CN201892439U - Stacked water cooling radiator - Google Patents

Stacked water cooling radiator Download PDF

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Publication number
CN201892439U
CN201892439U CN2010206155130U CN201020615513U CN201892439U CN 201892439 U CN201892439 U CN 201892439U CN 2010206155130 U CN2010206155130 U CN 2010206155130U CN 201020615513 U CN201020615513 U CN 201020615513U CN 201892439 U CN201892439 U CN 201892439U
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CN
China
Prior art keywords
fin
crossbeam
stacked
water
heat radiation
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Expired - Lifetime
Application number
CN2010206155130U
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Chinese (zh)
Inventor
蔡曦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Eagle Peak Polytron Technologies Inc
Original Assignee
WUHAN RENUO METAL TECHNOLOGY Co Ltd
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Filing date
Publication date
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Priority to CN2010206155130U priority Critical patent/CN201892439U/en
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Publication of CN201892439U publication Critical patent/CN201892439U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

A stacked water cooling radiator comprises a housing, a water inlet and a water outlet, wherein a main flume is arranged in the housing, one end of the main flume is connected with the water inlet, while the other end of the main flume is connected with the water outlet; a radiating fin stacked array is mounted in the main flume and comprises at least two horizontally-stacked radiating fins, and the neighboring radiating fins are mutually overturned for 180 DEG; at least two oblique radiating beams are formed on the radiating fins and arranged in parallel at an uniform interval or a non-uniform interval, the included angle between the radiating beams and a plane surface ranges from 10 to 30 DEG, and the radiating fins are formed by punching rectangular metal sheets. The stacked water cooling radiator not only has big heat exchange area, but also has remarkable radiating effect.

Description

Stacked chip water-filled radiator
Technical field
The utility model relates to a kind of radiator, relates in particular to a kind of stacked chip water-filled radiator.
Background technology
Along with the integrated level of power electronics industry power model is more and more higher, caloric value is increasing, and the application of the water-cooled type of cooling is also increasingly extensive, and is simultaneously, also more and more higher to the water-filled radiator performance requirement that closely links to each other with heating module.Under identical external environment condition work, the design of different radiator inner flow passages will be to the thermal resistance of radiator, and parameters such as flow resistance cause appreciable impact, so the quality of inner flow passage design has directly determined every performance indications of radiator.
The Chinese patent notification number is: CN1930440A, the day for announcing is: the patent of the present invention on March 14th, 2007 relates to a kind of stacked-plate heat exchanger, particularly be installed in the built-in oil cooler of the tank for coolant of the liquid coolant cooler that is used for automobile, this heat exchanger has some mutually stacked and interconnect, the long slab sheet of brazing filler metal particularly, these plates are made up of two and half plates respectively, and comprise one by medium to be cooled, as oil, cavity along vertical percolation of plate, for the cost that makes the producing zone stacked plate heat exchanger reduces, each half plate has numerous grooves, and they extend to a vertical side on opposite from a vertical side of half plate.The defective of this structure is: the topology layout complexity, manufacturing cost is higher, its runner is made of half plate with numerous grooves, the cooling heat dissipation area is less, make heat exchange insufficient, radiating effect is not good, and this heat exchanger only is suitable for oil as the situation of cooling medium, is not suitable for water-cooled power electronics radiator.
Summary of the invention
The purpose of this utility model be, heat exchange smaller at the contact area that exists in the existing water-cooling type radiator inadequately fully, the dissatisfactory defective of radiating effect and deficiency, now provide a kind of simple in structure, easy to use, contact area is big, the stacked preferably chip water-filled radiator of radiating effect.
For achieving the above object, technical solution of the present utility model is: stacked chip water-filled radiator comprises housing, water inlet and delivery port; The inside of described housing offers the main flow tank, and an end of main flow tank is connected with water inlet, and the other end is connected with delivery port, and in the inside of main flow tank fin is installed and piles up array; Described fin piles up array and is piled up by at least two fin levels and form, and adjacent fin turns over turnback mutually.
Offer the heat radiation crossbeam of at least two inclinations on the described fin, heat radiation is between the crossbeam equidistantly or non-equidistance is arranged in parallel, and the angle between heat radiation crossbeam and the horizontal plane is 10 Du –, 30 degree.
Described fin is stamped to form by rectangular metal sheet.
The beneficial effects of the utility model are:
1, because the inside of the main flow tank in the utility model is equipped with fin and piles up array, fin piles up array and is piled up by at least two fin levels and form, adjacent fin turns over turnback mutually, and offer the heat radiation crossbeam of at least two inclinations on the fin, during use, behind fin superimposed, the area of space that forms between the heat radiation crossbeam constitutes walks aqua region, this is walked aqua region and is the broken line distribution, and run through and crisscross fin and pile up each fin in the array, walk cooling water mobile in the aqua region with between the many beams in plane, the how interplanar mode moving of facade is advanced, and big with radiator contact-making surface linear area, heat exchange is abundant.Therefore not only contact area is bigger for the utility model, and the heat exchange effect is remarkable.
2, owing to mainly piling up array by fin, the main flow tank in the utility model constitutes, not only simple in structure, just with integral body manufacturing and installation, and this structure walking in the aqua region at fixed volume main flow tank, bigger effective water flowing area of section can be provided, whole fluid resistance to cooling water is less, helps strengthening radiating effect, in addition, main flow tank in the utility model is support with multilayer crossbeam array, can improve the bulk strength of radiator.Therefore not only radiating effect is better, less to the whole fluid resistance of cooling water for the utility model, and intensity is higher.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is the structural representation of main flow tank among Fig. 1.
Fig. 3 is the structural representation that fin piles up array among Fig. 2.
Fig. 4 is the structural representation of fin among Fig. 3.
Fig. 5 is the view of cooling water flow when fin piles up array.
Among the figure: housing 1, water inlet 2, delivery port 3, fin 4, heat radiation crossbeam 5 is walked aqua region 6, and fin piles up array 7, screw hole 8, main flow tank 9.
The specific embodiment
Below in conjunction with the description of drawings and the specific embodiment the utility model is described in further detail:
Referring to Fig. 1 to Fig. 5, the stacked chip water-filled radiator of the utility model comprises housing 1, water inlet 2 and delivery port 3; The inside of described housing 1 offers main flow tank 9, and an end of main flow tank 9 is connected with water inlet 2, and the other end is connected with delivery port 3, and in the inside of main flow tank 9 fin is installed and piles up array 7; Described fin piles up array 7 and is piled up by at least two fin 4 levels and form, and adjacent fin 4 turns over turnback mutually.
Offer the heat radiation crossbeam 5 of at least two inclinations on the described fin 4, heat radiation is between the crossbeam 5 equidistantly or non-equidistance is arranged in parallel, and the angle between heat radiation crossbeam 5 and the horizontal plane is 10 Du –, 30 degree.
Described fin 4 by rectangular metal sheet through being stamped to form.
Main flow tank 9 is installed on the housing 1 by screw hole 8, the outline of the fin 4 of main flow tank 9 inside is a rectangular shape, fin 4 is made through punching press by the metal lamella, fin 4 forms the heat radiation crossbeam 5 of a plurality of inclinations after punching press, heat radiation crossbeam 5 width are even, heat radiation crossbeam 5 is equidistantly or non-equidistance is arranged, the heat radiation crossbeam 5 that is equidistant distribution is similar to the comb structure that is certain inclination angle, the area of space that forms between the heat radiation crossbeam 5 has just constituted after fin 4 is superimposed walks aqua region 6, walks the cooling water that can flow in the aqua region 6.
Walk aqua region 6 and be broken line and distribute, and run through and crisscross fin and pile up each fin 4 in the array 7, cooling water can omnibearingly fully contact with fin 4 like this, and the area of generation heat exchange is big, and radiating effect is remarkable.The surface of fin 4 can scribble antirust and other coating.
After cooling water flows in the housing 1 by water inlet 2, piling up array 7 along fin flows near the space between the heat radiation crossbeam 5 on the water inlet 2 one end fin 4, enter away aqua region 6, because heat radiation crossbeam 5 is certain angle of inclination and adjacent fin 4 with respect to the other side's Rotate 180 degree and be formed by stacking, after making that cooling water flows into a segment distance from a fin 4, that passes that superimposed formed passage between two fin 4 enters into adjacent fin 4 walks aqua region 6, and flows forward.In flow process, cooling water flow can constantly flow to walks aqua region 6 between the adjacent fin 4, walk aqua region 6 and be the broken line distribution, and run through and crisscross fin and pile up each fin 4 in the array 7, making cooling water pile up the moving of making a circulation in the array 7 at fin advances, and be flowing forward of stereoscopic multi-layer face, the heat radiation contact area is big, can apply to widely in the radiator runner of various condenses.
Therefore the utility model not only thermocontact area is bigger, and radiating effect is better.

Claims (3)

1. stacked chip water-filled radiator, comprise housing (1), water inlet (2) and delivery port (3), it is characterized in that: the inside of described housing (1) offers main flow tank (9), one end of main flow tank (9) is connected with water inlet (2), the other end is connected with delivery port (3), and in the inside of main flow tank (9) fin is installed and piles up array (7); Described fin piles up array (7) and is piled up by at least two fin (4) level and form, and adjacent fin (4) turns over turnback mutually.
2. stacked chip water-filled radiator according to claim 1, it is characterized in that: the heat radiation crossbeam (5) that offers at least two inclinations on the described fin (4), be between heat radiation crossbeam (5) equidistantly or non-equidistance is arranged in parallel, and the angle between heat radiation crossbeam (5) and the horizontal plane is 10 Du –, 30 degree.
3. stacked chip water-filled radiator according to claim 1 and 2 is characterized in that: described fin (4) is stamped to form by rectangular metal sheet.
CN2010206155130U 2010-11-19 2010-11-19 Stacked water cooling radiator Expired - Lifetime CN201892439U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206155130U CN201892439U (en) 2010-11-19 2010-11-19 Stacked water cooling radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206155130U CN201892439U (en) 2010-11-19 2010-11-19 Stacked water cooling radiator

Publications (1)

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CN201892439U true CN201892439U (en) 2011-07-06

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CN2010206155130U Expired - Lifetime CN201892439U (en) 2010-11-19 2010-11-19 Stacked water cooling radiator

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103988041A (en) * 2011-10-04 2014-08-13 法雷奥热系统公司 Heat exchanger with stacked plates
CN107924897A (en) * 2015-09-18 2018-04-17 株式会社T.Rad Laminated cores build radiator
CN108662549A (en) * 2018-07-26 2018-10-16 中山易事达光电科技有限公司 L ED vehicle lamp with liquid cooling heat dissipation function
CN110323140A (en) * 2019-04-12 2019-10-11 厦门大学 Manufacturing method and heat exchanger with microflute-fold micro-channel heat exchanger core
CN111988971A (en) * 2020-09-18 2020-11-24 珠海银河温控技术有限公司 Heat exchange unit and heat exchange module
WO2022253241A1 (en) * 2021-06-03 2022-12-08 苏州汇川联合动力系统有限公司 Heat exchange assembly, heat dissipation structure, and electric motor controller
CN116864467A (en) * 2023-08-04 2023-10-10 毫厘机电(苏州)有限公司 Chip heat abstractor

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103988041A (en) * 2011-10-04 2014-08-13 法雷奥热系统公司 Heat exchanger with stacked plates
CN107924897A (en) * 2015-09-18 2018-04-17 株式会社T.Rad Laminated cores build radiator
CN107924897B (en) * 2015-09-18 2020-10-23 株式会社T.Rad Laminated core type radiator
CN108662549A (en) * 2018-07-26 2018-10-16 中山易事达光电科技有限公司 L ED vehicle lamp with liquid cooling heat dissipation function
CN110323140A (en) * 2019-04-12 2019-10-11 厦门大学 Manufacturing method and heat exchanger with microflute-fold micro-channel heat exchanger core
CN110323140B (en) * 2019-04-12 2021-03-16 厦门大学 Method for manufacturing micro-channel heat exchanger core with micro-groove-corrugation and heat exchanger
CN111988971A (en) * 2020-09-18 2020-11-24 珠海银河温控技术有限公司 Heat exchange unit and heat exchange module
WO2022253241A1 (en) * 2021-06-03 2022-12-08 苏州汇川联合动力系统有限公司 Heat exchange assembly, heat dissipation structure, and electric motor controller
CN116864467A (en) * 2023-08-04 2023-10-10 毫厘机电(苏州)有限公司 Chip heat abstractor

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SHANGHAI EAGTOP ELECTRONIC TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: WUHAN RENUO METAL TECHNOLOGY CO.,LTD.

Effective date: 20120517

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 430082 WUHAN, HUBEI PROVINCE TO: 201604 SONGJIANG, SHANGHAI

TR01 Transfer of patent right

Effective date of registration: 20120517

Address after: Songjiang District shihudong Town Industrial Park, Shanghai City, 201604 humin Road No. 158

Patentee after: Shanghai Eagtop Electronic Technology Co., Ltd.

Address before: 430082 No. 43 metallurgical Avenue, Qingshan District, Hubei, Wuhan

Patentee before: Wuhan Renuo Metal Technology Co., Ltd.

C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: Songjiang District shihudong Town Industrial Park, Shanghai City, 201604 humin Road No. 158

Patentee after: Shanghai Eagle Peak Polytron Technologies Inc

Address before: Songjiang District shihudong Town Industrial Park, Shanghai City, 201604 humin Road No. 158

Patentee before: Shanghai Eagtop Electronic Technology Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20110706

CX01 Expiry of patent term