CN113363791A - Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body - Google Patents

Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body Download PDF

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Publication number
CN113363791A
CN113363791A CN202010146829.8A CN202010146829A CN113363791A CN 113363791 A CN113363791 A CN 113363791A CN 202010146829 A CN202010146829 A CN 202010146829A CN 113363791 A CN113363791 A CN 113363791A
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CN
China
Prior art keywords
silica gel
area
frame
frame body
effective
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010146829.8A
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Chinese (zh)
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CN113363791B (en
Inventor
李国基
李进兴
程磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Dragonstate Electronic Technology Co ltd
Concraft Holding Co Ltd
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Kunshan Dragonstate Electronic Technology Co ltd
Concraft Holding Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Kunshan Dragonstate Electronic Technology Co ltd, Concraft Holding Co Ltd filed Critical Kunshan Dragonstate Electronic Technology Co ltd
Priority to CN202010146829.8A priority Critical patent/CN113363791B/en
Publication of CN113363791A publication Critical patent/CN113363791A/en
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Publication of CN113363791B publication Critical patent/CN113363791B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055Shaping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/1742Mounting of moulds; Mould supports
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

A frame with a silica gel layer on the outside and a manufacturing method for forming the silica gel layer on the outside of the frame comprise a molding step, a combining step and a removing step. The method comprises the steps of firstly forming a silica gel substrate comprising an effective combination area and at least one invalid area in a pair of molds with forming spaces, forming an embedding space in the effective combination area, then placing a frame body in the embedding space, coating a silica gel coating on one of the outer part of the frame body and the embedding space before embedding, then combining the effective combination area with the outer part of the frame body by secondary vulcanization, and finally removing the effective combination area from the invalid area, thus forming a silica gel layer formed by the combination area on the outer part of the frame body.

Description

Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body
Technical Field
The invention relates to a frame body with a silica gel layer outside and a manufacturing method for forming the silica gel layer outside the frame body, in particular to a method which can effectively improve the phenomenon that the silica gel layer is easy to generate glue overflow or burrs during molding, further improve the production yield and effectively reduce the manufacturing cost.
Background
Silica gel injection is widely used in various products, such as waterproof connectors, Micro Control Units (MCU), micro speakers, and the like. The purpose of the silica gel is mainly to prevent water, absorb shock or provide elastic force.
Most of the traditional silica gel injection is to place the part to be coated by silica gel into a pair of molds, and then to inject silica gel into the molds, and after cooling, the silica gel is directly coated on the molds. For example, in the waterproof connector, a frame is placed in the mold, and then the silicone gel is directly formed on the frame by injection molding or injection molding, so as to achieve the waterproof effect by using the silicone gel. When the shock-absorbing material is applied to an MCU product, the silica gel is directly injected and molded outside the frame body, and the silica gel is used for the shock absorption effect.
However, even if the silica gel has good fluidity due to its material characteristics, when the silica gel is injected into the mold, the silica gel is likely to flow into the gaps due to the gaps at the mold closing position of the mold, and after the silica gel is cooled and molded, burrs or flash of the silica gel are formed on the silica gel, so that the assembly tolerance is too large, and the waterproof effect is affected or the precision is not good. Therefore, after the silicone rubber is molded, a great amount of manpower is required to trim burrs or flash, which greatly increases the manufacturing cost.
Therefore, how to provide a method which can effectively improve the phenomenon that the silica gel layer is easy to generate glue overflow or burrs during molding is the problem to be solved by the scheme.
Disclosure of Invention
The present invention is directed to a frame with a silicone layer on the outside and a method for manufacturing the silicone layer on the outside of the frame, and more particularly, to a method for manufacturing a frame with a silicone layer on the outside, which can effectively improve the phenomenon that the silicone layer is prone to glue overflow or burr during molding, thereby improving the production yield and effectively reducing the manufacturing cost.
To achieve the above object, the present invention first provides a method for forming a silicone layer on the exterior of a frame, the method comprising a forming step, a bonding step and a removing step. The molding step comprises: firstly, a pair of moulds with a forming space inside are provided, then a silica gel substrate is formed in the forming space, the silica gel substrate is provided with at least one effective combination area and at least one ineffective area connected with the effective combination area, and the effective combination area is provided with a placing space inside. The combining step: and then, heating the frame body and the silica gel base material simultaneously to ensure that the silica gel coating and the effective combination area are subjected to secondary vulcanization, so that the effective combination area can be combined outside the frame body. The removing step: taking out the silica gel substrate and the frame after the secondary fluidization, and then removing the effective combination area from the ineffective area, so that the effective combination area is kept outside the frame, and a silica gel layer is formed outside the frame.
In one embodiment, a first connecting section is formed between the effective combining area and the ineffective area, and at least one first cut-off section is formed between the first connecting section and the effective combining area when the effective combining area is removed from the ineffective area.
In one embodiment, the thickness of the first connecting section is smaller than that of the silica gel substrate.
In one embodiment, the first cut plane surrounds the surface of the silicone gel layer.
In one embodiment, the effective bonding area further includes a supporting section located at one side of the insertion space, and a second connecting section is formed between the supporting section and the effective bonding area, and when the supporting section is removed from the effective bonding area, at least one second cut surface is formed between the second connecting section and the effective bonding area.
In one embodiment, the thickness of the second connecting section is smaller than that of the silica gel substrate.
In one embodiment, the second cut plane surrounds the surface of the silicone gel layer.
In order to achieve the above object, the present invention further provides a frame body with a silicone layer on an outer surface thereof, including a frame body and a silicone layer. The silica gel layer is arranged outside the frame body, and at least a cutting surface is arranged on the silica gel layer.
In one embodiment, the cut surface surrounds the surface of the silicone layer.
In one embodiment, the thickness of the cut surface is smaller than the thickness of the silicone layer.
Drawings
Fig. 1 is a perspective view illustrating a silicone layer formed outside a frame according to the present invention.
FIG. 2 is a schematic view of the manufacturing process of the present invention.
FIG. 3 is a schematic cross-sectional view of the inventive die.
FIG. 4 is a schematic cross-sectional view of a silicone substrate retained on a first mold base according to the present invention.
Fig. 5 is an enlarged cross-sectional view of the frame body of the present invention before being placed in the placing space.
FIG. 6 is an enlarged cross-sectional view of a first cross-sectional surface of the present invention.
FIG. 7 is an enlarged cross-sectional view of a second cross-sectional surface of the present invention.
FIG. 8 is an exploded view of the frame and the silica gel substrate according to the present invention.
Fig. 9 is a schematic view of the frame body and the silica gel substrate after being combined.
FIG. 10 is a schematic diagram of the present invention with the active binding region separated from the inactive region.
FIG. 11 is a schematic view of the support region of the present invention separated from the active bonding region.
Description of the symbols:
10 frame body
20 silica gel layer
21 section plane
30 mould
31 first die holder
32 second die holder
33 forming space
40 silica gel base material
41 effective binding area
42 invalid region
43 support area
44 into space
45 first connecting section
46 second linking section
47 first cut plane
48 second cut surface
S1 Molding step
S2 combination step
S3 removing step
H. H1, H2 thickness
Detailed Description
The detailed description and technical contents of the present invention will now be described with reference to the drawings as follows:
as shown in fig. 1, the present invention first provides a frame body with a silicone layer on the outside, which includes a frame body 10 and a silicone layer 20 covering the outside of the frame body 10, and at least one cut surface 21 is formed on the surface of the silicone layer 20.
As shown in fig. 2 to 11, the present invention further provides a manufacturing method for forming the silicone layer outside the frame body. Referring to fig. 2, the manufacturing method includes a forming step S1, a combining step S2, and a removing step S3.
The molding step S1 mainly includes providing a pair of molds 30, referring to fig. 3, the mold 30 is composed of a first mold base 31 and a second mold base 32, a molding space 33 is formed between the first mold base 31 and the second mold base 32, and then a liquid silicone material is injected into the molding space 33, and the silicone material is cooled and molded in the molding space 33 to form a silicone base material 40. The silicone substrate 40 includes at least one effective bonding area 41, an ineffective area 42 and at least one supporting area 43, wherein the effective bonding area 41 has an insertion space 44 therein, and the supporting area 43 is below the insertion space 44. In addition, a first connecting section 45 is formed between the effective bonding area 41 and the ineffective area 42, a thickness H1 of the first connecting section 45 is smaller than the thickness H of the effective bonding area 41, a second connecting section 46 is formed between the effective bonding area 41 and the supporting area 43, and a thickness H2 of the second connecting section 46 is smaller than the thickness H of the effective bonding area 41. In the present embodiment, four effective bonding areas 41 are disposed on the silicone substrate 40, the ineffective area 42 is connected between the effective bonding areas 41, each effective bonding area 41 has an insertion space 44, and a supporting area 43 is disposed below each insertion space 44. After the silicone base material 40 is cooled and molded in the molding space 43, the second mold base 32 is removed, so that the silicone base material 40 remains on the first mold base 31, as shown in fig. 4. In the embodiment, for convenience of illustration, the silicone base material 40 is retained on the first mold base 31, and in practical applications, the silicone base material 40 can be removed from the first mold base 31.
The combining step S2 is to provide at least one frame 10, in this embodiment, an enlarged cross-sectional view of the frame 10 before being placed in the placing space 44 is shown in fig. 5, and since four effective combining areas 41 are disposed on the silicone base material 40, four frame 10 are also provided in this embodiment, and each frame 10 corresponds to each effective combining area 41, as shown in fig. 8. Next, a silicone coating (not shown in the figures) is coated on the exterior of the frame 10 or in each of the placing spaces 44, and then each of the frame 10 is placed into each of the placing spaces 44 in sequence, and then the first mold base 31, the silicone base 40 and the frames 10 are placed into an oven (not shown in the figures) at the same time to perform a secondary vulcanization on the silicone coating and the silicone base 40, so that the effective combining area 41 can be effectively combined and adhered to the exterior of the frame 10 through the secondary vulcanization, as shown in fig. 9.
The removing step S3 is to remove the effective bonding area 41 from the ineffective area 42, in the removing process, since a first connecting section 45 is formed between each effective bonding area 41 and the ineffective area 42, and the thickness H1 of the first connecting section 45 is smaller than the thickness H of the effective bonding area 41, the effective bonding area 41 can be removed from the ineffective area 42 by tearing or cutting, as shown in fig. 10, when the effective bonding area 41 is removed from the ineffective area 42, a first cutting section 47 is formed at the adjacent position of the effective bonding area 41 and the first connecting section 45, as shown in fig. 6. In the embodiment, the first connecting section 45 surrounds the surface of the effective bonding region 41, so that the first connecting section 47 surrounds the surface of the effective bonding region 41, but in practical applications, the first connecting section 45 can also be connected between the effective bonding region 41 and the ineffective bonding region 42 in a segmented manner, so that the first connecting section 47 is formed on the surface of the effective bonding region 41 in a segmented manner. Next, each of the supporting regions 43 is removed from each of the effective bonding regions 41, and when each of the supporting sections 43 is removed from each of the effective bonding regions 41, a second cutting surface 48 is formed at a position adjacent to the effective bonding region 41 and the second connecting section 46, as shown in fig. 11, and a cross-sectional view of the second cutting surface 48 is shown in fig. 7. In the embodiment, the second connecting section 46 surrounds the surface of the effective bonding area 41, so that the second cut surface 48 surrounds the surface of the effective bonding area 41, but in practical applications, the second connecting section 46 can also be connected between the effective bonding area 41 and the supporting area 43 in a segmented manner, so that the second cut surface 48 is formed on the surface of the effective bonding area 41 in a segmented manner. In this way, the effective bonding area 41 can be retained outside the frame body 10, and the silicone layer 20 is formed outside the frame body 10, and at least one cut surface 21 formed by the first cut surface 47 or the second cut surface 48 is formed on the silicone layer 20.
It should be noted that, the silicone layer 20 formed on the frame 10 by the manufacturing method of the present invention can improve the phenomenon that flash or burr is easily generated when the silicone layer 20 is directly formed on the frame 10 by the conventional injection molding method. Meanwhile, the silica gel substrate 40 can be provided with a plurality of effective combining areas 41, and the frame bodies 10 are respectively arranged in the effective combining areas 41, so that the effect of mass production is achieved, the yield of products can be improved, a large amount of manpower is not needed for trimming glue overflow or burrs, and the manufacturing cost can be effectively reduced.
In addition, the frame 10 of the present invention can be applied to various products, such as a frame of a waterproof connector or a frame of an MCU, the frame 10 can be made of metal or plastic, and the silicone layer 20 can be used as a waterproof layer or a buffer layer. In addition, the shape of the silicone layer 20 can be designed according to different products, and various product designs can be satisfied only by changing the shape of the effective bonding area 41 in the mold 30.
In conclusion, the present invention has been made to meet the requirements of the patent application, and the patent application is made in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and the claims of the present invention should not be limited thereto. Modifications and variations of this invention, which will occur to those skilled in the art and which fall within the spirit of this invention, are intended to be covered by the following claims.

Claims (10)

1. A manufacturing method for forming a silica gel layer outside a frame body comprises the following steps:
a molding step; firstly, providing a pair of moulds with a forming space inside, forming a silica gel substrate in the forming space, wherein the silica gel substrate is provided with at least one effective combination area and at least one invalid area connected with the effective combination area, and the effective combination area is internally provided with a placing space;
a combination step: then, heating the frame body and the silica gel base material simultaneously to ensure that the silica gel coating and the effective combination area are vulcanized for the second time so as to ensure that the effective combination area can be combined outside the frame body; and
a removing step: taking out the silica gel substrate and the frame after the secondary fluidization, and then removing the effective combination area from the ineffective area, so that the effective combination area is kept outside the frame, and a silica gel layer is formed outside the frame.
2. The method of claim 1, wherein a first connecting section is formed between the effective bonding area and the ineffective bonding area, and at least a first cut-off section is formed between the first connecting section and the effective bonding area when the effective bonding area is removed from the ineffective bonding area.
3. The method according to claim 2, wherein the first connecting section has a thickness smaller than the thickness of the silicone base material.
4. The manufacturing method of forming a silicone layer outside a frame according to claim 2, wherein the first cut surface surrounds a surface of the silicone layer.
5. The method according to claim 2, wherein the effective bonding area further comprises a supporting section disposed at one side of the insertion space, a second connecting section is formed between the supporting section and the effective bonding area, and at least a second cut surface is formed between the second connecting section and the effective bonding area when the supporting section is removed from the effective bonding area.
6. The method according to claim 5, wherein the second connecting section has a thickness smaller than the thickness of the silicone base material.
7. The manufacturing method of forming a silicone layer outside a frame according to claim 5, wherein the second cut surface surrounds a surface of the silicone layer.
8. A frame with silica gel layer on its exterior comprises
A frame body; and
the silica gel layer is arranged outside the frame body and is provided with at least one cutting surface.
9. The frame with silicone exterior layer of claim 8 wherein the cut surface surrounds the surface of the silicone layer.
10. The frame with silicone layer outside according to claim 8, wherein the thickness of the cut surface is smaller than the thickness of the silicone layer.
CN202010146829.8A 2020-03-05 2020-03-05 Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body Active CN113363791B (en)

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CN202010146829.8A CN113363791B (en) 2020-03-05 2020-03-05 Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body

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CN202010146829.8A CN113363791B (en) 2020-03-05 2020-03-05 Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116557A (en) * 1989-03-03 1992-05-26 Recticel Method of making objects having an elastomeric outer wall and a synthetic foam core
US20130175721A1 (en) * 2011-12-31 2013-07-11 Novartis Ag Colored contact lenses and method of making the same
CN203849653U (en) * 2014-06-09 2014-09-24 张祥锋 Metal plastic cement jacket of tablet personal computer
CN104085083A (en) * 2014-06-19 2014-10-08 东莞劲胜精密组件股份有限公司 Liquid silicone rubber injection mold
CN105109038A (en) * 2015-09-08 2015-12-02 山景雷特乐橡塑科技(苏州)有限公司 Silica gel and PC composite molding mobile phone shell and production process thereof
JP2016083781A (en) * 2014-10-23 2016-05-19 信越ポリマー株式会社 Metal mold for insert molding, method of insert-molding using metal mold
CN108568937A (en) * 2017-03-09 2018-09-25 德尔福技术公司 Method for the molded elastomeric material around rigid workpiece

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116557A (en) * 1989-03-03 1992-05-26 Recticel Method of making objects having an elastomeric outer wall and a synthetic foam core
US20130175721A1 (en) * 2011-12-31 2013-07-11 Novartis Ag Colored contact lenses and method of making the same
CN203849653U (en) * 2014-06-09 2014-09-24 张祥锋 Metal plastic cement jacket of tablet personal computer
CN104085083A (en) * 2014-06-19 2014-10-08 东莞劲胜精密组件股份有限公司 Liquid silicone rubber injection mold
JP2016083781A (en) * 2014-10-23 2016-05-19 信越ポリマー株式会社 Metal mold for insert molding, method of insert-molding using metal mold
CN105109038A (en) * 2015-09-08 2015-12-02 山景雷特乐橡塑科技(苏州)有限公司 Silica gel and PC composite molding mobile phone shell and production process thereof
CN108568937A (en) * 2017-03-09 2018-09-25 德尔福技术公司 Method for the molded elastomeric material around rigid workpiece

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