CN113373446B

CN113373446B - Carrier for chemical polishing

Info

Publication number: CN113373446B
Application number: CN202110667661.XA
Authority: CN
Inventors: 张灿
Original assignee: Lens Technology Co Ltd
Current assignee: Lens Technology Co Ltd
Priority date: 2021-06-16
Filing date: 2021-06-16
Publication date: 2023-06-23
Anticipated expiration: 2041-06-16
Also published as: CN113373446A

Abstract

The invention discloses a carrier for chemical polishing, which comprises at least one limiting support assembly, wherein each limiting support assembly comprises: two groups of spacing racks are arranged at intervals, and each spacing rack is correspondingly provided with a plurality of V-shaped grooves; two slope surfaces respectively positioned below the two groups of limiting racks, and the two slope surfaces are respectively inclined towards the direction away from each other. The carrier for chemical polishing changes the supporting mode of the bottom of the product, namely, changes the contact mode of the bottom of the product and the carrier. Because the two slope surfaces are adopted to respectively support the two fillets at the bottom of the product, the product fillets are in point-to-surface contact with the slope surfaces, so that the contact area between the bottom of the product and the carrier is greatly reduced, the smoothness of the flowing of the solution in the chemical polishing pool at the contact position of the product fillets and the slope surfaces can be ensured, the solution is prevented from being detained, the imprinting of the product caused by the chemical reaction of the detained solution and the slope surfaces is avoided, and the appearance of the product is poor.

Description

Carrier for chemical polishing

Technical Field

The invention relates to the technical field of chemical polishing process equipment, in particular to a carrier for chemical polishing.

Background

For electronic product components such as mobile phone front and back covers, watches, vehicle-mounted display screens, computer display screens, camera lenses and the like, a chemical polishing process is generally involved, and the process is that the product is placed into a chemical polishing pool for chemical polishing so as to remove internal hidden injuries and surface microcracks of the product and enhance the plane strength and four-side pressure resistance of the product.

Currently, when placing products into a chemical polishing bath, conventional transfer carriers are used to carry the products, i.e., the products are placed into the transfer carriers, and then the Zhou Zhuaizai tool is placed into the chemical polishing bath as a whole. The traditional carrier in the prior art comprises four limiting racks and two supporting racks, wherein the four limiting racks are oppositely arranged in pairs and used for limiting two sides of a product respectively; two support racks are used to support the bottom of the product. That is, after the product is put into the conventional turnover carrier, two sides of the product are respectively contacted with the limiting racks on two sides, and the bottom edge of the product is contacted with the two supporting racks.

However, when the traditional turnover carrier is used for carrying the product to chemically polish the product, the solution in the chemical polishing pool flows very slowly, the solution circulation is not smooth at the contact part of the limiting rack and the supporting rack with the product, especially at the contact part of the supporting rack with the product, the straight edge of the bottom of the product completely falls into the bottoms of the V-shaped limiting grooves on the two supporting racks under the action of self gravity, so that the straight body position of the bottom of the product and the front and back surfaces of the product near the straight body position are respectively in full close contact with the supporting racks, the product is fixed after falling into the V-shaped limiting grooves on the supporting racks, the solution is prevented from being circularly replaced, the retained solution and the supporting racks generate irreversible chemical reaction, marks are caused on the product, and the appearance of the product is poor.

In summary, how to provide a carrier for chemical polishing to reduce the marks generated on the bottom of the product and improve the yield of the product is a problem to be solved by those skilled in the art.

Disclosure of Invention

Accordingly, the present invention is directed to a carrier for chemical polishing, which can reduce the marks generated on the bottom of the product and improve the appearance yield of the product.

In order to achieve the above object, the present invention provides the following technical solutions:

a carrier for chemical polishing comprising at least one spacing support assembly, each of the spacing support assemblies comprising:

two groups of limiting racks are arranged at intervals, and a plurality of V-shaped grooves are correspondingly arranged on each limiting rack;

and the two slope surfaces are respectively positioned below the two groups of limiting racks and are respectively inclined towards the directions away from each other.

Preferably, the inclined angle of the slope surface relative to the horizontal plane is in the range of 30-35 degrees.

Preferably, the included angle of the V-shaped groove ranges from 86 degrees to 90 degrees.

Preferably, the radius range of the bottom R angle of the V-shaped groove is 0.9 mm-1.2 mm.

Preferably, the radius of the bottom R angle is 1.0mm.

Preferably, two ends of each limiting rack and two ends of each slope surface are respectively arranged on two opposite supporting plates, each supporting plate is 904L stainless steel plate, and a nickel plating layer is arranged on the surface of each supporting plate.

Preferably, the outer sides of the two supporting plates are respectively provided with a special engineering plastic plate with strong alkali resistance.

Preferably, a connecting and fixing rod is connected between the two supporting plates, and a nickel plating layer is arranged on the surface of the connecting and fixing rod.

Preferably, two sides of the two supporting plates are respectively provided with a reinforced fixing plate, and the surfaces of the reinforced fixing plates are provided with nickel plating layers.

Preferably, the two ends of the limiting rack and the two ends of the slope surface are adjustable in the corresponding setting positions on the supporting plate.

Compared with the prior art that two support racks are used for supporting the bottom of a product, the carrier for chemical polishing changes the support mode of the bottom of the product, namely, changes the contact mode of the bottom of the product and the carrier. Because the two slope surfaces are adopted to respectively support the two fillets at the bottom of the product, the product fillets are in point-to-surface contact with the slope surfaces, so that the contact area between the bottom of the product and the carrier is greatly reduced, the smoothness of the flowing of the solution in the chemical polishing pool at the contact position of the product fillets and the slope surfaces can be ensured, the solution is prevented from being detained, the imprinting of the product caused by the chemical reaction of the detained solution and the slope surfaces is avoided, and the appearance of the product is poor.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a carrier for chemical polishing according to an embodiment of the present invention;

FIG. 2 is a schematic view of the structure of FIG. 1 from another perspective;

FIG. 3 is a schematic view of the structure of one of the spacing support assemblies shown in FIG. 1 after a product is placed therein;

FIG. 4 is a schematic view of the structure where the product contacts the ramp surface;

FIG. 5 is a front view of the product in contact with the ramp surface;

FIG. 6 is a schematic view of an L-shaped bend plate forming a ramp surface;

FIG. 7 is a schematic view of an inverted V-shaped bend plate forming a ramp surface;

FIG. 8 is a schematic view of a structure of a rack;

FIG. 9 is an enlarged view of a portion of the racks;

FIG. 10 is a schematic view of a product clamped between corresponding V-grooves of two spacing racks;

FIG. 11 is an enlarged view of a portion of the product of FIG. 10 in contact with the walls of the V-shaped slot of the rack;

fig. 12 is a schematic view showing a structure of the carrier for chemical polishing shown in fig. 1 after being placed in a chemical polishing bath.

Reference numerals in fig. 1 to 12 are as follows:

the chemical polishing device comprises a limiting rack 1, a V-shaped groove 11, a bottom R angle 12, a slope surface 2, an L-shaped bent plate 21, a first fixing plate 22, an inverted V-shaped bent plate 23, a second fixing plate 24, a supporting plate 3, a special engineering plastic plate 4, a connecting fixing rod 5, a reinforcing fixing plate 6, a product 7 and a chemical polishing pool 8.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

The invention provides a carrier for chemical polishing, which can reduce marks generated at the bottom of a product and improve the appearance yield of the product.

Please refer to fig. 1-12, which are drawings illustrating the present invention.

The invention provides a carrier for chemical polishing, which comprises at least one limiting and supporting assembly, wherein each limiting and supporting assembly comprises two groups of limiting racks 1 arranged at intervals and two slope surfaces 2 respectively positioned below the two groups of limiting racks 1, the two groups of limiting racks 1 are used for limiting two side edges of a product 7, and the two slope surfaces 2 are used for contacting with two round corners at the bottom of the product 7 so as to support the round corners at the bottom of the product 7 through the slope surfaces 2. Wherein, each spacing rack 1 corresponds and is equipped with a plurality of V-arrangement groove 11, and two slope faces 2 slope towards the direction that keeps away from each other respectively.

The carrier for chemical polishing is mainly used for carrying the product 7 and is placed in the chemical polishing tank 8 together with the product 7 so as to chemically polish the product 7.

When the product 7 is used, the product 7 is placed between two groups of limit racks 1 of the same limit support assembly, so that the product 7 is clamped into the V-shaped groove 11 of the limit rack 1, at the moment, two fillets at the bottom of the product 7 respectively fall on the two slope surfaces 2 under the action of gravity, and the two slope surfaces 2 provide support force for the product 7.

It can be seen that the present invention changes the way the bottom of the product 7 is supported, i.e. the way the bottom of the product 7 is in contact with the carrier, compared to the prior art where two support racks are used to support the bottom of the product 7. Because the two slope surfaces 2 are adopted to respectively support the two fillets at the bottom of the product 7, point-to-surface contact is formed between the fillets of the product 7 and the slope surfaces 2 (as shown in fig. 4 and 5), so that the contact area between the bottom of the product 7 and a carrier is greatly reduced, the smoothness of the solution in the chemical polishing pool 8 flowing at the contact position of the fillets of the product 7 and the slope surfaces 2 can be ensured, the solution is prevented from being detained, the imprinting of the product 7 caused by the chemical reaction of the detained solution and the slope surfaces 2 is avoided, and the bad appearance of the product 7 is caused.

It should be noted that, in this embodiment, the number of the limiting racks 1 in each group of limiting racks 1 in the single limiting support assembly is not limited, as shown in fig. 1, preferably, the number of the limiting racks 1 in each group of limiting racks 1 is two, and the two limiting racks 1 in the same group are arranged in parallel up and down, and a preset interval is provided between the two limiting racks to better define the position of the side edge of the product 7.

It will be appreciated that the greater the number of limit support assemblies, the greater the number of V-shaped grooves 11 on a single limit rack 1, the greater the number of products 7 that can be contained at one time.

In addition, different spacing supporting components can share the same group of spacing racks 1, as shown in fig. 1, including two spacing supporting components, three groups of spacing racks 1 are shared to two spacing supporting components, and a group of spacing racks 1 in the middle is shared for two spacing supporting components.

Further, the forming manner of the slope surface 2 is not limited in this embodiment, the slope surface 2 is formed by a plate-shaped member, as shown in fig. 2 and 6, preferably, the carrier for chemical polishing includes an L-shaped bending plate 21, one right-angle side of the L-shaped bending plate 21 forms a slope surface 2, and two ends of the L-shaped bending plate 21 are connected with a first fixing plate 22 for fixing the L-shaped bending plate 21 so that the slope surface 2 has a proper position; it will be appreciated that this structure has high structural strength and stability compared to a single inclined plate. In view of convenience in setting the slope surface 2 under the set of the positioning racks 1 shared by the two positioning support assemblies, it is preferable that the carrier for chemical polishing includes, as shown in fig. 2 and 7, an inverted V-shaped bent plate 23, both sides of the inverted V-shaped bent plate 23 forming one slope surface 2, respectively, that is, one inverted V-shaped bent plate 23 may provide two slope surfaces 2, and both ends of the inverted V-shaped bent plate 23 are connected with second fixing plates 24 for fixing the inverted V-shaped bent plate 23 so that the two slope surfaces 2 have appropriate positions.

It should be noted that, the specific inclination angle of the slope surface 2 is not limited in this embodiment, however, the inventors found through a lot of experiments that, unexpectedly, when the inclination angle of the slope surface 2 with respect to the horizontal plane is between 30 ° and 35 °, the mark of the bottom of the product 7 is significantly improved, and when the inclination angle of the slope surface 2 with respect to the horizontal plane is less than 30 ° or more than 35 °, the mark of the bottom of the product 7 is significantly improved, and the appearance defect rate is significantly increased. Therefore, it is preferable that the inclination angle of the slope surface 2 with respect to the horizontal surface is in the range of 30 ° to 35 ° on the basis of the above-described embodiment.

Further, the test shows that the effect is best when the inclination angle of the slope surface 2 with respect to the horizontal plane is 30 °.

In addition, the inventor finds through a large number of experiments that when the included angle of the V-shaped groove 11 of the limiting rack 1 is improperly set, after the product 7 is inserted into the V-shaped groove 11, chamfer surfaces on two sides of the product 7 or front and back surfaces of the product 7 are in contact with groove walls of the V-shaped groove 11, so that smoothness of flowing of chemical solution is affected, the solution is easy to stay, marks are formed on two sides of the product 7, and reject ratio of the product 7 is increased. In order to prevent marks from being generated on two sides of the product 7 and improve the overall yield of the product 7, the inventor finds through a large number of experiments that unexpectedly, when the included angle of the V-shaped groove 11 of the limiting rack 1 is between 86 degrees and 90 degrees, the marks on two sides of the product 7 are obviously improved, at this time, a certain included angle is formed between the chamfer surfaces on two sides of the product 7 and the groove walls of the V-shaped groove 11, so that the chamfer side edges on two sides of the product 7 are contacted with the groove walls of the V-shaped groove 11 (as shown in fig. 11), namely, the contact mode of the chamfer side edges on two sides of the product 7 is point-to-line contact, the smoothness of the flowing of the chemical solution at the contact position of the two sides of the product 7 and the limiting rack 1 is improved well, the rapid circulation of the solution is ensured, the solution retention is avoided, and the marks are reduced to the greatest extent. When the included angle of the V-shaped grooves 11 of the limiting rack 1 is smaller than 86 degrees or larger than 90 degrees, obvious marks are formed on two sides of the product 7, and the appearance reject ratio is obviously increased. Therefore, it is preferable that the angle of the V-shaped groove 11 is in the range of 86 ° to 90 ° on the basis of the above-described embodiment.

Further, experiments have shown that the effect is optimal when the angle of the V-shaped groove 11 of the racks 1 is between 86 ° and 88 °. Preferably, the included angle of the V-shaped groove 11 of the limit rack 1 is 86 ° or 88 °.

In addition, in order to make the bottom water flow of the V-shaped groove 11 sufficient, the R angle is formed at the bottom of the V-shaped groove 11, and the inventor has found through a great number of experiments that, unexpectedly, when the radius of the bottom R angle 12 of the V-shaped groove 11 is between 0.9mm and 1.2mm, the flow of the chemical solution is facilitated to be sufficient, the smoothness of the flow of the solution can be ensured, the solution can be rapidly circulated, the phenomenon that marks are generated on two sides of the product 7 due to the unsmooth flow of the chemical solution is avoided, and the appearance yield of two sides of the product 7 can be greatly improved. Therefore, it is preferable that the radius of the bottom R angle 12 of the V-shaped groove 11 is in the range of 0.9mm to 1.2mm on the basis of the above embodiment.

Further, the test shows that the radius of the bottom R angle 12 of the V-shaped groove 11 is 1.0mm, which is the best.

It can be understood that when the inclination angle of the slope surface 2 relative to the horizontal plane, the included angle of the V-shaped groove 11 of the limiting rack 1, and the radius of the bottom R-angle 12 of the V-shaped groove 11 all take appropriate values, marks on the bottom and two sides of the product 7 can be greatly reduced, so that the overall yield of the product 7 is relatively high, and experimental data are given below to support the above experimental results, specifically please refer to tables 1 to 3. In tables 1 to 3, the specific angle value of the slope surface 2 is the inclination angle with respect to the horizontal plane.

TABLE 1

As can be seen from Table 1, when the included angle of the V-shaped groove 11 of the limiting rack 1 is 88 degrees and the radius of the bottom R angle 12 of the V-shaped groove 11 is 1.0mm, the yield of the product 7 is highest when the inclination angle of the inclined surface 2 relative to the horizontal plane is 30 degrees, at this time, marks on both sides of the product 7 and the bottom of the product 7 are not obvious, and the appearance quality of the product 7 is good, so that the requirements can be met. The footprint of the sides of the product 7 and the bottom of the product 7 is also better improved when the slope 2 is inclined at an angle of 35 ° to the horizontal.

TABLE 2

As can be seen from table 2, when the inclination angle of the slope surface 2 relative to the horizontal plane is 30 °, and the radius of the bottom R angle 12 of the V-shaped groove 11 is 1.0mm, and the included angle of the V-shaped groove 11 of the limiting rack 1 is 86 ° or 88 °, the yield of the product 7 is highest, at this time, marks on both sides of the product 7 and the bottom of the product 7 are not obvious, and the product 7 has good appearance quality, and can meet the requirements. When the included angle of the V-shaped groove 11 of the limiting rack 1 is 90 degrees, marks on two sides of the product 7 and the bottom of the product 7 are also improved better.

TABLE 3 Table 3

As can be seen from Table 3, when the inclination angle of the slope surface 2 relative to the horizontal plane is 30 degrees, and the included angle of the V-shaped groove 11 of the limiting rack 1 is 90 degrees, the yield of the product 7 is higher when the radius of the bottom R angle 12 of the V-shaped groove 11 is 0.9 mm-1.2 mm, wherein when the radius of the bottom R angle 12 of the V-shaped groove 11 is 1.0mm, the yield of the product 7 is highest, at the moment, marks on both sides of the product 7 and the bottom of the product 7 are not obvious, and the appearance quality of the product 7 is good, so that the requirements can be met.

In the above embodiments, considering that the solution used in the chemical polishing is a solution of high concentration sodium hydroxide and sodium gluconate and the temperature of the solution is up to 150 ℃, in order to avoid the reaction between the limiting rack 1 and the slope surface 2 and the chemical solution, the surface of the product 7 is imprinted, preferably, the limiting rack 1 is 904L stainless steel rack, and preferably, the surface of the limiting rack 1 is provided with a nickel plating layer. Similarly, the plate member forming the slope surface 2 is preferably 904L stainless steel plate, and the surface of the slope surface 2 is preferably provided with a nickel plating layer.

It will be appreciated that the two ends of each of the spacing racks 1 and the two ends of the ramp surface 2 need to be disposed on a support member for carrying, so as to ensure the relative positional relationship between the two sets of spacing racks 1 and the relative positional relationship between the spacing racks 1 and the corresponding ramp surfaces 2 in the same spacing support assembly.

Preferably, on the basis of the above embodiment, two ends of each limiting rack 1 and two ends of the slope surface 2 are respectively arranged on two opposite supporting plates 3, the supporting plates 3 are 904L stainless steel plates, and nickel plating layers are arranged on the surfaces of the supporting plates.

It should be noted that, in the prior art, the supporting plate 3 used by the conventional transfer carrier is a 304 stainless steel plate, and because the solution used in chemical polishing is a solution of high concentration sodium hydroxide and sodium gluconate and the solution temperature is up to 150 ℃, the conventional Zhou Zhuaizai tool can undergo chemical reaction when repeatedly used in the chemical solution, so that the surface of the conventional transfer carrier is blackened, the chemical solution is easy to pollute, marks are easily caused on the surface of the product 7, in order to solve the problem, the supporting plate 3 in the embodiment adopts 904L stainless steel plate, and the surface of the supporting plate 3 is provided with a nickel plating layer to resist corrosion of strong alkali. After the 904L stainless steel plate is plated with nickel, the surface is not blackened after being repeatedly used at high temperature for a long time in an environment with high temperature and low temperature, so that the pollution to the product 7 can be avoided.

In addition, considering that after the products 7 are sequentially inserted into the V-shaped grooves 11 of the limiting rack 1, the product 7 needs to be integrally lifted into the chemical polishing pool 8 by using a mechanical arm, after the product 7 is chemically polished, the chemical polishing carrier is lifted out by using the mechanical arm and rapidly placed in normal-temperature purified water for cooling and flushing, and then the chemical polishing carrier is lifted out by using the mechanical arm, when the mechanical arm is directly contacted with the 904L stainless steel support plate 3, the mechanical arm is easy to damage by long-term grabbing, and the mechanical arm needs to be replaced irregularly, so that in order to avoid damage to the mechanical arm, on the basis of the embodiment, the outer sides of the two support plates 3 are respectively provided with strong-alkali resistant special engineering plastic plates 4, for example, preferably, PEEK (polyether ether ketone) plates are respectively arranged on the outer sides of the two support plates so as to be contacted with the mechanical arm when the mechanical arm is clamped, and the mechanical arm is prevented from being directly contacted with the 904L stainless steel support plate 3, therefore, the mechanical arm can be prevented from being damaged, and the cost can be saved.

It should be noted that, in this embodiment, the specific connection mode between the special engineering plastic plate 4 and the support plate 3 is not limited, and as a preferred scheme, the support plate 3 and the special engineering plastic plate 4 on the outer side thereof are fixedly connected by 904L stainless steel special screws with nickel plated on the surface.

In addition, in order to improve the reliability of the connection between the two support plates 3, a connection fixing rod 5 is connected between the two support plates 3, and the surface of the connection fixing rod 5 is provided with a nickel plating layer. That is, the two support plates 3 are connected together by the connecting and fixing rod 5 in this embodiment, so as to improve the overall structural strength and firmness of the carrier for chemical polishing. The specific number of the connection fixing bars 5 and the arrangement positions of the connection fixing bars 5 are not limited in this embodiment, and may be set by those skilled in the art according to actual demands. For example, as shown in fig. 1 to 4, preferably, two connecting and fixing rods 5 are respectively provided between both sides of the two support plates 3; meanwhile, a connection fixing rod 5 may be provided between the bottoms of the two support plates 3.

Further, in order to enhance the structural strength of the carrier for chemical polishing, on the basis of the above embodiment, the two sides of the two support plates 3 are respectively provided with a reinforcing fixing plate 6, and the surface of the reinforcing fixing plate 6 is provided with a nickel plating layer. Preferably, as shown in fig. 1-4, a reinforcing fixation plate 6 is provided between the two connecting fixation bars 5.

In addition, in order to promote the commonality of carrier for chemical polishing, make it can adapt to the product 7 of different models, on the basis of above-mentioned embodiment, the both ends of spacing rack 1 and the both ends of ramp 2 are adjustable in the setting position on corresponding backup pad 3. That is, in this embodiment, the relative positional relationship between the two sets of limiting racks 1 and the relative positional relationship between the limiting racks 1 and the corresponding slope 2 in the same limiting support assembly are adjusted by adjusting the setting positions of the two ends of the limiting racks 1 and the setting positions of the two ends of the slope 2, so that the two sets of limiting racks 1 in the same limiting support assembly have a proper distance therebetween and the limiting racks 1 and the corresponding slope 2 have a proper distance therebetween, thereby being capable of adapting to products 7 with different sizes and improving the universality of the carrier for chemical polishing. In this embodiment, the specific adjustment manner is not limited, for example, the support plate 3 is provided with a long strip-shaped mounting hole, and when two ends of the limiting rack 1 or two ends of the ramp surface 2 are mounted, two ends of the limiting rack 1 or two ends of the ramp surface 2 are aligned to different positions of the long strip-shaped mounting hole, so that the limiting rack 1 and the ramp surface 2 have proper positions.

It should be understood that the terms "bottom," "sides," "horizontal," and the like in this disclosure indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, and are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, and a specific orientation configuration and operation, and therefore should not be construed as limiting the present application.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The carrier for chemical polishing provided by the invention is described in detail above. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.

Claims

1. The utility model provides a carrier for chemical polishing, its characterized in that includes at least one spacing supporting component, every spacing supporting component includes:

two groups of limiting racks (1) which are arranged at intervals are used for limiting two side edges of a product (7); each limiting rack (1) is correspondingly provided with a plurality of V-shaped grooves (11);

the two slope surfaces (2) are respectively positioned below the two groups of limiting racks (1), the two slope surfaces (2) are respectively inclined towards the directions away from each other, and the two slope surfaces (2) are used for being in contact with two fillets at the bottom of the product (7); the inclination angle of the slope surface (2) relative to the horizontal plane ranges from 30 degrees to 35 degrees.

2. A carrier for chemical polishing according to claim 1, wherein the V-shaped grooves (11) have an included angle ranging from 86 ° to 90 °.

3. A carrier for chemical polishing according to claim 1, wherein the radius of the bottom R angle (12) of the V-shaped groove (11) is in the range of 0.9mm to 1.2mm.

4. A carrier for chemical polishing according to claim 3, wherein the radius of the bottom R-angle (12) is 1.0mm.

5. The carrier for chemical polishing according to claim 1, wherein two ends of each of the limit racks (1) and two ends of the slope surface (2) are respectively provided with two support plates (3) which are oppositely arranged, the support plates (3) are 904L stainless steel plates, and the surfaces of the support plates are provided with nickel plating layers.

6. The carrier for chemical polishing according to claim 5, wherein the outer sides of the two support plates (3) are respectively provided with a special engineering plastic plate (4) having strong alkali resistance.

7. The carrier for chemical polishing according to claim 5, wherein a connection fixing rod (5) is connected between the two support plates (3), and a nickel plating layer is provided on the surface of the connection fixing rod (5).

8. The carrier for chemical polishing according to claim 5, wherein reinforcing and fixing plates (6) are provided on both sides of the two support plates (3), respectively, and a nickel plating layer is provided on the surface of the reinforcing and fixing plates (6).

9. The carrier for chemical polishing according to claim 5, wherein the positions of both ends of the retainer rack (1) and both ends of the slope surface (2) on the corresponding support plate (3) are adjustable.