CN213026057U

CN213026057U - Wafer cleaning device and cleaning cavity thereof

Info

Publication number: CN213026057U
Application number: CN202022070340.5U
Authority: CN
Inventors: 廖彬; 周铁军; 陈勇; 喻胜举
Original assignee: First Semiconductor Materials Co ltd
Current assignee: First Semiconductor Materials Co ltd
Priority date: 2020-09-18
Filing date: 2020-09-18
Publication date: 2021-04-20
Anticipated expiration: 2030-09-18

Abstract

The utility model provides a wafer belt cleaning device and washing chamber thereof for wash the wafer. The cleaning cavity comprises an upper cavity cover and a lower cavity cover positioned on the lower side of the upper cavity cover, and the upper cavity cover and the lower cavity cover enclose a hollow cavity for cleaning the wafer. The upper cavity cover is provided with a hollow passage, an air inlet and an air outlet, the hollow passage is communicated with the air inlet and the air outlet, the air inlet is positioned on the inner side of the hollow passage and communicated with the hollow cavity, and the air outlet is positioned on the outer side of the hollow passage. When the wafer is cleaned, the volatile liquid medicine can enter the hollow channel through the air inlet and stay in the hollow channel or directly exit the hollow channel through the air outlet. Based on the setting of hollow passage, air inlet and gas vent, the regional separation of the regional and the contained volatility liquid medicine of wafer cleaning device's washing wafer of this application to reduced the volatility liquid medicine that is detained in the cavity of washing chamber effectively, greatly reduced the corruption of volatility liquid medicine to the wafer after wasing from this.

Description

Wafer cleaning device and cleaning cavity thereof

Technical Field

The utility model relates to a wafer processing technology field especially relates to a wafer belt cleaning device and washing chamber thereof.

Background

Wafer cleaning is one of the important links for obtaining high-quality and high-stability semiconductor wafers, is also the last link of semiconductor wafer processing, is an indispensable step for obtaining high-quality wafer surfaces, and is often the key for determining whether the wafer reaches the EPI-Ready state or not due to the stability of the wafer surfaces after cleaning, so the stability of the wafer surfaces after cleaning is of vital importance. At present, cleaning methods for semiconductor wafers fall into two broad categories, one is manual cleaning by a user; the other is automatic cleaning by using equipment.

In the process of using equipment for automatic cleaning, a wafer is generally placed in a cleaning cavity, various liquid medicines are automatically switched to be sprayed on the wafer according to program design to clean the wafer, and the commonly used cleaning liquid medicine (acidic or alkaline solution) has certain volatility, such as HCL, NH4OH and the like, so that the liquid medicine is volatilized and emitted in the cleaning process, and is harmful to human bodies; on the other hand, after the wafer is cleaned and before the wafer is taken away, the wafer is placed in the cleaning cavity for a period of time, and the chemical liquid remained in the cleaning cavity due to volatilization can continuously act on the surface of the cleaned wafer, so that the wafer is adversely affected.

SUMMERY OF THE UTILITY MODEL

In view of the problems in the prior art, an object of the present invention is to provide a wafer cleaning apparatus and a cleaning chamber thereof, which can effectively reduce the volatile liquid medicine staying in the cleaning chamber, thereby greatly reducing the corrosion of the volatile liquid medicine to the cleaned wafer.

In order to achieve the above object, the present invention provides a cleaning chamber of a wafer cleaning apparatus, which is used for cleaning a wafer. The cleaning cavity comprises an upper cavity cover and a lower cavity cover positioned on the lower side of the upper cavity cover, and the upper cavity cover and the lower cavity cover enclose a hollow cavity for cleaning the wafer. The upper cavity cover is provided with a hollow passage, an air inlet and an air outlet, the hollow passage is communicated with the air inlet and the air outlet, the air inlet is positioned on the inner side of the hollow passage and communicated with the hollow cavity, and the air outlet is positioned on the outer side of the hollow passage.

In the cleaning chamber according to some embodiments, the cleaning chamber further comprises a conduit, and the conduit is disposed at the air outlet and communicates with the hollow passage.

In a wash chamber according to some embodiments, the hollow channel is formed as an annular channel.

In the wash chamber according to some embodiments, the air inlet is plural in number, and the plural air inlets are arranged at intervals in the circumferential direction.

In the cleaning cavity according to some embodiments, the upper cavity cover is further provided with a chemical spraying port, the chemical spraying port is radially arranged on the upper cavity cover in a penetrating manner and communicated with the hollow cavity, and the chemical spraying port is used for spraying a chemical liquid to the surface of the wafer in the hollow cavity.

In the cleaning chamber according to some embodiments, the bottom of the lower chamber cover is provided with a support table for placing a wafer to be cleaned.

In the cleaning cavity according to some embodiments, the bottom of the lower cavity cover is further provided with a liquid discharge hole for discharging the waste liquid in the hollow cavity.

The utility model also provides a wafer belt cleaning device, it is used for wasing the wafer. The wafer cleaning apparatus includes the cleaning chamber described above.

In the wafer cleaning apparatus according to some embodiments, the wafer cleaning apparatus further includes a vacuum pump communicating with the hollow passage through the exhaust port of the cleaning chamber.

In some embodiments, the wafer cleaning apparatus further comprises a chemical spraying mechanism, wherein the chemical spraying mechanism is communicated with the hollow cavity of the cleaning chamber and is used for spraying a chemical liquid to the surface of the wafer in the hollow cavity.

The utility model has the advantages as follows:

when the wafer is cleaned, the volatile liquid medicine can enter the hollow channel through the air inlet and stay in the hollow channel or directly exit the hollow channel through the air outlet. Therefore, based on the arrangement of the hollow channel, the air inlet and the air outlet, the region (namely the hollow cavity) for cleaning the wafer of the wafer cleaning device is separated from the region (namely the hollow channel) for accommodating the volatile liquid medicine, so that the volatile liquid medicine remained in the hollow cavity of the cleaning cavity is effectively reduced, and the corrosion of the volatile liquid medicine to the cleaned wafer is greatly reduced.

Drawings

Fig. 1 is a schematic structural diagram of a wafer cleaning apparatus according to the present invention.

Fig. 2 is a perspective view of the cleaning chamber of the wafer cleaning apparatus of the present invention from a viewing angle.

Fig. 3 is a perspective view of the cleaning chamber of the wafer cleaning apparatus of the present invention from another perspective.

Fig. 4 is a front view of fig. 2.

Fig. 5 is a sectional view taken along line a-a of fig. 4.

Wherein the reference numerals are as follows:

1 cleaning chamber 121 support table

11 upper cavity cover 122 drain hole

111 hollow channel 13 conduit

112 gas inlet 2 vacuum pump

113 exhaust port 3 pesticide spraying mechanism

114 spraying medicine mouth S hollow cavity

12 lower cavity cover

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The term "plurality" in the specification and claims of this application or in the above-described drawings means more than two (including two).

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The wafer cleaning apparatus and the cleaning chamber thereof according to the present application will be described in detail with reference to the accompanying drawings.

Referring to fig. 1 to 5, the wafer cleaning apparatus of the present application includes a cleaning chamber 1. Wherein a wafer to be cleaned is placed in the cleaning chamber 1.

In some embodiments, referring to fig. 2 to 5, the washing chamber 1 includes an upper chamber cover 11 and a lower chamber cover 12 located at an underside of the upper chamber cover 11. The upper chamber cover 11 and the lower chamber cover 12 enclose a hollow chamber S for cleaning a wafer. The upper chamber cover 11 is provided with a hollow passage 111, an air inlet 112, and an air outlet 113. The hollow passage 111 communicates with an air inlet 112 and an air outlet 113. The air inlet 112 is located inside the hollow passage 111 and communicates with the hollow cavity S, and the air outlet 113 is located outside the hollow passage 111.

When cleaning the wafer, the volatile chemical liquid may enter the hollow passage 111 through the gas inlet 112 and stay in the hollow passage 111 or directly exit the hollow passage 111 through the gas outlet 113. Therefore, based on the arrangement of the hollow passage 111, the gas inlet 112 and the gas outlet 113, the region for cleaning the wafer (i.e. the hollow cavity S) of the wafer cleaning apparatus of the present application is separated from the region for containing the volatile chemical (i.e. the hollow passage 111), so that the volatile chemical staying in the hollow cavity S of the cleaning chamber 1 is effectively reduced, thereby greatly reducing the corrosion of the wafer after cleaning by the volatile chemical.

In some embodiments, referring to fig. 2-5, the wash chamber 1 may further comprise a conduit 13. The duct 13 is disposed at the exhaust port 113 and communicates with the hollow passage 111 through the exhaust port 113. Wherein the duct 13 may be integrally formed with the upper cap 11, or may be separately formed and then connected to the exhaust port 113.

In some embodiments, upper chamber cover 11 is an annular structure. Specifically, the upper chamber cover 11 has an inner wall facing the hollow chamber S, an outer wall facing away from the hollow chamber S, a lower wall facing the lower chamber cover 12, and an upper wall facing away from the lower chamber cover 12, and the inner wall, the outer wall, the lower wall, and the upper wall of the upper chamber cover 11 together enclose an annular hollow passage 111. In other words, the hollow passage 111 is formed as an annular passage, as shown in fig. 5.

In some embodiments, referring to fig. 2 to 5, the air inlet 112 is plural in number, and the plural air inlets 112 are circumferentially spaced apart on the inner wall of the upper chamber cover 11. The number and the size of the openings of the air inlets 112 can be set reasonably according to the size and the strength of the upper cavity cover 11.

In some embodiments, referring to fig. 2 to 5, the upper chamber cover 11 is further provided with a medicine spraying port 114, and the medicine spraying port 114 is radially arranged through the upper chamber cover 11 (i.e. the medicine spraying port 114 radially penetrates through both the inner wall and the outer wall of the upper chamber cover 11) and is communicated with the hollow cavity S. When cleaning the wafer, the chemical solution is sprayed toward the surface of the wafer in the hollow chamber S through the chemical spraying port 114.

In some embodiments, referring to fig. 2 to 5, a support table 121 is disposed at the bottom of the lower cavity cover 12. The support table 121 is used for placing a wafer to be cleaned.

In some embodiments, referring to fig. 2 to 5, the bottom of the lower cavity cover 12 is further provided with a drainage hole 122, and the drainage hole 122 is used for draining the waste liquid in the hollow cavity S.

In some embodiments, referring to fig. 1, in order to accelerate the discharge of the volatile liquid medicine out of the hollow cavity S of the cleaning chamber 1, the wafer cleaning apparatus of the present application further includes a vacuum pump 2, the vacuum pump 2 can be communicated with the hollow channel 111 of the upper chamber cover 11 through the conduit 13 and the exhaust port 113 of the upper chamber cover 11, so that the volatile liquid medicine is rapidly discharged out of the hollow cavity S of the cleaning chamber 1 through the exhaust port 113 by the suction effect of the vacuum pump 2, thereby effectively reducing the volatile liquid medicine staying in the hollow cavity S of the cleaning chamber 1, and greatly reducing the corrosion of the volatile liquid medicine to the cleaned wafer.

In some embodiments, referring to fig. 1, the wafer cleaning apparatus of the present application further includes a spraying mechanism 3, wherein the spraying mechanism 3 is communicated with the cleaning chamber 1 through a spraying port 114 of the upper chamber cover 11 and sprays a chemical solution onto the wafer in the cleaning chamber 1 to clean the wafer.

Claims

1. A cleaning chamber (1) of a wafer cleaning device is used for cleaning wafers, and is characterized in that the cleaning chamber (1) comprises an upper chamber cover (11) and a lower chamber cover (12) positioned on the lower side of the upper chamber cover (11), and the upper chamber cover (11) and the lower chamber cover (12) enclose a hollow cavity (S) for cleaning the wafers;

the upper cavity cover (11) is provided with a hollow passage (111), an air inlet (112) and an air outlet (113), the hollow passage (111) is communicated with the air inlet (112) and the air outlet (113), the air inlet (112) is positioned on the inner side of the hollow passage (111) and communicated with the hollow cavity (S), and the air outlet (113) is positioned on the outer side of the hollow passage (111).

2. The cleaning chamber (1) of the wafer cleaning device as claimed in claim 1, wherein the cleaning chamber (1) further comprises a conduit (13), and the conduit (13) is disposed at the exhaust port (113) and communicated with the hollow channel (111).

3. Cleaning chamber (1) for wafer cleaning apparatuses according to claim 1, characterized in that the hollow channel (111) is formed as an annular channel.

4. The wafer cleaning apparatus cleaning chamber (1) according to claim 1, characterized in that the gas inlet (112) is plural in number, and the plural gas inlets (112) are arranged at intervals in a circumferential direction.

5. The cleaning chamber (1) of the wafer cleaning device as claimed in claim 1, wherein the upper chamber cover (11) is further provided with a chemical spraying port (114), the chemical spraying port (114) is radially arranged on the upper chamber cover (11) in a penetrating manner and is communicated with the hollow cavity (S), and the chemical spraying port (114) is used for spraying the chemical liquid to the surface of the wafer in the hollow cavity (S).

6. The cleaning chamber (1) of the wafer cleaning device as claimed in claim 1, characterized in that the bottom of the lower chamber cover (12) is provided with a support table (121), and the support table (121) is used for placing the wafer to be cleaned.

7. A cleaning chamber (1) of a wafer cleaning device as claimed in claim 1, characterized in that the bottom of the lower chamber cover (12) is further provided with a drain hole (122), and the drain hole (122) is used for draining the waste liquid in the hollow cavity (S).

8. Wafer cleaning apparatus for cleaning wafers, characterized in that it comprises a cleaning chamber (1) according to any one of claims 1 to 7.

9. The wafer cleaning apparatus according to claim 8, further comprising a vacuum pump (2), wherein the vacuum pump (2) is communicated with the hollow channel (111) through an exhaust port (113) of the cleaning chamber (1).

10. The wafer cleaning apparatus according to claim 8, further comprising a spraying mechanism (3), wherein the spraying mechanism (3) is communicated with the hollow cavity (S) of the cleaning chamber (1) and is used for spraying the liquid medicine to the surface of the wafer in the hollow cavity (S).