CN113347811B - Method for forming three-dimensional structure of multilayer conductive sheet - Google Patents
Method for forming three-dimensional structure of multilayer conductive sheet Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/60—Treatment of workpieces or articles after build-up
- B22F10/62—Treatment of workpieces or articles after build-up by chemical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Abstract
The application provides a method for forming a three-dimensional structure of a multilayer conductive sheet, which comprises the following steps: designing or acquiring a three-dimensional line structure model, and splitting the three-dimensional line structure model into a plurality of two-dimensional line models which are connected in an interlayer mode through leads; respectively preparing circuit boards comprising circuit structures corresponding to the two-dimensional circuit models according to the split two-dimensional circuit models; according to the three-dimensional circuit structure model structure, a plurality of circuit boards are laminated in an aligned mode to form a combined body; placing the combined body in an acid medium, and corroding a wire outlet hole on the combined body by utilizing the laser-induced acid medium according to the design position of the lead; the forming method effectively simplifies the preparation process of the conducting strip with the three-dimensional structure, and meanwhile, the line holes are obtained through laser-induced acidic medium corrosion, compared with the traditional laser drilling mode, the line hole forming process of the embodiment of the application is milder, the drilling depth can be effectively controlled, the focusing temperature requirement is far lower than the temperature requirement of laser drilling, and the equipment threshold is effectively reduced.
Description
Technical Field
The application relates to the technical field of integrated circuits, in particular to a forming method of a three-dimensional structure of a multilayer conductive sheet.
Background
With the rapid development of the semiconductor industry, devices tend to be miniaturized more and more, and the I/O number is increased gradually. The trend of integrated circuits has been to follow moore's law, and the density of integrated circuits has increased. The main driving force for such an increase in integration is the reduction of feature size, enabling more devices to be integrated in a particular area, but this is mainly the integration in two dimensions, and the integration density cannot be further increased.
In the prior art, some three-dimensional structure circuit structures are adopted, and a layer-by-layer online accumulation forming mode is generally adopted, so that the forming mode is low in efficiency, and the preparation is carried out by forming a circuit layer by layer, forming and then forming, and then packaging, and the preparation process is relatively complicated; the preparation is also carried out by bonding wires or flying wires in a mode of carrying out laser drilling on an independent circuit board, but the mode has higher requirements on equipment.
In view of the above problems, no effective technical solution exists at present.
Disclosure of Invention
The embodiment of the application aims to provide a method for forming a three-dimensional structure of a multilayer conductive sheet, which can effectively simplify the preparation process of a conductive sheet with a three-dimensional structure and reduce the threshold of equipment.
The embodiment of the application provides a method for forming a three-dimensional structure of a multilayer conductive sheet, which comprises the following steps:
s1, designing or obtaining a three-dimensional line structure model, and splitting the three-dimensional line structure model into a plurality of two-dimensional line models which are connected in an interlayer mode through leads;
s2, respectively preparing circuit boards comprising circuit structures corresponding to the two-dimensional circuit models according to the split two-dimensional circuit models;
s3, aligning and laminating a plurality of circuit boards according to the three-dimensional circuit structure model structure to form a combined body;
s4, placing the combined body in an acid medium, and corroding the wire outlet hole of the combined body by utilizing the laser-induced acid medium according to the designed position of the lead;
and S5, taking out and cleaning the combined body, then placing a conductive material into the wire hole and preparing a conductive lead for connecting the circuit boards, and realizing interlayer connection of the circuit boards in the combined body.
In the method for forming the three-dimensional structure of the multilayer conductive sheet, in step S3, adjacent circuit boards are connected through a glass cushion block and adhesive glue.
The forming method of the three-dimensional structure of the multilayer conductive sheet is characterized in that the glass cushion block avoids the position of the line hole or is provided with a hole corresponding to the position of the line hole.
In the method for forming the three-dimensional structure of the multilayer conductive sheet, in step S4, the laser incidence direction is vertically towards the upper end face and the lower end face of the combined bottom, or obliquely towards the upper end face and the lower end face of the combined bottom, or horizontally towards the side face of the combined body.
According to the method for forming the three-dimensional structure of the multilayer conductive sheet, after the assembly is corroded through the outlet hole by using the laser-induced acidic medium, the short circuit position on the circuit board can be corroded through the laser-induced acidic medium.
The forming method of the three-dimensional structure of the multilayer conductive sheet is characterized in that a conductive lead is prepared in a laser sintering or electroplating deposition mode.
The method for forming the three-dimensional structure of the multilayer conductive sheet is characterized in that the acidic medium does not corrode and dissolve the circuit board in the assembly at normal temperature.
The method for forming the three-dimensional structure of the multilayer conductive sheet is characterized in that the acidic medium is an acidic liquid or an acidic gas containing water vapor.
The method for forming the three-dimensional structure of the multilayer conductive sheet can add oxide for improving the dissolving effect of the circuit on the circuit board in the assembly into the acidic medium.
The method for forming the three-dimensional structure of the multilayer conductive sheet further comprises the step S6 of removing residual conductive materials in the combined body.
According to the forming method of the three-dimensional structure of the multilayer conductive sheet, the preparation process of the conductive sheet with the three-dimensional structure is effectively simplified, meanwhile, the wire holes are obtained through laser-induced acidic medium corrosion, and compared with a traditional laser drilling mode, the forming process of the wire holes is milder, the drilling depth can be effectively controlled, the focusing temperature requirement is far lower than the temperature requirement of laser drilling, and the threshold of equipment is effectively reduced.
Drawings
Fig. 1 is a flowchart of a method for forming a three-dimensional structure of a multilayer conductive sheet according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not construed as indicating or implying relative importance.
Referring to fig. 1, fig. 1 is a method for forming a three-dimensional structure of a multilayer conductive sheet according to some embodiments of the present application, including the following steps:
s1, designing or obtaining a three-dimensional line structure model, and splitting the three-dimensional line structure model into a plurality of two-dimensional line models which are connected in an interlayer mode through leads;
the three-dimensional circuit structure model is a three-dimensional model formed by connecting a plurality of stacked two-dimensional circuit models through vertical or oblique leads, and the two-dimensional circuit model refers to a circuit board model with a planar circuit structure; when the three-dimensional circuit structure model is designed, the leads are designed to be staggered in depression angle as much as possible, and the subsequent forming of the conductive leads is facilitated;
specifically, the two-dimensional line model is of a rectangular plate-shaped structure, and the sizes of the two-dimensional line model are similar or the same;
s2, respectively preparing circuit boards comprising circuit structures corresponding to the two-dimensional circuit models according to the split two-dimensional circuit models;
the process of preparing the circuit board can be carried out in a metal sintering or metal corrosion mode so as to accurately obtain the circuit structure of the two-dimensional circuit model;
s3, aligning and laminating a plurality of circuit boards according to the three-dimensional circuit structure model structure to form a combined body;
when the circuit boards are stacked, the positions of the circuit boards correspond to the positions of the two-dimensional circuit models in the three-dimensional circuit structure model;
s4, placing the combined body in an acid medium, and corroding the wire outlet hole of the combined body by utilizing the laser-induced acid medium according to the designed position of the lead;
the laser is preferably confocal laser, light rays of the laser irradiate on the combined body according to the designed position of the lead, and focusing heating at a specific position and a specific depth can be realized, so that the metal circuit on the combined body is heated, an acid medium in contact with the metal circuit conducts heat and is heated to corrode the metal circuit at the position to form a line hole, and the laser stops irradiating until the line hole is formed to the designed depth of the lead;
s5, taking out and cleaning the assembly, then placing conductive materials into the wire holes and preparing conductive leads for connecting the circuit boards, and realizing interlayer connection of the circuit boards in the assembly.
Wherein, the process of cleaning the assembly mainly comprises the steps of cleaning the acid medium and the moisture attached to the assembly to ensure that the surface of the assembly is clean and dry; after the assembly is cleaned, a conductive lead connecting circuit board is prepared, and a multilayer conductive sheet three-dimensional structure is obtained.
The method for forming the three-dimensional structure of the multilayer conductive sheet effectively simplifies the preparation process of the conductive sheet of the three-dimensional structure, and meanwhile, the line hole is obtained through the corrosion of the laser-induced acidic medium, compared with the traditional laser drilling mode, the line hole forming process of the embodiment of the application is milder, the drilling depth can be effectively controlled, the focusing temperature requirement is far lower than the temperature requirement of laser drilling, and the threshold of equipment is effectively reduced.
In some preferred embodiments, the multilayer conductive sheet three-dimensional structure prepared by the multilayer conductive sheet three-dimensional structure forming method of the embodiments of the present application can be connected to a chip, a substrate or an electronic device, and used as a redistribution layer of a corresponding device.
In some preferred embodiments, in step S3, adjacent circuit boards are connected through a glass mat and an adhesive; the glass cushion blocks can separate the circuit boards which are adjacent to each other, so that short circuit caused by direct contact of the circuits on the circuit boards is avoided, the circuit boards are connected through the adhesive glue, the circuit boards can be stably connected after being aligned, and forming errors caused by position deviation of the circuit boards in the process of forming the circuit holes or in other operations are prevented.
Specifically, a glass cushion block is fixed on the bottom surface of each circuit board, and the glass cushion block is fixedly connected with another circuit board through adhesive glue.
Specifically, the glass pad may be a metal circuit carrier in the process of preparing the circuit board in step S2, or may be a transition connector only used for connecting the circuit board in step S3.
More specifically, the glass mat is preferably used only as a transition connector for connecting circuit boards in step S3, that is, in step S3, the circuit boards are supported and connected by an adhesive, and a whole glass mat may be disposed between two adjacent circuit boards for connection, or a plurality of glass mats may be disposed for multi-point supporting connection.
In some preferred embodiments, the glass pad avoids the position of the line hole or is provided with an opening corresponding to the position of the line hole.
Specifically, when a whole glass cushion block is arranged for connection, an opening corresponding to the position of the line hole is formed in the glass cushion block in advance; when setting up polylith glass cushion and carrying out the multiple spot support connection, the position of setting up of polylith glass cushion should avoid the line hole position.
In some preferred embodiments, in step S4, the laser incidence direction is vertically toward the upper and lower end surfaces of the combined bottom, or obliquely toward the upper and lower end surfaces of the combined bottom, or horizontally toward the side surface of the combined body; the wire holes in different directions and shapes can be formed in the step S4, so that the conductive leads in different directions and shapes can be prepared in the step S5, the finally prepared three-dimensional structure body of the multilayer conductive sheet has structural diversity, and design patterns can be drawn in a three-dimensional circuit structure model more freely, namely, the three-dimensional structure body of the multilayer conductive sheet has higher operability and freedom in designing and manufacturing the three-dimensional circuit structure model, and the application range of the three-dimensional structure forming method of the multilayer conductive sheet in the embodiment of the application is wider.
Specifically, after the combined body is placed in an acid medium, the longitudinal depth of laser engraving in a circuit can be changed by adjusting the intensity and time of laser irradiation, the forming direction of the line holes can be changed by adjusting the direction of the laser irradiation, for example, the line holes in the vertical direction can be formed when vertically facing the upper end surface and the lower end surface of the combined body, the line holes in the inclined direction can be formed when obliquely facing the upper end surface and the lower end surface of the combined body, the line holes in the horizontal direction can be formed when horizontally facing the lateral surface of the combined body, the specific irradiation direction of the laser can be determined according to the requirements of model design characteristics, and the combined body has high operability and freedom degree in manufacturing.
More specifically, in some preferred embodiments, the laser incidence direction is preferably vertically oriented toward the upper end surface and the lower end surface of the assembly, so that the subsequently prepared conductive lead is in the vertical direction, the lead distance can be effectively shortened, the material is saved, and the stable molding of the conductive lead is facilitated.
When the circuit board is prepared in the step S2, if the multiple glass cushion blocks are used for multi-point supporting connection in the step S3, in order to maintain the structural strength of the connection of the metal circuit on the circuit board, the metal circuit on the circuit board can retain some short-circuit positions to enhance the structural strength of the circuit, and the damage, fracture or deformation of the circuit board in the process of forming the assembly is avoided, so that in some preferred embodiments, after the assembly is corroded by using a laser-induced acidic medium to form the wire outlet hole, the short-circuit position on the circuit board can be corroded by using a laser-induced acidic medium in the step S4; specifically, the circuit boards after the assembly are aligned and the structure is relatively stable, so that the short circuit position for connection can be cut off by laser induction.
In some preferred embodiments, in step S5, the conductive leads are prepared by laser sintering or electroplating deposition, so that specific positions of the assembly realize interlayer conductive interconnection.
Specifically, when the conductive lead is prepared by adopting a laser sintering mode, a certain amount of nano metal particles are filled in the wire hole, then the metal blocks are sintered by laser heating, the processes are repeated, the metal blocks are sintered and superposed, and the conductive circuit is directly formed to connect the metal circuits on the two or more circuit boards, the conductive lead can be prepared along the wire hole by the forming mode, the conductive lead can also be prepared under the condition of no wire hole guide, and the conductive lead can be used in two types of glass cushion blocks; when the conductive lead is prepared by adopting an electroplating deposition mode, the preparation method of the conductive lead is suitable for being used when a single glass cushion block is provided with holes corresponding to the wire holes, so that metal is deposited in the wire holes and the holes to form the conductive lead connected with the circuit board, namely, the forming position and the shape of the conductive lead are jointly limited by the wire holes and the holes.
In addition, the nano metal particles are sintered by adopting a laser sintering mode, and the sintering position is the position of the wire hole in the process, so that the preparation of the conductive lead wire can be completed along the vertical sintering of the wire hole without designing complicated displacement routes such as laser movement/powder laying movement and the like, and the use mode of laser sintering is simplified.
In some preferred embodiments, in step S2, the circuit board is prepared by laser sintering, and the specific process is as follows: and sintering a layer of nano metal material layer with a specific circuit pattern on the glass according to the two-dimensional circuit model, taking down the sintered structure from the glass, and transferring the sintered structure to a specified position for later use.
In some preferred embodiments, the acidic medium does not corrode and dissolve the circuit board in the assembly at normal temperature, that is, the acidic medium coexists with the circuit board at normal temperature, so that the assembly can be placed in the acidic medium atmosphere at normal temperature for a long time without causing corrosion of the circuit on the circuit board, and the problem of open circuit of a normal metal circuit part is effectively avoided.
In some preferred embodiments, the acidic medium is an acidic liquid or an acidic gas comprising water vapor.
When the acidic liquid is used as the acidic medium, the assembly needs to be slowly placed into a vessel containing the acidic liquid and stands in the vessel; when the acidic gas containing the water vapor is used as the acidic medium, the combination can be placed in a sealed vessel and then the acidic gas containing the water vapor is introduced, so that the combination is in the atmosphere of the acidic gas containing the water vapor, and the acidic gas containing the water vapor can be introduced into the sealed vessel and then the combination can be placed.
Specifically, when the acidic gas containing water vapor is used as the acidic medium, the acidic gas containing water vapor can be continuously and circularly introduced, so that the acid gas with sufficient concentration in the gas atmosphere can be ensured to carry out the wire hole corrosion molding on the combined body.
In some preferred embodiments, the acidic medium may include an oxide that enhances the dissolution of the circuit boards in the assembly. The effect of adding the oxide is to achieve one or more of the following effects: the corrosion efficiency of the circuit on the circuit board corroded by the acidic medium is improved, or the heating temperature requirement of the circuit on the circuit board corroded by the acidic medium is reduced, or fixed waste generated after corrosion is avoided. Specifically, the oxide comprises one or more of hydrogen peroxide, trivalent permanganate acid radical and ozone; the three oxides have enough oxidation performance to improve the corrosion efficiency of the acid medium on the circuit board, namely, the acid medium can finish the corrosion of the circuit on the circuit board more quickly when the laser is focused on the circuit board, thereby reducing the time required by forming the wire holes.
In some preferred embodiments, the laser in step S4 is continuous irradiation or pulse irradiation, and the laser is single laser or multiple lasers simultaneously.
Specifically, continuous irradiation is adopted to quickly carry out circuit corrosion on the circuit board, pulse irradiation is adopted to effectively control the corrosion frequency of the acid medium, further control the corrosion depth, avoid temperature rise and diffusion of an irradiated part, and the irradiation mode can be selected according to the characteristics of the circuit board, so that the repairing mode of the embodiment of the application is suitable for forming multilayer conductive sheet three-dimensional structures in different forms; in addition, whether single-beam laser irradiation or simultaneous irradiation of a plurality of lasers is adopted needs to be selected according to the number and the density of the wire holes to be formed.
In some preferred embodiments, the method further comprises the step S6 of removing the residual conductive material in the combined body; more specifically, the organic solution assembly is used for cleaning in step S6 to remove the residual conductive material, and accordingly, the residual nano metal particles in the sintering mode can be removed or the residual electroplating solution in the electroplating mode can be removed.
Example 1
According to the use requirement, a three-dimensional circuit structure model with a three-layer circuit structure is designed, the three-dimensional circuit structure model is decomposed into three two-dimensional circuit models connected through vertical leads, three corresponding circuit boards containing copper circuits are prepared in a laser sintering mode, the three circuit boards are connected into a combined body through glass cushion blocks and adhesive glue in sequence and opposite positions, the combined body is placed in a sulfuric acid solution designated position with the pH =5.2, ultraviolet laser with the wavelength of 357nm is used for irradiation according to the lead position in the three-dimensional circuit structure model, circuits on the circuit boards are heated, the irradiation position is heated to more than 50 ℃, the sulfuric acid solution corrodes the circuits at the heating position to form wire holes with the required depth, and compared with the forming working condition of thousands of degrees centigrade required by common laser drilling, the equipment requirement and the energy consumption are effectively reduced; and then switching the laser irradiation position to continuously corrode the rest of the wire holes until all the wire holes are formed, taking out the combined body from the sulfuric acid solution, cleaning the combined body, removing the sulfuric acid solution inside and outside the combined body, fixing the combined body on a sintering workbench, adding the nano-copper particle paste into the wire holes while performing laser sintering treatment until conductive copper wires connected to the upper circuit board and the lower circuit board are formed in the wire holes, completing the preparation of a conductive lead after copper filling and sintering treatment is performed on all the wire holes, cleaning the combined body by using an organic solution, removing residual nano-copper particles, and completing the preparation of the three-dimensional structure of the three-layer conductive sheet.
Example 2
Designing a three-dimensional circuit structure model with a three-layer circuit structure according to use requirements, decomposing the three-dimensional circuit structure model into three two-dimensional circuit models connected through a vertical lead, preparing a glass block with holes corresponding to lead positions, preparing three corresponding circuit boards containing copper circuits on the glass block in a laser sintering mode, sequentially and oppositely connecting the three circuit boards with glass blocks through adhesive glue to form a combined body, placing the combined body in a formic acid atmosphere designated position containing water vapor, irradiating the defect position by using ultraviolet laser 5 with the wavelength of 357nm to heat the circuits on the circuit boards, heating the irradiation position to be higher than 80 ℃, corroding the circuits at the heating position by using the formic acid atmosphere containing water vapor to form wire holes with required depth, and effectively reducing the equipment requirements and energy consumption compared with the forming working condition of thousands of degrees centigrade required by common laser drilling; and switching the laser irradiation position to continuously corrode the rest of the wire holes until all the wire holes are formed, taking out the combined body from the formic acid atmosphere containing water vapor, cleaning the combined body, placing the combined body in an electroplating working pool, performing electroplating copper deposition treatment to reduce copper into the wire holes and open holes to form conductive copper wires connected with the upper circuit board and the lower circuit board, completing the preparation of a conductive lead, taking out the combined body, and cleaning to complete the preparation of the three-layer conductive sheet three-dimensional structure.
According to the forming method of the three-dimensional structure of the multilayer conductive sheet, the preparation process of the conductive sheet with the three-dimensional structure is effectively simplified, meanwhile, the wire holes are obtained through laser-induced acidic medium corrosion, and compared with a traditional laser drilling mode, the forming process of the wire holes is milder, the drilling depth can be effectively controlled, the focusing temperature requirement is far lower than the temperature requirement of laser drilling, and the threshold of equipment is effectively reduced.
In the embodiments provided in this application, it should be understood that the disclosed structures and methods may be implemented in other ways. The structural embodiments described above are merely illustrative.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (9)
1. A method for forming a three-dimensional structure of a multilayer conductive sheet is characterized by comprising the following steps:
s1, designing or obtaining a three-dimensional line structure model, and splitting the three-dimensional line structure model into a plurality of two-dimensional line models which are connected in an interlayer mode through leads;
s2, respectively preparing circuit boards comprising circuit structures corresponding to the two-dimensional circuit models according to the split two-dimensional circuit models;
s3, aligning and laminating a plurality of circuit boards according to the three-dimensional circuit structure model structure to form a combined body;
s4, placing the combined body in an acid medium, and corroding a wire outlet hole on the combined body by utilizing the laser-induced acid medium according to the design position of a lead, wherein the acid medium cannot corrode and dissolve a circuit board in the combined body at the normal temperature;
s5, taking out and cleaning the assembly, then placing conductive materials into the wire holes and preparing conductive leads for connecting the circuit boards, and realizing interlayer connection of the circuit boards in the assembly.
2. The method for forming the three-dimensional structure of the multilayer conductive sheet as claimed in claim 1, wherein in step S3, the adjacent circuit boards are connected by glass spacers and adhesive glue.
3. The method of claim 2, wherein the glass mat avoids the wire hole or is provided with an opening corresponding to the wire hole.
4. The method for forming a three-dimensional structure of a multilayer conductive sheet as claimed in claim 1, wherein in step S4, the laser beam is incident in a direction vertically toward the top and bottom end surfaces of the assembly bottom, or obliquely toward the top and bottom end surfaces of the assembly bottom, or horizontally toward the side surfaces of the assembly.
5. The method for forming a three-dimensional structure of a multilayer conductive sheet according to claim 1, wherein in step S4, after the assembly is subjected to outlet hole etching by using the laser-induced acidic medium, the short circuit position on the circuit board is also etched by using the laser-induced acidic medium.
6. The method for forming a three-dimensional structure of a multilayer conductive sheet as claimed in claim 1, wherein in step S5, the conductive leads are prepared by laser sintering or electroplating deposition.
7. The method of claim 1, wherein the acidic medium is an acidic liquid or an acidic gas containing water vapor.
8. The method of claim 1, wherein an oxide is added to the acidic medium to enhance the dissolution of the circuit on the wiring board in the assembly.
9. The method for forming a three-dimensional structure of a multilayer conductive sheet as claimed in claim 1, further comprising a step S6 of removing the residual conductive material in the combined body.
Priority Applications (1)
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| JP2006005251A (en) * | 2004-06-18 | 2006-01-05 | Osaka Industrial Promotion Organization | Fractal structure, and method for manufacturing same |
| CN205883839U (en) * | 2016-08-08 | 2017-01-11 | 成都四威高科技产业园有限公司 | Aluminium liquid cooling machine case structure |
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| CN106658999A (en) * | 2016-11-12 | 2017-05-10 | 广东科翔电子科技有限公司 | Preparation method of multi-layer flexible circuit board |
| US10354045B2 (en) * | 2017-06-16 | 2019-07-16 | Globalfoundries Inc. | Modeling 3D physical connectivity into planar 2D domain to identify via redundancy |
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| JP2006005251A (en) * | 2004-06-18 | 2006-01-05 | Osaka Industrial Promotion Organization | Fractal structure, and method for manufacturing same |
| CN205883839U (en) * | 2016-08-08 | 2017-01-11 | 成都四威高科技产业园有限公司 | Aluminium liquid cooling machine case structure |
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| Three-dimensional global interconnect based on a design window;Qian Li-Bo 等;《Chinese Physics B》;20111031;第20卷(第10期);第108401-1至108401-6页 * |
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