CN113373495A - Induction type nanometer diaphragm - Google Patents

Induction type nanometer diaphragm Download PDF

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Publication number
CN113373495A
CN113373495A CN202110587539.1A CN202110587539A CN113373495A CN 113373495 A CN113373495 A CN 113373495A CN 202110587539 A CN202110587539 A CN 202110587539A CN 113373495 A CN113373495 A CN 113373495A
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China
Prior art keywords
net
metal net
conducting rod
electroplating
nano
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CN202110587539.1A
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Chinese (zh)
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CN113373495B (en
Inventor
江德馨
刘鹏
何定兵
何君杰
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Liu Peng
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Dongguan Zhuoji Mechanical Equipment Technology Co ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002Cell separation, e.g. membranes, diaphragms

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses an induction type nanometer diaphragm, which at least comprises a metal net, a nanometer net and a conducting rod, wherein one end of the conducting rod is connected with the metal net, and the other end of the conducting rod is close to an electroplating cathode; the metal net is arranged close to the anode to form an induction cathode, and negative ions of the gloss agent are blocked from passing through by the principle that like poles repel each other. The conducting rod extends from the metal net to be close to the electroplating cathode so as to form an induction anode, and the nano net covers the metal net from at least one side surface, has the function of isolating gas, particularly decomposed oxygen ions, and enables the oxygen ions to be difficult to pass through, thereby having the effect of physical isolation and reducing the loss of the brightener.

Description

Induction type nanometer diaphragm
Technical Field
The invention belongs to the technical field of electroplating, and particularly relates to an induction type nanometer diaphragm for an electroplating bath, which can effectively reduce the loss of a brightener in the electroplating process.
Background
In the electroplating process, a brightener needs to be added into the electroplating solution, the brightener forms an almost complete adsorption monolayer on the surface of a plated part, micropores which are formed and disappeared continuously appear on an adsorption surface, metal can form deposition at the micropores, and the micropores are distributed in disorder, so that the metal deposition is uniformly distributed, and the brightness of a plating layer is caused. Meanwhile, the existing small crystal faces can be continuously eliminated by means of the function of geometric flattening, and the purpose of brightness is achieved.
Theoretically, the brightener is only an auxiliary agent and can be consumed in real production approximately according to the designed proportion. However, in the actual electroplating process, especially when an insoluble anode is used in the electroplating process, water molecules are electrolyzed near the anode to form oxygen ions, and the oxygen ions have an oxidizing effect on the brightener, so that extra loss of the brightener is generated, and the electroplating solution and other preparations need to be frequently replaced, thereby affecting the electroplating quality, increasing the electroplating cost and affecting the electroplating efficiency.
Disclosure of Invention
Based on the above, the primary object of the present invention is to provide an inductive nano-diaphragm, which can reduce the loss of brightener by isolating the anode from the electroplating solution, thereby ensuring the service life of the electroplating solution and reducing the electroplating cost.
Another object of the present invention is to provide an inductive nano-separator, which can form an isolation between the plating solution and the anode, and prevent oxygen ions from contacting with the brightener in the plating solution, thereby reducing the loss of the brightener.
In order to achieve the purpose, the technical scheme of the invention is as follows:
an induction type nanometer diaphragm at least comprises a metal net, a nanometer net and a conducting rod, wherein one end of the conducting rod is connected with the metal net, and the other end of the conducting rod is close to an electroplating cathode; the metal mesh is arranged close to the anode in the electroplating bath to form an induction cathode, and the negative ions of the brightener are blocked from passing through by the principle of like-pole repulsion. The conducting rod extends from the metal net to be close to the electroplating cathode so as to form an induction anode, and the nano net covers the metal net from at least one side surface, has the function of isolating gas, particularly decomposed oxygen ions, and enables the oxygen ions to be difficult to pass through, thereby having the effect of physical isolation and reducing the loss of the brightener.
Furthermore, the outside of the nano net is covered with a protection net which has a protection effect on the nano net.
Furthermore, the protection net has certain rigidity so as to have the function of a framework, can support the metal net and the nano net, and can keep the stability and the reliability of isolation.
Furthermore, the conducting rod is provided with one or more conducting rods which respectively extend towards the cathode direction to form an induction anode.
The lengths of the plurality of conducting rods can be consistent or inconsistent; when the lengths of the electroplating layers are inconsistent, the corresponding electroplating progress can be calculated through the loss of the lengths.
The invention has the beneficial effects that:
the diaphragm physically separates oxygen ions generated by the insoluble anode from the brightener through the metal mesh and the nano mesh, so that the brightener is not influenced by the oxidation caused by the influence of the oxygen ions to influence the action of the brightener, and the loss of the brightener is reduced.
Therefore, the invention can ensure the service life of the electroplating solution, reduce the electroplating cost, avoid frequent replacement of the electroplating solution and improve the electroplating efficiency.
Drawings
Fig. 1 is a schematic view of the structure of a separator realized by the present invention.
Figure 2 is a cross-sectional view of a diaphragm body in which the invention is implemented.
Figure 3 is a cross-sectional view of another diaphragm body in which the present invention is implemented.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, the inductive nano-separator implemented by the present invention includes a separator main body 10 and conductive rods 20 and 30, and is shown in fig. 2, wherein the separator main body 10 further includes a metal mesh 13, a nano-mesh 12 and a protection mesh 11, the innermost is the metal mesh 13, the metal mesh 13 is disposed near an anode in an electroplating bath to form an inductive cathode, and negative ions of a gloss agent are blocked from passing through by the principle of like-polarity repulsion. The nano-net 12 is covered on the metal net 13, and the nano-net 13 has the function of isolating gas, especially decomposed oxygen ions, so that the oxygen ions are difficult to pass through, thereby generating the effect of physically isolating the oxygen ions from the brightener, and reducing the loss of the brightener.
One end of the conducting rod (20, 30) is connected with the other end of the metal mesh 13 and is close to the electroplating cathode; the conductive rod extends from the metal mesh 13 near the plating cathode to form an induction anode, while the nano-mesh 12 covers the metal mesh 13 from at least one side.
Usually, the metal net 13 has mesh holes, and usually, a 10-mesh copper net is used to have a good isolation effect.
The nano-net 12 is a nano-scale, sub-nano-scale or micro-scale pore size net, membrane or cloth, preferably a nano-scale pore size net, membrane or cloth, such as nano-paper, dialysis membrane, etc.
The outside of the nano-net 12 is covered with a protective net 11, and the protective net 11 has a protective effect on the nano-net 12 and the metal net 13.
The protective mesh 11 is usually made of a film or cloth, and other materials may be used as long as they can transmit the plating liquid.
If a metal net with relatively hard strength is selected, the metal net has rigidity to form a support, and the nano net and the protection net can be stably fixed on the metal net. However, when the metal net is thin and cannot form a rigid supporting structure, and is a metal soft net, a frame is required to support the metal soft net, the nano net and the protection net, and at this time, the protection net 11 may also be designed to be a rigid structure, and if the metal net is thick and has certain strength and hardness, the metal net does not need to be supported by the protection net, and the protection net 11 only needs to provide a protection function.
The two conducting rods 20 and 30 may be the same or different in length; when the lengths of the electroplating layers are inconsistent, the corresponding electroplating progress can be calculated through the loss of the lengths.
The nano-mesh 12 may be coated on the metal mesh 13 from both sides of the metal mesh 13, as shown in fig. 3, which is another structural form of the separator body 10 of the present invention, in which the nano-mesh 12 may be coated on the metal mesh 13 from one side of the metal mesh 13, i.e., the side of the metal mesh 13 facing the anode is exposed.
In a word, the diaphragm provided by the invention physically separates oxygen ions generated by the insoluble anode from the brightener through the metal mesh and the nano mesh, so that the brightener is not influenced by the oxidation caused by the influence of the oxygen ions to influence the action of the brightener, and the loss of the brightener is reduced.
Therefore, the invention can ensure the service life of the electroplating solution, reduce the electroplating cost, avoid frequent replacement of the electroplating solution and improve the electroplating efficiency. Tests prove that when the copper plating solution is used in a copper plating process, the service life of the plating solution can be prolonged by 76%, the service life of the plating solution is effectively prolonged, the waste of materials is greatly reduced, the pollution to the environment can be reduced, and the copper plating solution is low-carbon and environment-friendly.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (2)

1. An induction type nanometer diaphragm at least comprises a metal net, a nanometer net and a conducting rod, wherein one end of the conducting rod is connected with the metal net, and the other end of the conducting rod is close to an electroplating cathode; the metal net is arranged close to the anode to form an induction cathode, the conducting rod extends out of the metal net to be close to the electroplating cathode to form an induction anode, and meanwhile, the nano net covers the metal net from at least one side face.
2. The inductive nanofilter of claim 1, wherein the nanomesh is further covered with a protective mesh on the outside of the nanomesh, the protective mesh protecting the nanomesh.
CN202110587539.1A 2021-05-27 2021-05-27 Induction type nanometer diaphragm Active CN113373495B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110587539.1A CN113373495B (en) 2021-05-27 2021-05-27 Induction type nanometer diaphragm

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Application Number Priority Date Filing Date Title
CN202110587539.1A CN113373495B (en) 2021-05-27 2021-05-27 Induction type nanometer diaphragm

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CN113373495A true CN113373495A (en) 2021-09-10
CN113373495B CN113373495B (en) 2022-10-04

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3923630A (en) * 1974-08-16 1975-12-02 Basf Wyandotte Corp Electrolytic cell including diaphragm and diaphragm-support structure
US4802960A (en) * 1986-02-04 1989-02-07 The Dow Chemical Company Electrochemical cell and process employing a biasing electrode
KR20130102415A (en) * 2012-03-07 2013-09-17 한국전기연구원 Nano membrain water treatment filters using thin metal film mesh and their manufacturing method
WO2018103621A1 (en) * 2016-12-05 2018-06-14 叶旖婷 Acid copper electroplating process using insoluble anode and equipment therefor
CN209368374U (en) * 2018-12-11 2019-09-10 昆山成功环保科技有限公司 Insoluble anode electro-coppering equipment
US20200407866A1 (en) * 2019-06-28 2020-12-31 Teijin Limited Plating diaphragm, plating method, and plating apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3923630A (en) * 1974-08-16 1975-12-02 Basf Wyandotte Corp Electrolytic cell including diaphragm and diaphragm-support structure
US4802960A (en) * 1986-02-04 1989-02-07 The Dow Chemical Company Electrochemical cell and process employing a biasing electrode
KR20130102415A (en) * 2012-03-07 2013-09-17 한국전기연구원 Nano membrain water treatment filters using thin metal film mesh and their manufacturing method
WO2018103621A1 (en) * 2016-12-05 2018-06-14 叶旖婷 Acid copper electroplating process using insoluble anode and equipment therefor
CN209368374U (en) * 2018-12-11 2019-09-10 昆山成功环保科技有限公司 Insoluble anode electro-coppering equipment
US20200407866A1 (en) * 2019-06-28 2020-12-31 Teijin Limited Plating diaphragm, plating method, and plating apparatus

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Applicant before: Dongguan Zhuoji mechanical equipment Technology Co.,Ltd.

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