CN113316758A

CN113316758A - Touch panel and method for manufacturing touch panel

Info

Publication number: CN113316758A
Application number: CN202080009834.2A
Authority: CN
Inventors: 泽木大悟; 中平真一
Original assignee: Fujifilm Corp
Current assignee: Fujifilm Corp
Priority date: 2019-03-25
Filing date: 2020-03-04
Publication date: 2021-08-27
Also published as: JPWO2020195622A1; JP7352619B2; WO2020195622A1

Abstract

The invention provides a touch panel and a method for manufacturing the touch panel, which can restrain resistance change generated in an active area as an input area of the touch panel along with the passing of time. The touch panel of the present invention is a touch panel in which an image display module, a1 st transparent insulating layer, a conductive film, a 2 nd transparent insulating layer, and a covering portion are laminated in this order, and the conductive film is arranged on the display surface side of the image display module, wherein the conductive film has a detection portion formed of a conductive layer and a lead-out wiring portion having one end electrically connected to the detection portion and the other end connected to an external connection terminal on at least one surface of a transparent flexible base material, the conductive film has a bent portion bent at a predetermined bending position and the external connection terminal is arranged on the side opposite to the display surface side of the image display module, and the side surface of the 2 nd transparent insulating layer orthogonal to the laminating direction and the bent portion of the conductive film are covered with a sealing layer.

Description

Touch panel and method for manufacturing touch panel

Technical Field

The present invention relates to a touch panel including an image display module and a conductive film that functions as a touch sensor, the conductive film being bent, and a method for manufacturing the touch panel, and more particularly, to a touch panel having a narrow bezel and suppressing a change in resistance with the passage of time in an active region that is an input region of the touch panel, and a method for manufacturing the touch panel.

Background

Currently, there is a touch panel as follows: in various electronic devices including mobile information devices such as tablet computers and smart phones, the electronic devices are used in combination with a display device such as a liquid crystal display device, and input operations are performed on the electronic devices by contacting a screen. The touch panel includes a touch sensor including a detection electrode for detecting a touch and a lead-out wiring electrically connected to the detection electrode.

The extraction wiring extracts an electric signal from the detection electrode, and is routed around the detection electrode and disposed at a position connected to an FPC (flexible printed circuit board). The FPC is electrically connected to the extraction wiring at a connection portion with the FPC, and is connected to an IC (integrated circuit) for controlling the touch sensor through the FPC. Thereby, the touch sensor can be driven.

In recent years, the frame of the touch panel has been narrowed. By narrowing the frame of the touch panel, the area occupied by the screen display of the touch panel becomes large, the screen size to be actually used increases, and the design has high design properties.

In the conventional configuration, the connection portions of the touch sensor and the FPC are arranged on the same plane of 1 substrate, and the FPC connected to the touch sensor is bent and connected to the control mechanism on the back surface side of the touch sensor. In the conventional structure, the area occupied by the connection portion of the FPC and the bent portion of the FPC is large, and therefore it is not sufficient to narrow the frame.

In order to meet the demand for a display device with a narrow frame, various efforts have been made to arrange wiring on the outer periphery of a screen and to dispose a flexible printed circuit board.

For example, in order to narrow the frame, for example, in patent document 1, the wiring is bent using a flexible substrate.

Patent document 1 describes a touch sensor including: 1 substrate having a plurality of regions, at least a planar region and a side region continuous with the planar region and bent with respect to the planar region; a touch sensor unit provided in a planar region of a substrate; and an antenna provided in a region of the substrate other than the planar region. The substrate is formed of a flexible transparent substrate, the touch sensor portion includes a detection portion and a peripheral wiring portion, and at least the detection portion is formed of a thin metal wire. In patent document 1, the sensing electrode or the wiring portion is bent.

Patent document 2 describes an input device including: a base material having light transmittance and flexibility; a plurality of 1 st electrode portions having optical transparency and arranged in the 1 st direction in a detection region on the substrate; a plurality of 2 nd electrode portions which have translucency and are arranged in a 2 nd direction intersecting the 1 st direction in a detection region on the substrate; and a plurality of lead-out wirings which are respectively conducted with the plurality of 1 st electrode parts and the plurality of 2 nd electrode parts and extend from the detection region on the base material to a peripheral region outside the detection region, wherein a bending part is arranged on the peripheral region of the base material, the lead-out wirings comprise a flexible laminated body arranged on the bending part, and a coating material arranged to cover at least a part of the flexible laminated body arranged on the bending part is provided.

Patent document 3 describes a panel-integrated touch sensor including a sensor film having sensor electrodes and an operation panel covering the sensor film. In the sensor film, a sensor electrode is provided on a resin film serving as a base material, and the sensor electrode is covered with a resist layer. The wires extend from the sensor electrodes, and the wires are connected to electrode terminals provided at the ends of the resin film. The electrode terminal is connected to an analysis circuit unit having an IC chip or the like provided outside, and a detection signal obtained from the sensor electrode is analyzed. The resist layer is an insulating film provided to prevent conduction between the sensor electrodes and to protect the sensor electrodes from ultraviolet rays, scratches, and the like. As described above, patent document 3 exemplifies a case where an insulating film is formed to protect the sensor electrode from ultraviolet rays, scratches, and the like.

Prior art documents

Patent document

Patent document 1: international publication No. 2016/158085

Patent document 2: international publication No. 2017/195451

Patent document 3: japanese laid-open patent publication No. 2015-114793

Disclosure of Invention

Technical problem to be solved by the invention

As described in patent document 1, when a touch sensor is manufactured by bending an inductive electrode or a wiring portion, there is a possibility that resistance changes with time in an active region which is an input region of a touch panel.

As described above, in patent document 2, the lead wire has the flexible laminate provided on the bending portion, and the covering material is provided so as to cover at least a part of the flexible laminate provided on the bending portion. Patent document 3 exemplifies a case where an insulating coating is formed on a sensor electrode. Even if the flexible laminate is coated with a coating material as in patent document 2, or an insulating coating is formed on the sensor electrode as in patent document 3, the resistance changes with time in the active region of the touch panel as in patent document 1.

These resistance changes in the active area over time can affect the sensitivity performance of the touch panel. In particular, it has been found that narrowing the width of the frame portion of the touch panel increases the resistance change occurring in the active region with time, and thus there is room for improvement.

As a result of intensive experimental studies, the present inventors have found that a change in resistance occurring with time in an active region, which is an input region of the touch panel, is caused by vulcanization from a bent portion, and have completed the present invention.

An object of the present invention is to provide a touch panel and a method of manufacturing the touch panel, which solve the problems of the conventional techniques described above and suppress a change in resistance with time in an active region, which is an input region of the touch panel.

Means for solving the technical problem

As a result of intensive experimental studies to achieve the above object, the present inventors have found that the above object can be achieved by the following structure.

The present invention provides a touch panel in which an image display module, a1 st transparent insulating layer, a conductive film, a 2 nd transparent insulating layer, and a covering portion are sequentially stacked, and the conductive film is disposed on a display surface side of the image display module, wherein the conductive film has a detection portion formed of a conductive layer and a lead-out wiring portion having one end electrically connected to the detection portion and the other end connected to an external connection terminal on at least one surface of a transparent flexible base material, the conductive film has a bent portion bent at a predetermined bending position and the external connection terminal is disposed on a side opposite to the display surface side of the image display module, and a side surface of the 2 nd transparent insulating layer orthogonal to a stacking direction and the bent portion of the conductive film are covered with a sealing layer.

Preferably, the end of the sealing layer is in contact with the surface of the cover and the surface of the image display module opposite to the display surface.

The sealing layer is preferably formed of an adhesive layer having electrical insulation properties.

It is preferable that the permeability of the sealing layer to sulfur gas measured by gas chromatography is 10^-2g/m²The day is less.

Preferably, the flexible substrate has a strip-shaped protruding portion, and the protruding portion is provided with a lead-out wiring portion.

Preferably, at least one of the 1 st transparent insulating layer and the 2 nd transparent insulating layer includes a metal stabilizer. Preferably, the metal stabilizer comprises a compound selected from compounds having a mercaptothiazole skeleton or a mercaptothiadiazole skeleton, or salts thereof.

The present invention also provides a touch panel in which an image display module, a1 st transparent insulating layer, a conductive layer, and a 2 nd transparent insulating layer are sequentially stacked, the conductive layer is disposed on a display surface side of the image display module, and at least one of the 1 st transparent insulating layer and the 2 nd transparent insulating layer contains a metal stabilizer.

Preferably, the metal stabilizer comprises a compound selected from compounds having a mercaptothiazole skeleton or a mercaptothiadiazole skeleton, or salts thereof.

The present invention provides a method for manufacturing a touch panel, the touch panel being formed by laminating an image display module, a1 st transparent insulating layer, a conductive film, a 2 nd transparent insulating layer, and a covering portion in this order, the conductive film being disposed on a display surface side of the image display module, wherein the conductive film has a detection portion formed of a conductive layer and a lead-out wiring portion having one end electrically connected to the detection portion and the other end connected to an external connection terminal, on at least one surface of a transparent flexible base material, the method comprising: a step of bending the conductive film at a predetermined bending position to dispose the external connection terminal on a side of the image display module opposite to the display surface side; and forming a sealing layer covering a side surface of the 2 nd transparent insulating layer in a direction orthogonal to the laminating direction and a bent portion in which the conductive film is bent at a predetermined bending position and the external connection terminal is arranged on a side opposite to the display surface side of the image display module.

The sealing layer is preferably formed by any one of a pasting method, a sputtering method, a vapor deposition method, a spraying method, and a dropping method.

Effects of the invention

The touch panel of the present invention can suppress a change in resistance that occurs with the passage of time in an active region, which is an input region of the touch panel. Further, according to the method of manufacturing a touch panel, a touch panel in which a change in resistance occurring with the passage of time in an input region, that is, an active region of the touch panel is suppressed can be obtained.

Drawings

Fig. 1 is a schematic cross-sectional view showing an example of a touch panel according to an embodiment of the present invention.

Fig. 2 is a schematic view showing example 1 of the conductive film of the touch panel according to the embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view showing the structure of a detection section of a conductive film according to example 1 of the embodiment of the present invention.

Fig. 4 is a schematic view showing example 2 of the conductive film of the touch panel according to the embodiment of the present invention.

Fig. 5 is a schematic view showing example 3 of the conductive film of the touch panel according to the embodiment of the present invention.

Fig. 6 is a schematic view showing example 4 of the conductive film of the touch panel according to the embodiment of the present invention.

Fig. 7 is a schematic view showing example 5 of the conductive film of the touch panel according to the embodiment of the present invention.

Fig. 8 is a schematic diagram showing an electrode structure of a detection section of a conductive film of a touch panel according to an embodiment of the present invention.

Fig. 9 is a schematic diagram showing an example of the shape of the mesh pattern of the detection section of the conductive film of the touch panel according to the embodiment of the present invention.

Fig. 10 is a schematic cross-sectional view showing an example of the configuration of the detection section of the conductive film of the touch panel according to the embodiment of the present invention.

Fig. 11 is an enlarged schematic view showing an example of the conductive line of the detection section according to the embodiment of the present invention.

Fig. 12 is a schematic cross-sectional view showing a step of a method for manufacturing a touch panel according to an embodiment of the present invention.

Fig. 13 is a schematic cross-sectional view showing a step of the method for manufacturing a touch panel according to the embodiment of the present invention.

Fig. 14 is a schematic cross-sectional view showing a reference example of a touch panel having a conductive film.

Fig. 15 is a schematic view showing a reference example of the conductive film.

Detailed Description

Hereinafter, a touch panel and a method for manufacturing the touch panel according to the present invention will be described in detail with reference to preferred embodiments shown in the drawings.

The drawings described below are exemplary drawings for describing the present invention, and the present invention is not limited to the drawings described below.

In addition, "to" in the following numerical ranges includes numerical values described on both sides. For example, the term "epsilon" is a value from α to β, meaning that the range of epsilon includes the value α and the value β, and when expressed in mathematical notation, α ≦ epsilon ≦ β.

Unless otherwise specified, angles such as "parallel" and "orthogonal" include error ranges that are generally allowable in the corresponding technical fields.

Also, "the same" includes an error range generally allowed in the corresponding technical field.

The light refers to an activating ray or radiation. Unless otherwise specified, "exposure" in this specification includes not only exposure based on a bright line spectrum of a mercury lamp, far ultraviolet rays typified by an excimer laser, X rays, EUV light, and the like, but also drawing based on a particle beam such as an electron beam or an ion beam.

Further, "(meth) acrylate" represents both or either of acrylate and methacrylate, and "(meth) acrylic acid" represents both or either of acrylic acid and methacrylic acid. And, "(meth) acryloyl group" means both or either of an acryloyl group and a methacryloyl group.

The term "transparent" means that the light transmittance is 40% or more, preferably 80% or more, and more preferably 90% or more in the visible light wavelength region having a wavelength of 380 to 780nm, unless otherwise specified.

The light transmittance was measured according to JIS (japanese industrial standard) K7375: the value determined by "calculation of total light transmittance and total light reflectance" specified in 2008.

(touch panel)

Fig. 1 is a schematic cross-sectional view showing an example of a touch panel according to an embodiment of the present invention, and fig. 2 is a schematic view showing a1 st example of a conductive film of the touch panel according to the embodiment of the present invention. Fig. 3 is a schematic cross-sectional view showing the structure of a detection section of a conductive film according to example 1 of the embodiment of the present invention.

The touch panel 10 of example 1 shown in fig. 1 includes a conductive film 12, an image display module 14, a cover 16, a1 st transparent insulating layer 15, and a 2 nd transparent insulating layer 17. In the touch panel 10, the image display module 14, the 1 st transparent insulating layer 15, the conductive film 12, the 2 nd transparent insulating layer 17, and the cover portion 16 are stacked in this order along the stacking direction Dt, and the conductive film 12 is disposed on the display surface 14a side of the image display module 14.

In the touch panel 10, the conductive film 12 and the image display module 14 are laminated via the 1 st transparent insulating layer 15. The conductive film 12 and the covering portion 16 are laminated via a 2 nd transparent insulating layer 17.

The 1 st transparent insulating layer 15 is provided over the entire display surface 14a of the image display module 14. For example, the 1 st transparent insulating layer 15 and the 2 nd transparent insulating layer 17 are provided in the same area. At this time, the 1 st transparent insulating layer 15 and the 2 nd transparent insulating layer 17 are the same in size when viewed from the surface 16a side of the covering portion 16.

In the touch panel 10, the 1 st transparent insulating layer 15, the conductive film 12, the 2 nd transparent insulating layer 17, and the cover portion 16, which are disposed on the display surface 14a side of the image display module 14, are preferably transparent so that a display object (not shown) displayed on the display surface 14a of the image display module 14 can be visually recognized.

The touch panel 10 includes a frame 40 surrounding the image display module 14 and the conductive film 12. The image display module 14 and the conductive film 12 are housed in the interior 40a of the housing 40. The frame 40 has a bottom plate 41 having a shape similar to the covering portion 16 and a side plate 42 surrounding the outer edge of the bottom plate 41. In the interior 40a of the housing 40, a cushion material 44 is provided, for example, at a corner portion between the bottom plate 41 and the side plate 42 and a corner portion between the side plate 42 and the covering portion 16. The side plate 42 of the frame 40 is bonded to the back surface 16b of the covering portion 16.

The buffer material 44 is used to protect the image display module 14 and the conductive film 12 from external impact and the like. The cushion material 44 can be formed using ethylene-propylene sponge, chloroprene sponge, styrene-butadiene sponge, nitrile rubber sponge, or the like.

In the touch panel 10, the surface 16a of the cover 16 serves as a touch surface of the touch panel 10 and serves as an operation surface. In the touch panel 10, an input operation is performed with the surface 16a of the cover 16 as an operation surface. The touch surface is a surface for detecting contact with a finger, a stylus, or the like. The surface 16a of the covering portion 16 serves as a viewing surface for a display object (not shown) displayed on the display surface 14a of the image display module 14.

A controller 13 is provided on the back surface 14b of the image display module 14. The conductive film 12 is bent so as to surround the side surface 14c of the image display module 14. The conductive film 12 and the controller 13 are electrically connected by a flexible wiring member such as a flexible circuit board 19.

A decorative layer 18 having a light shielding function is provided on the back surface 16b of the cover 16. The decorative layer 18 is provided, for example, along the outer edge of the covering portion 16 as viewed from the surface 16a side of the covering portion 16. The region where the decoration layer 18 is provided is the frame portion Df. The frame portion Df is a member for making the structure located below the frame portion invisible through the decoration layer 18. The narrow width of the frame portion Df is referred to as a narrow frame. The narrowing of the width of the frame portion Df is referred to as "frame narrowing".

As will be described in detail below, in the touch panel 10, the conductive film 12 has the bent portions 27 protruding from the 1 st transparent insulating layer 15 and the 2 nd transparent insulating layer 17, and the side surface 17c of the 2 nd transparent insulating layer 17 and the bent portions 27 of the conductive film 12 in the direction Dw orthogonal to the lamination direction Dt are covered with the sealing layer 36. The end 36a of the sealing layer 36 can reach the surface of the decorative layer 18 of the cover 16.

The sealing layer 36 preferably has an end 36a in contact with the covering portion 16 and a terminal 36c in contact with the back surface 14b, which is the surface of the image display module 14 opposite to the display surface 14 a. With the sealing layer 36 having such a structure, vulcanization of the conductive layer by the sealing layer 36 can be further suppressed. As shown in fig. 2, the flexible circuit board 19 is narrower than the flexible base material 25. The sealing layer 36 is provided to cover the flexible circuit board 19 and to contact the back surface 14b of the image display module 14.

The sealing layer 36 suppresses vulcanization of the conductive layer of the conductive film 12 and suppresses vulcanization in the input region E as the detection section 20 of the touch panel 10₁The resistance change in the active region with the passage of time. The sealing layer 36 is made of a material having electrical insulation properties. For example, even if sulfur gas (hydrogen sulfide gas or volatile sulfur (S)) is generated by degassing from the frame 40 and the buffer 44₈) Etc.), it is also possible to suppress the penetration of sulfur gas into the interface between the conductive film 12 and the 2 nd transparent insulating layer 17 by the sealing layer 36. When the conductive layer is vulcanized, the resistance of the conductive layer changes, but as described above, the permeation of sulfur gas can be suppressed, so that the vulcanization of the conductive layer of the conductive film 12 can be suppressed. This suppresses a change in the resistance of the conductive layer and suppresses a change in the resistance with time in the active region. Furthermore, since the vulcanization of the conductive layer is suppressed, the appearance of the conductive layer is not deteriorated, and the conductive layer can be prevented from being visually recognized.

Sulfur gas (hydrogen sulfide gas or volatile sulfur (S)) causing the occurrence of sulfur₈) Etc.) are not limited to those generated by outgassing from the frame 40 and the cushioning material 44.

Further, since the sealing layer 36 does not need to cover the entire surface of the conductive film 12, it is possible to maintain the light transmittance while suppressing a decrease in the light transmittance.

As described above, in the touch panel 10, the input area E of the detection unit 20 can be suppressed₁I.e., a change in resistance in the active region over time. In addition, the frame can be narrowed and the light transmittance can be maintained at the same time.

The controller 13 is configured by a known component used for detection by the touch sensor. When the touch panel 10 is of the capacitance type, the controller 13 detects a position where capacitance changes when a finger or the like touches the surface 16a of the covering portion 16 as a touch surface. The capacitive touch panel includes a mutual capacitive touch panel and a self capacitive touch panel, but is not particularly limited thereto.

The covering portion 16 protects the conductive film 12. The structure of the covering portion 16 is not particularly limited. The cover 16 is preferably transparent so that a display object (not shown) displayed on the display surface 14a of the image display module 14 can be visually recognized. For example, a plastic film, a plastic plate, a glass plate, or the like is used for the cover portion 16. The thickness of the covering portion 16 is preferably selected as appropriate according to the respective use.

As a raw material of the plastic film and the plastic plate, for example, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as Polyethylene (PE), polypropylene (PP), polystyrene, and EVA (ethylene-vinyl acetate copolymer); a vinyl-based resin; in addition, Polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC), cycloolefin resin (COP), polyvinylidene fluoride (PVDF), Polyarylate (PAR), Polyethersulfone (PES), high-molecular acrylic resin, fluorene derivative, crystalline COP, and the like.

As the cover 16, a polarizing plate, a circularly polarizing plate, or the like can be used.

As described above, since the surface 16a of the cover 16 serves as a touch surface, a hard coat layer may be provided on the surface 16a as necessary. The thickness of the covering portion 16 is, for example, 0.1 to 1.3mm, and particularly preferably 0.1 to 0.7 mm.

The structure of the 1 st transparent insulating layer 15 is not particularly limited as long as it is transparent and electrically insulating and can stably fix the conductive film 12 and the image display module 14. As the first transparent insulating layer 15, for example, an optically transparent Resin (OCR) such as an Optically Clear Adhesive (OCA) or a UV (Ultra Violet: ultraviolet) curable Resin can be used. Also, the 1 st transparent insulating layer 15 may be partially hollow.

The structure of the 2 nd transparent insulating layer 17 is not particularly limited as long as it is transparent and electrically insulating and can stably fix the conductive film 12 and the covering portion 16. The 2 nd transparent insulating layer 17 can use the same transparent insulating layer as the 1 st transparent insulating layer 15.

The image display module 14 includes a display surface 14a for displaying a display object such as an image, and includes, for example, a liquid crystal display device. The image display module 14 is not limited to a liquid crystal display device, and may be an Organic EL (Organic electro luminescence) display device. In addition to the above, the image display module 14 may be a Cathode Ray Tube (CRT) display device, a Vacuum Fluorescent Display (VFD), a Plasma Display Panel (PDP), a surface electric field display (SED), a Field Emission Display (FED), electronic paper, or the like.

The image display module 14 can be appropriately used in a form according to its application, but is preferably in a form of a panel such as a liquid crystal display panel or an organic EL panel in order to make the touch panel 10 thin.

As described above, the decorative layer 18 has a light shielding function, and the structures such as the detection section 20 and the extraction wiring section 22 are not visible by the structures such as the detection section 20 and the extraction wiring section 22 covering the conductive film 12 positioned below the decorative layer 18.

The decorative layer 18 is not particularly limited as long as it can make structures such as the detection section 20 and the extraction wiring section 22 invisible, and a known decorative layer can be used. Various printing methods such as screen printing, gravure printing, and offset printing, transfer methods, and vapor deposition methods can be used for forming the decorative layer. The decoration layer 18 is formed on the back surface 16b of the covering portion 16, but is not limited thereto, and may be formed directly on a structure such as the detection portion 20 and the extraction wiring portion 22.

The invisible state means that the structure located below the decorative layer 18 is not visible, and the structure is not visible to 1 person when observed by 10 observers.

(conductive film)

The conductive film 12 will be explained.

The conductive film 12 functions as a touch sensor in the touch panel 10. The structure of the conductive film 12 is not particularly limited as long as it functions as a touch sensor.

For example, the conductive film 12 has a detection unit 20 made of a conductive layer and a lead-out wiring unit 22 having one end electrically connected to the detection unit 20 and the other end connected to an external connection terminal 26 on at least one surface of a transparent flexible substrate 25. In the conductive film 12, the detection section 20 and the extraction wiring section 22 are provided on the front surface 25a and the back surface 25b of the flexible substrate 25, respectively.

The conductive film 12 having the flexible base material 25 is flexible and can be bent. When the conductive film 12 has a polygonal shape, at least one side of the conductive film 12 is bent.

The detection unit 20 is an input area E in which a user can perform an input operation₁. In the input area E₁Outer side region E of₂The extraction wiring section 22 is disposed. An input area E of the detection unit 20₁Referred to as the active region. The input region E of the detection unit 20 can be suppressed by the sealing layer 36₁Internal vulcanization, i.e., vulcanization in the active region, and suppresses a change in resistance occurring in the active region with the passage of time.

In the touch panel 10, the conductive film 12 is bent at a bending position Bf defined in accordance with design specifications or the like, and the external connection terminal 26 of the extraction wiring portion 22 is disposed on the back surface 14b side, which is the opposite side of the image display module 14 from the display surface 14a side. A flexible wiring member such as the flexible circuit board 19 is electrically connected to the external connection terminal 26.

In the case of the conductive film 12 alone, that is, in a state before the conductive film 12 is assembled to the touch panel 10, the bending position Bf of the conductive film 12 is a predetermined bending position of the flexible substrate 25. The flexible base material 25 is bent at a predetermined bending position. The bending position Bf of the conductive film 12 and the predetermined bending position of the flexible substrate 25 are different in that the positions are the same whether the conductive film 12 is incorporated into the touch panel 10 or the conductive film 12 is a single body.

In the conductive film 12, the bent portion 27 is a range Dc from the bent position Bf to the outer edge 25c of the flexible base material 25. That is, the bent portion 27 extends from the bent position Bf to the end portion of the flexible base material 25 in the Y direction on the side where the detection portion 20 is not provided. The external connection terminals 26 are provided on the bent portions 27. As described above, the sealing layer 36 is formed in the bent portion 27, i.e., the range Dc.

The conductive film 12 shown in fig. 2 has the following structure: at the bending position Bf, only the detection section 20 and the extraction wiring section 22 out of the extraction wiring sections 22 are provided, and the detection section 20 is not provided. A region from the bent position Bf to the end 20c of the detector 20 is a frame region Ds corresponding to the frame Df.

The detection unit 20 includes, for example, a plurality of 1 st detection electrodes 30 and a plurality of 2 nd detection electrodes 32. The plurality of 1 st detection electrodes 30 are strip-shaped electrodes extending in parallel to each other in the X direction, and are provided on the surface 25a (see fig. 2) of the flexible base material 25 in a state of being electrically insulated from each other in the Y direction at intervals 31 in the Y direction orthogonal to the X direction. The plurality of 2 nd detection electrodes 32 are strip-shaped electrodes extending in the Y direction in parallel to each other, and are provided on the back surface 25b (see fig. 2) of the flexible base material 25 in a state of being electrically insulated from each other in the X direction with a gap 31 therebetween in the X direction. The plurality of 1 st detection electrodes 30 and the plurality of 2 nd detection electrodes 32 are disposed orthogonally to each other, but are electrically insulated from each other by the flexible base material 25.

The gap 31 between the 1 st detection electrode 30 and the 2 nd detection electrode 32 is a region that is not electrically connected to the 1 st detection electrode 30 or the 2 nd detection electrode 32. Therefore, as described above, the plurality of 1 st detection electrodes 30 are electrically insulated from each other in the Y direction, and the plurality of 2 nd detection electrodes 32 are electrically insulated from each other in the X direction.

As shown in fig. 2, in the detection unit 20, 6 detection electrodes 30 are provided at the 1 st position, and 5 detection electrodes 32 are provided at the 2 nd position, but the number is not particularly limited as long as there are a plurality of detection electrodes.

The 1 st detection electrode 30 and the 2 nd detection electrode 32 are constituted by, for example, a thin metal wire 33 (refer to fig. 3). The thin metal wires 33 are arranged in a grid pattern, for example. The pattern of the thin metal wire 33 will be described in detail later. The 1 st detection electrode 30 and the 2 nd detection electrode 32 each correspond to a conductive layer.

The extraction wiring portion 22 functions to apply a voltage to the 1 st detection electrode 30 and the 2 nd detection electrode 32. One end of the extraction wiring portion 22 is electrically connected to the 1 st detection electrode 30 or the 2 nd detection electrode 32. An external connection terminal 26 is provided at the terminal end 22b as the other end. The extraction wiring portion 22 may be formed of a conductive layer.

The extraction wiring section 22 is constituted by a plurality of lead-out wirings 23. One end of the lead line 23 is electrically connected to the 1 st detection electrode 30 or the 2 nd detection electrode 32. The other ends of the lead lines 23 are electrically connected to 1 external connection terminal 26. The other end of the lead lines 23 is the terminal 22b of the extraction line section 22.

The number of lead lines 23 of the extraction wiring section 22 is the same as the number of electrically connected detection electrodes.

In the touch panel 10 shown in fig. 2, the extraction wiring portion 22 is electrically connected to the end portion of the 1 st detection electrode 30 in the X direction, the extraction wiring portion 22 is electrically connected to one end portion of the 2 nd detection electrode 32 in the Y direction, and the extraction wiring portions 22 are arranged from 3 directions with respect to the 1 st detection electrode 30 and the 2 nd detection electrode 32.

Preferably, the detection unit 20 and the extraction wiring unit 22 are integrally configured. At this time, the detection unit 20 and the extraction wiring unit 22 are formed by, for example, photolithography.

Here, fig. 14 is a schematic cross-sectional view showing a reference example of a touch panel having a conductive film, and fig. 15 is a schematic view showing a reference example of a conductive film.

In fig. 14 and 15, the same structural objects as those of the touch panel 10 shown in fig. 1 and the conductive film 12 shown in fig. 2 are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

In the touch panel 100 shown in fig. 14, as in the conductive film 102 shown in fig. 15, the detection section 20 and the extraction wiring section 22 are provided on the front surface 104a and the back surface 104b of the substrate 104, respectively. The outer edge 104c of the substrate 104 is an end portion in the Y direction on the side of the substrate 104 where the detection unit 20 is not provided.

In the conductive film 102 shown in fig. 15, the external connection terminal 26 and the detection unit 20 are provided on the same surface of the front surface 104a or the same surface of the back surface 104b of the substrate 104.

The flexible circuit board 19 is electrically connected to the external connection terminals 26 provided at the terminal end 22b of the extraction wiring section 22.

In the conductive film 102 shown in fig. 15, the flexible circuit board 19 is bent without bending the conductive film 102. The flexible circuit board 19 has a bending position Bf therein, and the flexible circuit board 19 is bent at the bending position Bf and electrically connected to the controller 13 as shown in fig. 14.

In the conductive film 102, a sealing layer 36 is formed in a region 105 from the end portion 20c of the detection portion 20 to the outer edge 104c of the substrate 104 (see fig. 14). However, in the structure of the conductive film 102, for example, when sulfur gas is generated by degassing from the frame 40 and the buffer material 44, the sealing layer 36 cannot prevent the sulfur gas from penetrating into the interface between the conductive film 12 and the 2 nd transparent insulating layer 17. Therefore, the conductive layer of the conductive film 102 cannot be prevented from being vulcanized, and the conductive layer is vulcanized by permeation of sulfur gas. The resistance of the conductive layer increases due to vulcanization, and changes with time in the active region. Further, the conductive layer is colored due to vulcanization or the like, and the appearance of the conductive layer may be deteriorated, and the conductive layer may be visually recognized.

The curvature of the bent portion is larger when the flexible circuit board 19 is bent than when the conductive film 12 (see fig. 2) is bent. For this reason, narrowing of the frame cannot be achieved.

As described above, the conductive film 12 shown in fig. 2 has flexibility, and the conductive film 12 itself can be bent. Therefore, the bending curvature of the conductive film 12 shown in fig. 2 can be set smaller than that in the case where the flexible circuit board 19 is bent like the conductive film 102 shown in fig. 15, and thereby the frame of the touch panel 10 (see fig. 1) can be narrowed.

(Another example of the conductive film)

Next, example 2 of the conductive film 12 will be described.

In fig. 4, the same structural objects as those of the touch panel 10 shown in fig. 1 and the conductive film 12 shown in fig. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

The conductive film 12 of example 2 shown in fig. 4 is similar to the conductive film 12 shown in fig. 2 except that the conductive film 12 is different in the position of the bending position Bf and the space 25d between the extraction wiring portion 22 and the outer edge 25c of the flexible substrate 25 is narrowed, as compared with the conductive film 12 shown in fig. 2, and therefore, detailed description thereof is omitted.

The conductive film 12 shown in fig. 4 has a detection portion 20 and a lead-out wiring portion 22 at a bending position Bf, and the detection portion 20 and the lead-out wiring portion 22 are bent. The frame region Ds can be made substantially zero by bending the conductive film 12 at the bending position Bf where the detection section 20 is located, and a further narrower frame can be achieved. As a result, in the touch panel (not shown) using the conductive film 12 shown in fig. 4, the width of the decorative layer 18 (see fig. 1) can be narrowed to further narrow the bezel.

The touch panel using the conductive film 12 shown in fig. 4 can have a structure in which the decorative layer 18 has a narrower width and the frame portion Df is narrower than the touch panel 10 shown in fig. 1.

The structure of the conductive film 12 is not limited to the above structure. For example, the structure shown in fig. 5 to 7 may be adopted.

Fig. 5 is a schematic view showing a 3 rd example of the conductive film of the touch panel according to the embodiment of the present invention, fig. 6 is a schematic view showing a 4 th example of the conductive film of the touch panel according to the embodiment of the present invention, and fig. 7 is a schematic view showing a5 th example of the conductive film of the touch panel according to the embodiment of the present invention.

In the conductive film 12 shown in fig. 5, the same structural objects as those of the conductive film 12 shown in fig. 2 are denoted by the same reference numerals, and detailed description thereof is omitted. In the conductive film 12 shown in fig. 6, the same structural objects as those of the conductive film 12 shown in fig. 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

The conductive film 12 shown in fig. 5 is similar to the conductive film 12 shown in fig. 2 except that the flexible base material 25 has the strip-shaped protruding portion 29, compared to the conductive film 12 shown in fig. 2, and therefore, detailed description thereof is omitted.

The protruding portion 29 is provided with the extraction wiring portion 22, and the protruding portion 29 has the terminal portion 22b of the extraction wiring portion 22. The flexible circuit board 19 is electrically connected to the external connection terminals 26 provided at the terminal portion 22 b.

In the conductive film 12 shown in fig. 5, the bent position Bf is located at the protruding portion 29. At the bending position Bf, only the extraction wiring section 22 out of the detection section 20 and the extraction wiring section 22 is present. The protruding portion 29 can be formed by punching or partially cutting the flexible base material 25. In the conductive film 12 shown in fig. 5, the sealing layer 36 is formed in the range Dc from the bent position Bf to the outer edge 25c of the flexible base material 25, that is, in the bent portion 27 formed of the protruding portion 29 (see fig. 1).

In the conductive film 12 shown in fig. 5, the position of the protruding portion 29 is set to the center in the X direction, but the present invention is not limited to this. The position of the protruding portion 29 is appropriately determined according to the layout of the detection portion 20 and the extraction wiring portion 22.

Depending on the size of the detection unit 20, a plurality of portions connected to the flexible circuit board 19 may be provided. At this time, the number of the protruding portions 29 is the same as the number of portions connected to the flexible circuit board 19. Therefore, the number of the protruding portions 29 is not limited to 1, and may be plural. The plurality of projections 29 can be bent.

The conductive film 12 shown in fig. 6 is the same as the conductive film 12 shown in fig. 5 except that the bending position Bf is different from the conductive film 12 shown in fig. 5, and therefore, detailed description thereof is omitted. The conductive film 12 shown in fig. 6 has a detection unit 20 and a lead-out wiring unit 22 at a bending position Bf, and the detection unit 20 and the lead-out wiring unit 22 are bent, similarly to the conductive film 12 shown in fig. 4. As shown in fig. 6, the frame region Ds can be made substantially zero by bending the conductive film 12 at the bending position Bf where the detection unit 20 is located, and a further narrower frame can be achieved. Thus, when the touch panel is configured, the width of the decorative layer 18 (see fig. 1) can be reduced, and a further reduced bezel can be obtained.

In the conductive film 12 shown in fig. 6, a sealing layer 36 is formed on a bent portion 27 formed by a part of the flexible base material 25 and the protruding portion 29 in a range Dc from the bent position Bf to the outer edge 25c of the flexible base material 25 (see fig. 1).

The conductive film 12 shown in fig. 7 is the same as the conductive film 12 shown in fig. 2 except that the number of the 1 st detection electrodes 30 and the number of the 2 nd detection electrodes 32, and the extraction wiring section 22 is led out in 2 directions, as compared with the conductive film 12 shown in fig. 2, and therefore, detailed description thereof is omitted.

In the conductive film 12 shown in fig. 7, the extraction wiring portion 22 is led out from the outer edge 25c of the flexible substrate 25 on both sides in the Y direction in which the 1 st detection electrode 30 extends, and the external connection terminal 26 is provided at the terminal end 22b of the extraction wiring portion 22. The flexible circuit board 19 is electrically connected to the external connection terminals 26.

The drawing direction of the extraction wiring portion 22 is not limited to the direction shown in fig. 7.

For example, the bending position Bf is set at 2, and the bending can be performed at 2.

The bending position Bf has only the extraction wiring portion 22 of the detection portion 20 and the extraction wiring portion 22 and does not have the detection portion 20, but is not limited thereto, and may have the detection portion 20 and the extraction wiring portion 22.

The conductive film 12 is bent at 2, but is not limited to this, and may be bent at 1. In addition, the region E outside the flexible substrate 25 in the X direction may be set₂The extraction wiring portion 22 of (2) is bent. The conductive film 12 shown in fig. 7 can be bent at 4 points at most.

(Structure of conductive film)

Hereinafter, each member constituting the conductive film will be described.

< electrode Structure, etc. >

Fig. 8 is a schematic view showing an electrode structure of a detection portion of a conductive film of a touch panel according to an embodiment of the present invention, and fig. 9 is a schematic view showing an example of a shape of a mesh pattern of the detection portion of the conductive film of the touch panel according to the embodiment of the present invention.

As described above, the 1 st and 2

nd detection electrodes

30 and 32 of the detection unit 20 are constituted by the thin metal wires 33. For example, as shown in fig. 8, the 1 st and 2

nd detection electrodes

30 and 32 have a mesh pattern in which a plurality of thin metal wires 33 intersect.

The lead line 23 may have the same configuration as the 1 st detection electrode 30 and the 2 nd detection electrode 32. The lead line 23 may have a grid pattern in which a plurality of thin metal wires 33 intersect.

When the 1 st detection electrode 30, the 2 nd detection electrode 32, and the lead line 23 are configured to have a mesh pattern, the pattern of the mesh pattern is not particularly limited, but is preferably a geometric pattern in which a combination of a triangle such as a regular triangle, an isosceles triangle, or a right triangle, a square, a rectangle, a rhombus, a parallelogram, a trapezoid, a quadrangle such as a (regular) hexagon, a (regular) octagon such as a (regular) octagon, a circle, an ellipse, a star, and the like is used.

As shown in fig. 9, the mesh of the mesh pattern is a shape including a plurality of openings 35 formed by intersecting fine metal wires 33.

The opening 35 is an opening region surrounded by the thin metal wire 33. The upper limit of the length W of one side of the opening 35 is preferably 800 μm or less, more preferably 600 μm or less, and still more preferably 400 μm or less, and the lower limit is preferably 5 μm or more, more preferably 30 μm or more, and still more preferably 80 μm or more. When the length W of one side of the opening 35 is within the above range, the transparency can be further maintained well, and when the conductive film 12 (see fig. 1) is attached to the display surface 14a (see fig. 1) of the image display module 14 (see fig. 1), the display can be visually recognized without discomfort.

From the viewpoint of visible light transmittance, the aperture ratio of the mesh pattern is preferably 85% or more, more preferably 90% or more, and still more preferably 95% or more. The aperture ratio corresponds to the ratio of the permeable portion other than the fine metal wire, i.e., the aperture, in the region where the conductive layer is provided to the entire region where the conductive layer is provided.

As shown in fig. 3, the configuration of the detection unit 20 is not limited to the configuration in which the 1 st detection electrode 30 is provided on the front surface 25a and the 2 nd detection electrode 32 is provided on the rear surface 25b of the flexible base material 25. For example, the 1 st detection electrode 30 and the 2 nd detection electrode 32 may be provided on different flexible base materials and laminated. Specifically, the flexible substrate 25 provided with the 1 st detection electrode 30 and the flexible substrate 25 provided with the 2 nd detection electrode 32 may be laminated via a transparent and electrically insulating insulator layer.

However, the present invention is not limited to the configuration in which the detection unit 20 is provided on each of the front surface 25a and the back surface 25b of the flexible base material 25. As shown in fig. 10, the detection electrode 34 may be provided only on one surface of the flexible substrate 25, for example, only on the surface 25 a. The detection electrode 34 shown in fig. 10 functions as the detection unit 20. The detection electrode 34 is constituted by a plurality of thin metal wires 33, as with the 1 st detection electrode 30 (see fig. 8), and the thin metal wires 33 are provided on the surface 25 a.

The 1 st and 2

nd detection electrodes

30 and 32 of the detection unit 20 may be formed of conductive fibers such as silver nanowires, Carbon Nanotubes (CNTs), Carbon Nanobuds (CNBs), or a combination thereof, as a structure other than the fine metal wires.

< Flexible substrate >

The flexible base material is a material that can be bent, and specifically, a material that does not crack even when bent with a curvature radius of 1 mm.

The flexible base material is a support body having flexibility and supporting the detection portion and the wiring portion. The type of the flexible base material is not limited as long as it can support the detection unit and the extraction wiring unit and has flexibility, and a transparent support is preferable, and a plastic sheet is particularly preferable.

Specific examples of the material constituting the flexible substrate include PET (polyethylene terephthalate) (258 ℃), polycycloolefin (134 ℃), polycarbonate (250 ℃), (meth) acrylic resin (128 ℃), PEN (polyethylene naphthalate) (269 ℃), PE (polyethylene) (135 ℃), PP (polypropylene) (163 ℃), polystyrene (230 ℃), polyvinyl chloride (180 ℃), polyvinylidene chloride (212 ℃), PVDF (vinylidene fluoride) (177 ℃), PAR (polyarylate) (250 ℃), PEs (polyethersulfone) (225 ℃), polymer acrylic resin, fluorene derivative (140 ℃), plastic film having a melting point of about 290 ℃ or less, such as COP crystallinity (165 ℃) or TAC (triacetylcellulose) (290 ℃), and more preferably (meth) acrylic resin, PET, polycycloolefin, or polycarbonate. () The values within (A) are melting points or glass transition temperatures.

The total light transmittance of the flexible substrate is preferably 85 to 100%.

The thickness of the flexible substrate is not particularly limited, but can be arbitrarily selected from the range of 25 to 500 μm in general from the viewpoint of application to a touch panel. In addition, when the flexible substrate also has a function of a touch surface in addition to a function of a flexible base material, the flexible substrate can be designed to have a thickness of more than 500 μm.

As one of preferable embodiments of the flexible substrate, there is given a treated support subjected to at least 1 treatment selected from the group consisting of an atmospheric pressure plasma treatment, a corona discharge treatment and an ultraviolet irradiation treatment. By performing the above treatment, hydrophilic groups such as OH groups are introduced into the surface of the treated support, whereby the adhesion of the conductive wire is further improved.

In another preferred embodiment of the flexible substrate, the flexible substrate may have a structure having an undercoat layer containing a polymer on the surface thereof. By forming the detecting portion and the lead-out wiring portion on the undercoat layer, the adhesion between the detecting portion and the lead-out wiring portion is further improved.

The method of forming the primer layer is not particularly limited, and examples thereof include a method of applying a composition for forming a primer layer containing a polymer onto a flexible substrate and, if necessary, performing heat treatment. The composition for forming an undercoat layer may contain a solvent as needed. The type of the solvent is not particularly limited, and known solvents can be exemplified. As the composition for forming an undercoat layer containing a polymer, a latex containing fine polymer particles can be used.

The thickness of the undercoat layer is not particularly limited, but is preferably 0.02 to 0.3 μm, more preferably 0.03 to 0.2 μm, from the viewpoint of more excellent adhesion between the detection section and the extraction wiring section.

< detection part, wiring extraction part >

The line width of the thin metal wire constituting the detection section and the extraction wiring section is not particularly limited, but the upper limit is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, particularly preferably 9 μm or less, most preferably 7 μm or less, and the lower limit is preferably 0.5 μm or more, more preferably 1.0 μm or more. When the amount is within the above range, an electrode having a low resistance can be formed relatively easily.

When the thin metal wire is used as a lead-out wire of the lead-out wiring portion, the thin metal wire preferably has a line width of 500 μm or less, more preferably 50 μm or less, and still more preferably 30 μm or less. Within the above range, the touch panel electrode having a low resistance can be formed relatively easily.

The thickness of the thin metal wire is not particularly limited, but is preferably 0.01 to 200. mu.m, more preferably 30 μm or less, further preferably 20 μm or less, particularly preferably 0.01 to 9 μm, and most preferably 0.05 to 5 μm. When the amount is within the above range, an electrode having low resistance and excellent durability can be formed relatively easily.

Examples of the material of the fine metal wire include metals and alloys such as gold (Au), silver (Ag), molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), and tungsten (W). Among them, silver is preferable because of its excellent conductivity.

From the viewpoint of adhesion between the thin metal wire and the flexible base material, the thin metal wire preferably contains a binder.

The adhesive is preferably a resin because the adhesion between the thin metal wire and the flexible base material is more excellent, and more specifically, it includes at least one resin selected from the group consisting of (meth) acrylic resins, styrene resins, vinyl resins, polyolefin resins, polyester resins, polyurethane resins, polyamide resins, polycarbonate resins, polydiene resins, epoxy resins, silicone resins, cellulose polymers, and chitosan polymers, or a copolymer composed of monomers constituting these resins.

The thin metal wire including the binder will be described in detail later.

The method for producing the thin metal wire is not particularly limited, and a known method can be used. For example, a method of forming a resist pattern by exposing and developing a photoresist film formed on a metal foil on the surface of a flexible substrate, and etching the metal foil exposed from the resist pattern is given. Further, there is a method of printing a paste containing metal fine particles or metal nanowires on both main surfaces of a flexible base material and metal plating the paste. Further, there is a method in which a patterned groove structure is formed in advance on the surface of a flexible base material, and a paste containing metal fine particles or metal nanowires is embedded in the groove by screen printing. Further, there is a method of forming a fine metal wire by pattern printing with an ink containing fine metal particles or metal nanowires on the surface of a flexible base material by an ink jet system.

In addition to the above-mentioned methods, a method using silver halide is also exemplified. More specifically, the method described in paragraphs 0056 to 0114 of Japanese patent application laid-open No. 2014-209332 is included. The method of using silver halide will be described in detail later.

A preferred embodiment of the detection unit includes a mesh pattern formed of fine silver wires, and preferably, the 1 st detection electrode is disposed on the front surface of the flexible base material and the 2 nd detection electrode is disposed on the rear surface thereof.

[ other examples of thin metal wires ]

The 1 st and 2

nd detection electrodes

30 and 32 of the detection unit 20 and the lead line 23 of the extraction wiring unit 22 are not limited to being constituted by a thin metal wire, and may be constituted by a conductive wire containing a binder and a metal portion dispersed in the binder.

In the conductive wire, the adhesive contains a1 st polymer and a 2 nd polymer having a lower glass transition temperature than the 1 st polymer. In the present specification, the glass transition temperature of a polymer means the glass transition temperature measured by a Differential Scanning Calorimetry (DSC) method. The glass transition temperature was measured by the "method for measuring the transition temperature of plastic" specified in JIS K7121 (2012).

Examples of the 1 st polymer and the 2 nd polymer include a hydrophobic polymer (hydrophobic resin), and more specifically include at least one resin selected from the group consisting of an acrylic resin, a styrene resin, a vinyl resin, a polyolefin resin, a polyester resin, a polyurethane resin, a polyamide resin, a polycarbonate resin, a polydiene resin, an epoxy resin, a silicone resin, a cellulose polymer, and a chitosan polymer, and a copolymer composed of monomers constituting these resins.

The polymer preferably contains a reactive group that reacts with a crosslinking agent described later.

The polymer preferably has at least 1 unit selected from the group consisting of the following formulas A, B, C and D.

Among them, the 1 st polymer is preferably a polymer composed of 1 unit selected from the group consisting of A, B, C and D, more preferably a polymer composed of at least 1 unit selected from the group consisting of B, C and D, and still more preferably a polymer composed of a unit represented by formula D, from the viewpoint of easily controlling the glass transition temperature to be low.

[ chemical formula 1]

R¹Represents a methyl group or a halogen atom, preferably a methyl group, a chlorine atom or a bromine atom. p represents an integer of 0 to 2, preferably 0 or 1, more preferably 0.

R²Represents a methyl or ethyl group, preferably a methyl group.

R³Represents a hydrogen atom or a methyl group, preferably a hydrogen atom. L represents a 2-valent linking group, preferably a group represented by the following general formula (2).

General formula (2): - (CO-X)¹)r-X²-in the formula X¹Represents an oxygen atom or-NR³⁰-. Wherein R is³⁰Represents a hydrogen atom, an alkyl group, an aryl group or an acyl group, and may have a substituent (e.g., a halogen atom, a nitro group, a hydroxyl group, etc.))。R³⁰Preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms (e.g., methyl, ethyl, n-butyl, n-octyl, etc.), an acyl group (e.g., acetyl, benzoyl, etc.). As X¹Particularly preferably an oxygen atom or NH-.

X²Represents an alkylene group, an arylene group, an alkylenearylene group, an arylenealkylene group or an alkylenearylenealkylene group, and may have inserted-O-, -S-, -OCO-, -CO-, -COO-, -NH-, -SO-, -C-O-or an alkylenearylene-alkylene group₂-、-N(R³¹)-、-N(R³¹)SO₂-and the like. Wherein R is³¹Represents a linear or branched alkyl group having 1 to 6 carbon atoms, and includes methyl, ethyl, isopropyl and the like. As X²Preferable examples of (3) include dimethylene, trimethylene, tetramethylene, o-phenylene, m-phenylene, p-phenylene and-CH₂CH₂OCOCH₂CH₂-and-CH₂CH₂OCO(C₆H₄) -and the like.

r represents 0 or 1.

q represents 0 or 1, preferably 0.

R⁴Represents an alkyl group, an alkenyl group or an alkynyl group having 1 to 80 carbon atoms, and the 1 st polymer is preferably an alkyl group having 1 to 5 carbon atoms, and the 2 nd polymer is preferably an alkyl group having 5 to 50 carbon atoms, more preferably an alkyl group having 5 to 30 carbon atoms, and further preferably an alkyl group having 5 to 20 carbon atoms.

R⁵Represents a hydrogen atom, a methyl group, an ethyl group, a halogen atom or-CH₂COOR⁶Preferably a hydrogen atom, a methyl group, a halogen atom or-CH₂COOR⁶Further, a hydrogen atom, a methyl group or-CH is preferable₂COOR⁶Particularly preferred is a hydrogen atom.

R⁶Represents a hydrogen atom or an alkyl group having 1 to 80 carbon atoms, and may be reacted with R⁴Identical or different, R⁶The number of carbon atoms of (A) is preferably 1 to 70, more preferably 1 to 60.

As another preferable embodiment of the 1 st polymer and the 2 nd polymer, a polymer (copolymer) represented by the following general formula (1) can be mentioned from the viewpoint of further preventing moisture permeation.

General formula (1): - (A) x- (B) y- (C) z- (D) w-and in the general formula (1), A, B, C and D each represent the above-mentioned repeating unit as described above.

In the general formula (1), x, y, z and w represent the molar ratio of each repeating unit.

X is 3 to 60 mol%, preferably 3 to 50 mol%, and more preferably 3 to 40 mol%.

Y is 30 to 96 mol%, preferably 35 to 95 mol%, and more preferably 40 to 90 mol%.

Z is 0.5 to 25 mol%, preferably 0.5 to 20 mol%, and more preferably 1 to 20 mol%.

W is 0.5 to 40 mol%, preferably 0.5 to 30 mol%.

In the general formula (1), it is particularly preferable that x is 3 to 40 mol%, y is 40 to 90 mol%, z is 0.5 to 20 mol%, and w is 0.5 to 10 mol%.

As the polymer represented by the general formula (1), polymers represented by the following general formulae (2) and (3) are preferable.

[ chemical formula 2]

In the general formula (2), x, y, z and w are as defined above.

[ chemical formula 3]

General formula (3)

In the above formulae, a1, b1, c1, d1 and e1 represent molar ratios of the respective monomer units, a1 represents 3 to 60 (mol%), b1 represents 30 to 95 (mol%), c1 represents 0.5 to 25 (mol%), d1 represents 0.5 to 40 (mol%), and e1 represents 1 to 10 (mol%).

The preferred ranges of a1 and b1 are the same as those of y, c1 and d1 are the same as those of z, and x is the same as that of w.

e1 is 1 to 10 mol%, preferably 2 to 9 mol%, and more preferably 2 to 8 mol%.

The weight average molecular weight of the polymer represented by the general formula (1) is preferably 1000 to 100 ten thousand, more preferably 2000 to 75 ten thousand, and further preferably 3000 to 50 ten thousand.

The polymer represented by the general formula (1) can be synthesized, for example, by referring to japanese patent No. 3305459 and japanese patent No. 3754745.

The glass transition temperatures of the 1 st polymer and the 2 nd polymer are not particularly limited, but the glass transition temperature of the 1 st polymer is preferably 0 ℃ or higher, more preferably 25 ℃ or higher, and further preferably more than 40 ℃. The upper limit is not particularly limited, but is preferably 120 ℃ or lower in general.

The glass transition temperature of the 2 nd polymer is not particularly limited, but is preferably 40 ℃ or lower, more preferably 25 ℃ or lower, further preferably lower than 25 ℃, particularly preferably 0 ℃ or lower, and most preferably lower than 0 ℃. The lower limit is not particularly limited, but is preferably-50 ℃ or higher.

The difference (absolute value) between the glass transition temperature of the 1 st polymer and the glass transition temperature of the 2 nd polymer is not particularly limited, but is preferably 20 to 100 ℃.

The metal portion in the conductive wire is a portion that secures the conductive characteristics of the conductive wire, and the metal portion is made of metal. The metal constituting the metal portion is preferably at least 1 metal selected from the group consisting of gold (metallic gold), silver (metallic silver), copper (metallic copper), nickel (metallic nickel), and palladium (metallic palladium), from the viewpoint of more excellent electrical conductivity.

In addition, fig. 11 is an enlarged view of the conductive line 50. Fig. 11 shows a form in which metal portion 54 is dispersed in conductive line 50 in a particulate form, and the form of metal portion 54 is not limited to a particulate form, and may be a form in which metal portion 54 is dispersed in conductive line 50 in a layer form (not shown).

The conductive wire 50 shown in fig. 11 includes a binder 52 containing a1 st polymer and a 2 nd polymer, and a plurality of metal portions 54 dispersed in the binder 52. As described above, the metal portion 54 is in a particle shape.

The conductive wire may contain materials other than those described above. Examples of the other materials include non-metal fine particles. Examples of the non-metal fine particles include resin particles and metal oxide particles, and metal oxide particles are preferable.

Examples of the metal oxide particles include silicon oxide particles and titanium oxide particles.

The average particle diameter of the non-metallic fine particles is not particularly limited, but is preferably 1 to 1000nm, more preferably 10 to 500nm, and still more preferably 20 to 200nm in terms of a spherical equivalent diameter. Within the above range, the detection portion tends to have more excellent transparency and more excellent conductivity.

The spherical equivalent diameter of the non-metallic fine particles is a value obtained by calculating arbitrary 50 spherical equivalent diameters by a transmission electron microscope and arithmetically averaging these diameters.

< Metal stabilizer >

For the purpose of stabilizing the metal part, the conductive wire preferably has a metal stabilizer on the surface or inside of the metal part or in the binder. As the metal stabilizer, the following materials can be used alone or in combination.

Preservatives described in paragraphs 0075 to 0086 of Japanese patent application laid-open No. 2009-505358.

The metal ion-capturing agent described in paragraphs 0077 to 0092 of Japanese patent laid-open publication No. 2009-188360.

Nitrogen-containing heterocyclic compounds having a mercapto group as described in paragraphs 0044 to 0047 of Japanese patent laid-open publication No. 2012-146548.

Compositions for forming a silver ion diffusion-inhibiting layer, which are described in paragraphs 0018 to 0049 of Japanese patent application laid-open No. 2013-224397.

Compounds for forming a silver ion diffusion suppression layer described in paragraphs 0030 to 0066 of Japanese patent application laid-open No. 2014-075115.

Anti-rust agents described in paragraphs 0050 to 0057 of Japanese patent application laid-open No. 2018-024784.

Mercaptobenzothiazoles described in paragraphs 0050 to 0057 of Japanese patent application laid-open No. 2019 and 016488.

As the metal stabilizer, a specific compound described later can be preferably used.

As the metal stabilizer, the following compounds or salts thereof are preferred.

2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 5-mercapto-1-phenyl-1H-tetrazole, 1- (4-carboxyphenyl) -5-mercapto-1H-tetrazole, 3-mercapto-1, 2, 4-triazole, sodium 1- (m-sulfophenyl) -5-mercapto-1H-tetrazole, 2-mercaptobenzoxazole, 1,2, 3-benzotriazole, 1- (3-acetamidophenyl) -5-mercaptotetrazole, 5-amino-2-mercaptobenzimidazole, 6-amino-2-mercaptobenzothiazole, thiocyanuric acid, 6- (dibutylamino) -1,3, 5-triazine-2, 4-dithiol, 2-mercaptothiazoline, diethylammonium diethyldithiocarbamate, (2-benzothiazolylthio) acetic acid, 3- (2-benzothiazolylthio) propionic acid, 6- (dibutylamino) -1,3, 5-triazine-2, 4-dithiol, 2-amino-5-mercapto-1, 3, 4-thiadiazole, 2-mercapto-5-methylthio-1, 3, 4-thiadiazole, 2-mercapto-5-ethylthio-1, 3, 4-thiadiazole, 2-5-dimercapto-1, 3, 4-thiadiazole, 2-thioacetic acid-5-mercapto-1, 3, 4-thiadiazole, 2-aminopyrimidine, diethyl-thiobenzoate, diethyl-2-benzothiazolylthio-acetic acid, diethyl-2-amino-5-mercapto-1, 3, 4-thiadiazole, and mixtures thereof, 5, 6-dimethylbenzimidazole and 2-mercaptopyrimidine.

Among these, the metal stabilizer is most preferable because a compound selected from compounds having a mercaptothiazole skeleton or a mercaptothiadiazole skeleton and salts thereof is particularly effective for improving the vulcanization resistance. Specific examples of the most preferable compounds include 2-mercaptobenzothiazole, 5-methyl-2-mercaptobenzothiazole, 2-amino-5-mercapto-1, 3, 4-thiadiazole, 2-mercapto-5-methylthio-1, 3, 4-thiadiazole, 2-mercapto-5-ethylthio-1, 3, 4-thiadiazole, 2-5-dimercapto-1, 3, 4-thiadiazole, and derivatives or salts thereof.

The introduction of the metal stabilizer is preferable because it is useful for improving the durability of the metal material in the bent portion and the non-bent portion, and particularly effective for suppressing migration and sulfidation when silver is used in the metal portion. As a method for introducing the metal stabilizer, a method of bringing the conductive film into contact with a solution containing the metal stabilizer by coating or dipping during or after the formation of the conductive line, a method of depositing the metal stabilizer on the conductive film by vapor phase reaction by means of a Lavender or the like, or the like can be preferably used. Further, a metal stabilizer is also preferably contained in the transparent insulating layer. In particular, the inclusion of the metal stabilizer in the transparent insulating layer in advance is preferable because a solvent for dissolving the metal stabilizer is not required to be in contact with the conductive wire, and damage to the conductive wire or the adhesive due to the solvent can be avoided. Therefore, at least one of the 1 st transparent insulating layer and the 2 nd transparent insulating layer preferably contains a metal stabilizer.

In addition, the input area E of the detection unit 20 as the touch panel 10₁The resistance change in the active region of (2) with the passage of time may also occur in a touch panel having a structure without a bent portion. However, even in the touch panel having the structure without the bent portion, the touch panel can suppress the resistance change by including the metal stabilizer in at least one of the 1 st transparent insulating layer and the 2 nd transparent insulating layer.

The amount of the metal stabilizer used is not limited, and is preferably 1mg/m per 1 conductive layer in at least one of the transparent insulating layer and the conductive film²～10g/m²More preferably 10mg/m²～1g/m²Within the range of (a).

The shape of the conductive line is not particularly limited, and is preferably a linear shape (straight line, curved line, combination of these, or the like) so that more excellent touch position detection performance can be obtained when the conductive line is applied to a touch panel. In this case, the line width of the conductive line is not particularly limited, but is preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm or less, particularly preferably 5 μm or less, most preferably 4 μm or less, preferably 0.5 μm or more, and more preferably 1.0 μm or more, from the viewpoint of the balance between the conductive characteristics of the conductive line and the difficulty of visual recognition.

The thickness of the conductive wire is not particularly limited, but is preferably 200 μm or less, more preferably 30 μm or less, further preferably 10 μm or less, particularly preferably 0.3 to 5 μm, and most preferably 0.5 to 5 μm, from the viewpoint of balance between thinning and conductive characteristics.

< method for manufacturing detection part >

The method for manufacturing the detection section will be described by taking, as an example, a case where the metal portion of the conductive wire contains silver (metallic silver). From the viewpoint of obtaining more excellent productivity, a method having the following steps is preferred.

Step a:

and a step of simultaneously applying a silver halide-containing coating solution containing at least silver halide and a1 st polymer and a component adjustment coating solution containing at least a 2 nd polymer to the flexible base material in a plurality of layers to form a silver halide photosensitive layer.

Step B:

and a step of forming a conductive line containing metallic silver by exposing the silver halide photosensitive layer and then performing a development treatment.

Hereinafter, each step will be described in detail.

< Process A >

The step a is a step of simultaneously applying a silver halide-containing coating solution containing at least silver halide and a1 st polymer and a component adjustment coating solution containing at least a 2 nd polymer to a flexible base material in a plurality of layers to form a silver halide photosensitive layer.

The order of stacking the coating liquids in the case of simultaneous multi-layer coating is not particularly limited. The silver halide-containing coating liquid and the component adjustment coating liquid may be stacked in this order from the flexible base material side. The coating liquid for preparing the composition and the coating liquid for preparing the silver halide may be laminated in this order from the flexible base material side. The component adjustment coating liquid, the silver halide-containing coating liquid, and the component adjustment coating liquid may be sequentially stacked.

In addition, "coated on a flexible substrate" also includes a case where the coating is directly applied on the surface of the flexible substrate and a case where another layer is disposed on the flexible substrate and coated on the layer.

In this step, since the silver halide-containing coating liquid containing silver halide and the component adjustment coating liquid not containing silver halide are simultaneously applied in multiple layers, component diffusion proceeds on the interface of the 2-layer coating film formed from the two coating liquids. More specifically, a part of the silver halide and the 1 st polymer diffuses from the coating film (hereinafter, also referred to as coating film a) formed from the silver halide-containing coating liquid disposed on the flexible base material into the coating film (hereinafter, also referred to as coating film B) formed from the composition-adjusting coating liquid. As a result, the coating film B contains silver halide and the 1 st polymer in the region on the coating film a side, and the content thereof is less than the content of the silver halide and the 1 st polymer in the coating film a.

Since the region on the coating film a side of the coating film B (hereinafter also referred to as "region w") contains silver halide that migrates from the coating film a, the region w becomes an upper region in forming the conductive line after the process B described later. In this case, in the conductive line, the content of the 2 nd polymer relative to the total amount of the content of the 1 st polymer and the content of the 2 nd polymer in the region w tends to be larger than that in the intermediate region.

The silver halide-containing coating liquid may contain at least a silver halide and a1 st polymer, and may further contain a 2 nd polymer. In this case, the content mass ratio of the content of the 2 nd polymer to the total amount of the content of the 1 st polymer and the content of the 2 nd polymer in the silver halide-containing coating liquid is preferably smaller than the content mass ratio of the 2 nd polymer to the content of the 1 st polymer and the content of the 2 nd polymer in the component adjustment coating liquid.

The composition adjusting coating liquid may contain at least the 2 nd polymer, and may further contain a silver halide and/or the 1 st polymer. When the component adjustment coating liquid further contains silver halide, the content thereof is not particularly limited, and the content of silver halide in the component adjustment coating liquid is preferably smaller than the content of silver halide in the silver halide-containing coating liquid. By doing so, a detection unit with less external light reflection can be easily obtained.

When the composition-adjusting coating liquid further contains the 1 st polymer, the content mass ratio of the content of the 1 st polymer to the total amount of the content of the 1 st polymer and the content of the 2 nd polymer in the composition-adjusting coating liquid is preferably smaller than the content mass ratio of the 1 st polymer to the content of the 1 st polymer and the content of the 2 nd polymer in the silver halide-containing coating liquid.

The silver halide contained in the silver halide-containing coating liquid is not particularly limited, and known silver halide can be used. The halogen element contained in the silver halide may be any of chlorine, bromine, iodine, and fluorine, or a combination thereof. For example, silver halide mainly composed of silver chloride, silver bromide, or silver iodide can be preferably used, and silver halide mainly composed of silver bromide or silver chloride can be more preferably used. Silver chlorobromide, silver iodochlorobromide or silver iodobromide may also be preferably used. More preferably, silver chlorobromide, silver bromide, silver iodochlorobromide or silver iodobromide, and most preferably, silver chlorobromide or silver iodochlorobromide containing 50 mol% or more of silver chloride is used.

Here, "silver halide mainly containing silver bromide" means silver halide in which the molar fraction of bromide ions in the silver halide composition is 50% or more. The silver halide particles mainly composed of silver bromide may contain iodide ions and chloride ions in addition to bromide ions.

The silver halide is in the form of solid particles, and the average particle size of the silver halide is preferably 0.1 to 1000nm (1 μm), more preferably 0.1 to 300nm, and still more preferably 1 to 200nm in terms of a spherical equivalent diameter.

In addition, the spherical equivalent diameter of the silver halide particle is the diameter of a particle having the same volume in which the particle shape is spherical.

The shape of the silver halide particles is not particularly limited, and may be, for example, spherical, cubic, flat (hexagonal flat, triangular flat, quadrangular flat, etc.), octahedral, decatetrahedral, or other various shapes.

Further, as for the use of a metal compound belonging to group VIII or VIIB, such as a rhodium compound or an iridium compound, or a palladium compound for stabilizing or sensitizing silver halide, the description in paragraphs 0039 to 0042 of jp 2009-188360 a can be referred to. Further, chemical sensitization can be described in section 0043 of japanese patent application laid-open No. 2009-188360.

The forms of the 1 st polymer included in the silver halide-containing coating liquid and sometimes included in the component adjustment coating liquid and the 2 nd polymer included in the component adjustment coating liquid and sometimes included in the silver halide-containing coating liquid are as described above, and therefore, the description thereof is omitted.

As described below, the silver halide-containing coating liquid and the component adjustment coating liquid may contain components other than silver halide, the 1 st polymer and the 2 nd polymer, and these components are commonly used in the silver halide-containing coating liquid and the component adjustment coating liquid.

The silver halide-containing coating liquid and the component adjustment coating liquid may further contain gelatin.

The type of gelatin is not particularly limited, and for example, acid-treated gelatin, hydrolysates of gelatin, enzymatic hydrolysates of gelatin, and amino-or carboxyl-modified gelatin (phthalated gelatin, acetylated gelatin) may be used in addition to lime-treated gelatin.

The silver halide-containing coating liquid and the component adjustment coating liquid may further contain a solvent. Examples of the solvent to be used include water, organic solvents (e.g., alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, esters such as ethyl acetate, and ethers), ionic liquids, and mixed solvents thereof.

If necessary, other materials than the above-described materials may be contained in the silver halide-containing coating liquid and the component adjustment coating liquid. For example, it is preferable to contain a crosslinking agent for crosslinking the 1 st polymer and the 2 nd polymer. The inclusion of the crosslinking agent promotes crosslinking between the polymers, and even when gelatin is decomposed and removed in a later-described process, the connection between the metallic silver is maintained, and as a result, the conductive properties are more excellent.

The method for simultaneously applying the silver halide-containing coating liquid and the component adjustment coating liquid in a plurality of layers is not particularly limited, and a known method can be used, and for example, a die coating method is preferably used. The die coating method includes a slot coating method, an extrusion coating method, and a curtain coating method, and preferably includes a slot coating method or an extrusion coating method, and most preferably includes an extrusion coating method having high suitability for thin layer coating.

In addition, in the case of performing the multilayer simultaneous coating, it is preferable to adjust the coating liquid using a component containing the 2 nd polymer having a composition such that the dry thickness of the film (surface film) formed when the coating is performed on a predetermined substrate becomes 300nm or more, from the viewpoint of easily obtaining the embodiment of embodiment 1 of the conductive film for a touch panel.

After the simultaneous coating of a plurality of layers, the obtained coating film may be dried as necessary. By performing the drying treatment, the solvent contained in the coating film obtained by the silver halide-containing coating liquid and the coating film obtained by the composition-adjusting coating liquid can be easily removed.

By the above treatment, a photosensitive layer containing silver halide can be formed on the flexible substrate. In the present specification, the "silver halide-containing photosensitive layer" may be referred to as a "silver halide photosensitive layer" or simply as a "photosensitive layer".

< Process B >

The step B is a step of exposing the silver halide photosensitive layer and then performing a development treatment to form a conductive line containing metallic silver.

Through this step, silver halide is reduced to form a conductive wire containing metallic silver. In addition, usually, exposure treatment is performed in a pattern form, and a conductive line containing metallic silver is formed in an exposed portion. On the other hand, in the unexposed portion, silver halide is eluted by a developing treatment described later. Forming a non-conductive wire comprising the gelatin and the polymer. The non-conductive wire does not substantially contain metallic silver, and the non-conductive wire means a region not exhibiting conductivity.

The exposure process and the development process performed in this step will be described in detail below.

The exposure treatment is a treatment of exposing the photosensitive layer. By pattern-wise exposing the photosensitive layer, a latent image is formed from silver halide in the photosensitive layer in the exposed region. In the region where the latent image is formed, a conductive line is formed by a developing process described later. On the other hand, in the unexposed area where exposure was not performed, silver halide was dissolved and flowed out from the photosensitive layer at the time of development treatment described later, whereby a transparent film (non-conductive wire) was obtained.

The light source used for exposure is not particularly limited, and examples thereof include light such as visible light and ultraviolet light, and radiation such as X-ray.

The method of performing pattern exposure is not particularly limited, and may be performed by surface exposure using a photomask, or may be performed by scanning exposure using a laser beam, for example. The shape of the pattern is not particularly limited, and may be appropriately adjusted according to the pattern of the conductive line to be formed.

The method of the development treatment is not particularly limited, and, for example, a general development treatment technique used for silver salt films, photographic papers, films for plate making, and emulsion masks for photomasks can be used.

The type of the developer used in the development treatment is not particularly limited, and for example, a PQ (phenadone hydroquinone) developer, an MQ (Metol hydroquinone) developer, an MAA (Metol ascorbic acid) developer, and the like can be used.

The development treatment can include a fixing treatment for the purpose of removing the silver salt at the unexposed portion for stabilization. The fixing treatment can use a fixing treatment technique used for silver salt films, photographic papers, films for plate making, emulsion masks for photomasks, and the like.

The fixing temperature in the fixing step is preferably about 20 to about 50 ℃, and more preferably 25 to 45 ℃. The fixing time is preferably 5 seconds to 1 minute, and more preferably 7 seconds to 50 seconds.

The photosensitive layer subjected to the development and fixing treatment is preferably subjected to a water washing treatment and a stabilization treatment.

The method may further include steps other than the above-described step a and step B.

Examples of other steps include:

a step F of fusing the metallic silver of the conductive wires to each other after the step B;

a step C1 of bringing the silver halide photosensitive layer into contact with a compound having a metal-adsorptive substituent or a metal-adsorptive structure (hereinafter, also referred to as "specific compound") after the step a and before the step B;

a step C2 of bringing the conductive wire into contact with the specific compound after the step B and before the step F;

a step D of further consolidating the conductive wire after the step B and before the step F;

a step (E) for removing the gelatin in the conductive wire after the step (B) and before the step (D) when at least 1 selected from the group consisting of the silver halide-containing coating liquid and the composition adjusting coating liquid contains gelatin; and the like. In addition, as another step, a step of forming an easy adhesion layer described later may be mentioned. The following describes other steps.

(Process F)

Step F is a step of fusing metallic silver of the conductive wires (contained in the conductive wires) to each other after step B. In this step, the metallic silver is welded to each other, and as a result, a detection unit having a conductive wire (having more excellent conductivity) can be obtained.

The heating method is not particularly limited, and may be a treatment in which a flexible substrate having a conductive wire is brought into contact with superheated steam.

The superheated steam is not particularly limited, and may be superheated steam or a mixture of superheated steam and another gas.

Preferably, the conductive wire is contacted with the superheated steam within a supply time of 10 to 300 seconds. When the supply time is 10 seconds or more, the conductivity is greatly improved. Further, a conductivity of 300 seconds or less is more preferable from the viewpoint of economy, because the conductivity is sufficiently improved.

The amount of the feed is preferably 500 to 600g/m³The temperature of the superheated steam is preferably controlled to 100 to 160 ℃ under 1 atm.

Other methods of the heat treatment include heat treatment at 80 to 150 ℃.

The heating time is not particularly limited, but is preferably 0.1 to 5.0 hours, more preferably 0.5 to 1.0 hour, from the viewpoint of further improving the above effects.

(Process C1)

The step C1 is a step of bringing the silver halide photosensitive layer into contact with the specific compound, which is performed after the step a and before the step B. By this step, the metallic silver generated in the subsequent step B is less likely to be welded to each other. In this step, since the specific compound is brought into contact with the silver halide photosensitive layer, the metallic silver is not easily welded to each other in a region (interface region) closer to the surface of the silver halide photosensitive layer. Therefore, in the conductive wire obtained by the subsequent step, in particular, the fusion bonding of the metallic silver to each other in the interface region is more easily hindered. In this case, it is considered that the metallic silver is sufficiently fused to each other in the intermediate region of the conductive wire, and the detection portion having excellent conductivity can be obtained.

The method of manufacturing the detecting unit preferably includes step C1 or step C2 described later, and may include steps C1 and C2.

The method of bringing the specific compound into contact with the silver halide photosensitive layer is not particularly limited, and a method of bringing a solution in which the specific compound is dissolved and/or dispersed into contact with the silver halide photosensitive layer is generally exemplified. Further, a method of bringing a gas containing a specific compound into contact with the silver halide photosensitive layer may be used.

The method of bringing the solution containing the specific compound into contact with the silver halide photosensitive layer is not particularly limited, and a method of immersing the silver halide photosensitive layer in the solution, a method of applying the solution to the silver halide photosensitive layer, and the like are exemplified, and a method of immersing the silver halide photosensitive layer in the solution is more preferable. The method of immersing the silver halide photosensitive layer in the solution can be performed more stably with a simpler apparatus, and the excess solution can be removed more easily by cleaning after the immersion, which is preferable.

The method of bringing the silver halide photosensitive layer into contact with a gas and/or a solution containing a compound having a metal-adsorbing site is also characterized in that: on the surface of the silver halide photosensitive layer, metallic silver is easily adsorbed by the compound. This makes it easier to prevent the metallic silver from being fused to each other on the surface of the conductive wire.

The specific compound is a compound having a metal-adsorbing substituent or a metal-adsorbing structure (hereinafter, these are also collectively referred to as "metal-adsorbing site").

The metal-adsorptive substituent is not particularly limited, and preferably at least 1 kind selected from the group consisting of a carboxyl group or a salt thereof, a nicotinamide group, an amino group, an imidazole group, a pyrazole group, a thiol group, a thioether group, and a disulfide group.

The metal-adsorbing structure is not particularly limited, but is preferably a nitrogen-containing heterocycle, more preferably a 5-or 6-membered ring azole, and still more preferably a 5-membered ring azole.

Examples of the nitrogen-containing heterocycle include a tetrazole ring, a triazole ring, an imidazole ring, a thiadiazole ring, an oxadiazole ring, a selenobizole ring, an oxazole ring, a thiazole ring, a benzoxazole ring, a benzothiazole ring, a benzimidazole ring, a pyrimidine ring, a triazabine ring, a tetraazaindene ring, a benzoidazole ring, a benzotriazole ring, a benzoxazole ring, a benzothiazole ring, a pyridine ring, a quinoline ring, a piperidine ring, a piperazine ring, a quinoxaline ring, a morpholine ring, and a pentaazaindene ring.

These rings may have a substituent, and examples of the substituent include a nitro group, a halogen atom (e.g., a chlorine atom and a bromine atom), a cyano group, a substituted or unsubstituted alkyl group (e.g., each of methyl, ethyl, propyl, tert-butyl, and cyanoethyl groups), an aryl group (e.g., each of phenyl, 4-methanesulfonamidophenyl, 4-methylphenyl, 3, 4-dichlorophenyl, and naphthyl groups), an alkenyl group (e.g., an allyl group), an aralkyl group (e.g., each of benzyl, 4-methylbenzyl, and phenethyl groups), a sulfonyl group (e.g., each of methanesulfonyl, ethanesulfonyl, and p-toluenesulfonyl groups), a carbamoyl group (e.g., each of unsubstituted carbamoyl, methylcarbamoyl, and phenylcarbamoyl groups), a sulfamoyl group (e.g., each of unsubstituted sulfamoyl, methylsulfamoyl, and phenylsulfamoyl groups), and a salt thereof, A carboxamide group (e.g., each of an acetamide group and a benzamido group), a sulfonamide group (e.g., each of a methanesulfonamide group, a benzenesulfonamide group, and a p-toluenesulfonamide group), an acyloxy group (e.g., each of an acetoxy group and a benzoyloxy group), a sulfonyloxy group (e.g., a methanesulfonyloxy group), a ureido group (e.g., each of an unsubstituted ureido group, a methylureido group, an ethylureido group, and a phenylureido group), an acyl group (e.g., each of an acetyl group and a benzoyl group), an oxycarbonyl group (e.g., each of a methoxycarbonyl group and a phenoxycarbonyl group), a hydroxyl group, and the like. The substituent may be substituted plural on 1 ring.

The compound is preferably a compound having a nitrogen-containing 6-membered ring (nitrogen-containing 6-membered ring compound), and the nitrogen-containing 6-membered ring compound is preferably a compound having a triazine ring, a pyrimidine ring, a pyridine ring, a pyrroline ring, a piperidine ring, a pyridazine ring or a pyrazine ring, and more preferably a compound having a triazine ring or a pyrimidine ring. These nitrogen-containing 6-membered ring compounds may have a substituent, and examples of the substituent include an alkyl group having 1 to 6 (preferably 1 to 3) carbon atoms, an alkoxy group having 1 to 6 (preferably 1 to 3) carbon atoms, a hydroxyl group, a carboxyl group, a mercapto group, an alkoxyalkyl group having 1 to 6 (preferably 1 to 3) carbon atoms, and a hydroxyalkyl group having 1 to 6 (preferably 1 to 3) carbon atoms.

Specific examples of the nitrogen-containing 6-membered ring compound include triazine, methyltriazine, dimethyltriazine, hydroxyethyltriazine, pyrimidine, 4-methylpyrimidine, pyridine and pyrroline.

The compound can have 1 kind of metal adsorption sites, but also can have more than 2, the compounds preferably have more than 2 kinds of metal adsorption sites.

(Process C2)

The step C2 is a step of bringing the conductive wire into contact with the specific compound, which is performed after the step B and before the step F. By this step, the metallic silver of the conductive wire (contained in the conductive wire) is less likely to be welded to each other. In this step, since the specific compound is brought into contact with the conductive wire, the metallic silver is not easily fused to each other in a region (interface region) closer to the surface of the conductive wire. Therefore, in the interface region of the conductive wires, the fusion of the metallic silver to each other is more easily hindered. In this case, it is considered that the metallic silver is sufficiently fused to each other in the intermediate region of the conductive wire, and the detection portion having excellent conductivity can be obtained.

In this step, the method of bringing the conductive wire into contact with the specific compound, the form of the specific compound, and the like are the same as those in the step C1 described above, and therefore, the description thereof is omitted.

(Process D)

Step D is a step of consolidating the conductive wire after step B and before step F. By this step, the conductivity of the conductive wire is further improved, and the adhesion of the conductive wire to the flexible base material is more easily improved.

The method for fixing the conductive thread is not particularly limited, and for example, it is preferable to pass the flexible base material having the conductive thread through a rolling process between at least one pair of rollers under pressure. Hereinafter, the consolidation treatment using the calender roll is referred to as a calendering treatment.

Examples of the rolls used for the rolling treatment include plastic rolls and metal rolls. From the viewpoint of preventing wrinkles, a plastic roller is preferable. The pressure between the rolls is not particularly limited. The pressure between the rolls can be measured using pressure measurement film "Prescale" (for high pressure) manufactured by Fujifilm Corporation.

The surface roughness Ra of the roll for the rolling treatment is preferably 0 to 2.0. mu.m, more preferably 0.3 to 1.0. mu.m, from the viewpoint that the obtained conductive wire is less visible.

The temperature of the consolidation treatment is not particularly limited, but is preferably 10 ℃ (no temperature adjustment) to 100 ℃, and more preferably 10 ℃ (no temperature adjustment) to 50 ℃, although the density and shape of the objects and the type of the binder vary depending on the pattern of the conductive line.

(Process E)

When at least 1 selected from the group consisting of the silver halide-containing coating liquid and the composition adjusting coating liquid contains gelatin, the step E is a step of removing the gelatin of the conductive wire (contained in the conductive wire) after the step B and before the step D. By removing the gelatin, the content of metallic silver of the conductive wire is relatively increased as a result, and thus a conductive wire having more excellent conductivity can be obtained.

The step E may be a step of removing all or a part of the gelatin. In step E, gelatin may be removed from a portion (for example, a non-conductive wire) other than the conductive wire on the flexible substrate, in addition to the conductive wire.

The method for removing gelatin is not particularly limited, and examples thereof include a method of removing gelatin by decomposition with a protease and a method of removing gelatin by decomposition with a predetermined oxidizing agent.

Further, as a method for removing gelatin by decomposition with a protease, for example, the method described in paragraphs 0084 to 0077 of Japanese patent application laid-open No. 2014-209332 can be used.

Further, as a method for removing gelatin by decomposition with an oxidizing agent, for example, the method described in paragraphs 0064 to 0066 of jp 2014-112512 a can be employed.

(Process for Forming easily adhesive layer)

The easy adhesion layer forming step is a step of forming an easy adhesion layer (hereinafter, also referred to as "primer layer") on the flexible substrate before step a, and obtaining the flexible substrate with the easy adhesion layer (primer layer). The method for forming the undercoat layer on the flexible substrate is not particularly limited, and a method for applying the undercoat layer-forming composition on the flexible substrate may be mentioned. In the undercoat layer forming step, the formed undercoat layer is preferably adjusted so that the absolute value of the difference in refractive index between the formed undercoat layer and another adjacent layer (such as the flexible substrate and the non-conductive wire) is small. The method of adjusting the difference in refractive index between the undercoat layer and another adjacent layer is not particularly limited, and examples thereof include a method of adjusting the types of the respective components contained in the composition for forming each layer.

The method for forming the easy adhesion layer is not particularly limited, and a method in which the composition for forming the easy adhesion layer is applied to the flexible base material and, if necessary, subjected to heat treatment may be mentioned. The composition for forming an easy-adhesion layer may contain a solvent. The kind of the solvent is not particularly limited, and a solvent which may be contained as a silver halide-containing coating liquid or the like is already described.

The thickness of the easy-adhesion layer is not particularly limited, but is preferably 0.02 to 0.3 μm from the viewpoint of further improving the adhesion between the flexible substrate and the silver halide photosensitive layer and the conductive line.

The easy adhesion layer is not particularly limited, and for example, a preferable application example of the 1 st adhesion layer described in japanese patent application laid-open No. 2008-208310 can be preferably used.

< other manufacturing method of detecting part >

The method of manufacturing the thin metal wire constituting the detection section and the wiring section is not particularly limited to the above-described method, and for example, a plating method, a vapor deposition method, a printing method, or the like can be suitably used.

A method of forming a thin metal wire by the electroplating method will be described. For example, the thin metal wire can be formed of a metal plating film formed on the underlying layer by electroless plating on the electroless plating underlying layer. In this case, a metal plating film is formed by forming a catalyst ink containing at least fine metal particles in a pattern on a substrate and then immersing the substrate in an electroless plating bath. More specifically, the method for producing a metal-coated substrate described in japanese patent application laid-open No. 2014-159620 can be used. Further, the following may be formed: after a resin composition having at least a functional group capable of interacting with a metal catalyst precursor is formed in a pattern on a substrate, a catalyst or a catalyst precursor is applied, and the substrate is immersed in an electroless plating bath, thereby forming a metal plating film. More specifically, the method for producing a metal-coated substrate described in japanese patent application laid-open No. 2012-144761 can be applied.

A method for forming a thin metal wire by a vapor deposition method will be described. First, a copper foil layer is formed by vapor deposition, and a copper wiring is formed from the copper foil layer by photolithography, whereby a fine metal wire can be formed. As the copper foil layer, electrolytic copper foil can be used in addition to the vapor-deposited copper foil. More specifically, the step of forming copper wiring described in japanese patent application laid-open No. 2014-29614 can be used.

A method for forming a thin metal wire by a printing method will be described. First, a conductive paste containing a conductive powder is applied onto a substrate in the same pattern as the thin metal wire, and then a heat treatment is performed, whereby the thin metal wire can be formed. The pattern formation using the conductive paste is accomplished by, for example, an inkjet method or a screen printing method. More specifically, the conductive paste described in japanese patent application laid-open publication No. 2011-28985 can be used as the conductive paste.

< sealing layer >

The sealing layer is used to suppress vulcanization of the conductive layer of the conductive film. The sealing layer is not particularly limited as long as it is an electrically insulating material. For example, the sealing layer is formed of an adhesive layer having electrical insulation. As the adhesive layer, for example, an adhesive tape can be used.

Further, the sealing layer preferably has a gas permeability of sulfur gas (hydrogen sulfide gas) of 10 as measured by gas chromatography^-2g/m²Materials below one day. The lower limit of the air permeability is 0g/m²The day is. In the present invention, a GC-FPD (Gas chromatography-Flame Photometric Detector) method is used in the Gas chromatography.

The sealing layer is preferably made of polyimide tape, silicone, or Al₂O₃SiON or a urethane resin.

The thickness of the sealing layer is preferably 30nm or more and 200 μm or less. If the thickness of the sealing layer is 30nm or less, the effect of suppressing vulcanization described above is not easily obtained. On the other hand, if the thickness of the sealing layer exceeds 200 μm, the sealing layer becomes too thick, and therefore, a long time is required for forming the sealing layer, or the followability to the bent portion at the time of pasting is poor, or cracks may occur when the material of the sealing layer is brittle.

The method for forming the sealing layer is not particularly limited as long as the sealing layer can be formed on the entire surface of the bent portion, and a pasting method, a sputtering method, a vapor deposition method, a spray method, a coating method, a dropping method, and the like can be used. The bonding method is a method of forming a sealing layer by bonding an electrically insulating tape such as a polyimide tape.

< 1 st transparent insulating layer and 2 nd transparent insulating layer >

The first and second transparent insulating layers 1 and 2 are not limited to the Optical Clear Resin (OCR) such as the Optical Clear Adhesive (OCA) and the UV (ultraviolet) curable Resin.

The 1 st transparent insulating layer and the 2 nd transparent insulating layer may be disposed on the front surface and the back surface of the flexible base material so as to cover the region where the detection section and the extraction wiring section are not provided and the detection section and the extraction wiring section. In this case, the 1 st transparent insulating layer and the 2 nd transparent insulating layer are transparent and have electrical insulation properties, and have functions of protecting the detection section and the wiring section. The conductivity of the 1 st transparent insulating layer and the 2 nd transparent insulating layer is sufficiently low. The detection section and the lead-out wiring section are in a state where the electrical conductivity between the fine metal wires and the electrical conductivity with other members are sufficiently low by the 1 st transparent insulating layer and the 2 nd transparent insulating layer, and thus the conduction between the fine metal wires and the conduction with other members can be suppressed and short-circuiting and the like can be prevented.

The 1 st transparent insulating layer and the 2 nd transparent insulating layer may be disposed so that the detection section and the extraction wiring section are partially exposed, that is, so that the detection section and the extraction wiring section are not partially covered. As described above, the optical transparent adhesive and the optical transparent resin can be used for the 1 st transparent insulating layer and the 2 nd transparent insulating layer, but the present invention is not limited thereto, and those described below can be used. Hereinafter, the 1 st transparent insulating layer and the 2 nd transparent insulating layer are simply collectively referred to as a transparent insulating layer.

In addition, from the viewpoint that the transparent insulating layer can be formed by 1 coating process, it is preferable that the input region E is formed₁And an outer region E₂Both are provided with the same transparent insulating layer.

As the transparent insulating layer, a transparent insulating layer in which a crosslinked structure is introduced and in which indentation hardness of the transparent insulating layer is adjusted to a predetermined range can be used.

It is estimated that the cracks and disconnections of the thin metal wires are caused by the stress associated with the bending mode of the conductive film including the storage environment condition. Therefore, by relieving the stress on the surface of the thin metal wire and applying the transparent insulating layer having a function of enhancing the strength of the thin metal wire, it is possible to prevent cracking and breaking of the thin metal wire. Specifically, in order to impart a function of reinforcing strength to the transparent insulating layer, a crosslinked structure is introduced into the transparent insulating layer to maintain excellent rigidity of the transparent insulating layer. The indentation hardness of the transparent insulating layer is adjusted to be within a predetermined range so as to prevent the thin metal wire from being broken due to cracks generated in the transparent insulating layer when the transparent insulating layer is bent.

The indentation hardness of the transparent insulating layer is 200MPa or less, preferably 150MPa or less, and more preferably 130MPa or less. The lower limit is not particularly limited, but is preferably 10MPa or more. When the indentation hardness is 200MPa or less, a desired effect is easily obtained.

The indentation hardness of the transparent insulating layer can be measured using a microhardness tester (picohardness).

In order to make the transparent insulating layer exhibit the indentation hardness, the main chain structure of the resin constituting the transparent insulating layer is preferably a flexible structure or a structure in which the distance between the crosslinking points is long.

The transparent insulating layer preferably has an elastic modulus of 1 × 10 at 50-90 deg.C⁵Pa or more, more preferably 1X 10⁶～1×10¹⁰MPa. When the flexible base material is thermally expanded, the thin metal wire having a lower expansion ratio than that of the flexible base material formed on the flexible base material is similarly extended, and thus disconnection of the thin metal wire may occur. On the other hand, if the elastic modulus of the transparent insulating layer at 50 to 90 ℃ is within the above range, even if the conductive film is used in a bent state in a high-temperature and high-humidity environment, the transparent insulating layer is hard and hard to extend, and therefore, cracks and breakage of the thin metal wire are not easily generated.

Further, the elastic modulus of the transparent insulating layer at a temperature of 85 ℃ and a relative humidity of 85% is preferably 1X 10⁵Pa or more, more preferably 1X 10⁶Pa or more, more preferably 1.5X 10⁶Pa or above. The upper limit is not particularly limited, but 1X 10¹⁰MPa or less is often used. If the elastic modulus is within the above range, the conductive film is less likely to be cracked or broken even when the conductive film is used in a bent state in a high-temperature and high-humidity environment.

The elastic modulus of the transparent insulating layer can be measured by a microhardness tester (picohardness) under a predetermined measurement environment, for example, at a temperature of 85 ℃ and a relative humidity of 85%.

The linear expansion coefficient of the transparent insulating layer is not particularly limited, but is preferably 1 to 500 ppm/DEG C, more preferably 5 to 200 ppm/DEG C, and still more preferably 5 to 150 ppm/DEG C. If the linear expansion coefficient of the transparent insulating layer is within the above range, the conductive film is less likely to cause cracking or breaking of the thin metal wire even when the conductive film is used in a bent state in a high-temperature and high-humidity environment.

The linear expansion coefficient of the transparent insulating layer can be calculated by measuring a curl value (curl radius of curvature) when heat is applied to a measurement sample composed of the transparent insulating layer, and using the following 2 equations.

Formula 1: (linear expansion coefficient of transparent insulating layer-linear expansion coefficient of flexible base material) × temperature difference ═ measurement of strain of sample

Formula 2: the strain of the sample was measured { (elastic modulus of flexible base material × (thickness of flexible base material))²}/{3 × (1-Poisson's ratio of flexible substrate) × (elastic modulus of transparent insulating layer) × (radius of curvature of curl) }

In addition, from the viewpoint of further suppressing the disconnection of the thin metal wire, the difference between the linear expansion coefficient of the transparent insulating layer and the linear expansion coefficient of the flexible base material is preferably small, and the upper limit of the difference is preferably 300 ppm/DEG C or less, and more preferably 150 ppm/DEG C or less. The lower limit is not particularly limited, but may be 0 ppm/DEG C.

The thickness of the transparent insulating layer is not particularly limited, but if the thickness is large, the transparent insulating layer is likely to crack when bent. From the viewpoint of suppressing cracking, and further achieving excellent adhesion between the detection section and the lead-out wiring section and excellent film strength, the thickness is preferably 1 to 20 μm, more preferably 5 to 15 μm.

As described above, the transparent insulating layer has a property of transmitting light.

The total light transmittance of the conductive film including the transparent insulating layer is preferably 85% or more, and more preferably 90% or more in the visible light region (wavelength of 400 to 700 nm).

The total light transmittance was measured by a spectrocolorimeter CM-3600A (manufactured by Konica Minolta, inc.).

In addition, the total light transmittance of the transparent insulating layer itself is preferably adjusted so that the conductive film exhibits the above total light transmittance, and is preferably at least 85% or more.

The transparent insulating layer is preferably excellent in adhesion to the detection section and the extraction wiring section, and more specifically, is more preferably free from peeling in a tape adhesion evaluation test based on "610" manufactured by 3M Company.

Further, the transparent insulating layer is preferably excellent in adhesion to the flexible substrate (or the undercoat layer or the adhesive layer) because it is in contact with not only the detection section and the extraction wiring section but also a region of the flexible substrate (or the undercoat layer or the adhesive layer) where the detection section and the extraction wiring section are not formed. The pressure-sensitive adhesive layer is a layer composed of a pressure-sensitive adhesive disposed between the thin metal wires on the flexible base material, and is often formed when the thin metal wires are produced by a silver halide method.

As described above, when the transparent insulating layer has high adhesion to the flexible base material, the detection section, and the lead-out wiring section, cracking and breakage of the thin metal wire can be further suppressed.

From the viewpoint of suppressing surface reflection of the conductive film, the smaller the difference in refractive index between the refractive index of the transparent insulating layer and the refractive index of the flexible substrate is, the more preferable.

When the thin metal wires of the detection section and the extraction wiring section include a binder component, the smaller the difference in refractive index between the refractive index of the transparent insulating layer and the refractive index of the binder component, the smaller the difference in refractive index between the transparent insulating layer and the binder component, and the resin component forming the transparent insulating layer is preferably the same as the binder component.

In addition, the case where the resin component forming the transparent insulating layer is made of the same material as the binder component is exemplified by the case where both the binder component and the resin component forming the transparent insulating layer are (meth) acrylic resins.

In addition, when a touch panel is configured using a conductive film as described above, an optically transparent adhesive sheet or an adhesive layer may be further bonded to the transparent insulating layer of the conductive film. In order to suppress light scattering at the interface between the transparent insulating layer and the optically transparent adhesive sheet or adhesive layer, it is preferable that the refractive index difference between the refractive index of the transparent insulating layer and the refractive index of the optically transparent adhesive sheet or the refractive index of the adhesive layer is smaller.

The transparent insulating layer includes a crosslinked structure. By containing the crosslinked structure, the thin metal wire is less likely to be broken even when the conductive film is used in a bent state in a high-temperature and high-humidity environment.

In order to form a crosslinked structure, it is preferable to form the transparent insulating layer using a polyfunctional compound, as described later.

The material constituting the transparent insulating layer is not particularly limited as long as a layer exhibiting the above-described characteristics can be obtained.

Among them, from the viewpoint of controlling the characteristics of the transparent insulating layer, a layer formed using a composition for forming a transparent insulating layer containing a polymerizable compound having a polymerizable group is preferable.

Hereinafter, a mode using the composition for forming a transparent insulating layer will be described in detail.

(method for Forming transparent insulating layer)

The method for forming the transparent insulating layer using the composition for forming a transparent insulating layer is not particularly limited. For example, there is a method (coating method) of applying a composition for forming a transparent insulating layer on a flexible substrate, a detection section, and a wiring section to be taken out, and if necessary, curing the applied film to form a transparent insulating layer; or a method (transfer method) in which a transparent insulating layer is formed on the temporary substrate and transferred to the surface of the detection section and the wiring section. Among them, the coating method is preferable from the viewpoint of easy control of the thickness.

In the case of the coating method, the method of applying the composition for forming a transparent insulating layer to the flexible base material, the detection section, and the wiring section to be taken out is not particularly limited, and a known method (for example, a coating method such as gravure coating, comma coating, bar coating, knife coating, die coating, or roll coating, an ink jet method, a screen printing method, or the like) can be used.

From the viewpoint of handling properties and manufacturing efficiency, the following is preferred: the composition for forming a transparent insulating layer is applied to the flexible substrate, the detection section, and the wiring section, and if necessary, dried to remove the remaining solvent, thereby forming a coating film.

The conditions for the drying treatment are not particularly limited, and from the viewpoint of better productivity, the drying treatment is preferably carried out at room temperature to 220 ℃ (preferably 50 to 120 ℃) for 1 to 30 minutes (preferably 1 to 10 minutes).

From the viewpoint of productivity, it is more preferable that the composition for forming a transparent insulating layer does not contain a solvent component and does not have a drying step.

In the case of the coating method, the curing treatment may be any of a photo-curing treatment and a thermosetting treatment. Among them, the photo-curing treatment is preferable from the viewpoint of reducing damage to the flexible base material and shortening the tact time (takt time).

The method of exposure is not particularly limited, and examples thereof include a method of irradiation with an activating light or a radiation. As the irradiation with the activating light, irradiation with a UV (ultraviolet) lamp, visible light, or the like can be used. Examples of the light source include mercury lamps, metal halide lamps, xenon lamps, chemical lamps, and carbon arc lamps. Examples of the radiation include an electron beam, an X-ray, an ion beam, and a far infrared ray.

By exposing the coating film, the polymerizable group contained in the compound in the coating film is activated to cause crosslinking between the compounds, thereby curing the layer. The exposure energy is only 10 to 8000mJ/cm²About 50 to 3000mJ/cm is preferable²The range of (1).

The composition for forming a transparent insulating layer contains a polymerizable compound having a polymerizable group. The number of the polymerizable group contained in the polymerizable compound is not particularly limited, and may be 1 or more. Among them, a polymerizable compound having 2 or more polymerizable groups is preferably used from the viewpoint of being able to form a crosslinked structure in the transparent insulating layer.

The type of the polymerizable group is not particularly limited, and examples thereof include a radical polymerizable group such as a (meth) acryloyl group, vinyl group, and allyl group, and a cation polymerizable group such as an epoxy group and oxetanyl group. Among them, from the viewpoint of reactivity, a radical polymerizable group is preferable, and a (meth) acryloyl group is more preferable.

The polymerizable compound may be in any form selected from a monomer, an oligomer, and a polymer. That is, the polymerizable compound may be an oligomer having a polymerizable group or a polymer having a polymerizable group.

In addition, as the monomer, a compound having a molecular weight of less than 1,000 is preferable.

The oligomer and the polymer are polymers in which a limited number (generally 5 to 100) of monomers are bonded. The oligomer means a compound having a weight average molecular weight of 3000 or less, and the polymer means a compound having a weight average molecular weight of more than 3000.

The polymerizable compound may be used in 1 kind or in combination of plural kinds.

Preferred embodiments of the composition for forming a transparent insulating layer include a polymerizable compound (polyfunctional compound) having 2 or more polymerizable groups and an embodiment including at least one of a urethane (meth) acrylate compound and an epoxy (meth) acrylate compound.

Further, the urethane (meth) acrylate compound having 2 or more polymerizable groups corresponds to the urethane (meth) acrylate compound described above and is not included in the polyfunctional compound. The epoxy (meth) acrylate compound having 2 or more polymerizable groups corresponds to the epoxy (meth) acrylate compound and is not included in the polyfunctional compound.

The polyfunctional compound may have 2 or more polymerizable groups, and is preferably a compound having 2 or more (meth) acryloyl groups.

Specific examples of the 2-functional (meth) acrylate include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, 1, 4-butanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, 1, 9-nonanediol di (meth) acrylate, glycerol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 3-methyl-1, 5-pentanediol di (meth) acrylate, 2-butyl-2-ethyl-1, 3-propane di (meth) acrylate, dimethylol tricyclodecane di (meth) acrylate, propylene glycol di (meth) acrylate, and mixtures thereof, Dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, neopentyl glycol hydroxypivalate di (meth) acrylate, 1, 3-butanediol di (meth) acrylate, dimethyloldicyclopentane diacrylate, hexamethylene glycol diacrylate, hexaethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, butanediol di (meth) acrylate, 2' -bis (4-acryloyloxydiethoxyphenyl) propane, bisphenol a tetraethylene glycol diacrylate and the like.

Examples of the 3-functional (meth) acrylate include trimethylolpropane tri (meth) acrylate, ethylene oxide-modified trimethylolpropane tri (meth) acrylate, propylene oxide-modified trimethylolpropane tri (meth) acrylate, tris (acryloyloxyethyl) isocyanurate, caprolactone-modified tris (acryloyloxyethyl) isocyanurate, pentaerythritol tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, alkyl-modified dipentaerythritol tri (meth) acrylate, tetramethylolmethane tri (meth) acrylate, ethylene oxide-modified glycerol triacrylate, propylene oxide-modified glycerol triacrylate, epsilon-caprolactone-modified trimethylolpropane triacrylate, pentaerythritol triacrylate, and the like.

Examples of the 4-functional (meth) acrylate include ditrimethylolpropane tetra (meth) acrylate, pentaerythritol ethoxy tetra (meth) acrylate, and pentaerythritol tetra (meth) acrylate.

Examples of the 5-or more-functional (meth) acrylate compound include dipentaerythritol penta (meth) acrylate, alkyl-modified dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate, and polypentaerythritol polyacrylate.

The content of the polyfunctional compound in the composition for forming a transparent insulating layer is not particularly limited, and is preferably 0 to 50% by mass, more preferably 20 to 45% by mass, based on the total solid content in the composition for forming a transparent insulating layer, from the viewpoint of further improving the effect of the present invention.

In detail, the urethane (meth) acrylate compound is preferably a compound containing 2 or more photopolymerizable groups selected from the group consisting of acryloyloxy group, acryloyl group, methacryloyloxy group, and methacryloyl group in 1 molecule and containing 1 or more urethane bonds in 1 molecule. Such a compound can be produced, for example, by a urethanization reaction of an isocyanate and a hydroxyl group-containing (meth) acrylate compound. The urethane (meth) acrylate compound may be a so-called oligomer or a polymer.

The photopolymerizable group is a polymerizable group capable of radical polymerization. A polyfunctional urethane (meth) acrylate compound containing 2 or more photopolymerizable groups in 1 molecule is useful in forming a transparent insulating layer with high hardness.

The number of photopolymerizable groups contained in 1 molecule of the urethane (meth) acrylate compound is preferably at least 2, for example, more preferably 2 to 10, and further preferably 2 to 6. The 2 or more photopolymerizable groups contained in the urethane (meth) acrylate compound may be the same or different.

As the photopolymerizable group, an acryloyloxy group or a methacryloyloxy group is preferable.

The number of urethane bonds contained in 1 molecule of the urethane (meth) acrylate compound is only required to be 1 or more, and is preferably 2 or more, for example, more preferably 2 to 5, from the viewpoint of increasing the hardness of the transparent insulating layer to be formed.

In the urethane (meth) acrylate compound having 2 urethane bonds in 1 molecule, the photopolymerizable group may be bonded to only one urethane bond directly or via a linking group, or may be bonded to 2 urethane bonds directly or via a linking group.

In one embodiment, 1 or more photopolymerizable groups are preferably bonded to 2 urethane bonds bonded via a linking group, respectively.

As described above, in the urethane (meth) acrylate compound, the urethane bond and the photopolymerizable group may be directly bonded, or a linking group may be present between the urethane bond and the photopolymerizable group. The linking group is not particularly limited, and examples thereof include a linear or branched saturated or unsaturated hydrocarbon group, a cyclic group, and a group composed of a combination of 2 or more of these. The number of carbon atoms of the hydrocarbon group is, for example, about 2 to 20, but is not particularly limited. Examples of the cyclic structure included in the cyclic group include an aliphatic ring (e.g., a cyclohexane ring), an aromatic ring (e.g., a benzene ring and a naphthalene ring), and the like. The above groups may be unsubstituted or substituted.

In the present specification, unless otherwise specified, the groups described may have a substituent or may be unsubstituted. When a group has a substituent, examples of the substituent include an alkyl group (e.g., an alkyl group having 1 to 6 carbon atoms), a hydroxyl group, an alkoxy group (e.g., an alkoxy group having 1 to 6 carbon atoms), a halogen atom (e.g., a fluorine atom, a chlorine atom, and a bromine atom), a cyano group, an amino group, a nitro group, an acyl group, and a carboxyl group.

The urethane (meth) acrylate compound can be synthesized by a known method. Further, it can be obtained as a commercially available product.

As an example of the synthesis method, for example, a method of reacting a hydroxyl group-containing compound such as an alcohol, a polyol and/or a hydroxyl group-containing (meth) acrylate with an isocyanate is given. Further, there can be mentioned a method of esterifying the urethane compound obtained by the above reaction with (meth) acrylic acid as necessary. In addition, (meth) acrylic acid is used in the meaning of including acrylic acid and methacrylic acid.

Examples of the isocyanate include aromatic, aliphatic, and alicyclic polyisocyanates, and toluene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, polyphenylmethane polyisocyanate, modified diphenylmethane diisocyanate, hydrogenated xylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, tetramethylxylene diisocyanate, isophorone diisocyanate, norbornene diisocyanate, 1, 3-bis (isocyanatemethyl) cyclohexane, phenylene diisocyanate, lysine triisocyanate, and naphthalene diisocyanate. These may be 1 kind or 2 or more kinds may be used simultaneously.

Examples of the hydroxyl group-containing (meth) acrylate include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 4-hydroxybutyl acrylate, 2-hydroxyethyl acryloyl phosphate, 2-acryloyloxyethyl-2-hydroxypropyl phthalate, glycerol diacrylate, 2-hydroxy-3-acryloyloxypropyl acrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, caprolactone-modified 2-hydroxyethyl acrylate, and cyclohexanedimethanol monoacrylate. These may be 1 kind or 2 or more kinds may be used simultaneously.

The commercially available urethane (meth) acrylate compound is not limited to the following commercially available urethane (meth) acrylate compounds, and examples thereof include Kyoeisha Chemical Co., Ltd., U-306H, UA-306I, UA-306T, UA-510H, UF-8001G, UA-101I, UA-101T, AT-600, AH-600, AI-600, Shin-Nakamura Chemical Co., Ltd., U-4HA, U-6LPA, UA-32P, U-15HA, UA-1100H, Nippon Synthetic Chemical Industry Co., Ltd., Violet UV-7610B, Violet UV-1700B, Violet UV-6300B, Violet UV-7550B, Violet UV-7600B, Violet UV-05B, Violet UV-7610B, Violet UV-20 EA, Violet-7630B 767630B, Violet UV-7640B, violet UV-6630B, violet UV-7000B, violet UV-7510B, violet UV-7461TE, violet UV-3000B, violet UV-3200B, violet UV-3210EA, violet UV-3310B, violet UV-3500BA, violet UV-3520TL, violet UV-3700B, violet UV-6100B, violet UV-6640B, violet UV-2000B, violet UV-2010B, violet UV-2250 EA. Further, Nippon Synthetic Chemical Industry Co., Ltd, ultraviolet UV-2750B, Kyoeisha Chemical Co., Ltd, UL-503LN Co., Ltd, UNIDIC 17-806, UNIDIC 17-813, UNIDIC V-4030, UNIDIC V-4000BA, Daicel UCB Co., Ltd, EB-1290K, TOKUSHIKI Co., Ltd, HI-COAP AU 2010-2020, HI-COAP AU-2020 and the like can be given.

Examples of the 6-or more-functional urethane (meth) acrylate compound include Negami Chemical Industrial Co., Ltd, Art Resin UN-3320HA manufactured by Ltd, Art Resin UN-3320HC, Art Resin UN-3320HS, Art Resin UN-904, Nippon Synthetic Chemical Industrial Co., Ltd, violet UV-1700B manufactured by Ltd, violet UV-7605B, violet UV-7610B, violet UV-7630B, violet UV-7640B, Shin-Nakamura Chemical Co., Ltd, NK Oligo U-6PA manufactured by Ltd, and NK Oligo U-10HA, NK Oligo U-10PA, NK Oligo U-1100H, NK Oligo U-15HA, NK Oligo U-53H, KRM8452, EBECRYL1290, KRM8200, EBECRYL5129, KRM8904, Nippon Kayaku Co., Ltd., UX-5000, and the like.

Further, examples of the 2-to 3-functional urethane (meth) acrylate compound include Nagase & Co., Ltd., NATOKO UV SELF-ALING, and EXP DX-40, manufactured by DIC Corporation.

The molecular weight (weight average molecular weight Mw) of the urethane (meth) acrylate compound is preferably in the range of 300 to 10,000. When the molecular weight is within this range, a transparent insulating layer having excellent flexibility and excellent surface hardness can be obtained.

The epoxy (meth) acrylate compound is a compound obtained by addition reaction of a polyglycidyl ether and (meth) acrylic acid, and often has at least 2 (meth) acryloyl groups in the molecule.

The total content of the urethane (meth) acrylate compound and the epoxy (meth) acrylate compound in the composition for forming a transparent insulating layer is not particularly limited, but is preferably 10 to 70% by mass, more preferably 30 to 65% by mass, based on the total solid content in the composition for forming a transparent insulating layer, from the viewpoint of further improving the effect of the present invention.

The composition for forming a transparent insulating layer may further contain a monofunctional monomer, preferably a monofunctional (meth) acrylate. The monofunctional monomer functions as a diluent monomer for controlling the crosslink density in the transparent insulating layer.

Examples of the monofunctional (meth) acrylate include long-chain alkyl (meth) acrylates such as butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, nonyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (meth) acrylate, hexadecyl (meth) acrylate, octadecyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, nonylphenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, nonylphenoxyethyltetrahydrofurfuryl (meth) acrylate, caprolactone-modified tetrahydrofurfuryl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, and the like, Dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, ethylene oxide-modified nonylphenol (meth) acrylate, propylene oxide-modified nonylphenol (meth) acrylate, 2-ethylhexyl carbitol (meth) acrylate and other (meth) acrylates having a cyclic structure, glycidyl (meth) acrylate, methoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, 2- (meth) acryloyloxyethyl acid phosphate, diethylaminoethyl (meth) acrylate, isomyristyl (meth) acrylate, methyl methacrylate, ethyl methacrylate, and mixtures thereof, Isostearyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, isobornyl (meth) acrylate, and esters of (meth) acrylic acid with polyhydric alcohols.

The content of the monofunctional monomer in the composition for forming a transparent insulating layer is not particularly limited, and is preferably 0 to 40% by mass, more preferably 0 to 20% by mass, based on the total solid content in the composition for forming a transparent insulating layer, from the viewpoint of further improving the effect of the present invention.

The composition for forming a transparent insulating layer may further contain a polymerization initiator. The polymerization initiator may be any of a photopolymerization initiator and a thermal polymerization initiator, but is preferably a photopolymerization initiator.

The kind of the photopolymerization initiator is not particularly limited, and a known photopolymerization initiator (radical photopolymerization initiator, cationic photopolymerization initiator) can be used. Examples thereof include acetophenone, 2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, benzophenone, 2-chlorobenzophenone, benzil, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, 2-dimethoxy-1, 2-diphenylethan-1-one, 1-cyclohexylphenyl ketone, 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl ] -2-hydroxy-2-methyl-1-propan-1-one, oligo (2-hydroxy-2-methyl-1- (4- (1-methylvinyl) phenyl) propan-1-one Yl) acetone), 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl ] -phenyl } -2-methyl-propan-1-one, 2-methyl-1- [4- (methylthio) phenyl ] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, bis (2,4, 6-trimethylbenzoyl) -phenylphosphine oxide, 2,4, 6-trimethylbenzoyl-diphenyl-phosphine oxide, bis (2, 6-dimethoxybenzoyl) -2, carbonyl compounds such as 4, 4-trimethyl-pentylphosphine oxide, ethyl- (2,4, 6-trimethylbenzoyl) phenylphosphinate, 1, 2-octanedione, 1- [4- (phenylthio) -, 2- (O-benzoyl oxime) ], methylbenzoyl formate, 4-methylbenzophenone, 4-phenylbenzophenone, 2,4, 6-trimethylbenzophenone, 4-benzoyl-4' -methyldiphenylsulfide, 1- [4- (4-benzoylphenylsulfanyl) phenyl ] -2-methyl-2- (4-methylphenylsulfonyl) propan-1-one, and thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, and mixtures thereof, Sulfur compounds such as tetramethylthiuram disulfide, and the like. The polymerization initiator may be used alone in 1 kind, or may be used in combination in 2 or more kinds.

The content of the polymerization initiator in the composition for forming a transparent insulating layer is not particularly limited, but is preferably 0.1 to 10% by mass, more preferably 2 to 5% by mass, based on the total solid content in the composition for forming a transparent insulating layer, from the viewpoint of curability. When 2 or more kinds of polymerization initiators are used, the total content of the polymerization initiators is preferably within the above range.

In addition to the above, various conventionally known additives such as the metal stabilizer, leveling agent, surface lubricant, antioxidant, preservative, light stabilizer, ultraviolet absorber, polymerization inhibitor, silane coupling agent, inorganic or organic filler, powder such as metal powder and pigment, and particulate or foil-like matter can be added to the composition for forming a transparent insulating layer as appropriate depending on the application. For details of these, for example, refer to paragraphs 0032 to 0034 of Japanese patent application laid-open No. 2012 and 229412. However, the photopolymerization initiator is not limited to these examples, and various additives generally used in photopolymerizable compositions can be used. The amount of the additive to be added to the composition for forming a transparent insulating layer is not particularly limited, and may be appropriately adjusted.

As the leveling agent, a known leveling agent can be used as long as it has an action of imparting wettability to the coating object by the composition for forming a transparent insulating layer and an action of reducing surface tension. Examples thereof include silicone-modified resins, fluorine-modified resins, and alkyl-modified resins.

The composition for forming a transparent insulating layer may contain a solvent from the viewpoint of handling properties, but is preferably solvent-free from the viewpoint of VOC (volatile organic compound) suppression and the viewpoint of reduction in tact time.

When the composition for forming a transparent insulating layer contains a solvent, the solvent that can be used is not particularly limited, and examples thereof include water and an organic solvent.

The conductive film may be used as a laminate having the conductive film, the adhesive sheet, and the release sheet in this order during handling and transportation. When the touch panel laminate is conveyed, the release sheet functions as a protective sheet for preventing the conductive film from being scratched or the like. In this manner, when the conductive film is used, the release sheet can be peeled off and the conductive film can be used by being stuck to a predetermined position.

For example, the conductive film may be treated to form a composite having the conductive film, the adhesive sheet, and the protective layer in this order. In this manner, the occurrence of scratches and the like in the conductive film can also be prevented.

(method of manufacturing touch Panel)

Fig. 12 is a schematic cross-sectional view showing a step of a method for manufacturing a touch panel according to an embodiment of the present invention, and fig. 13 is a schematic cross-sectional view showing a step of a method for manufacturing a touch panel according to an embodiment of the present invention.

In fig. 12 and 13, the same structural objects as those of the touch panel 10 shown in fig. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

In the method of manufacturing the touch panel 10 shown in fig. 1, for example, the image display module 14, the 1 st transparent insulating layer 15, the conductive film 12, the 2 nd transparent insulating layer 17, and the covering portion 16 shown in fig. 12 are sequentially stacked in the stacking direction Dt. At this time, the conductive film 12 is in a state where the bent portion 27 protrudes from the 1 st transparent insulating layer 15 and the 2 nd transparent insulating layer 17.

Next, the conductive film 12 is bent at the bending position Bf, the bending portion 27 is disposed on the back surface 14b side of the image display module 14, and the external connection terminal 26 of the extraction wiring portion 22 is electrically connected to the flexible circuit board 19.

The laminate in which the 1 st transparent insulating layer 15, the conductive film 12, the 2 nd transparent insulating layer 17, and the covering portion 16 are laminated is referred to as a touch panel laminate 60.

Next, as shown in fig. 13, the sealing layer 36 is formed on the bent portion 27 of the conductive film 12 and the side surface 17c of the 2 nd transparent insulating layer 17 in the laminate 60 for a touch panel shown in fig. 12. As described above, in the sealing layer 36, the end portion 36a can reach the surface of the decorative layer 18 of the cover 16. As described above, the sealing layer 36 preferably has the end 36c in contact with the back surface 14b of the image display module 14.

The flexible circuit board 19 is electrically connected to the controller 13 (see fig. 1), and the controller 13 is disposed on the rear surface 14b of the image display module 14.

In addition, the controller 13 may be disposed on the rear surface 14b of the image display module 14 before the sealing layer 36 is formed.

Next, a frame 40 having a cushion material 44 disposed inside 40a shown in fig. 1 is prepared.

Next, the side plate 42 of the frame 40 is bonded to the back surface 16b of the covering portion 16 of the touch panel laminate 60 shown in fig. 13, on which the sealing layer 36 is formed. Thereby, the touch panel 10 shown in fig. 1 can be obtained. The bonding method is not particularly limited, and bonding with an adhesive can be used, for example.

As described above, the sealing layer 36 is formed on the touch panel laminate 60 by, for example, a bonding method in which an adhesive tape having electrical insulation is bonded to the bent portion 27 and the side surface 17c of the 2 nd transparent insulating layer 17.

The sealing layer 36 can also be formed on the touch panel laminate 60 by applying a substance having electrical insulation to the bent portions 27 and the side surfaces 17c of the 2 nd transparent insulating layer 17 by, for example, a spray coating method or a drip coating method to form a coating film.

The sealing layer 36 can also be formed on the touch panel laminate 60 by depositing a material having electrical insulation properties on the bent portions 27 and the side surfaces 17c of the 2 nd transparent insulating layer 17 by, for example, a sputtering method or a vapor deposition method.

As described above, by forming the sealing layer, the dimensional accuracy of the sealing layer can be improved, and the width of the frame portion Df of the touch panel 10 can be narrowed. Further, the defect rate in forming the sealing layer can be reduced. That is, the yield of manufacturing the touch panel can be improved.

The width of the frame Df of the touch panel 10 depends on the thickness of the base material and each layer used in the laminate for a touch panel, but may be 1.5mm or less. The width of the frame Df of the touch panel 10 is preferably 0.5mm to 1.5 mm.

The present invention is basically constituted as described above. Although the touch panel and the method of manufacturing the touch panel of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various improvements and modifications may be made without departing from the scope of the present invention.

Examples

The features of the present invention will be described in more detail below with reference to examples. The materials, reagents, amounts of substances, ratios thereof, operations and the like shown in the following examples can be appropriately modified within a range not departing from the gist of the present invention. Therefore, the scope of the present invention is not limited to the following examples.

In example 1, touch panels of examples 1 to 9 and comparative example 1 were produced. For each touch panel, the permeability of the sealing layer shown below was measured, and the change in resistance of the active region was evaluated. The results are shown in table 1 below.

[ evaluation ]

(resistance change of active region)

Regarding the change in the resistance of the active region, the touch panel in which the conductive film and the frame were bonded was left at a temperature of 80 ℃ for 10 days. The resistance of the active region was measured before and after 10 days on the touch panel, and evaluated according to the evaluation criteria shown below. The evaluation results are shown in table 1 below.

Resistance measurement was performed by using a Fluke (registered trademark) digital multimeter (handheld type) by contacting test terminals to piano wire portions of FPCs protruding from both ends of a touch panel to measure the resistance value between the FPCs. The resistance value before and after 10 days was measured, and the resistance change (%) [ { (resistance value after time-resistance value before time)/resistance value before time } × 100] was detected.

(evaluation criteria)

A: the resistance change of the active region after time is less than +/-10%

B: the resistance value of the active region after the elapse of time is more than +/-10%, and the resistance value after the elapse of time is within 2 times of the resistance value before the elapse of time

C: the resistance value of the active region after the lapse of time is 2 times greater than the resistance value before the lapse of time

(permeability of sealing layer)

The permeability of the sealing layer was evaluated by sandwiching a sample of the sealing layer for coating between 2 cells by a Gas chromatography-Flame Photometric Detector (GC-FPD) method, introducing a supply Gas into one of the cells, introducing an ultra-high purity Gas (hydrogen sulfide) into the opposite cell, measuring the concentration of the Gas that has passed through, and determining the amount of Gas that has passed through per unit time and per unit area as the permeability.

In addition, a sealant layer was coated on a PET (polyethylene terephthalate) film other than Kapton (registered trademark) tape, and the transmittance was determined from the difference in the values of the uncoated PET film. In addition, test conditions are shown below.

< test conditions >

Sample shape: diameter 110mm, supply gas: hydrogen sulfide (H)₂S), supply gas concentration: 50ppm, gas flow: 10-50 ml/min, sample temperature: 25 deg.C

Examples 1 to 9 and comparative example 1 will be described below.

[ example 1]

< production of laminate for touch Panel >

(preparation of silver halide emulsion)

An amount corresponding to 90% of each of the following solutions 2 and 3 was added to solution 1 below, which was maintained at 38 ℃ and pH4.5, while stirring for 20 minutes, to form 0.16 μm core particles. Then, the following solutions 4 and 5 were added over 8 minutes, and the remaining 10% of the solutions 2 and 3 were further added over 2 minutes, thereby growing to 0.21. mu.m. Further, 0.15g of potassium iodide was added thereto, and the mixture was aged for 5 minutes to complete the formation of particles.

Solution 1:

liquid 2:

300ml of water

Silver nitrate 150g

Liquid 3:

4, liquid:

100ml of water

Silver nitrate 50g

Liquid 5:

thereafter, water washing was performed by a flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ℃, and the pH was lowered with sulfuric acid until silver halide precipitated (pH in the range of 3.6 ± 0.2). Then, about 3 liters of supernatant was removed (first water wash). After further addition of 3 liters of distilled water, sulfuric acid was added until silver halide precipitated. The 3 liters of supernatant were again removed (second water wash). The same operation as the second washing (third washing) was further repeated 1 time, and the washing/desalting step was completed. The emulsion after washing/desalting was adjusted to pH6.4 and pAg7.5, 2.5g of gelatin, 10mg of sodium thiophenylsulfonate, 3mg of sodium thiophenylsulfonate, 15mg of sodium thiosulfate and 10mg of chloroauric acid were added, chemical sensitization was performed at 55 ℃ to obtain the optimum sensitivity, 100mg of 1,3,3a, 7-tetrazine indene was added as a stabilizer, and 100mg of PROXEL (trade name, ICI Co., Ltd.) was added as a preservative. The emulsion finally obtained was an emulsion of cubic silver iodochlorobromide particles containing 0.08 mol% of silver iodide, and the ratio of silver chlorobromide was 70 mol% of silver chloride and 30 mol% of silver bromide, and the average particle diameter was 0.22 μm and the coefficient of variation was 9%.

(preparation of photosensitive layer Forming composition)

Adding 1,3,3a, 7-tetrazine indene 1.2X 10 to the emulsion^-4Mole/mole Ag, hydroquinone 1.2X 10^-2Mole/mole Ag, citric acid 3.0X 10^-4Ag mole/mole, 2, 4-dichloro-6-hydroxy-1, 3, 5-triazine sodium salt 0.90 g/mole Ag, trace amount of hardener, and adjusting the pH of the coating solution to 5.6 with citric acid.

A polymer latex containing a polymer represented by the following formula (P-1) and a dispersant composed of dialkyl phenyl PEO sulfate (the mass ratio of the dispersant/polymer is 2.0/100 to 0.02) was added to the coating liquid until the ratio to the contained gelatin became polymer/gelatin (mass ratio) 0.5/1.

As the crosslinking agent, EPOXY RESIN DY 022 (trade name: manufactured by Nagase ChemteX Corporation) was further added. The amount of the crosslinking agent added was adjusted so that the amount of the crosslinking agent in the silver halide-containing photosensitive layer described later became 0.09g/m²。

The photosensitive layer forming composition was prepared as described above.

In addition, a polymer represented by the following formula (P-1) was synthesized with reference to Japanese patent No. 3305459 and Japanese patent No. 3754745.

[ chemical formula 4]

(photosensitive layer Forming step)

The polymer latex was coated on both sides of a polyethylene terephthalate (PET) film having a thickness of 40 μm, thereby providing an undercoat layer having a thickness of 0.05 μm.

Next, a silver halide-free layer-forming composition containing the polymer latex and gelatin was applied onto the primer layer, thereby forming a silver halide-free layer having a thickness of 1.0 μm. The mixing mass ratio of the polymer and gelatin (polymer/gelatin) was 2/1, and the polymer content was 0.65g/m²。

Next, the photosensitive layer-forming composition was applied onto a layer not containing silver halide, thereby providing a silver halide-containing photosensitive layer having a thickness of 2.5 μm. The mixing mass ratio of the polymer and gelatin in the silver halide-containing photosensitive layer (polymer/gelatin) was 0.5/1, and the content of the polymer was 0.22g/m²。

Next, a protective layer having a thickness of 0.15 μm was formed by applying a protective layer-forming composition containing the polymer latex and gelatin to the silver halide-containing photosensitive layer. The mixing mass ratio of the polymer to the gelatin (polymer/gelatin) was 0.1/1, and the content of the polymer was 0.015g/m²。

(Exposure treatment and development treatment)

The photosensitive layer thus produced was exposed to parallel light using a high-pressure mercury lamp as a light source through a photomask provided with a detection unit (1 st detection electrode, 2 nd detection electrode) and a wiring extraction unit shown in fig. 7.

After exposure, the substrate was developed with a developing solution, further subjected to a developing treatment with a fixing solution (trade name: CN16X, N3X-R: manufactured by Fujifilm Corporation), washed with pure water, and dried.

Composition of the developer:

the following compounds were contained in 1 liter (L) of the developer.

(Heat treatment)

Then, the mixture was left to stand in a superheated steam bath at 120 ℃ for 130 seconds to be subjected to heat treatment.

(treatment of decomposition of gelatin)

The gel was further immersed in a gelatin-decomposed solution (40 ℃ C.) prepared as follows for 120 seconds, and then immersed in warm water (liquid temperature: 50 ℃ C.) for 120 seconds to wash the gel.

Preparing a gelatin decomposition solution:

triethanolamine and sulfuric acid were added to an aqueous solution (concentration of protease: 0.5% by mass) of protease (BIOPRASE 30L manufactured by Nagase ChemteX Corporation) to prepare a pH of 8.5.

(Polymer crosslinking treatment)

The plate was further immersed in a 1% aqueous solution of CARBODILITE V-02-L2 (trade name: Nisshinbo Co., Ltd.) for 30 seconds, taken out of the aqueous solution, immersed in pure water (room temperature) for 60 seconds, and washed.

Thus, film a having detection electrodes and peripheral wiring formed on both surfaces of the PET film was obtained.

(bonding of No. 1 Release film and adhesive layer)

A film B composed of another release film (No. 1 release film) (thickness: 50 μ M) and an adhesive layer (75 μ M) was obtained by peeling off one release film of OCA (8146-4 (product number) manufactured by 3M Company) (adhesive layer having release films on both sides). One side of the adhesive layer of the obtained film B was bonded to the 1 st side (the side on which the 1 st detection electrode was present) of the film a.

(protruding part formation step)

An insulating film covering the detection sections and surrounding the periphery of the plurality of detection sections was formed using an Asahi Chemical Research Laboratory Co., Ltd., UVF30T (product name) made by Ltd., as a UV (Ultra Violet) curable resin, thereby forming a protruding section (thickness: 9 to 10 μm) composed of the extraction wiring section and the insulating film. The protruding portion is formed along the peripheral portion of the conductive film at the end of the conductive film. Further, UVF30T was applied by screen printing, followed by UV exposure (metal halide lamp, 1000 mJ/cm)²) Exposure is performed, whereby a protruding portion is formed. In this manner, a film including the 1 st release film, the adhesive layer, and the conductive film in this order was obtained. Here, the conductive film has a flexible base material, detection portions (1 st detection electrode, 2 nd detection electrode), a lead-out wiring portion, and a protruding portion. Next, the obtained conductive film was laminated in the order of a liquid crystal display module as an image display module, a1 st transparent insulating layer (8146-3 (product number) by 3M Company), a conductive film, a 2 nd transparent insulating layer (8146-3 (product number) by 3M Company), and a cover layer, thereby obtaining a laminate for a touch panel. The light transmittance of the laminate for a touch panel was 95%. In the laminate for touch panel, the 1 st extraction wiring region B of the conductive film₁The 1 side (see fig. 7) is bent toward the back surface side of the liquid crystal display module and electrically connected to an FPC (flexible printed circuit board). In the laminate for a touch panel, the side surface and the bent portion of the 2 nd transparent insulating layer corresponding to the bent 1 st side were covered with an electrically insulating polyimide tape having a thickness of 100 μm, thereby forming a sealing layer. Then, the frame body (refer to fig. 1) with the cushion material arranged therein is connected withThe touch panel is obtained by laminating the laminate. The width of the frame Df of the touch panel was 1.5 mm. In addition, Kapton (registered trademark) tape was used as the polyimide tape. Ethylene-propylene sponge was used as the cushioning material.

[ example 2]

Example 2 is different from example 1 in the following points, and is the same as example 1 except for the points. In example 2, the 1 st extraction wiring region B of the conductive film₁(refer to FIG. 7) and the 2 nd peripheral wiring region B₂The 2 sides (see fig. 7) are bent toward the back surface side of the liquid crystal display module and electrically connected to an FPC (flexible printed circuit board). The side surface and the bent portion of the 2 nd transparent insulating layer corresponding to each of the bent sides of the conductive film were covered with a polyimide tape having a thickness of 100 μm on the bent 2 sides, thereby forming a sealing layer. Then, a housing (see fig. 1) in which a cushion material is arranged is bonded to the touch panel laminate to obtain a touch panel. In addition, Kapton (registered trademark) tape was used as the polyimide tape.

[ example 3]

Example 3 is the same as example 1 except that it is different from example 1 in the following points. In example 3, the 1 st extraction wiring region B of the conductive film₁(refer to FIG. 7), 2 nd peripheral wiring region B₂(refer to FIG. 7) and the 3 rd peripheral wiring region B₃The 3 sides (see fig. 7) are bent toward the back surface side of the liquid crystal display module and electrically connected to the FPC. The side surface and the bent portion of the 2 nd transparent insulating layer corresponding to the bent sides of the conductive film were covered with a polyimide tape having a thickness of 100 μm on the bent 3 sides, thereby forming a sealing layer. Then, a housing (see fig. 1) in which a cushion material is arranged is bonded to the touch panel laminate to obtain a touch panel. In addition, Kapton (registered trademark) tape was used as the polyimide tape.

[ example 4]

Example 4 is different from example 1 in the following points, and is the same as example 1 except for the points. In factIn example 4, the 1 st extraction wiring region B of the conductive film₁(refer to FIG. 7), 2 nd peripheral wiring region B₂(refer to fig. 7), 3 rd peripheral wiring region B₃(refer to FIG. 7) and the 4 th peripheral wiring region B₄The 4 sides (see fig. 7) are bent toward the back surface side of the liquid crystal display module and electrically connected to an FPC (flexible printed circuit board). The side surface and the bent portion of the 2 nd transparent insulating layer corresponding to each bent side of the conductive film were covered with a polyimide tape having a thickness of 100 μm on the bent 4 sides, thereby forming a sealing layer. Then, a housing (see fig. 1) in which a cushion material is arranged is bonded to the touch panel laminate to obtain a touch panel. In addition, Kapton (registered trademark) tape was used as the polyimide tape.

[ example 5 ]

Example 5 is the same as example 1 except that it is different from example 1 in the following points. In example 5, the side surface and the bent portion of the 2 nd transparent insulating layer corresponding to the bent 1 side of the conductive film were covered with AIR URETHANE CLEAR (trade name) having a thickness of 20 μm by a spray coating method to form a sealing layer, and then the sealing layer was attached to a frame (see fig. 1).

[ example 6 ]

Example 6 is different from example 1 in the following points, and is the same as example 1 except that the other points are different. In example 6, the wiring region B was extracted in the 1 st extraction region of the conductive film by RF (Radio Frequency) magnetron sputtering₁Al with a thickness of 30nm is formed on the side surface of the 2 nd transparent insulating layer corresponding to the bent part and the 1 st side (see FIG. 7)₂O₃Layer, thereby forming a sealing layer. Then, a housing (see fig. 1) in which a cushion material is arranged is bonded to the touch panel laminate to obtain a touch panel. RF magnetron sputtering method in vacuum degree of 10^-4Atmosphere of Pa or less and film forming speed

Under the conditions of (1), Al is formed₂O₃A sealing layer of the layer.

[ example 7 ]

Example 7 is the same as example 1 except that it is different from example 1 in the following points. In example 7, the first extraction wiring region B of the conductive film was formed on the first extraction wiring region B by RF (Radio Frequency) magnetron sputtering₁The sealant layer was formed by forming a SiON layer having a thickness of 30nm on the side surface of the 2 nd transparent insulating layer corresponding to the 1 st side bent (see fig. 7). Then, a housing (see fig. 1) in which a cushion material is arranged is bonded to the touch panel laminate to obtain a touch panel. RF magnetron sputtering method in vacuum degree of 10^-4Atmosphere of Pa or less and film forming speed

Under the conditions of (1), a sealing layer of the SiON layer was formed.

[ example 8 ]

Example 8 is the same as example 1 except that it is different from example 1 in the following points. In example 8, the first extraction wiring region B of the conductive film was formed by vapor deposition₁Al with a thickness of 30nm is formed on the side surface of the 2 nd transparent insulating layer corresponding to the bent part and the 1 st side (see FIG. 7)₂O₃Layer, thereby forming a sealing layer. Then, a housing (see fig. 1) in which a cushion material is arranged is bonded to the touch panel laminate to obtain a touch panel. Vapor deposition method at vacuum degree of 10^-4Atmosphere of Pa or less and film forming speed

Under the condition of (1) forming Al₂O₃A sealing layer of the layer.

[ example 9 ]

Example 9 is the same as example 1 except that it is different from example 1 in the following points. In example 9, the first extraction wiring region B of the conductive film was formed by vapor deposition₁(refer to FIG. 7) the SiOx layer having a thickness of 30nm is formed on the side surface of the 2 nd transparent insulating layer corresponding to the 1 st side to be bentThereby forming a sealing layer. Then, a housing (see fig. 1) in which a cushion material is arranged is bonded to the touch panel laminate to obtain a touch panel. Vapor deposition method at vacuum degree of 10^-4Atmosphere of Pa or less and film forming speed

Under the conditions of (1) forming a sealing layer of the SiOx layer.

[ comparative example 1]

Comparative example 1 is different from example 1 in the following points, and is the same as example 1 except for the points. In comparative example 1, the protruding portion forming step of example 1 was performed on the extraction wiring portions on both sides to obtain a conductive film. Next, the obtained conductive film was laminated in the order of the liquid crystal display module, the 1 st transparent insulating layer, the conductive film, the 2 nd transparent insulating layer, and the cover material, and the 1 side of the extraction wiring region of the conductive film was bent toward the back surface side of the liquid crystal display module and electrically connected to the FPC. In comparative example 1, no sealing layer was formed.

In comparative example 1, although the insulating film was used in the structure of UVF30T (product name) manufactured by Asahi Chemical Research Laboratory co., ltd., no sealing layer was provided in the bent portion. Therefore, the evaluation of the permeability of the sealant layer was not performed, and the column entitled "permeability of sealant layer" in table 1 was marked with "-".

[ Table 1]

As shown in table 1, examples 1 to 9 can obtain better results with respect to the change in the resistance of the active region than comparative example 1.

As is clear from examples 1 to 9, in examples using a sealing layer having excellent permeability, that is, hardly permeable to gas, good results were obtained with respect to the change in the resistance of the active region.

In addition, in the evaluation of the change in the resistance of the active region, ethylene-propylene sponge was used as the buffer material in examples 1 to 9, but the same effects were obtained by using chloroplatinic sponge, styrene-butadiene sponge, and nitrile rubber sponge.

In example 2, touch panels of examples 10 to 17 and comparative example 2 were produced, and the change in resistance of the active region was evaluated for each touch panel. Further, the change in the resistance of the active region was also evaluated for each of the touch panels of example 1, examples 5 to 9, and comparative example 1. The results are shown in table 2 below.

Examples 10 to 17 and comparative example 2 will be described below.

[ example 10 ]

Example 10 a touch panel was produced in the same manner as in example 1, except that the adhesive B obtained by the following production method was used instead of 8146-3 (product number) manufactured by the 3M Company described above to produce the 1 st transparent insulating layer and the 2 nd transparent insulating layer, compared to example 1.

< method for producing adhesive B >

An esterification product of a maleic anhydride adduct of a polyisoprene polymer and 2-hydroxyethyl methacrylate (trade name UC203, KURARAY co., LTD. having a molecular weight of 36000), 21.8 parts by mass, polybutadiene (trade name Polyvest110, ev nik Degussa GmbH), 11.4 parts by mass, dicyclopentenyloxyethyl methacrylate (trade name FA512M, Hitachi Chemical company, LTD.), 5 parts by mass, 2-ethylhexyl methacrylate (FUJIFILM Wako Pure Chemical Corporation) 20 parts by mass, terpene-based hydrogenated resin (trade name CLEARON P-135, yahara Chemical co., LTD.) 38.8 parts by mass, and 2-mercaptobenzothiazole as a metal stabilizer 0.05 part by mass were kneaded in a thermostatic bath at 130 ℃. Subsequently, the temperature of the thermostatic bath was adjusted to 80 ℃, 0.6 part by mass of a photopolymerization initiator (trade name Lucirin TPO, BASF) and 2.4 parts by mass of a photopolymerization initiator (trade name IRGACURE184, BASF) were added thereto, kneaded by a kneader, and then coated on a surface-treated surface of a release film (heavy release film) having a predetermined thickness of 75 μm until the thickness of the formed adhesive layer became 50 μm. On the obtained coating film is adheredThe surface-treated surface of a release film (light release film) having a predetermined thickness of 50 μm. The coating film sandwiched by the release film was irradiated with UV light by a parallel exposure machine (ORC MANUFACTURING CO., LTD., model: EXM-1172B-00) until the irradiation energy became 3J/cm²Thereby obtaining a double-sided adhesive sheet.

[ example 11 ]

Example 11 a touch panel was produced in the same manner as in example 5, except that the adhesive B was used only to produce the 1 st transparent insulating layer and the 2 nd transparent insulating layer.

[ example 12 ]

Example 12 a touch panel was produced in the same manner as in example 6, except that the adhesive B was used only to produce the 1 st transparent insulating layer and the 2 nd transparent insulating layer.

[ example 13 ]

Example 13 was a touch panel prepared in the same manner as in example 7, except that the touch panel was prepared in the same manner as in example 7, except that the adhesive B was used only to prepare the 1 st transparent insulating layer and the 2 nd transparent insulating layer.

[ example 14 ]

Example 14 was a touch panel prepared in the same manner as in example 8, except that the touch panel was prepared in the same manner as in example 8, except that the adhesive B was used only to prepare the 1 st transparent insulating layer and the 2 nd transparent insulating layer.

[ example 15 ]

Example 15 was a touch panel prepared in the same manner as in example 9, except that the touch panel was prepared in the same manner as in example 9, except that the adhesive B was used only to prepare the 1 st transparent insulating layer and the 2 nd transparent insulating layer.

< method for producing adhesive C >

The adhesive C was produced in the same manner as the adhesive B except that the adhesive was produced using 2-amino-5-mercapto-1, 3, 4-thiadiazole as the metal stabilizer instead of 2-mercaptobenzothiazole, as compared with the method for producing the adhesive B.

[ example 16 ]

Example 16 was a touch panel produced in the same manner as in example 13, except that the touch panel was produced in the same manner as in example 13, except that the adhesive C was used only to produce the 1 st transparent insulating layer and the 2 nd transparent insulating layer.

< method for producing adhesive D >

Adhesive D was produced in the same manner as adhesive B, except that it was different from the method for producing adhesive B only in that 2-mercaptobenzothiazole was not used. Adhesive D contains no metal stabilizer.

[ example 17 ]

Example 17 was a touch panel produced in the same manner as in example 13, except that the touch panel was produced in the same manner as in example 13, except that the adhesive D was used only to produce the 1 st transparent insulating layer and the 2 nd transparent insulating layer. The 1 st and 2 nd transparent insulating layers of example 17 do not contain a metal stabilizer.

[ comparative example 2]

Comparative example 2 a touch panel was produced in the same manner as in comparative example 1, except that the adhesive B was used only to produce the 1 st transparent insulating layer and the 2 nd transparent insulating layer, as compared with comparative example 1.

In example 2, a thermal shock test was performed on each of the obtained touch panels under the following conditions, and the resistance change of the active region before and after the thermal shock test was evaluated by the method shown in the foregoing example 1.

In the thermal shock test, the temperature was changed alternately to-45 ℃ and 85 ℃, the holding time for each temperature was set to 45 minutes, and the time required for changing the temperature was set to about 2 minutes, and the temperature change was repeated for 100 cycles. The results are shown in table 2 below.

In example 2, the thermal shock test was also performed on example 1, examples 5 to 9, and comparative example 1 of example 1, and the change in resistance of the active region before and after the thermal shock test was evaluated by the method shown in example 1. The results are shown in table 2. In examples 1,5 to 17 and comparative examples 1 and 2, examples containing no metal stabilizer are listed as "-" in the column of the metal stabilizer in table 2 below.

[ Table 2]

As shown in table 2, examples 1 and 5 to 17 can obtain better results with respect to the change in the resistance of the active region than comparative examples 1 and 2.

As shown in example 1 and examples 5 to 17, even when the sealing layer of the present invention was used, a change in resistance was observed before and after the thermal shock test depending on the type of the sealing layer material, whereas a change in resistance before and after the thermal shock test was improved by using a metal stabilizer for the transparent insulating layer.

Description of the symbols

10-touch panel, 12-conductive film, 13-controller, 14-image display module, 14 a-display surface, 14 b-back surface, 14 c-side surface, 15-1 st transparent insulating layer, 16-cover portion, 16 a-surface, 16 b-back surface, 17-2 nd transparent insulating layer, 18-decorative layer, 19-flexible circuit board, 20-detection portion, 20 c-end portion, 22-extraction wiring portion, 22 b-end portion, 23-extraction wiring, 25-flexible substrate, 25 a-surface, 25 b-back surface, 25 c-outer edge, 25 d-space, 26-external connection terminal, 27-bending portion, 29-protruding portion, 30-1 st detection electrode, 31-interval, 32-2 nd detection electrode, 33-fine metal wire, 34-detection electrode, 35-opening, 36-sealing layer, 36 a-end, 36 c-end, 50-conductive wire, 52-adhesive, 54-metal part, 60-laminate for touch panel, 100-touch panel, 102, 103-conductive film, 104-substrate, 104 c-outer edge, 105-region, B-region₁1 st extraction wiring region, B₂-2 nd peripheral wiring region, B₃-a 3 rd peripheral wiring region, B₄-4 th peripheral wiring region, Bf-bending position, Dc-range, Df-frame portion, Ds-frameRegion, Dt-stacking direction, Dw-direction orthogonal to stacking direction, E₁-an input area, E₂-an outer region.

Claims

1. A touch panel comprising an image display module, a1 st transparent insulating layer, a conductive film, a 2 nd transparent insulating layer, and a cover portion, which are laminated in this order, wherein the conductive film is disposed on the display surface side of the image display module,

the conductive film has a detection section composed of a conductive layer and a lead-out wiring section having one end electrically connected to the detection section and the other end connected to an external connection terminal, on at least one surface of a transparent flexible substrate,

the conductive film has a bent portion where the conductive film is bent at a predetermined bending position and the external connection terminal is disposed on a side of the image display module opposite to the display surface side,

the side surface of the 2 nd transparent insulating layer and the bent portion of the conductive film, which are orthogonal to the lamination direction, are covered with a sealing layer.

2. The touch panel according to claim 1,

the end of the sealing layer is in contact with the covering section and the surface of the image display module on the side opposite to the display surface.

3. The touch panel according to claim 1 or 2,

the sealing layer is composed of an adhesive layer having electrical insulation.

4. The touch panel according to any one of claims 1 to 3,

the gas permeability of the sealing layer as measured by gas chromatography was 10^-2g/m²The day is less.

5. The touch panel according to any one of claims 1 to 4,

the flexible base material has a strip-shaped protruding portion, and the extraction wiring portion is provided on the protruding portion.

6. The touch panel according to any one of claims 1 to 5,

at least one of the 1 st transparent insulating layer and the 2 nd transparent insulating layer includes a metal stabilizer.

7. The touch panel according to claim 6,

the metal stabilizer comprises: a compound selected from compounds having a mercaptothiazole skeleton or a mercaptothiadiazole skeleton, or salts thereof.

8. A touch panel comprising an image display module, a1 st transparent insulating layer, a conductive layer and a 2 nd transparent insulating layer laminated in this order, wherein the conductive layer is disposed on the display surface side of the image display module,

9. The touch panel according to claim 8,

10. A method for manufacturing a touch panel in which an image display module, a1 st transparent insulating layer, a conductive film, a 2 nd transparent insulating layer, and a cover are laminated in this order, and the conductive film is arranged on the display surface side of the image display module,

the method for manufacturing the touch panel comprises the following steps:

a step of bending the conductive film at a predetermined bending position to dispose the external connection terminal on a side of the image display module opposite to the display surface side; and

and a step of forming a sealing layer that covers a side surface of the 2 nd transparent insulating layer and a bent portion in a direction orthogonal to the lamination direction, and at the bent portion, the conductive film is bent at a predetermined bending position so that the external connection terminal is disposed on a side opposite to the display surface side of the image display module.

11. The method of manufacturing a touch panel according to claim 10,

the sealing layer is formed by any one of a pasting method, a sputtering method, an evaporation method, a spray method, and a dropping method.