CN113316370A - Heat exchange assembly, heat dissipation structure and motor controller - Google Patents
Heat exchange assembly, heat dissipation structure and motor controller Download PDFInfo
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- CN113316370A CN113316370A CN202110620503.9A CN202110620503A CN113316370A CN 113316370 A CN113316370 A CN 113316370A CN 202110620503 A CN202110620503 A CN 202110620503A CN 113316370 A CN113316370 A CN 113316370A
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- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- Microelectronics & Electronic Packaging (AREA)
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- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat exchange assembly, a heat dissipation structure and a motor controller. The heat exchange assembly comprises at least two layers of stacked radiating fins, a plurality of through holes are formed in each radiating fin at intervals, a liquid inlet of cooling liquid is formed in one side face of one layer of radiating fin, and a liquid outlet of the cooling liquid is formed in the other side face of the other adjacent layer of radiating fin; wherein, the orthographic projections of the two through holes positioned at the opposite positions of the two adjacent layers of radiating fins on the plane of the radiating fins are arranged in a cross way, so as to form a flow channel for the cooling liquid to flow from the liquid inlet to the liquid outlet. According to the technical scheme, when the cooling liquid is introduced into the heat exchange assembly, the cooling liquid can simultaneously flow transversely and longitudinally on the two adjacent layers of radiating fins, the flowing direction and the flowing range of the cooling liquid are increased, the turbulent flow effect of the cooling liquid is enhanced, and therefore the heat dissipation efficiency is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor heat dissipation, in particular to a heat exchange assembly, a heat dissipation structure and a motor controller.
Background
At present, a chip module of an electric vehicle controller, such as a cold plate of an IGBT (Insulated Gate Bipolar transistor) module, has various structural forms, such as a flat plate, a hobbing, a forged Pinfin (nail), and the like. However, the gaps between the fins of the above cold plate structures are large, the fins are relatively independent, heat cannot be transferred between different fins, the difference of the heat dissipation capacity of the fins at different positions is large, when cooling liquid is introduced, the flow of the cooling liquid is performed in the same plane, the heat convection effect is general, and the heat dissipation effect is poor.
Disclosure of Invention
The invention mainly aims to provide a heat exchange assembly, aiming at enhancing the convection heat exchange effect of cooling liquid in the heat exchange assembly so as to improve the heat exchange efficiency.
In order to achieve the purpose, the heat exchange assembly provided by the invention comprises at least two layers of stacked radiating fins, wherein a plurality of through holes are formed in the radiating fins at intervals, a liquid inlet of cooling liquid is formed in one side surface of one layer of radiating fin, and a liquid outlet of the cooling liquid is formed in the other side surface of the other adjacent layer of radiating fin;
the through holes positioned at the opposite positions of the two adjacent layers of radiating fins are arranged in a crossed manner in the orthographic projection on the plane where the radiating fins are positioned so as to form a flow channel for the cooling liquid to flow from the liquid inlet to the liquid outlet.
In an embodiment of the invention, the projections of the two through holes at opposite positions on the adjacent two layers of the heat sinks on the substrate are connected end to end.
In an embodiment of the present invention, two adjacent layers of heat dissipation fins are attached to each other.
In an embodiment of the present invention, the through holes are strip-shaped holes; the heat exchange assembly is defined to be a first direction from one side of the liquid inlet to one side of the liquid outlet, and the extending direction of the through hole is inclined relative to the first direction.
In an embodiment of the present invention, the through holes are strip-shaped holes; the direction of the heat exchange assembly from one side provided with the liquid inlet to one side provided with the liquid outlet is defined as a first direction, wherein the extending direction of the through hole on one heat radiating fin is parallel to the first direction, and the extending direction of the through hole on the other adjacent heat radiating fin is perpendicular to the first direction.
In an embodiment of the present invention, two adjacent layers of the heat dissipation fins have the same shape and are stacked in a staggered manner; the staggered angle of two adjacent layers of radiating fins is 180 degrees.
In an embodiment of the present invention, the heat exchange assembly includes multiple layers of stacked heat dissipation fins, where two adjacent layers of heat dissipation fins are defined as a first heat dissipation fin and a second heat dissipation fin, respectively, and an orthographic projection of the through hole on the first heat dissipation fin on a plane where the second heat dissipation fin is located is intersected with the through hole at a relative position on the second heat dissipation fin;
defining a cooling fin adjacent to one side of the first cooling fin, which is far away from the second cooling fin, as a third cooling fin, and defining a cooling fin adjacent to one side of the second cooling fin, which is far away from the first cooling fin, as a fourth cooling fin;
the orthographic projection of the through hole on the third radiating fin on the plane where the first radiating fin is located is superposed with the through hole on the relative position on the first radiating fin, and/or the orthographic projection of the through hole on the fourth radiating fin on the plane where the second radiating fin is located is superposed with the through hole on the relative position on the second radiating fin.
In order to achieve the above object, the present invention further provides a heat dissipation structure, which includes a substrate and the heat exchange assembly, wherein the heat exchange assembly is disposed on the substrate.
In an embodiment of the present invention, the substrate includes a substrate layer stacked in multiple layers, and at least a portion of the substrate layer has a plurality of heat dissipation holes; at least one heat dissipation hole is communicated with at least one through hole.
In an embodiment of the present invention, the heat dissipation holes of the two adjacent substrate layers are staggered and at least partially overlapped to form a flow channel.
In an embodiment of the present invention, a groove is formed on a surface of the substrate, and the heat exchange assembly is mounted in the groove.
In order to achieve the above object, the present invention further provides a motor controller, including a power module and the above heat dissipation structure; the heat dissipation structure comprises a substrate and the heat exchange assembly, the heat exchange assembly is arranged on the substrate, and one side of the substrate, which is far away from the heat exchange assembly, is fixedly connected with the power module.
In the technical scheme of the invention, the heat exchange component comprises at least two layers of heat radiating fins which are stacked, and the heat exchange area is increased by forming a plurality of through holes which are arranged at intervals on the heat radiating fins; simultaneously, orthographic projections of the two through holes on the radiating fins, which are positioned at the opposite positions of the two adjacent layers of radiating fins, are arranged into a cross structure, so that the two through holes on the two adjacent layers of radiating fins can be communicated, and a flow channel for cooling liquid from a liquid inlet to a liquid outlet is formed, and when the cooling liquid is injected into the heat exchange assembly, the cooling liquid can simultaneously realize transverse and longitudinal flow on the two adjacent layers of radiating fins, the flow direction and the flow range of the cooling liquid are increased, and the heat exchange efficiency and the heat dissipation efficiency of the heat exchange assembly are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a motor controller according to an embodiment of the present invention;
FIG. 2 is an exploded view of an embodiment of the motor controller of the present invention;
FIG. 3 is a schematic structural diagram of a cooling liquid channel in an embodiment of a heat dissipation structure of the invention;
FIG. 4 is a schematic view of another structure of a cooling liquid channel in an embodiment of a heat dissipation structure of the invention;
FIG. 5 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present invention;
FIG. 6 is an exploded view of an embodiment of a heat dissipation structure of the present invention;
FIG. 7 is a schematic structural diagram of another embodiment of a motor controller according to the present invention;
fig. 8 is a schematic diagram of a heat exchanger and a substrate with a groove according to the heat dissipation structure of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) | |
| 100 | |
210 | |
|
| 110 | |
201 | Through |
|
| 111 | |
210a | |
|
| 101 | Groove | | Liquid outlet | |
| 200 | |
300 | Power module |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a heat exchange assembly, aiming at improving the structure of the heat exchange assembly for exchanging heat by using cooling liquid, and enhancing the turbulence effect of the cooling liquid when the cooling liquid circulates in the heat exchange assembly so as to further improve the overall heat exchange effect and the heat dissipation effect of the heat exchange assembly. It can be understood that the heat exchange assembly provided by the invention can be suitable for any occasions needing heat exchange and heat dissipation by utilizing flowing of cooling liquid, is not limited to a certain specific heat dissipation occasion, and is not limited to a heat exchange assembly with a certain shape and structure.
In the embodiment of the present invention, as shown in fig. 1 to 4, the heat exchange assembly 200 includes at least two layers of stacked heat dissipation fins 210, the heat dissipation fins 210 are formed with a plurality of through holes 201 arranged at intervals, one side surface of one layer of heat dissipation fins 210 is formed with a liquid inlet 210a for cooling liquid, and the other side surface of the other adjacent layer of heat dissipation fins 210 is formed with a liquid outlet 210b for cooling liquid;
the projections of the two through holes 201 on the adjacent two layers of cooling fins 210 are arranged in a cross manner, so as to form a flow channel for the cooling liquid from the liquid inlet 210a to the liquid outlet 210 b.
When the heat exchange assembly 200 is applied, it may be directly mounted on a certain mounting platform, for example, on a heat generating device (such as a power module), or indirectly mounted on the heat generating device through the substrate 100, so as to contact the heat generating device for heat exchange, thereby implementing heat exchange and heat dissipation functions of the heat generating device. The heat exchange assembly 200 comprises at least two layers of heat radiating fins 210 which are stacked, a plurality of through holes 201 which are arranged at intervals are formed in each heat radiating fin 210, the plurality of through holes 201 play a role in increasing the heat exchange area, meanwhile, the path of heat longitudinal conduction is also increased, and the heat radiating efficiency of a heating device is accelerated. On this basis, the orthographic projections of the two through holes 201 at the opposite positions of the two adjacent layers of the heat dissipation fins 210 on the heat dissipation fins 210 are arranged in a crossed manner, and the two through holes 201 at the opposite positions on the two adjacent layers of the heat dissipation fins 210 are communicated with each other, so that heat can be transferred from the through hole 201 of one heat dissipation fin 210 to the through hole 201 of the other heat dissipation fin 210 in the stacking direction of the two layers of the heat dissipation fins 210, and the heat transfer path is further increased. It can be understood that the through holes 201 on the two adjacent layers of the heat dissipation fins 210 are arranged in a cross manner, when the cooling liquid is injected into the heat exchange assembly 200, the through holes 201 which are communicated with each other form a flow channel for the cooling liquid to flow from the liquid inlet 210a to the liquid outlet 210b, so that the cooling liquid can longitudinally flow from one heat dissipation fin 210 to another heat dissipation fin 210, and can transversely flow on the same heat dissipation fin 210, thereby increasing the flow direction of the cooling liquid and improving the heat exchange efficiency.
It can be understood that, though the heat dissipation post can conduct the temperature of the device that generates heat to heat exchange assembly among the prior art, but the heat dissipation post is inhomogeneous along its length direction upper temperature during heat conduction, the clearance has between the different heat dissipation posts, the body of heat dissipation post is also inhomogeneous with the temperature of periphery, it is inhomogeneous to lead to the coolant liquid heat transfer when flowing through the heat dissipation post, and this application is through improving the heat dissipation post for the fin, adopt the face contact to conduct heat, heat transfer assembly's heat conductivility has been strengthened greatly, can make the heat spread on the fin fast. On the other hand, because the radiating fins are arranged in a stacking mode, different radiating fins are different from the heat source in distance, through the crossed arrangement of the through holes in the two adjacent layers of radiating fins, the heat exchange of the cooling liquid between different radiating fins can be ensured, the cooling liquid can transversely flow on the same radiating fin, and the temperature uniformity of the heat exchange assembly is better due to the three-dimensional flow path of the cooling liquid.
In addition, the heat sink 210 has a plurality of through holes 201 formed at intervals, and the arrangement and shape of the plurality of through holes 210 may be determined according to actual conditions, for example, the plurality of through holes 210 may be regularly distributed in an array or irregularly distributed in a scattered manner. The cross-sectional shape of the through-hole 201 may be circular, triangular, square, or other irregular shapes.
Two through holes 201 in opposite positions on two adjacent layers of cooling fins 210 are arranged in a crossed manner, and it can be understood that one through hole 201 on one cooling fin 210 is communicated with one through hole 201 on the other cooling fin 210 in a crossed manner, that is, the through holes 201 on two adjacent layers of cooling fins 210 are in one-to-one correspondence, so that the flow guiding effect on the cooling liquid is strong, the flow resistance of the cooling liquid is reduced, and the energy loss is reduced. It can also be understood that a through hole 201 on one heat sink 210 is simultaneously in cross communication with two or more through holes 201 on another heat sink 210, and at this time, the through holes 201 on two adjacent layers of heat sinks 210 are in a one-to-many correspondence manner, so that the flow paths of the cooling liquid are increased, a strong turbulent flow effect is generated on the cooling liquid, the contact time between the cooling liquid and the heat sink 210 is prolonged, and the heat exchange efficiency is improved.
In the practical application process, the manner of introducing the cooling liquid into the heat exchange assembly 200 can be determined according to the practical situation, for example, the cooling liquid can be introduced from one side of the heat exchange assembly 200, and the cooling liquid can be discharged from the other side; or liquid is fed in and discharged from the same side of the heat exchange assembly 200; or the heat exchange assembly 200 may be placed directly in a fluid bath with flowing cooling fluid. When the cooling liquid flows to the other side from one side of the heat exchange assembly 200, the through holes 201 penetrating the side surfaces of the cooling fin 210 are formed in the side, facing the liquid inlet, of the cooling fin 210, so that the cooling liquid enters from the through holes 201 (equivalent to the liquid inlet 210a) in one side and flows out from the through holes 201 (equivalent to the liquid outlet 210b) in the other side, at the moment, the through holes 201 in the heat exchange assembly 200 form flow channels of the cooling liquid, the cooling liquid can simultaneously flow transversely and longitudinally in the heat exchange assembly 200, the flow area is ensured, and the heat dissipation effect is improved. When the cooling liquid enters from one side of the heat exchange assembly 200 and flows out from the same side, at least two through holes 201 penetrating through the side surface of the heat sink 210 are arranged on one side of the heat sink 210 facing the liquid inlet to allow the cooling liquid to enter and flow out respectively, and the through holes 201 in the heat sink form a flow channel of the cooling liquid. When the heat exchange assembly 200 is directly placed in a tank with cooling liquid, the heat sink 210 is immersed in the cooling liquid, and the through hole 201 can be arranged on the side surface or the top surface of the heat sink 210, as long as it is ensured that the through hole 201 in the heat exchange assembly 200 can form a flow channel of the cooling liquid.
It should be noted that the stacking manner between two adjacent layers of fins 210 may be a close stacking, or may be an interval stacking. When the heat exchange component 200 is attached and stacked, the through hole 201 on one heat dissipation fin 210 and the plate surface of the other heat dissipation fin 210 enclose to form a cooling liquid flow channel extending in parallel along the plate surface of the heat dissipation fin 210, namely in this way, cooling liquid flows in the through hole 201 in the heat exchange component 200, and the through hole 201 can play a role in guiding flow; when the interval piles up, be formed with the middle runner that supplies the coolant liquid to flow between the adjacent two-layer fin 210, the through-hole 201 that lies in on two-layer fin 210 this moment can all communicate with middle runner, utilize through-hole 201 to realize the coolant liquid from runner water conservancy diversion to another middle runner in the middle of one, can change the flow direction originally of coolant liquid simultaneously, played the vortex effect to the coolant liquid.
In practical applications, in order to ensure the heat dissipation effect, the heat sink 210 may be made of a metal material with high thermal conductivity, such as copper, aluminum, or the like. The through holes 201 of the heat sink 210 may be formed by a stamping process.
In the technical scheme of the invention, the heat exchange assembly 200 comprises at least two layers of heat radiating fins 210 which are stacked, and the heat exchange area is increased by forming a plurality of through holes 201 which are arranged at intervals on the heat radiating fins 210; simultaneously, orthographic projections of the two through holes 201 on the radiating fins 210, which are positioned at opposite positions of the two adjacent layers of radiating fins 210, are arranged into a cross structure, so that the two through holes 201 on the two adjacent layers of radiating fins 210 are in cross communication, and a flow channel for cooling liquid from the liquid inlet 210a to the liquid outlet 210b is formed, so that when the cooling liquid is introduced into the heat exchange assembly 200, the cooling liquid can simultaneously realize transverse and longitudinal flow on the two adjacent layers of radiating fins 210, the flow direction and the flow range of the cooling liquid are increased, the turbulence effect of the cooling liquid is enhanced, and further the heat exchange efficiency and the heat dissipation efficiency are improved.
In order to further enhance the heat exchange effect of the cooling liquid, referring to fig. 1 to 4, in an embodiment of the present invention, the orthogonal projections of two through holes 201 on the two adjacent layers of the heat dissipation fins 210, which are oppositely located, on the plane of one heat dissipation fin 210 are connected end to end.
In this embodiment, two corresponding through holes 201 on two adjacent layers of heat dissipation fins 210 are arranged end to end, so that the cooling liquid flows longitudinally into the through hole 201 of another heat dissipation fin 210 after flowing transversely in a certain path in the through hole 201 of one heat dissipation fin 210, the flowing path of the cooling liquid is prolonged, and the retention time of the cooling liquid in the heat exchange assembly 200 is further prolonged, so as to achieve the purpose of sufficient heat exchange.
Based on all being equipped with a plurality of through-holes 201 that the interval set up on every layer of fin 210, then a plurality of through-holes 201 on the adjacent two-layer fin 210 end to end, can understand that the tail end that is located the through-hole 201 of the fin 210 on upper strata communicates with the head end that the fin 210 of lower floor corresponds through-hole 201, the tail end that is located this through-hole 201 of the fin 210 of lower floor simultaneously communicates with the head end of another through-hole 201 on the fin 210 of upper strata, or, the tail end that is located this through-hole 201 of the fin 210 of lower floor also can communicate with the head end that is located the through-hole 201 on the fin 210 of lower floor, so on and so on, thereby make coolant liquid transversely vertically fully flow in heat exchange component 200, the convective heat transfer effect of coolant liquid has been improved.
Alternatively, when the plurality of through holes 201 on the adjacent two layers of the heat dissipation fins 210 are orthographically projected on the plane of one heat dissipation fin 210, the plurality of through holes 201 may form end-to-end flow channels of the cooling liquid, such as zigzag, time-aligned, wavy, or linear. When the plurality of through holes 201 on the adjacent two layers of the radiating fins 210 project towards a plane perpendicular to the radiating fins 210, end-to-end flow channels for the cooling liquid can also be formed.
In an embodiment of the present invention, referring to fig. 1 to 4, two adjacent layers of heat dissipation fins 210 are attached to each other.
In this embodiment, two adjacent layers of the heat dissipation fins 210 are attached to each other, so that the through hole 201 on one heat dissipation fin 210 and the plate surface of the other heat dissipation fin 210 enclose a flow channel for the cooling liquid, and the cooling liquid in the flow channel can absorb heat on the heat dissipation fin 210 through the plate surface of the heat dissipation fin 210 and the hole wall of the through hole 201. At least one through hole 201 penetrates through the side surface of one heat radiating fin 210 to form a liquid inlet 210a of cooling liquid, at least another through hole 201 penetrates through the side surface of another heat radiating fin 210 to form a liquid outlet 210b, and the liquid inlet 210a and the liquid outlet 210b are respectively arranged on two opposite sides of the heat exchange assembly 200, it can be understood that the cooling liquid enters the inside of the heat exchange assembly 200 from one side of one heat radiating fin 210 and flows out of the heat exchange assembly 200 from the other side of another heat radiating fin 210, so that the cooling liquid flows out from the other side after flowing through the multiple layers of heat radiating fins 210, and the length and time of the cooling liquid flowing through the inside of the heat exchange assembly 200 are ensured.
On the basis of the foregoing embodiment, the through holes 201 in the adjacent two layers of fins 210 are connected end to end, so that when the cooling liquid is introduced from the liquid inlet 210a of one fin 210, the cooling liquid will firstly transversely flow through the through holes 201 on the side portions of the fin 210, then longitudinally enter the through holes 201 of the adjacent fins 210, then transversely flow to the tail ends of the through holes 201, and then longitudinally flow into the through holes 201 on the previous layer of fins 210 or longitudinally flow into the through holes 201 on the next layer of fins 210, and thus the above-mentioned operation is repeated until the through holes 201 in the multiple layers of fins 210 are filled and flow out from the liquid outlet 210b of the other fin 210, thereby ensuring the sufficient contact between the cooling liquid and the multiple layers of fins 210 and improving the heat exchange effect.
In practical applications, the heat exchange assembly 200 includes a plurality of stacked fins 210, and in order to ensure the residence time and the heat exchange area of the cooling liquid in the heat exchange assembly 200, a liquid inlet 210a may be disposed on one side of the uppermost fin 210, and a liquid outlet 210b may be disposed on the other side of the lowermost fin 210, so as to extend the path of the cooling liquid. Certainly, in other embodiments, the liquid inlets 210a and the liquid outlets 210b may be respectively disposed on two adjacent layers of the heat dissipation fins 210, that is, the liquid inlets 210a and the liquid outlets 210b are alternately disposed, in such an embodiment, the heat exchange assembly 200 has a plurality of liquid inlets 210a to simultaneously introduce the cooling liquid, and a plurality of liquid outlets 210b to simultaneously flow out, so as to increase the flow rate of the cooling liquid and reduce the flow resistance of the cooling liquid.
In an embodiment of the present invention, referring to fig. 1 to 3, the through holes 201 are strip-shaped holes; a direction of the heat exchange assembly 200 from the side where the liquid inlet 210a is disposed toward the side where the liquid outlet 210b is disposed is defined as a first direction (see fig. 3), and an extending direction of the through hole 201 (see fig. 3) is disposed obliquely with respect to the first direction, where the extending direction of the through hole 201 refers to a length direction of the through hole 201 on a plane where the heat sink 210 is disposed (see fig. 3). Specifically, an included angle is formed between the extending direction of the through holes 201 arranged in an inclined manner and the first direction, which is defined as an inclined angle a, the inclined angle affects the change of the flowing direction of the cooling liquid in the two adjacent through holes 210, and the inclined angle cannot be too large or too small, if too large, the reversing amplitude of the cooling liquid is large, and large resistance is easily caused; if the flow rate is too small, the reversing amplitude of the cooling liquid is small, and the achieved turbulent flow effect is small. Alternatively, the inclination angle of the through hole 210 with respect to the first direction may be selected to be 15 ° to 75 °, such as 15 °, 30 °, 45 °, 60 °, 75 °, and the like.
It can be understood that the liquid inlet 210a and the liquid outlet 210b are respectively located at two sides of the heat exchange assembly 200, a direction from the liquid inlet 210a to the liquid outlet 210b is defined as a first direction, and an extending direction of the through hole 201 is inclined with respect to the first direction, so that a flowing direction of the cooling liquid in the through hole 210 is inclined with respect to the first direction, and a flowing length of the cooling liquid is increased.
Based on a plurality of through-holes 201 on two adjacent layers of fin 210 communicate end to end, and two corresponding through-holes 201 set up alternately, then the flow direction of the coolant liquid in two through-holes 201 that communicate each other is different, and in the direction of flowing from going into liquid mouth 210a to liquid outlet 210b, the flow path of coolant liquid is sawtooth shape, through the flow direction of change coolant liquid many times, reaches the vortex, strengthens the effect of coolant liquid torrent.
In order to make the heat exchange effect of the cooling liquid in the heat exchange assembly 200 more uniform, referring to fig. 1 to 3, in an embodiment of the present invention, a plurality of through holes 201 on the same heat sink 210 are distributed in an array.
In this embodiment, through with a plurality of through-holes 201 array distribution on fin 210, guaranteed the flow distribution uniformity of coolant liquid in heat exchange assembly 200 to prevent that the inside uneven condition of heat transfer of heat exchange assembly 200 from taking place.
Alternatively, the array distribution of the plurality of through holes 201 may be a circular array or a rectangular array.
In an embodiment of the present invention, referring to fig. 1 to 3, two adjacent layers of heat dissipation fins 210 have the same shape and are stacked in a staggered manner; the stagger angle of the adjacent two layers of fins 210 is 180 °.
It can be understood that the shape of the multiple layers of fins 210 in the heat exchange assembly 200 is the same, the fins 210 are provided with a plurality of through holes 201 arranged at intervals, and the fins 210 of two adjacent layers are stacked in a staggered manner, so that two through holes 201 at corresponding positions are arranged in a crossed manner to realize partial overlapping, thereby forming mutually communicated coolant flow channels.
In this embodiment, adopt the same structure with multilayer fin 210, reduced the manufacturing degree of difficulty and manufacturing cost, only need design one set of mould can be general, also be convenient for change simultaneously.
In practical applications, the fixing manner of the stacked multi-layer heat sink 210 may be welding, fusing, or other fixing connection manners.
In other embodiments of the present invention, referring to fig. 4, the through holes 201 are strip-shaped holes; the direction of the heat exchange assembly 200 from the side where the liquid inlet 210a is disposed to the side where the liquid outlet 210b is disposed is defined as a first direction, wherein the extending direction of the through hole 201 on one heat sink 210 is parallel to the first direction, and the extending direction of the through hole 201 on another adjacent heat sink 210 is perpendicular to the first direction.
In this embodiment, the two adjacent layers of fins 210 have different structures, and the arrangement of the through holes 201 is also different. The plurality of through holes 201 on one heat sink 210 are arranged in parallel at intervals along a first direction, the plurality of through holes 201 on the other heat sink 210 are arranged along a direction perpendicular to the first direction, the plurality of through holes 201 of the two heat sinks 210 are connected end to end, the extending direction of the two connected through holes 201 is perpendicular, and the projection shape of the formed cooling liquid flow channel on the substrate 100 is a timing diagram shape, so that the effect of increasing the convection heat exchange of the cooling liquid is achieved.
In other embodiments of the present invention, the heat exchange assembly 200 includes a plurality of stacked heat dissipation fins 210, where two adjacent heat dissipation fins 210 are defined as a first heat dissipation fin and a second heat dissipation fin, respectively, and an orthographic projection of the through hole 201 on the first heat dissipation fin on a plane where the second heat dissipation fin is located intersects with the through hole 201 at a relative position on the second heat dissipation fin;
defining a cooling fin adjacent to one side of the first cooling fin, which is far away from the second cooling fin, as a third cooling fin, and defining a cooling fin adjacent to one side of the second cooling fin, which is far away from the first cooling fin, as a fourth cooling fin;
the orthographic projection of the through hole 201 on the third radiating fin on the plane where the first radiating fin is located coincides with the through hole 201 on the first radiating fin at the relative position, and/or the orthographic projection of the through hole 201 on the fourth radiating fin on the plane where the second radiating fin is located coincides with the through hole 201 on the second radiating fin at the relative position.
In this embodiment, the heat exchange assembly 200 includes the heat dissipation fins 210 stacked in multiple layers, wherein the through holes 201 at opposite positions on at least two adjacent layers of the heat dissipation fins 210 (the first heat dissipation fin and the second heat dissipation fin) are arranged in a cross manner, and the two through holes 201 at opposite positions of the first heat dissipation fin and the second heat dissipation fin are communicated with each other, so that heat can be transferred from the through holes 201 of the first heat dissipation fin to the through holes 201 of the second heat dissipation fin, and the path for transferring heat is further increased.
It can be understood that, on this basis, the structure of the third heat sink adjacent to the other side of the first heat sink may be the same as that of the first heat sink, i.e. the orthographic projection of the through hole 201 on the third heat sink coincides with that of the through hole 201 on the first heat sink, and then the longitudinal flow efficiency of the cooling liquid is increased; of course, the structure of the third heat sink may also be the same as that of the second heat sink, and the through holes 201 of the third heat sink and the through holes 201 of the first heat sink are arranged in a crossing manner, so that the longitudinal and transverse flows of the cooling liquid are ensured.
Similarly, the structure of the fourth heat sink adjacent to the other side of the second heat sink may be the same as that of the second heat sink, that is, the orthographic projections of the through holes 201 on the fourth heat sink and the through holes 201 on the second heat sink are overlapped, so that the longitudinal flow efficiency of the cooling liquid is increased; of course, the structure of the fourth heat dissipation plate may also be the same as that of the first heat dissipation plate, and at this time, the through holes 201 of the fourth heat dissipation plate and the through holes 201 of the second heat dissipation plate are arranged in a crossing manner, so as to ensure the longitudinal and transverse flows of the cooling liquid.
The present invention further provides a heat dissipation structure, referring to fig. 1, fig. 2 and fig. 8, the heat dissipation structure includes a substrate 100 and a heat exchange assembly 200, the specific structure of the heat exchange assembly 200 refers to the above embodiments, and since the heat dissipation structure adopts all technical solutions of all the above embodiments, the heat dissipation structure at least has all the beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein. Wherein, the heat exchange assembly 200 is disposed on the substrate 100.
The substrate 100 plays a role of providing a mounting platform for the heat exchange assembly 200, so that the heat exchange assembly 200 is mounted on a heating device (such as a power module), the temperature of the heating device is transmitted to the substrate 100 and the heat exchange assembly 200, and the substrate and the heat exchange assembly are in contact heat exchange with the heating device, so that the function of heat dissipation of the heating device is realized. The heat exchange assembly 200 comprises at least two layers of heat radiating fins 210 which are stacked, and the heat exchange area is increased by forming a plurality of through holes 201 which are arranged at intervals on the heat radiating fins 210; simultaneously, orthographic projections of the two through holes 201 on the substrate 100, which are located at opposite positions of the two adjacent layers of radiating fins 210, are set to be in a cross structure, so that the two through holes 201 on the two adjacent layers of radiating fins 210 are in cross communication, a flow channel for flowing cooling liquid from the liquid inlet 210a to the liquid outlet 210b is formed, and when the cooling liquid is introduced into the heat exchange assembly 200, the cooling liquid can simultaneously flow transversely and longitudinally on the two adjacent layers of radiating fins 210, the flowing direction and the flowing range of the cooling liquid are increased, the turbulence effect of the cooling liquid is enhanced, the heat exchange efficiency of the heat exchange assembly 200 is further improved, and the heat dissipation efficiency of the heat dissipation structure is improved.
In practical applications, the substrate 100 may be made of copper or aluminum with high thermal conductivity, so as to accelerate the rate of transferring heat from the heat generating device to the heat exchanging assembly 200.
In one embodiment, the surface of the substrate 100 is provided with a groove 101, and the heat exchange assembly 200 is mounted in the groove 101. In this embodiment, the groove 101 plays a role in limiting and fixing the heat exchange assembly 200, so that the mounting difficulty of the heat exchange assembly 200 and the substrate 100 is simplified, and the assembly accuracy of the heat exchange assembly 200 and the substrate 100 is improved; on the other hand, the distance between the heating device and the heat exchange assembly is reduced, and the heat dissipation effect is improved.
In order to further improve the heat dissipation effect of the heat dissipation structure, referring to fig. 5 to 8, in an embodiment of the invention, the substrate 100 includes a substrate layer 110 stacked in multiple layers, wherein at least a portion of the substrate layer 110 has a plurality of heat dissipation holes 111 formed therein.
It can be understood that, when the heat dissipation holes 111 are formed on the substrate layer 110 in contact with the heat generating device, the remaining substrate layer 110 also has the heat dissipation holes 111 to ensure that the cooling liquid flows through the heat dissipation holes 111; when the substrate layer 110 contacted with the heating device does not have the heat dissipation holes 111, at least part of the rest of the substrate layer 110 has the heat dissipation holes 111, and the heat dissipation holes 111 meeting the requirements of the rest of the substrate layer 110 have cooling liquid flowing.
The stacking direction of the multi-layer substrate layer 110 coincides with the stacking direction of the at least two layers of heat dissipation fins 210.
In this embodiment, the substrate 100 is stacked by a plurality of substrate layers 110, and a plurality of heat dissipation holes 111 are formed in the substrate layers 110 to increase the heat exchange area and improve the heat exchange efficiency. It can be understood that the adjacent two substrate layers 110 may be attached to each other or disposed at intervals, and are fixedly connected by welding.
The stacking direction of the multi-layer substrate layer 110 is consistent with the stacking direction of the multi-layer heat sink 210, so that the substrate 100 has a sufficient mounting area for mounting the heat sink 210, and the stability of the whole structure is ensured.
On the basis of the foregoing embodiment, when the cooling liquid is introduced, the cooling liquid flows into the heat dissipation holes 111 of the substrate layer 110 when flowing through the through holes 201 in the heat dissipation plate 210, so as to absorb heat of the substrate layer 110 and the heat dissipation plate 210 at the same time, thereby further increasing the heat dissipation efficiency.
In order to further improve the heat dissipation efficiency, referring to fig. 5 to 8, in an embodiment of the present invention, the heat dissipation holes 111 of the two adjacent substrate layers 110 are staggered and at least partially overlapped to form a flow channel; this runner can switch on with the runner of the coolant liquid in the heat exchange assembly 200 for the coolant liquid can flow into in the louvre 111 of base plate layer 110 and cool off, improves the heat transfer effect.
The at least one heat dissipation hole 111 is communicated with the at least one through hole 201.
It can be understood that two heat dissipation holes 111 at the opposite positions of the adjacent two substrate layers 110 are staggered and at least partially overlapped, so that when a cooling liquid is introduced, the cooling liquid can flow transversely along the plane of the substrate layers 110 and longitudinally along the thickness direction of the substrate layers 110, the flow direction of the cooling liquid is increased, the turbulence effect of the cooling liquid is enhanced, and the heat exchange efficiency of the cooling liquid in the substrate 100 is improved.
In combination with the foregoing embodiments, the cooling liquid flow channels capable of flowing transversely and longitudinally are formed in the multi-layer fins 210 of the heat exchange assembly 200, and the cooling liquid flow channels capable of flowing transversely and longitudinally are formed in the multi-layer substrate layer 110 in the substrate 100, so that the heat convection effect of the cooling liquid is enhanced by both the heat exchange assembly 200 and the substrate 100, and the heat exchange efficiency of the heat dissipation structure is further improved.
In an embodiment, the at least one heat dissipation hole 111 on the substrate 100 is communicated with the at least one through hole 201 of the heat exchange assembly 200, so that the cooling fluid channel inside the substrate 100 is communicated with the cooling fluid channel inside the heat exchange assembly 200, thereby enhancing the convection effect of the cooling fluid between the substrate 100 and the heat exchange assembly 200, making the heat exchange between the substrate 100 and the heat exchange assembly 200 more uniform, and improving the reliability of the whole heat dissipation structure.
Referring to fig. 1, 2 and 7, the motor controller includes a power module 300 and a heat dissipation structure, where the specific structure of the heat dissipation structure refers to the above embodiments, and since the power module adopts all technical solutions of all the above embodiments, the power module at least has all beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein. Wherein, one side of the substrate 100 departing from the heat exchange assembly 200 is fixedly connected with the power module 300.
The heat dissipation structure is fixedly connected with the power module 300 to form a motor controller with a heat dissipation function, so that the performance of the motor controller is improved. The heat dissipation structure includes a substrate 100 and a heat exchange assembly 200 disposed on the substrate 100, wherein one side of the substrate 100 is fixedly connected to the power module 300, and the other side of the substrate is fixedly connected to the heat exchange assembly 200.
In an embodiment, when the substrate 100 is a plate-shaped structure, the heat exchange assembly 200 includes at least two layers of heat dissipation fins 210 stacked together, the heat dissipation fins 210 are formed with a plurality of through holes 201 arranged at intervals, and orthographic projections of two through holes 201 located at opposite positions of two adjacent layers of heat dissipation fins 210 on the substrate 100 are arranged crosswise to form a flow channel for cooling fluid to flow through. When the cooling liquid is introduced into the heat exchange assembly 200, the cooling liquid can simultaneously flow transversely and longitudinally on the two adjacent layers of radiating fins 210, so that the transverse and longitudinal flow in the heat exchange assembly 200 can be realized, the turbulence effect of the cooling liquid is enhanced, and the heat dissipation efficiency of the chip body 300 is improved.
In an embodiment, the substrate 100 is configured as a substrate layer 110 stacked in multiple layers, the substrate layer 110 is provided with a plurality of heat dissipation holes 111, and the heat dissipation holes 111 of two adjacent substrate layers 110 are staggered, so that a cooling liquid channel inside the substrate 100 is formed, and the cooling liquid channel inside the heat exchange assembly 200 is combined, thereby realizing the dual function of enhancing the convection heat exchange of the cooling liquid, and further improving the heat dissipation efficiency of the power module 300.
It is understood that, in practical applications, the power module 300 and the heat dissipation structure form a motor controller with heat dissipation function, which can be combined with the module or separated from the module according to the type of the motor controller. If the power module 300 is an IGBT (Insulated Gate Bipolar transistor) module, the power module with the heat dissipation structure may be applied to a motor controller to enhance the performance of the motor controller.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (12)
1. A heat exchange assembly, comprising:
the cooling fins are stacked in at least two layers, a plurality of through holes are formed in the cooling fins at intervals, a liquid inlet of cooling liquid is formed in one side face of one layer of cooling fin, and a liquid outlet of the cooling liquid is formed in the other side face of the other adjacent layer of cooling fin;
the through holes positioned at the opposite positions of the two adjacent layers of radiating fins are arranged in a crossed manner in the orthographic projection on the plane where the radiating fins are positioned so as to form a flow channel for the cooling liquid to flow from the liquid inlet to the liquid outlet.
2. The heat exchange assembly of claim 1, wherein the orthogonal projections of two through holes at opposite positions on the heat dissipation fins of two adjacent layers on a plane on which the heat dissipation fins are arranged are connected end to end.
3. The heat exchange assembly of claim 2 wherein adjacent layers of fins are positioned in close proximity.
4. The heat exchange assembly of claim 3, wherein the through-holes are strip-shaped holes; the heat exchange assembly is defined to be a first direction from one side of the liquid inlet to one side of the liquid outlet, and the extending direction of the through hole is inclined relative to the first direction.
5. The heat exchange assembly of claim 3, wherein the through-holes are strip-shaped holes; the direction of the heat exchange assembly from one side provided with the liquid inlet to one side provided with the liquid outlet is defined as a first direction, wherein the extending direction of the through hole on one heat radiating fin is parallel to the first direction, and the extending direction of the through hole on the other adjacent heat radiating fin is perpendicular to the first direction.
6. The heat exchange assembly of any one of claims 1 to 4, wherein the fins of two adjacent layers are identical in shape and are staggered; the staggered angle of two adjacent layers of radiating fins is 180 degrees.
7. The heat exchange assembly of any one of claims 1 to 5, wherein the heat exchange assembly comprises a plurality of layers of the heat dissipation fins stacked together, wherein the adjacent two layers of the heat dissipation fins are respectively a first heat dissipation fin and a second heat dissipation fin, and an orthographic projection of the through holes on the first heat dissipation fin on a plane where the second heat dissipation fin is located is crossed with the through holes on the second heat dissipation fin at opposite positions;
defining a cooling fin adjacent to one side of the first cooling fin, which is far away from the second cooling fin, as a third cooling fin, and defining a cooling fin adjacent to one side of the second cooling fin, which is far away from the first cooling fin, as a fourth cooling fin;
the orthographic projection of the through hole on the third radiating fin on the plane where the first radiating fin is located is superposed with the through hole on the relative position on the first radiating fin, and/or the orthographic projection of the through hole on the fourth radiating fin on the plane where the second radiating fin is located is superposed with the through hole on the relative position on the second radiating fin.
8. A heat dissipation structure, comprising:
a substrate;
and the heat exchange assembly of any one of claims 1 to 7, disposed on the base plate.
9. The heat dissipation structure of claim 8, wherein the substrate is formed by a plurality of stacked substrate layers, at least a portion of the substrate layers having a plurality of heat dissipation holes; at least one heat dissipation hole is communicated with at least one through hole.
10. The heat dissipating structure of claim 9, wherein the heat dissipating holes of the two adjacent substrate layers are staggered and at least partially overlapped to form a flow channel.
11. The heat dissipating structure of any one of claims 8 to 10, wherein the surface of the base plate is provided with a groove, and the heat exchanging element is mounted in the groove.
12. A motor controller comprising a power module and the heat dissipation structure of any one of claims 8 to 11; one side of the base plate, which is far away from the heat exchange assembly, is fixedly connected with the power module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110620503.9A CN113316370A (en) | 2021-06-03 | 2021-06-03 | Heat exchange assembly, heat dissipation structure and motor controller |
| PCT/CN2022/096362 WO2022253241A1 (en) | 2021-06-03 | 2022-05-31 | Heat exchange assembly, heat dissipation structure, and electric motor controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110620503.9A CN113316370A (en) | 2021-06-03 | 2021-06-03 | Heat exchange assembly, heat dissipation structure and motor controller |
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| Publication Number | Publication Date |
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| CN113316370A true CN113316370A (en) | 2021-08-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110620503.9A Pending CN113316370A (en) | 2021-06-03 | 2021-06-03 | Heat exchange assembly, heat dissipation structure and motor controller |
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| Country | Link |
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| CN (1) | CN113316370A (en) |
| WO (1) | WO2022253241A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022253241A1 (en) * | 2021-06-03 | 2022-12-08 | 苏州汇川联合动力系统有限公司 | Heat exchange assembly, heat dissipation structure, and electric motor controller |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115825499A (en) * | 2022-12-26 | 2023-03-21 | 北京工业大学 | Power cycle test fixture for double-sided heat dissipation device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI292863B (en) * | 2006-04-28 | 2008-01-21 | Foxconn Tech Co Ltd | Liquid-cooling heat sink |
| JP2010249439A (en) * | 2009-04-17 | 2010-11-04 | Panasonic Corp | Liquid heat exchange device and heat exchange system |
| CN201892439U (en) * | 2010-11-19 | 2011-07-06 | 武汉热诺金属科技有限公司 | Stacked water cooling radiator |
| CN103489838B (en) * | 2013-10-15 | 2016-04-06 | 北京大学 | A kind of enhance heat three-dimension packaging structure and method for packing thereof |
| CN109387096A (en) * | 2018-11-12 | 2019-02-26 | 东莞运宏模具有限公司 | Lamination type water-cooled radiator |
| CN113316370A (en) * | 2021-06-03 | 2021-08-27 | 苏州汇川联合动力系统有限公司 | Heat exchange assembly, heat dissipation structure and motor controller |
-
2021
- 2021-06-03 CN CN202110620503.9A patent/CN113316370A/en active Pending
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2022
- 2022-05-31 WO PCT/CN2022/096362 patent/WO2022253241A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022253241A1 (en) * | 2021-06-03 | 2022-12-08 | 苏州汇川联合动力系统有限公司 | Heat exchange assembly, heat dissipation structure, and electric motor controller |
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| WO2022253241A1 (en) | 2022-12-08 |
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Address after: 215000 52 tianedang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Applicant after: Suzhou Huichuan United Power System Co.,Ltd. Address before: 215000 52 tianedang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Applicant before: SUZHOU HUICHUAN UNITED POWER SYSTEM Co.,Ltd. |