WO2019208125A1 - Touch sensor and touch panel - Google Patents

Touch sensor and touch panel Download PDF

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Publication number
WO2019208125A1
WO2019208125A1 PCT/JP2019/014637 JP2019014637W WO2019208125A1 WO 2019208125 A1 WO2019208125 A1 WO 2019208125A1 JP 2019014637 W JP2019014637 W JP 2019014637W WO 2019208125 A1 WO2019208125 A1 WO 2019208125A1
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WO
WIPO (PCT)
Prior art keywords
base
touch sensor
group
touch
silver halide
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Application number
PCT/JP2019/014637
Other languages
French (fr)
Japanese (ja)
Inventor
大悟 澤木
遠藤　靖
浩行 小林
Original Assignee
富士フイルム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 富士フイルム株式会社 filed Critical 富士フイルム株式会社
Priority to JP2020516158A priority Critical patent/JPWO2019208125A1/en
Publication of WO2019208125A1 publication Critical patent/WO2019208125A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to a foldable touch sensor and a touch panel having the touch sensor, and in particular, a foldable touch sensor and a touch panel having a configuration in which one sensor sheet for detecting contact of a finger, a touch pen, or the like is provided on two substrates.
  • a foldable touch sensor and a touch panel having a configuration in which one sensor sheet for detecting contact of a finger, a touch pen, or the like is provided on two substrates.
  • Patent Document 1 there is a touch panel using a thin metal wire.
  • the touch panel of patent document 1 is a capacitance sensor (including a base material, a plurality of Y electrode patterns, a plurality of X electrode patterns, a plurality of jumper insulating layers, a plurality of jumper wirings, and a transparent insulating layer). Touch sensor, input device).
  • Each of the plurality of Y electrode patterns has a substantially rhombus shape, and is arranged in a matrix along the X direction and the Y direction on the surface of the substrate so that the vertices face each other.
  • the mesh is formed by intersecting two kinds of fine metal wires inclined in line symmetry with the Y direction as the center in a lattice shape.
  • the plurality of X electrode patterns have substantially the same rhombus shape as the Y electrode pattern.
  • an electronic device including a touch panel for example, a tablet computer, a smartphone, or the like
  • a touch panel for example, a tablet computer, a smartphone, or the like
  • it is necessary to increase the screen size of the electronic device and the electronic device is increased in size.
  • development of the electronic device in a folding form is progressing.
  • U.S. Patent No. 6,057,037 shows an electronic device that uses three separate touch screen displays that can be mechanically connected and folded and used individually or together.
  • the electronic device of Patent Document 2 can expand the display area, other expansion, for example, the side surface of the display area cannot be used as the sensing area.
  • An object of the present invention is to provide a touch sensor and a touch panel capable of solving the problems based on the above-described conventional technology and extending a sensing area in addition to an expansion of a display area.
  • the present invention is provided on two bases that face each other and that are swingably connected, the surfaces of the two bases, and the connected side faces.
  • the two substrates have a sensor sheet for detecting contact, and in the state where the sensor sheet is provided, the two substrates face each other, and the surfaces of the two substrates are positioned on the same plane.
  • a touch sensor is provided that is in a first state and a second state in which the back surfaces of two substrates face each other.
  • the two bases are each provided with a notch on the connected side surface on the side opposite to the side where the sensor sheet is provided in the first state, along a side perpendicular to the opposing direction of the side surfaces. It is preferable.
  • the surface of the substrate on which the sensor sheet is provided and the connected side surface are bonded to the sensor sheet by an adhesive layer, respectively, and the adhesive force of the adhesive layer is different from the surface of the substrate and the connected side surface. Is preferred.
  • the sensor sheet is provided with a protective layer between the substrate and the protective layer.
  • the protective layer preferably has an elastic modulus of 10 MPa or more and 9.8 GPa or less.
  • the upper limit of the elastic modulus is more preferably 5.0 GPa or less, and still more preferably 3.0 GPa or less.
  • an adhesive layer is provided in addition to the corner where the surface and side surface of the substrate intersect.
  • the adhesive layer provided at the corner portion where the surface and the side surface of the substrate cross each other is preferably thinner than the adhesive layer provided on the surface and the side surface of the substrate.
  • the two bases are swingably connected by a hinge member.
  • substrates are comprised by the plate-shaped member.
  • the present invention provides a touch panel having a touch sensor and a base having a display unit. Moreover, this invention provides the touch panel which has a touch sensor and the display part provided in the back surface of the base
  • the present invention it is possible to provide a touch sensor and a touch panel in which the sensing area is expanded in addition to the display area.
  • the temperature includes an error range generally allowed in the corresponding technical field unless otherwise specified. Further, “entire surface” and the like include an error range generally allowed in the corresponding technical field.
  • transparent means that the light transmittance is 40% or more, preferably 80% or more, more preferably 90% or more in the visible light wavelength range of 380 to 780 nm. The light transmittance is measured by using “Plastics—Determination of total light transmittance and total light reflectance” defined in JIS (Japanese Industrial Standard) K 7375: 2008.
  • the touch panel is used for electronic devices such as portable information communication terminals such as smartphones, personal computers, and tablet PCs (personal computers).
  • the touch panel has a foldable configuration and includes, for example, a touch sensor 18 (see FIG. 1) and a display unit 20 (see FIG. 6).
  • the touch panel will be specifically described.
  • FIG. 1 is a schematic perspective view showing a first state of the touch panel according to the embodiment of the present invention
  • FIG. 2 is a schematic perspective view showing a second state of the touch panel according to the embodiment of the present invention.
  • the touch panel 10 shown in FIG. 1 shows an expanded state, and the display area is the widest state.
  • the touch panel 10 can be folded as shown in FIG. 2, and can also be in the middle of folding as shown in FIG.
  • the touch sensor 18 detects contact of a finger, a touch pen, and the like.
  • the touch sensor 18 is used to use an image or the like displayed on the display unit 20 as an operation button or the like, and constitutes a part of a user interface.
  • One sensor sheet 16 is used for the above-described contact detection.
  • the touch sensor 18 has two substrates, and includes, for example, a first substrate 12 and a second substrate 14.
  • the touch sensor 18 is composed of at least two substrates, and may be composed of three or more substrates.
  • the 1st base 12 and the 2nd base 14 are constituted by a rectangular plate-shaped member, for example.
  • the first base 12 and the second base 14 have the same shape and size, that is, they are congruent.
  • the first base 12 and the second base 14 are connected to each other so that the side surfaces 12b and 14b face each other and can swing. That is, the first base 12 and the second base 14 are connected to each other so that the side faces 12b and 14b abut each other and can swing.
  • the connection method of the first base 12 and the second base 14 is not particularly limited as long as it can swing.
  • the first base 12 and the second base 14 are swingably connected by a hinge member (not shown). The By making the first substrate 12 and the second substrate 14 swingable, the side surfaces 12b and 14b of the first substrate 12 and the second substrate 14 face each other as shown in FIG.
  • the first state in which the surface 12a of the first base 12 and the surface 14a of the second base 14 are located on the same plane can be achieved. That is, the surface 12a of the first base 12 and the surface 14a of the second base 14 can be made flat.
  • the first state is a state in which the first base 12 and the second base 14 are expanded.
  • the surface 12a of the first base 12 and the surface 14a of the second base 14 can be in a second state in which their back surfaces are opposed to each other.
  • the second state is a state in which the first base 12 and the second base 14 are folded. In other words, it has two base bodies and one sensor sheet for detecting contact, and the two base bodies are connected to each other so as to face each other and to be swingable.
  • the two bases face each other, and the surfaces of the two bases are flush with each other, with the sensor sheet provided on the side faces connected to the surfaces of the two bases. It is the touch sensor which will be in the 2nd state where the 1st state located and the mutual back surface of two said base
  • Both the first base 12 and the second base 14 constitute the touch sensor 18, and constitute the appearance of the touch sensor 18 and the touch panel 10. Further, the first base 12 and the second base 14 support the sensor sheet 16. For this reason, it is preferable that the first base 12 and the second base 14 are transparent so that an image displayed on the display unit 20 disposed below the sensor sheet 16 can be visually recognized. . As will be described later, when the display unit 20 (see FIG. 6) is provided on the first base 12 and the second base 14, it also functions as a storage unit for the display unit 20. In this case, the first base 12 and the second base 14 have electrical insulation.
  • the first substrate 12 and the second substrate 14 are appropriately configured according to the specifications of the touch sensor 18 and the touch panel 10, and may have a configuration including an optical function layer such as an antireflection layer and a polarizing layer, for example.
  • the first base 12 and the second base 14 are not limited to the same size, and may be different.
  • the first base 12 and the second base 14 may be different from each other. Either one of the widths may be narrow.
  • the sizes of the first base 12 and the second base 14 are appropriately determined according to the application and design.
  • One sensor sheet 16 is provided on the surfaces of the two base bodies and the connected side surfaces, and the sensor sheet 16 is also disposed at the connection portion between the first base body 12 and the second base body 14.
  • the sensor sheet 16 is electrically connected to an external connection terminal (not shown) provided on the first base 12 or the second base 14 by, for example, a lead wiring (not shown) provided on an FPC (flexible printed circuit board). Connected.
  • the external connection terminal is for electrically connecting a sensor (not shown) that detects a position touched by the sensor sheet 16 and the sensor sheet 16.
  • the arrangement position of the external connection terminal is not particularly limited, and is, for example, the inside or back surface 12d of the first base 12 or the inside or back surface 14d of the second base 14.
  • FIG. 4 is a schematic cross-sectional view showing the connection portion in a state where the touch panel of the embodiment of the present invention is folded
  • FIG. 5 is a schematic view showing the connection portion in a state where the touch panel of the embodiment of the present invention is opened.
  • FIG. 4 corresponds to the second state shown in FIG. 2
  • FIG. 5 corresponds to the first state shown in FIG.
  • the two base bodies of the first base body 12 and the second base body 14 are opposite to the side where the sensor sheet 16 is provided in the first state shown in FIG. 1 and FIG.
  • notches 12c and 14c are provided along side portions extending in a direction DL perpendicular to the abutting direction DW between the side surfaces 12b and 14b.
  • the side face 12b of the first base 12 is provided with a triangular notch 12c on the back face 12d side
  • the side face 14b of the second base 14 is provided with a triangular notch on the back face 14d side.
  • 14c is provided.
  • the shape of the notch 12c and the notch 14c is not specifically limited, A square or circular arc may be sufficient besides the above-mentioned triangle.
  • the sensor sheet 16 is bonded to the surface 12a and the side surface 12b of the first base 12 and the surface 14a and the side surface 14b of the second base 14 by, for example, an adhesive layer (not shown). Is provided.
  • the sensor sheet 16 is not bonded to the notches 12c and 14c. Thereby, the followability with respect to the swinging of the first base 12 and the second base 14 is improved, and the first base 12 and the second base 14 can be easily spread and folded.
  • the touch sensor 18 in the first state shown in FIG. 5, a space is formed by the notch 12c and the notch 14c, and a part of the sensor sheet 16 not bonded to the notches 12c and 14c is disposed in the space. It is not caught.
  • the notch 12c of the first base 12 and the notch 14c of the second base 14 suppress the pinching of the sensor sheet 16 and suppress the occurrence of sensor failure.
  • an image without distortion can be displayed.
  • the first base 12 and the second base 14 are attached to the first base 12 and the second base 14 with the single sensor sheet 16 provided on the first base 12 and the second base 14.
  • the first state shown in FIGS. 1 and 5 and the second state shown in FIGS. 2 and 4 can be obtained. That is, the first base 12 and the second base 14 can be folded or spread with the single sensor sheet 16 provided. In any state, the sensor sheet 16 is always disposed outside. For this reason, it can be used as the touch sensor 18 even in a folded state. In addition, since the side surface can be used as the touch sensor 18, the sensing area can be expanded. Note that the touch sensor 18 can be in the state shown in FIG. 3 as described above.
  • the number of lead-out wires (not shown) that electrically connect the sensor sheet 16 to external connection terminals (not shown) can be reduced, and the apparatus configuration is simplified.
  • the layout of the lead wires is highly flexible.
  • the controller (not shown) for detecting the position touched by the sensor sheet 16 can also be simplified in configuration as compared with the case where a plurality of sensor sheets are used.
  • the touch panel 10 includes a display unit 20 on the back surface 12 d of the first base 12 of the touch sensor 18 and a display unit 20 on the back surface 14 d of the second base 14. .
  • the display unit 20 is positioned inside in a folded state.
  • an optical functional layer for enlarging the image on the first base 12 and the second base 14 is provided. It may be provided.
  • the display unit 20 is provided for each base, and the display unit 20 itself is not bent.
  • the display unit 20 is not particularly limited, and includes a display area (not shown) for displaying an image or the like, and is configured by, for example, a liquid crystal display panel or an organic EL (Organic electroluminescence) display panel.
  • the display unit 20 can use a vacuum fluorescent display (VFD), a plasma display panel (PDP), a surface electric field display (SED), a field emission display (FED), electronic paper, and the like in addition to the above-described ones.
  • VFD vacuum fluorescent display
  • PDP plasma display panel
  • SED surface electric field display
  • FED field emission display
  • one display unit 20 may be provided on the back surface 12 d of the first base 12 and the back surface 14 d of the second base 14.
  • a display that can be bent and can display an image or the like such as a flexible OLED (Organic Light Emitting Diode) display is used.
  • the control unit that controls the image display of the display unit 20 can be simplified, and the display control of an image across a plurality of screens can be facilitated.
  • the display unit 20 is not limited to the configuration in which the display unit 20 is provided on the back surface 12d of the first base 12 and the back surface 14d of the second base 14.
  • the display unit 20 may be provided inside the first base 12 and the display unit 20 may be provided inside the second base 14.
  • the touch panel 10 can be in the first state shown in FIG. 1 and the second state shown in FIG. 2 in the same manner as the touch sensor 18 with the display unit 20 provided.
  • the surface 12a of the first base 12 and the surface 14a of the second base 14 each function as a display screen for images and the like, and the touch panel 10 has two screens.
  • the touch panel 10 can use a display area for two screens in an expanded state. In this case, since it can be made flat as described above, when an image or the like is displayed on the display unit 20 and a content straddling two screens is displayed, an image without distortion can be displayed. The touch operation can be smoothly performed even when the touch operation is performed over the two, and the operability is good. Furthermore, the touch panel 10 displays an image or the like on the display unit 20 so that the content can be displayed on the outside even in a folded state, and the side surface is used as a sensing region in the same manner as the touch sensor 18 described above. be able to.
  • FIG. 9 is a schematic cross-sectional view showing a first example of the configuration of the sensor sheet of the touch sensor according to the embodiment of the present invention
  • FIG. 10 shows a second configuration of the sensor sheet of the touch sensor according to the embodiment of the present invention
  • FIG. 11 is a schematic cross-sectional view showing a third example of the configuration of the sensor sheet of the touch sensor according to the embodiment of the present invention. 9 to 11 all show the second state, which corresponds to FIG.
  • the sensor sheet 16 includes a touch sensor unit 30, a first adhesive layer 32 on the touch sensor unit 30, a first protective layer 34 on the first adhesive layer 32, and a touch sensor unit.
  • the sensor sheet 16 is a laminated structure having a second adhesive layer 36 below 30 and a second protective layer 38 below the second adhesive layer 36.
  • the sensor sheet 16 is arranged with the second protective layer 38 facing the first base 12 and the second base 14.
  • the sensor sheet 16 is provided with a second protective layer 38 between the first base 12 and the second base 14.
  • the sensor sheet 16 may have a total light transmittance of at least 40%, preferably 80% or more, and more preferably 90% or more.
  • the total light transmittance is measured using, for example, “Plastics—How to obtain total light transmittance and total light reflectance” defined in JIS K 7375: 2008.
  • the first pressure-sensitive adhesive layer 32 and the second pressure-sensitive adhesive layer 36 are both optically transparent and insulating, and the configuration thereof is not particularly limited as long as a stable fixing force can be exhibited. Absent.
  • Examples of the first adhesive layer 32 and the second adhesive layer 36 include optically transparent resins (OCR, Optical, such as optically transparent adhesive (OCA, Optical Clear Adhesive) and UV (Ultra Violet) cured resin). Clear Resin) can be used, for example, 8146-4 (product number) manufactured by 3M Corporation.
  • the 1st protective layer 34 and the 2nd protective layer 38 play the role which protects the touch sensor part 30 from an external environment, and are comprised by the transparent member.
  • the first protective layer 34 and the second protective layer 38 are, for example, at least one of polyimide (PI), polyamide (PA), polyethylene terephthalate (PET), triacetyl cellulose (TAC), and cycloolefin copolymer (COC). It is preferable to be composed of two.
  • the first protective layer 34 and the second protective layer 38 preferably have an elastic modulus of 10 MPa or more and 9.8 GPa or less.
  • the upper limit of the elastic modulus is more preferably 5.0 GPa or less, and still more preferably 3.0 GPa or less.
  • the sensor sheet 16 is bonded to the surface 12a of the first base 12 and the surface 14a of the second base 14 by the first adhesive layer 40, and the side surface 12b of the first base 12 is Each of the side surfaces 14 b of the base body 14 is bonded by a second adhesive layer 42.
  • the first adhesive layer 40 and the second adhesive layer 42 have different adhesive forces, and the second adhesive layer 42 used for adhesion between the side surface 12b and the side surface 14b is used for adhesion between the surface 12a and the surface 14a. It is preferable that the adhesive force is greater than that of the one adhesive layer 40. Thereby, the followability with respect to the oscillation of the first base 12 and the second base 14 is further improved.
  • adhesive force is prescribed
  • the peeling force can be measured using a JIS Z0237: 2009 adhesive tape / adhesive sheet test method.
  • the sensor sheet 16 is not limited to the configuration illustrated in FIG. 9, and may be configured to provide the protective layers 39 on both surfaces of the touch sensor unit 30 as illustrated in FIG. 10.
  • the protective layer 39 is not particularly limited as long as it is optically transparent and has an insulating property.
  • the sensor sheet 16 is provided with a protective layer 39 on the entire surface of the touch sensor unit 30, and a protective layer 39 is provided between the lower surface of the touch sensor unit 30 and the second adhesive layer 42. But you can. In this case, the first adhesive layer 40 and the touch sensor unit 30 may be in direct contact, and the second adhesive layer 42 and the touch sensor unit 30 may be in direct contact.
  • the protective layer 39 is, for example, an air urethane clear (trade name) (manufactured by Isamu Paint Co., Ltd.) or GSI Creos Mr. It can be formed by spray coating using top coat spray gloss (trade name) (manufactured by GSI Creos Co., Ltd.).
  • FIG. 12 is a schematic cross-sectional view showing a first example of the sensor sheet adhesion form of the touch sensor according to the embodiment of the present invention
  • FIG. 13 is a diagram of the sensor sheet adhesion form of the touch sensor according to the embodiment of the present invention.
  • FIG. 14 is a schematic cross-sectional view showing an example of 2
  • FIG. 14 is a schematic cross-sectional view showing a third example of the adhesive form of the sensor sheet of the touch sensor according to the embodiment of the present invention.
  • the surface 12a of the first base 12 and the surface 14a of the second base 14 are bonded by the first adhesive layer 40, and the side surface 12b of the first base 12 is The side surface 14 b of the second substrate 14 is bonded by the second adhesive layer 42.
  • the first adhesive layer 40 is provided up to the side surface 12b
  • the second adhesive layer 42 is provided up to the surface 12a
  • the bonding form is not limited to the configuration shown in FIG.
  • the first adhesive layer 40 may be provided up to the second adhesive layer 42, and the first adhesive layer 40 may have a thin thickness at the corner portion 17.
  • the second adhesive layer 42 may be provided up to the first adhesive layer 40, and the second adhesive layer 42 may have a thin thickness at the corner portion 17.
  • the configuration of the touch sensor will be described.
  • 15 to 17 are schematic sectional views showing other examples of the configuration of the touch sensor according to the embodiment of the present invention.
  • the first base 12 and the second base 14 are not limited to the rectangular plate-like members shown in FIGS. 1 to 3 described above.
  • the end surface 12e opposite to the side surface 12b of the twelve and the end surface 14e opposite to the side surface 14b of the second base 14 may be formed of a curved surface.
  • the end surface 12e of the first base 12 and the end surface 14e of the second base 14 are connected to the sensing unit as compared with the rectangular plate-shaped member shown in FIGS.
  • the sensing unit and the display area can be expanded.
  • the side surface 12b of the first base 12 and the end surface 12e opposite to the side surface 12b may be configured by curved surfaces.
  • the side surface 14b of the second base 14 and the end surface 14e opposite to the side surface 14b may be configured by curved surfaces.
  • the sensing unit and the display area can be expanded as described above.
  • the sensor sheet 16 may be provided up to the end surface 12e of the first base 12 and the end surface 14e of the second base 14 in the configuration of the touch sensor 18 shown in FIGS. Good.
  • the end surface 12e of the first base 12 and the end surface 14e of the second base 14 can be used as the sensing unit, and the sensing area can be expanded. .
  • the sensor sheet 16 is made up of the end surface 12 e and the back surface 12 d of the first base 12 and the end face of the second base 14 in the configuration of the touch sensor 18 shown in FIGS. 1 to 3. 14e and back surface 14d may be provided.
  • the end surface 12e and the back surface 12d of the first base 12 and the end surface 14e and the back surface 14d of the second base 14 can be used as sensing units.
  • the sensing area can be further expanded. In the configuration shown in FIG.
  • the display unit 20 has the first base 12 as shown in FIG. It is preferable that the structure is provided inside the second base 14. Further, in FIG. 19, the sensor sheet 16 is not configured to cover the entire back surface 12d of the first base 12 and the entire back surface 14d of the second base 14, but the entire back surface 12d of the first base 12 The sensor sheet 16 may cover the entire back surface 14d of the second base 14.
  • the display unit 20 that is capable of displaying an image or the like on the front side and the back side is provided on the first base 12 and the second base 14 to constitute the touch panel 10, so that the content is displayed in a folded state. Can be displayed, and the content can be displayed on both sides of the touch panel 10 even in the open state. Even in this configuration, the sensing area and the display area can be expanded.
  • FIG. 20 is a schematic perspective view showing a first state of another example of the touch panel according to the embodiment of the present invention
  • FIG. 21 is a schematic view showing a second state of another example of the touch panel according to the embodiment of the present invention.
  • FIG. FIG. 22 is a schematic diagram illustrating an example of a sensor sheet used in another example of the touch panel according to the embodiment of the present invention. 20 to 22, the same components as those of the touch panel 10 shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the touch panel 10 shown in FIGS. 20 and 21 can use all surfaces other than the back surface 12d of the first base 12 as a sensing unit, as compared with the touch panel 10 shown in FIGS. 2 except that all surfaces other than the back surface 14d of the base 14 can be used as a sensing unit, and the other configurations are the same as those of the touch panel 10 shown in FIGS.
  • the side surfaces 12b, 12f, 12g and the end surface 12e of the first base 12 can be used as sensing units, and the side surfaces 14b, 14f, 14g and the end surface 14e of the second base 14 are used. Can be used as a sensing unit.
  • the sensor sheet 16 is composed of a single sheet. For example, as shown in FIG. 22, a cutout portion 19 is provided.
  • the cutout 19 forms regions that cover the side surfaces 12b, 12f, 12g and the end surface 12e of the first base 12 and the side surfaces 14b, 14f, 14g and the end surface 14e of the second base 14.
  • the region 16a of the sensor sheet 16 is a region corresponding to the end surface 12e of the first base 12
  • the region 16b is a region corresponding to the side surface 12f
  • the region 16c is a region corresponding to the side surface 12g.
  • the region 16d of the sensor sheet 16 is a region corresponding to the end surface 14e of the second base 14, the region 16e is a region corresponding to the side surface 14f, and the region 16f is a region corresponding to the side surface 14g.
  • the region 16g is a region corresponding to the side surface 12b of the first base 12 and the side surface 14b of the second base 14.
  • the touch panel 10 can realize the expansion of the sensing area by using the surface and side surfaces as sensing areas.
  • the touch panel 10 shown in FIG. 20 and FIG. 21 as well by displaying an image or the like on the display unit 20 (not shown), the content can be displayed in a folded state or in an open state, and all the sides and all are displayed. Can be used as a sensing region.
  • any touch sensor 18 and touch panel 10 described above have the first base 12 and the second base 14, the present invention is not limited thereto.
  • a plurality of touch sensors 18 may be connected in the butting direction DW (see FIGS. 1 and 20) to form the touch panel 10.
  • one sensor sheet 16 may be provided for each touch sensor 18, or one sensor sheet 16 may be provided for all of the plurality of connected touch sensors 18.
  • the touch sensor unit 30 may be a capacitance type or a resistance film type.
  • a controller (not shown) for detecting the position touched by the touch sensor unit 30, a controller corresponding to the touch sensor unit 30 is appropriately used. If the touch sensor unit 30 is a capacitance type, the position where the capacitance has changed is detected by a controller (not shown), and the touched position is specified. If the touch sensor unit 30 is a resistive film type, the position where the resistance has changed is detected by a controller (not shown), and the touched position is specified.
  • the touch sensor unit 30 will be described using a capacitive touch sensor as an example, but the configuration of the touch sensor unit 30 is not limited to the one described below.
  • the touch sensor unit 30 is formed on a support body 50 having electrical insulation, detection electrodes formed on both surfaces of one support body 50, and the periphery of the detection electrodes. And a peripheral wiring electrically connected to the detection electrode.
  • the detection electrode corresponds to a conductive layer.
  • a plurality of first detection electrodes that extend along the first direction Y on the surface 50a (see FIG. 24) of the support 50 and are arranged in parallel in the second direction X orthogonal to the first direction Y.
  • the plurality of first detection electrodes 52 and the plurality of second detection electrodes 54 are electrically insulated by the support body 50 and are spaced apart from each other and are partially overlapped.
  • the support 50 functions as an insulating layer that electrically insulates at least two conductive layers, and is a form of the insulating layer.
  • a region where the plurality of first detection electrodes 52 and the plurality of second detection electrodes 54 overlap each other in plan view is a detection region 57.
  • the detection area 57 is an area in which contact with a finger or the like can be detected. Note that the size, shape, and the like of the detection region 57 of the touch sensor unit 30 are appropriately determined depending on where the sensor sheet 16 is provided, and are not limited to the detection region 57 shown in FIG. 23 described above. .
  • the first detection electrode 52 is composed of, for example, a conductive line 60 formed on the surface 50 a of the support 50.
  • a first adhesive layer 32 that covers the first detection electrode 52 is provided.
  • the conductive lines 60 of the first detection electrodes 52 are arranged in a diamond mesh pattern as shown in FIG.
  • the second detection electrode 54 is constituted by, for example, a conductive line 60 formed on the back surface 50 b of the support body 50.
  • a second adhesive layer 36 that covers the second detection electrode 54 is provided.
  • the conductive lines 60 of the second detection electrodes 54 are arranged in a diamond mesh pattern as shown in FIG. 25, for example.
  • the first detection electrode 52 and the second detection electrode 52 are formed even when the support 50 contracts. Deviations in the positional relationship with the detection electrode 54 can be reduced.
  • the mesh pattern of the conductive wire 60 is not limited to the above rhombus, and examples of the mesh pattern include triangles such as regular triangles, isosceles triangles, right triangles, squares, rectangles, rhombuses, parallelograms, trapezoids, and the like.
  • the mesh of a mesh pattern intends the shape containing the some square-shaped opening part 62 comprised by the electrically conductive wire 60 which cross
  • the length Pa of one side of the opening 62 is not particularly limited, is preferably 1500 ⁇ m or less, more preferably 1300 ⁇ m or less, further preferably 1000 ⁇ m or less, preferably 5 ⁇ m or more, more preferably 30 ⁇ m or more, and 80 ⁇ m. The above is more preferable.
  • the length of the side of the opening 62 is in the above-mentioned range, it is possible to further maintain the transparency, and when the conductive film is mounted on the display surface of the display unit, the display is performed without a sense of incongruity. Can be visually recognized.
  • the aperture ratio of the mesh pattern formed by the conductive wire 60 is preferably 85% or more, more preferably 90% or more, and still more preferably 95% or more.
  • the aperture ratio corresponds to the ratio of the area on the support excluding the area where the conductive wire 60 is present to the whole.
  • the touch sensor unit 30 is not limited to the configuration shown in FIG. 24, and may have the configuration of the touch sensor unit 30a shown in FIG. Compared to the touch sensor unit 30 shown in FIG. 24, the touch sensor unit 30 a shown in FIG. 27 uses an insulating layer 58 instead of the support 50, and the insulating layer 58 and the first detection electrode 52 are connected to the second sensor electrode 30.
  • the detection electrode 54 is electrically insulated and spaced apart.
  • a second detection electrode 54 is formed on the second protective layer 38.
  • the first detection electrode 52 is different in that it is formed on the surface 58 a of the insulating layer 58.
  • a first adhesive layer 32 that covers the first detection electrode 52 is provided.
  • a second adhesive layer 36 is provided on the back surface 58 b of the insulating layer 58.
  • the touch sensor unit 30a illustrated in FIG. 27 can obtain the same effects as the touch sensor unit 30 illustrated in FIG.
  • the type of the support is not limited as long as the first detection electrode 52 and the second detection electrode 54 can be electrically insulated and spaced apart from each other, and the support is a transparent support. And a plastic sheet is particularly preferable.
  • Specific examples of the material constituting the support include polyethylene terephthalate (PET) (258 ° C.), polycycloolefin (134 ° C.), polycarbonate (250 ° C.), acrylic (128 ° C.), polyethylene naphthalate (PEN) (269 ° C), polyethylene (PE) (135 ° C), polypropylene (PP) (163 ° C), polystyrene (230 ° C), polyvinyl chloride (180 ° C), polyvinylidene chloride (212 ° C), TAC (290 ° C), etc.
  • a plastic film having a melting point of about 290 ° C. or less is preferable, and PET, polycycloolefin, and polycarbonate are particularly preferable. Figures in parentheses are melting points.
  • the total light transmittance of the support is preferably 85% to 100%. The total light transmittance is measured using, for example, “Plastics—How to obtain total light transmittance and total light reflectance” defined in JIS K 7375: 2008.
  • the thickness of the support is not particularly limited, but is generally preferably 25 to 500 ⁇ m.
  • the touch sensor unit also has a function of the touch surface in addition to the function of the support, it can be designed with a thickness exceeding 500 ⁇ m.
  • One preferred embodiment of the support includes a treated support that has been subjected to at least one treatment selected from the group consisting of atmospheric pressure plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment.
  • at least one treatment selected from the group consisting of atmospheric pressure plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment.
  • the conductive wire contains a binder and a metal part dispersed in the binder.
  • the binder described above contains a first polymer and a second polymer having a glass transition temperature lower than that of the first polymer.
  • the glass transition temperature of a polymer means the glass transition temperature measured by the differential scanning calorimetry (DSC) method. The glass transition temperature is measured using a “plastic transition temperature measurement method” defined in JIS K7121 (2012).
  • first polymer and the second polymer examples include hydrophobic polymers (hydrophobic resins), and more specifically, acrylic resins, styrene resins, vinyl resins, polyolefin resins, polyesters. Resin, polyurethane resin, polyamide resin, polycarbonate resin, polydiene resin, epoxy resin, silicone resin, cellulose polymer, and at least one resin selected from the group consisting of chitosan polymers, or And copolymers composed of monomers constituting these resins. Further, the polymer preferably contains a reactive group that reacts with a cross-linking agent described later.
  • the polymer preferably has at least one unit selected from the group consisting of the following formulas A, B, C, and D.
  • the first polymer is preferably a polymer composed of one unit selected from the group consisting of formulas A, B, C, and D from the viewpoint of easy control of the glass transition temperature. More preferred are polymers comprising at least one unit selected from the group consisting of C, C and D, and more preferred are polymers comprising units of the formula D.
  • R 1 represents a methyl group or a halogen atom, preferably a methyl group, a chlorine atom, or a bromine atom.
  • p represents an integer of 0 to 2, preferably 0 or 1, and more preferably 0.
  • R 2 represents a methyl group or an ethyl group, and a methyl group is preferable.
  • R 3 represents a hydrogen atom or a methyl group, and preferably a hydrogen atom.
  • L represents a divalent linking group and is preferably a group represented by the following general formula (2).
  • X 1 represents an oxygen atom or NR 30 —.
  • R 30 represents a hydrogen atom, an alkyl group, an aryl group, or an acyl group, and each may have a substituent (for example, a halogen atom, a nitro group, a hydroxyl group, etc.).
  • R 30 is preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms (eg, methyl group, ethyl group, n-butyl group, n-octyl group, etc.), acyl group (eg, acetyl group, benzoyl group, etc.) It is. Particularly preferred as X 1 is an oxygen atom or NH—.
  • X 2 represents an alkylene group, an arylene group, an alkylene arylene group, an arylene alkylene group, or an alkylene arylene alkylene group, and these groups include —O—, —S—, —OCO—, —CO—, and —COO.
  • R 31 represents a linear or branched alkyl group having 1 to 6 carbon atoms, such as a methyl group, an ethyl group, and an isopropyl group.
  • Preferred examples of X 2 include dimethylene group, trimethylene group, tetramethylene group, o-phenylene group, m-phenylene group, p-phenylene group, —CH 2 CH 2 OCOCH 2 CH 2 —, and —CH 2 CH 2.
  • r represents 0 or 1; q represents 0 or 1, and 0 is preferable.
  • R 4 represents an alkyl group having 1 to 80 carbon atoms, an alkenyl group, or an alkynyl group
  • the first polymer is preferably an alkyl group having 1 to 5 carbon atoms
  • the second polymer has An alkyl group having 5 to 50 carbon atoms is preferable, an alkyl group having 5 to 30 carbon atoms is more preferable, and an alkyl group having 5 to 20 carbon atoms is still more preferable.
  • R 5 is a hydrogen atom, a methyl group, an ethyl group, a halogen atom, or a -CH 2 COOR 6
  • a hydrogen atom, a methyl group, a halogen atom or a -CH 2 COOR 6 is preferably a hydrogen atom, a methyl group Or —CH 2 COOR 6 is more preferred, and a hydrogen atom is particularly preferred.
  • R 6 represents a hydrogen atom or an alkyl group having 1 to 80 carbon atoms, and may be the same as or different from R 4, and R 6 preferably has 1 to 70 carbon atoms, and more preferably 1 to 60 carbon atoms.
  • Another preferred form of the first polymer and 2 is a polymer (copolymer) represented by the following general formula (1) from the viewpoint that moisture can be further prevented from entering.
  • A, B, C, and D each represent the above-described repeating unit.
  • x, y, z, and w represent the molar ratio of each repeating unit.
  • x is 3 to 60 mol%, preferably 3 to 50 mol%, more preferably 3 to 40 mol%.
  • y is 30 to 96 mol%, preferably 35 to 95 mol%, more preferably 40 to 90 mol%.
  • z is 0.5 to 25 mol%, preferably 0.5 to 20 mol%, more preferably 1 to 20 mol%.
  • w is 0.5 to 40 mol%, preferably 0.5 to 30 mol%.
  • the polymer represented by the general formula (1) is preferably a polymer represented by the following general formula (2) or general formula (3).
  • a1, b1, c1, d1, and e1 represent the molar ratio of each monomer unit, a1 is 3 to 60 (mol%), b1 is 30 to 95 (mol%), and c1 is 0.5 To 25 (mol%), d1 represents 0.5 to 40 (mol%), and e1 represents 1 to 10 (mol%).
  • the preferred range of a1 is the same as the preferred range of x described above, the preferred range of b1 is the same as the preferred range of y, and the preferred range of c1 is the same as the preferred range of z described above.
  • the preferred range is the same as the preferred range of w described above.
  • e1 is 1 to 10 mol%, preferably 2 to 9 mol%, more preferably 2 to 8 mol%.
  • the weight average molecular weight of the polymer represented by the general formula (1) is preferably 1,000 to 1,000,000, more preferably 2000 to 750,000, and still more preferably 3000 to 500,000.
  • the polymer represented by the general formula (1) can be synthesized with reference to, for example, Japanese Patent No. 3305459 and Japanese Patent No. 3754745.
  • the glass transition temperatures of the first polymer and the second polymer are not particularly limited, but the glass of the first polymer can be obtained in that a touch sensor unit having a better effect of the present invention can be obtained.
  • a transition temperature 0 degreeC or more is preferable, 25 degreeC or more is more preferable, and it is still more preferable to exceed 40 degreeC.
  • the glass transition temperature of the second polymer is not particularly limited, but is preferably 40 ° C. or less, more preferably 25 ° C. or less, still more preferably less than 25 ° C., particularly preferably 0 ° C. or less, 0 ° C. Less than is most preferred.
  • the lower limit is not particularly limited but is generally preferably ⁇ 50 ° C. or higher.
  • the difference (absolute value) between the glass transition temperature of the first polymer and the glass transition temperature of the second polymer is not particularly limited, but is generally preferably 20 to 100 ° C.
  • the touch sensor unit has a more excellent effect of the present invention.
  • the metal part in a conductive wire is a part which ensures the electroconductive characteristic of a conductive wire, and a metal part is comprised with the metal.
  • the metal constituting the metal part is composed of gold (metal gold), silver (metal silver), copper (metal copper), nickel (metal nickel), and palladium (metal palladium) in that the conductive properties are more excellent. At least one metal selected from the group is preferred. Note that, in FIG. 28, the metal part is in the form of particles and dispersed in the conductive wire. However, the form of the metal part is not limited to the above-described form, and the metal part is layered. It may be a form dispersed in conductive wires. FIG.
  • a conductive wire 60 shown in FIG. 30 includes a binder 70 containing a first polymer and a second polymer, and a plurality of metal parts 72 dispersed in the binder 70.
  • the metal part 72 is particulate as described above.
  • the conductive wire may contain materials other than those described above.
  • materials other than those mentioned above are examples
  • non-metallic fine particles can be mentioned.
  • non-metallic fine particles include resin particles and metal oxide particles, and metal oxide particles are preferred.
  • the metal oxide particles include silicon oxide particles and titanium oxide particles.
  • the average particle diameter of the nonmetallic fine particles is not particularly limited, but the equivalent sphere diameter is preferably 1 to 1000 nm, more preferably 10 to 500 nm, and still more preferably 20 to 200 nm. If it is in the above-mentioned range, a touch sensor part tends to have more excellent transparency, and it is easy to have more excellent electroconductivity.
  • the equivalent sphere diameter of the non-metallic fine particles is an arithmetic average of 50 equivalent sphere diameters calculated using a transmission electron microscope.
  • the shape of the conductive line is not particularly limited, but it is linear (straight line, curved line, and a combination of these) so that better touch position detection performance can be obtained when applied to a touch panel. Is preferred.
  • the line width of the conductive line is not particularly limited, but is preferably 30 ⁇ m or less, more preferably 15 ⁇ m or less, and even more preferably 10 ⁇ m or less, from the viewpoint of the balance between the conductive characteristics of the conductive line and the difficulty of visual recognition. 5 ⁇ m or less is particularly preferable, 4 ⁇ m or less is most preferable, 0.5 ⁇ m or more is preferable, and 1.0 ⁇ m or more is more preferable.
  • the thickness of the conductive wire is not particularly limited, but is preferably 200 ⁇ m or less, more preferably 30 ⁇ m or less, still more preferably 10 ⁇ m or less, and more preferably 0.3 to 5 ⁇ m in terms of balance between thinning and conductive properties. Is particularly preferable, and most preferably 0.5 to 5 ⁇ m.
  • ⁇ Method for manufacturing touch sensor unit> The manufacturing method of a touch sensor part is demonstrated taking the case where the metal part of a conductive wire contains silver (metal silver) as an example. A method having the following steps is preferable in that more excellent productivity can be obtained.
  • -Process A A silver halide-containing coating solution containing at least silver halide and a first polymer and a composition-adjusting coating solution containing at least a second polymer are simultaneously coated on the support, and silver halide is coated.
  • Forming a photosensitive layer -Process B: A step of forming a conductive wire containing metallic silver by exposing the silver halide photosensitive layer to development.
  • step A a silver halide-containing coating solution containing at least a silver halide and a first polymer and a composition-adjusting coating solution containing at least a second polymer are applied simultaneously on the support. And a step of forming a silver halide photosensitive layer.
  • a silver halide-containing coating solution and a composition-adjusting coating solution may be laminated in this order.
  • the composition-adjusting coating solution and the silver halide-containing coating solution may be laminated in this order from the support side.
  • the composition adjustment coating solution, the silver halide-containing coating solution, and the composition adjustment coating solution may be laminated in this order.
  • applying on the support includes the case of applying directly on the surface of the support and the case where a separate layer is disposed on the support and applying on the layer.
  • a silver halide-containing coating solution containing silver halide and a composition-adjusting coating solution not containing silver halide are applied simultaneously, a two-layer coating film formed from both coating solutions The diffusion of components proceeds at the interface. More specifically, a coating film formed from a composition-adjusting coating solution (hereinafter referred to as coating film A) from a silver halide-containing coating solution disposed on a support (hereinafter also referred to as coating film A). Part of the silver halide and the first polymer diffuse in the coating film B).
  • the area on the coating film A side in the coating film B contains silver halide and the first polymer, and the content thereof is the silver halide and the first polymer in the coating film A. Less than the content of.
  • the region on the coating film A side in the coating film B (hereinafter also referred to as “region W”) contains silver halide that has moved from the coating film A. Will form the upper region in the conductive line. At this time, in the region W of the conductive wire, the content ratio of the content of the second polymer to the total amount of the content of the first polymer and the content of the second polymer is larger than that in the intermediate region. Cheap.
  • the silver halide containing coating liquid should just contain a silver halide and a 1st polymer at least, and may further contain a 2nd polymer.
  • the content ratio of the second polymer to the content of the first polymer and the content of the second polymer in the silver halide-containing coating solution is the content of the first polymer in the composition-adjusted coating solution. It is preferable that the mass ratio of the second polymer is smaller than the content of the second polymer.
  • the composition-adjusting coating solution may contain at least the second polymer, and may further contain silver halide and / or the first polymer.
  • the content thereof is not particularly limited, but the content of the silver halide-containing coating solution in the composition-adjusting coating solution is not limited. It is preferred that the silver halide content is lower. By doing so, it is easy to obtain a touch sensor portion with less external light reflection.
  • the composition-adjusting coating solution further contains the first polymer
  • the content ratio of the first polymer to the content of the first polymer and the content of the second polymer in the composition-adjusting coating solution is silver halide. It is preferable that the content ratio of the first polymer to the content of the first polymer and the content of the second polymer in the containing coating solution is smaller than the content ratio.
  • the silver halide contained in the silver halide-containing coating solution is not particularly limited, and a known silver halide can be used.
  • the halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof.
  • silver chloride, silver bromide, or silver halide mainly composed of silver iodide is preferably used, and silver halide mainly composed of silver bromide or silver chloride is preferably used.
  • Silver chlorobromide, silver iodochlorobromide, or silver iodobromide is also preferably used.
  • silver chlorobromide More preferably, it is silver chlorobromide, silver bromide, silver iodochlorobromide, or silver iodobromide, and most preferably silver chlorobromide or iodine salt containing 50 mol% or more of silver chloride.
  • Silver bromide is used.
  • silver halide mainly composed of silver bromide refers to silver halide in which the molar fraction of bromide ions in the silver halide composition is 50% or more.
  • the silver halide grains mainly composed of silver bromide may contain iodide ions and chloride ions in addition to bromide ions.
  • the silver halide is in the form of a solid grain, and the average grain size of the silver halide is preferably 0.1 to 1000 nm (1 ⁇ m), more preferably 0.1 to 300 nm in terms of a sphere equivalent diameter. More preferably, it is -200 nm.
  • the sphere equivalent diameter of silver halide grains is the diameter of grains having the same volume and having a spherical shape.
  • the shape of the silver halide grains is not particularly limited.
  • various shapes such as a spherical shape, a cubic shape, a flat plate shape (hexagonal flat plate shape, triangular flat plate shape, tetragonal flat plate shape, etc.), octahedral shape, and tetrahedral shape are available. It can be in shape.
  • metal compounds belonging to Group VIII and VIIB such as rhodium compounds and iridium compounds, and palladium compounds used for stabilizing or enhancing the sensitivity of silver halide.
  • paragraph 0039 of JP-A-2009-188360 Reference can be made to the description in paragraph 0042.
  • chemical sensitization reference can be made to the technical description in paragraph 0043 of JP-A-2009-188360.
  • the silver halide-containing coating solution and the composition-adjusting coating solution may contain components other than silver halide, the first polymer, and the second polymer, and these components are silver halide-containing coatings. This is common in the liquid and the composition-adjusting coating liquid, as described below.
  • the silver halide-containing coating solution and the composition-adjusting coating solution may further contain gelatin.
  • the type of gelatin is not particularly limited.
  • acid-processed gelatin may be used, and gelatin hydrolyzate, gelatin enzyme-decomposed product, and amino group or carboxyl group are modified.
  • Gelatin phthalated gelatin, acetylated gelatin
  • the silver halide-containing coating solution and the composition-adjusting coating solution may further contain a solvent.
  • a solvent examples include water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, esters such as ethyl acetate, ethers, and the like. Etc.), ionic liquids, and mixed solvents thereof.
  • the silver halide-containing coating solution and the composition-adjusting coating solution may contain other materials than the above-described materials as necessary.
  • a crosslinking agent used to crosslink the first polymer and the second polymer described above is included.
  • the cross-linking agent By including the cross-linking agent, cross-linking between the polymers proceeds, and even when gelatin is decomposed and removed in a process described later, the connection between the metal silvers is maintained, and as a result, the conductive properties are more excellent.
  • the method for simultaneous multilayer coating of the silver halide-containing coating solution and the composition-adjusting coating solution is not particularly limited, and a known method can be adopted.
  • a die coating method is preferably used.
  • the die coating method includes a slide coating method, an extrusion coating method, and a curtain coating method, but a slide coating method or an extrusion coating method is preferable, and an extrusion coating method with high suitability for thin layer coating is most preferable.
  • a film (surface film) formed when applied on a predetermined substrate from the viewpoint that the form of the first embodiment of the conductive film for touch panel described above is easily obtained. It is preferable to use a composition-adjusting coating solution containing a second polymer having a composition such that the dry thickness of the film becomes 300 nm or more.
  • the obtained coating film may be subjected to a drying treatment as necessary.
  • a drying treatment By carrying out the drying treatment, the solvent contained in the coating film obtained from the silver halide-containing coating solution and the coating film obtained from the composition-adjusting coating solution can be easily removed.
  • a photosensitive layer containing silver halide can be formed on the support.
  • the above-mentioned “photosensitive layer containing silver halide” may be referred to as “silver halide photosensitive layer” or simply “photosensitive layer”.
  • Step B is a step of forming a conductive wire containing metal silver by exposing the silver halide photosensitive layer and developing it. By this step, the silver halide is reduced and a conductive wire containing metallic silver is formed. Normally, the exposure process is performed in a pattern, and a conductive line containing metallic silver is formed in the exposed portion. On the other hand, in the non-exposed portion, silver halide is eluted by a development process described later. A non-conductive line comprising the above gelatin and the above polymer is formed. The non-conductive line is substantially free of metallic silver, and the non-conductive line is intended to indicate a region that does not exhibit conductivity. Below, the exposure process and development process implemented at this process are explained in full detail.
  • the exposure process is a process for exposing the photosensitive layer.
  • the silver halide in the photosensitive layer in the exposed region forms a latent image.
  • a conductive line is formed by development processing described later.
  • the silver halide dissolves and flows out of the photosensitive layer during the development processing described later, and a transparent film (non-conductive line) is obtained.
  • the light source used in the exposure is not particularly limited, and examples thereof include light such as visible light and ultraviolet light, and radiation such as X-rays.
  • the method for performing pattern exposure is not particularly limited. For example, surface exposure using a photomask may be performed, or scanning exposure using a laser beam may be performed.
  • the shape of the pattern is not particularly limited, and is appropriately adjusted according to the pattern of the conductive line desired to be formed.
  • the development processing method is not particularly limited.
  • a normal development processing technique used for a silver salt photographic film, a photographic paper, a printing plate film, a photomask emulsion mask, or the like may be used. it can.
  • the type of developer used in the development process is not particularly limited.
  • PQ phenidone hydroquinone
  • MQ Metal hydroquinone
  • MAA metal ascorbic acid
  • a liquid or the like can also be used.
  • the development process can include a fixing process performed for the purpose of removing and stabilizing the silver salt in the unexposed part.
  • the fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., more preferably 25 to 45 ° C.
  • the fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds.
  • the photosensitive layer that has been subjected to development and fixing treatment is preferably subjected to water washing treatment and stabilization treatment.
  • Step B After Step B, Step F for fusing metal silver of conductive wires to each other; After Step A and before Step B, the silver halide photosensitive layer is contacted with a compound having a metal-adsorbing substituent or a metal-adsorbing structure (hereinafter also referred to as “specific compound”).
  • a compound having a metal-adsorbing substituent or a metal-adsorbing structure hereinafter also referred to as “specific compound”.
  • at least one selected from the group consisting of a silver halide-containing coating solution and a composition-adjusting coating solution contains gelatin it is after step B and before step D. Removing gelatin E; Etc.
  • examples of other processes include an easy-adhesion layer forming process described later. Hereinafter, other steps will be described.
  • Step F is a step of fusing metal silver (contained in the conductive wire) of the conductive wires to each other after Step B. As a result of the fusion of the metallic silver by this step, a touch sensor unit provided with a conductive wire having better conductivity is obtained.
  • the process which makes the support body which has an electrically conductive wire contact superheated steam is mentioned.
  • the superheated steam is not particularly limited, and may be superheated steam or a mixture of superheated steam with another gas.
  • the superheated steam is preferably brought into contact with the conductive wire within a supply time of 10 to 300 seconds. When the supply time is 10 seconds or more, the conductivity is greatly improved. Moreover, since it will fully improve electroconductivity as it is 300 seconds or less, it is more preferable from the point of economical efficiency.
  • the superheated steam is preferably brought into contact with the conductive wire in a supply amount range of 500 to 600 g / m 3 , and the temperature of the superheated steam is preferably controlled to 100 to 160 ° C. at 1 atm.
  • heat treatment at 80 to 150 ° C. may be mentioned.
  • the heating time is not particularly limited, but is preferably 0.1 to 5.0 hours, and more preferably 0.5 to 1.0 hours, from the viewpoint that the above-described effects are more excellent.
  • Step C1 is a step that is performed after Step A and before Step B, and brings the silver halide photosensitive layer into contact with the specific compound.
  • the metallic silver produced in the subsequent step B becomes more difficult to fuse.
  • the silver halide photosensitive layer since the specific compound is brought into contact with the silver halide photosensitive layer, the silver halide photosensitive layer has an effect that metal silver is hardly fused in a region closer to the surface (interface region). . Therefore, particularly in a conductive wire obtained by a subsequent process, fusion between metallic silvers is more likely to be inhibited in the interface region. Even in this case, it is considered that the metal silver is sufficiently fused in the intermediate region of the conductive wire, and a touch sensor unit having excellent conductivity can be obtained.
  • the manufacturing method of a touch sensor part has the process C1 or the process C2 mentioned later, and may have the process C1 and the process C2.
  • a method for bringing the specific compound into contact with the silver halide photosensitive layer is not particularly limited, but typically, a solution in which the specific compound is dissolved and / or dispersed, a silver halide photosensitive layer, Can be mentioned. Moreover, the method of making the gas containing a specific compound and a silver halide photosensitive layer contact may be sufficient.
  • the method of bringing the solution containing the specific compound into contact with the silver halide photosensitive layer is not particularly limited, but a method of immersing the silver halide photosensitive layer in the solution, and a silver halide photosensitive layer And a method of immersing the silver halide photosensitive layer in the solution is more preferable.
  • the method of immersing the silver halide photosensitive layer in the solution is preferable because it can be carried out more stably with a simpler apparatus, and if it is washed after immersion, the excess solution can be removed more easily.
  • the method of bringing the silver halide photosensitive layer into contact with a gas containing a compound having a metal adsorbing site and / or a solution is as follows. It also has a feature that it is easily adsorbed on the surface. Thereby, it is easier to inhibit metallic silver from fusing together on the surface of the conductive wire.
  • the specific compound is a compound having a metal-adsorbing substituent or a metal-adsorbing structure (hereinafter also referred to as “metal-adsorbing site”).
  • the metal-adsorptive substituent is not particularly limited, and examples of the metal-adsorptive substituent include a carboxyl group or a salt thereof, an acid amide group, an amino group, an imidazole group, a pyrazole group, a thiol group, a thioether group, And at least 1 sort (s) selected from the group which consists of a disulfide group is preferable.
  • a nitrogen-containing heterocyclic ring is preferable, 5- or 6-membered ring azoles are preferable and 5-membered ring azoles are more preferable.
  • the nitrogen-containing heterocycle include tetrazole ring, triazole ring, imidazole ring, thiadiazole ring, oxadiazole ring, serenadiazole ring, oxazole ring, thiazole ring, benzoxazole ring, benzothiazole ring, benzimidazole ring, pyrimidine Ring, triazaindene ring, tetraazaindene ring, benzoindazole ring, benzotriazole ring, benzoxazole ring, benzothiazole ring, pyridine ring, quinoline ring, piperidine ring, piperazine ring, quinoxaline ring, morpholine ring, and pentaaza
  • These rings may have a substituent, and examples of the substituent include a nitro group, a halogen atom (for example, a chlorine atom and a bromine atom), a cyano group, a substituted or unsubstituted alkyl group (for example, methyl Group, ethyl group, propyl group, t-butyl group, and cyanoethyl group), aryl group (eg, phenyl group, 4-methanesulfonamidophenyl group, 4-methylphenyl group, 3,4-dichloro) Phenyl group and naphthyl group), alkenyl group (for example, allyl group), aralkyl group (for example, benzyl group, 4-methylbenzyl group, and phenethyl group), sulfonyl group (for example, methane group) Sulfonyl group, ethanesulfonyl group and p-toluen
  • a compound having a nitrogen-containing 6-membered ring (nitrogen-containing 6-membered ring compound) is preferable.
  • the nitrogen-containing 6-membered ring compound include triazine ring, pyrimidine ring, pyridine ring, pyrroline ring, piperidine ring, pyridazine ring.
  • a compound having a pyrazine ring is preferable, and a compound having a triazine ring or a pyrimidine ring is more preferable.
  • These nitrogen-containing 6-membered ring compounds may have a substituent.
  • substituents examples include an alkyl group having 1 to 6 carbon atoms (preferably 1 to 3), and 1 to 6 carbon atoms (preferably 1 to 3 carbon atoms). 3) an alkoxy group, a hydroxyl group, a carboxyl group, a mercapto group, an alkoxyalkyl group having 1 to 6 carbon atoms (preferably 1 to 3), and a hydroxyalkyl group having 1 to 6 carbon atoms (preferably 1 to 3).
  • nitrogen-containing 6-membered ring compound include triazine, methyltriazine, dimethyltriazine, hydroxyethyltriazine, pyrimidine, 4-methylpyrimidine, pyridine, and pyrroline.
  • the above compound may have one kind of metal adsorbing site alone or two or more kinds, but the above compound has two or more kinds of metal adsorbing sites. Is preferred.
  • Step C2 is a step that is performed after Step B and before Step F, and brings the conductive wire into contact with the specific compound. This step makes it more difficult for metal silver (contained in the conductive wire) of the conductive wires to be fused together.
  • the specific compound since the specific compound is brought into contact with the conductive wire, there is an effect that the metallic silver is hardly fused in a region (interface region) closer to the surface of the conductive wire. Therefore, the fusion of metallic silver is more likely to be inhibited in the interface region of the conductive wire. Even in this case, it is considered that the metal silver is sufficiently fused in the intermediate region of the conductive wire, and a touch sensor unit having excellent conductivity can be obtained.
  • step C1 the method for bringing the conductive wire into contact with the specific compound, the form of the specific compound, and the like are the same as those in the already-described step C1, and thus the description thereof is omitted.
  • the process D is a process of consolidating the conductive wires after the process B and before the above-described process F. By this step, the conductivity of the conductive wire is further improved, and the adhesion of the conductive wire to the support is more likely to be improved.
  • the method for consolidating the conductive wire is not particularly limited, but, for example, a calendering process in which a support having a conductive wire is passed under pressure between at least a pair of rolls is preferable.
  • a calendering process in which a support having a conductive wire is passed under pressure between at least a pair of rolls is preferable.
  • consolidation processing using a calendar roll is referred to as calendar processing.
  • Examples of the roll used for the calendar process include a plastic roll and a metal roll. From the viewpoint of preventing wrinkles, a plastic roll is preferable.
  • the pressure between the rolls is not particularly limited. The pressure between the rolls can be measured using a prescale (for high pressure) manufactured by FUJIFILM Corporation.
  • the surface roughness Ra of the roll used for the calendering treatment is preferably 0 to 2.0 ⁇ m, more preferably 0.3 to 1.0 ⁇ m, from the viewpoint that the obtained conductive wire is less visible.
  • the temperature of the consolidation treatment is not particularly limited, but is preferably 10 ° C. (no temperature control) to 100 ° C., and varies depending on the line density, shape, and binder type of the conductive wire pattern. No temperature control) to 50 ° C. is more preferable.
  • step E When at least one selected from the group consisting of a silver halide-containing coating solution and a composition-adjusting coating solution contains gelatin, step E is after step B and before step D. This is a step of removing gelatin from conductive lines (contained in conductive lines). By removing gelatin, as a result, the content of metallic silver in the conductive wire is relatively increased, so that a conductive wire having better conductivity can be obtained.
  • Step E may be a step of removing all of gelatin or a step of removing a part of gelatin. In step E, gelatin may be removed from portions other than the conductive lines on the support (for example, non-conductive lines) in addition to the conductive lines.
  • the method for removing gelatin is not particularly limited, and examples thereof include a method for decomposing and removing using a proteolytic enzyme and a method for decomposing and removing using a predetermined oxidizing agent.
  • a method for degrading and removing gelatin using a proteolytic enzyme for example, the method described in paragraphs 0084 to 0077 of JP-A-2014-209332 can be employed.
  • a method for decomposing and removing gelatin using an oxidizing agent for example, the method described in paragraphs 0064 to 0066 of JP-A-2014-112512 can be employed.
  • the easy-adhesion layer forming step is a step of forming an easy-adhesion layer (hereinafter also referred to as “undercoat layer”) on the support before Step A to obtain a support with an easy-adhesion layer (undercoat layer).
  • the method for forming the undercoat layer on the support is not particularly limited, and examples thereof include a method of applying the undercoat layer forming composition on the support.
  • the formed undercoat layer is adjusted so that the absolute value of the difference in refractive index between other adjacent layers (such as the support and the non-conductive line) becomes smaller. It is preferable.
  • the method for adjusting the difference in refractive index between the undercoat layer and another adjacent layer is not particularly limited, but the type of each component contained in the composition used for forming each layer is adjusted. The method of doing is mentioned.
  • the composition for easily bonding layer formation may contain a solvent.
  • the type of the solvent is not particularly limited, and is as already described as the solvent that may be contained in the silver halide-containing coating solution.
  • the thickness of the easy-adhesion layer is not particularly limited, but is preferably 0.02 to 0.3 ⁇ m from the viewpoint of further improving the adhesion between the support, the silver halide photosensitive layer and the conductive wire.
  • the easily adhesive layer is not particularly limited, and for example, a suitable application example of the first adhesive layer described in JP-A-2008-208310 can be suitably used.
  • the manufacturing method will not be specifically limited to the above-mentioned method, For example, the plating method, the vapor deposition method, and the printing method Etc. can be used as appropriate.
  • the configuration of the conductive wire 60 is not particularly limited as long as it has conductivity and functions as a conductive layer.
  • the conductive wire 60 is preferably formed of a metal or an alloy. In the case of a metal, the conductive wire 60 is preferably silver, aluminum, molybdenum, copper, titanium, gold, or tungsten. Among them, silver is more preferable because the conductivity of the conductive wire is excellent.
  • carbonaceous conductive materials such as carbon nanotubes (CNT) and carbon nanobuds (CNB), and conductive oxides such as ITO (Indium Tin Oxide) and SnO 2 are used for the conductive wires 60.
  • CNT carbon nanotubes
  • CNB carbon nanobuds
  • ITO Indium Tin Oxide
  • SnO 2 conductive oxides
  • the conductive wire 60 preferably contains a binder from the viewpoint of adhesion between the conductive wire and the support 50.
  • a resin is preferable because the adhesion between the conductive wire and the support 50 is more excellent.
  • a (meth) acrylic resin, a styrene resin, a vinyl resin, a polyolefin resin, a polyester is preferable.
  • the conductive wire 60 can be formed of a metal plating film formed on the underlayer by electroless plating on the electroless plating underlayer.
  • the catalyst ink containing at least metal fine particles is formed in a pattern on the substrate, and then the substrate is immersed in an electroless plating bath to form a metal plating film.
  • the method for producing a metal-coated substrate described in JP 2014-159620 A can be used.
  • a catalyst or a catalyst precursor is applied, and the substrate is immersed in an electroless plating bath. It is formed by forming a metal plating film. More specifically, the method for producing a metal film substrate described in JP 2012-144661 A can be applied.
  • the conductive wire 60 can be formed by forming a copper foil layer by vapor deposition and forming a copper wiring from the copper foil layer by a photolithography method.
  • an electrolytic copper foil can be used in addition to the deposited copper foil.
  • the step of forming a copper wiring described in JP 2014-29614 A can be used.
  • a method for forming the conductive line 60 by a printing method will be described.
  • the conductive wire 60 can be formed by applying a conductive paste containing conductive powder to the substrate in the same pattern as the conductive wire 60 and then performing a heat treatment.
  • the pattern formation using the conductive paste is performed by, for example, an ink jet method or a screen printing method. More specifically, the conductive paste described in JP 2011-28985 A can be used as the conductive paste.
  • the present invention is basically configured as described above.
  • the touch sensor and touch panel of the present invention have been described in detail above, but the present invention is not limited to the above-described embodiment, and various improvements or modifications may be made without departing from the spirit of the present invention. Of course.

Abstract

Provided are a touch sensor and a touch panel by which a display region can be extended, and in addition, a sensing region can also be extended. The touch sensor includes: two bases that have lateral surfaces which face each other, and that are vibrationally connected; and one sensor sheet that is disposed on the top surface of the bases and on the connected lateral surfaces, and that detects contact therewith. In a state where the sensor sheet has been disposed, the two bases are configured so as to be in a first state in which the lateral surfaces of the two bases face each other and the top surfaces thereof are positioned on the same plane, and a second state in which the back surfaces of the two bases face each other.

Description

タッチセンサおよびタッチパネルTouch sensor and touch panel
　本発明は、折り畳み可能なタッチセンサおよびタッチセンサを有するタッチパネルに関し、特に、２つの基体に、指、タッチペン等の接触を検出するセンサシートが１枚設けられた構成の折り畳み可能なタッチセンサおよびタッチパネルに関する。 The present invention relates to a foldable touch sensor and a touch panel having the touch sensor, and in particular, a foldable touch sensor and a touch panel having a configuration in which one sensor sheet for detecting contact of a finger, a touch pen, or the like is provided on two substrates. About.
　近年、タブレット型コンピュータおよびスマートフォン等の携帯情報機器を始めとした各種の電子機器において、液晶表示装置等の表示装置と組み合わせて用いられ、画面に接触することにより電子機器への入力操作を行うタッチパネルの普及が進んでいる。
　例えば、特許文献１に示されるように金属細線を用いたタッチパネルがある。特許文献１のタッチパネルは、基材と、複数のＹ電極パターンと、複数のＸ電極パターンと、複数のジャンパ絶縁層と、複数のジャンパ配線と、透明絶縁層とを備えた静電容量センサ（タッチセンサ、入力装置）である。
　複数のＹ電極パターンは、それぞれ略菱形形状を有しており、その頂点同士が相互に対向するように、基材の表面上にＸ方向及びＹ方向に沿ってマトリクス状に配列されている。メッシュは、Ｙ方向を中心として線対称に傾斜した２種類の金属細線を格子状に交差させて形成されている。複数のＸ電極パターンは、Ｙ電極パターンと同じ略菱形形状を有している。 2. Description of the Related Art In recent years, various electronic devices such as tablet computers and mobile information devices such as smartphones are used in combination with a display device such as a liquid crystal display device, and a touch panel that performs an input operation to the electronic device by touching a screen. Is spreading.
For example, as disclosed in Patent Document 1, there is a touch panel using a thin metal wire. The touch panel of patent document 1 is a capacitance sensor (including a base material, a plurality of Y electrode patterns, a plurality of X electrode patterns, a plurality of jumper insulating layers, a plurality of jumper wirings, and a transparent insulating layer). Touch sensor, input device).
Each of the plurality of Y electrode patterns has a substantially rhombus shape, and is arranged in a matrix along the X direction and the Y direction on the surface of the substrate so that the vertices face each other. The mesh is formed by intersecting two kinds of fine metal wires inclined in line symmetry with the Y direction as the center in a lattice shape. The plurality of X electrode patterns have substantially the same rhombus shape as the Y electrode pattern.
特開２０１４－１１５６９４号公報JP 2014-115694 A 特開２０１７－１０２９４５号公報JP 2017-102945 A
　タッチパネルを備える電子機器、例えば、タブレット型コンピュータおよびスマートフォン等において、表示領域を大きくするには、電子機器の画面サイズを大きくする必要があり、電子機器が大型化してしまう。この電子機器の大型化を抑制するために、折り畳む形態の電子機器の開発が進んでいる。例えば、特許文献２には、機械的に接続され、折り畳むことが可能であり、個々にまたは一緒に使用され得る３つの別々のタッチスクリーンディスプレイを使用する電子デバイスが示されている。
　しかしながら、特許文献２の電子デバイスは、表示領域を拡張できるが、それ以外の拡張、例えば、表示領域の側面をセンシング領域とすることができない。 In an electronic device including a touch panel, for example, a tablet computer, a smartphone, or the like, in order to increase the display area, it is necessary to increase the screen size of the electronic device, and the electronic device is increased in size. In order to suppress the increase in size of the electronic device, development of the electronic device in a folding form is progressing. For example, U.S. Patent No. 6,057,037 shows an electronic device that uses three separate touch screen displays that can be mechanically connected and folded and used individually or together.
However, although the electronic device of Patent Document 2 can expand the display area, other expansion, for example, the side surface of the display area cannot be used as the sensing area.
　本発明の目的は、前述の従来技術に基づく問題点を解消し、表示領域の拡張に加え、センシング領域も拡張できるタッチセンサおよびタッチパネルを提供することにある。 An object of the present invention is to provide a touch sensor and a touch panel capable of solving the problems based on the above-described conventional technology and extending a sensing area in addition to an expansion of a display area.
　上述の目的を達成するために、本発明は、互いの側面同士を対向させ、かつ揺動可能に接続された、２つの基体と、２つの基体の表面と、接続された側面とに設けられた、接触を検出する１枚のセンサシートとを有し、センサシートが設けられた状態で、２つの基体は、互いの側面が対向し、かつ２つの基体の表面が同一平面に位置する第１の状態と、２つの基体の互いの裏面が対向する第２の状態とになる、タッチセンサを提供するものである。 In order to achieve the above-described object, the present invention is provided on two bases that face each other and that are swingably connected, the surfaces of the two bases, and the connected side faces. In addition, the two substrates have a sensor sheet for detecting contact, and in the state where the sensor sheet is provided, the two substrates face each other, and the surfaces of the two substrates are positioned on the same plane. A touch sensor is provided that is in a first state and a second state in which the back surfaces of two substrates face each other.
　２つの基体は、それぞれ接続された側面に、第１の状態においてセンサシートの設けられている側と反対側に、側面同士の対向方向と直交する辺部に沿って切欠きが設けられていることが好ましい。
　センサシートが設けられている基体の表面と、接続された側面とは、それぞれセンサシートに接着層により接着されており、基体の表面と、接続された側面とは接着層の接着力が異なることが好ましい。 The two bases are each provided with a notch on the connected side surface on the side opposite to the side where the sensor sheet is provided in the first state, along a side perpendicular to the opposing direction of the side surfaces. It is preferable.
The surface of the substrate on which the sensor sheet is provided and the connected side surface are bonded to the sensor sheet by an adhesive layer, respectively, and the adhesive force of the adhesive layer is different from the surface of the substrate and the connected side surface. Is preferred.
　センサシートは、基体との間に保護層が設けられており、保護層は、弾性率が１０ＭＰａ以上９．８ＧＰａ以下であることが好ましい。弾性率の上限値に関しては、更に５．０ＧＰａ以下であることがより好ましく、更に３．０ＧＰａ以下であることが更に好ましい。
　基体の表面と側面とが交わる角部以外に、接着層が設けられていることが好ましい。
　基体の表面と側面とが交わる角部に設けられた接着層は、基体の表面、および側面に設けられた接着層よりも厚みが薄いことが好ましい。
　２つの基体は、ヒンジ部材により揺動可能に接続されていることが好ましい。また、２つの基体は、板状部材で構成されていることが好ましい。 The sensor sheet is provided with a protective layer between the substrate and the protective layer. The protective layer preferably has an elastic modulus of 10 MPa or more and 9.8 GPa or less. The upper limit of the elastic modulus is more preferably 5.0 GPa or less, and still more preferably 3.0 GPa or less.
It is preferable that an adhesive layer is provided in addition to the corner where the surface and side surface of the substrate intersect.
The adhesive layer provided at the corner portion where the surface and the side surface of the substrate cross each other is preferably thinner than the adhesive layer provided on the surface and the side surface of the substrate.
It is preferable that the two bases are swingably connected by a hinge member. Moreover, it is preferable that two base | substrates are comprised by the plate-shaped member.
　本発明は、タッチセンサを有し、基体は、表示部を有する、タッチパネルを提供するものである。
　また、本発明は、タッチセンサと、タッチセンサの基体の裏面に設けられた表示部とを有する、タッチパネルを提供するものである。 The present invention provides a touch panel having a touch sensor and a base having a display unit.
Moreover, this invention provides the touch panel which has a touch sensor and the display part provided in the back surface of the base | substrate of a touch sensor.
　本発明によれば、表示領域の拡張に加え、センシング領域も拡張したタッチセンサおよびタッチパネルを提供することができる。 According to the present invention, it is possible to provide a touch sensor and a touch panel in which the sensing area is expanded in addition to the display area.
本発明の実施形態のタッチパネルの第１の状態を示す模式的斜視図である。It is a typical perspective view showing the 1st state of a touch panel of an embodiment of the present invention. 本発明の実施形態のタッチパネルの第２の状態を示す模式的斜視図である。It is a typical perspective view which shows the 2nd state of the touch panel of embodiment of this invention. 本発明の実施形態のタッチパネルの他の状態を示す模式的斜視図である。It is a typical perspective view which shows the other state of the touchscreen of embodiment of this invention. 本発明の実施形態のタッチパネルの接続部を示す模式的断面図である。It is typical sectional drawing which shows the connection part of the touchscreen of embodiment of this invention. 本発明の実施形態のタッチパネルの接続部を示す模式的断面図である。It is typical sectional drawing which shows the connection part of the touchscreen of embodiment of this invention. 本発明の実施形態のタッチパネルの一形態を示す模式的側面図である。It is a typical side view showing one form of a touch panel of an embodiment of the present invention. 本発明の実施形態のタッチパネルの表示部の配置の他の例を示す模式的側面図である。It is a typical side view showing other examples of arrangement of a display part of a touch panel of an embodiment of the present invention. 本発明の実施形態のタッチパネルの表示部の配置の他の例を示す模式的側面図である。It is a typical side view showing other examples of arrangement of a display part of a touch panel of an embodiment of the present invention. 本発明の実施形態のタッチセンサのセンサシートの構成の第１の例を示す模式的断面図である。It is typical sectional drawing which shows the 1st example of a structure of the sensor sheet | seat of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサのセンサシートの構成の第２の例を示す模式的断面図である。It is typical sectional drawing which shows the 2nd example of a structure of the sensor sheet | seat of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサのセンサシートの構成の第３の例を示す模式的断面図である。It is typical sectional drawing which shows the 3rd example of a structure of the sensor sheet | seat of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサのセンサシートの接着形態の第１の例を示す模式的断面図である。It is typical sectional drawing which shows the 1st example of the adhesion | attachment form of the sensor sheet | seat of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサのセンサシートの接着形態の第２の例を示す模式的断面図である。It is typical sectional drawing which shows the 2nd example of the adhesion | attachment form of the sensor sheet | seat of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサのセンサシートの接着形態の第３の例を示す模式的断面図である。It is typical sectional drawing which shows the 3rd example of the adhesion | attachment form of the sensor sheet | seat of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサの構成の他の例を示す模式的断面図である。It is typical sectional drawing which shows the other example of a structure of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサの構成の他の例を示す模式的断面図である。It is typical sectional drawing which shows the other example of a structure of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサの構成の他の例を示す模式的断面図である。It is typical sectional drawing which shows the other example of a structure of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサのセンサシートの配置の第１の例を示す模式的断面図である。It is typical sectional drawing which shows the 1st example of arrangement | positioning of the sensor sheet | seat of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチセンサのセンサシートの配置の第２の例を示す模式的断面図である。It is typical sectional drawing which shows the 2nd example of arrangement | positioning of the sensor sheet | seat of the touch sensor of embodiment of this invention. 本発明の実施形態のタッチパネルの他の例の第１の状態を示す模式的斜視図である。It is a typical perspective view which shows the 1st state of the other example of the touchscreen of embodiment of this invention. 本発明の実施形態のタッチパネルの他の例の第２の状態を示す模式的斜視図である。It is a typical perspective view which shows the 2nd state of the other example of the touchscreen of embodiment of this invention. 本発明の実施形態のタッチパネルの他の例に用いられるセンサシートの一例を示す模式図である。It is a schematic diagram which shows an example of the sensor sheet | seat used for the other example of the touchscreen of embodiment of this invention. 本発明の実施形態のタッチセンサ部の一例を示す模式的平面図である。It is a typical top view showing an example of a touch sensor part of an embodiment of the present invention. 本発明の実施形態のタッチセンサ部の一例を示す模式的断面図である。It is typical sectional drawing which shows an example of the touch sensor part of embodiment of this invention. 本発明の実施形態のタッチセンサ部の導電線の配置の一例を示す平面図である。It is a top view which shows an example of arrangement | positioning of the conductive wire of the touch sensor part of embodiment of this invention. 本発明の実施形態のタッチセンサ部の導電線のパターンの一例を示す平面図である。It is a top view which shows an example of the pattern of the conductive line of the touch sensor part of embodiment of this invention. 本発明の実施形態のタッチセンサ部の他の例を示す模式的断面図である。It is typical sectional drawing which shows the other example of the touch sensor part of embodiment of this invention. 本発明の実施形態のタッチセンサ部の導電線の一例を拡大して示す模式図である。It is a schematic diagram which expands and shows an example of the conductive wire of the touch sensor part of embodiment of this invention.
　以下に、添付の図面に示す好適実施形態に基づいて、本発明のタッチセンサおよびタッチパネルを詳細に説明する。
　なお、以下に説明する図は、本発明を説明するための例示的なものであり、以下に示す図に本発明が限定されるものではない。
　なお、以下において数値範囲を示す「～」とは両側に記載された数値を含む。例えば、εが数値α～数値βとは、εの範囲は数値αと数値βを含む範囲であり、数学記号で示せばα≦ε≦βである。
　「平行」および「直交」等の角度は、特に記載がなければ、該当する技術分野で一般的に許容される誤差範囲を含む。また、温度についても、特に記載がなければ、該当する技術分野で一般的に許容される誤差範囲を含む。
　また、「全面」等は、該当する技術分野で一般的に許容される誤差範囲を含む。
　なお、透明とは、光透過率が、波長３８０～７８０ｎｍの可視光波長域において、４０％以上のことであり、好ましくは８０％以上、より好ましくは９０％以上のことである。
　光透過率は、ＪＩＳ（日本工業規格）　Ｋ　７３７５：２００８に規定される「プラスチック－全光線透過率および全光線反射率の求め方」を用いて測定されるものである。 Hereinafter, a touch sensor and a touch panel of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
In addition, the figure demonstrated below is an illustration for demonstrating this invention, and this invention is not limited to the figure shown below.
In the following, “to” indicating a numerical range includes numerical values written on both sides. For example, when ε is a numerical value α to a numerical value β, the range of ε is a range including the numerical value α and the numerical value β, and expressed by mathematical symbols, α ≦ ε ≦ β.
Unless otherwise specified, angles such as “parallel” and “orthogonal” include an error range generally allowed in the corresponding technical field. Further, the temperature includes an error range generally allowed in the corresponding technical field unless otherwise specified.
Further, “entire surface” and the like include an error range generally allowed in the corresponding technical field.
The term “transparent” means that the light transmittance is 40% or more, preferably 80% or more, more preferably 90% or more in the visible light wavelength range of 380 to 780 nm.
The light transmittance is measured by using “Plastics—Determination of total light transmittance and total light reflectance” defined in JIS (Japanese Industrial Standard) K 7375: 2008.
　タッチパネルは、スマートフォン等の携帯情報通信端末、パーソナルコンピュータ、およびタブレットＰＣ（パーソナルコンピュータ）等の電子機器に利用されるものである。タッチパネルは、後述するように、折り畳み可能な構成であり、例えば、タッチセンサ１８（図１参照）と、表示部２０（図６参照）とを有する。以下、タッチパネルについて具体的に説明する。 The touch panel is used for electronic devices such as portable information communication terminals such as smartphones, personal computers, and tablet PCs (personal computers). As will be described later, the touch panel has a foldable configuration and includes, for example, a touch sensor 18 (see FIG. 1) and a display unit 20 (see FIG. 6). Hereinafter, the touch panel will be specifically described.
　図１は本発明の実施形態のタッチパネルの第１の状態を示す模式的斜視図であり、図２は本発明の実施形態のタッチパネルの第２の状態を示す模式的斜視図であり、図３は本発明の実施形態のタッチパネルの他の状態を示す模式的斜視図である。

　図１に示すタッチパネル１０は、広げた状態を示しており、表示領域が最も広い状態である。タッチパネル１０は、図２に示すように折り畳むことができ、さらには、図３に示すように折り畳む途中の状態にすることもできる。 FIG. 1 is a schematic perspective view showing a first state of the touch panel according to the embodiment of the present invention, and FIG. 2 is a schematic perspective view showing a second state of the touch panel according to the embodiment of the present invention. These are the typical perspective views which show the other state of the touch panel of embodiment of this invention.

The touch panel 10 shown in FIG. 1 shows an expanded state, and the display area is the widest state. The touch panel 10 can be folded as shown in FIG. 2, and can also be in the middle of folding as shown in FIG.
　タッチセンサ１８は、指およびタッチペン等の接触を検出するものであり、例えば、表示部２０に表示された画像等を操作ボタン等として利用するために用いられ、ユーザーインターフェースの一部を構成する。上述の接触の検出には、センサシート１６が１枚用いられる。
　タッチセンサ１８は、２つの基体を有するものであり、例えば、第１の基体１２と第２の基体１４とを有する。タッチセンサ１８は、少なくとも２つの基体で構成されたものであり、３つ以上の基体で構成されたものであってもよい。第１の基体１２と第２の基体１４とは、例えば、矩形の板状部材で構成される。第１の基体１２と第２の基体１４とは、例えば、形状および大きさが同じであり、すなわち、合同である。 The touch sensor 18 detects contact of a finger, a touch pen, and the like. For example, the touch sensor 18 is used to use an image or the like displayed on the display unit 20 as an operation button or the like, and constitutes a part of a user interface. One sensor sheet 16 is used for the above-described contact detection.
The touch sensor 18 has two substrates, and includes, for example, a first substrate 12 and a second substrate 14. The touch sensor 18 is composed of at least two substrates, and may be composed of three or more substrates. The 1st base 12 and the 2nd base 14 are constituted by a rectangular plate-shaped member, for example. For example, the first base 12 and the second base 14 have the same shape and size, that is, they are congruent.
　第１の基体１２と第２の基体１４とは、互いの側面１２ｂ、１４ｂ同士を対向させ、かつ揺動可能に接続されている。即ち、第１の基体１２と第２の基体１４とは、互いの側面１２ｂ、１４ｂ同士を突き合せ、かつ揺動可能に接続されている。第１の基体１２と第２の基体１４とは、揺動可能であれば、その接続方法は、特に限定されるものではなく、例えば、ヒンジ部材（図示せず）により揺動可能に接続される。
　第１の基体１２と第２の基体１４とを揺動可能にすることにより、図１に示すように第１の基体１２と第２の基体１４は、互いの側面１２ｂ、１４ｂが対向し、かつ第１の基体１２の表面１２ａと第２の基体１４の表面１４ａとが同一平面に位置する第１の状態にできる。すなわち、第１の基体１２の表面１２ａと第２の基体１４の表面１４ａとを平らな状態にできる。第１の状態は第１の基体１２と第２の基体１４とを広げた状態である。
　また、図２に示すように第１の基体１２の表面１２ａと第２の基体１４の表面１４ａとは、互いの裏面が対向する第２の状態にできる。第２の状態は第１の基体１２と第２の基体１４とを折り畳んだ状態である。　言い換えると、２つの基体と、接触を検出する１枚のセンサシートとを有し、２つの前記基体は、互いの側面同士を対向させ、かつ揺動可能に接続されており、前記センサシートを２つの前記基体の表面と接続された側面とに有し、前記センサシートを有する状態で、２つの前記基体は、互いの前記側面が対向し、かつ２つの前記基体の前記表面が同一平面に位置する第１の状態と、２つの前記基体の互いの裏面が対向する第２の状態とになるタッチセンサである。
The first base 12 and the second base 14 are connected to each other so that the side surfaces 12b and 14b face each other and can swing. That is, the first base 12 and the second base 14 are connected to each other so that the side faces 12b and 14b abut each other and can swing. The connection method of the first base 12 and the second base 14 is not particularly limited as long as it can swing. For example, the first base 12 and the second base 14 are swingably connected by a hinge member (not shown). The
By making the first substrate 12 and the second substrate 14 swingable, the side surfaces 12b and 14b of the first substrate 12 and the second substrate 14 face each other as shown in FIG. In addition, the first state in which the surface 12a of the first base 12 and the surface 14a of the second base 14 are located on the same plane can be achieved. That is, the surface 12a of the first base 12 and the surface 14a of the second base 14 can be made flat. The first state is a state in which the first base 12 and the second base 14 are expanded.
Further, as shown in FIG. 2, the surface 12a of the first base 12 and the surface 14a of the second base 14 can be in a second state in which their back surfaces are opposed to each other. The second state is a state in which the first base 12 and the second base 14 are folded. In other words, it has two base bodies and one sensor sheet for detecting contact, and the two base bodies are connected to each other so as to face each other and to be swingable. The two bases face each other, and the surfaces of the two bases are flush with each other, with the sensor sheet provided on the side faces connected to the surfaces of the two bases. It is the touch sensor which will be in the 2nd state where the 1st state located and the mutual back surface of two said base | substrates oppose.
　第１の基体１２と第２の基体１４とは、いずれもタッチセンサ１８を構成するものであり、タッチセンサ１８およびタッチパネル１０の外観を構成するものである。また、第１の基体１２と第２の基体１４とは、センサシート１６を支持するものである。このため、第１の基体１２と第２の基体１４とは、センサシート１６の下側に配置される表示部２０に表示される画像等が視認できるようにするため、透明であることが好ましい。また、後述のように表示部２０（図６参照）が第１の基体１２と第２の基体１４とに設けられている場合には、表示部２０の収納部としても機能する。この場合、第１の基体１２および第２の基体１４は電気的絶縁性を有する。第１の基体１２および第２の基体１４は、タッチセンサ１８およびタッチパネル１０の仕様に応じたもので適宜構成され、例えば、反射防止層、および偏光層等の光学機能層を有する構成でもよい。 Both the first base 12 and the second base 14 constitute the touch sensor 18, and constitute the appearance of the touch sensor 18 and the touch panel 10. Further, the first base 12 and the second base 14 support the sensor sheet 16. For this reason, it is preferable that the first base 12 and the second base 14 are transparent so that an image displayed on the display unit 20 disposed below the sensor sheet 16 can be visually recognized. . As will be described later, when the display unit 20 (see FIG. 6) is provided on the first base 12 and the second base 14, it also functions as a storage unit for the display unit 20. In this case, the first base 12 and the second base 14 have electrical insulation. The first substrate 12 and the second substrate 14 are appropriately configured according to the specifications of the touch sensor 18 and the touch panel 10, and may have a configuration including an optical function layer such as an antireflection layer and a polarizing layer, for example.
　なお、第１の基体１２と第２の基体１４とは、大きさが同じであることに限定されるものではなく、異なってもよく、例えば、第１の基体１２と第２の基体１４とのいずれか一方の幅が狭くてもよい。第１の基体１２と第２の基体１４との大きさは、用途およびデザイン等に応じて適宜決定されるものである。 The first base 12 and the second base 14 are not limited to the same size, and may be different. For example, the first base 12 and the second base 14 may be different from each other. Either one of the widths may be narrow. The sizes of the first base 12 and the second base 14 are appropriately determined according to the application and design.
　１枚のセンサシート１６は、２つの基体の表面と、接続された側面とに設けられ、第１の基体１２と第２の基体１４との接続部にもセンサシート１６が配置される。センサシート１６は、例えば、ＦＰＣ（フレキシブルプリント基板）に設けられた引出し配線（図示せず）により第１の基体１２または第２の基体１４に設けられた外部接続端子（図示せず）に電気的に接続される。外部接続端子は、センサシート１６で接触された位置を検出するコントローラ（図示せず）とセンサシート１６とを電気的に接続するものである。外部接続端子の配置位置は、特に限定されるものではなく、例えば、第１の基体１２の内部もしくは裏面１２ｄ、または第２の基体１４の内部もしくは裏面１４ｄである。
One sensor sheet 16 is provided on the surfaces of the two base bodies and the connected side surfaces, and the sensor sheet 16 is also disposed at the connection portion between the first base body 12 and the second base body 14. The sensor sheet 16 is electrically connected to an external connection terminal (not shown) provided on the first base 12 or the second base 14 by, for example, a lead wiring (not shown) provided on an FPC (flexible printed circuit board). Connected. The external connection terminal is for electrically connecting a sensor (not shown) that detects a position touched by the sensor sheet 16 and the sensor sheet 16. The arrangement position of the external connection terminal is not particularly limited, and is, for example, the inside or back surface 12d of the first base 12 or the inside or back surface 14d of the second base 14.
　ここで、図４は本発明の実施形態のタッチパネルが折り畳まれた状態の接続部を示す模式的断面図であり、図５は本発明の実施形態のタッチパネルが開いた状態の接続部を示す模式的断面図である。図４は図２に示す第２の状態に対応し、図５は図１に示す第１の状態に対応する。
　第１の基体１２および第２の基体１４の２つの基体は、それぞれ接続された側面１２ｂ、１４ｂに、図１および図５に示す第１の状態においてセンサシート１６の設けられている側と反対側に、側面１２ｂ、１４ｂ同士の突合せ方向ＤＷと直交する方向ＤＬに伸びる辺部に沿って切欠き１２ｃ、１４ｃが設けられている。具体的には、第１の基体１２の側面１２ｂには裏面１２ｄ側に、三角形状の切欠き１２ｃが設けられ、第２の基体１４の側面１４ｂには裏面１４ｄ側に、三角形状の切欠き１４ｃが設けられている。
　なお、切欠き１２ｃと切欠き１４ｃの形状は、特に限定されるものではなく、上述の三角形以外に、四角形、または円弧であってもよい。 Here, FIG. 4 is a schematic cross-sectional view showing the connection portion in a state where the touch panel of the embodiment of the present invention is folded, and FIG. 5 is a schematic view showing the connection portion in a state where the touch panel of the embodiment of the present invention is opened. FIG. 4 corresponds to the second state shown in FIG. 2, and FIG. 5 corresponds to the first state shown in FIG.
The two base bodies of the first base body 12 and the second base body 14 are opposite to the side where the sensor sheet 16 is provided in the first state shown in FIG. 1 and FIG. On the side, notches 12c and 14c are provided along side portions extending in a direction DL perpendicular to the abutting direction DW between the side surfaces 12b and 14b. Specifically, the side face 12b of the first base 12 is provided with a triangular notch 12c on the back face 12d side, and the side face 14b of the second base 14 is provided with a triangular notch on the back face 14d side. 14c is provided.
In addition, the shape of the notch 12c and the notch 14c is not specifically limited, A square or circular arc may be sufficient besides the above-mentioned triangle.
　図４に示すように、センサシート１６が、第１の基体１２の表面１２ａおよび側面１２ｂ、ならびに第２の基体１４の表面１４ａおよび側面１４ｂに、例えば、接着層（図示せず）により接着されて設けられている。センサシート１６は、切欠き１２ｃ、１４ｃに接着されていない。これにより、第１の基体１２と第２の基体１４との揺動に対する追従性が良好となり、第１の基体１２と第２の基体１４とを広げること、折り畳むことを容易にできる。
　タッチセンサ１８では、図５に示す第１の状態において、切欠き１２ｃと切欠き１４ｃとで空間が形成され、切欠き１２ｃ、１４ｃに接着されていないセンサシート１６の一部が空間に配置され挟み込まれることがない。かつ、空間でセンサシート１６の一部の変形も許容される。
　このように、第１の基体１２の切欠き１２ｃと、第２の基体１４の切欠き１４ｃとにより、センサシート１６の挟み込みが抑制され、センサ不良の発生を抑制することができる。しかも、第１の基体１２と第２の基体１４との間に隙間がなく、第１の基体１２の表面１２ａと第２の基体１４の表面１４ａとを平らな状態にできる。このため、第１の基体１２と第２の基体１４とを跨ぐタッチ操作に際しても円滑にタッチ操作でき、操作性を良好にできる。また、第１の基体１２と第２の基体１４とを跨ぐコンテンツを表示した際、歪みのない画像を表示することができる。 As shown in FIG. 4, the sensor sheet 16 is bonded to the surface 12a and the side surface 12b of the first base 12 and the surface 14a and the side surface 14b of the second base 14 by, for example, an adhesive layer (not shown). Is provided. The sensor sheet 16 is not bonded to the notches 12c and 14c. Thereby, the followability with respect to the swinging of the first base 12 and the second base 14 is improved, and the first base 12 and the second base 14 can be easily spread and folded.
In the touch sensor 18, in the first state shown in FIG. 5, a space is formed by the notch 12c and the notch 14c, and a part of the sensor sheet 16 not bonded to the notches 12c and 14c is disposed in the space. It is not caught. Moreover, some deformation of the sensor sheet 16 is allowed in the space.
As described above, the notch 12c of the first base 12 and the notch 14c of the second base 14 suppress the pinching of the sensor sheet 16 and suppress the occurrence of sensor failure. Moreover, there is no gap between the first base 12 and the second base 14, and the surface 12a of the first base 12 and the surface 14a of the second base 14 can be made flat. For this reason, the touch operation can be smoothly performed even in the touch operation straddling the first base 12 and the second base 14, and the operability can be improved. In addition, when a content straddling the first base 12 and the second base 14 is displayed, an image without distortion can be displayed.
　このように、タッチセンサ１８では、１枚のセンサシート１６が第１の基体１２と第２の基体１４に設けられた状態で、第１の基体１２と第２の基体１４とを上述の図１および図５に示す第１の状態と、上述の図２および図４に示す第２の状態とにすることができる。すなわち、１枚のセンサシート１６を設けた状態で第１の基体１２と第２の基体１４とを折り畳んだり、広げたりすることができる。いずれの状態でも、センサシート１６は、常に外側に配置された状態にある。このため、折り畳んだ状態でも、タッチセンサ１８として利用することができる。しかも、タッチセンサ１８として、側面も使用できることから、センシング領域を拡張できることから、操作性上の利点が大きい。なお、タッチセンサ１８は、上述のように図３に示す状態にすることもできる。
　また、センサシート１６を１枚設ける構成であるため、センサシート１６を外部接続端子（図示せず）と電気的に接続する引出し配線（図示せず）を少なくすることができ、装置構成を簡素化できる。しかも、引出し配線が少ないため、引出し配線のレイアウトの自由度も高い。さらには、センサシート１６で接触された位置を検出するコントローラ（図示せず）も、複数のセンサシートを用いる場合に比して、構成を簡素化できる。 As described above, in the touch sensor 18, the first base 12 and the second base 14 are attached to the first base 12 and the second base 14 with the single sensor sheet 16 provided on the first base 12 and the second base 14. The first state shown in FIGS. 1 and 5 and the second state shown in FIGS. 2 and 4 can be obtained. That is, the first base 12 and the second base 14 can be folded or spread with the single sensor sheet 16 provided. In any state, the sensor sheet 16 is always disposed outside. For this reason, it can be used as the touch sensor 18 even in a folded state. In addition, since the side surface can be used as the touch sensor 18, the sensing area can be expanded. Note that the touch sensor 18 can be in the state shown in FIG. 3 as described above.
In addition, since one sensor sheet 16 is provided, the number of lead-out wires (not shown) that electrically connect the sensor sheet 16 to external connection terminals (not shown) can be reduced, and the apparatus configuration is simplified. Can be In addition, since there are few lead wires, the layout of the lead wires is highly flexible. Furthermore, the controller (not shown) for detecting the position touched by the sensor sheet 16 can also be simplified in configuration as compared with the case where a plurality of sensor sheets are used.
　タッチパネル１０は、例えば、図６に示すように、タッチセンサ１８の第１の基体１２の裏面１２ｄに表示部２０が設けられ、第２の基体１４の裏面１４ｄに表示部２０が設けられている。表示部２０は、折り畳んだ状態で内側に位置する。この場合、第１の基体１２と第２の基体１４の境界での画像が表示されないことを抑制するため、例えば、第１の基体１２と第２の基体１４に画像を拡大する光学機能層を設けてもよい。
　図６に示すタッチパネル１０の構成では、表示部２０は、基体毎に設けられており、表示部２０自体が曲げられるものではない。
　表示部２０は、特に限定されるものではなく、画像等を表示する表示領域（図示せず）を備えるものであり、例えば、液晶表示パネル、または有機ＥＬ（Organic electro luminescence）表示パネルで構成される。表示部２０は、上述のもの以外に、真空蛍光ディスプレイ（ＶＦＤ）、プラズマディスプレイパネル（ＰＤＰ）、表面電界ディスプレイ（ＳＥＤ）、電界放出ディスプレイ（ＦＥＤ）、および電子ペーパー等を利用することができる。 For example, as shown in FIG. 6, the touch panel 10 includes a display unit 20 on the back surface 12 d of the first base 12 of the touch sensor 18 and a display unit 20 on the back surface 14 d of the second base 14. . The display unit 20 is positioned inside in a folded state. In this case, in order to prevent the image at the boundary between the first base 12 and the second base 14 from being displayed, for example, an optical functional layer for enlarging the image on the first base 12 and the second base 14 is provided. It may be provided.
In the configuration of the touch panel 10 illustrated in FIG. 6, the display unit 20 is provided for each base, and the display unit 20 itself is not bent.
The display unit 20 is not particularly limited, and includes a display area (not shown) for displaying an image or the like, and is configured by, for example, a liquid crystal display panel or an organic EL (Organic electroluminescence) display panel. The The display unit 20 can use a vacuum fluorescent display (VFD), a plasma display panel (PDP), a surface electric field display (SED), a field emission display (FED), electronic paper, and the like in addition to the above-described ones.
　また、図７に示すように、第１の基体１２の裏面１２ｄと第２の基体１４の裏面１４ｄに、１つの表示部２０を設ける構成でもよい。この場合、表示部２０も曲げられるため、フレキシブルなＯＬＥＤ（Organic Light Emitting Diode）ディスプレイ等の曲げることができ、かつ画像等を表示できるディスプレイが用いられる。表示部２０は１つの方が複数設ける場合に比して、表示部２０の画像表示を制御する制御部を簡素化でき、しかも、複数画面を跨ぐ画像の表示制御も容易にできる。
　なお、上述の図６および図７に示すように、第１の基体１２の裏面１２ｄと第２の基体１４の裏面１４ｄとに表示部２０を設ける構成に限定されるものではない。例えば、図８に示すように、第１の基体１２の内部に表示部２０を設け、第２の基体１４の内部に表示部２０を設ける構成でもよい。 Further, as shown in FIG. 7, one display unit 20 may be provided on the back surface 12 d of the first base 12 and the back surface 14 d of the second base 14. In this case, since the display unit 20 is also bent, a display that can be bent and can display an image or the like such as a flexible OLED (Organic Light Emitting Diode) display is used. As compared with the case where a plurality of display units 20 are provided, the control unit that controls the image display of the display unit 20 can be simplified, and the display control of an image across a plurality of screens can be facilitated.
6 and 7, the display unit 20 is not limited to the configuration in which the display unit 20 is provided on the back surface 12d of the first base 12 and the back surface 14d of the second base 14. For example, as shown in FIG. 8, the display unit 20 may be provided inside the first base 12 and the display unit 20 may be provided inside the second base 14.
　タッチパネル１０は、表示部２０が設けられた状態で、上述のタッチセンサ１８と同様に図１に示す第１の状態と、図２に示す第２の状態とにすることができる。第１の基体１２の表面１２ａと第２の基体１４の表面１４ａとは、それぞれ画像等の表示画面として機能し、タッチパネル１０は２つの画面を有する構成である。タッチパネル１０は、広げた状態で２画面分の表示領域を利用できる。この場合、上述のように平らな状態にできることから、表示部２０に画像等を表示して、２画面を跨ぐコンテンツを表示した際、歪みのない画像を表示することができ、また、２画面を跨ぐタッチ操作に際しても円滑にタッチ操作でき、操作性が良好である。
　さらには、タッチパネル１０は、表示部２０に画像等を表示することにより、折り畳んだ状態でも、外側にコンテンツを表示することができ、かつ上述のタッチセンサ１８と同様に側面をセンシング領域として利用することができる。 The touch panel 10 can be in the first state shown in FIG. 1 and the second state shown in FIG. 2 in the same manner as the touch sensor 18 with the display unit 20 provided. The surface 12a of the first base 12 and the surface 14a of the second base 14 each function as a display screen for images and the like, and the touch panel 10 has two screens. The touch panel 10 can use a display area for two screens in an expanded state. In this case, since it can be made flat as described above, when an image or the like is displayed on the display unit 20 and a content straddling two screens is displayed, an image without distortion can be displayed. The touch operation can be smoothly performed even when the touch operation is performed over the two, and the operability is good.
Furthermore, the touch panel 10 displays an image or the like on the display unit 20 so that the content can be displayed on the outside even in a folded state, and the side surface is used as a sensing region in the same manner as the touch sensor 18 described above. be able to.
＜センサシートの構成＞
　次に、タッチセンサのセンサシートの構成について説明する。
　図９は本発明の実施形態のタッチセンサのセンサシートの構成の第１の例を示す模式的断面図であり、図１０は本発明の実施形態のタッチセンサのセンサシートの構成の第２の例を示す模式的断面図であり、図１１は本発明の実施形態のタッチセンサのセンサシートの構成の第３の例を示す模式的断面図である。図９～図１１は、いずれも第２の状態を示しており、図４に対応するものである。
　センサシート１６は、例えば、図９に示すように、タッチセンサ部３０と、タッチセンサ部３０上の第１粘着層３２と、第１粘着層３２上の第１保護層３４と、タッチセンサ部３０下の第２粘着層３６と、第２粘着層３６下の第２保護層３８とを有する積層構造である。センサシート１６は、第２保護層３８を第１の基体１２および第２の基体１４に向けて配置されている。センサシート１６は、第１の基体１２と第２の基体１４との間に、第２保護層３８が設けられている。
　センサシート１６は、全光線透過率が、少なくとも４０％であればよく、好ましくは８０％以上、より好ましくは９０％以上である。全光透過率は、例えば、ＪＩＳ　Ｋ　７３７５：２００８に規定される「プラスチック－全光線透過率および全光線反射率の求め方」を用いて測定されるものである。 <Configuration of sensor sheet>
Next, the configuration of the sensor sheet of the touch sensor will be described.
FIG. 9 is a schematic cross-sectional view showing a first example of the configuration of the sensor sheet of the touch sensor according to the embodiment of the present invention, and FIG. 10 shows a second configuration of the sensor sheet of the touch sensor according to the embodiment of the present invention. FIG. 11 is a schematic cross-sectional view showing a third example of the configuration of the sensor sheet of the touch sensor according to the embodiment of the present invention. 9 to 11 all show the second state, which corresponds to FIG.
For example, as illustrated in FIG. 9, the sensor sheet 16 includes a touch sensor unit 30, a first adhesive layer 32 on the touch sensor unit 30, a first protective layer 34 on the first adhesive layer 32, and a touch sensor unit. 30 is a laminated structure having a second adhesive layer 36 below 30 and a second protective layer 38 below the second adhesive layer 36. The sensor sheet 16 is arranged with the second protective layer 38 facing the first base 12 and the second base 14. The sensor sheet 16 is provided with a second protective layer 38 between the first base 12 and the second base 14.
The sensor sheet 16 may have a total light transmittance of at least 40%, preferably 80% or more, and more preferably 90% or more. The total light transmittance is measured using, for example, “Plastics—How to obtain total light transmittance and total light reflectance” defined in JIS K 7375: 2008.
　第１粘着層３２および第２粘着層３６は、いずれも光学的に透明で絶縁性を有するものであり、かつ安定した固定力を発揮することができれば、その構成は、特に限定されるものではない。第１粘着層３２および第２粘着層３６としては、例えば、光学的に透明な粘着剤（ＯＣＡ、Optical Clear Adhesive）およびＵＶ（Ultra Violet）硬化樹脂等の光学的に透明な樹脂（ＯＣＲ、Optical Clear Resin）を用いることができ、例えば、３Ｍ株式会社製　８１４６－４（製品番号）を用いることができる。
　また、第１保護層３４と第２保護層３８は、外部環境からタッチセンサ部３０を保護する役割を果たすものであり、透明な部材で構成されている。第１保護層３４と第２保護層３８は、例えば、ポリイミド（ＰＩ）、ポリアミド（ＰＡ）、ポリエチレンテレフタレート（ＰＥＴ）、トリアセチルセルロース（ＴＡＣ）、およびシクロオレフィンコポリマー（ＣＯＣ）のうち、少なくとも１つで構成されることが好ましい。第１保護層３４と第２保護層３８は、弾性率が１０ＭＰａ以上９．８ＧＰａ以下であることが好ましい。弾性率の上限値に関しては、更に５．０ＧＰａ以下であることがより好ましく、更に３．０ＧＰａ以下であることが更に好ましい。 The first pressure-sensitive adhesive layer 32 and the second pressure-sensitive adhesive layer 36 are both optically transparent and insulating, and the configuration thereof is not particularly limited as long as a stable fixing force can be exhibited. Absent. Examples of the first adhesive layer 32 and the second adhesive layer 36 include optically transparent resins (OCR, Optical, such as optically transparent adhesive (OCA, Optical Clear Adhesive) and UV (Ultra Violet) cured resin). Clear Resin) can be used, for example, 8146-4 (product number) manufactured by 3M Corporation.
Moreover, the 1st protective layer 34 and the 2nd protective layer 38 play the role which protects the touch sensor part 30 from an external environment, and are comprised by the transparent member. The first protective layer 34 and the second protective layer 38 are, for example, at least one of polyimide (PI), polyamide (PA), polyethylene terephthalate (PET), triacetyl cellulose (TAC), and cycloolefin copolymer (COC). It is preferable to be composed of two. The first protective layer 34 and the second protective layer 38 preferably have an elastic modulus of 10 MPa or more and 9.8 GPa or less. The upper limit of the elastic modulus is more preferably 5.0 GPa or less, and still more preferably 3.0 GPa or less.
　センサシート１６は、第１の基体１２の表面１２ａと、第２の基体１４の表面１４ａのそれぞれにおいて第１接着層４０により接着されており、第１の基体１２の側面１２ｂと、第２の基体１４の側面１４ｂのそれぞれにおいては第２接着層４２により接着されている。第１接着層４０と第２接着層４２とは接着力が異なり、側面１２ｂと側面１４ｂとの接着に用いられる第２接着層４２の方が、表面１２ａと表面１４ａとの接着に用いられる第１接着層４０よりも接着力が大きいことが好ましい。これにより、第１の基体１２と第２の基体１４との揺動に対する追従性が更に良好となる。加えて、第１の基体１２と第２の基体１４との折り畳み繰り返しても、センサシート１６の剥離等が抑制され、折り畳みに対する繰り返し耐久性が良好となる。
　なお、接着力は、剥離力で規定されるものであり、剥離力が大きい方が、接着力が大きい。
　剥離力は、ＪＩＳ　Ｚ０２３７：２００９　粘着テープ・粘着シート試験方法を用いて測定することができる。 The sensor sheet 16 is bonded to the surface 12a of the first base 12 and the surface 14a of the second base 14 by the first adhesive layer 40, and the side surface 12b of the first base 12 is Each of the side surfaces 14 b of the base body 14 is bonded by a second adhesive layer 42. The first adhesive layer 40 and the second adhesive layer 42 have different adhesive forces, and the second adhesive layer 42 used for adhesion between the side surface 12b and the side surface 14b is used for adhesion between the surface 12a and the surface 14a. It is preferable that the adhesive force is greater than that of the one adhesive layer 40. Thereby, the followability with respect to the oscillation of the first base 12 and the second base 14 is further improved. In addition, even if folding of the first base 12 and the second base 14 is repeated, peeling of the sensor sheet 16 or the like is suppressed, and repeated durability against folding is improved.
In addition, adhesive force is prescribed | regulated by peeling force, and the one where the peeling force is larger has larger adhesive force.
The peeling force can be measured using a JIS Z0237: 2009 adhesive tape / adhesive sheet test method.
　センサシート１６は、図９に示す構成に限定されるものではなく、図１０に示すように、タッチセンサ部３０の両面に保護層３９を設ける構成でもよい。保護層３９は、光学的に透明であり、かつ絶縁性を有するものであれば、特に限定されるものではない。
　センサシート１６は、図１１に示すように、タッチセンサ部３０上の全面に保護層３９を設け、タッチセンサ部３０の下面には、第２接着層４２との間に保護層３９を設ける構成でもよい。この場合、第１接着層４０とタッチセンサ部３０とが直接接触し、第２接着層４２とタッチセンサ部３０とが直接接触する構成でもよい。
　保護層３９は、例えば、エアーウレタン　クリヤー（商品名）（イサム塗料株式会社製）またはＧＳＩクレオス　Ｍｒ．トップコートスプレー　光沢（商品名）（株式会社ＧＳＩクレオス製）を用いたスプレー塗装により形成することができる。 The sensor sheet 16 is not limited to the configuration illustrated in FIG. 9, and may be configured to provide the protective layers 39 on both surfaces of the touch sensor unit 30 as illustrated in FIG. 10. The protective layer 39 is not particularly limited as long as it is optically transparent and has an insulating property.
As shown in FIG. 11, the sensor sheet 16 is provided with a protective layer 39 on the entire surface of the touch sensor unit 30, and a protective layer 39 is provided between the lower surface of the touch sensor unit 30 and the second adhesive layer 42. But you can. In this case, the first adhesive layer 40 and the touch sensor unit 30 may be in direct contact, and the second adhesive layer 42 and the touch sensor unit 30 may be in direct contact.
The protective layer 39 is, for example, an air urethane clear (trade name) (manufactured by Isamu Paint Co., Ltd.) or GSI Creos Mr. It can be formed by spray coating using top coat spray gloss (trade name) (manufactured by GSI Creos Co., Ltd.).
＜センサシートの接着形態＞
　次に、センサシート１６と、第１の基体１２および第２の基体１４との接着形態について説明する。
　図１２は本発明の実施形態のタッチセンサのセンサシートの接着形態の第１の例を示す模式的断面図であり、図１３は本発明の実施形態のタッチセンサのセンサシートの接着形態の第２の例を示す模式的断面図であり、図１４は本発明の実施形態のタッチセンサのセンサシートの接着形態の第３の例を示す模式的断面図である。なお、図１２～図１４では、第１の基体１２しか示していないが、第１の基体１２と第２の基体１４とは同じ構成であるため、第２の基体１４についても同じである。このため、第１の基体１２についてのみ説明し、第２の基体１４についての説明は省略する。
<Adhesive form of sensor sheet>
Next, a bonding form between the sensor sheet 16 and the first base 12 and the second base 14 will be described.
FIG. 12 is a schematic cross-sectional view showing a first example of the sensor sheet adhesion form of the touch sensor according to the embodiment of the present invention, and FIG. 13 is a diagram of the sensor sheet adhesion form of the touch sensor according to the embodiment of the present invention. FIG. 14 is a schematic cross-sectional view showing an example of 2, and FIG. 14 is a schematic cross-sectional view showing a third example of the adhesive form of the sensor sheet of the touch sensor according to the embodiment of the present invention. Although only the first base 12 is shown in FIGS. 12 to 14, since the first base 12 and the second base 14 have the same configuration, the same applies to the second base 14. Therefore, only the first base 12 will be described, and the description of the second base 14 will be omitted.
　上述のように、センサシート１６は、第１の基体１２の表面１２ａと、第２の基体１４の表面１４ａとが第１接着層４０により接着され、第１の基体１２の側面１２ｂと、第２の基体１４の側面１４ｂとが第２接着層４２により接着される。図１２に示すように、第１接着層４０は側面１２ｂ迄設けられ、第２接着層４２は表面１２ａ迄設けられており、第１の基体１２の表面１２ａと側面１２ｂとが交わる角部１７に接着層が設けられていない。すなわち、角部１７を除き、すなわち、角部１７以外に接着層が設けられている。
　なお、接着形態は、上述の図１２に示す構成に限定されるものではなく、角部１７の接着層の厚みが薄い構成でもよい。
　例えば、図１３に示すように、第１接着層４０が第２接着層４２迄設けられ、かつ第１接着層４０は角部１７における厚みが薄い構成でもよい。また、例えば、図１４に示すように、第２接着層４２が第１接着層４０迄設けられ、かつ第２接着層４２は角部１７における厚みが薄い構成でもよい。 As described above, in the sensor sheet 16, the surface 12a of the first base 12 and the surface 14a of the second base 14 are bonded by the first adhesive layer 40, and the side surface 12b of the first base 12 is The side surface 14 b of the second substrate 14 is bonded by the second adhesive layer 42. As shown in FIG. 12, the first adhesive layer 40 is provided up to the side surface 12b, the second adhesive layer 42 is provided up to the surface 12a, and the corner portion 17 where the surface 12a and the side surface 12b of the first base 12 intersect each other. Is not provided with an adhesive layer. That is, except for the corner portion 17, that is, an adhesive layer is provided in addition to the corner portion 17.
The bonding form is not limited to the configuration shown in FIG. 12 described above, and may be a configuration in which the adhesive layer of the corner portion 17 is thin.
For example, as shown in FIG. 13, the first adhesive layer 40 may be provided up to the second adhesive layer 42, and the first adhesive layer 40 may have a thin thickness at the corner portion 17. Further, for example, as shown in FIG. 14, the second adhesive layer 42 may be provided up to the first adhesive layer 40, and the second adhesive layer 42 may have a thin thickness at the corner portion 17.
＜タッチセンサの構成＞
　次に、タッチセンサの構成について説明する。
　図１５～図１７は本発明の実施形態のタッチセンサの構成の他の例を示す模式的断面図である。
　タッチセンサ１８では、第１の基体１２および第２の基体１４が上述の図１～図３に示す矩形の板状部材に限定されるものではなく、図１５に示すように、第１の基体１２の側面１２ｂの反対側の端面１２ｅと、第２の基体１４の側面１４ｂの反対側の端面１４ｅとが曲面で構成されていてもよい。第１の基体１２の端面１２ｅと第２の基体１４の端面１４ｅを曲面で構成することにより、図１～図３に示す矩形の板状部材に比して、端面１２ｅと端面１４ｅをセンシング部および表示領域として利用することができ、センシング部および表示領域を拡張できる。
　また、図１６に示すように、第１の基体１２の側面１２ｂと、側面１２ｂの反対側の端面１２ｅとを曲面で構成してもよい。また、第２の基体１４の側面１４ｂと、側面１４ｂの反対側の端面１４ｅとを曲面で構成してもよい。第１の基体１２の側面１２ｂと第２の基体１４の側面１４ｂとを曲面で構成することにより、側面１２ｂと側面１４ｂとにセンサシート１６が挟まれることが抑制され、センサシート１６の故障の発生を抑制することができる。第１の基体１２の端面１２ｅと第２の基体１４の端面１４ｅとを曲面とすることにより、上述のようにセンシング部および表示領域を拡張できる。
　なお、図１７に示すように、対向する第１の基体１２の側面１２ｂと第２の基体１４の側面１４ｂとだけを曲面で構成してもよい。この場合、上述のようにセンサシート１６の故障の発生を抑制することができる。 <Configuration of touch sensor>
Next, the configuration of the touch sensor will be described.
15 to 17 are schematic sectional views showing other examples of the configuration of the touch sensor according to the embodiment of the present invention.
In the touch sensor 18, the first base 12 and the second base 14 are not limited to the rectangular plate-like members shown in FIGS. 1 to 3 described above. As shown in FIG. The end surface 12e opposite to the side surface 12b of the twelve and the end surface 14e opposite to the side surface 14b of the second base 14 may be formed of a curved surface. By forming the end surface 12e of the first base 12 and the end surface 14e of the second base 14 as curved surfaces, the end surface 12e and the end surface 14e are connected to the sensing unit as compared with the rectangular plate-shaped member shown in FIGS. It can be used as a display area, and the sensing unit and the display area can be expanded.
Further, as shown in FIG. 16, the side surface 12b of the first base 12 and the end surface 12e opposite to the side surface 12b may be configured by curved surfaces. Further, the side surface 14b of the second base 14 and the end surface 14e opposite to the side surface 14b may be configured by curved surfaces. By configuring the side surface 12b of the first base 12 and the side surface 14b of the second base 14 with curved surfaces, the sensor sheet 16 is suppressed from being sandwiched between the side surface 12b and the side surface 14b. Occurrence can be suppressed. By making the end surface 12e of the first base 12 and the end surface 14e of the second base 14 curved surfaces, the sensing unit and the display area can be expanded as described above.
In addition, as shown in FIG. 17, you may comprise only the side surface 12b of the 1st base | substrate 12 and the side surface 14b of the 2nd base | substrate 14 which oppose as a curved surface. In this case, the occurrence of a failure of the sensor sheet 16 can be suppressed as described above.
　また、センサシート１６は、図１８に示すように、上述の図１～図３に示すタッチセンサ１８の構成において第１の基体１２の端面１２ｅおよび第２の基体１４の端面１４ｅ迄設ける構成でもよい。これにより、上述の図１～図３に示すタッチセンサ１８においても、第１の基体１２の端面１２ｅおよび第２の基体１４の端面１４ｅをセンシング部として利用することができ、センシング領域を拡張できる。 Further, as shown in FIG. 18, the sensor sheet 16 may be provided up to the end surface 12e of the first base 12 and the end surface 14e of the second base 14 in the configuration of the touch sensor 18 shown in FIGS. Good. Thereby, also in the touch sensor 18 shown in FIGS. 1 to 3 described above, the end surface 12e of the first base 12 and the end surface 14e of the second base 14 can be used as the sensing unit, and the sensing area can be expanded. .
　さらには、図１９に示すように、センサシート１６を、上述の図１～図３に示すタッチセンサ１８の構成において第１の基体１２の端面１２ｅおよび裏面１２ｄ、ならびに第２の基体１４の端面１４ｅおよび裏面１４ｄ迄設ける構成でもよい。これにより、上述の図１～図３に示すタッチセンサ１８において、第１の基体１２の端面１２ｅおよび裏面１２ｄ、ならびに第２の基体１４の端面１４ｅおよび裏面１４ｄをセンシング部として利用することができ、センシング領域をより一層拡張できる。図１９に示す構成では、第１の基体１２の裏面１２ｄ、および第２の基体１４の裏面１４ｄにセンサシート１６が配置されるため、図８に示すように表示部２０は第１の基体１２の内部、第２の基体１４の内部に設けられている構成であることが好ましい。
　また、図１９では、センサシート１６が第１の基体１２の裏面１２ｄの全面、および第２の基体１４の裏面１４ｄの全面を覆う構成ではないが、第１の基体１２の裏面１２ｄの全面、および第２の基体１４の裏面１４ｄの全面をセンサシート１６が覆う構成でもよい。この場合、表示部２０として、表面側と裏面側に画像等を表示できるものを、第１の基体１２と第２の基体１４とに設けてタッチパネル１０を構成することにより、折り畳んだ状態でコンテンツを表示することができ、開いた状態でも、タッチパネル１０の両面にコンテンツを表示することができる。この構成でも、センシング領域および表示領域の拡張を実現できる。 Further, as shown in FIG. 19, the sensor sheet 16 is made up of the end surface 12 e and the back surface 12 d of the first base 12 and the end face of the second base 14 in the configuration of the touch sensor 18 shown in FIGS. 1 to 3. 14e and back surface 14d may be provided. Thereby, in the touch sensor 18 shown in FIGS. 1 to 3 described above, the end surface 12e and the back surface 12d of the first base 12 and the end surface 14e and the back surface 14d of the second base 14 can be used as sensing units. , The sensing area can be further expanded. In the configuration shown in FIG. 19, since the sensor sheet 16 is disposed on the back surface 12d of the first base 12 and the back surface 14d of the second base 14, the display unit 20 has the first base 12 as shown in FIG. It is preferable that the structure is provided inside the second base 14.
Further, in FIG. 19, the sensor sheet 16 is not configured to cover the entire back surface 12d of the first base 12 and the entire back surface 14d of the second base 14, but the entire back surface 12d of the first base 12 The sensor sheet 16 may cover the entire back surface 14d of the second base 14. In this case, the display unit 20 that is capable of displaying an image or the like on the front side and the back side is provided on the first base 12 and the second base 14 to constitute the touch panel 10, so that the content is displayed in a folded state. Can be displayed, and the content can be displayed on both sides of the touch panel 10 even in the open state. Even in this configuration, the sensing area and the display area can be expanded.
　次に、タッチパネルの他の例について説明する。
　図２０は本発明の実施形態のタッチパネルの他の例の第１の状態を示す模式的斜視図であり、図２１は本発明の実施形態のタッチパネルの他の例の第２の状態を示す模式的斜視図である。図２２は本発明の実施形態のタッチパネルの他の例に用いられるセンサシートの一例を示す模式図である。なお、図２０～図２２において、図１～図３に示すタッチパネル１０と同一構成物には同一符号を付して、その詳細な説明は省略する。 Next, another example of the touch panel will be described.
FIG. 20 is a schematic perspective view showing a first state of another example of the touch panel according to the embodiment of the present invention, and FIG. 21 is a schematic view showing a second state of another example of the touch panel according to the embodiment of the present invention. FIG. FIG. 22 is a schematic diagram illustrating an example of a sensor sheet used in another example of the touch panel according to the embodiment of the present invention. 20 to 22, the same components as those of the touch panel 10 shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.
　図２０および図２１に示すタッチパネル１０は、図１および図２に示すタッチパネル１０に比して、第１の基体１２の裏面１２ｄ以外の全ての面がセンシング部として利用可能である点、および第２の基体１４の裏面１４ｄ以外の全ての面がセンシング部として利用可能である点が異なり、それ以外の構成は図１および図２に示すタッチパネル１０と同じである。
　図２０および図２１に示すタッチパネル１０は、第１の基体１２の側面１２ｂ、１２ｆ、１２ｇおよび端面１２ｅがセンシング部として利用可能であり、第２の基体１４の側面１４ｂ、１４ｆ、１４ｇおよび端面１４ｅがセンシング部として利用可能である。 The touch panel 10 shown in FIGS. 20 and 21 can use all surfaces other than the back surface 12d of the first base 12 as a sensing unit, as compared with the touch panel 10 shown in FIGS. 2 except that all surfaces other than the back surface 14d of the base 14 can be used as a sensing unit, and the other configurations are the same as those of the touch panel 10 shown in FIGS.
In the touch panel 10 shown in FIGS. 20 and 21, the side surfaces 12b, 12f, 12g and the end surface 12e of the first base 12 can be used as sensing units, and the side surfaces 14b, 14f, 14g and the end surface 14e of the second base 14 are used. Can be used as a sensing unit.
　センサシート１６は１枚で構成されており、例えば、図２２に示すように、切欠部１９が設けられている。切欠部１９により、第１の基体１２の側面１２ｂ、１２ｆ、１２ｇおよび端面１２ｅ、ならびに第２の基体１４の側面１４ｂ、１４ｆ、１４ｇおよび端面１４ｅを覆う領域が形成されている。センサシート１６の領域１６ａは第１の基体１２の端面１２ｅに対応する領域であり、領域１６ｂは側面１２ｆに対応する領域であり、領域１６ｃは側面１２ｇに対応する領域である。センサシート１６の領域１６ｄは第２の基体１４の端面１４ｅに対応する領域であり、領域１６ｅは側面１４ｆに対応する領域であり、領域１６ｆは側面１４ｇに対応する領域である。領域１６ｇが第１の基体１２の側面１２ｂと第２の基体１４の側面１４ｂとに対応する領域である。このように、タッチパネル１０は表面および側面をセンシング領域とし、センシング領域の拡張を実現できる。
　図２０および図２１に示すタッチパネル１０でも、表示部２０（図示せず）に画像等を表示することにより、折り畳んだ状態でも、開いた状態でもコンテンツを表示することができ、全ての側面と全ての端面とをセンシング領域として利用することができる。 The sensor sheet 16 is composed of a single sheet. For example, as shown in FIG. 22, a cutout portion 19 is provided. The cutout 19 forms regions that cover the side surfaces 12b, 12f, 12g and the end surface 12e of the first base 12 and the side surfaces 14b, 14f, 14g and the end surface 14e of the second base 14. The region 16a of the sensor sheet 16 is a region corresponding to the end surface 12e of the first base 12, the region 16b is a region corresponding to the side surface 12f, and the region 16c is a region corresponding to the side surface 12g. The region 16d of the sensor sheet 16 is a region corresponding to the end surface 14e of the second base 14, the region 16e is a region corresponding to the side surface 14f, and the region 16f is a region corresponding to the side surface 14g. The region 16g is a region corresponding to the side surface 12b of the first base 12 and the side surface 14b of the second base 14. In this way, the touch panel 10 can realize the expansion of the sensing area by using the surface and side surfaces as sensing areas.
In the touch panel 10 shown in FIG. 20 and FIG. 21 as well, by displaying an image or the like on the display unit 20 (not shown), the content can be displayed in a folded state or in an open state, and all the sides and all are displayed. Can be used as a sensing region.
　上述のいずれのタッチセンサ１８およびタッチパネル１０において、第１の基体１２と第２の基体１４とを有する構成であるが、これに限定されるものではない。例えば、複数のタッチセンサ１８を突合せ方向ＤＷ（図１および図２０参照）に接続して、タッチパネル１０としてもよい。この場合、センサシート１６は、タッチセンサ１８毎に１枚設ける構成でもよく、接続された複数のタッチセンサ１８全部に対して、１枚設ける構成でもよい。 Although any touch sensor 18 and touch panel 10 described above have the first base 12 and the second base 14, the present invention is not limited thereto. For example, a plurality of touch sensors 18 may be connected in the butting direction DW (see FIGS. 1 and 20) to form the touch panel 10. In this case, one sensor sheet 16 may be provided for each touch sensor 18, or one sensor sheet 16 may be provided for all of the plurality of connected touch sensors 18.
＜タッチセンサ部の構造＞
　次に、センサシート１６のタッチセンサ部３０についてより具体的に説明する。
　タッチセンサ部３０は、静電容量方式でも、抵抗膜方式でもよい。タッチセンサ部３０で接触された位置を検出するコントローラ（図示せず）は、タッチセンサ部３０に応じたものが適宜用いられる。タッチセンサ部３０が静電容量式であれば、静電容量が変化した位置がコントローラ（図示せず）で検出され、接触された位置が特定される。タッチセンサ部３０が抵抗膜式であれば、抵抗が変化した位置がコントローラ（図示せず）で検出され、接触された位置が特定される。 <Structure of touch sensor>
Next, the touch sensor unit 30 of the sensor sheet 16 will be described more specifically.
The touch sensor unit 30 may be a capacitance type or a resistance film type. As a controller (not shown) for detecting the position touched by the touch sensor unit 30, a controller corresponding to the touch sensor unit 30 is appropriately used. If the touch sensor unit 30 is a capacitance type, the position where the capacitance has changed is detected by a controller (not shown), and the touched position is specified. If the touch sensor unit 30 is a resistive film type, the position where the resistance has changed is detected by a controller (not shown), and the touched position is specified.
　タッチセンサ部３０について、静電容量方式のタッチセンサを例に説明するが、タッチセンサ部３０の構成は、以下に説明するものに限定されるものではない。
　タッチセンサ部３０は、図２３に示されるように、電気絶縁性を有する支持体５０と、１つの支持体５０の両面の各面にそれぞれ形成される検出電極と、検出電極の周辺に形成され、検出電極と電気的に接続された周辺配線とを有する。検出電極が導電層に相当する。
　支持体５０の表面５０ａ（図２４参照）上にそれぞれ第１の方向Ｙに沿って延び、かつ第１の方向Ｙに直交する第２の方向Ｘに並列配置された複数の第１の検出電極５２が形成され、複数の第１の検出電極５２に電気的に接続された複数の第１の周辺配線５３が互いに近接して配列されている。同様に、支持体５０の裏面５０ｂ（図２４参照）上には、それぞれ第２の方向Ｘに沿って延び、かつ第１の方向Ｙに並列配置された複数の第２の検出電極５４が形成され、複数の第２の検出電極５４に電気的に接続された複数の第２の周辺配線５５が互いに近接して配列されている。複数の第１の検出電極５２と複数の第２の検出電極５４とが検出電極である。複数の第１の検出電極５２と複数の第２の検出電極５４とは、支持体５０により電気的に絶縁され、かつ離間して、一部を重ねて配置されている。支持体５０は、少なくとも２つの導電層を電気的に絶縁する絶縁層として機能するものであり、絶縁層の一形態である。 The touch sensor unit 30 will be described using a capacitive touch sensor as an example, but the configuration of the touch sensor unit 30 is not limited to the one described below.
As shown in FIG. 23, the touch sensor unit 30 is formed on a support body 50 having electrical insulation, detection electrodes formed on both surfaces of one support body 50, and the periphery of the detection electrodes. And a peripheral wiring electrically connected to the detection electrode. The detection electrode corresponds to a conductive layer.
A plurality of first detection electrodes that extend along the first direction Y on the surface 50a (see FIG. 24) of the support 50 and are arranged in parallel in the second direction X orthogonal to the first direction Y. 52, and a plurality of first peripheral wirings 53 electrically connected to the plurality of first detection electrodes 52 are arranged close to each other. Similarly, a plurality of second detection electrodes 54 that extend along the second direction X and are arranged in parallel in the first direction Y are formed on the back surface 50b (see FIG. 24) of the support 50. A plurality of second peripheral wirings 55 electrically connected to the plurality of second detection electrodes 54 are arranged close to each other. The plurality of first detection electrodes 52 and the plurality of second detection electrodes 54 are detection electrodes. The plurality of first detection electrodes 52 and the plurality of second detection electrodes 54 are electrically insulated by the support body 50 and are spaced apart from each other and are partially overlapped. The support 50 functions as an insulating layer that electrically insulates at least two conductive layers, and is a form of the insulating layer.
　タッチセンサ部３０では、支持体５０において、複数の第１の検出電極５２と複数の第２の検出電極５４とが平面視で重なって配置される領域が検知領域５７である。検知領域５７は指等の接触の検出が可能な領域である。なお、タッチセンサ部３０の検知領域５７の大きさおよび形状等は、センサシート１６が設けられる場所により適宜決定されるものであり、上述の図２３に示す検知領域５７に限定されるものではない。 In the touch sensor unit 30, in the support body 50, a region where the plurality of first detection electrodes 52 and the plurality of second detection electrodes 54 overlap each other in plan view is a detection region 57. The detection area 57 is an area in which contact with a finger or the like can be detected. Note that the size, shape, and the like of the detection region 57 of the touch sensor unit 30 are appropriately determined depending on where the sensor sheet 16 is provided, and are not limited to the detection region 57 shown in FIG. 23 described above. .
　図２４に示すように、第１の検出電極５２は、例えば、支持体５０の表面５０ａに形成された導電線６０で構成される。第１の検出電極５２を覆う第１粘着層３２が設けられている。第１の検出電極５２の導電線６０は、例えば、図２５に示すように菱形のメッシュパターンに配置される。
　図２４に示すように、第２の検出電極５４は、例えば、支持体５０の裏面５０ｂに形成された導電線６０で構成される。第２の検出電極５４を覆う第２粘着層３６が設けられている。第２の検出電極５４の導電線６０は、例えば、図２５に示すように菱形のメッシュパターンに配置される。
　支持体５０の表面５０ａに第１の検出電極５２を形成し、裏面５０ｂに第２の検出電極５４を形成することにより、支持体５０が収縮しても第１の検出電極５２と第２の検出電極５４との位置関係のズレを小さくすることができる。 As shown in FIG. 24, the first detection electrode 52 is composed of, for example, a conductive line 60 formed on the surface 50 a of the support 50. A first adhesive layer 32 that covers the first detection electrode 52 is provided. For example, the conductive lines 60 of the first detection electrodes 52 are arranged in a diamond mesh pattern as shown in FIG.
As shown in FIG. 24, the second detection electrode 54 is constituted by, for example, a conductive line 60 formed on the back surface 50 b of the support body 50. A second adhesive layer 36 that covers the second detection electrode 54 is provided. The conductive lines 60 of the second detection electrodes 54 are arranged in a diamond mesh pattern as shown in FIG. 25, for example.
By forming the first detection electrode 52 on the front surface 50a of the support 50 and forming the second detection electrode 54 on the back surface 50b, the first detection electrode 52 and the second detection electrode 52 are formed even when the support 50 contracts. Deviations in the positional relationship with the detection electrode 54 can be reduced.
　導電線６０のメッシュパターンは、上述の菱形に限定されるものではない、メッシュパターンとしては、例えば、正三角形、二等辺三角形、直角三角形等の三角形、正方形、長方形、菱形、平行四辺形、台形等の四角形、（正）六角形、（正）八角形等の（正）ｎ角形、円、楕円、星形等を組み合わせた幾何学図形であってもよい。
　なお、メッシュパターンのメッシュとは、図２６に示すように、交差する導電線６０により構成される複数の正方形状の開口部６２を含んでいる形状を意図する。
　開口部６２の一辺の長さＰａは特に限定されるものではなく、１５００μｍ以下が好ましく、１３００μｍ以下がより好ましく、１０００μｍ以下であることが更に好ましく、５μｍ以上が好ましく、３０μｍ以上がより好ましく、８０μｍ以上が更に好ましい。開口部６２の辺の長さが上述の範囲である場合には、さらに透明性も良好に保つことが可能であり、導電性フィルムを表示部の表示面上に取り付けた際に、違和感なく表示を視認することができる。
　可視光透過率の点から、導電線６０により形成されるメッシュパターンの開口率は８５％以上であることが好ましく、９０％以上であることがより好ましく、９５％以上であることが更に好ましい。開口率とは、導電線６０がある領域を除いた支持体上の領域が全体に占める割合に相当する。 The mesh pattern of the conductive wire 60 is not limited to the above rhombus, and examples of the mesh pattern include triangles such as regular triangles, isosceles triangles, right triangles, squares, rectangles, rhombuses, parallelograms, trapezoids, and the like. A geometric figure combining a (positive) hexagon, a (positive) n-gon such as a (positive) octagon, a circle, an ellipse, a star, or the like.
In addition, the mesh of a mesh pattern intends the shape containing the some square-shaped opening part 62 comprised by the electrically conductive wire 60 which cross | intersects, as shown in FIG.
The length Pa of one side of the opening 62 is not particularly limited, is preferably 1500 μm or less, more preferably 1300 μm or less, further preferably 1000 μm or less, preferably 5 μm or more, more preferably 30 μm or more, and 80 μm. The above is more preferable. When the length of the side of the opening 62 is in the above-mentioned range, it is possible to further maintain the transparency, and when the conductive film is mounted on the display surface of the display unit, the display is performed without a sense of incongruity. Can be visually recognized.
From the viewpoint of visible light transmittance, the aperture ratio of the mesh pattern formed by the conductive wire 60 is preferably 85% or more, more preferably 90% or more, and still more preferably 95% or more. The aperture ratio corresponds to the ratio of the area on the support excluding the area where the conductive wire 60 is present to the whole.
　タッチセンサ部３０は、図２４に示す構成に限定されるものではなく、図２７に示すタッチセンサ部３０ａの構成でもよい。図２７に示すタッチセンサ部３０ａは、図２４に示すタッチセンサ部３０に比して、支持体５０に代えて、絶縁層５８が用いられ、絶縁層５８により第１の検出電極５２と第２の検出電極５４とが電気的に絶縁され、かつ離間して配置されている点が異なる。また、第２保護層３８上に第２の検出電極５４が形成されている。第１の検出電極５２は絶縁層５８の表面５８ａに形成されている点が異なる。第１の検出電極５２を覆う第１粘着層３２が設けられている。絶縁層５８の裏面５８ｂに第２粘着層３６が設けられている。
　図２７に示すタッチセンサ部３０ａは、図２４に示すタッチセンサ部３０と同様の効果を得ることができる。 The touch sensor unit 30 is not limited to the configuration shown in FIG. 24, and may have the configuration of the touch sensor unit 30a shown in FIG. Compared to the touch sensor unit 30 shown in FIG. 24, the touch sensor unit 30 a shown in FIG. 27 uses an insulating layer 58 instead of the support 50, and the insulating layer 58 and the first detection electrode 52 are connected to the second sensor electrode 30. The detection electrode 54 is electrically insulated and spaced apart. A second detection electrode 54 is formed on the second protective layer 38. The first detection electrode 52 is different in that it is formed on the surface 58 a of the insulating layer 58. A first adhesive layer 32 that covers the first detection electrode 52 is provided. A second adhesive layer 36 is provided on the back surface 58 b of the insulating layer 58.
The touch sensor unit 30a illustrated in FIG. 27 can obtain the same effects as the touch sensor unit 30 illustrated in FIG.
＜タッチセンサ部の構成＞
　以下、タッチセンサ部３０を構成する各部材について説明する。 <Configuration of touch sensor unit>
Hereinafter, each member which comprises the touch sensor part 30 is demonstrated.
〔支持体〕
　支持体は、第１の検出電極５２および第２の検出電極５４を電気的に絶縁し、かつ離間して配置することができれば、その種類は限定されるものではなく、透明支持体であることが好ましく、特にプラスチックシートが好ましい。
　支持体を構成する材料の具体例としては、ポリエチレンテレフタレート（ＰＥＴ）（２５８℃）、ポリシクロオレフィン（１３４℃）、ポリカーボネート（２５０℃）、アクリル(１２８℃)、ポリエチレンナフタレート（ＰＥＮ）（２６９℃）、ポリエチレン（ＰＥ）（１３５℃）、ポリプロピレン（ＰＰ）（１６３℃）、ポリスチレン（２３０℃）、ポリ塩化ビニル（１８０℃）、ポリ塩化ビニリデン（２１２℃）およびＴＡＣ（２９０℃）等の融点が約２９０℃以下であるプラスチックフィルムが好ましく、特に、ＰＥＴ、ポリシクロオレフィン、ポリカーボネートが好ましい。（　）内の数値は融点である。支持体の全光線透過率は、８５％～１００％であることが好ましい。全光透過率は、例えば、ＪＩＳ　Ｋ　７３７５：２００８に規定される「プラスチック－全光線透過率および全光線反射率の求め方」を用いて測定されるものである。
　支持体の厚みは特に限定されるものではないが、一般に、２５～５００μｍが好ましい。なお、タッチセンサ部が支持体の機能の他にタッチ面の機能をも兼ねる場合は、５００μｍを超えた厚みで設計することも可能である。 [Support]
The type of the support is not limited as long as the first detection electrode 52 and the second detection electrode 54 can be electrically insulated and spaced apart from each other, and the support is a transparent support. And a plastic sheet is particularly preferable.
Specific examples of the material constituting the support include polyethylene terephthalate (PET) (258 ° C.), polycycloolefin (134 ° C.), polycarbonate (250 ° C.), acrylic (128 ° C.), polyethylene naphthalate (PEN) (269 ° C), polyethylene (PE) (135 ° C), polypropylene (PP) (163 ° C), polystyrene (230 ° C), polyvinyl chloride (180 ° C), polyvinylidene chloride (212 ° C), TAC (290 ° C), etc. A plastic film having a melting point of about 290 ° C. or less is preferable, and PET, polycycloolefin, and polycarbonate are particularly preferable. Figures in parentheses are melting points. The total light transmittance of the support is preferably 85% to 100%. The total light transmittance is measured using, for example, “Plastics—How to obtain total light transmittance and total light reflectance” defined in JIS K 7375: 2008.
The thickness of the support is not particularly limited, but is generally preferably 25 to 500 μm. In addition, when the touch sensor unit also has a function of the touch surface in addition to the function of the support, it can be designed with a thickness exceeding 500 μm.
　支持体の好適態様の一つとしては、大気圧プラズマ処理、コロナ放電処理、および紫外線照射処理からなる群から選択される少なくとも一つの処理が施された処理済支持体が挙げられる。上述の処理が施されることにより、処理済支持体表面にはＯＨ基等の親水性基が導入され、導電線の密着性がより向上する。 One preferred embodiment of the support includes a treated support that has been subjected to at least one treatment selected from the group consisting of atmospheric pressure plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment. By performing the above-described treatment, hydrophilic groups such as OH groups are introduced on the treated support surface, and the adhesion of the conductive wire is further improved.
〔導電線〕
　導電線は、バインダ、および、バインダ中に分散した金属部を含有する。
　上述のバインダは第１高分子と、第１高分子よりもガラス転移温度が低い第２高分子を含有する。なお、本明細書において、ポリマーのガラス転移温度は、示差走査熱量分析（ＤＳＣ）法によって測定したガラス転移温度を意味する。ガラス転移温度は、ＪＩＳ　Ｋ７１２１（２０１２）に規定される「プラスチックの転移温度測定方法」を用いて測定されるものである。 [Conductive wire]
The conductive wire contains a binder and a metal part dispersed in the binder.
The binder described above contains a first polymer and a second polymer having a glass transition temperature lower than that of the first polymer. In addition, in this specification, the glass transition temperature of a polymer means the glass transition temperature measured by the differential scanning calorimetry (DSC) method. The glass transition temperature is measured using a “plastic transition temperature measurement method” defined in JIS K7121 (2012).
　第１高分子および第２高分子としては、例えば、疎水性ポリマー（疎水性樹脂）等が挙げられ、より具体的には、アクリル系樹脂、スチレン系樹脂、ビニル系樹脂、ポリオレフィン系樹脂、ポリエステル系樹脂、ポリウレタン系樹脂、ポリアミド系樹脂、ポリカーボネート系樹脂、ポリジエン系樹脂、エポキシ系樹脂、シリコーン系樹脂、セルロース系重合体およびキトサン系重合体、からなる群から選ばれる少なくともいずれかの樹脂、または、これらの樹脂を構成する単量体からなる共重合体等が挙げられる。
　また、ポリマーには、後述する架橋剤と反応する反応性基が含まれることが好ましい。 Examples of the first polymer and the second polymer include hydrophobic polymers (hydrophobic resins), and more specifically, acrylic resins, styrene resins, vinyl resins, polyolefin resins, polyesters. Resin, polyurethane resin, polyamide resin, polycarbonate resin, polydiene resin, epoxy resin, silicone resin, cellulose polymer, and at least one resin selected from the group consisting of chitosan polymers, or And copolymers composed of monomers constituting these resins.
Further, the polymer preferably contains a reactive group that reacts with a cross-linking agent described later.
　ポリマーとしては、以下の式Ａ、Ｂ、Ｃ、および、Ｄからなる群より選択される少なくとも１種の単位を有することが好ましい。
　中でも、第１高分子としては、よりガラス転移温度を低く制御しやすい観点から、式Ａ、Ｂ、Ｃ、および、Ｄからなる群より選択される１種の単位からなる重合体が好ましく、Ｂ、Ｃ、および、Ｄからなる群より選択される少なくとも１種の単位からなる重合体がより好ましく、式Ｄで表される単位からなる重合体が更に好ましい。 The polymer preferably has at least one unit selected from the group consisting of the following formulas A, B, C, and D.
Among them, the first polymer is preferably a polymer composed of one unit selected from the group consisting of formulas A, B, C, and D from the viewpoint of easy control of the glass transition temperature. More preferred are polymers comprising at least one unit selected from the group consisting of C, C and D, and more preferred are polymers comprising units of the formula D.
Figure JPOXMLDOC01-appb-C000001
Figure JPOXMLDOC01-appb-C000001
　Ｒ1は、メチル基またはハロゲン原子を表し、好ましくはメチル基、塩素原子、臭素原子を表す。ｐは０～２の整数を表し、０または１が好ましく、０がより好ましい。 R 1 represents a methyl group or a halogen atom, preferably a methyl group, a chlorine atom, or a bromine atom. p represents an integer of 0 to 2, preferably 0 or 1, and more preferably 0.
　Ｒ2は、メチル基またはエチル基を表し、メチル基が好ましい。
　Ｒ3は、水素原子またはメチル基を表し、水素原子が好ましい。Ｌは、２価の連結基を表し、下記一般式（２）で表される基が好ましい。
　一般式（２）：－（ＣＯ－Ｘ1）ｒ－Ｘ2－
　式中Ｘ1は、酸素原子またはＮＲ30－を表す。ここでＲ30は、水素原子、アルキル基、アリール基、またはアシル基を表し、それぞれ置換基（例えば、ハロゲン原子、ニトロ基、ヒドロキシル基等）を有してもよい。Ｒ30は、好ましくは水素原子、炭素数１～１０のアルキル基（例えば、メチル基、エチル基、ｎ－ブチル基、ｎ－オクチル基等）、アシル基（例えば、アセチル基、ベンゾイル基等）である。Ｘ1として特に好ましいのは、酸素原子またはＮＨ－である。
　Ｘ2は、アルキレン基、アリーレン基、アルキレンアリーレン基、アリーレンアルキレン基、または、アルキレンアリーレンアルキレン基を表し、これらの基には－Ｏ－、－Ｓ－、－ＯＣＯ－、－ＣＯ－、－ＣＯＯ－、－ＮＨ－、－ＳＯ2－、－Ｎ（Ｒ31）－、－Ｎ（Ｒ31）ＳＯ2－等が途中に挿入されてもよい。ここでＲ31は炭素数１～６の直鎖または分岐のアルキル基を表し、メチル基、エチル基、および、イソプロピル基等がある。Ｘ2の好ましい例として、ジメチレン基、トリメチレン基、テトラメチレン基、ｏ－フェニレン基、ｍ－フェニレン基、ｐ－フェニレン基、－ＣＨ2ＣＨ2ＯＣＯＣＨ2ＣＨ2－、および、－ＣＨ2ＣＨ2ＯＣＯ（Ｃ6Ｈ4）－等が挙げられる。
　ｒは０または１を表す。
　ｑは０または１を表し、０が好ましい。 R 2 represents a methyl group or an ethyl group, and a methyl group is preferable.
R 3 represents a hydrogen atom or a methyl group, and preferably a hydrogen atom. L represents a divalent linking group and is preferably a group represented by the following general formula (2).
Formula (2): — (CO—X 1 ) r—X 2 —
In the formula, X 1 represents an oxygen atom or NR 30 —. Here, R 30 represents a hydrogen atom, an alkyl group, an aryl group, or an acyl group, and each may have a substituent (for example, a halogen atom, a nitro group, a hydroxyl group, etc.). R 30 is preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms (eg, methyl group, ethyl group, n-butyl group, n-octyl group, etc.), acyl group (eg, acetyl group, benzoyl group, etc.) It is. Particularly preferred as X 1 is an oxygen atom or NH—.
X 2 represents an alkylene group, an arylene group, an alkylene arylene group, an arylene alkylene group, or an alkylene arylene alkylene group, and these groups include —O—, —S—, —OCO—, —CO—, and —COO. —, —NH—, —SO 2 —, —N (R 31 ) —, —N (R 31 ) SO 2 — and the like may be inserted in the middle. Here, R 31 represents a linear or branched alkyl group having 1 to 6 carbon atoms, such as a methyl group, an ethyl group, and an isopropyl group. Preferred examples of X 2 include dimethylene group, trimethylene group, tetramethylene group, o-phenylene group, m-phenylene group, p-phenylene group, —CH 2 CH 2 OCOCH 2 CH 2 —, and —CH 2 CH 2. And OCO (C 6 H 4 ) —.
r represents 0 or 1;
q represents 0 or 1, and 0 is preferable.
　Ｒ4は、炭素数１～８０のアルキル基、アルケニル基、または、アルキニル基を表し、第１高分子としては、炭素数１～５のアルキル基が好ましく、第２高分子としては、炭素数５～５０のアルキル基が好ましく、炭素数５～３０のアルキル基がより好ましく、炭素数５～２０のアルキル基が更に好ましい。
　Ｒ5は、水素原子、メチル基、エチル基、ハロゲン原子、または、－ＣＨ2ＣＯＯＲ6を表し、水素原子、メチル基、ハロゲン原子、または、－ＣＨ2ＣＯＯＲ6が好ましく、水素原子、メチル基、または、－ＣＨ2ＣＯＯＲ6が更に好ましく、水素原子が特に好ましい。
　Ｒ6は、水素原子または炭素数１～８０のアルキル基を表し、Ｒ4と同じでも異なってもよく、Ｒ6の炭素数は１～７０が好ましく、１～６０がより好ましい。 R 4 represents an alkyl group having 1 to 80 carbon atoms, an alkenyl group, or an alkynyl group, and the first polymer is preferably an alkyl group having 1 to 5 carbon atoms, and the second polymer has An alkyl group having 5 to 50 carbon atoms is preferable, an alkyl group having 5 to 30 carbon atoms is more preferable, and an alkyl group having 5 to 20 carbon atoms is still more preferable.
R 5 is a hydrogen atom, a methyl group, an ethyl group, a halogen atom, or a -CH 2 COOR 6, a hydrogen atom, a methyl group, a halogen atom or a -CH 2 COOR 6 is preferably a hydrogen atom, a methyl group Or —CH 2 COOR 6 is more preferred, and a hydrogen atom is particularly preferred.
R 6 represents a hydrogen atom or an alkyl group having 1 to 80 carbon atoms, and may be the same as or different from R 4, and R 6 preferably has 1 to 70 carbon atoms, and more preferably 1 to 60 carbon atoms.
　第１高分子および２の他の好適形態としては、水分の浸入をより防止できる点より、以下の一般式（１）で表されるポリマー（共重合体）が挙げられる。
　一般式（１）：　－（Ａ）ｘ－（Ｂ）ｙ－（Ｃ）ｚ－（Ｄ）ｗ－
　なお、一般式（１）中、Ａ、Ｂ、Ｃ、およびＤはそれぞれ、すでに説明した上述の繰り返し単位を表す。 Another preferred form of the first polymer and 2 is a polymer (copolymer) represented by the following general formula (1) from the viewpoint that moisture can be further prevented from entering.
Formula (1):-(A) x- (B) y- (C) z- (D) w-
In the general formula (1), A, B, C, and D each represent the above-described repeating unit.
　一般式（１）中、ｘ、ｙ、ｚ、およびｗは各繰り返し単位のモル比率を表す。
　ｘとしては、３～６０モル％、好ましくは３～５０モル％、より好ましくは３～４０モル％である。
　ｙとしては、３０～９６モル％、好ましくは３５～９５モル％、より好ましくは４０～９０モル％である。
　ｚとしては０．５～２５モル％、好ましくは０．５～２０モル％、より好ましくは１～２０モル％である。
　ｗとしては、０．５～４０モル％、好ましくは０．５～３０モル％である。
　一般式（１）において、ｘは３～４０モル％、ｙは４０～９０モル％、ｚは０．５～２０モル％、ｗは０．５～１０モル％の場合が特に好ましい。 In general formula (1), x, y, z, and w represent the molar ratio of each repeating unit.
x is 3 to 60 mol%, preferably 3 to 50 mol%, more preferably 3 to 40 mol%.
y is 30 to 96 mol%, preferably 35 to 95 mol%, more preferably 40 to 90 mol%.
z is 0.5 to 25 mol%, preferably 0.5 to 20 mol%, more preferably 1 to 20 mol%.
w is 0.5 to 40 mol%, preferably 0.5 to 30 mol%.
In the general formula (1), it is particularly preferable that x is 3 to 40 mol%, y is 40 to 90 mol%, z is 0.5 to 20 mol%, and w is 0.5 to 10 mol%.
　一般式（１）で表されるポリマーとしては、下記一般式（２）および一般式（３）で表されるポリマーが好ましい。 The polymer represented by the general formula (1) is preferably a polymer represented by the following general formula (2) or general formula (3).
Figure JPOXMLDOC01-appb-C000002
Figure JPOXMLDOC01-appb-C000002
　一般式（２）中、ｘ、ｙ、ｚおよびｗは、上述の定義の通りである。 In general formula (2), x, y, z and w are as defined above.

Figure JPOXMLDOC01-appb-C000003
Figure JPOXMLDOC01-appb-C000003
　上述の式中、ａ１、ｂ１、ｃ１、ｄ１、およびｅ１は各モノマー単位のモル比率を表し、ａ１は３～６０（モル％）、ｂ１は３０～９５（モル％）、ｃ１は０．５～２５（モル％）、ｄ１は０．５～４０（モル％）、ｅ１は１～１０（モル％）を表す。
　ａ１の好ましい範囲は上述のｘの好ましい範囲と同じであり、ｂ１の好ましい範囲は上述のｙの好ましい範囲と同じであり、ｃ１の好ましい範囲は上述のｚの好ましい範囲と同じであり、ｄ１の好ましい範囲は上述のｗの好ましい範囲と同じである。
　ｅ１は１～１０モル％であり、好ましくは２～９モル％であり、より好ましくは２～８モル％である。 In the above formula, a1, b1, c1, d1, and e1 represent the molar ratio of each monomer unit, a1 is 3 to 60 (mol%), b1 is 30 to 95 (mol%), and c1 is 0.5 To 25 (mol%), d1 represents 0.5 to 40 (mol%), and e1 represents 1 to 10 (mol%).
The preferred range of a1 is the same as the preferred range of x described above, the preferred range of b1 is the same as the preferred range of y, and the preferred range of c1 is the same as the preferred range of z described above. The preferred range is the same as the preferred range of w described above.
e1 is 1 to 10 mol%, preferably 2 to 9 mol%, more preferably 2 to 8 mol%.
　一般式（１）で表されるポリマーの重量平均分子量は、１０００～１００万が好ましく、２０００～７５万がより好ましく、３０００～５０万が更に好ましい。
　一般式（１）で表されるポリマーは、例えば、特許第３３０５４５９号および特許第３７５４７４５号公報等を参照して合成することができる。 The weight average molecular weight of the polymer represented by the general formula (1) is preferably 1,000 to 1,000,000, more preferably 2000 to 750,000, and still more preferably 3000 to 500,000.
The polymer represented by the general formula (1) can be synthesized with reference to, for example, Japanese Patent No. 3305459 and Japanese Patent No. 3754745.
　なお、第１高分子および第２高分子のガラス転移温度としては特に限定されるものではないが、より優れた本発明の効果を有するタッチセンサ部が得られる点で、第１高分子のガラス転移温度としては、０℃以上が好ましく、２５℃以上がより好ましく、４０℃を超えることが更に好ましい。上限としては特に限定されるものではないが、一般に１２０℃以下が好ましい。
　また、第２高分子のガラス転移温度としては特に限定されるものではないが、４０℃以下が好ましく、２５℃以下がより好ましく、２５℃未満が更に好ましく、０℃以下が特に好ましく、０℃未満が最も好ましい。下限としては特に限定されるものではないが、一般に－５０℃以上が好ましい。 The glass transition temperatures of the first polymer and the second polymer are not particularly limited, but the glass of the first polymer can be obtained in that a touch sensor unit having a better effect of the present invention can be obtained. As a transition temperature, 0 degreeC or more is preferable, 25 degreeC or more is more preferable, and it is still more preferable to exceed 40 degreeC. Although it does not specifically limit as an upper limit, Generally 120 degrees C or less is preferable.
The glass transition temperature of the second polymer is not particularly limited, but is preferably 40 ° C. or less, more preferably 25 ° C. or less, still more preferably less than 25 ° C., particularly preferably 0 ° C. or less, 0 ° C. Less than is most preferred. The lower limit is not particularly limited but is generally preferably −50 ° C. or higher.
　第１高分子のガラス転移温度と、第２高分子のガラス転移温度の差（絶対値）としては特に限定されるものではないが、一般に２０～１００℃が好ましい。第１高分子のガラス転移温度と、第２高分子のガラス転移温度の差（絶対値）が上述の範囲内だと、タッチセンサ部はより優れた本発明の効果を有する。 The difference (absolute value) between the glass transition temperature of the first polymer and the glass transition temperature of the second polymer is not particularly limited, but is generally preferably 20 to 100 ° C. When the difference (absolute value) between the glass transition temperature of the first polymer and the glass transition temperature of the second polymer is within the above-described range, the touch sensor unit has a more excellent effect of the present invention.
　導電線における金属部は、導電線の導電特性を担保する部分であり、金属部は金属により構成される。金属部を構成する金属としては、導電特性がより優れる点で、金（金属金）、銀（金属銀）、銅（金属銅）、ニッケル（金属ニッケル）、および、パラジウム（金属パラジウム）からなる群より選択される少なくとも１種の金属が好ましい。
　なお、図２８においては、金属部が粒子状になって導電線に分散した形態を記載しているが、金属部の形態としては上述の形態に限定されるものではなく、金属部が層状となって導電線に分散した形態であってもよい。
　なお、図２８はタッチセンサ部３０の導電線６０の拡大図である。図３０に示す導電線６０は、第１高分子、および第２高分子を含有するバインダ７０と、バインダ７０中に分散した複数の金属部７２とを含む。金属部７２は上述のように粒子状である。 The metal part in a conductive wire is a part which ensures the electroconductive characteristic of a conductive wire, and a metal part is comprised with the metal. The metal constituting the metal part is composed of gold (metal gold), silver (metal silver), copper (metal copper), nickel (metal nickel), and palladium (metal palladium) in that the conductive properties are more excellent. At least one metal selected from the group is preferred.
Note that, in FIG. 28, the metal part is in the form of particles and dispersed in the conductive wire. However, the form of the metal part is not limited to the above-described form, and the metal part is layered. It may be a form dispersed in conductive wires.
FIG. 28 is an enlarged view of the conductive wire 60 of the touch sensor unit 30. A conductive wire 60 shown in FIG. 30 includes a binder 70 containing a first polymer and a second polymer, and a plurality of metal parts 72 dispersed in the binder 70. The metal part 72 is particulate as described above.
　導電線には上述の以外の材料が含有されていてもよい。上述の以外の材料としては、例

えば、非金属の微粒子が挙げられる。非金属の微粒子としては、例えば、樹脂粒子、および、金属酸化物粒子等が挙げられ、金属酸化物粒子が好ましい。
　金属酸化物粒子としては、例えば、酸化ケイ素粒子、および、酸化チタン粒子等が挙げられる。 The conductive wire may contain materials other than those described above. Examples of materials other than those mentioned above are examples

For example, non-metallic fine particles can be mentioned. Examples of non-metallic fine particles include resin particles and metal oxide particles, and metal oxide particles are preferred.
Examples of the metal oxide particles include silicon oxide particles and titanium oxide particles.
　非金属の微粒子の平均粒子径としては特に限定されるものではないが、球相当径で１～１０００ｎｍが好ましく、１０～５００ｎｍがより好ましく、２０～２００ｎｍが更に好ましい。上述の範囲内であれば、タッチセンサ部はより優れた透明性を有しやすく、かつ、より優れた導電性を有しやすい。
　非金属の微粒子の球相当径は、透過型電子顕微鏡を用いて、任意の５０個分の球相当径を算出し、それらを算術平均したものである。 The average particle diameter of the nonmetallic fine particles is not particularly limited, but the equivalent sphere diameter is preferably 1 to 1000 nm, more preferably 10 to 500 nm, and still more preferably 20 to 200 nm. If it is in the above-mentioned range, a touch sensor part tends to have more excellent transparency, and it is easy to have more excellent electroconductivity.
The equivalent sphere diameter of the non-metallic fine particles is an arithmetic average of 50 equivalent sphere diameters calculated using a transmission electron microscope.
　導電線の形状は特に限定されるものではないが、タッチパネルに適用した際により優れたタッチ位置の検出性能が得られるように、線状（直線、曲線、および、これらの組み合わせ等）であるのが好ましい。この際、導電線の線幅は特に限定されるものではないが、導電線の導電特性および視認しづらさのバランスの点から、３０μｍ以下が好ましく、１５μｍ以下がより好ましく、１０μｍ以下が更に好ましく、５μｍ以下が特に好ましく、４μｍ以下が最も好ましく、０．５μｍ以上が好ましく、１．０μｍ以上がより好ましい。
　導電線の厚みは特に限定されるものではないが、薄型化と導電特性のバランスの点で、２００μｍ以下が好ましく、３０μｍ以下がより好ましく、１０μｍ以下が更に好ましく、０．３～５μｍであることが特に好ましく、０．５～５μｍであることが最も好ましい。 The shape of the conductive line is not particularly limited, but it is linear (straight line, curved line, and a combination of these) so that better touch position detection performance can be obtained when applied to a touch panel. Is preferred. At this time, the line width of the conductive line is not particularly limited, but is preferably 30 μm or less, more preferably 15 μm or less, and even more preferably 10 μm or less, from the viewpoint of the balance between the conductive characteristics of the conductive line and the difficulty of visual recognition. 5 μm or less is particularly preferable, 4 μm or less is most preferable, 0.5 μm or more is preferable, and 1.0 μm or more is more preferable.
The thickness of the conductive wire is not particularly limited, but is preferably 200 μm or less, more preferably 30 μm or less, still more preferably 10 μm or less, and more preferably 0.3 to 5 μm in terms of balance between thinning and conductive properties. Is particularly preferable, and most preferably 0.5 to 5 μm.
＜タッチセンサ部の製造方法＞
　タッチセンサ部の製造方法について、導電線の金属部が銀（金属銀）を含有する場合を例にして説明する。より優れた生産性が得られる点で以下工程を有する方法が好ましい。 <Method for manufacturing touch sensor unit>
The manufacturing method of a touch sensor part is demonstrated taking the case where the metal part of a conductive wire contains silver (metal silver) as an example. A method having the following steps is preferable in that more excellent productivity can be obtained.
・工程Ａ：
　支持体上に、少なくともハロゲン化銀と第１高分子とを含有するハロゲン化銀含有塗布液と、少なくとも第２高分子を含有する組成調整塗布液とを、同時重層塗布して、ハロゲン化銀感光性層を形成する工程。
・工程Ｂ：
　ハロゲン化銀感光性層を露光した後、現像処理して金属銀を含有する導電線を形成する工程。
　以下では、各工程について詳述する。 -Process A:
A silver halide-containing coating solution containing at least silver halide and a first polymer and a composition-adjusting coating solution containing at least a second polymer are simultaneously coated on the support, and silver halide is coated. Forming a photosensitive layer;
-Process B:
A step of forming a conductive wire containing metallic silver by exposing the silver halide photosensitive layer to development.
Below, each process is explained in full detail.
＜工程Ａ＞
　工程Ａは、支持体上に、少なくともハロゲン化銀と第１高分子とを含有するハロゲン化銀含有塗布液と、少なくとも第２高分子を含有する組成調整塗布液とを、同時重層塗布して、ハロゲン化銀感光性層を形成する工程である。
　なお、同時重層塗布する場合の各塗布液の積層順序としては特に限定されるものではない。支持体側から、ハロゲン化銀含有塗布液、および、組成調整塗布液をこの順に積層してもよい。逆に、支持体側から、組成調整塗布液、および、ハロゲン化銀含有塗布液をこの順に積層してもよい。更に、組成調整塗布液、ハロゲン化銀含有塗布液、および、組成調整塗布液をこの順に積層してもよい。 <Process A>
In step A, a silver halide-containing coating solution containing at least a silver halide and a first polymer and a composition-adjusting coating solution containing at least a second polymer are applied simultaneously on the support. And a step of forming a silver halide photosensitive layer.
In addition, there is no particular limitation on the stacking order of the coating liquids when simultaneous multilayer coating is performed. From the support side, a silver halide-containing coating solution and a composition-adjusting coating solution may be laminated in this order. Conversely, the composition-adjusting coating solution and the silver halide-containing coating solution may be laminated in this order from the support side. Further, the composition adjustment coating solution, the silver halide-containing coating solution, and the composition adjustment coating solution may be laminated in this order.
　なお、「支持体上に塗布」とは、支持体表面上に直接塗布する場合、および、支持体上に別途層が配置され、その層上に塗布する場合も含める。
　本工程では、ハロゲン化銀を含むハロゲン化銀含有塗布液と、ハロゲン化銀を含まない組成調整塗布液とを同時重層塗布しているため、両者の塗布液より形成される２層の塗膜の界面にて成分の拡散が進行する。より具体的には、支持体上に配置されるハロゲン化銀含有塗布液から形成される塗膜（以後、塗膜Ａともいう）中から、組成調整塗布液から形成される塗膜（以後、塗膜Ｂともいう）中に一部のハロゲン化銀、および、第１高分子の拡散が進行する。その結果、塗膜Ｂ中の塗膜Ａ側の領域にはハロゲン化銀、および、第１高分子が含まれ、その含有量は、塗膜Ａ中のハロゲン化銀、および、第１高分子の含有量よりも少ない。
　塗膜Ｂ中の塗膜Ａ側の領域（以下「領域Ｗ」ともいう。）には、塗膜Ａから移動したハロゲン化銀が含有されるため、後述する工程Ｂを経た後、この領域Ｗは、導電線における上部領域を形成することとなる。このとき、導電線のうち、領域Ｗにおいては第１高分子の含有量および第２高分子の含有量の合計量に対する第２高分子の含有量の含有質量比が、中間領域よりも大きくなりやすい。 In addition, “applying on the support” includes the case of applying directly on the surface of the support and the case where a separate layer is disposed on the support and applying on the layer.
In this step, since a silver halide-containing coating solution containing silver halide and a composition-adjusting coating solution not containing silver halide are applied simultaneously, a two-layer coating film formed from both coating solutions The diffusion of components proceeds at the interface. More specifically, a coating film formed from a composition-adjusting coating solution (hereinafter referred to as coating film A) from a silver halide-containing coating solution disposed on a support (hereinafter also referred to as coating film A). Part of the silver halide and the first polymer diffuse in the coating film B). As a result, the area on the coating film A side in the coating film B contains silver halide and the first polymer, and the content thereof is the silver halide and the first polymer in the coating film A. Less than the content of.
The region on the coating film A side in the coating film B (hereinafter also referred to as “region W”) contains silver halide that has moved from the coating film A. Will form the upper region in the conductive line. At this time, in the region W of the conductive wire, the content ratio of the content of the second polymer to the total amount of the content of the first polymer and the content of the second polymer is larger than that in the intermediate region. Cheap.
　なお、ハロゲン化銀含有塗布液は、少なくともハロゲン化銀と第１高分子とを含有すればよく、第２高分子を更に含有してもよい。この場合、ハロゲン化銀含有塗布液中における第１高分子の含有量および第２高分子の含有量に対する第２高分子の含有質量比は、組成調整塗布液中における第１高分子の含有量および第２高分子の含有量に対する第２高分子の含有質量比よりも小さいことが好ましい。 In addition, the silver halide containing coating liquid should just contain a silver halide and a 1st polymer at least, and may further contain a 2nd polymer. In this case, the content ratio of the second polymer to the content of the first polymer and the content of the second polymer in the silver halide-containing coating solution is the content of the first polymer in the composition-adjusted coating solution. It is preferable that the mass ratio of the second polymer is smaller than the content of the second polymer.
　また、組成調整塗布液は、少なくとも第２高分子を含有すればよく、ハロゲン化銀、および／または、第１高分子を更に含有してもよい。組成調整塗布液が更にハロゲン化銀を含有する場合、その含有量としては特に限定されるものではないが、ハロゲン化銀含有塗布液中におけるハロゲン化銀の含有量より、組成調整塗布液中におけるハロゲン化銀の含有量の方が少ないことが好ましい。そのようにすることで、より外光反射の少ないタッチセンサ部が得られやすい。
　組成調整塗布液が更に第１高分子を含有する場合、組成調整塗布液中における第１高分子の含有量および第２高分子の含有量に対する第１高分子の含有質量比は、ハロゲン化銀含有塗布液における第１高分子の含有量および第２高分子の含有量に対する第１高分子の含有質量比よりも小さいことが好ましい。 The composition-adjusting coating solution may contain at least the second polymer, and may further contain silver halide and / or the first polymer. When the composition-adjusting coating solution further contains silver halide, the content thereof is not particularly limited, but the content of the silver halide-containing coating solution in the composition-adjusting coating solution is not limited. It is preferred that the silver halide content is lower. By doing so, it is easy to obtain a touch sensor portion with less external light reflection.
When the composition-adjusting coating solution further contains the first polymer, the content ratio of the first polymer to the content of the first polymer and the content of the second polymer in the composition-adjusting coating solution is silver halide. It is preferable that the content ratio of the first polymer to the content of the first polymer and the content of the second polymer in the containing coating solution is smaller than the content ratio.
　ハロゲン化銀含有塗布液に含有されるハロゲン化銀としては特に限定されるものではなく、公知のハロゲン化銀が使用できる。ハロゲン化銀に含有されるハロゲン元素は、塩素、臭素、ヨウ素およびフッ素のいずれであってもよく、これらを組み合わせでもよい。例えば、塩化銀、臭化銀、または、ヨウ化銀を主体としたハロゲン化銀が好ましく用いられ、更に臭化銀または塩化銀を主体としたハロゲン化銀が好ましく用いられる。塩臭化銀、沃塩臭化銀、または、沃臭化銀もまた好ましく用いられる。より好ましくは、塩臭化銀、臭化銀、沃塩臭化銀、または、沃臭化銀であり、最も好ましくは、塩化銀５０モル％以上を含有する塩臭化銀、または、沃塩臭化銀が用いられる。
　なお、ここで、「臭化銀を主体としたハロゲン化銀」とは、ハロゲン化銀組成中に占める臭化物イオンのモル分率が５０％以上のハロゲン化銀をいう。この臭化銀を主体としたハロゲン化銀粒子は、臭化物イオンのほかに沃化物イオン、塩化物イオンを含有していてもよい。 The silver halide contained in the silver halide-containing coating solution is not particularly limited, and a known silver halide can be used. The halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof. For example, silver chloride, silver bromide, or silver halide mainly composed of silver iodide is preferably used, and silver halide mainly composed of silver bromide or silver chloride is preferably used. Silver chlorobromide, silver iodochlorobromide, or silver iodobromide is also preferably used. More preferably, it is silver chlorobromide, silver bromide, silver iodochlorobromide, or silver iodobromide, and most preferably silver chlorobromide or iodine salt containing 50 mol% or more of silver chloride. Silver bromide is used.
Here, “silver halide mainly composed of silver bromide” refers to silver halide in which the molar fraction of bromide ions in the silver halide composition is 50% or more. The silver halide grains mainly composed of silver bromide may contain iodide ions and chloride ions in addition to bromide ions.
　ハロゲン化銀は固体粒子状であり、ハロゲン化銀の平均粒子サイズは、球相当径で０．１～１０００ｎｍ（１μｍ）であることが好ましく、０．１～３００ｎｍであることがより好ましく、１～２００ｎｍであることが更に好ましい。
　なお、ハロゲン化銀粒子の球相当径とは、粒子形状が球形の同じ体積を有する粒子の直径である。 The silver halide is in the form of a solid grain, and the average grain size of the silver halide is preferably 0.1 to 1000 nm (1 μm), more preferably 0.1 to 300 nm in terms of a sphere equivalent diameter. More preferably, it is -200 nm.
The sphere equivalent diameter of silver halide grains is the diameter of grains having the same volume and having a spherical shape.
　ハロゲン化銀粒子の形状は特に限定されず、例えば、球状、立方体状、平板状（６角平板状、三角形平板状、４角形平板状等）、八面体状、および、１４面体状等様々な形状であることができる。
　また、ハロゲン化銀の安定化または高感化のために用いられるロジウム化合物、イリジウム化合物等のＶＩＩＩ族、ＶＩＩＢ族に属する金属化合物、パラジウム化合物の利用については、特開２００９－１８８３６０号公報の段落００３９～段落００４２の記載を参照することができる。更に化学増感については、特開２００９－１８８３６０号公報の段落００４３の技術記載を参照することができる。 The shape of the silver halide grains is not particularly limited. For example, various shapes such as a spherical shape, a cubic shape, a flat plate shape (hexagonal flat plate shape, triangular flat plate shape, tetragonal flat plate shape, etc.), octahedral shape, and tetrahedral shape are available. It can be in shape.
Also, regarding the use of metal compounds belonging to Group VIII and VIIB, such as rhodium compounds and iridium compounds, and palladium compounds used for stabilizing or enhancing the sensitivity of silver halide, paragraph 0039 of JP-A-2009-188360. Reference can be made to the description in paragraph 0042. Further, regarding chemical sensitization, reference can be made to the technical description in paragraph 0043 of JP-A-2009-188360.
　ハロゲン化銀含有塗布液に含有され、組成調整塗布液に含有されることがある第１高分子、および、組成調整塗布液に含有され、ハロゲン化銀含有塗布液に含有されることがある第２高分子の形態としては既に説明したとおりであるため、説明は省略する。
　ハロゲン化銀含有塗布液、および、組成調整塗布液は、ハロゲン化銀、第１高分子、および、第２高分子以外の成分を含有していてもよく、それらの成分はハロゲン化銀含有塗布液、および、組成調整塗布液において共通であり、以下に説明するとおりである。 The first polymer that is contained in the silver halide-containing coating solution and may be contained in the composition-adjusting coating solution, and the first polymer that is contained in the composition-adjusting coating solution and may be contained in the silver halide-containing coating solution. Since the two polymer forms are as already described, the description thereof is omitted.
The silver halide-containing coating solution and the composition-adjusting coating solution may contain components other than silver halide, the first polymer, and the second polymer, and these components are silver halide-containing coatings. This is common in the liquid and the composition-adjusting coating liquid, as described below.
　ハロゲン化銀含有塗布液、および、組成調整塗布液は、更にゼラチンを含有してもよい。
　ゼラチンの種類は特に限定されるものではなく、例えば、石灰処理ゼラチンの他、酸処理ゼラチンを用いてもよく、ゼラチンの加水分解物、ゼラチン酵素分解物、および、アミノ基またはカルボキシル基を修飾したゼラチン（フタル化ゼラチン、アセチル化ゼラチン）を使用することもできる。 The silver halide-containing coating solution and the composition-adjusting coating solution may further contain gelatin.
The type of gelatin is not particularly limited. For example, in addition to lime-processed gelatin, acid-processed gelatin may be used, and gelatin hydrolyzate, gelatin enzyme-decomposed product, and amino group or carboxyl group are modified. Gelatin (phthalated gelatin, acetylated gelatin) can also be used.
　ハロゲン化銀含有塗布液、および、組成調整塗布液は、更に溶媒を含有してもよい。使用される溶媒としては、例えば、水、有機溶媒（例えば、メタノール等のアルコール類、アセトン等のケトン類、ホルムアミド等のアミド類、ジメチルスルホキシド等のスルホキシド類、酢酸エチル等のエステル類、エーテル類等）、イオン性液体、および、これらの混合溶媒を挙げることができる。 The silver halide-containing coating solution and the composition-adjusting coating solution may further contain a solvent. Examples of the solvent used include water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, esters such as ethyl acetate, ethers, and the like. Etc.), ionic liquids, and mixed solvents thereof.
　ハロゲン化銀含有塗布液、および、組成調整塗布液には、必要に応じて、上述した材料以外の他の材料が含まれていてもよい。例えば、上述の第１高分子および第２高分子を架橋するために使用される架橋剤が含まれることが好ましい。架橋剤が含まれることによりポリマー間での架橋が進行し、後述する工程においてゼラチンが分解除去された際にも金属銀同士の連結が保たれ、結果として導電特性がより優れる。 The silver halide-containing coating solution and the composition-adjusting coating solution may contain other materials than the above-described materials as necessary. For example, it is preferable that a crosslinking agent used to crosslink the first polymer and the second polymer described above is included. By including the cross-linking agent, cross-linking between the polymers proceeds, and even when gelatin is decomposed and removed in a process described later, the connection between the metal silvers is maintained, and as a result, the conductive properties are more excellent.
　ハロゲン化銀含有塗布液と組成調整塗布液とを同時重層塗布する方法は特に限定されるものではなく、公知の方法を採用することができ、例えば、ダイ塗布方式を用いることが好ましい。ダイ塗布方式にはスライド塗布方式、エクストルージョン塗布方式、カーテン塗布方式があるが、スライド塗布方式またはエクストルージョン塗布が好ましく、薄層塗布適性が高いエクストルージョン塗布が最も好ましい。 The method for simultaneous multilayer coating of the silver halide-containing coating solution and the composition-adjusting coating solution is not particularly limited, and a known method can be adopted. For example, a die coating method is preferably used. The die coating method includes a slide coating method, an extrusion coating method, and a curtain coating method, but a slide coating method or an extrusion coating method is preferable, and an extrusion coating method with high suitability for thin layer coating is most preferable.
　なお、上述の同時重層塗布する際には、上述したタッチパネル用導電性フィルムの第１実施態様の形態が得られやすい点から、所定の基板上に塗布した際に形成される膜（表面膜）の乾燥厚みが３００ｎｍ以上となるような組成の第２高分子を含有する組成調整塗布液を使用することが好ましい。 In addition, when applying the above-described simultaneous multilayer coating, a film (surface film) formed when applied on a predetermined substrate from the viewpoint that the form of the first embodiment of the conductive film for touch panel described above is easily obtained. It is preferable to use a composition-adjusting coating solution containing a second polymer having a composition such that the dry thickness of the film becomes 300 nm or more.
　また、同時重層塗布を実施した後、得られた塗膜に対して、必要に応じて、乾燥処理を施してもよい。乾燥処理を実施することにより、ハロゲン化銀含有塗布液より得られる塗膜および組成調整塗布液より得られる塗膜に含まれる溶媒を容易に除去することができる。 In addition, after the simultaneous multilayer coating, the obtained coating film may be subjected to a drying treatment as necessary. By carrying out the drying treatment, the solvent contained in the coating film obtained from the silver halide-containing coating solution and the coating film obtained from the composition-adjusting coating solution can be easily removed.

　上述の処理により、ハロゲン化銀を含有する感光性層を支持体上に形成することができる。なお、本明細書では、上述の「ハロゲン化銀を含有する感光性層」を「ハロゲン化銀感光性層」、または、単に「感光性層」ということがある。
By the above-described treatment, a photosensitive layer containing silver halide can be formed on the support. In the present specification, the above-mentioned “photosensitive layer containing silver halide” may be referred to as “silver halide photosensitive layer” or simply “photosensitive layer”.
＜工程Ｂ＞
　工程Ｂは、ハロゲン化銀感光性層を露光した後、現像処理して金属銀を含有する導電線を形成する工程である。
　本工程により、ハロゲン化銀が還元され、金属銀を含む導電線が形成される。なお、通常、露光処理はパターン状に実施され、露光部では金属銀を含む導電線が形成される。一方、非露光部では、後述する現像処理によってハロゲン化銀が溶出される。上述のゼラチンおよび上述の高分子を含む非導電線が形成される。非導電線には実質的に金属銀が含まれておらず、非導電線とは導電性を示さない領域を意図する。
　以下では、本工程で実施される露光処理と現像処理とについて詳述する。 <Process B>
Step B is a step of forming a conductive wire containing metal silver by exposing the silver halide photosensitive layer and developing it.
By this step, the silver halide is reduced and a conductive wire containing metallic silver is formed. Normally, the exposure process is performed in a pattern, and a conductive line containing metallic silver is formed in the exposed portion. On the other hand, in the non-exposed portion, silver halide is eluted by a development process described later. A non-conductive line comprising the above gelatin and the above polymer is formed. The non-conductive line is substantially free of metallic silver, and the non-conductive line is intended to indicate a region that does not exhibit conductivity.
Below, the exposure process and development process implemented at this process are explained in full detail.
　露光処理は、感光性層に露光を行う処理である。感光性層に対してパターン状の露光を施すことにより、露光領域における感光性層中のハロゲン化銀が潜像を形成する。この潜像が形成された領域は、後述する現像処理によって導電線を形成する。一方、露光がなされなかった未露光領域では、後述する現像処理の際にハロゲン化銀が溶解して感光性層から流出し、透明な膜（非導電線）が得られる。
　露光の際に使用される光源は特に限定されるものではなく、可視光線、紫外線等の光、または、Ｘ線等の放射線等が挙げられる。
　パターン露光を行う方法は特に限定されるものではなく、例えば、フォトマスクを利用した面露光で行ってもよいし、レーザービームによる走査露光で行ってもよい。なお、パターンの形状は特に限定されるものではなく、形成したい導電線のパターンに合わせて適宜調整される。 The exposure process is a process for exposing the photosensitive layer. By subjecting the photosensitive layer to pattern exposure, the silver halide in the photosensitive layer in the exposed region forms a latent image. In the area where the latent image is formed, a conductive line is formed by development processing described later. On the other hand, in an unexposed area that has not been exposed, the silver halide dissolves and flows out of the photosensitive layer during the development processing described later, and a transparent film (non-conductive line) is obtained.
The light source used in the exposure is not particularly limited, and examples thereof include light such as visible light and ultraviolet light, and radiation such as X-rays.
The method for performing pattern exposure is not particularly limited. For example, surface exposure using a photomask may be performed, or scanning exposure using a laser beam may be performed. The shape of the pattern is not particularly limited, and is appropriately adjusted according to the pattern of the conductive line desired to be formed.
　現像処理の方法は特に限定されるものではないが、例えば、銀塩写真フイルム、印画紙、印刷製版用フイルム、および、フォトマスク用エマルジョンマスク等に用いられる通常の現像処理の技術を用いることができる。
　現像処理の際に使用される現像液の種類は特に限定されるものではないが、例えば、ＰＱ（ｐｈｅｎｉｄｏｎｅ　ｈｙｄｒｏｑｕｉｎｏｎｅ）現像液、ＭＱ（Ｍｅｔｏｌ　ｈｙｄｒｏｑｕｉｎｏｎｅ）現像液、および、ＭＡＡ（メトール・アスコルビン酸）現像液等を用いることもできる。
　現像処理は、未露光部分の銀塩を除去して安定化させる目的で行われる定着処理を含むことができる。定着処理は、銀塩写真フイルム、印画紙、印刷製版用フイルム、および、フォトマスク用エマルジョンマスク等に用いられる定着処理の技術を用いることができる。
　定着工程における定着温度は、約２０℃～約５０℃が好ましく、２５～４５℃がより好ましい。また、定着時間は５秒～１分が好ましく、７秒～５０秒がより好ましい。
　現像、定着処理を施した感光性層は、水洗処理および安定化処理を施されるのが好ましい。 The development processing method is not particularly limited. For example, a normal development processing technique used for a silver salt photographic film, a photographic paper, a printing plate film, a photomask emulsion mask, or the like may be used. it can.
The type of developer used in the development process is not particularly limited. For example, PQ (phenidone hydroquinone) developer, MQ (Metal hydroquinone) developer, and MAA (methol ascorbic acid) developer. A liquid or the like can also be used.
The development process can include a fixing process performed for the purpose of removing and stabilizing the silver salt in the unexposed part. For the fixing process, a technique of a fixing process used for a silver salt photographic film, a photographic paper, a printing plate-making film, a photomask emulsion mask, or the like can be used.
The fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds.
The photosensitive layer that has been subjected to development and fixing treatment is preferably subjected to water washing treatment and stabilization treatment.
　上述の工程Ａおよび工程Ｂ以外のその他の工程を有していてもよい。
　その他の工程としては、例えば、
　工程Ｂの後に、導電線の金属銀同士を互いに融着させる工程Ｆ；
　工程Ａの後であって、工程Ｂの前に、ハロゲン化銀感光性層と、金属吸着性置換基または金属吸着性構造を有する化合物（以下、「特定化合物」ともいう。）と、を接触させる工程Ｃ１；
　工程Ｂの後であって、工程Ｆの前に、導電線と特定化合物とを接触させる工程Ｃ２；
　工程Ｂの後であって、工程Ｆの前に、更に、導電線を圧密化する工程Ｄ；

　ハロゲン化銀含有塗布液、および、組成調整塗布液からなる群より選択される少なくとも１種が、ゼラチンを含有する場合に、工程Ｂの後であって、工程Ｄの前に、導電線中のゼラチンを除去する工程Ｅ；
等が挙げられる。また、その他の工程としては、後述する易接着層形成工程等も挙げられる。以下では、その他の工程について説明する。 You may have other processes other than the above-mentioned process A and process B.
As other processes, for example,
After Step B, Step F for fusing metal silver of conductive wires to each other;
After Step A and before Step B, the silver halide photosensitive layer is contacted with a compound having a metal-adsorbing substituent or a metal-adsorbing structure (hereinafter also referred to as “specific compound”). Step C1 of causing;
Step C2 after contacting the conductive wire and the specific compound after Step B and before Step F;
Step D after step B and before step F, further consolidating the conductive wires;

When at least one selected from the group consisting of a silver halide-containing coating solution and a composition-adjusting coating solution contains gelatin, it is after step B and before step D. Removing gelatin E;
Etc. In addition, examples of other processes include an easy-adhesion layer forming process described later. Hereinafter, other steps will be described.
（工程Ｆ）
　工程Ｆは、工程Ｂの後に、導電線の（導電線に含有される）金属銀同士を互いに融着させる工程である。本工程により、金属銀同士が融着する結果、より優れた導電性を有する導電線を備えたタッチセンサ部が得られる。 (Process F)
Step F is a step of fusing metal silver (contained in the conductive wire) of the conductive wires to each other after Step B. As a result of the fusion of the metallic silver by this step, a touch sensor unit provided with a conductive wire having better conductivity is obtained.
　加熱の方法としては特に限定されるものではないが、導電線を有する支持体を過熱蒸気に接触させる処理が挙げられる。
　過熱蒸気としては特に限定されるものではなく、過熱水蒸気でよいし、過熱水蒸気に他のガスを混合させたものでもよい。
　過熱蒸気は、供給時間１０～３００秒の範囲で導電線に接触させることが好ましい。供給時間が１０秒以上であると、導電率の向上が大きい。また、３００秒以下だと、十分に導電率が向上するため、経済性の点からより好ましい。
　また、過熱蒸気は、供給量が５００～６００ｇ／ｍ3の範囲で導電線に接触させることが好ましく、過熱蒸気の温度は、１気圧で１００～１６０℃に制御されることが好ましい。 Although it does not specifically limit as a heating method, The process which makes the support body which has an electrically conductive wire contact superheated steam is mentioned.
The superheated steam is not particularly limited, and may be superheated steam or a mixture of superheated steam with another gas.
The superheated steam is preferably brought into contact with the conductive wire within a supply time of 10 to 300 seconds. When the supply time is 10 seconds or more, the conductivity is greatly improved. Moreover, since it will fully improve electroconductivity as it is 300 seconds or less, it is more preferable from the point of economical efficiency.
The superheated steam is preferably brought into contact with the conductive wire in a supply amount range of 500 to 600 g / m 3 , and the temperature of the superheated steam is preferably controlled to 100 to 160 ° C. at 1 atm.
　加熱処理の他の方法としては、８０～１５０℃での加熱処理が挙げられる。
　加熱時間は特に限定されるものではないが、上述の効果がより優れる点で、０．１～５．０時間が好ましく、０．５～１．０時間がより好ましい。 As another method of heat treatment, heat treatment at 80 to 150 ° C. may be mentioned.
The heating time is not particularly limited, but is preferably 0.1 to 5.0 hours, and more preferably 0.5 to 1.0 hours, from the viewpoint that the above-described effects are more excellent.
（工程Ｃ１）
　工程Ｃ１は、工程Ａの後であって、工程Ｂの前に実施され、ハロゲン化銀感光性層と、特定化合物とを接触させる工程である。本工程によって、後段の工程Ｂにおいて生じた金属銀同士がより融着しにくくなる。本工程においては、ハロゲン化銀感光性層に特定化合物を接触させるため、ハロゲン化銀感光性層のより表面に近い領域（界面領域）において、金属銀同士が融着しにくくなるという効果を有する。従って、特に後段の工程によって得られる導電線において、界面領域において金属銀同士の融着がより阻害されやすい。また、この場合であっても、導電線の中間領域においては、十分に金属銀同士が融着するものと考えられ、優れた導電性を有するタッチセンサ部が得られる。 (Process C1)
Step C1 is a step that is performed after Step A and before Step B, and brings the silver halide photosensitive layer into contact with the specific compound. By this step, the metallic silver produced in the subsequent step B becomes more difficult to fuse. In this step, since the specific compound is brought into contact with the silver halide photosensitive layer, the silver halide photosensitive layer has an effect that metal silver is hardly fused in a region closer to the surface (interface region). . Therefore, particularly in a conductive wire obtained by a subsequent process, fusion between metallic silvers is more likely to be inhibited in the interface region. Even in this case, it is considered that the metal silver is sufficiently fused in the intermediate region of the conductive wire, and a touch sensor unit having excellent conductivity can be obtained.
　タッチセンサ部の製造方法は、工程Ｃ１または後述する工程Ｃ２を有することが好ましく、工程Ｃ１および工程Ｃ２を有していてもよい。 It is preferable that the manufacturing method of a touch sensor part has the process C1 or the process C2 mentioned later, and may have the process C1 and the process C2.
　特定化合物とハロゲン化銀感光性層を接触させる方法としては特に限定されるものではないが、典型的には特定化合物が溶解、および／または、分散された溶液と、ハロゲン化銀感光性層とを接触させる方法が挙げられる。また、特定化合物を含有する気体と、ハロゲン化銀感光性層とを接触させる方法であってもよい。 A method for bringing the specific compound into contact with the silver halide photosensitive layer is not particularly limited, but typically, a solution in which the specific compound is dissolved and / or dispersed, a silver halide photosensitive layer, Can be mentioned. Moreover, the method of making the gas containing a specific compound and a silver halide photosensitive layer contact may be sufficient.
　特定化合物を含有する溶液とハロゲン化銀感光性層とを接触させる方法としては特に限定されるものではないが、溶液にハロゲン化銀感光性層を浸漬させる方法、および、ハロゲン化銀感光性層に溶液を塗布する方法等が挙げられ、溶液にハロゲン化銀感光性層を浸漬させる方法がより好ましい。溶液にハロゲン化銀感光性層を浸漬させる方法は、より簡便な装置で、より安定的に実施でき、また、浸漬後に洗浄すれば、余剰の溶液をより容易に除去できるため、好ましい。
The method of bringing the solution containing the specific compound into contact with the silver halide photosensitive layer is not particularly limited, but a method of immersing the silver halide photosensitive layer in the solution, and a silver halide photosensitive layer And a method of immersing the silver halide photosensitive layer in the solution is more preferable. The method of immersing the silver halide photosensitive layer in the solution is preferable because it can be carried out more stably with a simpler apparatus, and if it is washed after immersion, the excess solution can be removed more easily.
　また、ハロゲン化銀感光性層と、金属吸着性部位を有する化合物を含有する気体、および／または、溶液とを接触させる方法は、ハロゲン化銀感光性層の表面において、金属銀が上述の化合物に吸着されやすいという特徴も有する。これにより、導電線の表面において金属銀が互いに融着するのがより阻害されやすい。 In addition, the method of bringing the silver halide photosensitive layer into contact with a gas containing a compound having a metal adsorbing site and / or a solution is as follows. It also has a feature that it is easily adsorbed on the surface. Thereby, it is easier to inhibit metallic silver from fusing together on the surface of the conductive wire.
　特定化合物は、金属吸着性置換基または金属吸着性構造（以下、これらをあわせて「金属吸着性部位」ともいう。）を有する化合物である。 The specific compound is a compound having a metal-adsorbing substituent or a metal-adsorbing structure (hereinafter also referred to as “metal-adsorbing site”).
　金属吸着性置換基としては、特に限定されるものではないが、金属吸着性置換基としては、カルボキシル基またはその塩、酸アミド基、アミノ基、イミダゾール基、ピラゾール基、チオール基、チオエーテル基、および、ジスルフィド基からなる群より選択される少なくとも１種が好ましい。 The metal-adsorptive substituent is not particularly limited, and examples of the metal-adsorptive substituent include a carboxyl group or a salt thereof, an acid amide group, an amino group, an imidazole group, a pyrazole group, a thiol group, a thioether group, And at least 1 sort (s) selected from the group which consists of a disulfide group is preferable.
　金属吸着性構造としては特に限定されるものではないが、含窒素ヘテロ環が好ましく、５または６員環アゾール類が好ましく、５員環アゾール類がより好ましい。
　含窒素ヘテロ環としては、例えば、テトラゾール環、トリアゾール環、イミダゾール環、チアジアゾール環、オキサジアゾール環、セレナジアゾール環、オキサゾール環、チアゾール環、ベンズオキサゾール環、ベンゾチアゾール環、ベンズイミダゾール環、ピリミジン環、トリアザインデン環、テトラアザインデン環、ベンゾインダゾール環、ベンゾトリアゾール環、ベンゾオキサゾール環、ベンゾチアゾール環、ピリジン環、キノリン環、ピペリジン環、ピペラジン環、キノキサリン環、モルホリン環、および、ペンタアザインデン環等が挙げられる。
　これらの環は、置換基を有してもよく、置換基としては、ニトロ基、ハロゲン原子（例えば、塩素原子、および、臭素原子）、シアノ基、置換もしくは無置換のアルキル基（例えば、メチル基、エチル基、プロピル基、ｔ－ブチル基、および、シアノエチル基の各基）、アリール基（例えば、フェニル基、４－メタンスルホンアミドフェニル基、４－メチルフェニル基、３，４－ジクロルフェニル基、および、ナフチル基の各基）、アルケニル基（例えば、アリル基）、アラルキル基（例えば、ベンジル基、４－メチルベンジル基、および、フェネチル基の各基）、スルホニル基（例えば、メタンスルホニル基、エタンスルホニル基、および、ｐ－トルエンスルホニル基の各基）、カルバモイル基（例えば、無置換カルバモイル基、メチルカルバモイル基、および、フェニルカルバモイル基の各基）、スルファモイル基（例えば、無置換スルファモイル基、メチルスルファモイル基、および、フェニルスルファモイル基の各基）、カルボンアミド基（例えば、アセトアミド基、および、ベンズアミド基の各基）、スルホンアミド基（例えば、メタンスルホンアミド基、ベンゼンスルホンアミド基、および、ｐ－トルエンスルホンアミド基の各基）、アシルオキシ基（例えば、アセチルオキシ基、および、ベンゾイルオキシ基の各基）、スルホニルオキシ基（例えば、メタンスルホニルオキシ基）、ウレイド基（例えば、無置換ウレイド基、メチルウレイド基、エチルウレイド基、および、フェニルウレイド基の各基）、アシル基（例えば、アセチル基、および、ベンゾイル基の各基）、オキシカルボニル基（例えば、メトキシカルボニル基、および、フェノキシカルボニル基の各基）、および、ヒドロキシル基等が挙げられる。置換基は、一つの環に複数置換してもよい。 Although it does not specifically limit as a metal adsorptive structure, A nitrogen-containing heterocyclic ring is preferable, 5- or 6-membered ring azoles are preferable and 5-membered ring azoles are more preferable.
Examples of the nitrogen-containing heterocycle include tetrazole ring, triazole ring, imidazole ring, thiadiazole ring, oxadiazole ring, serenadiazole ring, oxazole ring, thiazole ring, benzoxazole ring, benzothiazole ring, benzimidazole ring, pyrimidine Ring, triazaindene ring, tetraazaindene ring, benzoindazole ring, benzotriazole ring, benzoxazole ring, benzothiazole ring, pyridine ring, quinoline ring, piperidine ring, piperazine ring, quinoxaline ring, morpholine ring, and pentaaza And indene ring.
These rings may have a substituent, and examples of the substituent include a nitro group, a halogen atom (for example, a chlorine atom and a bromine atom), a cyano group, a substituted or unsubstituted alkyl group (for example, methyl Group, ethyl group, propyl group, t-butyl group, and cyanoethyl group), aryl group (eg, phenyl group, 4-methanesulfonamidophenyl group, 4-methylphenyl group, 3,4-dichloro) Phenyl group and naphthyl group), alkenyl group (for example, allyl group), aralkyl group (for example, benzyl group, 4-methylbenzyl group, and phenethyl group), sulfonyl group (for example, methane group) Sulfonyl group, ethanesulfonyl group and p-toluenesulfonyl group), carbamoyl group (for example, unsubstituted carbamoyl group, methyl Bamoyl group and phenylcarbamoyl group), sulfamoyl group (for example, unsubstituted sulfamoyl group, methylsulfamoyl group, and phenylsulfamoyl group), carbonamido group (for example, acetamido group, And benzamide group), sulfonamide group (for example, methanesulfonamide group, benzenesulfonamide group, and p-toluenesulfonamide group), acyloxy group (for example, acetyloxy group, and benzoyl group) Oxy group), sulfonyloxy group (for example, methanesulfonyloxy group), ureido group (for example, unsubstituted ureido group, methylureido group, ethylureido group, and phenylureido group), acyl group ( For example, each group of acetyl group and benzoyl group , Oxycarbonyl group (e.g., methoxycarbonyl group, and each group of phenoxycarbonyl group), and include a hydroxyl group. Multiple substituents may be substituted on one ring.
　上述の化合物としては含窒素６員環を有する化合物（含窒素６員環化合物）が好ましく、含窒素６員環化合物としては、トリアジン環、ピリミジン環、ピリジン環、ピロリン環、ピペリジン環、ピリダジン環、または、ピラジン環を有する化合物が好ましく、トリアジン環またはピリミジン環を有する化合物がより好ましい。これらの含窒素６員環化合物は置換基を有していてもよく、置換基としては、炭素数１～６（好ましくは１～３）のアルキル基、炭素数１～６（好ましくは１～３）のアルコキシ基、水酸基、カルボキシル基、メルカプト基、炭素数１～６（好ましくは１～３）のアルコキシアルキル基、および、炭素数１～６（好ましくは１～３）のヒドロキシアルキル基が挙げられる。
　含窒素６員環化合物の具体例としては、トリアジン、メチルトリアジン、ジメチルトリアジン、ヒドロキシエチルトリアジン、ピリミジン、４－メチルピリミジン、ピリジン、および、ピロリンが挙げられる。 As the above-mentioned compound, a compound having a nitrogen-containing 6-membered ring (nitrogen-containing 6-membered ring compound) is preferable. Examples of the nitrogen-containing 6-membered ring compound include triazine ring, pyrimidine ring, pyridine ring, pyrroline ring, piperidine ring, pyridazine ring. Alternatively, a compound having a pyrazine ring is preferable, and a compound having a triazine ring or a pyrimidine ring is more preferable. These nitrogen-containing 6-membered ring compounds may have a substituent. Examples of the substituent include an alkyl group having 1 to 6 carbon atoms (preferably 1 to 3), and 1 to 6 carbon atoms (preferably 1 to 3 carbon atoms). 3) an alkoxy group, a hydroxyl group, a carboxyl group, a mercapto group, an alkoxyalkyl group having 1 to 6 carbon atoms (preferably 1 to 3), and a hydroxyalkyl group having 1 to 6 carbon atoms (preferably 1 to 3). Can be mentioned.
Specific examples of the nitrogen-containing 6-membered ring compound include triazine, methyltriazine, dimethyltriazine, hydroxyethyltriazine, pyrimidine, 4-methylpyrimidine, pyridine, and pyrroline.
　上述の化合物は、金属吸着性部位の１種を単独で有しても、２種以上を有してもよいが、上述の化合物は、２種以上の金属吸着性部位を有していることが好ましい。 The above compound may have one kind of metal adsorbing site alone or two or more kinds, but the above compound has two or more kinds of metal adsorbing sites. Is preferred.
（工程Ｃ２）
　工程Ｃ２は、工程Ｂの後であって、工程Ｆの前に実施され、導電線と、特定化合物とを接触させる工程である。本工程によって、導電線の（導電線に含まれる）金属銀同士がより融着しにくくなる。本工程においては、導電線に特定化合物を接触させるため、導電線のより表面に近い領域（界面領域）において、金属銀同士が融着しにくくなるという効果を有する。従って、導電線の界面領域において金属銀同士の融着がより阻害されやすい。また、この場合であっても、導電線の中間領域においては、十分に金属銀同士が融着するものと考えられ、優れた導電性を有するタッチセンサ部が得られる。 (Process C2)
Step C2 is a step that is performed after Step B and before Step F, and brings the conductive wire into contact with the specific compound. This step makes it more difficult for metal silver (contained in the conductive wire) of the conductive wires to be fused together. In this step, since the specific compound is brought into contact with the conductive wire, there is an effect that the metallic silver is hardly fused in a region (interface region) closer to the surface of the conductive wire. Therefore, the fusion of metallic silver is more likely to be inhibited in the interface region of the conductive wire. Even in this case, it is considered that the metal silver is sufficiently fused in the intermediate region of the conductive wire, and a touch sensor unit having excellent conductivity can be obtained.
　なお、本工程において、導電線と特定化合物とを接触させる方法、および、特定化合物の形態等については、既に説明した工程Ｃ１における各形態と同様であるため、説明を省略する。 In this step, the method for bringing the conductive wire into contact with the specific compound, the form of the specific compound, and the like are the same as those in the already-described step C1, and thus the description thereof is omitted.
（工程Ｄ）
　工程Ｄは、工程Ｂの後であって上述の工程Ｆの前に、導電線を圧密化する工程である。本工程によって、導電線の導電性がより向上するとともに、導電線の支持体への密着性がより向上しやすい。 (Process D)
The process D is a process of consolidating the conductive wires after the process B and before the above-described process F. By this step, the conductivity of the conductive wire is further improved, and the adhesion of the conductive wire to the support is more likely to be improved.
　導電線を圧密化する方法としては特に限定されるものではないが、例えば、導電線を有する支持体を、少なくとも一対のロール間を加圧下で通過させるカレンダ処理工程が好ましい。以下、カレンダーロールを用いた圧密化処理をカレンダ処理と記す。 The method for consolidating the conductive wire is not particularly limited, but, for example, a calendering process in which a support having a conductive wire is passed under pressure between at least a pair of rolls is preferable. Hereinafter, consolidation processing using a calendar roll is referred to as calendar processing.
　カレンダ処理に用いられるロールとしては、プラスチックロールおよび金属ロールが挙げられる。シワ防止の点からプラスチックロールが好ましい。ロール間の圧力としては特に限定されるものではない。ロール間の圧力は、富士フイルム株式会社製プレスケール（高圧用）を用いて測定できる。
　カレンダ処理に用いられるロールの表面粗さＲａは、得られる導電線がより視認されにくい点で、０～２．０μｍが好ましく、０．３～１．０μｍがより好ましい。 Examples of the roll used for the calendar process include a plastic roll and a metal roll. From the viewpoint of preventing wrinkles, a plastic roll is preferable. The pressure between the rolls is not particularly limited. The pressure between the rolls can be measured using a prescale (for high pressure) manufactured by FUJIFILM Corporation.
The surface roughness Ra of the roll used for the calendering treatment is preferably 0 to 2.0 μm, more preferably 0.3 to 1.0 μm, from the viewpoint that the obtained conductive wire is less visible.
　圧密化処理の温度は特に限定されるものではないが、１０℃（温調なし）～１００℃が好ましく、導電線のパターンの画線密度、形状、および、バインダ種によって異なるが、１０℃（温調なし）～５０℃がより好ましい。 The temperature of the consolidation treatment is not particularly limited, but is preferably 10 ° C. (no temperature control) to 100 ° C., and varies depending on the line density, shape, and binder type of the conductive wire pattern. No temperature control) to 50 ° C. is more preferable.
（工程Ｅ）
　ハロゲン化銀含有塗布液、および、組成調整塗布液からなる群より選択される少なくとも１種が、ゼラチンを含有する場合に、工程Ｅは、工程Ｂの後であって、工程Ｄの前に、導電線（導電線に含有される）のゼラチンを除去する工程である。ゼラチンを除去することにより、結果として導電線の金属銀の含有量が相対的に高まるため、より優れた導電性を有する導電線が得られる。
　工程Ｅはゼラチンの全部を除去する工程であってもよいし、ゼラチンの一部を除去する工程であってもよい。また、工程Ｅにおいては、導電線に加えて、支持体上の導電線以外の部分（例えば、非導電線）からゼラチンを除去してもよい。
(Process E)
When at least one selected from the group consisting of a silver halide-containing coating solution and a composition-adjusting coating solution contains gelatin, step E is after step B and before step D. This is a step of removing gelatin from conductive lines (contained in conductive lines). By removing gelatin, as a result, the content of metallic silver in the conductive wire is relatively increased, so that a conductive wire having better conductivity can be obtained.
Step E may be a step of removing all of gelatin or a step of removing a part of gelatin. In step E, gelatin may be removed from portions other than the conductive lines on the support (for example, non-conductive lines) in addition to the conductive lines.
　ゼラチンを除去する方法としては特に限定されるものではないが、例えば、タンパク質分解酵素を用いて分解除去する方法、および、所定の酸化剤を用いて分解除去する方法が挙げられる。
　なお、タンパク質分解酵素を用いてゼラチンを分解除去する方法としては、例えば、特開２０１４－２０９３３２号公報の段落００８４～００７７に記載の方法を採用できる。
　また、酸化剤を用いてゼラチンを分解除去する方法としては、例えば、特開２０１４－１１２５１２号公報の段落００６４～００６６に記載の方法を採用できる。 The method for removing gelatin is not particularly limited, and examples thereof include a method for decomposing and removing using a proteolytic enzyme and a method for decomposing and removing using a predetermined oxidizing agent.
As a method for degrading and removing gelatin using a proteolytic enzyme, for example, the method described in paragraphs 0084 to 0077 of JP-A-2014-209332 can be employed.
Further, as a method for decomposing and removing gelatin using an oxidizing agent, for example, the method described in paragraphs 0064 to 0066 of JP-A-2014-112512 can be employed.
（易接着層形成工程）
　易接着層形成工程は、工程Ａの前に、支持体上に易接着層（以下、「下塗り層」ともいう。）を形成し、易接着層（下塗り層）付き支持体を得る工程である。支持体上に下塗り層を形成する方法としては特に限定されるものではないが、支持体上に下塗り層形成用組成物を塗布する方法が挙げられる。下塗り層形成工程では、形成される下塗り層が、隣接する他の層（支持体、および、非導電線等）との間で、屈折率の差の絶対値がより小さくなるよう、調整されることが好ましい。下塗り層と隣接する他の層との間の屈折率の差を調整する方法としては特に限定されるものではないが、各層の形成に用いられる組成物中に含有される各成分の種類を調整する方法が挙げられる。 (Easily adhesive layer forming process)
The easy-adhesion layer forming step is a step of forming an easy-adhesion layer (hereinafter also referred to as “undercoat layer”) on the support before Step A to obtain a support with an easy-adhesion layer (undercoat layer). . The method for forming the undercoat layer on the support is not particularly limited, and examples thereof include a method of applying the undercoat layer forming composition on the support. In the undercoat layer forming step, the formed undercoat layer is adjusted so that the absolute value of the difference in refractive index between other adjacent layers (such as the support and the non-conductive line) becomes smaller. It is preferable. The method for adjusting the difference in refractive index between the undercoat layer and another adjacent layer is not particularly limited, but the type of each component contained in the composition used for forming each layer is adjusted. The method of doing is mentioned.
　易接着層を形成する方法としては特に限定されるものではないが、易接着層形成用組成物を支持体上に塗布して、必要に応じて加熱処理を施す方法が挙げられる。易接着層形成用組成物は、溶媒を含有してもよい。溶媒の種類は特に限定されるものではなく、ハロゲン化銀含有塗布液等が含有することがある溶媒として既に説明したとおりである。
　易接着層の厚みは特に限定されるものではないが、支持体と、ハロゲン化銀感光性層および導電線との密着性がより向上する点で、０．０２～０．３μｍが好ましい。
　易接着層としては特に限定されるものではなく、例えば、特開２００８－２０８３１０号公報に記載の第１接着層の好適な適用例を、好適に用いることができる。 Although it does not specifically limit as a method to form an easily bonding layer, The method of apply | coating the composition for easily bonding layer formation on a support body and heat-processing as needed is mentioned. The composition for easily bonding layer formation may contain a solvent. The type of the solvent is not particularly limited, and is as already described as the solvent that may be contained in the silver halide-containing coating solution.
The thickness of the easy-adhesion layer is not particularly limited, but is preferably 0.02 to 0.3 μm from the viewpoint of further improving the adhesion between the support, the silver halide photosensitive layer and the conductive wire.
The easily adhesive layer is not particularly limited, and for example, a suitable application example of the first adhesive layer described in JP-A-2008-208310 can be suitably used.
＜タッチセンサ部の他の製造方法＞
　タッチセンサ部３０、３０ａは、導電線６０を支持体５０に形成することができれば、その製造方法は、上述の方法に、特に限定されるものではなく、例えば、めっき法、蒸着法および印刷法等が適宜利用可能である。
　なお、導電線６０は、導電性を有し、導電層として機能すれば、その構成は特に限定されるものではない。導電線６０は、金属または合金で形成されていることが好ましい。導電線６０は、金属の場合、銀、アルミニウム、モリブデン、銅、チタン、金またはタングステンが好ましく、なかでも、導電線の導電性が優れる理由から、銀であることがより好ましい。これら以外に、導電線６０には、カーボンナノチューブ（ＣＮＴ）、およびカーボンナノバッド（ＣＮＢ）等の炭素性の導電材料、ＩＴＯ（Indium Tin Oxide）、およびＳｎＯ２等の導電性酸化物を用いることができる。導電層に作用する引張応力を低減できるため、導電線６０は金属以外の炭素性の導電材料および導電性酸化物を用いても十分な折り曲げ耐性を得ることができる。
　導電線６０の中には、導電線と支持体５０との密着性の観点から、バインダが含まれていることが好ましい。
　バインダとしては、導電線と支持体５０との密着性がより優れる理由から、樹脂が好ましく、より具体的には、（メタ）アクリル系樹脂、スチレン系樹脂、ビニル系樹脂、ポリオレフィン系樹脂、ポリエステル系樹脂、ポリウレタン系樹脂、ポリアミド系樹脂、ポリカーボネート系樹脂、ポリジエン系樹脂、エポキシ系樹脂、シリコーン系樹脂、セルロース系重合体およびキトサン系重合体からなる群から選ばれる少なくともいずれかの樹脂、または、これらの樹脂を構成する単量体からなる共重合体等が挙げられる。 <Other manufacturing method of touch sensor unit>
If the touch sensor parts 30 and 30a can form the conductive wire 60 in the support body 50, the manufacturing method will not be specifically limited to the above-mentioned method, For example, the plating method, the vapor deposition method, and the printing method Etc. can be used as appropriate.
The configuration of the conductive wire 60 is not particularly limited as long as it has conductivity and functions as a conductive layer. The conductive wire 60 is preferably formed of a metal or an alloy. In the case of a metal, the conductive wire 60 is preferably silver, aluminum, molybdenum, copper, titanium, gold, or tungsten. Among them, silver is more preferable because the conductivity of the conductive wire is excellent. In addition to these, carbonaceous conductive materials such as carbon nanotubes (CNT) and carbon nanobuds (CNB), and conductive oxides such as ITO (Indium Tin Oxide) and SnO 2 are used for the conductive wires 60. Can do. Since the tensile stress acting on the conductive layer can be reduced, the conductive wire 60 can obtain sufficient bending resistance even if a carbonaceous conductive material other than metal and a conductive oxide are used.
The conductive wire 60 preferably contains a binder from the viewpoint of adhesion between the conductive wire and the support 50.
As the binder, a resin is preferable because the adhesion between the conductive wire and the support 50 is more excellent. More specifically, a (meth) acrylic resin, a styrene resin, a vinyl resin, a polyolefin resin, a polyester is preferable. Resin, polyurethane resin, polyamide resin, polycarbonate resin, polydiene resin, epoxy resin, silicone resin, cellulose polymer, and at least one resin selected from the group consisting of chitosan polymers, or Examples thereof include copolymers composed of monomers constituting these resins.

　めっき法よる導電線６０の形成方法について説明する。例えば、導電線６０は、無電解めっき下地層に無電解めっきすることにより下地層上に形成される金属めっき膜で構成することができる。この場合、少なくとも金属微粒子を含有する触媒インクを基材上にパターン状に形成した後に、基材を無電解めっき浴に浸漬し、金属めっき膜を形成することで形成される。より具体的には、特開２０１４－１５９６２０号公報に記載の金属被膜基材の製造方法を利用することができる。また、少なくとも金属触媒前駆体と相互作用しうる官能基を有する樹脂組成物を基材上にパターン状に形成した後、触媒または触媒前駆体を付与し、基材を無電解めっき浴に浸漬し、金属めっき膜を形成することで形成される。より具体的には、特開２０１２－１４４７６１号公報に記載の金属被膜基材の製造方法を応用することができる。
A method for forming the conductive wire 60 by plating will be described. For example, the conductive wire 60 can be formed of a metal plating film formed on the underlayer by electroless plating on the electroless plating underlayer. In this case, the catalyst ink containing at least metal fine particles is formed in a pattern on the substrate, and then the substrate is immersed in an electroless plating bath to form a metal plating film. More specifically, the method for producing a metal-coated substrate described in JP 2014-159620 A can be used. In addition, after forming a resin composition having a functional group capable of interacting with at least a metal catalyst precursor in a pattern on a substrate, a catalyst or a catalyst precursor is applied, and the substrate is immersed in an electroless plating bath. It is formed by forming a metal plating film. More specifically, the method for producing a metal film substrate described in JP 2012-144661 A can be applied.
　また、蒸着法よる導電線６０の形成方法について説明する。まず、蒸着により、銅箔層を形成し、フォトリソグラフィー法により銅箔層から銅配線を形成することにより、導電線６０を形成することができる。銅箔層は、蒸着銅箔以外にも、電解銅箔が利用可能である。より具体的には、特開２０１４－２９６１４号公報に記載の銅配線を形成する工程を利用することができる。
　また、印刷法よる導電線６０の形成方法について説明する。まず、導電性粉末を含有する導電性ペーストを導電線６０と同じパターンで基板に塗布し、その後、加熱処理を施すことにより導電線６０を形成することができる。導電性ペーストを用いたパターン形成は、例えば、インクジェット法またはスクリーン印刷法でなされる。導電性ペーストとしては、より具体的には、特開２０１１－２８９８５号公報に記載の導電性ペーストを利用することができる。 A method for forming the conductive wire 60 by vapor deposition will be described. First, the conductive wire 60 can be formed by forming a copper foil layer by vapor deposition and forming a copper wiring from the copper foil layer by a photolithography method. As the copper foil layer, an electrolytic copper foil can be used in addition to the deposited copper foil. More specifically, the step of forming a copper wiring described in JP 2014-29614 A can be used.
In addition, a method for forming the conductive line 60 by a printing method will be described. First, the conductive wire 60 can be formed by applying a conductive paste containing conductive powder to the substrate in the same pattern as the conductive wire 60 and then performing a heat treatment. The pattern formation using the conductive paste is performed by, for example, an ink jet method or a screen printing method. More specifically, the conductive paste described in JP 2011-28985 A can be used as the conductive paste.
　本発明は、基本的に以上のように構成されるものである。以上、本発明のタッチセンサおよびタッチパネルについて詳細に説明したが、本発明は上述の実施形態に限定されず、本発明の主旨を逸脱しない範囲において、種々の改良または変更をしてもよいのはもちろんである。 The present invention is basically configured as described above. The touch sensor and touch panel of the present invention have been described in detail above, but the present invention is not limited to the above-described embodiment, and various improvements or modifications may be made without departing from the spirit of the present invention. Of course.
　１０　タッチパネル
　１２　第１の基体
　１２ａ、１４ａ　表面
　１２ｂ、１２ｆ、１２ｇ　側面
　１２ｃ、１４ｃ　切欠き
　１２ｄ、１４ｄ　裏面
　１２ｅ、１４ｅ　端面
　１４　第２の基体
　１４ｂ、１４ｆ、１４ｇ　側面
　１４ｃ　切欠き
　１４ｄ　裏面
　１６　センサシート
　１６ａ、１６ｂ、１６ｃ、１６ｄ、１６ｅ、１６ｆ、１６ｇ　領域
　１７　角部
　１８　タッチセンサ
　１９　切欠部
　２０　表示部
　３０、３０ａ　タッチセンサ部
　３２　第１粘着層
　３４　第１保護層
　３６　第２粘着層

　３８　第２保護層
　３９　保護層
　４０　第１接着層
　４２　第２接着層
　５０　支持体
　５０ａ　表面
　５０ｂ　裏面
　５２　第１の検出電極
　５３　第１の周辺配線
　５４　第２の検出電極
　５５　第２の周辺配線
　５７　検知領域
　５８　絶縁層
　５８ａ　表面
　５８ｂ　裏面
　６０　導電線
　６０ａ　表面
　６２　開口部
　７０　バインダ
　７２　金属部
　ＤＬ　方向
　ＤＷ　突合せ方向
　Ｘ　第２の方向
　Ｙ　第１の方向 DESCRIPTION OF SYMBOLS 10 Touch panel 12 1st base | substrate 12a, 14a Surface 12b, 12f, 12g Side surface 12c, 14c Notch 12d, 14d Back surface 12e, 14e End surface 14 2nd base | substrate 14b, 14f, 14g Side surface 14c Notch 14d Back surface 16 Sensor sheet 16a , 16b, 16c, 16d, 16e, 16f, 16g Region 17 Corner portion 18 Touch sensor 19 Notch portion 20 Display portion 30, 30a Touch sensor portion 32 First adhesive layer 34 First protective layer 36 Second adhesive layer

38 second protective layer 39 protective layer 40 first adhesive layer 42 second adhesive layer 50 support 50a surface 50b back surface 52 first detection electrode 53 first peripheral wiring 54 second detection electrode 55 second peripheral wiring 57 Detection area 58 Insulating layer 58a Front surface 58b Back surface 60 Conductive line 60a Surface 62 Opening 70 Binder 72 Metal part DL direction DW Butting direction X Second direction Y First direction

Claims (10)

  1. 　互いの側面同士を対向させ、かつ揺動可能に接続された、２つの基体と、
    　２つの前記基体の表面と接続された前記側面とに設けられた、接触を検出する１枚のセンサシートとを有し、
    　前記センサシートが設けられた状態で、２つの前記基体は、互いの前記側面が対向し、かつ２つの前記基体の前記表面が同一平面に位置する第１の状態と、２つの前記基体の互いの裏面が対向する第２の状態とになる、タッチセンサ。
    Two bases facing each other and connected so as to be swingable;
    One sensor sheet for detecting contact, provided on the side surface connected to the surface of the two bases,
    In the state in which the sensor sheet is provided, the two substrates are in a first state in which the side surfaces of the two substrates are opposed to each other and the surfaces of the two substrates are in the same plane, and the two substrates are mutually aligned. The touch sensor which will be in the 2nd state which the back surface opposes.
  2. 　２つの前記基体は、それぞれ接続された前記側面に、前記第１の状態において前記センサシートが設けられている側とは反対側に、前記側面同士の対向方向と直交する辺部に沿って切欠きが設けられている、請求項１に記載のタッチセンサ。
    The two base bodies are cut along the sides perpendicular to the opposing direction of the side surfaces, on the side surfaces connected to each other, on the side opposite to the side where the sensor sheet is provided in the first state. The touch sensor according to claim 1, wherein a notch is provided.
  3. 　前記センサシートが設けられている前記基体の前記表面と、接続された前記側面とは、それぞれ前記センサシートに接着層により接着されており、前記基体の前記表面と、接続された前記側面とは前記接着層の接着力が異なる、請求項１または２に記載のタッチセンサ。
    The surface of the substrate on which the sensor sheet is provided and the connected side surface are respectively bonded to the sensor sheet by an adhesive layer, and the surface of the substrate and the connected side surface are The touch sensor according to claim 1, wherein the adhesive force of the adhesive layer is different.
  4. 　前記センサシートは、前記基体との間に保護層が設けられており、
    　前記保護層は、弾性率が１０ＭＰａ以上９．８ＧＰａ以下である、請求項１～３のいずれか１項に記載のタッチセンサ。
    The sensor sheet is provided with a protective layer between the substrate and the sensor sheet,
    The touch sensor according to any one of claims 1 to 3, wherein the protective layer has an elastic modulus of 10 MPa or more and 9.8 GPa or less.
  5. 　前記基体の前記表面と前記側面とが交わる角部以外に、接着層が設けられている、請求項３または４に記載のタッチセンサ。
    The touch sensor according to claim 3, wherein an adhesive layer is provided in addition to a corner portion where the surface and the side surface of the base body intersect.
  6. 　前記基体の前記表面と前記側面とが交わる角部に設けられた接着層は、前記基体の前記表面、および前記側面に設けられた前記接着層よりも厚みが薄い、請求項３または４に記載のタッチセンサ。
    The adhesive layer provided in the corner | angular part where the said surface and the said side surface of the said base | substrate cross | intersect the thickness of the said adhesive layer provided in the said surface of the said base | substrate and the said side surface. Touch sensor.
  7. 　２つの前記基体は、ヒンジ部材により揺動可能に接続されている、請求項１～６のいずれか１項に記載のタッチセンサ。
    The touch sensor according to any one of claims 1 to 6, wherein the two bases are swingably connected by a hinge member.
  8. 　２つの前記基体は、板状部材で構成されている、請求項１～７のいずれか１項に記載のタッチセンサ。
    The touch sensor according to any one of claims 1 to 7, wherein the two bases are configured by plate-like members.
  9. 　前記請求項１～８のいずれか１項に記載のタッチセンサを有し、
    　前記基体は、表示部を有する、タッチパネル。
    The touch sensor according to any one of claims 1 to 8,
    The base is a touch panel having a display unit.
  10. 　前記請求項１～８のいずれか１項に記載のタッチセンサと、
    　前記タッチセンサの前記基体の前記裏面に設けられた表示部とを有する、タッチパネル。     The touch sensor according to any one of claims 1 to 8,
    And a display unit provided on the back surface of the base body of the touch sensor.
PCT/JP2019/014637 2018-04-25 2019-04-02 Touch sensor and touch panel WO2019208125A1 (en)

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JP2017102945A (en) * 2008-09-08 2017-06-08 クゥアルコム・インコーポレイテッドＱｕａｌｃｏｍｍ Ｉｎｃｏｒｐｏｒａｔｅｄ Multi-panel electronic device
JP2015129917A (en) * 2013-12-02 2015-07-16 株式会社半導体エネルギー研究所 Information processing device

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