CN113352215A - Processing method of ITO (indium tin oxide) rotary target material - Google Patents
Processing method of ITO (indium tin oxide) rotary target material Download PDFInfo
- Publication number
- CN113352215A CN113352215A CN202110481709.8A CN202110481709A CN113352215A CN 113352215 A CN113352215 A CN 113352215A CN 202110481709 A CN202110481709 A CN 202110481709A CN 113352215 A CN113352215 A CN 113352215A
- Authority
- CN
- China
- Prior art keywords
- rotary target
- ito
- target material
- ito rotary
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013077 target material Substances 0.000 title claims description 43
- 238000003672 processing method Methods 0.000 title abstract description 7
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 title description 4
- 238000005498 polishing Methods 0.000 claims abstract description 35
- 238000004140 cleaning Methods 0.000 claims abstract description 22
- 238000009739 binding Methods 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 16
- 238000001514 detection method Methods 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 239000002893 slag Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 6
- 244000137852 Petrea volubilis Species 0.000 description 2
- 238000010835 comparative analysis Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a processing method of an ITO rotary target, which comprises the steps of integrally polishing the ITO rotary target to enable the R angle of an end face to reach 0.3-0.5; then welding, binding and cleaning the ITO rotary target; integrally polishing the finished ITO rotary target again to enable the R angle of the end face to reach 0.2; the damage to the end face R angle during welding, binding and cleaning is effectively solved by adopting twice polishing before and after processing and reserving the loss value of the end face R angle during processing.
Description
Technical Field
The invention relates to the technical field of production of ITO (indium tin oxide) rotary targets, in particular to a method for processing an ITO rotary target.
Background
At present, in the production process of the ITO rotary target material, the ITO rotary target material needs to be fixed on a conductive back tube for binding, and the bound ITO rotary target material can be used as a finished product. Welding and cleaning seams are needed for the ITO rotary target after binding is finished, but the existing method needs to carry out integral polishing after the welding and cleaning of the ITO rotary target, and carry out polishing and grinding on the R corners of the end faces at the two sides of the ITO rotary target. This can result in damage and undesirable rework of the end face R corners during the manufacturing process due to binding and cleaning.
Chinese patent document CN 110670030 a discloses a bonding method for ITO spliced target, which comprises performing ultrasonic flaw detection, polishing, cleaning and packaging on the bonded target, wherein the product needs to be cleaned after polishing in the production method, which may cause damage to the product during cleaning. In view of the above, a redesign of the target processing method is required.
Disclosure of Invention
In order to solve the problems, the invention provides a processing method of an ITO rotary target material, which comprises the steps of integrally polishing the ITO rotary target material to enable the R angle of an end face to reach 0.3-0.5; then welding, binding and cleaning the ITO rotary target; integrally polishing the finished ITO rotary target again to enable the R angle of the end face to reach 0.2; the damage to the end face R angle during welding, binding and cleaning is effectively solved by adopting twice polishing before and after processing and reserving the loss value of the end face R angle during processing.
The invention aims to provide a processing method of an ITO (indium tin oxide) rotary target material, which is characterized by comprising the following steps of firstly, integrally polishing the ITO rotary target material and enabling the R angle of an end face to reach 0.3-0.5; then binding and cleaning the seams; and finally, integrally polishing the ITO rotary target material to enable the R angle of the end face to reach 0.2.
The further improvement lies in that: the method comprises the following steps:
the method comprises the following steps: integrally polishing the ITO rotating target material, and enabling the R angle of the end face of the ITO rotating target material to reach 0.3-0.5 and the integral roughness to be less than or equal to 0.8 mm;
step two: the inner side of the ITO rotary target material is subjected to ultrasonic metallization by indium, and then the ITO rotary target material is sleeved on a conductive metal back tube to be bound, the bound ITO rotary target material is welded by indium in sequence, and the gap between the ITO rotary target material and the ITO rotary target material needs to be controlled to be 0.3mm +/-0.1 mm;
step three: manually cleaning the gaps of the ITO rotary target material, and manually removing welding slag in the gaps by using a gap cleaning tool;
step four: integrally polishing the ITO rotary target material after the seam cleaning is finished again, and enabling the R angle of the end face of the ITO rotary target material to reach 0.2;
the further improvement lies in that: the method also comprises the following steps: and detecting the ITO rotary target after the detection is finished, and packaging after the detection is qualified.
The further improvement lies in that: and the integral polishing in the step one is to polish by adopting a machine.
The further improvement lies in that: and the integral polishing in the fourth step is manually performed and is performed by using sand paper with the thickness of 0.15 mm.
The further improvement lies in that: and in the second step, the conductive metal back tube is made of aluminum.
The further improvement lies in that: and in the second step and the third step, a placing platform with a transverse arc-shaped groove on the surface is required to be used.
The invention has the beneficial effects that: and integrally polishing the ITO rotating target by using a machine, and determining the R angle of the end face to be 0.3-0.5. The roughness is 0.8mm, welding, binding and gap cleaning are carried out after the completion of the operation, so that the completed ITO rotary target material is obtained, manual secondary polishing is carried out on the completed ITO rotary target material again, and the R angle of the end face is determined to be 0.2; the invention effectively solves the problem of damage to the end surface R angle in the processes of welding, binding and cleaning, and the secondary polishing adopts manual work to greatly improve the controllability during polishing, thereby improving the production quality of products.
Detailed Description
For the purpose of enhancing understanding of the present invention, the present invention will be further described in detail with reference to the following examples, which are provided for illustration only and are not to be construed as limiting the scope of the present invention.
The embodiment provides a processing method of an ITO rotary target, which comprises the following steps:
the method comprises the following steps: integrally polishing the ITO rotating target material, and enabling the R angle of the end face of the ITO rotating target material to reach 0.3-0.5 and the integral roughness to be less than or equal to 0.8 mm;
step two: the inner side of the ITO rotary target material is subjected to ultrasonic metallization by indium, and then the ITO rotary target material is sleeved on a conductive metal back tube to be bound, the bound ITO rotary target material is welded by indium in sequence, and the gap between the ITO rotary target material and the ITO rotary target material needs to be controlled to be 0.3mm +/-0.1 mm;
step three: manually cleaning the gaps of the ITO rotary target material, and manually removing welding slag in the gaps by using a gap cleaning tool;
step four: integrally polishing the ITO rotary target material after the seam cleaning is finished again, and enabling the R angle of the end face of the ITO rotary target material to reach 0.2;
step five: and detecting the ITO rotary target after the detection is finished, and packaging after the detection is qualified.
And the integral polishing in the step one is to polish by adopting a machine. And the integral polishing in the fourth step is manually performed and is performed by using sand paper with the thickness of 0.15 mm. And in the second step, the conductive metal back tube is made of aluminum. And in the second step and the third step, a placing platform with a transverse arc-shaped groove on the surface is required to be used.
Comparative analysis of the polishing effect of the present example
According to the comparative analysis, the problems that the R angle of the end face is less than 0.2 and the product is broken in the production process are caused regardless of the adoption of polishing before processing or polishing after the processing; therefore, the problems of product breakage and unqualified end face R angle are greatly reduced by adopting twice integral polishing.
Claims (6)
1. The method for processing the ITO rotary target is characterized by comprising the following steps of firstly, integrally polishing the ITO rotary target to enable the R angle of an end face to reach 0.3-0.5; then binding and cleaning the seams; and finally, integrally polishing the ITO rotary target material to enable the R angle of the end face to reach 0.2.
2. The method for processing the ITO rotary target according to claim 1, comprising the steps of:
the method comprises the following steps: integrally polishing the ITO rotating target material, and enabling the R angle of the end face of the ITO rotating target material to reach 0.3-0.5 and the integral roughness to be less than or equal to 0.8 mm;
step two: the inner side of the ITO rotary target material is subjected to ultrasonic metallization by indium, and then the ITO rotary target material is sleeved on a conductive metal back tube to be bound, the bound ITO rotary target material is welded by indium in sequence, and the gap between the ITO rotary target material and the ITO rotary target material needs to be controlled to be 0.3mm +/-0.1 mm;
step three: manually cleaning the gaps of the ITO rotary target material, and manually removing welding slag in the gaps by using a gap cleaning tool;
step four: integrally polishing the ITO rotary target material after the seam cleaning is finished again, and enabling the R angle of the end face of the ITO rotary target material to reach 0.2;
the method for processing the ITO rotary target according to claim 2, further comprising the following steps: and detecting the ITO rotary target after the detection is finished, and packaging after the detection is qualified.
3. The method for processing the ITO rotary target according to claim 2, wherein the overall polishing in the first step is machine polishing.
4. The method for processing the ITO rotary target according to claim 2, wherein the polishing in the fourth step is performed manually and sandpaper with a thickness of 0.15mm is used.
5. The method as claimed in claim 2, wherein the conductive metal backing tube in the second step is made of aluminum.
6. The method as claimed in claim 2, wherein a platform with a lateral arc-shaped groove is used in the second step and the third step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110481709.8A CN113352215A (en) | 2021-04-30 | 2021-04-30 | Processing method of ITO (indium tin oxide) rotary target material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110481709.8A CN113352215A (en) | 2021-04-30 | 2021-04-30 | Processing method of ITO (indium tin oxide) rotary target material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113352215A true CN113352215A (en) | 2021-09-07 |
Family
ID=77525809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110481709.8A Pending CN113352215A (en) | 2021-04-30 | 2021-04-30 | Processing method of ITO (indium tin oxide) rotary target material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113352215A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007154176A (en) * | 2005-11-11 | 2007-06-21 | Hitachi Chem Co Ltd | Polishing liquid for polishing ito film and method for polishing substrate |
| CN202240825U (en) * | 2011-09-29 | 2012-05-30 | 厦门映日光电科技有限公司 | Grinding device for rotary target |
| CN108655525A (en) * | 2018-05-17 | 2018-10-16 | 洛阳丰联科绑定技术有限公司 | A kind of binding method of target |
| CN110670030A (en) * | 2019-09-29 | 2020-01-10 | 洛阳丰联科绑定技术有限公司 | Bonding method of ITO spliced target material |
| CN111468799A (en) * | 2020-04-22 | 2020-07-31 | 宁波江丰电子材料股份有限公司 | Welding method of ceramic rotary target |
| CN112080727A (en) * | 2020-09-11 | 2020-12-15 | 芜湖映日科技有限公司 | Binding method of rotary target material |
| CN112192327A (en) * | 2020-10-29 | 2021-01-08 | 先导薄膜材料（广东）有限公司 | Cleaning device and method for rotary target |
-
2021
- 2021-04-30 CN CN202110481709.8A patent/CN113352215A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007154176A (en) * | 2005-11-11 | 2007-06-21 | Hitachi Chem Co Ltd | Polishing liquid for polishing ito film and method for polishing substrate |
| CN202240825U (en) * | 2011-09-29 | 2012-05-30 | 厦门映日光电科技有限公司 | Grinding device for rotary target |
| CN108655525A (en) * | 2018-05-17 | 2018-10-16 | 洛阳丰联科绑定技术有限公司 | A kind of binding method of target |
| CN110670030A (en) * | 2019-09-29 | 2020-01-10 | 洛阳丰联科绑定技术有限公司 | Bonding method of ITO spliced target material |
| CN111468799A (en) * | 2020-04-22 | 2020-07-31 | 宁波江丰电子材料股份有限公司 | Welding method of ceramic rotary target |
| CN112080727A (en) * | 2020-09-11 | 2020-12-15 | 芜湖映日科技有限公司 | Binding method of rotary target material |
| CN112192327A (en) * | 2020-10-29 | 2021-01-08 | 先导薄膜材料（广东）有限公司 | Cleaning device and method for rotary target |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20210907 |