TWI783983B - Manufacturing method of non-linearly processed optical laminate with adhesive layer - Google Patents
Manufacturing method of non-linearly processed optical laminate with adhesive layer Download PDFInfo
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- TWI783983B TWI783983B TW107110920A TW107110920A TWI783983B TW I783983 B TWI783983 B TW I783983B TW 107110920 A TW107110920 A TW 107110920A TW 107110920 A TW107110920 A TW 107110920A TW I783983 B TWI783983 B TW I783983B
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- cutting
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- adhesive layer
- manufacturing
- outer peripheral
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
- B32B38/105—Removing layers, or parts of layers, mechanically or chemically on edges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C1/00—Milling machines not designed for particular work or special operations
- B23C1/04—Milling machines not designed for particular work or special operations with a plurality of horizontal working-spindles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/12—Trimming or finishing edges, e.g. deburring welded corners
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/42—Polarizing, birefringent, filtering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Polarising Elements (AREA)
- Milling Processes (AREA)
- Laminated Bodies (AREA)
Abstract
本發明之課題在於提供一種不產生故障而能夠簡便地製造經非直線加工之光學積層體之方法。 本發明之附黏著劑層之光學積層體之製造方法包含:將附黏著劑層之光學積層體重疊複數片而形成工件;一面使具有與工件之外周面垂直之旋轉軸及向切斷面側突出設置之切削刃的第1切削機構旋轉,一面使工件及第1切削機構相對地移動,而進行直線性切削工件之外周面的第1切削;及一面使具有於工件之積層方向延伸之旋轉軸及作為以旋轉軸為中心旋轉之本體之最外徑構成之切削刃的第2切削機構旋轉,一面使工件及第2切削機構相對地移動,而進行非直線性切削工件之外周面的第2切削;且於自上下夾持工件之狀態,進行第1切削及第2切削。The object of the present invention is to provide a method for easily manufacturing a non-linearly processed optical layered body without causing trouble. The method for producing an optical laminate with an adhesive layer of the present invention includes: forming a workpiece by stacking a plurality of optical laminates with an adhesive layer; The first cutting mechanism of the protruding cutting edge is rotated, and the workpiece and the first cutting mechanism are relatively moved to perform the first cutting of the outer peripheral surface of the workpiece linearly; and the rotation extending in the lamination direction of the workpiece is performed. The shaft and the second cutting mechanism, which is the cutting edge formed by the outermost diameter of the main body rotating around the rotating shaft, rotate, and the workpiece and the second cutting mechanism move relatively while performing non-linear cutting of the second cutting edge on the outer peripheral surface of the workpiece. 2 cutting; and in the state of clamping the workpiece from top to bottom, perform the first cutting and the second cutting.
Description
本發明係關於經非直線加工之附黏著劑層之光學積層體之製造方法。The present invention relates to a method for manufacturing an optical laminate with an adhesive layer processed through non-linear processing.
於行動電話、筆記型個人電腦等之圖像顯示裝置中,為實現圖像顯示,及/或提高該圖像顯示之性能,使用各種光學積層體(例如,偏光板)。近年,於汽車之儀表面板或智慧手錶等亦期望光學積層體之使用,期望將光學積層體之形狀加工為矩形以外之形狀。 [先前技術文獻] [專利文獻] 專利文獻1:日本專利特開2004-114205號公報In image display devices such as mobile phones and notebook personal computers, various optical laminates (for example, polarizing plates) are used to realize image display and/or improve the performance of the image display. In recent years, the use of optical laminates is also expected in instrument panels of automobiles and smart watches, and it is expected to process the shape of optical laminates into shapes other than rectangles. [Prior Art Document] [Patent Document] Patent Document 1: Japanese Patent Laid-Open No. 2004-114205
[發明所欲解決之問題] 本發明係為解決上述先前之課題而完成者,其主要目的係提供一種可不產生故障,簡便地製造經非直線加工之附黏著劑層之光學積層體之方法。 [解決問題之技術手段] 本發明之附黏著劑層之光學積層體之製造方法包含:將附黏著劑層之光學積層體重疊複數片而形成工件;一面使具有與該工件之外周面垂直之旋轉軸及向該切斷面側突出設置之切削刀的第1切削機構旋轉,一面使該工件及該第1切削機構相對地移動,而進行直線性切削該工件之外周面的第1切削;及一面使具有於該工件之積層方向延伸之旋轉軸及作為以該旋轉軸為中心旋轉之本體之最外徑構成之切削刀的第2切削機構旋轉,一面使該工件及該第2切削機構相對地移動,而進行非直線性切削該工件之外周面的第2切削。於該製造方法中,於自上下夾持該工件之狀態,進行該第1切削及該第2切削。 於1個實施形態中,上述第1切削及上述第2切削係以自上下夾持上述工件之狀態不鬆開夾持地連續進行。 於1個實施形態中,上述光學積層體為偏光板。 於1個實施形態中,以上述第2切削加工切削之部分之長度相對於以上述第1切削加工及該第2切削加工切削之部分之長度為70%以下。 於1個實施形態中,於上述製造方法中,於上述第2切削之後進行上述第1切削。 於1個實施形態中,上述第2切削機構之刃角度為45°~75°。 於1個實施形態中,上述第2切削機構之直徑為3 mm~20 mm。 [發明之效果] 根據本發明之附黏著劑層之光學積層體之製造方法,重疊複數片附黏著劑層之光學積層體形成工件,藉由雙頭銑刀加工將該工件直線性切削,及藉由立銑刀加工進行非直線性切削,藉此可不產生故障,簡便地製造經非直線加工之附黏著劑層之光學積層體。更詳細內容係如以下。重疊複數片附黏著劑層之光學積層體形成工件,將該工件加工成矩形以外之形狀之情形時,作為該加工方法,列舉雷射加工、沖切加工、立銑刀加工等作為候補。但,雷射加工有對獲得之光學積層體之光學特性產生不良影響之情形,沖切加工有形狀精度不足,且產生裂縫之情形。因此,嘗試了立銑刀加工之結果,新發現產生阻塞(具體而言,工件之附黏著劑層之光學積層體彼此因端面之黏著劑而接著之現象)之課題。本發明者等對該新課題重複試行錯誤之結果,發現伴隨立銑刀加工而成為於工件端面塗佈黏著劑之狀態,推斷若減少存在於工件端面之黏著劑之量即可抑制阻塞,並重複進一步之試行錯誤。其結果,發現藉由減少附著於立銑刀之切削刃之黏著劑之量,可減少存在於工件端面之黏著劑之量,可解決阻塞之問題。具體而言,藉由以雙頭銑刀加工進行直線性加工(切削),以立銑刀加工僅進行非直線性加工(切削),而減少附著於立銑刀之切削刃之黏著劑之量,解決了阻塞之問題。即,本發明係解決了於將附黏著劑層之光學積層體進行非直線加工之技術中新產生之課題者。[Problem to be Solved by the Invention] The present invention was made to solve the aforementioned problems, and its main purpose is to provide a method for easily manufacturing an optical laminate with an adhesive layer processed by non-linear processing without causing trouble. [Technical means to solve the problem] The method for producing an optical laminate with an adhesive layer of the present invention includes: stacking a plurality of optical laminates with an adhesive layer to form a workpiece; The rotating shaft and the first cutting mechanism of the cutting blade protruding toward the cut surface side are rotated, and the workpiece and the first cutting mechanism are relatively moved to perform the first cutting of linearly cutting the outer peripheral surface of the workpiece; And while rotating the second cutting mechanism having a rotating shaft extending in the stacking direction of the workpiece and a cutting blade formed as the outermost diameter of the body rotating around the rotating shaft, the workpiece and the second cutting mechanism are rotated. Relatively move to perform the second cutting of non-linear cutting of the outer peripheral surface of the workpiece. In this manufacturing method, the first cutting and the second cutting are performed in a state where the workpiece is clamped from above and below. In one embodiment, the first cutting and the second cutting are continuously performed in a state where the workpiece is clamped from above and below without loosening the clamp. In one embodiment, the optical layered body is a polarizing plate. In one embodiment, the length of the portion cut by the second cutting process is 70% or less of the length of the portion cut by the first cutting process and the second cutting process. In one embodiment, in the above-mentioned manufacturing method, the above-mentioned first cutting is performed after the above-mentioned second cutting. In one embodiment, the blade angle of the second cutting mechanism is 45° to 75°. In one embodiment, the diameter of the second cutting mechanism is 3 mm to 20 mm. [Effects of the Invention] According to the method for producing an optical laminate with an adhesive layer of the present invention, a plurality of optical laminates with an adhesive layer are stacked to form a workpiece, and the workpiece is linearly cut by a double-end milling cutter, and Non-linear cutting is performed by end milling, whereby an optical laminate with an adhesive layer processed by non-linear processing can be easily manufactured without causing trouble. More detailed content is as follows. When a plurality of optical laminates with adhesive layers are stacked to form a workpiece, and the workpiece is processed into a shape other than a rectangle, laser processing, punching processing, end mill processing, etc. are listed as candidates for the processing method. However, laser processing may adversely affect the optical properties of the obtained optical laminate, and punching processing may have insufficient shape accuracy and may cause cracks. Therefore, as a result of trying end mill machining, a problem of clogging (specifically, a phenomenon in which optical laminates with an adhesive layer on the workpiece are bonded to each other by the adhesive on the end surface) was newly found. As a result of repeated trial and error on this new subject, the inventors of the present invention found that an adhesive is applied to the end surface of the workpiece as the end mill is processed, and concluded that clogging can be suppressed by reducing the amount of adhesive present on the end surface of the workpiece. Repeat further trial and error. As a result, it was found that by reducing the amount of adhesive attached to the cutting edge of the end mill, the amount of adhesive existing on the end surface of the workpiece can be reduced, and the problem of clogging can be solved. Specifically, the amount of adhesive adhering to the cutting edge of the end mill is reduced by performing linear processing (cutting) with the double-ended milling cutter and only non-linear processing (cutting) with the end mill processing , to solve the problem of blocking. That is, the present invention solves a new problem arising in the technique of non-linearly processing an optical layered body with an adhesive layer attached thereto.
以下,參照圖式對本發明之具體實施形態進行說明,但本發明不限定於該等實施形態。另,為容易觀察而模式性表示圖式,再者,圖式之長度、寬度、厚度等之比率、及角度等與實際不同。 本發明之附黏著劑層之光學積層體之製造方法包含:重疊複數片附黏著劑層之光學積層體而形成工件;進行直線性切削工件之外周面之第1切削;及進行非直線性切削工件之外周面之第2切削。作為附黏著劑層之光學積層體,列舉可使用於非直線加工為必要之用途的任意之適當之附黏著劑層之光學積層體。作為附黏著劑層之光學積層體之具體例,列舉偏光板、相位差板、觸控面板用導電性薄膜、表面處理薄膜、及根據目的而將該等適當積層之積層體(例如,防止反射用圓偏光板、附觸控面板用導電層之偏光板)。本發明於附黏著劑層之光學積層體之非直線加工中效果顯著。以下,作為一例,說明如圖1所示之平面形狀之附黏著劑層之光學積層體之製造方法的各步驟。 A.工件之形成 圖2係用以說明第1切削加工之概略立體圖,於該圖顯示工件1。如圖2所示,形成重疊複數片光學積層體之工件1。附黏著劑層之光學積層體於形成工件時,代表而言被切斷成任意適當之形狀。具體而言,附黏著劑層之光學積層體可切斷成矩形形狀,亦可切斷成類似矩形形狀之形狀。於圖示例中,附黏著劑層之光學積層體被切斷成矩形形狀,工件1具有相互對向之外周面(切削面)1a、1b及與其等正交之外周面(切削面)1c、1d。工件1較佳為藉由夾持機構(未圖示)自上下夾持。工件之總厚度較佳為10 mm以上,更佳為15 mm以上,進而較佳為20 mm以上。工件之總厚度之上限為例如150 mm。若為此種厚度,則可防止夾持機構之按壓或切削加工時之衝擊所致之損傷。附黏著劑層之光學積層體之工件以形成此種總厚度之方式重疊。構成工件之附黏著劑層之光學積層體之片數於一實施形態中為10片以上,於一實施形態中為30片~50片。夾持機構(例如治具)可由軟質材料構成,亦可由硬質材料構成。若由軟質材料構成,其硬度(JIS(Japanese Industrial Standard:日本工業標準) A)較佳為60°~80°。若硬度過高,則有可能留下夾持機構之壓痕。若硬度過低,則有可能因治具變形而產生位置偏移,使得切削精度變得不足。 B.第1切削加工 藉由第1切削機構2而直線性切削以上述方式形成之工件1之外周面(附黏著劑層之光學積層體之切斷面)。第1切削加工為所謂之雙頭銑刀加工。具體而言,第1切削機構2具有旋轉板3及切削刃4,具有與外周面1a、1b垂直之旋轉軸S,且可藉由任意之適當之驅動機構以旋轉軸S為中心於R方向旋轉地構成。旋轉板3於工件1之外周面1a、1b平行地配置,且側面視呈圓形,其直徑設計為超出工件1之厚度h之尺寸。切削刃4向旋轉軸S之軸方向突出設置,於旋轉板3之平面部分分別設置特定之間隔而配置。於圖示例中,藉由一對第1切削機構2設置特定之間隔D,且使具有切削刃4之平面部分對向,而配置成各個切削刃4對應於外周面1a、1b。切削機構2間之距離D以可搬入工件1,且切削刃4切削特定之切削部分之方式設定。一對第1切削機構2以可使距離D變化之方式可於旋轉軸S方向移動地構成。 工件1載置於可向與旋轉軸S正交之方向(圖2之箭頭A方向)移動,且,於該移動面內可旋轉地構成之載置台。如圖2及圖3(a)所示,使載置台向A方向移動而切削外周面1a、1b。接著,以將第1切削機構2之距離D對應於外周面1c、1d之方式變更,且使載置台旋轉90°。如圖3(b)所示,以該狀態使載置台向A方向移動而切削外周面1c、1d。如此,工件之全部之外周面之切削(直線性切削)完成。另,於圖示例中使工件向箭頭A方向移動,但亦可使第1切削機構向與A方向相反方向移動,亦可使工件向A方向移動且使第1切削機構向與A方向相反方向移動。 另,對第1切削加工(雙頭銑刀加工)之詳細內容,例如,記載於日本專利特開2005-224935號公報及日本專利特開2007-223021號公報,該公報之記載作為參考而引用於本說明書。 C.第2切削加工 接著,藉由第2切削機構20而將工件1之外周面之特定位置非直線性切削。於製作如圖1所示之俯視形狀之附黏著劑層之光學積層體之情形時,於工件之外周之2個角部形成倒角部4a、4b,於形成有倒角部4a、4b之外周面之中央部形成凹部4c。第2切削加工如圖4所示,為所謂之立銑刀加工。即,使用第2切削機構(立銑刀)20之側面,非直線性切削工件1之外周面之特定位置。作為第2切削機構(立銑刀)20,代表性為可使用直立銑刀。 具體而言,第2切削機構20如圖5所示,具有於工件1之積層方向(鉛直方向)延伸之旋轉軸21、及作為以旋轉軸21為中心旋轉之本體之最外徑構成之切削刃22。於圖示例中,切削刃22作為沿著旋轉軸21扭轉之最外徑構成。切削刃22包含刃尖22a、前刀面22b及後刀面22c。切削刃22之刃數可根據目的適當地設定。圖示例之切削刃為3片之構成,但刃數可為連續之1片,可為2片,可為4片,亦可為5片以上。第2切削機構之刃角度(圖示例之切削刃之扭轉角θ)較佳為45°~75°,更佳為45°~60°。若為如此之刃角度,則因黏著劑之削屑可容易地自切削刃排出,故其結果可抑制阻塞。切削刃之後刀面較佳經粗面化處理。作為粗面化處理,可採用任意之適當之處理。作為代表例,列舉噴擊處理。藉由對後刀面實施粗面化處理,抑制黏著劑向切削刃附著,其結果,可抑制阻塞。藉由適當地組合後刀面之粗面化處理與刃角度之調整,可藉由上述之相乘效果,進而抑制阻塞。 將如上述B項般經第1切削加工之工件1藉由第2切削機構(立銑刀)20予以非直線性切削。首先,如圖3(c)所示,將所要形成圖1之倒角部4a之部分進行倒角加工,接著,如圖3(d)所示,將所要形成倒角部4b之部分進行倒角加工。最後,如圖3(e)所示,切削形成凹部4c。第2切削加工之條件可根據期望之形狀而適當地設定。例如,第2切削機構(立銑刀)20之直徑較佳為3 mm~20 mm。第2切削機構之旋轉數較佳為1000 rpm~60000 rpm,更佳為10000 rpm~40000 rpm。第2切削機構之傳送速度較佳為500 mm/分~10000 mm/分,更佳為500 mm/分~2500 mm/分。切削部位之切削次數可為1次切削、2次切削、3次切削或其以上。另,於圖示例中依序形成倒角部4a、倒角部4b及凹部4c,但該等亦可按任意之適當之順序形成。 以第2切削加工切削之部分之長度(即非直線性切削之部分之長度),相對於以第1切削加工及第2切削加工切削之部分之長度(即切削部分全體之長度),較佳為70%以下。 第1切削加工及第2切削加工較佳連續地進行。更詳細而言,第1切削加工及第2切削加工係以自上下夾持工件1之狀態不鬆開該夾持地進行。可藉由不鬆開夾持地進行(即,連續地進行第1切削加工及第2切削加工),而省略將工件自第1切削機構更換至第2切削機構之作業而提高作業效率。此處,由於此種連續之加工係保持工件固定而對整周進行切削加工,故容易產生阻塞之問題。然而,根據本發明之實施形態,可藉由以立銑刀加工僅進行非直線之加工(切削),而進一步減少容易產生阻塞之立銑刀加工之區域,即使不鬆開夾持地連續進行第1切削加工及第2切削加工,亦可抑制阻塞之產生。即,根據本發明之實施形態,可良好地抑制阻塞,且使作業效率顯著提高。 如以上般,可獲得經非直線加工之附黏著劑層之光學積層體。另,於圖示例中對依序進行第1切削加工(直線加工)及第2切削加工(非直線加工)之形態進行了說明,但第1切削加工及第2切削加工之順序亦可相反。另,根據依序進行第2切削加工(非直線加工)及第1切削加工(直線加工)之形態,有可藉由直線加工時之工件之振動,消除因非直線加工產生之阻塞之情形。 [實施例] 以下,藉由實施例具體地說明本發明,但本發明不限定於該等實施例。實施例之評估項目如以下。 (1)阻塞 觀察實施例及比較例之切削加工後之工件之狀態,並由以下之基準評估。 ○:自工件分離成單獨之光學積層體較為容易 D:可自工件分離成單獨之光學積層體,但分離操作較為困難 ´:工件完全形成塊狀,無法分離成單獨之光學積層體 (2)刃污染 觀察實施例及比較例之切削加工後之第2切削機構(立銑刀)之黏著劑之污染狀態,並由以下之基準評估。 ○:未實質性觀察到污染 D:觀察到污染,但對加工未產生問題 ´:觀察到顯著之污染,對加工亦產生問題 <參考例1:工件之製作> 作為偏光件,使用使長條狀之聚乙烯醇(PVA)系樹脂薄膜含有碘,且沿長度方向(MD(Machine Direction:縱向)方向)單軸延伸而獲得之薄膜(厚度28 μm)。於該偏光件之單側形成黏著劑層(厚度5 μm),隔著該黏著劑層,以使長條狀之HC-TAC(Hard Coat-Triacetyl Cellulose:硬塗層-三醋酸纖維素)與彼此之長度方向一致之方式貼合。另,HC-TAC薄膜係於三醋酸纖維素(TAC)薄膜(25 μm)形成硬塗層(HC)(2 μm)之薄膜,以TAC薄膜成為偏光件側之方式貼合。於獲得之偏光件/TAC薄膜/HC層之積層體之兩側形成黏著劑層,於各個黏著劑層貼合間隔件,而獲得長條狀之附黏著劑層之光學積層體(附黏著劑層之偏光板)。 將獲得之附黏著劑層之偏光板沖切成5.7英寸(縱140 mm及橫65 mm左右),並重疊40片沖切之偏光板而形成工件。 <實施例1> 於以夾持(治具)夾住由參考例1獲得之工件之狀態,藉由立銑刀加工,於工件之外周之2個角部形成倒角部,且於形成倒角部之外周面之中央部形成凹部。 接著,藉由使用如圖2所示之裝置之雙頭銑刀加工,直線性切削工件之外周面,而獲得如圖1所示之經非直線加工之附黏著劑層之偏光板。 此處,立銑刀之刃數為2片,刃角度(扭轉角)為45°。又,立銑刀之傳送速度為1400 mm/分,旋轉數為30000 rpm。 對加工後之工件之狀態及立銑刀之刃污染,如上述(1)及(2)般進行評估。於表1顯示結果。 <實施例2> 除將立銑刀之刃角度設為60°以外與實施例1相同,而獲得如圖1所示之經非直線加工之附黏著劑層之偏光板。對加工後之工件之狀態及立銑刀之刃污染,與實施例1相同評估。於表1顯示結果。 <實施例3> 除將立銑刀之刃角度設為20°以外與實施例1相同,而獲得如圖1所示之經非直線加工之附黏著劑層之偏光板。對加工後之工件之狀態及立銑刀之刃污染,與實施例1相同評估。於表1顯示結果。 <實施例4> 除將雙頭銑刀加工與立銑刀加工之順序對調以外與實施例1相同,而獲得如圖1所示之經非直線加工之附黏著劑層之偏光板。對加工後之工件之狀態及立銑刀之刃污染,與實施例1相同評估。於表1顯示結果。 <比較例1> 僅由立銑刀加工獲得如圖1所示之經非直線加工之附黏著劑層之偏光板。對加工後之工件之狀態及立銑刀之刃污染,與實施例1相同評估。於表1顯示結果。於本比較例中,工件之阻塞顯著。再者,黏著劑向立銑刀之切斷刃之附著強烈,必須對每個工件仔細地清掃立銑刀。 <比較例2> 藉由使用湯姆森刃之沖切加工,獲得如圖1所示之經非直線加工之附黏著劑層之偏光板。對加工後之工件之狀態及湯姆森刃之刃污染,與實施例1相同評估。於表1顯示結果。於本比較例中,於獲得之偏光板(尤其於凹部)產生200 μm左右之裂縫。 <比較例3> 使用CO2
雷射(波長:9.35 μm、輸出:150 W)而切削,獲得如圖1所示之經非直線加工之附黏著劑層之偏光板。對加工後之工件之狀態,與實施例1相同評估。於表1顯示結果。於本比較例中,於切削部附近觀察到偏光消除區域。 [表1]
1‧‧‧工件1a‧‧‧外周面1b‧‧‧外周面1c‧‧‧外周面1d‧‧‧外周面2‧‧‧第1切削機構3‧‧‧旋轉板4‧‧‧切削刃4a‧‧‧倒角部4b‧‧‧倒角部4c‧‧‧凹部20‧‧‧第2切削機構21‧‧‧旋轉軸22‧‧‧切削刃22a‧‧‧刃尖22b‧‧‧前刀面22c‧‧‧後刀面A‧‧‧方向D‧‧‧間隔h‧‧‧厚度R‧‧‧方向S‧‧‧旋轉軸θ‧‧‧扭轉角1‧‧‧
圖1係顯示可藉由本發明之製造方法獲得之經非直線加工之附黏著劑層之光學積層體之形狀之一例的概略俯視圖。 圖2係用以說明本發明之製造方法之第1切削加工的概略立體圖。 圖3(a)~(e)係說明本發明之製造方法之一系列步驟的概略俯視圖。 圖4係用以說明本發明之製造方法之第2切削加工的概略立體圖。 圖5係用以說明於本發明之製造方法之第2切削加工使用之第2切削機構之構造之一例的概略圖。FIG. 1 is a schematic plan view showing an example of the shape of a non-linearly processed optical laminate with an adhesive layer obtained by the production method of the present invention. Fig. 2 is a schematic perspective view for explaining the first cutting process of the manufacturing method of the present invention. 3( a ) to ( e ) are schematic plan views illustrating a series of steps of the manufacturing method of the present invention. Fig. 4 is a schematic perspective view illustrating a second cutting process in the manufacturing method of the present invention. Fig. 5 is a schematic diagram illustrating an example of the structure of a second cutting mechanism used in the second cutting process of the manufacturing method of the present invention.
1a‧‧‧外周面 1a‧‧‧outer peripheral surface
1b‧‧‧外周面 1b‧‧‧outer peripheral surface
1c‧‧‧外周面 1c‧‧‧outer peripheral surface
1d‧‧‧外周面 1d‧‧‧outer peripheral surface
3‧‧‧旋轉板 3‧‧‧rotating plate
4a‧‧‧倒角部 4a‧‧‧Chamfering
4b‧‧‧倒角部 4b‧‧‧Chamfering
20‧‧‧第2切削機構 20‧‧‧The second cutting mechanism
A‧‧‧方向 A‧‧‧direction
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KR102320444B1 (en) * | 2018-11-06 | 2021-11-02 | 주식회사 엘지화학 | Apparatus and method for machining hole for optical film |
JP2020098326A (en) | 2018-12-11 | 2020-06-25 | 住友化学株式会社 | Polarizing plate |
KR20210126006A (en) | 2019-02-08 | 2021-10-19 | 닛토덴코 가부시키가이샤 | Manufacturing method of optical film |
JP2020131128A (en) * | 2019-02-20 | 2020-08-31 | 日東電工株式会社 | Foreign matter removal device |
JP7225975B2 (en) * | 2019-03-19 | 2023-02-21 | 三菱ケミカル株式会社 | Adhesive sheet, adhesive sheet laminate with release film, laminate for constituting image display device, and image display device using the same |
JP7446721B2 (en) * | 2019-05-13 | 2024-03-11 | 日東電工株式会社 | Polarizing plate, polarizing plate intermediate, polarizing plate manufacturing method, and punching blade type |
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TW201626001A (en) * | 2014-11-26 | 2016-07-16 | 住友化學股份有限公司 | Cutting method, method of producing polarizing plate which method includes the cutting method, and the polarizing plate |
TW201634958A (en) * | 2015-03-26 | 2016-10-01 | Nakao Technica Co Ltd | Processing device |
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