning apparatus and the control method of the wafer cleaning apparatus provided by the present invention are described in detail above, and the principle and the implementation of the present invention are explained in the present document by applying specific examples, and the description of the above examples is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (11)
1. A wafer cleaning apparatus, comprising: the air exhaust module, the first detection module and the fan filtering module;
the fan filtering module is used for blowing air to the interior of the wafer cleaning equipment after being electrified;
the air exhaust module is used for exhausting air to the outside of the wafer cleaning equipment after being electrified;
the first detection module is used for detecting the air exhaust pressure information of the air exhaust module and controlling the fan filter module to be electrified when the air exhaust pressure information meets a preset air exhaust condition; and when the air exhaust pressure information does not meet the preset air exhaust condition, controlling the fan filtering module to be powered off.
2. The wafer cleaning apparatus according to claim 1, further comprising: the electric cabinet door, the heating module and the second detection module;
the heating module is used for heating the chemical liquid inside the wafer cleaning equipment after being electrified;
the second detection module is used for detecting the opening and closing state of the cabinet door of the electrical cabinet and controlling the heating module to be electrified when the opening and closing state of the cabinet door of the electrical cabinet is a closed state; and controlling the heating module to be powered off when the electrical cabinet door is in an open state.
3. The wafer cleaning apparatus according to claim 2, further comprising: the device comprises a programming control module, a first power supply conversion module, a second power supply conversion module and a standby power supply;
the first power supply conversion module is connected with an external power supply, and is used for converting the voltage provided by the external power supply into voltages which are adaptive to the programming control module, the first detection module and the second detection module and supplying power to the programming control module, the first detection module and the second detection module;
the programming control module is used for outputting a working signal after being electrified and controlling the air exhaust module to be opened and closed;
the standby power supply is connected with the external power supply, the second power supply conversion module is connected with the standby power supply, and the standby power supply is used for supplying power to the second power supply conversion module when the external power supply or the first power supply conversion module fails;
and the second power supply conversion module is used for converting the voltage provided by the standby power supply into the voltage matched with the programming control module and supplying power to the programming control module.
4. The wafer cleaning apparatus according to any one of claims 1 to 3,
the first detection module is used for controlling the fan filtering module to be electrified when the pressure value corresponding to the air exhaust pressure information is in a normal range and the time of the pressure value in the normal range is longer than the preset time; when the pressure value corresponding to the air exhaust pressure information is in an abnormal range and the time in the abnormal range is longer than the preset time, controlling the fan filtering module to be powered off; and when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is not more than the preset time, maintaining the energization of the fan filtering module.
5. The wafer cleaning apparatus according to claim 3, further comprising: a scram key, a start key and a stop key,
and when the button state of the emergency stop button is in a non-pressed state, the button state of the start button is in a pressed state and the button state of the stop button is in a non-pressed state, the fan filtering module, the heating module and/or the standby power supply are powered on.
6. A method for controlling a wafer cleaning apparatus, applied to the wafer cleaning apparatus according to any one of claims 1 to 5, comprising:
after the air exhaust module is electrified, exhausting air to the outside of the wafer cleaning equipment;
detecting air exhaust pressure information of the air exhaust module through the first detection module, and controlling the fan filter module to be electrified to blow air inside the wafer cleaning equipment when the air exhaust pressure information meets preset air exhaust conditions; and when the air exhaust pressure information does not meet the preset air exhaust condition, controlling the fan filtering module to be powered off.
7. The method of claim 6, further comprising:
the opening and closing state of the cabinet door of the electric cabinet is detected through the second detection module, and when the opening and closing state of the cabinet door of the electric cabinet is a closed state, the heating module is controlled to be electrified to heat the chemical liquid inside the wafer cleaning equipment; and controlling the heating module to be powered off when the electrical cabinet door is in an open state.
8. The method of claim 7, wherein said exhausting outside of said wafer cleaning device after said exhausting module is energized comprises:
converting the voltage provided by the external power supply into a voltage adapted to the programming control module through the first power supply conversion module, and supplying power to the programming control module;
the programming control module outputs working signals after being electrified to control the opening and closing of the air exhaust module, and the air exhaust module exhausts air to the outside of the wafer cleaning equipment when being opened.
9. The method of claim 8, wherein said venting the exterior of the wafer cleaning device after said venting module is energized, further comprising:
when the external power supply or the first power supply conversion module fails, the standby power supply supplies power to the second power supply conversion module;
and converting the voltage provided by the standby power supply into the voltage matched with the programming control module through the second power supply conversion module, and supplying power to the programming control module.
10. The method according to any one of claims 6 to 9, wherein the first detection module detects the air exhaust pressure information of the air exhaust module, and controls the fan filter module to be powered on to blow air to the inside of the wafer cleaning device when the air exhaust pressure information meets a preset air exhaust condition; and when the air exhaust pressure information does not satisfy the preset air exhaust condition, controlling the fan filtering module to be powered off, comprising:
when the pressure value corresponding to the air exhaust pressure information is in a normal range and the time in the normal range is longer than preset time, controlling the fan filtering module to be electrified; when the pressure value corresponding to the air exhaust pressure information is in an abnormal range and the time in the abnormal range is longer than the preset time, controlling the fan filtering module to be powered off; and when the pressure value corresponding to the air exhaust pressure information is in the abnormal range and the time in the abnormal range is not more than the preset time, maintaining the energization of the fan filtering module.
11. The method of claim 9, further comprising:
and when the button state of the emergency stop button is a non-pressed state, the button state of the start button is a pressed state and the button state of the stop button is a non-pressed state, controlling the fan filtering module, the heating module and/or the standby power supply to be electrified.
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| CN201323188Y (en) * | 2008-12-30 | 2009-10-07 | 中芯国际集成电路制造(上海)有限公司 | Exhaust device |
| CN102974588A (en) * | 2012-09-27 | 2013-03-20 | 北京七星华创电子股份有限公司 | Technology chamber air exhaust system and air exhaust method |
| KR101469548B1 (en) * | 2013-09-23 | 2014-12-05 | 주식회사 케이씨텍 | Wafer cleaning equipment and cleaning method |
| CN104952759A (en) * | 2014-03-24 | 2015-09-30 | 睿励科学仪器（上海）有限公司 | Control device and control method for microenvironment in wafer cleaning box |
| JP2017143141A (en) * | 2016-02-09 | 2017-08-17 | 信越半導体株式会社 | Single-wafer cleaning apparatus and wafer cleaning method |
| KR101949144B1 (en) * | 2018-04-11 | 2019-02-18 | 조대복 | Fan management system for semiconductor product facility |
| CN109482579A (en) * | 2018-12-07 | 2019-03-19 | 杭州鸿星电子有限公司 | A kind of cleaning system and cleaning method of quartz wafer jig |
| CN111604324A (en) * | 2020-05-15 | 2020-09-01 | 北京北方华创微电子装备有限公司 | Control method of wafer cleaning machine and wafer cleaning machine |
| CN111968930A (en) * | 2020-07-02 | 2020-11-20 | 北京烁科精微电子装备有限公司 | Wafer cleaning equipment |
| CN213026057U (en) * | 2020-09-18 | 2021-04-20 | 广东先导先进材料股份有限公司 | Wafer cleaning device and cleaning cavity thereof |
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