CN113363791B - Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body - Google Patents
Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body Download PDFInfo
- Publication number
- CN113363791B CN113363791B CN202010146829.8A CN202010146829A CN113363791B CN 113363791 B CN113363791 B CN 113363791B CN 202010146829 A CN202010146829 A CN 202010146829A CN 113363791 B CN113363791 B CN 113363791B
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- China
- Prior art keywords
- silica gel
- frame body
- area
- gel layer
- effective
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/0055—Shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1742—Mounting of moulds; Mould supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
The frame with silica gel layer outside includes one forming step, one combining step and one removing step. Firstly, a silica gel base material containing an effective combination area and at least one ineffective area is formed in a pair of dies with forming space, an embedded space is formed in the effective combination area, then a frame body is embedded in the embedded space, one of the outside of the frame body and the embedded space is coated with a silica gel coating before the embedded space is embedded, then the effective combination area is combined with the outside of the frame body by secondary vulcanization, finally, the effective combination area is removed from the ineffective area, and a silica gel layer formed by the combination area is formed outside the frame body.
Description
Technical Field
The invention relates to a frame body with a silica gel layer outside and a manufacturing method for forming the silica gel layer outside the frame body, in particular to a method for effectively improving the phenomenon that the silica gel layer is easy to overflow or burr during molding, further improving the production yield and effectively reducing the manufacturing cost.
Background
Silica gel injection is currently widely applied to various products, such as waterproof connectors, micro control units (Microcontroller Unit, MCU), micro speakers and the like. The purpose of silica gel is mainly to waterproof, shock-absorbing or provide elastic force.
In the conventional injection of silica gel, most of the silica gel is to be coated by silica gel, and then the silica gel is injected into a pair of molds to be cooled, so that the silica gel is directly coated thereon. For example, the waterproof connector is applied to a waterproof connector, namely, a frame body is placed in the mold, and then silica gel is directly formed on the frame body in an injection molding or injection molding mode, so that the waterproof effect is achieved by the silica gel. When the silica gel is applied to MCU products, silica gel is directly injected and molded outside the frame body, and the silica gel is used as a damping effect.
However, due to the material characteristics of the silica gel, even if the silica gel has good fluidity, when the silica gel is injected into the mold, gaps are easily generated at the mold closing positions of the mold, so that the silica gel flows into the gaps, burrs or glue overflow can be formed on the silica gel after the silica gel is cooled and molded, and further, the tolerance on assembly is too large, so that the waterproof effect is affected or the precision is poor. Therefore, after the molding of the silicone, trimming of burrs or overflows is performed by using a large amount of manpower, which greatly increases the manufacturing cost.
Therefore, how to provide a method for effectively improving the phenomenon that the silica gel layer is easy to overflow or burr during molding is the problem to be solved in the scheme.
Disclosure of Invention
The invention mainly aims to provide a frame body with a silica gel layer outside and a manufacturing method for forming the silica gel layer outside the frame body, in particular to a method capable of effectively improving the phenomenon that the silica gel layer is easy to overflow or burr during molding, further improving the production yield and effectively reducing the manufacturing cost.
In order to achieve the above objective, the present invention provides a method for forming a silica gel layer outside a frame, which includes a molding step, a bonding step and a removing step. The molding step comprises the following steps: firstly, providing a pair of dies with a forming space inside, forming a silica gel substrate in the forming space, wherein the silica gel substrate is provided with at least one effective combination area and at least one ineffective area connected with the effective combination area, and the effective combination area is provided with an embedded space. The combining step comprises the following steps: and then providing a frame body, placing the frame body into the placing space, and coating a silica gel coating on one of the frame body and the placing space before placing the frame body into the placing space. The removing step comprises the following steps: and taking out the silica gel base material and the frame body after secondary fluidization, and removing the effective bonding area from the ineffective area, so that the effective bonding area remains outside the frame body, and a silica gel layer is formed outside the frame body.
In one embodiment, a first connecting section is formed between the active bonding area and the inactive area, and at least a first cut is formed between the first connecting section and the active bonding area when the active bonding area is removed from the inactive area.
In one embodiment, the thickness of the first connecting section is smaller than the thickness of the silica gel substrate.
In one embodiment, the first cut surface surrounds the surface of the silicone layer.
In an embodiment, the effective bonding area further includes a support section, the support section is located at one side of the placement space, a second connection section is formed between the support section and the effective bonding area, and at least one second cut is formed between the second connection section and the effective bonding area when the support section is removed from the effective bonding area.
In one embodiment, the thickness of the second connection section is smaller than the thickness of the silica gel substrate.
In one embodiment, the second cut surface surrounds the surface of the silica gel layer.
In order to achieve the above object, the present invention further provides a frame having a silica gel layer outside, which comprises a frame and a silica gel layer. The silica gel layer is arranged outside the frame body and is provided with at least one cutting surface.
In one embodiment, the cut surface surrounds the surface of the silica gel layer.
In one embodiment, the thickness of the cut surface is smaller than the thickness of the silica gel layer.
Drawings
Fig. 1 is a schematic perspective view of the present invention in which a silica gel layer is formed outside a frame body.
FIG. 2 is a schematic diagram of a manufacturing process according to the present invention.
FIG. 3 is a schematic cross-sectional view of a mold according to the present invention.
FIG. 4 is a schematic cross-sectional view of a silica gel substrate of the present invention retained on a first mold base.
FIG. 5 is an enlarged cross-sectional view of the frame of the present invention before being placed in the placement space.
Fig. 6 is an enlarged cross-sectional view of a first cross-section of the present invention.
FIG. 7 is an enlarged schematic cross-sectional view of a second cross-section of the present invention.
FIG. 8 is an exploded view of the frame and the silica gel substrate of the present invention.
FIG. 9 is a schematic diagram of the frame of the present invention after being bonded to a silica gel substrate.
FIG. 10 is a schematic illustration of the present invention after separation of the active binding region from the inactive region.
FIG. 11 is a schematic view of the support region of the present invention separated from the active binding region.
Symbol description:
10. frame body
20. Silica gel layer
21. Cut surface
30. Mould
31. First die holder
32. Second die holder
33. Forming space
40. Silica gel base material
41. Effective binding area
42. Ineffective area
43. Support area
44. Is put into space
45. First connecting section
46. Second connecting section
47. First cut surface
48. A second cut surface
S1 forming step
S2 binding step
S3 removal step
H. Thickness of H1, H2
Detailed Description
The detailed description and technical content of the present invention will now be described with reference to the drawings, in which:
as shown in fig. 1, the present invention firstly provides a frame body with a silica gel layer outside, which comprises a frame body 10 and a silica gel layer 20 coated outside the frame body 10, wherein at least a cut surface 21 is formed on the surface of the silica gel layer 20.
As shown in fig. 2 to 11, the present invention further provides a manufacturing method for forming the silica gel layer outside the frame body. Referring to fig. 2, the manufacturing method includes a forming step S1, a combining step S2, and a removing step S3.
In the molding step S1, a pair of molds 30 is provided first, referring to fig. 3, the molds 30 are composed of a first mold holder 31 and a second mold holder 32, a molding space 33 is formed between the first mold holder 31 and the second mold holder 32, then a liquid silica gel material is injected into the molding space 33, and the silica gel material is cooled and molded in the molding space 33 to form a silica gel substrate 40. The silica gel substrate 40 includes at least one effective bonding area 41, an ineffective area 42 and at least one supporting area 43, wherein the effective bonding area 41 has an insertion space 44 therein, and the supporting area 43 is located below the insertion space 44. In addition, a first connecting section 45 is formed between the effective bonding area 41 and the ineffective area 42, the thickness H1 of the first connecting section 45 is smaller than the thickness H of the effective bonding area 41, a second connecting section 46 is formed between the effective bonding area 41 and the supporting area 43, and the thickness H2 of the second connecting section 46 is smaller than the thickness H of the effective bonding area 41. In the present embodiment, four effective bonding areas 41 are disposed on the silica gel substrate 40, the ineffective areas 42 are connected between the effective bonding areas 41, each effective bonding area 41 has an insertion space 44, and the support area 43 is disposed below each insertion space 44. After the silica gel substrate 40 is cooled and molded in the molding space 43, the second mold base 32 is removed, so that the silica gel substrate 40 remains on the first mold base 31, as shown in fig. 4. In this embodiment, for convenience of description, the silica gel substrate 40 is retained on the first die holder 31, and the silica gel substrate 40 can be removed from the first die holder 31 in practical applications.
In the bonding step S2, at least one frame 10 is provided first, in this embodiment, an enlarged cross-sectional view of the frame 10 before being placed in the placement space 44 is shown in fig. 5, and since four effective bonding areas 41 are provided on the silica gel substrate 40, in this embodiment, four frames 10 are provided, and each frame 10 corresponds to each effective bonding area 41, as shown in fig. 8. Then, a silicone coating (not shown in the drawings) is coated on the outside of the frame 10 or in each of the placement spaces 44, and then each of the frame 10 is placed in each of the placement spaces 44 in sequence, and then the first mold base 31, the silicone base 40 and the frame 10 are simultaneously placed in an oven (not shown in the drawings) to perform secondary vulcanization on the silicone coating and the silicone base 40, so that the effective bonding area 41 can be effectively bonded and adhered on the outside of the frame 10 through secondary vulcanization, as shown in fig. 9.
In the removing step S3, the active bonding area 41 is removed from the inactive area 42, and in the removing process, since the first connecting section 45 is formed between each active bonding area 41 and the inactive area 42 and the thickness H1 of the first connecting section 45 is smaller than the thickness H of the active bonding area 41, the active bonding area 41 can be removed from the inactive area 42 by tearing or cutting, as shown in fig. 10, after the active bonding area 41 is removed from the inactive area 42, the first cut section 47 is formed adjacent to the active bonding area 41 and the first connecting section 45, as shown in fig. 6. In the present embodiment, the first connecting section 45 surrounds the surface of the effective bonding area 41, so the first cut surface 47 surrounds the surface of the effective bonding area 41, but in practical application, the first connecting section 45 may be connected between the effective bonding area 41 and the ineffective area 42 in a segmented manner, so that the first cut surface 47 is formed on the surface of the effective bonding area 41 in a segmented manner. Then, each of the support regions 43 is removed from each of the active bonding regions 41, and when each of the support regions 43 is removed from the active bonding region 41, a second cut 48 is formed adjacent to the active bonding region 41 and the second connecting region 46, as shown in fig. 11, a cross-sectional view of the second cut 48 is shown in fig. 7. In the present embodiment, the second connecting section 46 surrounds the surface of the effective bonding area 41, so the second cut surface 48 surrounds the surface of the effective bonding area 41, but in practical application, the second connecting section 46 may be connected between the effective bonding area 41 and the supporting area 43 in a segmented manner, so that the second cut surface 48 is formed on the surface of the effective bonding area 41 in a segmented manner. In this way, the effective bonding area 41 is kept outside the frame 10, and the silica gel layer 20 is formed outside the frame 10, and at least one cut surface 21 formed by the first cut surface 47 or the second cut surface 48 is formed on the silica gel layer 20.
It should be noted that, the silica gel layer 20 formed on the frame 10 by the manufacturing method of the present invention can improve the phenomenon that flash or burr is easily generated when the silica gel layer 20 is directly formed on the frame 10 by the conventional injection molding method. Meanwhile, the silica gel substrate 40 can be provided with a plurality of effective bonding areas 41, and a plurality of frames 10 are respectively placed in the plurality of effective bonding areas 41, so that a mass production effect is achieved, and besides the yield of products can be improved, a large amount of manpower is not required to be used for trimming glue overflow or burrs, and the manufacturing cost can be effectively reduced.
In addition, the frame 10 of the present invention can be applied to various products, such as a waterproof connector frame or an MCU frame, and the frame 10 can be made of metal or plastic, and the silica gel layer 20 can be used as a waterproof layer or a buffer layer. In addition, the shape of the silicone layer 20 can be designed according to different products, and various product designs can be satisfied by only changing the shape of the effective bonding area 41 in the mold 30.
In view of the above, the present invention meets the requirements of the patent application, and the patent application is filed by law. However, the above description is only of the preferred embodiments of the present invention, and the claims should not be limited thereto. Such modifications and variations that may be apparent to a person skilled in the art are intended to be included within the scope of this invention as defined by the accompanying claims.
Claims (7)
1. A method of forming a silica gel layer outside a housing, comprising the steps of:
a molding step; firstly, providing a pair of dies with a forming space inside, forming a silica gel substrate in the forming space, wherein the silica gel substrate is provided with at least one effective combination area and at least one ineffective area connected with the effective combination area, and the effective combination area is provided with an embedded space;
and a combining step: providing a frame body, placing the frame body into the placing space, coating a silica gel coating on one of the frame body and the placing space before placing the frame body into the placing space, and heating the frame body and the silica gel base material simultaneously to perform secondary vulcanization on the silica gel coating and the effective bonding area so that the effective bonding area can be bonded outside the frame body; and
a removal step: and taking out the silica gel base material and the frame body after secondary fluidization, and removing the effective bonding area from the ineffective area, so that the effective bonding area remains outside the frame body, and a silica gel layer is formed outside the frame body.
2. The method of claim 1, wherein a first connecting section is formed between the active bonding area and the inactive area, and at least a first cut is formed between the first connecting section and the active bonding area when the active bonding area is removed from the inactive area.
3. The method of claim 2, wherein the first connecting section has a thickness less than a thickness of the silica gel substrate.
4. The method of claim 2, wherein the first cut surface surrounds the surface of the silica gel layer.
5. The method of claim 2, wherein the effective bonding region further comprises a support section, the support section is located at one side of the placement space, a second connecting section is formed between the support section and the effective bonding region, and at least a second cut surface is formed between the second connecting section and the effective bonding region when the support section is removed from the effective bonding region.
6. The method of claim 5, wherein the second connecting section has a thickness less than a thickness of the silica gel substrate.
7. The method of claim 5, wherein the second cut surface surrounds the surface of the silica gel layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010146829.8A CN113363791B (en) | 2020-03-05 | 2020-03-05 | Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010146829.8A CN113363791B (en) | 2020-03-05 | 2020-03-05 | Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113363791A CN113363791A (en) | 2021-09-07 |
| CN113363791B true CN113363791B (en) | 2023-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010146829.8A Active CN113363791B (en) | 2020-03-05 | 2020-03-05 | Frame body with silica gel layer outside and manufacturing method for forming silica gel layer outside frame body |
Country Status (1)
| Country | Link |
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| CN (1) | CN113363791B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5116557A (en) * | 1989-03-03 | 1992-05-26 | Recticel | Method of making objects having an elastomeric outer wall and a synthetic foam core |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2797734B1 (en) * | 2011-12-31 | 2016-04-06 | Novartis AG | Method of making colored contact lenses |
| CN203849653U (en) * | 2014-06-09 | 2014-09-24 | 张祥锋 | Metal plastic cement jacket of tablet personal computer |
| CN104085083B (en) * | 2014-06-19 | 2016-09-07 | 东莞劲胜精密组件股份有限公司 | A kind of liquid-state silicon gel injection mold |
| JP6418895B2 (en) * | 2014-10-23 | 2018-11-07 | 信越ポリマー株式会社 | Insert molding die and insert molding method using the die |
| CN105109038A (en) * | 2015-09-08 | 2015-12-02 | 山景雷特乐橡塑科技（苏州）有限公司 | Silica gel and PC composite molding mobile phone shell and production process thereof |
| US10493675B2 (en) * | 2017-03-09 | 2019-12-03 | Aptiv Technologies Limited | Method for molding a resilient material around a rigid work piece |
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2020
- 2020-03-05 CN CN202010146829.8A patent/CN113363791B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5116557A (en) * | 1989-03-03 | 1992-05-26 | Recticel | Method of making objects having an elastomeric outer wall and a synthetic foam core |
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| CN113363791A (en) | 2021-09-07 |
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