CN220753410U - Microchannel radiator embedded with radiating grooves - Google Patents

Abstract

The utility model discloses a microchannel radiator embedded with radiating grooves, which comprises a radiating block body horizontally arranged along the front-back direction, wherein the radiating block body is provided with a microchannel which is communicated left and right and has a rectangular section, the bottom wall of the microchannel is concavely provided with a plurality of first connecting grooves which are distributed at intervals along the front-back direction along the left-right direction, the side walls of the two sides of the microchannel are concavely provided with a plurality of second connecting grooves which are distributed at intervals along the front-back direction along the vertical direction, the plurality of first connecting grooves on the bottom wall of the microchannel are respectively in one-to-one correspondence with the plurality of second connecting grooves on the side walls of the two sides of the microchannel, the two ends of each first connecting groove are communicated with the lower ends of the corresponding second connecting grooves on the two sides of each first connecting groove to jointly form a radiating groove, one end of the microchannel is a refrigerant inlet, the other end of the microchannel is a refrigerant outlet, the radiating effect of the microchannel is good, and a refrigerant medium is turbulent in the microchannel to absorb heat more fully.

Description

A microchannel radiator with heat dissipation grooves

Technical Field

The utility model belongs to the field of heat dissipation equipment, and in particular relates to a micro-channel radiator embedded with heat dissipation grooves.

Background technique

As electronic devices become increasingly miniaturized and integrated, the heat dissipation requirements of electronic chips also increase. Microchannel radiators are widely used in electronic equipment cooling technology due to their small size and good heat dissipation performance. However, currently, most microchannel radiators still achieve heat dissipation by extending the travel of the coolant to increase the heat exchange efficiency. For example, the microchannel radiator disclosed in document number CN113148940A "Microchannel radiator with comb-like baffle protrusion structure and preparation method thereof" has a plurality of parallel and serpentine flow channels, but it is not effective in removing the heat absorbed by the flow channel wall.

Utility Model Content

In order to solve the above technical problems, the purpose of the utility model is to provide a microchannel radiator with simple structure and good heat dissipation performance.

In order to achieve the above-mentioned purpose, the technical scheme of the utility model is as follows: a microchannel radiator embedded with heat dissipation grooves, comprising a heat dissipation block body horizontally arranged along the front-to-back direction, the heat dissipation block body having a microchannel which runs through left and right and has a rectangular cross-section, a plurality of first connecting grooves which are recessed along the left-right direction and are distributed at intervals along the front-to-back direction on the bottom wall of the microchannel, a plurality of second connecting grooves which are recessed vertically and are distributed at intervals along the front-to-back direction on the side walls on both sides of the microchannel, the plurality of first connecting grooves on the bottom wall of the microchannel respectively correspond one-to-one to the plurality of second connecting grooves on the side walls on both sides of the microchannel, the two ends of each of the first connecting grooves are connected to the lower ends of the corresponding second connecting grooves on both sides thereof and together constitute a heat dissipation groove, one end of the microchannel is a refrigerant inlet, and the other end is a refrigerant outlet.

The beneficial effect of the above technical solution lies in that, by arranging a first connecting groove on the inner bottom wall of the microchannel and arranging a second connecting groove on both side walls of the microchannel whose lower ends are connected to the corresponding first connecting groove, the hole wall of the microchannel forms a structure similar to a heat dissipation fin. When the lower end of the heat dissipation block body is heated, the temperature in the heat dissipation block body increases from bottom to top, so the fluid in the second connecting grooves on both sides will flow from bottom to top and finally flow away through the microchannel, so that the heat carried by the hole wall of the microchannel can be quickly taken away to dissipate heat and cool down.

In the above technical solution, the first connecting groove is tilted in the left-right direction, and its tilt angle is 30-60°, and a plurality of the first connecting grooves are parallel to each other.

The beneficial effect of the above technical solution is that the transverse vortex flow in the two second connecting grooves corresponding to the first connecting groove moves longitudinally to the microchannel, thereby more quickly taking out the heat in the side walls on both sides of the microchannel.

In the above technical solution, there are multiple microchannels, and the multiple microchannels are equally divided into multiple microchannel groups, each microchannel group has multiple microchannels, and the multiple microchannel groups are spaced apart along the front-to-back direction, and the multiple microchannels in the same group are spaced apart vertically, and the multiple heat dissipation grooves in two adjacent microchannels in the same group correspond to each other and are vertically aligned, and the two second connecting grooves on the same side of the corresponding two heat dissipation grooves extend to penetrate each other, so as to penetrate the two adjacent microchannels in the same group.

The beneficial effect of the above technical solution is that the microchannel radiator has a multi-layer structure, and the coolant medium in the microchannel below can carry heat and boil upward to the microchannel above it through the interconnected second connecting groove, thereby achieving rapid upward movement of heat and improving heat dissipation performance.

In the above technical solution, the number of the microchannels in each microchannel group is 2-4.

The beneficial effect of the above technical solution is that it has a simple structure.

In the above technical solution, the plurality of heat dissipation slots in the microchannel are equally divided into a plurality of heat dissipation slot groups spaced apart in the left-right direction, the plurality of heat dissipation slots in the same group are spaced apart in the front-back direction, the spacing between two adjacent heat dissipation slot groups is d ₁ , the spacing between two adjacent heat dissipation slots in the same group is d ₂ , and d ₁ >d ₂ .

The beneficial effect of the above technical solution is that a longitudinal vortex is formed along the axial direction of the microchannel at each heat dissipation slot group, and the resistance to the flow of the longitudinal vortex between two adjacent heat dissipation slot groups is small, so that its decay is slow and the heat of the microchannel pore wall can be better removed.

In the above technical solution, _d1 is more than 5 times of _d2 .

The beneficial effect of the above technical solution is that it has a simple structure.

In the above technical solution, each heat dissipation slot group has 5-30 heat dissipation slots.

The beneficial effect of the above technical solution is that it has a simple structure.

In the above technical solution, the plurality of microchannels are distributed in a matrix on the side wall of the heat dissipation block body.

The beneficial effects of the above technical solution are: its structure is simple, and the heat dissipation performance of the heat dissipation block body at various locations on the plane is consistent.

The heat sink body in the above technical solution is an aluminum part or a copper part.

The beneficial effect of the above technical solution is that it has fast heat transfer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a side view of the microchannel radiator described in Example 1 of the utility model;

FIG2 is a top view of the microchannel heat sink in a cross-sectional state according to Example 1 of the present utility model;

FIG3 is a partial view of the microchannel radiator described in Example 1 of the utility model;

FIG4 is a schematic diagram of the flow direction of the longitudinal vortex in Example 1 of the present utility model;

FIG5 is a schematic diagram of the flow direction of the lateral vortex in Example 1 of the present utility model;

FIG6 is a vertical view of the microchannel heat sink in a cross-sectional state in Example 2 of the present utility model;

FIG7 is a side view of the microchannel heat sink in Example 2 of the present utility model;

FIG8 is another side view of the microchannel heat sink in Example 2 of the present utility model;

In the figure: 1 heat sink body, 11 microchannel, 12 heat sink, 121 first connecting groove, 122 second connecting groove.

Detailed ways

The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention. The present invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. According to the following description and claims, the advantages and features of the present invention will be more clearly described. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

Example 1

As shown in FIGS. 1 to 3 , the present embodiment provides a microchannel heat sink with heat dissipation grooves, including a heat dissipation block body 1 horizontally arranged along the front-to-back direction, the heat dissipation block body 1 having a microchannel 11 that is through-through from left to right and has a rectangular cross-section, a plurality of first connection grooves 121 spaced apart along the front-to-back direction are recessed on the bottom wall of the microchannel 11 along the left-to-right direction, a plurality of second connection grooves 122 spaced apart along the front-to-back direction are vertically recessed on the side walls on both sides of the microchannel 11, the plurality of first connection grooves 121 on the bottom wall of the microchannel 11 correspond one-to-one to the plurality of second connection grooves 122 on the side walls on both sides of the microchannel 11, and the two ends of each of the first connection grooves 121 are connected to the second connection grooves corresponding to the two sides thereof. The lower ends of the connecting grooves 122 are connected and together form a heat dissipation groove 12. One end of the microchannel 11 is a refrigerant inlet, and the other end is a refrigerant outlet. In this way, a first connecting groove is arranged on the inner bottom wall of the microchannel, and second connecting grooves whose lower ends are connected to the corresponding first connecting grooves are arranged on the side walls on both sides of the microchannel. In this way, the hole wall of the microchannel forms a structure similar to a heat dissipation fin. When the lower end of the heat dissipation block body is heated, the temperature in the heat dissipation block body increases from bottom to top. Therefore, the second connecting grooves on both sides will flow from bottom to top and form transverse vortices, and the first connecting groove forms a longitudinal vortex in the microchannel, so that the medium in the microchannel is turbulent to quickly take away the heat carried by the microchannel hole wall to dissipate heat and cool down.

In the above technical solution, the first connecting groove 121 is tilted in the left-right direction, and its tilt angle is 30-60°, and multiple first connecting grooves 121 are parallel to each other, so that the transverse vortex flow in the two second connecting grooves corresponding to the first connecting groove moves longitudinally to the microchannel, thereby more quickly bringing out the heat in the side walls on both sides of the microchannel.

In the above technical solution, a plurality of microchannels 11 are provided, and the plurality of microchannels 11 are spaced apart and distributed along the front-to-back direction.

In the above technical solution, the plurality of heat dissipation slots 12 in the microchannel 11 are equally divided into a plurality of heat dissipation slot groups spaced apart in the left-right direction, the plurality of heat dissipation slots 12 in the same group are spaced apart in the front-back direction, the spacing between two adjacent heat dissipation slot groups is d ₁ , the spacing between two adjacent heat dissipation slots 12 in the same group is d ₂ , and d ₁ > d ₂ , so that a longitudinal vortex is formed along the axial direction of the microchannel at each heat dissipation slot group, and the resistance of the longitudinal vortex flow between two adjacent heat dissipation slot groups is small, so that it decays slowly, and can better take away the heat from the microchannel hole wall.

In the above technical solution, _d1 is more than 5 times of _d2 , and its structure is simple.

In the above technical solution, each heat dissipation slot group has 5-30 heat dissipation slots 12, and its structure is simple.

4 indicates the flow direction of the longitudinal vortex (along the flow direction of the refrigerant medium), and the two dotted arrows in FIG5 indicate the transverse vortex (vertically distributed in the second connecting groove).

The first connecting groove is arranged at an angle, and the multiple parallel first connecting grooves are used to induce the refrigerant to form a longitudinal vortex along the flow direction of the refrigerant in the microchannel, and the refrigerant in the second connecting groove forms a transverse vortex under the flow of the medium in the microchannel, and the transverse vortex is beneficial to take away the heat at the side wall of the heat sink corresponding to the heat sink body, and the longitudinal vortex sucks the refrigerant at the transverse vortex into the microchannel and mixes it with the medium in the microchannel, and finally the heat is taken away by the refrigerant. The heat dissipation groove shell in this embodiment makes the refrigerant medium in the microchannel turbulent, thereby improving the heat exchange efficiency.

In this embodiment, the length of the microchannel is 40 mm, the width is 1.5 mm, and the height is 0.75 mm. The width of the first connecting groove is 0.5 mm and the depth is 0.25 mm. The inclination angle of the first connecting groove to the fluid flow direction is 45°. The width of the second connecting groove is 0.5 mm, and the spacing between two adjacent second connecting grooves is 2.5 mm.

Example 2

The same as embodiment 1, the difference is that, as shown in Fig. 6-Fig. 7, the plurality of microchannels 11 are equally divided into a plurality of microchannel groups, each of which has a plurality of microchannels 11, and the plurality of microchannel groups are spaced apart in the front-to-back direction, and the plurality of microchannels 11 in the same group are spaced apart vertically, and the plurality of heat dissipation slots 12 in two adjacent microchannels 11 in the same group correspond to each other and are vertically aligned. Preferably, as shown in Fig. 8, the two second connecting slots 122 on the same side of the two corresponding heat dissipation slots 12 extend to interpenetrate each other, so as to interpenetrate the two adjacent microchannels 11 in the same group, so that the microchannel radiator has a multi-layer structure, and the refrigerant medium in the microchannel below can carry heat and boil upward to the microchannel above it through the communicating second connecting slot, thereby realizing the rapid upward movement of heat, thereby improving the heat dissipation performance. In Fig. 7 and Fig. 8, the dotted part represents the first connecting slot and the second connecting slot.

In the above technical solution, the number of the microchannels 11 in each microchannel group is 2-4, and the structure is simple.

In the above technical solution, the plurality of microchannels 11 are distributed in a matrix on the side wall of the heat dissipation block body 1, which has a simple structure and enables the heat dissipation performance of the heat dissipation block body to be consistent at various locations on the plane.

The heat sink body 1 in the above technical solution is made of aluminum or copper, which has fast heat transfer.

In this embodiment, the spacing between two adjacent microchannels in the same group is 0.5 mm, and the spacing between two adjacent groups of microchannels is 0.5 mm.

The above description is only a preferred embodiment of the utility model and does not limit the utility model in any form. Any ordinary technician in the industry can smoothly implement the utility model as shown in the drawings of the specification and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the utility model using the technical content disclosed above are all equivalent embodiments of the utility model. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the utility model are still within the protection scope of the technical solution of the utility model.

Claims (10)

1. The utility model provides a micro-channel radiator with embedded radiating groove, its characterized in that, including radiating block body (1) that sets up along fore-and-aft direction level, have on radiating block body (1) about link up and the broken cross-section is microchannel (11) of rectangle, be equipped with first spread groove (121) of many along fore-and-aft direction interval distributions along the left-and-right direction indent on the diapire of microchannel (11), be equipped with second spread groove (122) of many along fore-and-aft direction interval distributions along vertical indent on the lateral wall of microchannel (11) both sides, a plurality of first spread groove (121) on the diapire of microchannel (11) with a plurality of second spread groove (122) on the lateral wall of microchannel (11) both sides are respectively one-to-one, every the both ends of first spread groove (121) are linked together and constitute a radiating groove (12) with the lower extreme intercommunication of the second spread groove (122) that both sides correspond, the one end of microchannel (11) is the refrigerant entry, and the other end is the refrigerant export.

2. The microchannel heat sink with embedded heat sink according to claim 1, wherein the first connection grooves (121) are inclined in the right-left direction at an inclination angle of 30-60 °, and the plurality of first connection grooves (121) are parallel to each other.

3. The microchannel heat sink with heat sink according to claim 1, wherein the number of the microchannels (11) is plural, the number of the microchannels (11) is equally divided into a plurality of groups of microchannels, each group of microchannels has a plurality of the microchannels (11), the plurality of groups of microchannels are arranged at intervals in the front-rear direction, and the plurality of microchannels (11) of the same group are arranged at intervals vertically.

4. A microchannel heat sink with embedded heat sink according to claim 3, characterized in that a plurality of heat sink grooves (12) in two adjacent microchannels (11) in the same group are aligned vertically in one-to-one correspondence, and two second connecting grooves (122) on the same side of the corresponding two heat sink grooves (12) extend to be mutually penetrated to penetrate the same group of two adjacent microchannels (11).

5. The microchannel heat sink with heat sink according to claim 4, wherein the number of the microchannels (11) in each group of the microchannels is 2-4.

6. The microchannel heat sink with embedded heat sink according to any one of claims 1-5, wherein the plurality of heat sink grooves (12) in the microchannel (11) are equally divided into a plurality of heat sink groove groups distributed at intervals in the left-right direction, the plurality of heat sink grooves (12) of the same group are distributed at intervals in the front-rear direction, and the interval between two adjacent heat sink groove groups is d ₁ The distance between two adjacent heat dissipation grooves (12) in the same group is d ₂ And d ₁ ＞d ₂ 。

7. The microchannel heat sink with embedded heat sink of claim 6, wherein d ₁ Is d ₂ More than 5 times of the total number of the components.

8. The microchannel heat sink with embedded heat sink of claim 7, wherein each set of heat sink sets has 5-30 heat sink grooves (12) therein.

9. The microchannel heat sink with embedded heat sink according to claim 8, wherein a plurality of the microchannels (11) are distributed in a matrix on the side wall of the heat sink body (1).

10. The microchannel heat sink with embedded heat sink according to claim 6, wherein the heat sink body (1) is an aluminum or copper piece.