CN113284687A - Chip resistor and preparation method thereof - Google Patents
Chip resistor and preparation method thereof Download PDFInfo
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- CN113284687A CN113284687A CN202110449009.0A CN202110449009A CN113284687A CN 113284687 A CN113284687 A CN 113284687A CN 202110449009 A CN202110449009 A CN 202110449009A CN 113284687 A CN113284687 A CN 113284687A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/245—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
The invention discloses a chip resistor, comprising: a first resistor groove and a second resistor groove which are oppositely arranged on the resistor body; the distance between the resistance trimming port of the first resistance trimming groove and the positive electrode at the left end of the chip resistor is less than 1/8 of the length of the resistor body; the distance between the resistance trimming port of the second resistance trimming groove and the front electrode at the right end of the chip resistor is smaller than 1/8 of the length of the resistor body. The embodiment of the invention can improve the bearable power of the chip resistor.
Description
Technical Field
The invention relates to the technical field of resistor preparation, in particular to a chip resistor and a preparation method thereof.
Background
As shown in fig. 1(a), the resistance characteristics of the conventional chip resistor are mainly generated by the resistor body 1, and the resistor is trimmed in order to make the resistance value of the resistor meet a preset target resistance value. When the chip resistor is repaired in the prior art, the repairing groove 2 is usually arranged near the center of the resistor body, so that the effective cross-sectional area of the middle part of the resistor body is reduced after the resistor is repaired, the heat dissipation of the resistor is slow, and the bearable power of the chip resistor is low.
Disclosure of Invention
The embodiment of the invention provides a chip resistor and a manufacturing method thereof, which can improve the bearable power of the chip resistor after resistance trimming.
An embodiment of the present invention provides a chip resistor, including: a first resistor groove and a second resistor groove which are oppositely arranged on the resistor body; the distance between the resistance trimming port of the first resistance trimming groove and the positive electrode at the left end of the chip resistor is less than 1/8 of the length of the resistor body; the distance between the resistance trimming port of the second resistance trimming groove and the front electrode at the right end of the chip resistor is smaller than 1/8 of the length of the resistor body. The temperature rise of the resistor body is greatly reduced by arranging the two resistance repairing grooves, and the purpose of improving power is achieved.
Further, the distance between the resistance trimming port of the first resistance trimming groove and the positive electrode at the left end of the chip resistor is 0-0.1 mm; the distance between the resistance trimming port of the second resistance trimming groove and the front electrode at the right end of the chip resistor is 0-0.1 mm.
Further, the first resistance trimming groove is linear or L-shaped; the second resistance trimming groove is linear or L-shaped;
when the first resistance trimming groove is linear, the first resistance trimming groove is parallel to the side edge of the resistor body in the vertical direction; when the first resistance trimming groove is L-shaped, a vertical side parallel to the side of the resistor body in the vertical direction exists in the first resistance trimming groove;
when the second resistance trimming groove is linear, the second resistance trimming groove is parallel to the side edge of the resistor body in the vertical direction; when the second resistance trimming groove is L-shaped, a vertical side parallel to the side of the resistor body in the vertical direction exists in the second resistance trimming groove.
Further, when the first resistor trimming groove is linear, the length of the first resistor trimming groove is less than 1/3 of the length of the side edge of the resistor body in the vertical direction; 1/3, when the first resistance trimming groove is L-shaped, the length of the vertical side in the first resistance trimming groove is smaller than the length of the side of the resistor body in the vertical direction; 1/3, when the second resistor trimming groove is linear, the length of the second resistor trimming groove is smaller than the length of the side edge of the resistor body in the vertical direction; when the second resistor trimming groove is L-shaped, the length of the vertical side in the second resistor trimming groove is less than 1/3 of the length of the vertical side of the resistor. The resistor body effective area after resistance trimming is widened through the design, and therefore the margin of resistance power is improved.
Further, the width of the back electrode at the left end of the chip resistor is greater than the distance from the resistance trimming port of the first resistance trimming groove to the side face at the left end of the insulating substrate; the width of the back electrode at the right end of the chip resistor is larger than the distance from the resistance trimming port of the second resistance trimming groove to the side face of the right end of the insulating substrate. By the design, the width of the back electrode is extended to cover the position right below the resistance trimming opening, so that the heat dissipation speed is improved.
Further, the difference between the width of the back electrode at the left end of the chip resistor and the distance from the resistance trimming port of the first resistance trimming groove to the side face at the left end of the insulating substrate is greater than or equal to 0.05 mm; the difference between the width of the back electrode at the right end of the chip resistor and the distance from the resistance trimming port of the second resistance trimming groove to the side face of the right end of the insulating substrate is greater than or equal to 0.05 mm.
On the basis of the above embodiment, the present invention provides another embodiment.
Another embodiment of the present invention provides a method for manufacturing a chip resistor, which is applied to the chip resistor according to any one of the above embodiments of the present invention, and the method includes: printing silver conductor slurry on the back surface of the insulating substrate to generate a left end back electrode and a right end back electrode;
printing silver conductor slurry on the front surface of the insulating substrate to generate a left front electrode and a right front electrode; the width of the left end back electrode is greater than that of the left end front electrode, and the width of the right end back electrode is greater than that of the right end front electrode;
printing resistance paste on the front surface of the insulating substrate to generate a resistor body; the resistor body is superposed on the left end front electrode and the right end front electrode;
printing a first protective layer on the resistor body, and then cutting a first resistance trimming groove and a second resistance trimming groove on the resistor body by adopting a double-cutter opposite-cutting-strip-shaped cutting mode; the distance between the resistance trimming opening of the first resistance trimming groove and the left end front electrode is smaller than 1/8 of the length of the resistor body; the distance between the resistance trimming port of the second resistance trimming groove and the right end front electrode is smaller than 1/8 of the length of the resistor body; 1/3 in which the vertical lengths of the first resistor groove and the second resistor groove are smaller than the vertical side lengths of the resistors; the width of the left end back electrode is larger than the distance from the resistance trimming port of the first resistance trimming groove to the side face of the left end of the insulating substrate; the width of the right-end back electrode is greater than the distance from the resistance trimming port of the second resistance trimming groove to the right-end side face of the insulating substrate;
printing a second protective layer on the first protective layer, and then arranging conductive material generation end electrodes on the left end side surface and the right end side surface of the insulating substrate;
providing an electroplating layer to cover the front electrode, the back electrode and the terminal electrode exposed to the outside, and creating the chip resistor.
The embodiment of the invention has the following beneficial effects:
compared with the prior art, the two resistance trimming grooves are oppositely arranged on the resistor body, the resistance trimming grooves are not arranged in the middle of the resistor body any more, the distance between the two resistance trimming openings and the front electrode is set to be 1/8 which is less than the length of the resistor body, so that the resistance trimming openings are close to the front electrode, meanwhile, the width of the back electrode is greater than the distance from the resistance trimming openings to the side surface of the insulating substrate, the width of the back electrode is extended to cover the position under the resistance trimming openings, the heat dissipation speed is improved, and finally the bearable power of the chip resistor is improved.
Drawings
Fig. 1 is a schematic structural diagram of a chip resistor in the prior art.
Fig. 2 is another structure diagram of a chip resistor in the prior art.
Fig. 3 is a schematic diagram of another structure of a chip resistor in the prior art.
Fig. 4 is a schematic structural diagram of a chip resistor according to an embodiment of the invention.
Fig. 5 is a schematic structural diagram of a trimming slot in a chip resistor according to an embodiment of the invention.
Fig. 6 is a schematic size diagram of a linear trimming slot of a chip resistor according to an embodiment of the invention.
Fig. 7 is a schematic size diagram of an L-shaped trimming slot of a chip resistor according to an embodiment of the invention.
Fig. 8 is a schematic diagram of a trimming opening and a back electrode in a chip resistor according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to better highlight the present invention, the following detailed description is made on the problems of the prior chip resistor after trimming:
1. as shown in FIG. 1(b), the conventional chip resistor is provided with a resistance trimming groove, the position of the resistance trimming groove is close to the middle part of the resistor body, the distance between the resistance trimming port and the distances A1 and A2 of the front electrodes at the left end and the right end are both larger than or equal to 1/4 of the length L of the resistor body, namely A1 is larger than or equal to 1/4L, and A2 is larger than or equal to 1/4L; this results in slow heat dissipation, so that the resistor can withstand lower power.
2. As shown in fig. 2, the length L1 of the trimming slot in the vertical direction in the conventional chip resistor (the direction from one front electrode to the other front electrode of the resistor is defined as the horizontal direction in the present invention, and the direction perpendicular to the horizontal direction is defined as the vertical direction), is less than 1/2 of the length W of the vertical side of the resistor (i.e. 1/2 less than the width of the resistor, the lengths of the left and right sides of the resistor connected with the front electrodes are defined as the width of the resistor, and the lengths of the upper and lower sides are defined as the length of the resistor), and such an arrangement results in the residual dimension W1 of the resistor after trimming being more than or equal to 1/2W, thereby resulting in a small effective cross-sectional.
3. As shown in fig. 3, the back electrode 6 of the conventional chip resistor is not extended and is far from the trimming opening 5, so that the heat dissipation is slow and the power of the resistor can be reduced.
To solve the above problems, embodiments of the present invention provide a chip resistor.
As shown in fig. 4, an embodiment of the present invention provides a chip resistor, including: a first resistor groove 21 and a second resistor groove 22 provided in the resistor in an opposed manner; the distance C1 between the resistance trimming port of the first resistance trimming groove and the positive electrode 41 at the left end of the chip resistor is less than 1/8 of the length L of the resistor body; the distance C2 between the trimming port of the second trimming groove 22 and the right front electrode 42 of the chip resistor is less than 1/8 of the length L of the resistor body. After the design is adopted, the heat dissipation speed is improved, and finally the bearable power of the chip resistor is improved.
In a preferred embodiment, the distance C1 between the resistance trimming port of the first resistance trimming groove and the positive electrode at the left end of the chip resistor is between 0mm and 0.1mm, namely 0 < C1 ≦ 0.1 mm; the distance C2 between the resistance trimming port of the second resistance trimming groove and the front electrode at the right end of the chip resistor is between 0mm and 0.1mm, namely C2 is more than 0 and less than or equal to 0.1 mm.
As shown in fig. 5: in a preferred embodiment, the first trimming groove is linear or L-shaped; the second resistance trimming groove is linear or L-shaped; when the first resistance trimming groove is linear, the first resistance trimming groove is parallel to the side edge of the resistor body in the vertical direction; when the first resistance trimming groove is in an L shape, a vertical side 211 parallel to the side of the resistor body in the vertical direction exists in the first resistance trimming groove; when the second resistance trimming groove is linear, the second resistance trimming groove is parallel to the side edge of the resistor body in the vertical direction; when the second trimming groove is L-shaped, a vertical side 221 parallel to the vertical side of the resistor body exists in the second trimming groove. Fig. 5(a) shows a case where both the trimming grooves are linear, and fig. 5(b) shows a case where both the trimming grooves are L-shaped.
As shown in fig. 6 and 7: when the first resistor groove is linear, the length B1 of the first resistor groove is less than 1/3 of the side length W in the vertical direction of the resistor (i.e., the width of the resistor); when the first resistance trimming groove is L-shaped, the length b1 of a vertical side in the first resistance trimming groove is less than 1/3 of the length W of a side edge of the resistor body in the vertical direction; when the second resistor trimming groove is linear, the length B2 of the second resistor trimming groove is less than 1/3 of the side length W of the resistor in the vertical direction; when the second resistor repairing groove is L-shaped, the length of the vertical side b2 in the second resistor repairing groove is less than 1/3 of the length W of the vertical side of the resistor. Through the design, the residual size W1 of the resistor body is more than or equal to 2/3W after resistance trimming, so that the effective area of the resistor body is widened, and the margin of resistance power is improved.
As shown in fig. 8, in a preferred embodiment, the width K1 of the back electrode 61 at the left end of the chip resistor is greater than the distance J1 from the trimming port of the first trimming slot to the side surface at the left end of the insulating substrate 7; the width K2 of the right back electrode 62 of the chip resistor is larger than the distance J2 from the trimming port of the second trimming groove to the right side surface of the insulating substrate. The width of the back electrode is extended to cover the position right below the resistance repairing opening through the design, so that the purpose of improving power is achieved.
Preferably, the difference between the width K1 of the left-end back electrode of the chip resistor and the distance J1 from the trimming port of the first trimming groove to the left-end side face of the insulating substrate is greater than or equal to 0.05 mm; the difference J2 between the width K2 of the back electrode at the right end of the chip resistor and the distance from the trimming port of the second trimming groove to the right end side face of the insulating substrate is greater than or equal to 0.05 mm. Namely, the distance between the projection point right below the resistance trimming port and the tail end of the corresponding back electrode is more than or equal to 0.05mm
According to the embodiment, the overlapped composite design is formed by four technical means of widening the effective cross-sectional area of the resistor body, adjusting the position of the resistance trimming port to be close to the front electrode, trimming with opposite double cutters and prolonging the back electrode, so that the temperature rise of the resistor body is greatly reduced, the bearable power of the chip resistor is improved, and the performance of high-power resistance is achieved.
On the basis of the above embodiments, another embodiment of the present invention provides a method for manufacturing a chip resistor, which is suitable for use in the chip resistor according to any one of the above embodiments of the present invention, and the method includes: printing silver conductor slurry on the back surface of the insulating substrate to generate a left end back electrode and a right end back electrode;
printing silver conductor slurry on the front surface of the insulating substrate to generate a left front electrode and a right front electrode; the width of the left end back electrode is greater than that of the left end front electrode, and the width of the right end back electrode is greater than that of the right end front electrode;
printing resistance paste on the front surface of the insulating substrate to generate a resistor body; the resistor body is superposed on the left end front electrode and the right end front electrode;
printing a first protective layer on the resistor body, and then cutting a first resistance trimming groove and a second resistance trimming groove on the resistor body by adopting a double-cutter opposite-cutting-strip-shaped cutting mode; the distance between the resistance trimming opening of the first resistance trimming groove and the left end front electrode is smaller than 1/8 of the length of the resistor body; the distance between the resistance trimming port of the second resistance trimming groove and the right end front electrode is smaller than 1/8 of the length of the resistor body; 1/3 in which the vertical lengths of the first resistor groove and the second resistor groove are smaller than the vertical side lengths of the resistors; the width of the left end back electrode is larger than the distance from the resistance trimming port of the first resistance trimming groove to the side face of the left end of the insulating substrate; the width of the right-end back electrode is greater than the distance from the resistance trimming port of the second resistance trimming groove to the right-end side face of the insulating substrate;
printing a second protective layer on the first protective layer, and then arranging conductive material generation end electrodes on the left end side surface and the right end side surface of the insulating substrate;
providing an electroplating layer to cover the front electrode, the back electrode and the terminal electrode exposed to the outside, and creating the chip resistor.
The detailed preparation method comprises the following steps:
1. printing silver conductor paste on the back of a cuboid insulating substrate in a thick-film screen printing mode to obtain a pair of back electrodes 61 and 62, wherein the pattern of the back electrodes is designed to be square, the width of the back electrodes is prolonged to be larger than that of the front electrodes and exceed the position of a projection point right below a resistance trimming port, and the distance between the projection point right below the resistance trimming port and the tail end of the corresponding back electrode is larger than or equal to 0.05 mm.
2. On the front surface of the insulating substrate, a silver conductive paste is printed by thick film screen printing to obtain a pair of front electrodes 41 and 42, the front electrodes 41 and 42 are not connected to each other, and the front electrode pattern is designed to be square or convex. The back electrode and the front electrode are sintered at 840-860 ℃.
3. Printing resistance paste on the front surface of the insulating substrate by adopting a thick film screen printing mode, sintering at 840-860 ℃ to obtain the resistor body 1, arranging the resistance layer on the front electrode and connecting with the front electrode, and designing the graph of the resistance layer into a square shape.
4. Printing glass slurry on the front surface of the insulating substrate by adopting a thick film screen printing mode, and firing at 600-620 ℃ to obtain a first protective layer, wherein the first protective layer is required to at least completely cover the lap joint position or the resistance repairing position of the resistor body and the front electrode.
5. Laser drilling is adopted in the vertical projection direction of the laminated structure, a double-cutter cutting mode of a tangential strip is adopted, a cutting graph can be in a single straight line shape or an L shape, a resistor body of the laminated structure penetrates through and is removed or cut away from a part, the cross section area of the resistor layer is changed, resistance value trimming is achieved, the distance between a trimming port and a corresponding front electrode is required to be within 0-C and 0.1mm, the initial position of the trimming port needs to be within 0.05mm of the tail end of the extending length of a back electrode, and meanwhile the residual size W1 of the resistor body after trimming is larger than or equal to 2/3W.
6. And printing glass or epoxy resin slurry on the laminated structure on the front surface of the insulating substrate by adopting a thick film screen printing mode, and sintering to obtain a second protective layer. The second protective layer is designed to cover the resistor completely (including the overlapping position of the resistor and the front electrode).
And 7, forming a pair of terminal electrodes on two side surfaces of the resistor in a mode of vacuum sputtering of metal such as nickel-chromium or coating of conductor slurry such as silver paste, so that the front electrode is connected with the back electrode, and a pair of electroplated nickel layers and a pair of electroplated tin layers are respectively realized on the exposed conductor structures of the front electrode, the back electrode and the terminal electrodes.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (7)
1. A chip resistor, comprising: a first resistor groove and a second resistor groove which are oppositely arranged on the resistor body; the distance between the resistance trimming port of the first resistance trimming groove and the positive electrode at the left end of the chip resistor is less than 1/8 of the length of the resistor body; the distance between the resistance trimming port of the second resistance trimming groove and the front electrode at the right end of the chip resistor is smaller than 1/8 of the length of the resistor body.
2. The chip resistor according to claim 1, wherein the distance between the trimming port of the first trimming groove and the front electrode at the left end of the chip resistor is between 0mm and 0.1 mm; the distance between the resistance trimming port of the second resistance trimming groove and the front electrode at the right end of the chip resistor is 0-0.1 mm.
3. The chip resistor as claimed in claim 1, wherein the first trimming groove is linear or L-shaped; the second resistance trimming groove is linear or L-shaped;
when the first resistance trimming groove is linear, the first resistance trimming groove is parallel to the side edge of the resistor body in the vertical direction; when the first resistance trimming groove is L-shaped, a vertical side parallel to the side of the resistor body in the vertical direction exists in the first resistance trimming groove;
when the second resistance trimming groove is linear, the second resistance trimming groove is parallel to the side edge of the resistor body in the vertical direction; when the second resistance trimming groove is L-shaped, a vertical side parallel to the side of the resistor body in the vertical direction exists in the second resistance trimming groove.
4. The chip resistor according to claim 3, wherein when the first trimming groove is a straight type, the length of the first trimming groove is less than 1/3 of the length of the vertical side of the resistor body; 1/3, when the first resistance trimming groove is L-shaped, the length of the vertical side in the first resistance trimming groove is smaller than the length of the side of the resistor body in the vertical direction; 1/3, when the second resistor trimming groove is linear, the length of the second resistor trimming groove is smaller than the length of the side edge of the resistor body in the vertical direction; when the second resistor trimming groove is L-shaped, the length of the vertical side in the second resistor trimming groove is less than 1/3 of the length of the vertical side of the resistor.
5. The chip resistor according to claim 1, wherein the width of the back electrode at the left end of the chip resistor is larger than the distance from the trimming port of the first trimming groove to the side surface at the left end of the insulating substrate; the width of the back electrode at the right end of the chip resistor is larger than the distance from the resistance trimming port of the second resistance trimming groove to the side face of the right end of the insulating substrate.
6. The chip resistor of claim 5, wherein the difference between the width of the back electrode at the left end of the chip resistor and the distance from the trimming port of the first trimming groove to the side surface at the left end of the insulating substrate is greater than or equal to 0.05 mm; the difference between the width of the back electrode at the right end of the chip resistor and the distance from the resistance trimming port of the second resistance trimming groove to the side face of the right end of the insulating substrate is greater than or equal to 0.05 mm.
7. A method for manufacturing a chip resistor, which is applied to the chip resistor according to any one of claims 1-5, comprising:
printing silver conductor slurry on the back surface of the insulating substrate to generate a left end back electrode and a right end back electrode;
printing silver conductor slurry on the front surface of the insulating substrate to generate a left front electrode and a right front electrode; the width of the left end back electrode is greater than that of the left end front electrode, and the width of the right end back electrode is greater than that of the right end front electrode;
printing resistance paste on the front surface of the insulating substrate to generate a resistor body; the resistor body is superposed on the left end front electrode and the right end front electrode;
printing a first protective layer on the resistor body, and then cutting a first resistance trimming groove and a second resistance trimming groove on the resistor body by adopting a double-cutter opposite-cutting-strip-shaped cutting mode; the distance between the resistance trimming opening of the first resistance trimming groove and the left end front electrode is smaller than 1/8 of the length of the resistor body; the distance between the resistance trimming port of the second resistance trimming groove and the right end front electrode is smaller than 1/8 of the length of the resistor body; 1/3 in which the vertical lengths of the first resistor groove and the second resistor groove are smaller than the vertical side lengths of the resistors; the width of the left end back electrode is larger than the distance from the resistance trimming port of the first resistance trimming groove to the side face of the left end of the insulating substrate; the width of the right-end back electrode is greater than the distance from the resistance trimming port of the second resistance trimming groove to the right-end side face of the insulating substrate;
printing a second protective layer on the first protective layer, and then arranging conductive material generation end electrodes on the left end side surface and the right end side surface of the insulating substrate;
providing an electroplating layer to cover the front electrode, the back electrode and the terminal electrode exposed to the outside, and creating the chip resistor.
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| CN202110449009.0A CN113284687B (en) | 2021-04-25 | 2021-04-25 | Chip resistor and preparation method thereof |
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| CN202110449009.0A CN113284687B (en) | 2021-04-25 | 2021-04-25 | Chip resistor and preparation method thereof |
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| CN113284687B CN113284687B (en) | 2022-07-26 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001338801A (en) * | 2000-05-30 | 2001-12-07 | Matsushita Electric Ind Co Ltd | Resistor and its manufacturing method |
| CN101243524A (en) * | 2005-08-18 | 2008-08-13 | 罗姆股份有限公司 | Chip resistor |
| CN104575885A (en) * | 2014-12-25 | 2015-04-29 | 广东风华高新科技股份有限公司 | Lateral strap resistor |
| US20160343479A1 (en) * | 2014-02-27 | 2016-11-24 | Panasonic Intellectual Property Management Co., Ltd. | Chip resistor |
-
2021
- 2021-04-25 CN CN202110449009.0A patent/CN113284687B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001338801A (en) * | 2000-05-30 | 2001-12-07 | Matsushita Electric Ind Co Ltd | Resistor and its manufacturing method |
| CN101243524A (en) * | 2005-08-18 | 2008-08-13 | 罗姆股份有限公司 | Chip resistor |
| US20160343479A1 (en) * | 2014-02-27 | 2016-11-24 | Panasonic Intellectual Property Management Co., Ltd. | Chip resistor |
| CN104575885A (en) * | 2014-12-25 | 2015-04-29 | 广东风华高新科技股份有限公司 | Lateral strap resistor |
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| CN113284687B (en) | 2022-07-26 |
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