CN112331599A - Wafer carrier - Google Patents
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- CN112331599A CN112331599A CN202011222791.4A CN202011222791A CN112331599A CN 112331599 A CN112331599 A CN 112331599A CN 202011222791 A CN202011222791 A CN 202011222791A CN 112331599 A CN112331599 A CN 112331599A
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- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A wafer carrier relates to the technical field of semiconductors. The wafer carrier comprises a supporting frame and a supporting platform connected to the inner wall of the supporting frame, wherein the supporting platform comprises at least two supporting pieces which are arranged in the same horizontal plane in an annular distribution mode, a wafer is contained in the supporting frame and carried on the supporting platform, and each supporting piece is in line contact or point contact with the wafer. The wafer carrier can effectively solve the problem that the wafer carrier in the prior art is easy to scratch the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer carrier.
Background
With the progress of technology, semiconductor electronic products, which have semiconductor chips, have been applied to various fields of social life. As can be seen, semiconductor chips are of very significant importance in today's life.
In the fabrication of semiconductor chips, wafer carriers are often used as tools for carrying wafers, so as to efficiently perform wafer processing procedures. Generally, wafers are usually horizontally stacked in a wafer carrier, and during the manufacturing process, the wafer carrier is placed on a transfer apparatus, and then the wafer is transferred from one reaction chamber to another reaction chamber for the wafer transfer; alternatively, the wafers placed on the wafer carrier are processed correspondingly (for example, the wafers are placed on the wafer carrier first, and then the wafer carrier is placed in the furnace tube for diffusion processing). However, in the high temperature annealing process of the diffusion process of the wafer carrier in the prior art, the problem of temperature difference between the edge of the wafer and the center of the wafer often occurs, so that the crystal lattice of the wafer is easily affected, and the wafer slips relative to the wafer carrier to cause the defects of scratching and the like, which affects the performance of the wafer, thereby affecting the quality of the semiconductor device.
Disclosure of Invention
The present invention provides a wafer carrier to solve the problem of scratching a wafer easily caused by the wafer carrier in the prior art.
The embodiment of the invention is realized by the following steps:
in one aspect of the present invention, a wafer carrier is provided, which includes a supporting frame and a supporting platform connected to an inner wall of the supporting frame, wherein the supporting platform includes at least two supporting members disposed in a same horizontal plane and distributed annularly, a wafer is accommodated in the supporting frame and carried on the supporting platform, and each supporting member is in line contact or point contact with the wafer. The wafer carrier can effectively solve the problem that the wafer carrier in the prior art is easy to scratch the wafer.
Optionally, the support is rod-shaped, and one end of the support is connected to an inner wall of the support frame, wherein a sidewall of the support is used for carrying the wafer.
Optionally, the support is circular in cross-section.
Optionally, the cross section of the support is polygonal, and the wafer is mounted on the edge of the support.
Optionally, the supporting member is plate-shaped, and an included angle between a carrying surface of the supporting member for carrying the wafer and an inner wall of the supporting frame is 75 ° to 90 °.
Optionally, the supporting member is plate-shaped, a convex portion is provided on a carrying surface of the supporting member for carrying the wafer, and the wafer is carried on the convex portion.
Alternatively, the surface of the convex portion for mounting the wafer is arc-shaped.
Alternatively, the convex portion has a prism shape, wherein the wafer is mounted on an edge of the convex portion.
Optionally, the coefficient of thermal expansion of the support is the same as the coefficient of thermal expansion of the wafer.
Optionally, the material of the support is the same as that of the wafer.
Optionally, the supporting frame includes two fixing plates and at least two fixing rods, wherein the fixing rods are connected between the two fixing plates, two adjacent fixing rods are arranged in parallel, and the supporting member is connected to the fixing rods.
Optionally, the fixed plate is a circular plate or a circular ring plate.
The beneficial effects of the invention include:
the application provides a wafer carrier, this wafer carrier includes braced frame and connects the supporting platform on the braced frame inner wall, and supporting platform includes at least two support pieces that just are the annular distribution setting in same horizontal plane, and the wafer is acceptd in braced frame, and carries on supporting platform, is line contact or point contact between each support piece and the wafer. Therefore, when the annealing step of the diffusion process is carried out, the wafer can be accommodated in the supporting frame and is carried on the supporting platform, so that the edge of the wafer is in contact with the supporting piece of the supporting frame, and as the contact between the wafer and each supporting piece is in line contact or point contact in the application, the contact area between the wafer and the wafer carrier can be effectively reduced, compared with the surface contact in the prior art, the scratch caused by relative sliding between the wafer and the wafer carrier can be effectively reduced to a certain extent (when the wafer is in surface contact, the contact area is large, the scratch area caused by sliding is large, and the scratch degree is relatively reduced due to the reduction of the contact area in the application), so that the quality of the wafer in the diffusion process is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a wafer carrier according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of a wafer carrier according to an embodiment of the invention;
FIG. 3 is a third schematic view of a wafer carrier according to an embodiment of the present invention;
FIG. 4 is a fourth schematic structural view of a wafer carrier according to an embodiment of the present invention;
FIG. 5 is a fifth schematic view of a wafer carrier according to an embodiment of the present invention;
fig. 6 is a sixth schematic structural view of a wafer carrier according to an embodiment of the present invention.
Icon: 10-a support frame; 11-a fixed plate; 12-a fixation rod; 20-a support platform; 21-a support; 211-a convex part; 30-a wafer; the angle alpha-is included.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 and 2, the present embodiment provides a wafer carrier, which includes a support frame 10 and a support platform 20 connected to an inner wall of the support frame 10, wherein the support platform 20 includes at least two support members 21 disposed in a same horizontal plane and distributed annularly, a wafer 30 is accommodated in the support frame 10 and mounted on the support platform 20, and each support member 21 and the wafer 30 are in line contact or point contact.
In the present embodiment, the supporting frame 10 is mainly used as a carrier for accommodating the wafer 30 and carrying the wafer 30, the supporting platform 20 is disposed on an inner wall of the supporting frame 10, and the supporting platform 20 includes at least two supporting members 21 annularly disposed in a same horizontal plane, so that the supporting platform 20 composed of at least two supporting members 21 (when there are three supporting members 21, and so on) can form a stable supporting surface to support the wafer 30. The supporting members 21 are annularly distributed on the inner wall of the supporting frame 10, and each supporting member 21 is located on the same horizontal plane, so that the supporting platform 20 is located on a stable horizontal plane, and the wafer 30 is prevented from sliding off.
It should be understood that the supporting member 21 of the supporting platform 20 has one end connected to the supporting frame 10 and the other end extended toward the central axis of the supporting frame 10. Thus, the wafer 30 can be accommodated in the support frame 10 and mounted on the support platform 20 composed of the support members 21.
Optionally, the supporting platforms 20 of the present application have multiple sets, and the multiple sets of supporting platforms 20 are arranged in a linear array along the central axis direction of the supporting frame 10, as shown in fig. 1 or fig. 2, so that one wafer carrier can accommodate and carry multiple wafers 30 at the same time, and further, the working efficiency of the wafer carrier can be improved.
It should be noted that, in the present embodiment, the distance between two adjacent supporting platforms 20 is equal and is greater than or equal to the thickness of the wafer 30, so as to facilitate the insertion of the wafer 30.
In addition, optionally, in the embodiment, the wafer 30 of the present application and each support member 21 are in line contact or point contact, so that, compared with the surface contact in the prior art, the present application can effectively reduce the contact area between the wafer 30 and the wafer carrier, so that the scratch area caused by the wafer carrier on the wafer 30 when the wafer 30 slides relative to the wafer carrier can be reduced to a certain extent, thereby effectively improving the quality of the wafer 30.
In summary, the present application provides a wafer carrier, which includes a supporting frame 10 and a supporting platform 20 connected to an inner wall of the supporting frame 10, wherein the supporting platform 20 includes at least two supporting members 21 disposed in a same horizontal plane and distributed annularly, a wafer 30 is accommodated in the supporting frame 10 and carried on the supporting platform 20, and a line contact or a point contact is formed between the wafer 30 and each supporting member 21. Thus, when the annealing step of the diffusion process is performed, the wafer 30 may be accommodated in the support frame 10 and mounted on the support platform 20, so that the edge of the wafer 30 contacts the support 21 of the support frame 10, and since the contact between the wafer 30 and each support 21 is line contact or point contact in the present application, the contact area between the wafer 30 and the wafer carrier may be effectively reduced, compared with the surface contact in the prior art, the scratch caused by the relative slip between the wafer 30 and the wafer carrier may be effectively reduced to a certain extent (when the surface contact is performed, the contact area is large, and the scratch caused by the slip is large, but the scratch is relatively reduced due to the reduction of the contact area in the present application), thereby ensuring the quality of the wafer 30 in the diffusion process.
Alternatively, in an embodiment, as shown in fig. 1 and 2, the supporting frame 10 may include two fixing plates 11 and at least two fixing rods 12, wherein the fixing rods 12 are connected between the two fixing plates 11, two adjacent fixing rods 12 are arranged in parallel, and the supporting member 21 is connected to the fixing rods 12. In this way, the fixing rods 12 may be used to connect the fixing supports 21 such that the supports 21 are distributed in a ring shape on the same horizontal plane of the support frame 10, thereby facilitating the carrying of the wafer 30.
In order to save material and facilitate installation, in the present embodiment, the number of the fixing rods 12 is at least two, for example, the number of the fixing rods 12 may be two, three, four, and the like, preferably, the number of the fixing rods 12 is three, and the number of the supporting members 21 is also three, and the supporting members 21 correspond to the fixing rods 12 one by one, so that the wafer 30 may be mounted on the supporting platform 20 composed of the three supporting members 21, thereby making the stability of the supporting platform 20 better. It should be understood that the fixing rods 12 should correspond to one of the supporting members 21 of each supporting platform 20 (i.e. when there are three fixing rods 12, three supporting members 21 are correspondingly disposed, and the three supporting members 21 are located in the same horizontal plane, the three supporting members 21 together form the supporting platform 20 for supporting the wafer 30). When the fixing rod 12 has a plurality of fixing rods, the plurality of fixing rods 12 should be arranged around the edge of the fixing plate 11 to form the fixing rods 12 distributed in a ring shape, so that the supporting members 21 are connected to the fixing rods 12 at one end and extended toward the central axis of the supporting frame 10 at the other end, and the plurality of supporting members 21 are distributed in a ring shape.
Alternatively, the fixing plate 11 is a circular plate or a circular ring plate. In this way, the fixing rod 12 may form a circular ring around the fixing plate 11, so that the supporting platform 20 composed of the supporting members 21 is also circular ring, thereby facilitating the carrying of the wafer 30, and making the stress on the edge of the wafer 30 relatively uniform.
Alternatively, in another embodiment, the support frame 10 may include two fixed plates 11 and an arc-shaped connecting plate connected between the two fixed plates 11 for connecting the support platform 20 formed by the supporters 21. Specifically, support piece 21 is the annular distribution in the inner wall of arc connecting plate, and one end and the interior wall connection of arc connecting plate, the other end extend towards the central axis of arc connecting plate and set up. In this way, the arc-shaped connection plate can be used to connect the fixed supports 21, so that the supports 21 are distributed in a ring shape on the same horizontal plane of the support frame 10, thereby facilitating the bearing of the wafer 30.
Since there are various types of line contact or point contact between the wafer 30 and each of the supports 21, the following will be exemplified in a partial form to be described separately. It should be understood that the forms of line contact or surface contact shown below are only some examples given in the embodiments of the present application, and are not limited to the forms of line contact or surface contact, and those skilled in the art can still make appropriate changes according to the actual situation on the basis of the forms given below.
In one embodiment, the support 21 may be rod-shaped. One end of the support member 21 is connected to the inner wall of the support frame 10, and the other end extends toward the central axis of the support frame, wherein the side wall of the support member 21 is used for bearing the wafer.
For example, when the support 21 has a rod shape, the support 21 may have a circular cross-section. Thus, the wafer 30 can be mounted on the columnar support 21, and the wafer 30 can be in line contact with the support 21.
In addition, when the support 21 is in a rod shape, the cross section of the support 21 may be polygonal, and when the cross section of the support 21 is polygonal, the wafer 30 is mounted on the edge of the support 21. In this way, the wafer 30 can be mounted on the edge of the support 21, so that a line contact between the wafer 30 and the support 21 is also achieved. It should be understood that in the present application, since the support platform 20 is adapted to carry the wafer 30, and prevent damage to the wafer 30, any bumps or edges should not be considered as being absolutely sharp.
In another embodiment, the support 21 may also be plate-shaped. For example, referring to fig. 1 and fig. 3, when the supporting member 21 is plate-shaped, an included angle between the supporting surface of the supporting member 21 for supporting the wafer 30 and the inner wall of the supporting frame 10 is between 75 ° and 90 °. Illustratively, the included angle may be 75 °, 80 °, 85 °, 90 °, and so on. The present application can make the supporting member 21 and the wafer 30 in line contact or point contact by setting an included angle between the supporting member 21 and the supporting frame 10. When one side of the supporting member 21 close to the wafer 30 is a plate surface, the supporting member 21 and the supporting frame 10 (i.e. the fixing rod 12) are arranged at a fixed included angle, and one edge of the supporting member 21 is in line contact with the wafer 30; when the edge of the supporting member 21 is close to the wafer 30, the supporting member 21 and the supporting frame 10 (i.e. the fixing rod 12) are arranged at a fixed included angle, so that a vertex of the supporting member 21 is in point contact with the wafer 30.
In addition, referring to fig. 4, 5 and 6, when the supporting member 21 is plate-shaped, a convex portion 211 may be further disposed on the carrying surface of the supporting member 21 for carrying the wafer 30, and the wafer 30 is carried on the convex portion 211. In this way, the wafer 30 can be in point contact or line contact with the convex portion 211.
Alternatively, the surface of the convex portion 211 for mounting the wafer 30 may have a curved surface, so that the convex portion 211 makes point contact or line contact with the wafer 30.
For example, referring to fig. 4, the convex portion 211 may be a wave-shaped bump, i.e., a surface of the bump near the wafer 30 is wave-shaped (see the shape of the wave plate). For example, two adjacent wave crests of the wave shape can be equal in height, and two adjacent wave troughs can be equal in height or unequal in height. Thus, the contact surface between the wafer 30 and the convex portion 211 is in line contact, and specifically, the contact point can be determined according to the number of the wave-shaped wave peaks, that is, when there are two wave peaks, there are two contact lines; with a peak, there is a line of contact.
For example, referring to fig. 5, a surface of the convex portion 211 close to the wafer 30 may also be hemispherical, so that the wafer 30 and the convex portion 211 can realize point contact, and the contact area between the wafer 30 and the convex portion 211 can be further effectively reduced. It should be understood that the hemispherical shape is only an illustration and not an absolute hemispherical shape.
Referring to fig. 6, in the present embodiment, optionally, the protruding portion 211 may also be in a prism shape, wherein the wafer 30 is mounted on an edge of the protruding portion 211. Illustratively, the convex portion 211 may be a triangular prism, a quadrangular prism, a pentagonal prism, or the like. Fig. 6 shows a triangular prism shape, in which one edge faces the wafer 30, so that the wafer 30 can be mounted on one edge of the triangular prism, thereby achieving line contact between the support member 21 and the support member 21 through the convex portion 211 having the triangular prism shape.
Since the high temperature annealing step is required in the diffusion process, the defect of poor alignment precision often occurs on the contact surface between the wafer 30 and the wafer carrier, thereby affecting the yield, and in order to improve the alignment precision, it is usually required that each process should reduce the influence on the alignment precision, therefore, in the present embodiment, the thermal expansion coefficient of the support 21 is optionally the same as that of the wafer 30. Thus, when the wafer carrier of the present application is used in a diffusion process, and the wafer 30 is carried and annealed at a high temperature, since the thermal expansion coefficient of the supporting member 21 is the same as that of the wafer 30, the temperature at the contact surface between the wafer 30 and the wafer carrier is consistent (the wafer carrier of the prior art, the wafer 30 and the contact surface between the wafer carrier and the wafer 30 are slightly different in temperature, which causes the edge of the wafer 30 to experience a higher temperature than that of the wafer 30, and the crystal lattice of the wafer 30 can be changed in a long-time annealing process), the problem of stress residue is effectively reduced in the long-time annealing process, that is, the crystal lattice of the wafer 30 is not changed to a certain extent, so that the overlay accuracy in the photolithography technology can be effectively improved.
In addition, since the thermal expansion coefficient of the support 21 is the same as that of the wafer 30, the thermal expansion of the wafer carrier and that of the wafer 30 are relatively consistent under high temperature conditions, so that the contact point between the wafer 30 and the wafer carrier does not slide relatively, and the scratching of the wafer 30 can be reduced to a certain extent.
Optionally, in order to determine the material of the support 21, in the present embodiment, the material of the support 21 is the same as that of the wafer 30. In this way, the material of the support 21 of the wafer carrier may be conveniently determined according to the material of the wafer 30.
For example, when the material of the wafer 30 is Al2O3In this case, the material of the supporting member 21 is also Al2O3(ii) a When the material of the wafer 30 is Si, the material of the support 21 is also Si; when the material of the wafer 30 is SiC, the material of the support 21 is SiC. Of course, the entire material of the wafer carrier of the present application may be consistent with the wafer 30.
The above description is only an alternative embodiment of the present invention and is not intended to limit the present invention, and various modifications and variations of the present invention may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
Claims (11)
1. A wafer carrier is characterized by comprising a supporting frame and a supporting platform connected to the inner wall of the supporting frame, wherein the supporting platform comprises at least two supporting pieces which are distributed annularly in the same horizontal plane, a wafer is contained in the supporting frame and carried on the supporting platform, and each supporting piece is in line contact or point contact with the wafer.
2. The wafer carrier as claimed in claim 1, wherein the support member is rod-shaped, one end of the support member is connected to an inner wall of the support frame, and a sidewall of the support member is used for carrying the wafer.
3. A wafer carrier as claimed in claim 2 wherein the support is circular in cross-section.
4. A wafer carrier as claimed in claim 2 wherein the support member is polygonal in cross-section and the wafers are carried on edges of the support member.
5. The wafer carrier as claimed in claim 1, wherein the supporting member is plate-shaped, and an included angle between a carrying surface for carrying the wafer and an inner wall of the supporting frame is 75 ° to 90 °.
6. The wafer carrier as claimed in claim 1, wherein the supporting member is plate-shaped, and a convex portion is provided on a supporting surface of the supporting member for supporting the wafer, and the wafer is mounted on the convex portion.
7. The wafer carrier as claimed in claim 6, wherein the surface of the protrusion for carrying the wafer is a cambered surface.
8. The wafer carrier as claimed in claim 6, wherein the protrusions are prism-shaped, and wherein the wafer is mounted on edges of the protrusions.
9. The wafer carrier of claim 1, wherein the coefficient of thermal expansion of the support is the same as the coefficient of thermal expansion of the wafer.
10. The wafer carrier of claim 7, wherein the support is made of the same material as the wafer.
11. The wafer carrier as claimed in claim 1, wherein the supporting frame comprises two fixing plates and at least two fixing rods, wherein the fixing rods are connected between the two fixing plates, two adjacent fixing rods are arranged in parallel, and the supporting member is connected with the fixing rods.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011222791.4A CN112331599A (en) | 2020-11-05 | 2020-11-05 | Wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011222791.4A CN112331599A (en) | 2020-11-05 | 2020-11-05 | Wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112331599A true CN112331599A (en) | 2021-02-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011222791.4A Pending CN112331599A (en) | 2020-11-05 | 2020-11-05 | Wafer carrier |
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| CN (1) | CN112331599A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113373446A (en) * | 2021-06-16 | 2021-09-10 | 蓝思科技股份有限公司 | Carrier for chemical polishing |
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| CN201347452Y (en) * | 2008-10-21 | 2009-11-18 | 中芯国际集成电路制造(北京)有限公司 | Chemical vapor deposition equipment and boat thereof |
| CN204361062U (en) * | 2014-12-09 | 2015-05-27 | 杭州大和热磁电子有限公司 | A kind of siliceous boat of silicon chip |
| CN208315519U (en) * | 2018-06-05 | 2019-01-01 | 德淮半导体有限公司 | Cassette and furnace tube apparatus |
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2020
- 2020-11-05 CN CN202011222791.4A patent/CN112331599A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201347452Y (en) * | 2008-10-21 | 2009-11-18 | 中芯国际集成电路制造(北京)有限公司 | Chemical vapor deposition equipment and boat thereof |
| CN204361062U (en) * | 2014-12-09 | 2015-05-27 | 杭州大和热磁电子有限公司 | A kind of siliceous boat of silicon chip |
| CN208315519U (en) * | 2018-06-05 | 2019-01-01 | 德淮半导体有限公司 | Cassette and furnace tube apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113373446A (en) * | 2021-06-16 | 2021-09-10 | 蓝思科技股份有限公司 | Carrier for chemical polishing |
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Application publication date: 20210205 |