CN113369301A - 用于铜网制作的压延铜箔及其制备方法 - Google Patents
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- 239000011889 copper foil Substances 0.000 title claims abstract description 124
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 72
- 239000010949 copper Substances 0.000 title claims abstract description 72
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- 238000005098 hot rolling Methods 0.000 claims abstract description 7
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 238000007670 refining Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000010308 vacuum induction melting process Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 2
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Abstract
本发明涉及金属加工领域,具体涉及一种用于铜网制作的压延铜箔及其制备方法,采用纯度≥99.99%的阴极铜进行真空感应熔炼,得到铜锭后,对铜锭进行热轧成卷得到铜板,精整铜板表面,铜板经粗轧、中轧、预精轧、成品轧制得到压延铜箔,其中每一道轧制过程中退火处理,得到的压延铜箔各组分的重量百分比含量如下:Cu>99.95%,杂质元素<0.03%,所述杂质元素为Fe、P、S、O、Zn,其中,Fe为0.0015%,P为0.0016%,S为0.0011%,O为0.0031%,Zn为0.0002%。所述压延铜箔的厚度为(0.05~0.10)±0.001mm,所述铜箔的宽度>610mm,所述压延铜箔的导电率>99%IACS,电阻率为0.01730~0.01733Ω·mm2/m,抗拉强度为160~240Mpa,延伸率为15~16.5%,所述压延铜箔中铜的金相组织晶粒的平均直径小于12um,是制备防雷击用铜网的理想母材。
Description
技术领域
本发明涉及金属加工领域,具体涉及一种用于铜网制作的压延铜箔及其制备方法。
背景技术
制备铜网的母体材料根据生产工艺的不同分为电解铜箔和压延铜箔两大类。
电解铜箔是利用电化学原理通过铜电解而制成的,采用旋转的阴极辊,使电解液中的铜阳离子沉积于阴极辊表面,再将析出的铜箔连续剥下后经表面处理而成,制成生箔的内部组织结构为垂直针状结晶构造,其生产成本相对较低,该生产工艺也叫做电解化学沉积法。
压延铜箔是利用塑性加工原理对铜锭进行压延加工,即通过对铜锭的反复轧制-退火工艺而成,其内部组织结构为片状结晶组织,压延铜箔产品的延展性较好。
目前国内,用于制备防雷击用铜网的铜箔多为压延铜箔,杂质含量高,其导电率仅为95%IACS左右,且力学性能一般,国外的电解铜箔虽然导电率可以达到98%IACS,但是制作成本高,且力学性能低于压延铜箔,不利于广泛使用。
发明内容
本发明的目的是针对现有技术对应的不足,提供一种用于铜网制作的压延铜箔的制备方法,通过铜箔热处理工艺、组织与性能实验,和轧制工艺参数实验,得到所需的热处理工艺参数与轧制工艺参数,对铜板带进行多次重复压延与退火热处理,制成生箔后,对生箔进行表面处理,得到用于铜网制作的压延铜箔。
本发明的目的是采用下述方案实现的:
用于铜网制作的压延铜箔,所述压延铜箔各组分的重量百分比含量如下:Cu>99.95%,杂质元素<0.03%,所述压延铜箔的厚度为(0.05~0.10)±0.001mm,所述压延铜箔的导电率>99%IACS,电阻率为0.01730~0.01733Ω·mm2/m。
所述杂质元素为Fe、P、S、O、Zn,其中,Fe为0.0015%,P为0.0016%,S为0.0011%,O为0.0031%,Zn为0.0002%。
所述压延铜箔的抗拉强度为160~240Mpa,延伸率为15~16.5%。
所述压延铜箔中铜的金相组织晶粒的平均直径小于12um。
所述铜箔的宽度>610mm。
用于铜网制作的压延铜箔的制备方法,包括以下步骤:
1)采用纯度≥99.99%的阴极铜进行真空感应熔炼,得到铜锭;
2)对铜锭进行热轧成卷,得到铜板;
3)精整铜板表面;
4)铜板经粗轧、中轧、预精轧、成品轧制得到压延铜箔,所述每一道轧制结束后退火处理。
轧制工艺道次按照下列公式进行分配:
式中,εcp为总加工率,ε∑为平均道次加工率,n为轧制道次数。
退火处理均采用罩式退火,退火温度为200~450℃,持续时间0.5~5h。
所述真空感应熔炼的过程如下:将阴极铜放入石墨坩埚,待阴极铜全熔后在真空度为8~30Pa的条件下精炼10分钟,搅拌均匀,采用进行氩气保护,浇铸温度为1150℃~1200℃,低温细流浇铸。
本发明包含如下有益效果:
所述压延铜箔各组分的重量百分比含量如下:Cu>99.95%,杂质元素<0.03%,所述压延铜箔的厚度为(0.05~0.10)±0.001mm,所述压延铜箔的导电率>99%IACS,电阻率为0.01730~0.01733Ω·mm2/m。
本发明选用纯度≥99.99%的阴极铜,以降低原料中自身带有的杂质元素(如Fe、P、Zn等)对成品的影响;真空感应熔炼,避免铜锭在熔炼过程中与空气接触而产生杂质元素(如O、S等),为轧制压延铜箔提供高纯度的铜锭。
在轧制前,铜板表面进行精整,保证铜板没有表面缺陷(如气孔、夹渣、氧化皮、飞边、表面裂纹等),精整后的铜板厚度为18.5~19mm;
铜板经粗轧、中轧、预精轧、成品轧制得到压延铜箔,其中每一道轧制过程中退火处理,即粗轧、中轧、预精轧、成品轧制结束后均需要退火处理,所述退火处理均采用罩式退火,退火温度为200~450℃,退火持续时间0.5~5h,即达到GBT29094-2012《铜及铜合金状态表示方法》中的软化退火状态(以下简称O60)。
申请人对不同的退火温度和时间等条件下铜箔的组织、力学性能、导电性能等进行测试和分析,摸索铜箔退火时组织对其力学性能、导电性能的影响及作用机理,明确铜箔热处理工艺、组织与性能之间的关系,优化热处理工艺,得出最佳的退火温度和退火持续时间,制备出高纯度、高导电率和成形性能优异的铜箔,为铜网制备加工提供优质铜箔母材。
对不同压下率条件下的铜带/箔材的组织、形状尺寸、缺陷、力学性能和导电性能进行分析,通过轧制工艺参数实验探索轧制工艺参数对铜带/箔材变形行为、板形、尺寸、缺陷的影响,揭示轧制过程中组织、缺陷等的演变规律及其对铜箔力学性能和导电性能的影响,优化轧制工艺参数,粗轧(包括粗轧中的道次)、中轧(包括中轧中的道次)、预精轧(包括预精轧中的道次)、成品轧制(包括成品轧制中的道次)的轧制工艺道次均按照下列公式进行分配:
式中,εcp为总加工率,ε∑为平均道次加工率,n为轧制道次数。
申请人通过实验验证采用本发明制备的压延铜箔的压延铜箔的厚度为(0.05~0.10)±0.001mm,杂质含量低,导电率高,所述压延铜箔的导电率>99%IACS,电阻率为0.01730~0.01733Ω·mm2/m,并且抗拉强度为160~240Mpa,延伸率为15~16.5%,所述压延铜箔中铜的金相组织晶粒的平均直径小于12um,从性能而言,优于目前国内的压延铜箔,从性价比而言,也优于目前国外的电解铜箔,是制备防雷击用铜网的理想母材。
附图说明
图1为本发明的流程图。
具体实施方式
如图1所示,用于铜网制作的压延铜箔的制备方法,包括以下步骤:
1)采用纯度≥99.99%的阴极铜进行真空感应熔炼,得到铜锭;
所述真空感应熔炼的过程如下:将阴极铜放入石墨坩埚,待阴极铜全熔后在真空度为8~30Pa的条件下精炼10分钟,搅拌均匀,采用进行氩气保护,浇铸温度为1150℃~1200℃,低温细流浇铸,本实施例中,浇铸成型的铜锭的横截面尺寸为300mm×620mm,采用GBT5121.1-2008《铜及铜合金化学分析方法第1部分铜含量的测定》的测量方法对铜锭的含量进行分析,保证杂质元素<0.03%;
2)对铜锭进行热轧成卷,得到铜板,本实施例中,热轧温度为900℃,热轧后得到的铜板厚度为20mm;
3)精整铜板表面:热轧后得到的铜板表面存在缺陷,利用砂轮对铜板表面进行处理,保证铜板没有表面缺陷(如气孔、夹渣、氧化皮、飞边、表面裂纹等)。精整后的铜板必须进行表面检测后,再进行下一道工序。本实施例中,精整后的铜板厚度为18.5mm。
4)铜板经粗轧、中轧、预精轧、成品轧制得到压延铜箔,其中每一道轧制过程中退火处理。
轧制工艺道次分配原则按照下列公式进行分配:
式中,εcp为总加工率,ε∑为平均道次加工率,n为轧制道次数。
精整后的铜板在粗轧结束后退火处理,铜板厚度为1.5mm,再进行中轧,中轧结束后退火处理,铜板变为铜箔,厚度为0.2mm,将该铜箔进行预精轧,预精轧结束后退火处理,铜箔厚度为0.1mm,然后根据需求进行成品轧制,成品轧制结束后退火处理,最终得到的压延铜箔厚度为0.05~0.1mm,如表1所示:
表1
工序 | 轧制工艺(单位:mm) |
粗轧 | 18.5→16→11.7→8.6→6.3→4.6→3.3→2.4→1.5 |
中轧 | 1.5→1.0→0.72→0.52→0.38→0.27→0.2 |
预精轧 | 0.2→0.14→0.1 |
成品轧制 | 0.1→0.076→0.051 |
实施例1:用于制作飞机表面、风电叶片、机电等行业所使用的铜网的压延铜箔,厚度为0.076mm;
实施例2:用于制作航空、航天、通信等屏蔽铜网、防雷击铜网的压延铜箔,厚度为0.051mm。
本发明制备得到的压延铜箔,尺寸精度为六级,其宽度越大越好。
所述退火处理均采用罩式退火,退火温度为200~450℃,持续时间0.5~5h,软化退火,本实施例中,退火温度均为300℃,退火的持续时间均为5h。
上述实施例中的压延铜箔各组分的重量百分比含量如下:Cu>99.95%,杂质元素<0.03%,所述杂质元素为Fe、P、S、O、Zn,其中,Fe为0.0015%,P为0.0016%,S为0.0011%,O为0.0031%,Zn为0.0002%。所述压延铜箔的厚度公差为±0.001mm,所述铜箔的宽度>610mm,导电率为99.5~99.6%IACS,电阻率为0.01730~0.01733Ω·mm2/m,抗拉强度为160~240Mpa,延伸率为15~16.5%,且所述压延铜箔中铜的金相组织晶粒的平均直径小于12um。
本发明制备得到的压延铜箔与国外的电解铜箔、国内的压延铜箔的成分对比如表2所示:
表2
本发明制备得到的压延铜箔在北京有色金属及电子材料分析测试中心测试分析,与国外的电解铜箔、国内的压延铜箔的导电率对比如表3所示:
表3
样品类别 | 厚度(mm) | 导电率(%IACS) | 电阻率(Ω.mm<sup>2</sup>/m) |
电解铜箔(国外) | 0.051 | 98 | 0.017595 |
压延铜箔(国内) | 0.051 | 95 | 0.01815 |
压延铜箔(实施例2) | 0.051 | 99.5 | 0.01733 |
压延铜箔(实施例1) | 0.076 | 99.6 | 0.01730 |
本发明制备得到的压延铜箔的力学性能与国外的电解铜箔、国内的压延铜箔的对比结果如表4所示:
表4
样品类别 | 厚度(mm) | 抗拉强度Rm(MPa) | 延伸率A(%) |
电解铜箔(国外) | 0.076 | 198 | 8 |
电解铜箔(国外) | 0.051 | 188 | 7 |
压延铜箔(国内) | 0.076 | 212 | 12 |
压延铜箔(实施例2) | 0.051 | 229 | 16.5 |
压延铜箔(实施例1) | 0.076 | 228 | 15.0 |
国外的电解铜箔未进行晶粒尺寸控制,而本发明制备得到的压延铜箔进行了晶粒尺寸的组织控制,其对比结果如表5所示:
表5
样品类别 | 批次 | 晶粒尺寸(μm) |
电解铜箔(国外) | - | 9.12295 |
压延铜箔(实施例2) | TW-051-190422 | 10.28607 |
压延铜箔(实施例2) | TW-051-190520 | 10.26712 |
压延铜箔(实施例2) | TW-051-190718 | 8.856617 |
压延铜箔(实施例2) | TW-051-190725 | 8.094239 |
压延铜箔(实施例2) | TW-051-190731 | 11.64408 |
压延铜箔(实施例1) | TW-076-190718 | 4.294041 |
压延铜箔(实施例1) | TW-076-190725 | 6.464452 |
压延铜箔(实施例1) | TW-076-190731 | 7.750429 |
表5中,批次TW-051-190422、TW-051-190520、TW-051-190718、、TW-051-190725、TW-051-190731、TW-076-190718、TW-076-190725、TW-076-190731均为实施例中制备得到的压延铜箔。
综上所述,本发明制备得到的压延铜箔具有以下几个优点:
(1)箔材组织致密且均匀,气孔、夹渣等缺陷少;
(2)箔材纯度高于其他工艺制备得到的铜箔;
(3)箔材塑性和成形性能好,具有更高的电导率,甚至可以达到100%IACS;
(4)尺寸精度高。
以上所述仅为本发明的优选实施例,并不用于限制本发明,本领域的技术人员在不脱离本发明的精神的前提下,对本发明进行的改动均落入本发明的保护范围。
Claims (9)
1.一种用于铜网制作的压延铜箔,其特征在于,所述压延铜箔各组分的重量百分比含量如下:Cu>99.95%,杂质元素<0.03%,所述压延铜箔的厚度为(0.05~0.10)±0.001mm,所述压延铜箔的导电率>99%IACS,电阻率为0.01730~0.01733Ω·mm2/m。
2.根据权利要求1所述的压延铜箔,其特征在于:所述杂质元素为Fe、P、S、O、Zn,其中,Fe为0.0015%,P为0.0016%,S为0.0011%,O为0.0031%,Zn为0.0002%。
3.根据权利要求1所述的压延铜箔,其特征在于:所述压延铜箔的抗拉强度为160~240Mpa,延伸率为15~16.5%。
4.根据权利要求1所述的压延铜箔,其特征在于:所述压延铜箔中铜的金相组织晶粒的平均直径小于12um。
5.根据权利要求1所述的压延铜箔,其特征在于:所述铜箔的宽度>
610mm。
6.用于铜网制作的压延铜箔的制备方法,其特征在于,包括以下步骤:
1)采用纯度≥99.99%的阴极铜进行真空感应熔炼,得到铜锭;
2)对铜锭进行热轧成卷,得到铜板;
3)精整铜板表面;
4)铜板经粗轧、中轧、预精轧、成品轧制得到压延铜箔,所述每一道轧制结束后退火处理。
8.根据权利要求6所述的制备方法,其特征在于:所述退火处理均采用罩式退火,退火温度为200~450℃,持续时间0.5~5h。
9.根据权利要求6所述的制备方法,其特征在于:所述真空感应熔炼的过程如下:将阴极铜放入石墨坩埚,待阴极铜全熔后在真空度为8~30Pa的条件下精炼10分钟,搅拌均匀,采用进行氩气保护,浇铸温度为1150℃~1200℃,低温细流浇铸。
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