CN113366418A - 触摸传感器层叠体和图像显示装置 - Google Patents
触摸传感器层叠体和图像显示装置 Download PDFInfo
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- CN113366418A CN113366418A CN202080011092.7A CN202080011092A CN113366418A CN 113366418 A CN113366418 A CN 113366418A CN 202080011092 A CN202080011092 A CN 202080011092A CN 113366418 A CN113366418 A CN 113366418A
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- touch sensor
- layer
- adhesive layer
- image display
- display device
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- 239000010410 layer Substances 0.000 claims abstract description 121
- 230000003287 optical effect Effects 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 22
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 239000003431 cross linking reagent Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- BEQNOZDXPONEMR-UHFFFAOYSA-N cadmium;oxotin Chemical compound [Cd].[Sn]=O BEQNOZDXPONEMR-UHFFFAOYSA-N 0.000 description 1
- HKQOBOMRSSHSTC-UHFFFAOYSA-N cellulose acetate Chemical compound OC1C(O)C(O)C(CO)OC1OC1C(CO)OC(O)C(O)C1O.CC(=O)OCC1OC(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C1OC1C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C(COC(C)=O)O1.CCC(=O)OCC1OC(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C1OC1C(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C(COC(=O)CC)O1 HKQOBOMRSSHSTC-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 238000012905 input function Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
- B32B23/20—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
- B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
- Position Input By Displaying (AREA)
Abstract
根据本发明实施方式的触摸传感器层叠体包括:下部结构;触摸传感器层,其层叠在下部结构上;压敏粘合剂层,其层叠在触摸传感器层上并且具有0.05‑1MPa的杨氏模量;和光学层,其层叠在压敏粘合剂层上。触摸传感器层叠体满足预定的厚度比并具有改善的折叠耐用性。
Description
技术领域
本发明涉及触摸传感器、触摸传感器层叠体和图像显示装置。更具体地,本发明涉及包括触摸传感器层和光学层的触摸传感器层叠体和图像显示装置。
背景技术
随着信息技术的发展,对具有更薄尺寸、轻重量、高功耗效率等的显示装置的各种需求日益增加。显示装置可以包括平板显示装置,例如液晶显示(LCD)装置、等离子体显示面板(PDP)装置、电致发光显示装置、有机发光二极管(OLED)显示装置等。
将一种能够通过用手指或输入工具选择显示在屏幕上的指令来输入用户指示的触摸面板与显示装置相结合,从而可以在一个电子装置中实现显示和信息输入功能。
由于近来开发了能够折叠或弯曲的柔性显示器,因此应用于柔性显示器的触摸面板也需要柔性。
然而,诸如感测电极的导电结构以及绝缘结构分布在触控面板的同一层或不同层中,因此在进行折叠或弯曲时可能会导致诸如电极裂纹、电极剥落等缺陷。
例如,韩国注册专利公开第10-1923438号公开了一种结合有触摸面板的图像显示装置,但并未提出对如上所述的柔性性能的调整。
发明内容
【技术问题】
根据本发明的一个方面,提供一种具有改进的柔性和机械可靠性的触摸传感器层叠体。
根据本发明的一方面,提供一种具有改进的柔性和机械可靠性的图像显示装置。
【技术方案】
(1)一种触摸传感器层叠体,包括:下部结构;触摸传感器层,所述触摸传感器层堆叠在所述下部结构上;粘合剂层,所述粘合剂层堆叠在所述触摸传感器层上并且具有0.05~1MPa的杨氏模量;和光学层,所述光学层堆叠在所述粘合剂层上,其中由式1表示的厚度比在12~23%的范围内:
[式1]
|A-B|*100/B(%)
在式1中,A为所述光学层的顶表面到所述触摸传感器层与所述粘合剂层的界面的高度,B为所述触摸传感器层叠体的总厚度的1/2。
(2)根据上述(1)所述的触摸传感器层叠体,其中所述厚度比为17.7~21%。
(3)根据上述(1)所述的触摸传感器层叠体,其中所述粘合剂层的杨氏模量为0.05~0.25MPa。
(4)根据上述(1)所述的触摸传感器层叠体,其中所述粘合剂层相对于所述触摸传感器层的剥离强度为5~10N/25mm。
(5)根据上述(1)所述的触摸传感器层叠体,其中所述下部结构包括下部基板和下部粘合剂层,所述下部粘合剂层形成在所述下部基板和所述触摸传感器层之间。
(6)根据上述(5)所述的触摸传感器层叠体,其中所述下部基板包括柔性显示面板。
(7)根据上述(1)所述的触摸传感器层叠体,其中所述光学层包括涂覆型偏光器或偏光板。
(8)根据上述(1)所述的触摸传感器层叠体,其中,对应于所述触摸传感器层叠体的所述总厚度的1/2的中心表面包括在所述触摸传感器层中。
(9)一种图像显示装置,包括:柔性显示面板;触摸传感器层,所述触摸传感器层堆叠在所述柔性显示面板上;粘合剂层,所述粘合剂层堆叠在所述触摸传感器层上并且具有0.05-1MPa的杨氏模量;和光学层,所述光学层堆叠在所述粘合剂层上,其中由式1表示的厚度比在12~23%的范围内:
[式1]
|A-B|*100/B(%)
其中,在式1中,A为所述光学层的顶表面到所述触摸传感器层与所述粘合剂层的界面的高度,B为所述图像显示装置的总厚度的1/2。
(10)根据上述(9)所述的图像显示装置,还包括窗口基板,所述窗口基板堆叠在所述光学层上。
(11)根据上述(9)所述的图像显示装置,其中所述厚度比为17.7~21%,所述粘合剂层的所述杨氏模量为0.05~0.25MPa。
[发明的效果]
在根据本发明实施方式的触摸传感器层叠体中,可以控制包括触摸传感器层的层叠体的总厚度以及光学层和粘合剂层的厚度以防止由于折层叠体叠体时电极裂纹和触摸传感器层的电极损坏引起的触摸感测失败。
此外,可以控制粘合剂层的杨氏模量以进一步改善触摸传感器层在重复折叠期间的机械可靠性。
触摸传感器层叠体可以有效地应用于具有改进的柔性和操作可靠性的柔性显示器。
附图说明
图1是示出根据示例性实施方式的触摸传感器层叠体的示意性横截面图。
图2和图3分别是示出根据示例性实施方式的包括在触摸传感器层叠体中的触摸传感器层的构造的示意性俯视平面图和示意性横截面图。
图4是示出根据示例性实施方式的图像显示装置的示意性横截面图。
具体实施方式
根据本发明的示例性实施方式,提供用于提供改进的柔性和耐用性的触摸传感器层叠体和图像显示装置,其包括下部结构、触摸传感器层、粘合剂层和光学层。
在下文中,将参考附图详细描述本发明。然而,本领域技术人员将理解,提供参考附图描述的这些实施方式是为了进一步理解本发明的精神并且不限制如详细说明书和所附权利要求中公开的要保护的主题。
图1是示出根据示例性实施方式的触摸传感器层叠体的示意性横截面图。
参考图1,触摸传感器层叠体可以包括依次堆叠在下部结构100上的触摸传感器层130、粘合剂层140和光学层150。
下部结构100可以包括用于在其上形成触摸传感器层130的物体、基板层、基层、基板等。在示例性实施方式中,下部结构100可以包括下部基板110,并且可以包括形成在下部基板110和触摸传感器层130之间的下部粘合剂层120。
下部结构100或下部基板110可以包括单层结构或多层结构。例如,下部结构100可以包括多个绝缘层或绝缘结构,并且可以包括绝缘层和导电层的多层结构。
下部基板110可以包括柔性基板或具有柔性的柔性面板。在示例性实施方式中,下部基板110可以包括柔性显示面板。
下部粘合剂层120可以包括例如电气材料领域中已知的光学透明粘合剂(OCA)材料。
触摸传感器层130可以包括多个感测电极和绝缘层。触摸传感器层130的结构和元件将在后面参考图2和图3更详细地描述。
粘合剂层140可以包括例如丙烯酸或有机硅系压敏粘合剂材料。例如,可以将包含丙烯酸酯系共聚物和/或单体、交联剂和溶剂的粘合剂组合物涂覆在触摸传感器层130或光学层140的表面上,然后进行光固化以形成粘合剂层140。
交联剂可以包括例如异氰酸酯交联剂。粘合剂组合物还可包含另外的组分,例如硅烷偶联剂、抗静电剂等。
光学层150可以通过粘合剂层140附接至触摸传感器层130。光学层150可以包括偏光层、延迟层、亮度增强层、折射率匹配层等,其被包括在图像显示装置中用于图像改善。在示例性实施方式中,光学层150可以包括偏光层,例如涂覆型偏光器或偏光板。
涂层型偏光器可以包括液晶涂层,该液晶涂层包括聚合性液晶化合物和二色性染料。在这种情况下,光学层150还可以包括用于为液晶涂层提供取向的取向层。
例如,偏光板可包括聚乙烯醇系偏光器和附接至聚乙烯醇系偏光器的至少一个表面的保护膜。
在图1中,触摸传感器层叠体的总厚度的1/2表示为B,并且从触摸传感器层叠体的顶表面(例如,光学层150的顶表面)到触摸传感器层130和粘合剂层140之间的界面的高度表示为A。
在触摸传感器层叠体中,可以在预定范围内调整由下面的式1表示的厚度比。
[式1]
|A-B|*100/B(%)
在示例性实施方式中,由式1表示的触摸传感器层叠体的厚度比可以是为约12~23%。在该厚度比范围内,折叠时的耐用性可以通过触摸传感器层叠体的上部和下部的厚度平衡来改善。
此外,粘合剂层140的杨氏模量可以在约0.05~1MPa的范围内。例如,当粘合剂层140的杨氏模量小于约0.05MPa时,粘合剂层140的强度可能过度降低,并且可能无法实现触摸传感器层120的充分减震。当粘合剂层140的杨氏模量超过约1MPa时,粘合剂层140可能无法提供足够的柔性和弹性。
可以例如通过改变交联剂的含量、光固化过程的固化时间或光固化过程中的光照射量来调节粘合剂层140的杨氏模量。
在示例性实施方式中,可以一起控制触摸传感器层叠体的厚度比和粘合剂层140的杨氏模量以提高触摸传感器层130在折叠或弯曲时的机械稳定性,同时确保充分的柔性性能。
优选地,由等式1表示的触摸传感器层叠体的厚度比可以为约17.7%至21%。此外,粘合剂层140可具有约0.05~0.25MPa的杨氏模量。
在一些实施方式中,对应于触摸传感器层叠体总厚度的1/2的中心表面M可以包括在触摸传感器层130中,如图1中的虚线所示。因此,可以有效地分散触摸传感器层130中的应力以抑制触摸传感器层130中的电极的断裂和裂纹。
在一些实施方式中,粘合剂层140相对于触摸传感器层130的剥离强度可以为约5~10N/25mm。在上述范围内,当折叠应力被施加到触摸传感器层叠体时,折叠应力可以充分分散在粘合剂层140中而不会引起触摸传感器层130的剥离。因此,可以更有效地抑制触摸传感器层130中的电极裂纹。
图2和图3分别是示出根据示例性实施方式的包括在触摸传感器层叠体中的触摸传感器层的构造的示意性俯视平面图和示意性横截面图。具体地,图3是沿图2的线I-I'截取的横截面图。
参考图2和图3,触摸传感器层130可以包括布置在支撑层50上的感测电极。
支撑层50可以包含例如环烯烃聚合物(COP)、聚对苯二甲酸乙二醇酯(PET)、聚丙烯酸酯(PAR)、聚醚酰亚胺(PEI)、聚萘二甲酸乙二醇酯(PEN)、聚苯硫醚(PPS)、聚烯丙基化物、聚酰亚胺(PI)、醋酸丙酸纤维素(CAP)、聚醚砜(PES)、三醋酸纤维素(TAC)、聚碳酸酯(PC)、环烯烃共聚物(COC)、聚甲基丙烯酸甲酯(PMMA)等。
感测电极可以包括在平面图中沿不同方向布置的感测电极。例如,第一感测电极60(例如,沿X方向布置)和第二感测电极70(例如,沿Y方向布置)可以布置为彼此交叉。
第一感测电极60和第二感测电极70可以分别提供触摸点的X坐标和Y坐标的信息。例如,当人手或物体被输入到触摸传感器层叠体上时,可通过来自第一感测电极60和第二感测电极70的电容变化产生电信号。电信号可通过例如位置检测线被传送到驱动电路。
每个第二感测电极70可以具有彼此间隔开的岛状。第一感测电极60可以通过连接器65沿行方向(例如,X方向)彼此一体地连接。
当第一感测电极60和第二感测电极70被设置在同一水平时,还可以形成桥电极75以连接第二感测电极70同时与第一感测电极600绝缘。桥电极75可以将沿列方向(例如,y方向)彼此相邻的第二感测电极70电连接。
参考图3,绝缘层80可以至少部分地覆盖感测电极60和70。在一些实施方式中,绝缘层80可以覆盖第一感测电极60或连接器65,并且可以部分地覆盖第二感测电极70。例如,绝缘层80可以包括使第二感测电极70的顶表面部分暴露的接触孔。
绝缘层80可以由透明绝缘材料形成。例如,绝缘层80可以使用诸如氧化硅的无机绝缘材料或诸如丙烯酸树脂的透明有机材料形成。
桥电极75可以设置在绝缘层80上以将一对相邻的第二感测电极70彼此电连接。例如,桥电极75可以与绝缘层80上的连接器65交叉。桥电极75可以填充形成在绝缘层80中的接触孔。
感测电极60和70以及桥电极75可以包含透明导电氧化物或金属。透明导电氧化物可包括例如氧化铟锡(ITO)、氧化铟锌(IZO)、氧化锌(ZnO)、氧化铟锌锡(IZTO)、氧化镉锡(CTO)等。金属可包括例如,银(Ag)、金(Au)、铜(Cu)、铝(Al)、铂(Pt)、钯(Pd)、铬(Cr)、钛(Ti)、钨(W)、铌(Nb)、钽(Ta)、钒(V)、铁(Fe)、锰(Mn)、钴(Co)、镍(Ni)、锌(Zn)、锡(Sn)或其合金。
在一些实施方式中,感测电极60和70和/或桥电极75可以具有多层结构。例如,感测电极60和70和/或桥电极75可以具有其中透明氧化物层和金属层堆叠的结构。
在一些实施方式中,第一感测电极60和第二感测电极70可以形成在不同的水平上。例如,第一感测电极60和第二感测电极70中的一个可以形成在绝缘层80上,另一个可以形成在绝缘层80下方。在这种情况下,可以省略桥电极75,并且第一感测电极60和第二感测电极70两者都可以包括连接器。
在一些实施方式中,每个感测电极可以形成为独立的岛图案并且可以用作单独的感测域。
图4是示出根据示例性实施方式的图像显示装置的示意性横截面图。
例如,在图1所示的触摸传感器层叠体中,下部基板110可以包括柔性显示面板。在这种情况下,例如,可以实现如图4所示的柔性显示装置。
参考图4,图像显示装置可以包括依次堆叠在柔性显示面板110a上的下部粘合剂层120、触摸传感器层130、粘合剂层140和光学层150。
柔性显示面板110a可以包括设置在面板基板200上的像素电极210、像素限定层220、显示层230、对电极240和封装层250。
可以在面板基板200上形成包括薄膜晶体管(TFT)的像素电路,并且可以形成覆盖像素电路的绝缘层。像素电极210可以电连接到例如绝缘层上的TFT的漏电极。
像素限定层220可以形成在绝缘层上以暴露像素电极210以限定像素区域。显示层230可以形成在像素电极210上,并且显示层230可以包括例如液晶层或有机发光层。
对电极240可以设置在像素限定层220和显示层230上。对电极240可以用作例如图像显示装置的公共电极或阴极。可以在对电极240上堆叠用于保护柔性显示面板110a的封装层250。
在图像显示装置中也可以满足等式1的厚度比值。此外,在图像显示装置中,粘合剂层140也可以具有上述范围内的杨氏模量。
在一些实施方式中,窗口基板170可以经由上部粘合剂层320堆叠在光学层150上。
窗口基板170可以包括例如硬涂层膜。在一个实施方式中,可以在窗口基板170的一个表面的外围部分上形成遮光图案175。遮光图案175可以包括例如彩色印刷图案,并且可以具有单层或多层结构。图像显示装置的边框部分或非显示区域可以由遮光图案175限定。
在下文中,提出优选实施方式以更具体地描述本发明。然而,以下实施例仅用于说明本发明,并且相关领域的技术人员将明显理解这些实施例并不限制所附权利要求,而是在本发明的范围和精神内可以进行各种改变和修改。此类改变和修改适当地包括在所附权利要求中。
实验例:折叠耐用性评价
制备具有如下表1所示的厚度比的实施例和比较例的触摸传感器层叠体,其中PET膜-OCA层-触摸传感器层-粘合剂层(PSA层)-偏光板依次堆叠。
通过改变用于固化PSA层的光照射量和光照射时间来控制粘合剂层的杨氏模量。使用AG-Xplus测试仪(Shimadzu Co,.Ltd.)测量在每个触摸传感器层叠体中使用的粘合剂层的杨氏模量。
具体地,将PSA层的切割成20mm×50mm的矩形的样品固定到AG-Xplus测试仪的夹具上。之后,将样品固定为使得被拉伸样品的长度为5cm,在23℃的温度和55%的相对湿度的环境下在以20mm/min的拉伸速率向上拉伸的状态下测量杨氏模量。
使用AG-IS(由SHIMADZU制造)测量粘合剂层对触摸传感器的剥离强度。具体地,将粘合剂层附接在触摸传感器上,然后使用超级切割机切割成150mm×25mm的尺寸以形成样品。在切割样品的粘合剂层上形成引线,并将引线固定在上夹具上。将触摸传感器固定在下夹具上。此后,在移动上夹具的同时,将粘合剂层剥离180度以测量剥离强度。剥离强度通过除初始20%截面的值之外的剩余截面的平均值获得。
使用CFT-120(Cobotec Co.,Ltd.)设备以2R至5R的曲率半径将实施例和比较例的每个触摸传感器叠层重复折叠(向外折叠),使得显示面板的外表面向外折叠。折叠耐用性评价如下。
<评价标准>
S:折叠多于200,000次后,触摸传感器功能正常执行。
◎:折叠多于150,000次并少于200,000次后,触摸传感器功能正常运行。
○:折叠多于50,000次并少于100,000次后,触摸传感器功能正常运行。
△:折叠10,000次后触摸传感器正常运行,并且折叠20,000次后触摸传感器失效。
×:折叠10,000次后触摸传感器失效
评价结果一并示于下表1中。在表1中,按照偏光板-PSA层-触摸传感器层-OCA层-PET膜的顺序描述各层的厚度。
[表1]
参考表1,当满足根据上述示例性实施方式的厚度比和粘合剂层的杨氏模量时,即使折叠超过50,000次也能提供正常的触摸感测功能。然而,如比较例所示,当厚度比和粘合剂层的杨氏模量中的至少一项不满足时,折叠耐用性迅速降低。
Claims (11)
1.一种触摸传感器层叠体,包括:
下部结构;
触摸传感器层,所述触摸传感器层堆叠在所述下部结构上;
粘合剂层,所述粘合剂层堆叠在所述触摸传感器层上并且具有0.05~1MPa的杨氏模量;和
光学层,所述光学层堆叠在所述粘合剂层上,
其中由式1表示的厚度比在12-23%的范围内:
[式1]
|A-B|*100/B(%)
其中,在式1中,A为所述光学层的顶表面到所述触摸传感器层与所述粘合剂层的界面的高度,B为所述触摸传感器层叠体的总厚度的1/2。
2.根据权利要求1所述的触摸传感器层叠体,其中所述厚度比为17.7-21%。
3.根据权利要求1所述的触摸传感器层叠体,其中所述粘合剂层的杨氏模量为0.05-0.25MPa。
4.根据权利要求1所述的触摸传感器层叠体,其中所述粘合剂层相对于所述触摸传感器层的剥离强度为5~10N/25mm。
5.根据权利要求1所述的触摸传感器层叠体,其中所述下部结构包括下部基板和下部粘合剂层,所述下部粘合剂层形成在所述下部基板和所述触摸传感器层之间。
6.根据权利要求5所述的触摸传感器层叠体,其中所述下部基板包括柔性显示面板。
7.根据权利要求1所述的触摸传感器层叠体,其中所述光学层包括涂覆型偏光器或偏光板。
8.根据权利要求1所述的触摸传感器层叠体,其中,对应于所述触摸传感器层叠体的所述总厚度的1/2的中心表面包括在所述触摸传感器层中。
9.一种图像显示装置,包括:
柔性显示面板;
触摸传感器层,所述触摸传感器层堆叠在所述柔性显示面板上;
粘合剂层,所述粘合剂层堆叠在所述触摸传感器层上并且具有0.05~1MPa的杨氏模量;和
光学层,所述光学层堆叠在所述粘合剂层上,
其中由式1表示的厚度比在12~23%的范围内:
[式1]
|A-B|*100/B(%)
其中,在式1中,A为所述光学层的顶表面到所述触摸传感器层与所述粘合剂层的界面的高度,B为所述图像显示装置的总厚度的1/2。
10.根据权利要求9所述的图像显示装置,还包括窗口基板,所述窗口基板堆叠在所述光学层上。
11.根据权利要求9所述的图像显示装置,其中所述厚度比为17.7~21%,所述粘合剂层的所述杨氏模量为0.05~0.25MPa。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105026508A (zh) * | 2013-03-13 | 2015-11-04 | 富士胶片株式会社 | 粘着片、触摸屏用层叠体及静电电容式触摸屏 |
US20170147117A1 (en) * | 2015-11-20 | 2017-05-25 | Dongwoo Fine-Chem Co., Ltd. | Flexible image display device |
CN107646100A (zh) * | 2015-05-18 | 2018-01-30 | 东友精细化工有限公司 | 显示装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101923438B1 (ko) | 2011-11-10 | 2018-11-29 | 엘지전자 주식회사 | 터치패널 및 이를 구비한 이동 단말기 |
EP2841149B1 (en) * | 2012-04-27 | 2020-07-08 | Medtronic, Inc. | Method and system for fabricating a medical lead using an electrode fixture |
KR102207252B1 (ko) | 2013-12-30 | 2021-01-25 | 삼성전자주식회사 | 플렉서블 디스플레이 소자, 이를 채용한 접철식 전자 기기, 및 플렉서블 디스플레이 소자의 제조 방법 |
JP6470833B2 (ja) * | 2015-03-04 | 2019-02-13 | 富士フイルム株式会社 | タッチパネル用粘着シート、タッチパネル用積層体、静電容量式タッチパネル |
KR20160124541A (ko) | 2015-04-20 | 2016-10-28 | 삼성전기주식회사 | 플렉서블 디스플레이장치 |
US10884515B2 (en) * | 2015-11-06 | 2021-01-05 | Wacker Chemie Ag | Lamination method of substrates and product prepared thereby |
KR101579710B1 (ko) * | 2015-11-12 | 2015-12-22 | 동우 화인켐 주식회사 | 광학적층체 및 이를 포함하는 화상표시장치 |
WO2017163669A1 (ja) * | 2016-03-23 | 2017-09-28 | 富士フイルム株式会社 | 積層体、パターン状被めっき層付き基板の製造方法、金属層含有積層体の製造方法、タッチパネルセンサー、及びタッチパネル |
KR102112435B1 (ko) * | 2016-03-23 | 2020-05-18 | 후지필름 가부시키가이샤 | 도전성 적층체의 제조 방법과, 피도금층 전구체층을 구비한 입체 구조물, 패턴 형상 피도금층을 구비한 입체 구조물, 도전성 적층체, 터치 센서, 발열 부재 및 입체 구조물 |
US10884457B2 (en) * | 2016-09-14 | 2021-01-05 | Motorola Mobility Llc | Foldable display and method for making a foldable display |
US20180090720A1 (en) | 2016-09-27 | 2018-03-29 | Universal Display Corporation | Flexible OLED Display Module |
CN110753619A (zh) * | 2017-06-09 | 2020-02-04 | 康宁股份有限公司 | 包含各向异性层的可弯曲的层压制品 |
KR20180137748A (ko) * | 2017-06-19 | 2018-12-28 | 동우 화인켐 주식회사 | 터치센서를 포함하는 플렉시블 표시장치의 제조방법 |
CN111133341A (zh) * | 2017-09-29 | 2020-05-08 | 大日本印刷株式会社 | 光学膜和图像显示装置 |
JP6995580B2 (ja) * | 2017-11-17 | 2022-01-14 | 日本航空電子工業株式会社 | 光部品の生産方法及びタッチセンサを具備する製品の生産方法 |
-
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105026508A (zh) * | 2013-03-13 | 2015-11-04 | 富士胶片株式会社 | 粘着片、触摸屏用层叠体及静电电容式触摸屏 |
US20160002506A1 (en) * | 2013-03-13 | 2016-01-07 | Fujifilm Corporation | Adhesive sheet, laminate for touch panel, and capacitance-type touch panel |
CN107646100A (zh) * | 2015-05-18 | 2018-01-30 | 东友精细化工有限公司 | 显示装置 |
US20170147117A1 (en) * | 2015-11-20 | 2017-05-25 | Dongwoo Fine-Chem Co., Ltd. | Flexible image display device |
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