CN113311548A

CN113311548A - Optical module and electronic equipment

Info

Publication number: CN113311548A
Application number: CN202010124768.5A
Authority: CN
Inventors: 陶媛; 马富强; 郭学平; 孔繁鑫; 李得亮; 叶润清; 史洪宾
Original assignee: Huawei Device Co Ltd
Current assignee: Huawei Device Co Ltd
Priority date: 2020-02-27
Filing date: 2020-02-27
Publication date: 2021-08-27

Abstract

The embodiment of the application provides an optical module and electronic equipment. Wherein, the optical module includes: a connecting member; the substrate is electrically connected with a Printed Circuit Board (PCB) in the electronic equipment provided with the optical module through the connecting piece; an optical device disposed on a surface of the substrate remote from the PCB, the optical device being electrically connected to the substrate; the chip is arranged on the surface, close to the PCB, of the substrate and electrically connected with the substrate and used for controlling the optical device; and the heat conducting piece is arranged between the chip and the PCB, and the chip is connected with the PCB through the heat conducting piece.

Description

Optical module and electronic equipment

Technical Field

The present application relates to the field of optics, and in particular, to an optical module and an electronic device.

Background

In a conventional optical module design, a laser (VCSEL) and a Photodiode (PD) are integrated into a small module, and an Integrated Circuit (IC) chip is soldered on a circuit board together with the small module. The whole layout area is large, and the integration level is low. In order to meet the requirement of miniaturization, the current novel optical module adopts a substrate embedding scheme, a bare chip (die) of a driving IC is embedded in a module substrate of a VCSEL chip and a PD chip of a laser, and then the module is welded on a circuit board. The area of the optical module in the horizontal XY direction can be reduced. However, the drive IC is embedded in the substrate, and the periphery of the drive IC is completely surrounded by the substrate material, so that the equivalent thermal conductivity of the substrate in the horizontal direction is about 45W/(m · K), the equivalent thermal conductivity of the substrate in the vertical direction is about 0.45W/(m · K), the embedded drive IC has no effective heat dissipation path in the vertical direction, and the heat dissipation effect of the drive IC is poor in the working condition.

Disclosure of Invention

The embodiment of the application provides an optical module and electronic equipment. The optical module transmits heat generated by the chip to a circuit board of the electronic equipment through the heat conducting piece, so that the heat dissipation problem of the chip is solved while the miniaturization and high integration of the optical module are ensured.

In a first aspect, an optical module is provided, the optical module comprising: a connecting member; the substrate is electrically connected with a Printed Circuit Board (PCB) in the electronic equipment provided with the optical module through the connecting piece; an optical device disposed on a surface of the substrate remote from the PCB, the optical device being electrically connected to the substrate; the chip is arranged on the surface, close to the PCB, of the substrate and electrically connected with the substrate and used for controlling the optical device; and the heat conducting piece is arranged between the chip and the PCB, and the chip is connected with the PCB through the heat conducting piece.

According to this application embodiment, through set up optical device and chip in base plate both sides, guarantee optical module's miniaturization, simultaneously, because heat-conducting member sets up between chip and PCB, can transmit the circuit board of electronic equipment with the heat that the chip produced in the operation. Therefore, the optical module structure of this application can be in the heat dissipation problem of guaranteeing optical module miniaturization and high integration while solving the chip.

With reference to the first aspect, in certain implementations of the first aspect, the heat conducting member includes a metal plating layer and a first solder joint, the metal plating layer is disposed on a surface of the chip close to the PCB, and one end of the first solder joint is in contact with the metal plating layer, and the other end of the first solder joint is in contact with the PCB.

According to the embodiment of the application, the structure of the metal coating and the first welding point can ensure the heat dissipation efficiency and increase the structural strength. With reference to the first aspect, in certain implementations of the first aspect, the chip is overmolded in a compound.

With reference to the first aspect, in certain implementations of the first aspect, the optical module further includes a plastic package, and the chip is disposed in the plastic package.

With reference to the first aspect, in certain implementations of the first aspect, the connecting member is disposed in the plastic package.

According to the embodiment of the application, the chip and the connecting piece can be plastically packaged in the plastic package piece formed by the compound together, and the strength of the structure of the optical module is guaranteed.

In combination with the first aspect, in certain implementations of the first aspect, the connector may be a conductive silver paste.

According to the embodiment of the application, when the connecting piece is arranged in the plastic package part, the surface of the plastic package part can be perforated through laser, and the connecting piece is formed by filling conductive silver paste.

With reference to the first aspect, in certain implementations of the first aspect, the molding surface is provided with at least one hole; the metal coating is arranged along the hole wall of the at least one hole and is in contact with the chip.

According to this application embodiment, the chip can be wrapped up in plastic envelope spare, can effectively increase optical module's structural strength, simultaneously, can utilize laser drilling technique at plastic envelope surface trompil to chip surface to set up metallic coating at the pore wall, metallic coating one end and chip contact, the other end can contact with the solder joint, realizes heat conduction structure.

With reference to the first aspect, in certain implementation manners of the first aspect, the molding compound does not mold the chip close to the surface of the PCB.

According to this application embodiment, can expose the surface that the chip is close to PCB, when guaranteeing optical module structural strength, further increase the radiating efficiency.

With reference to the first aspect, in certain implementations of the first aspect, the heat conducting member is a heat conducting adhesive layer, an upper surface of the heat conducting member is in contact with the chip, and a lower surface of the heat conducting member is in contact with the PCB.

According to the embodiment of the application, the heat-conducting adhesive layer is used as the heat-conducting piece, so that the manufacturing is simple, and the cost is lower.

With reference to the first aspect, in certain implementations of the first aspect, a surface of the substrate close to the PCB is provided with a recess, and the chip is located in a notch formed by the recess.

With reference to the first aspect, in certain implementations of the first aspect, the connector includes: the frame plate, the second welding spot and the third welding spot; the frame plate is electrically connected with the substrate through a second welding spot, and the frame plate is electrically connected with the PCB through a third welding spot.

According to the embodiment of the application, the frame plate, the second welding spot and the third welding spot are used as the connecting piece, so that the electric connection effect is better.

With reference to the first aspect, in certain implementation manners of the first aspect, the connecting member is a fourth solder joint, the substrate is electrically connected to the PCB through the fourth solder joint, one end of the fourth solder joint is electrically connected to the substrate, and the other end of the fourth solder joint is electrically connected to the PCB.

According to the embodiment of the application, the electric connection between the substrate and the PCB can be realized through the fourth welding point, and the fourth welding point can be a large welding point, so that the structure is simple, and the manufacturing cost is low.

With reference to the first aspect, in certain implementations of the first aspect, the substrate is a ceramic material.

According to the embodiment of the application, the substrate made of the ceramic material can effectively improve the heat conduction efficiency of the optical module.

In a second aspect, an electronic device is provided, comprising at least one optical module as described in any of the above first aspects.

In a third aspect, an optical module is provided, which is applied to an electronic device, where the electronic device includes a PCB, and the optical module includes: the chip comprises an optical device, a chip, a grounding shielding layer, a grounding wiring layer, a grounding hole, a shielding metal layer and a substrate; the optical device is arranged on the surface of the substrate far away from the PCB, and the chip is arranged on the surface of the substrate close to the PCB; the substrate comprises an upper substrate, a middle substrate and a lower substrate, and the lower substrate is arranged on the surface of the PCB; the grounding shielding layer is positioned on the surface of the upper substrate far away from the middle substrate; the grounding wiring is positioned between the middle layer substrate and the upper layer substrate; the grounding hole is positioned in the middle layer substrate, the upper layer substrate and the lower layer substrate, one end of the grounding hole is electrically connected with the grounding shielding layer, and the other end of the grounding hole is electrically connected with the PCB and the grounding wiring layer; the metal shielding layer is positioned on the middle substrate, and the peripheries of the upper substrate and the lower substrate are electrically connected with the grounding shielding layer.

With reference to the third aspect, in certain implementations of the third aspect, a surface of the upper substrate is provided with a recess, and the optical device is located in a recess formed by the recess of the upper substrate.

With reference to the third aspect, in certain implementations of the third aspect, the surface of the lower substrate is provided with a recess, and the chip is located in a recess formed by the recess of the lower substrate.

With reference to the third aspect, in certain implementations of the third aspect, the middle substrate is a ceramic material.

In a fourth aspect, an electronic device is provided, comprising at least one optical module as described in any of the above third aspects.

Drawings

Fig. 1 is a schematic view of an electronic device provided in an embodiment of the present application.

FIG. 2 is a schematic diagram of an optical module using a substrate-embedded scheme.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure.

Fig. 4 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 5 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 6 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 7 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 8 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 9 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 10 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 11 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 12 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 13 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 14 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Fig. 15 is a schematic structural diagram of another optical module according to an embodiment of the present disclosure.

Detailed Description

The technical solution in the present application will be described below with reference to the accompanying drawings.

The electronic device in the embodiment of the application can be a mobile phone, a tablet computer, a notebook computer, an intelligent bracelet, an intelligent watch, an intelligent helmet, intelligent glasses and the like. The electronic device may also be a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a Wireless Local Loop (WLL) station, a Personal Digital Assistant (PDA), a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network, or an electronic device in a Public Land Mobile Network (PLMN) for future evolution, and the like, which are not limited in this embodiment.

Fig. 1 is a schematic view of an electronic device provided in an embodiment of the present application, and here, the electronic device is taken as a mobile phone for explanation.

As shown in fig. 1, the electronic device has a cubic shape, and may include a frame 10 and a display screen 20, where the frame 10 and the display screen 20 may be mounted on a middle frame (not shown in the figure), the frame 10 may be divided into an upper frame, a lower frame, a left frame, and a right frame, and the frames are connected to each other, and a certain arc or chamfer may be formed at the connection point.

The electronic device further includes a Printed Circuit Board (PCB) disposed inside, and electronic components may be disposed on the PCB and include, but are not limited to, a capacitor, an inductor, a resistor, a processor, a camera, a flash, a microphone, a battery, and the like.

The frame 10 may be a metal frame, such as a metal frame made of copper, magnesium alloy, stainless steel, etc., a plastic frame, a glass frame, a ceramic frame, etc., or a frame made of metal and plastic.

As shown in fig. 2, the driver IC30 is embedded in the substrate 40 of the VCSEL and PD module, and the optical module is soldered to the PCB. The heat dissipation effect of the package structure formed by vertically stacking the driver IC and the optical device through the driver IC embedded in the substrate of the module is not ideal.

The embodiment of the application provides an optical module which can be applied to any one of the electronic devices. The optical module is characterized in that the optical device and the chip are arranged on two sides of the substrate respectively, and heat generated by the chip is transmitted to the circuit board of the electronic equipment through the heat conducting piece, so that the heat dissipation problem of the chip is solved while the miniaturization and high integration of the optical module are ensured.

As shown in fig. 3, the optical module may include: substrate 110, optical device 120, chip 130, and thermal conductor 140. The optical module may be disposed on a PCB150 of the electronic device.

Wherein the substrate 110 may be electrically connected with the PCB150 through the connection member 190. The optical device 120 may be disposed on a surface of the substrate 110 away from the PCB150 and electrically connected to the substrate 110. The chip 130 may be disposed on a surface of the substrate 110 near the PCB and electrically connected to the substrate 110. The substrate 110 may have a circuit disposed therein, and the chip 130 may be electrically connected to the circuit in the substrate 110 to control the optical device 120. The thermal conductive member 140 may be disposed between the chip 130 and the PCB150 for connecting the chip 130 and the PCB150, and may transmit heat generated when the chip 130 operates to the PCB.

Alternatively, the optical device 120 may be a VCSEL, PD, or other optical device. In the present application, the optical device 120 is exemplified by the VCSEL121 and the PD122, but the type of the optical device is not limited.

Alternatively, the chip 130 may be a chip for controlling the optical device, such as a driving chip or a power supply chip, and the application is not limited to the kind of the chip.

Alternatively, the optical device 120 and the chip 130 may be fixed on the substrate 110 by an adhesive paste or solder.

Optionally, the optical module may further include a diffuser 170 having a lens structure.

For example, in the optical module, the chip 130 may drive the VCSEL121 to emit light according to a predetermined rule, the PD122 may detect the light intensity of the VCSEL121 and feed back the detected light intensity to the monitoring terminal for representing the operating state of the VCSEL121, the interconnection link between the VCSEL121 and the chip 130 may be interconnected with a passive device 160 such as a capacitor, an inductor, and a resistor, and the light emitted by the VCSEL121 may be irradiated onto an object through the diffuser 170, and the reflected light may be received and processed by the receiving terminal PD 122. It should be understood that when the optical module is applied to a mobile phone, the PD122 receives the reflected return light, and the distance of the human body or object approaching the mobile phone can be determined by the intensity of the return light. When the approaching distance is smaller than a certain threshold value, the brightness of the screen of the mobile phone can be dimmed.

Optionally, the connecting member 190 may further include a frame plate 191, and the substrate 110 may be electrically connected through the frame plate 191, the second pad 192 and the third pad 193.

Alternatively, the chip 130 may be fixed on the surface of the substrate 110 near the PCB by soldering. An underfill (underfill)180 may be filled at the solder joints of the chip 130 for protecting the solder joints, so as to increase the connection stability between the chip 130 and the substrate 110.

Alternatively, the heat conductive member 140 may include a metal plating layer 141 and a first solder 142. The metal plating layer 141 may be sputtered on the surface of the chip 130 close to the PCB150 by a sputtering process, so that the chip surface may be metallized and patterned into a pad pattern, and the pad and the PCB150 may be connected by the first pad 142.

The embodiment provided by the application can form a heat dissipation path from the surface of the chip to the PCB. The thermal conductivity coefficient of the welding point between the substrate and the PCB is 58W/(m.K), if the sputtering coating contains copper, the thermal conductivity coefficient is 377W/(m.K), and the thermal conductivity is obviously improved compared with the substrate with the embedded chip design.

Alternatively, the thermal conductive member 140 may be a thermal conductive adhesive layer, as shown in fig. 4. The upper surface of the heat-conducting adhesive layer is in contact with the surface of the chip, and the lower surface of the heat-conducting adhesive layer is in contact with the PCB. A good heat dissipation passage can be formed between the chip and the PCB through the heat conduction adhesive layer, and the heat dissipation problem of the chip is solved.

It should be understood that there are many options for the heat conducting member 140, and for convenience of description, the following embodiments are described by taking the heat conducting member as the first solder and the metal plating layer as examples.

Alternatively, the material of the substrate 110 may be ceramic. Because the substrate made of the ceramic material has good heat dissipation performance, the heat of the high-power optical device can be dissipated to the PCB at the speed of passing through the ceramic substrate. The heat dissipation path of the optical module is shown in fig. 4, which solves the heat dissipation problem of the optical device and the driving chip in the optical module.

Optionally, the passive devices 160 on the network link associated with the optical module may be integrated and embedded in the substrate, thereby increasing the degree of integration of the module and reducing the size of the module.

It should be understood that by arranging the optical device and the chip on two sides of the substrate respectively, the chip and the optical device can be vertically interconnected, and the direct interconnection distance between the chip and the optical device is shortened, so that the parasitic inductance on the driving link is reduced, and the electrical performance of the optical module is improved. Meanwhile, the structure does not need to embed the chip into the substrate, is simple in structure, and can improve the heat dissipation efficiency of the chip while ensuring high integration level.

As shown in fig. 5, a surface of the substrate 110 of the optical module near the PCB may be provided with a recess, i.e., a cavity (cavity) may be formed, and the chip may be disposed in a recess formed by the recess. The periphery of the substrate is electrically connected with the PCB through the fifth solder joint 144 to conduct interconnection signals, i.e., the connecting member between the substrate and the PCB is the fifth solder joint 144. The chip may be located in a recess formed by a sunken structure of the substrate. The chip can be fixed on the substrate 110 by welding, the underfill can be filled between the chip and the substrate, the chip is close to the upper surface of the PCB to form a metal coating by sputtering to form a pattern bonding pad, and then the chip is welded with the PCB by welding points to form a heat dissipation passage between the chip and the PCB.

As shown in fig. 6, on the basis of fig. 3, the substrate may be electrically connected to the PCB through a fourth pad 145 for conducting an interconnection signal, that is, a connection member between the substrate and the PCB may be the fourth pad 145. The fourth pad 145 may be a large-sized pad, one end of which is electrically connected to the substrate and the other end of which is electrically connected to the PCB.

As shown in fig. 7, the optical module may further include a molding member 210, and the chip 130 is disposed in the molding member 210. The molding compound 210 may be formed by partially molding the chip 130 with a compound. After the plastic package is completed, a hole 220 can be formed in the plastic package area of the chip 130 near the surface of the PCB150 by using a laser technique until reaching the surface of the chip 130, and then a metal coating on the hole wall and the plastic package surface can be formed by using a sputtering process, so that a bonding pad 230 can be formed on the plastic package surface. The pad 230 is connected to the PCB150 by a first solder point. Finally, a heat dissipation path is formed from the surface of the chip 130 to the PCB150, wherein the thermal conductivity of the first solder joint between the substrate 110 and the PCB150 is 58W/(m · K), and the thermal conductivity of copper contained in the metal layer is 377W/(m · K), which is significantly improved compared with the thermal conductivity of the substrate designed by the embedded chip. The substrate 110 may be electrically connected through the frame plate 191, the second pad 192, and the third pad 193 to perform signal transmission.

Alternatively, the compound may include a thermosetting crosslinking resin, for example, an Epoxy Molding Compound (EMC).

It should be understood that, by using the compound to locally mold the chip 130, the stability of the optical module can be effectively improved. Meanwhile, the radiating efficiency of the chip can be effectively ensured not to be influenced by opening holes on the surface of the plastic package and arranging the metal coating.

As shown in fig. 8, on the basis of fig. 7, the substrate may be electrically connected to the PCB through a fourth pad 145 for conducting an interconnection signal, that is, a connection member between the substrate and the PCB may be the fourth pad 145. The fourth pad 145 may be a large-sized pad, one end of which is electrically connected to the substrate and the other end of which is electrically connected to the PCB.

As shown in fig. 9, the chip 130 is disposed on the surface of the substrate 110, the surface of the substrate on which the chip is disposed may be integrally molded with a compound to form a molding compound 210, and the connecting member may be disposed in the molding compound 210. The surface of the molding member 210 may be subjected to laser processing (TMV) to mold via holes on the surface of the substrate 110, and the holes may be filled by electroless plating and electroplating to form the connection member 190. And a pad 240 is formed on the surface of the connection member 190, and the substrate 110 and the PCB150 can be electrically connected by a sixth pad 250.

As shown in fig. 10, the chip 130 is disposed on the surface of the substrate 110, and the surface of the substrate on which the chip is disposed may be integrally molded with a compound to form a molding compound 210, or the connecting member may be disposed in the molding compound 210. The molding member 210 may be formed by laser processing a TMV hole on the surface of the substrate 110 and filling a conductive silver paste in the TMV hole to form the connecting member 190. A metal plating layer may be formed on the plastic package surface by a sputtering process, and a patterned pad may be formed on the metal plating layer, so that the substrate 110 may be electrically connected to the PCB150 by the sixth solder joint 250.

As shown in fig. 11, the chip 130 is disposed on the surface of the substrate 110 close to the PCB150, and the molding member 210 can be formed by partially molding the chip 130 with a compound. The plastic grinding may be thinned to expose the surface of the chip 130, i.e. the plastic package 210 does not cover the surface of the chip 130 close to the PCB 150. And then the metal coating of the hole wall and the plastic package surface is realized by sputtering process, and the bonding pad 230 can be formed on the plastic package surface. The pad 230 is connected to the PCB150 by the first solder 142. Eventually forming a heat dissipation path from the surface of chip 130 to PCB 150. The substrate 110 may be electrically connected through the frame plate 191, the second pad 192, and the third pad 193 to perform signal transmission.

It should be understood that thinning the plastic grinding to expose the surface of the chip 130 can improve the heat dissipation efficiency while ensuring the stability of the optical module.

As shown in fig. 12, on the basis of fig. 11, the substrate may be electrically connected to the PCB through a fourth pad 145 for conducting an interconnection signal, that is, a connection member between the substrate and the PCB may be the fourth pad 145. The fourth pad 145 may have a large size, and one end is electrically connected to the substrate and the other end is electrically connected to the PCB.

As shown in fig. 13, the chip 130 is disposed on the surface of the substrate 110, the surface of the substrate on which the chip is disposed may be integrally molded by a compound to form a molding compound 210, and the connecting member may also be disposed in the molding compound 210. The plastic encapsulant may be thinned to expose the surface of the chip 130, i.e., the compound does not cover the surface of the chip 130 close to the PCB 150. The surface of the molding member 210 may be processed into the TMV hole by laser processing to the surface of the substrate 110, and the hole may be filled by electroless plating and electroplating to form the connection member 190. And a pad 240 is formed on the surface of the connection member 190, and the substrate 110 and the PCB150 can be electrically connected by a sixth pad 250.

As shown in fig. 14, the chip 130 is disposed on the surface of the substrate 110, the surface of the substrate on which the chip is disposed may be integrally molded by a compound to form a molding compound 210, and the connecting member may also be disposed in the molding compound 210. The plastic encapsulant may be thinned to expose the surface of the chip 130, i.e., the compound does not cover the surface of the chip 130 close to the PCB 150. The surface of the molding member 210 may be formed by laser processing a TMV hole into the surface of the substrate 110 and filling the TMV hole with a conductive silver paste to form the connecting member 190. A metal plating layer may be formed on the plastic package surface by a sputtering process, and a patterned pad may be formed on the metal plating layer, so that the substrate 110 may be electrically connected to the PCB150 by the sixth solder joint 250.

Based on the above embodiment, the present application further provides an optical module structure that realizes electromagnetic shielding for internal electronic components by using the internal metal structure and the external metal layer of the optical module.

As shown in fig. 15, the optical module may further include a substrate, a chip, and an optical device.

Wherein, the optical device 120 is disposed on the surface of the substrate away from the PCB. The chip 130 may be disposed on a surface of the substrate near the PCB. The substrates may include a middle substrate 310, an upper substrate 320, and a lower substrate 330. The middle substrate 310 may be positioned between the upper substrate 320 and the lower substrate 330. The surface of the lower substrate 330 may be provided with a recess, and the chip 130 may be located in a recess of a sunken structure formed by the recess of the lower substrate 330. The surface of the upper substrate 320 may be provided with a recess, and the optical device 120 may be located in the recess of the depression structure formed by the recess of the upper substrate 320. The lower substrate 330 may be fixed on the PCB 150.

It is understood that the substrates in the above example may include a middle substrate 310, an upper substrate 320, and a lower substrate 330.

The optical module may further include: a ground shield layer 340 and a ground routing layer 350. The ground shield layer 340 may be disposed on a surface of the upper substrate 320 away from the middle substrate 310. The ground wiring 350 may be positioned between the middle substrate 310 and the upper substrate 320. And a ground hole 360 formed in the middle substrate 310, the upper substrate 320, and the lower substrate 330, having one end electrically connected to the ground shield 340 and the other end electrically connected to the PCB and the ground wire 350, for grounding.

To improve the shielding effect, the optical module may further include a shielding metal layer 370 disposed around the middle substrate 310, the upper substrate 320 and the lower substrate 330, and the shielding metal layer 370 may be electrically connected to the ground shielding layer 340 and the ground wiring 350.

Alternatively, the middle substrate 310 may be a ceramic substrate, which may further increase the heat conduction efficiency of the optical module due to the good heat conduction performance of the ceramic material.

It should be understood that in the embodiment of the present application, the ground shielding layer 340 of the substrate, the ground wiring layer 350, and the substrate internal ground hole 360 form a good electromagnetic shielding effect by the substrate surrounding shielding metal layer 370, so as to prevent the electronic components inside the optical module from being interfered by external devices.

Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of some interfaces, devices or units, and may be an electric or other form.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An optical module, comprising:

a connecting member;

the substrate is electrically connected with a Printed Circuit Board (PCB) in the electronic equipment provided with the optical module through the connecting piece;

an optical device disposed on a surface of the substrate remote from the PCB, the optical device being electrically connected to the substrate;

the chip is arranged on the surface, close to the PCB, of the substrate and electrically connected with the substrate and used for controlling the optical device;

and the heat conducting piece is arranged between the chip and the PCB, and the chip is connected with the PCB through the heat conducting piece.

2. The optical module of claim 1, wherein the thermal conduction member comprises a metal plating layer and a first solder joint, the metal plating layer is disposed on a surface of the chip close to the PCB, one end of the first solder joint is in contact with the metal plating layer, and the other end of the first solder joint is in contact with the PCB.

3. The optical module of claim 2 further comprising a molding, the chip being disposed in the molding.

4. The optical module of claim 3, wherein the connector is disposed in the plastic package.

5. The optical module of claim 3,

the surface of the plastic package part is provided with at least one hole;

the metal coating is arranged along the hole wall of the at least one hole and is in contact with the chip.

6. The optical module of claim 3, wherein the molding compound does not mold the surface of the chip close to the PCB.

7. The optical module of claim 1 wherein the thermal conductive member is a thermal conductive adhesive layer, an upper surface of the thermal conductive member contacting the chip and a lower surface of the thermal conductive member contacting the PCB.

8. The optical module of claim 4 wherein the connecting member is a conductive silver paste.

9. The optical module of any one of claims 1 to 8, wherein the surface of the substrate adjacent to the PCB is provided with a recess, and the chip is located in a recess formed by the recess.

10. The optical module of any one of claims 1 to 7 wherein the connector comprises:

the frame plate, the second welding spot and the third welding spot;

the frame plate is electrically connected with the substrate through the second welding spot, and the frame plate is electrically connected with the PCB through the third welding spot.

11. The optical module of any one of claims 1 to 7 wherein the connector is a fourth solder, the substrate is electrically connected to the PCB via the fourth solder, and one end of the fourth solder is electrically connected to the substrate and the other end of the fourth solder is electrically connected to the PCB.

12. The optical module of any one of claims 1-11 wherein the substrate is a ceramic material.

13. An electronic device, characterized in that it comprises at least one optical module according to any one of claims 1 to 12.

14. The utility model provides an optical module, is applied to electronic equipment, electronic equipment includes PCB, its characterized in that, optical module includes:

the chip comprises an optical device, a chip, a grounding shielding layer, a grounding wiring layer, a grounding hole, a shielding metal layer and a substrate;

the optical device is arranged on the surface of the substrate far away from the PCB, and the chip is arranged on the surface of the substrate close to the PCB;

the substrate comprises an upper substrate, a middle substrate and a lower substrate, and the lower substrate is arranged on the surface of the PCB;

the grounding shielding layer is positioned on the surface of the upper substrate far away from the middle substrate;

the grounding wiring is positioned between the middle layer substrate and the upper layer substrate;

the grounding hole is positioned in the middle layer substrate, the upper layer substrate and the lower layer substrate, one end of the grounding hole is electrically connected with the grounding shielding layer, and the other end of the grounding hole is electrically connected with the PCB and the grounding wiring layer;

the metal shielding layer is positioned on the middle substrate, and the peripheries of the upper substrate and the lower substrate are electrically connected with the grounding shielding layer.

15. The optical module of claim 14 wherein the surface of the upper substrate is provided with a recess and the optical device is positioned in a recess formed by the recess of the upper substrate.

16. The optical module of claim 14 wherein the surface of the lower substrate is provided with a recess, and the die is positioned in a recess formed by the recess of the lower substrate.

17. The optical module of claim 14 wherein the middle substrate is a ceramic material.

18. An electronic device, characterized in that it comprises at least one optical module according to any one of claims 14 to 17.