CN113301718A - Welding device for miniature electronic element and maintenance method thereof - Google Patents
Welding device for miniature electronic element and maintenance method thereof Download PDFInfo
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- CN113301718A CN113301718A CN202110589810.5A CN202110589810A CN113301718A CN 113301718 A CN113301718 A CN 113301718A CN 202110589810 A CN202110589810 A CN 202110589810A CN 113301718 A CN113301718 A CN 113301718A
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- 238000003466 welding Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000012423 maintenance Methods 0.000 title description 6
- 238000012360 testing method Methods 0.000 claims abstract description 8
- 238000004377 microelectronic Methods 0.000 claims description 92
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 238000005476 soldering Methods 0.000 claims description 17
- 230000002950 deficient Effects 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 7
- 238000000016 photochemical curing Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims 1
- 229920000642 polymer Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a welding device for miniature electronic elements and an overhauling method thereof, wherein the welding device comprises a circuit back plate and a middle communicating structure; a plurality of groups of electrode contact pad groups are arrayed on the front surface of the circuit backboard; the middle communicating structure is arranged on the front surface and covers the electrode contact pad group; the middle communicating structure is used for movably arranging the miniature electronic element, when the miniature electronic element is arranged on the middle communicating structure and applies a test signal to the circuit backboard, the electrode of the miniature electronic element is correspondingly contacted and conducted with the electrode contact pad in the electrode contact pad group, whether the miniature electronic element has a fault can be detected through whether the miniature electronic element is contacted and conducted, if the miniature electronic element has the fault, the faulty miniature electronic element can be pulled out, and the healthy miniature electronic element is replaced.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a miniature electronic element welding device and an overhauling method thereof.
Background
With the increasing progress of semiconductor and integrated circuit processes, the sizes of electronic components such as diodes, transistors, sensors, actuators, etc. are getting smaller and smaller, even to the order of less than 100 microns. When manufacturing electronic devices using these microelectronic elements, the microelectronic elements need to be soldered to corresponding positions of a circuit board one by one. In addition, the microelectronic device soldered on the circuit board may be a defective electronic device due to the yield of the microelectronic device.
After a defective micro electronic component is detected, it is generally necessary to heat the solder of the defective electronic component to melt, remove the defective electronic component, and replace it with a new electronic component to re-solder the defective electronic component. However, in the process of repeated soldering, the soldering performance of the solder may be reduced, which affects the final soldering effect, so how to design a soldering apparatus for microelectronic components and a method for repairing the same are problems to be solved.
Disclosure of Invention
1. Technical problem to be solved by the invention
The invention aims to overcome the defects in the prior art and provides a miniature electronic element welding device and an overhauling method thereof.
2. Technical scheme
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
the invention relates to a welding device for miniature electronic elements, which comprises a circuit back plate and a middle communicating structure;
a plurality of groups of electrode contact pad groups are arrayed on the front surface of the circuit backboard;
the middle communicating structure is arranged on the front surface and covers the electrode contact pad group;
the middle communicating structure is used for movably arranging a miniature electronic element, and under the condition that the miniature electronic element is movably arranged on the middle communicating structure and a test signal is applied to the circuit backboard, an electrode of the miniature electronic element is correspondingly contacted and conducted with an electrode contact pad in the electrode contact pad group.
As a further step of the present invention, the intermediate communication structure includes a clamping layer disposed on the front surface and covering the electrode contact pad set, a plurality of boss structures for limiting the microelectronic element are arrayed on a surface of the clamping layer facing away from the front surface, a plurality of through holes are arrayed on the clamping layer, wherein the through holes communicated with the electrode contact pads are filled with solder, and the through holes on the boss structures are filled with adhesive.
It can be understood that a plurality of boss structures are arranged on the clamping layer in an array mode, and the boss structures are used for being clamped between electrodes of the miniature electronic element and play a role in facilitating alignment of the miniature electronic element. The through hole on the boss structure is filled with adhesive glue, when the miniature electronic element is attached to the boss structure, the adhesive glue in the through hole can play a role in temporarily adhering the miniature electronic element, and in addition, the electrode of the miniature electronic element is just in contact with the electrode contact pad group for conduction. The detection signal is applied to the circuit backboard, whether the micro electronic element has a fault or not can be detected, and if the micro electronic element has the fault, the micro electronic element with the fault can be pulled out and replaced by a healthy micro electronic element.
As a further step of the present invention, an orthographic projection area of the projection structure on the front surface is surrounded by each of the electrode contact pads in the corresponding electrode contact pad group, so that alignment and limitation of the projection structure on the microelectronic element can be realized.
As a further step of the present invention, each of the electrode contact pad sets includes a first electrode contact pad and a second electrode contact pad, and the orthographic projection area of the boss structure on the front surface is located between the first electrode contact pad and the second electrode contact pad.
As a further step of the present invention, the distance between the first electrode contact pad and the second electrode contact pad is an electrode contact pad distance, the distance between the first electrode and the second electrode of the microelectronic element is an electrode distance, and the electrode contact pad distance is equal to the corresponding electrode distance.
As a further step of the present invention, the through hole communicating with the first electrode contact pad and the second electrode contact pad is a first through hole, a cross-sectional area of the first through hole is smaller than that of the first electrode contact pad and that of the second electrode contact pad, the through hole on the boss structure is a second through hole, and a diameter of the second through hole is smaller than 2 μm.
It can be understood that, in general, the cross-sectional areas of the first electrode contact pad and the second electrode contact pad are equal, and the cross-sectional area of the first through hole is smaller than the cross-sectional areas of the first electrode contact pad and the second electrode contact pad, so that it is described that a plurality of first through holes are provided between each electrode and the electrode contact pad, that is, the electrode of the microelectronic element in the present invention is soldered to the electrode contact pad through the solder in a plurality of independent micro through holes, and since the solder is independently limited in the through holes, the solder does not spread out and flow around, thereby avoiding the occurrence of short circuit caused by the solder flowing to other electrodes during the heating process.
As a further step of the present invention, the first through hole is filled with a metal strip, and the length of the metal strip is smaller than the depth of the corresponding first through hole, so that the conductive capability in the through hole is improved by the filling of the metal strip.
The invention relates to a method for overhauling a miniature electronic element, which comprises the following steps:
901. providing a welding device for the miniature electronic element;
902. aligning and placing the microelectronic elements on the corresponding boss structures by using a running head device;
903. applying a test signal to the circuit backboard, detecting whether each micro electronic element has a fault, and taking the micro electronic element with the fault as a dead pixel element;
904. removing the defective pixel element;
905. realigning the healthy microelectronic elements on the boss structures corresponding to the dead pixel elements;
906. in the case where it is determined that each of the microelectronic elements on the microelectronic element soldering apparatus is not defective, the solder is heated so that the microelectronic element is soldered on the microelectronic element soldering apparatus.
As a further step of the present invention, before step 903, a laser is used to irradiate each boss structure, so as to cure the adhesive glue in the boss structure, where the adhesive glue is a photo-curing glue.
3. Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following remarkable effects:
(1) according to the welding device for the miniature electronic element, the miniature electronic element can be contacted and conducted by movably limiting the miniature electronic element on the middle communicating structure, so that on one hand, the initial positioning of the miniature electronic element during welding is ensured, the welding quality is improved, and on the other hand, the miniature electronic element can be detected whether the miniature electronic element is a defective element or not under the condition that the miniature electronic element is not welded and fixed through the movable arrangement, so that the miniature electronic element can be replaced in time, and the condition that welding capacity is gradually lost due to repeated heating of welding flux in the traditional maintenance method is effectively avoided.
(2) The invention relates to a welding device for miniature electronic elements, wherein the cross-sectional areas of a first electrode contact pad and a second electrode contact pad are equal, and the cross-sectional area of the first through-holes is smaller than the cross-sectional areas of the first electrode contact pad and the second electrode contact pad, it means that a plurality of first through-holes are provided between each electrode and the electrode contact pad, furthermore, the electrode of the microelectronic element in the invention is welded with the electrode contact pad through the solder in a plurality of independent micro through holes, because the solder is limited in the through hole independently, the solder does not spread and flow disorderly, and then avoided the solder to flow to other electrode department and lead to the condition emergence of short circuit in the heating process, still fill in first through-hole in addition has the metal strip, and the length of metal strip is less than the degree of depth of corresponding through-hole, and here has improved the conducting capacity in this through-hole through the filling of metal strip.
(3) According to the welding device for the microelectronic element, disclosed by the invention, the diameter of each second through hole is smaller than 2 microns, a plurality of second through holes are formed in one boss structure, and then the adhesive in each second through hole can temporarily adhere the microelectronic element, and the microelectronic element can be conveniently pulled out of the boss structure due to the fact that the diameter of each second through hole is smaller.
Drawings
FIG. 1 is a schematic structural diagram of a welding apparatus for microelectronic devices according to the present invention;
FIG. 2 is a schematic structural diagram of another welding apparatus for microelectronic components according to the present invention;
fig. 3 to 6 are schematic views illustrating a method for manufacturing the microelectronic device soldering apparatus shown in fig. 1;
FIG. 7 is a schematic flow chart of a method for repairing microelectronic devices according to the present invention;
fig. 8 to 10 are schematic views illustrating steps of a method for repairing a microelectronic device according to the present invention.
The reference numerals in the schematic drawings illustrate:
100. a microelectronic element; 101. a first electrode; 102. a second electrode;
200. a dead-pixel element;
10. a circuit backplane; 11. a first electrode contact pad; 12. a second electrode contact pad;
20. a clamping layer; 21. a boss structure; 221. a first through hole; 222 a second via hole;
30. welding flux; 40. adhesive glue; 50. operating the head device; 60. and (4) imprinting the template.
Detailed Description
For a further understanding of the invention, reference should be made to the following detailed description taken in conjunction with the accompanying drawings and examples.
Example 1
As shown in fig. 1, a microelectronic component soldering apparatus of the present embodiment includes a circuit backplane 10 and an intermediate communication structure; a plurality of electrode contact pad sets are arrayed on the front surface of the circuit backboard 10; the middle communicating structure is arranged on the front surface of the circuit backboard 10 and covers the electrode contact pad group; the middle communication structure is used for movably arranging the microelectronic element 100, and in a state that the microelectronic element 100 is movably arranged on the middle communication structure and a test signal is applied to the circuit backplane 10, the electrodes of the microelectronic element 100 are correspondingly contacted and conducted with the electrode contact pads in the electrode contact pad group.
It should be noted that the microelectronic element 100 may be a resistor, a capacitor, an inductor, a switch, a button, a light emitting diode, a microphone, a speaker, a piezoelectric actuator, a solenoid, an electromechanical actuator, a motor, a pressure sensor, a light detector, a piezoelectric force sensor, a strain gauge, a humidity sensor, a temperature sensor, an accelerometer, a gyroscope, a compass, a touch sensor, etc.
It should be emphasized that in this embodiment, the micro electronic element 100 is movably limited on the intermediate communication structure to achieve contact conduction, which not only ensures the initial positioning of the micro electronic element 100 during soldering and improves the soldering quality, but also enables the micro electronic element 100 to detect whether the micro electronic element 100 is the defective element 200 without soldering and fixing through the movable arrangement, so that the micro electronic element 100 can be replaced in time, and meanwhile, the situation that the solder 30 is repeatedly heated and gradually loses the soldering capability in the conventional maintenance method is effectively avoided.
Specifically, the middle communication structure of this embodiment includes a position-clamping layer 20 disposed on the front surface of the circuit backplane 10 and covering the electrode contact pad group, a plurality of boss structures 21 for limiting the microelectronic element 100 are arranged in an array on the surface of the position-clamping layer 20 away from the front surface of the circuit backplane 10, a plurality of through holes are arranged in an array on the position-clamping layer 20, wherein the through holes communicated with the electrode contact pads are filled with solder 30, and the through holes on the boss structures 21 are filled with adhesive 40.
It should be noted that the bump structure 21 in the present embodiment is used to be clamped between the electrodes of the microelectronic element 100, and plays a role in facilitating the alignment of the microelectronic element 100. In addition, the through holes on the boss structures 21 are filled with adhesive 40, when the microelectronic element 100 is attached to the boss structures 21, the adhesive 40 in the through holes can temporarily adhere to the microelectronic element 100, in addition, the electrodes of the microelectronic element 100 just contact with the electrode contact pad set, when a detection signal is applied to the circuit backboard 10, whether the microelectronic element 100 has a fault can be detected, and if the fault exists, the faulty microelectronic element 100 can be pulled out, and the healthy microelectronic element 100 can be replaced.
In the present embodiment, the orthographic projection area of the bump structure 21 on the front surface of the circuit backplane 10 is surrounded by each electrode contact pad in the corresponding electrode contact pad group. It should be explained here that since the electrodes of the microelectronic element 100 are disposed corresponding to the electrode contact pads, and the orthographic projection area of the bump structure 21 on the front surface of the circuit backplane 10 is surrounded by the electrode contact pads, it is known that the electrodes of the microelectronic element 100 surround the body thereof, that is, a groove structure is formed between the electrodes of the microelectronic element 100, and the groove structure can cooperate with the bump structure 21, thereby playing a role of quickly aligning the microelectronic element 100.
Specifically, in the present embodiment, the microelectronic element 100 is a light emitting diode, the size of the light emitting diode serving as the microelectronic element 100 is smaller than 100 micrometers, each electrode contact pad group of the soldering apparatus for the light emitting diode includes a first electrode contact pad 11 and a second electrode contact pad 12, an orthographic projection area of the bump structure 21 on the front surface of the circuit backplane 10 is located between the first electrode contact pad 11 and the second electrode contact pad 12, and when a test signal is applied to the circuit backplane 10, the first electrode contact pad 11 and the second electrode contact pad 12 are in corresponding contact with the first electrode 101 and the second electrode 102 on the light emitting diode for conducting electricity.
The distance between the first electrode contact pad 11 and the second electrode contact pad 12 is an electrode contact pad distance, the distance between the first electrode 101 and the second electrode 102 of the microelectronic element 100 is an electrode distance, and the electrode contact pad distance is equal to the corresponding electrode distance.
Wherein, the through hole communicating with the first electrode contact pad 11 and the second electrode contact pad 12 is a first through hole 221, and the cross-sectional area of the first through hole 221 is smaller than the cross-sectional areas of the first electrode contact pad 11 and the second electrode contact pad 12, it should be explained that: in this embodiment, the cross-sectional areas of the first electrode contact pad 11 and the second electrode contact pad 12 are equal, and the cross-sectional area of the first through hole 221 is smaller than the cross-sectional areas of the first electrode contact pad 11 and the second electrode contact pad 12, which means that a plurality of first through holes 221 are disposed between each electrode and the electrode contact pad, that is, the electrodes of the microelectronic element 100 in this embodiment are soldered to the electrode contact pads through the solder 30 in a plurality of independent micro through holes, and since the solder 30 is individually limited in the through holes, the solder 30 does not spread out and flow around, and thus the occurrence of short circuit caused by the solder 30 flowing to other electrodes during heating is avoided.
The through holes on the bump structure 21 are the second through holes 222, generally, the cross-sectional dimension of the bump structure 21 is on the order of tens of microns, wherein the diameter of the second through holes 222 is smaller than 2 microns, then a plurality of second through holes 222 are provided on one bump structure 21, the adhesive 40 in the second through holes 222 can play a role of temporarily adhering the microelectronic element 100, and in addition, because the diameter of each second through hole 222 is smaller, the microelectronic element 100 can be easily removed from the bump structure 21.
As shown in fig. 2, the first through hole 221 is further filled with a metal strip 70, and the length of the metal strip 70 is smaller than the depth of the corresponding first through hole 221, where the conductive capability in the through hole is improved by the filling of the metal strip 70.
The clamping layer 20 of the present embodiment is made of a photo-curing polymer, and the adhesive 40 is a photo-curing adhesive, as shown in fig. 3 to 6, which are schematic diagrams of a manufacturing method of the welding apparatus for microelectronic elements shown in fig. 1.
As shown in fig. 3, a circuit backplane 10 is provided; coating a photocurable polymer layer on the front surface of the circuit back sheet 10; an imprint template 60 is provided and the imprint template 60 is pressed onto the photocurable polymer layer such that the surface of the photocurable polymer layer is transferred with the structure on the front surface of the clamping layer 20 as shown in fig. 1 and 2.
As shown in fig. 4 and 5, after the photocurable polymer layer is cured by laser irradiation, the imprint template 60 and the photocurable polymer layer are separated, so as to obtain the card layer 20 shown in fig. 1 and 2;
as shown in fig. 6, the second through hole 222 on the boss structure 21 is closed by a mask, and the solder 30 is filled in the first through hole 221 communicating with the first electrode contact pad 11 and the second electrode contact pad 12; the first through hole 221 is sealed by another mask, and the second through hole 222 on the boss structure 21 is filled with the adhesive 40, so as to manufacture the welding device for the microelectronic element.
As shown in fig. 7, 8, 9 and 10, the method for repairing a microelectronic element in this embodiment includes the following steps:
901. providing the microelectronic element welding device of the embodiment;
902. aligning and placing the microelectronic elements 100 on the corresponding boss structures 21 by using the operation head device 50;
903. applying a test signal to the circuit backboard 10, detecting whether each micro electronic element 100 has a fault, and taking the micro electronic element 100 with the fault as a dead pixel element 200;
904. removing the defective pixel element 200;
905. realigning the healthy microelectronic element 100 on the corresponding boss structure 21 of the bad point element 200;
906. in the case where it is determined that none of the microelectronic elements 100 on the microelectronic element soldering apparatus is malfunctioning, the solder 30 is heated so that the microelectronic elements 100 are soldered on the microelectronic element soldering apparatus.
Before step 903, a laser is used to irradiate each boss structure 21, so that the adhesive 40 in the boss structure 21 is cured, and the adhesive 40 is a photo-curable adhesive.
Whether the micro-electronic component 100 has a fault can be detected by the maintenance method, and meanwhile, the condition that the welding capacity is gradually lost when the welding flux 30 is repeatedly heated in the traditional maintenance method is avoided.
The present invention and its embodiments have been described above schematically, without limitation, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching, without departing from the spirit of the invention, the person skilled in the art shall not inventively design the similar structural modes and embodiments to the technical solution, but shall fall within the scope of the invention.
Claims (9)
1. A welding device for miniature electronic components is characterized by comprising a circuit backboard (10) and an intermediate communication structure;
a plurality of groups of electrode contact pad groups are arrayed on the front surface of the circuit backboard (10);
the middle communicating structure is arranged on the front surface and covers the electrode contact pad group;
the middle communicating structure is used for movably arranging a miniature electronic element (100), and under the condition that the miniature electronic element (100) is movably arranged on the middle communicating structure and a test signal is applied to the circuit backboard (10), the electrode of the miniature electronic element (100) is correspondingly contacted and conducted with the electrode contact pad in the electrode contact pad group.
2. A microelectronic component bonding apparatus according to claim 1, wherein: middle intercommunication structure is including setting up just cover on the positive surface screens layer (20) of electrode contact pad group, screens layer (20) deviate from positive surface array is arranged a plurality of being used for spacingly on the surface boss structure (21) of miniature electronic component (100), array is arranged a plurality of through-holes on screens layer (20), wherein with electrode contact pad intercommunication the through-hole intussuseption is filled with solder (30), on boss structure (21) the through-hole intussuseption is filled with bonding glue (40).
3. A microelectronic component bonding apparatus according to claim 2, wherein: the orthographic projection area of the boss structure (21) on the front surface is surrounded by each of the electrode contact pads in the corresponding group of electrode contact pads.
4. A microelectronic component bonding apparatus according to claim 3, wherein: each set of electrode contact pads comprises a first electrode contact pad (11) and a second electrode contact pad (12), and the orthographic projection area of the boss structure (21) on the front surface is located between the first electrode contact pad (11) and the second electrode contact pad (12).
5. A microelectronic component bonding apparatus according to claim 4, wherein: the distance between the first electrode contact pad (11) and the second electrode contact pad (12) is an electrode contact pad distance, the distance between the first electrode (101) and the second electrode (102) of the microelectronic element (100) is an electrode distance, and the electrode contact pad distance is equal to the corresponding electrode distance.
6. A microelectronic component bonding apparatus according to claim 4, wherein: the through hole communicated with the first electrode contact pad (11) and the second electrode contact pad (12) is a first through hole (221), the cross-sectional area of the first through hole (221) is smaller than that of the first electrode contact pad (11) and that of the second electrode contact pad (12), the through hole on the boss structure (21) is a second through hole (222), and the diameter of the second through hole (222) is smaller than 2 micrometers.
7. A microelectronic component bonding apparatus according to claim 6, wherein: the first through hole (221) is filled with a metal strip (70), and the length of the metal strip (70) is smaller than the depth of the corresponding first through hole (221).
8. A method for overhauling a miniature electronic element is characterized by comprising the following steps:
901. providing a microelectronic component bonding apparatus as claimed in any one of claims 1 to 7;
902. aligning the microelectronic elements (100) on the corresponding boss structures (21) using a running head device (50);
903. applying a test signal to the circuit backboard (10), detecting whether each micro electronic element (100) has a fault, and taking the micro electronic element (100) with the fault as a dead pixel element (200);
904. -extracting the bad-spot element (200);
905. realigning the healthy microelectronic elements (100) on the corresponding boss structures (21) of the defective pixel elements (200);
906. in the case where it is determined that each of the microelectronic elements (100) on the microelectronic element soldering apparatus is not defective, the solder (30) is heated so that the microelectronic element (100) is soldered on the microelectronic element soldering apparatus.
9. The method for repairing a microelectronic element of a microelectronic element bonding apparatus according to claim 8, wherein the method comprises: before the step 903, irradiating each boss structure (21) by using a laser to cure the adhesive glue (40) in the boss structure (21), wherein the adhesive glue (40) is a photo-curing glue.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116952947A (en) * | 2023-06-01 | 2023-10-27 | 东莞市冠超光电科技有限公司 | Flaw detection device for mobile phone panel |
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| CN116952947B (en) * | 2023-06-01 | 2024-02-23 | 东莞市冠超光电科技有限公司 | Flaw detection device for mobile phone panel |
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| CN113301718B (en) | 2022-11-04 |
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Effective date of registration: 20240801 Address after: Building 6, Zhenxing Intelligent Industrial Park, Zhenxing South Road, Huainan Economic and Technological Development Zone, Huainan City, Anhui Province, 232000 Patentee after: Anhui Qiaogori Intelligent Equipment Manufacturing Co.,Ltd. Country or region after: China Address before: 232000 Dongshan West Road, Huainan City, Anhui Province Patentee before: HUAINAN NORMAL University Country or region before: China |