CN113272919A - Nickel paste for multilayer ceramic capacitor - Google Patents
Nickel paste for multilayer ceramic capacitor Download PDFInfo
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- CN113272919A CN113272919A CN201980088188.0A CN201980088188A CN113272919A CN 113272919 A CN113272919 A CN 113272919A CN 201980088188 A CN201980088188 A CN 201980088188A CN 113272919 A CN113272919 A CN 113272919A
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- ceramic capacitor
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- sintering
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 287
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 114
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 49
- 229920000728 polyester Polymers 0.000 claims abstract description 36
- 239000002270 dispersing agent Substances 0.000 claims abstract description 26
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 10
- 239000010452 phosphate Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 abstract description 48
- 238000005245 sintering Methods 0.000 abstract description 43
- 239000000919 ceramic Substances 0.000 abstract description 24
- 230000000977 initiatory effect Effects 0.000 abstract description 22
- 238000010304 firing Methods 0.000 abstract description 21
- 230000007847 structural defect Effects 0.000 abstract description 11
- 229910000510 noble metal Inorganic materials 0.000 abstract description 8
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 6
- 230000032798 delamination Effects 0.000 abstract description 6
- 239000011229 interlayer Substances 0.000 abstract description 6
- 229910052717 sulfur Inorganic materials 0.000 abstract description 6
- 239000011593 sulfur Substances 0.000 abstract description 6
- 230000003993 interaction Effects 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000011156 evaluation Methods 0.000 description 68
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 36
- 230000006399 behavior Effects 0.000 description 24
- 239000010408 film Substances 0.000 description 22
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 17
- 239000000463 material Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 239000000843 powder Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 5
- 230000002776 aggregation Effects 0.000 description 5
- 238000004220 aggregation Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- 239000011859 microparticle Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- -1 amine salt Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- HBNHCGDYYBMKJN-UHFFFAOYSA-N 2-(4-methylcyclohexyl)propan-2-yl acetate Chemical compound CC1CCC(C(C)(C)OC(C)=O)CC1 HBNHCGDYYBMKJN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
The present invention addresses the problem of providing a nickel paste for a laminated ceramic capacitor, which is suitable for forming a nickel internal electrode, has a configuration that does not use interaction with a dielectric layer, does not contain sulfur that is not preferable for a semiconductor component, and does not contain expensive noble metals, and can prevent the occurrence of structural defects such as interlayer delamination, cracks, and breaks in the internal electrode film in the firing step of the laminated ceramic capacitor by raising the sintering initiation temperature of the conductive paste to a temperature close to the sintering initiation temperature of the ceramic green sheet. The solution of the present invention is a nickel paste for forming internal electrodes of a multilayer ceramic capacitor, which comprises a nickel powder, a dispersant and an organic vehicle as main components, wherein the dispersant contains a polyester phosphate.
Description
Technical Field
The present invention relates to an electrically conductive paste, and more particularly, to a nickel paste for forming an internal electrode of a multilayer Ceramic Capacitor (MLCC).
Background
In recent years, as electronic devices such as mobile phones and digital devices have become thinner and smaller, various electronic components have been rapidly miniaturized, and multilayer ceramic capacitors as chip components have been also miniaturized, increased in capacity, and improved in performance. The multilayer ceramic capacitor has a structure in which ceramic dielectric layers and internal electrode layers are alternately stacked and sintered to be integrated. In addition, as an internal electrode material of a laminated ceramic capacitor, a noble metal such as palladium has been used in the past, but at present, nickel is mainly used for cost reduction. The most effective means for achieving miniaturization, higher capacity, and higher performance is to make the nickel internal electrode layers and the ceramic dielectric layers thinner and multilayered.
Generally, a multilayer ceramic capacitor is manufactured, for example, by the following manufacturing process. First, a nickel paste is prepared in which a nickel powder as an internal electrode material is dispersed in a vehicle containing an organic resin binder and a solvent. Secondly, barium titanate (BaTiO)3) The dielectric powder is dispersed as a main component in an organic resin binder, and then dried to prepare a green sheet. After printing a nickel paste on the green sheet, the green sheet is dried and the solvent is removed to form a dried film to be an internal electrode. The green sheet having the dry film formed in this manner is integrated by heating and pressure bonding in a state where a plurality of layers are stacked. The integrated dielectric block is cut into a predetermined chip size, then, in order to remove the organic resin binder, the dielectric block is subjected to a heat treatment at a temperature of 500 ℃ or less in an oxidizing atmosphere or an inert atmosphere to remove the binder, and then, the dielectric block is heated to about 1300 ℃ in a reducing atmosphere so that the internal electrodes are not oxidized, and then, the dielectric block is fired to integrally sinter the nickel internal electrode layers and the ceramic dielectric layers. The conductive paste for external electrodes was applied to both end surfaces of the sintered chip, and firing was performed at about 800 ℃. Subsequently, the surface of the external electrode thereof was plated to obtain a laminated ceramic capacitor.
However, in the above firing step, the temperature at which the ceramic dielectric layer starts to shrink after firing is about 1200 ℃, and the shrinkage behavior of the ceramic dielectric layer and the nickel internal electrode layer is greatly different from each other as compared with the temperature at which the conductive powder such as nickel starts to shrink after firing, and there is a case where structural defects such as interlayer peeling (delamination) and cracks occur. In particular, as the size and capacity are reduced, the larger the number of layers to be stacked and the thinner the thickness of the ceramic dielectric layer, the more significant the occurrence of structural defects.
However, as a prior art for solving this problem, patent document 1 discloses the following: by containing ceramic powder as a co-material in the electrode paste, the interaction between the co-material and the dielectric layer during sintering is controlled, and structural defects are suppressed.
Patent document 2 discloses the following technique: by using the nickel powder containing sulfur up to the inside of the nickel portion in the fine nickel powder, the thermal shrinkage initiation temperature is increased, the stress generated between the dielectric layer and the internal electrode layer is reduced, and the internal electrode film formed is not broken.
Patent document 3 discloses the following technique: by using nickel microparticles in which microparticles containing a noble metal element as a main component are distributed in a dot shape on the surface of microparticles containing a nickel element as a main component, the sintering resistance of the nickel microparticles is improved, and the shrinkage of the internal electrode layer and the breakage of the internal electrode film are suppressed.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2006-269320
Patent document 2: japanese patent laid-open publication No. 2014-091862
Patent document 3: japanese laid-open patent publication No. 2015-049973
Disclosure of Invention
Problems to be solved by the invention
However, with the recent trend toward smaller electronic devices, the internal electrode layers and the dielectric layers are becoming thinner, and the problem of occurrence of structural defects such as delamination, cracks, and breakage of the internal electrode films is hardly said to be a sufficiently solved state.
In the technique described in patent document 1, the firing shrinkage behavior may be controlled by the interaction between the common material and the dielectric layer due to sintering, and it is considered that the common material present at the interface reacts with the dielectric layer to be fixed, thereby suppressing the shrinkage of the internal electrode layer. When the thickness of the internal electrode layer is sufficient, shrinkage may be suppressed by this effect, but when the internal electrode layer is thin, cracks may occur in the internal electrode layer in the vicinity of the fixed common material, which is not preferable.
The technique described in patent document 2 is a technique for increasing the sintering initiation temperature of the internal electrode layer by including sulfur in the nickel powder. The multilayer ceramic capacitor thus formed is a good multilayer ceramic capacitor, but various electronic components mounted at the same time are also being miniaturized and refined, and if sulfur contained in the nickel powder is generated as outgas (out gas), it is not preferable because it may corrode surrounding high-definition components.
The technique described in patent document 3 is a technique of using conductive particles in which fine particles mainly composed of a noble metal element are distributed in dots on the surface of fine particles mainly composed of a nickel element. In further refinement, it is not preferable to uniformly distribute expensive noble metal fine particles in a dot shape so that the nickel powder does not sinter to each other, because the cost is high both technically and in terms of materials.
The present invention has been made in view of the above-described conventional circumstances, and an object thereof is to provide a nickel paste for a laminated ceramic capacitor, which is suitable for forming a nickel internal electrode, and which does not utilize an interaction with a dielectric layer, has a configuration not containing sulfur, which is not preferable for a semiconductor component, and not containing an expensive noble metal, and can prevent the occurrence of structural defects such as interlayer delamination, cracks, and interruption of an internal electrode film at a low cost in a firing step of the laminated ceramic capacitor by increasing a sintering start temperature of a conductive paste to be close to a sintering start temperature of a ceramic green sheet.
Means for solving the problems
In order to achieve the above object, the present invention provides a nickel paste for a laminated ceramic capacitor, which is a nickel paste for forming an internal electrode of a laminated ceramic capacitor, the nickel paste mainly containing a nickel powder, a dispersant and an organic vehicle, wherein the dispersant contains a phosphoric acid polyester.
In the nickel paste for a multilayer ceramic capacitor of the present invention, the content of the phosphoric polyester is preferably 0.3 parts by mass or more and 3 parts by mass or less with respect to 100 parts by mass of the nickel powder.
Effects of the invention
According to the present invention, the firing initiation temperature of the conductive paste is increased to be close to the firing initiation temperature of the ceramic green sheet without utilizing the interaction with the dielectric layer, and the composition does not contain sulfur which is not preferable for the semiconductor member, and does not contain expensive noble metal, so that the occurrence of structural defects such as interlayer delamination, cracks, and interruption of the internal electrode film in the firing step of producing the multilayer ceramic capacitor can be prevented at low cost. Therefore, a nickel paste for a multilayer ceramic capacitor can be obtained, which can easily produce a multilayer ceramic capacitor without structural defects regardless of the binder and solvent used, without controlling the shape and particle size of the nickel powder.
Detailed Description
The nickel paste for a multilayer ceramic capacitor of the present invention will be described in detail below.
The present inventors have conducted intensive studies on the influence of various additives contained in a nickel paste on the shrinkage behavior of a nickel internal electrode layer in the firing step of a multilayer ceramic capacitor, and as a result, have found that when a phosphoric acid polyester is contained in a nickel paste, there is an effect of raising the sintering initiation temperature of the nickel paste, and that there is an effect of reducing the stress generated between a dielectric layer and an internal electrode layer as compared with a conventional nickel paste containing no phosphoric acid polyester.
That is, when the phosphoric acid polyester is contained in the nickel paste, the phosphoric acid group is strongly adsorbed on the surface of the nickel powder in the nickel paste, and the long chain structure of the polyester linked to the phosphoric acid group prevents aggregation of the nickel powder, and it is considered that aggregation of the nickel powder in the nickel paste is suppressed, and the nickel powder can be uniformly dispersed in the nickel paste. Further, since the phosphoric polyester has heat resistance, the state of preventing aggregation of the nickel powder particles can be maintained even at a higher temperature, and it is considered that the higher temperature inhibits the bonding of the nickel powder particles at the time of firing and raises the firing temperature.
Further, it was found that the effect of raising the sintering temperature of the nickel paste by the phosphoric acid polyester reduces the difference between the sintering initiation temperature of the nickel powder and the sintering initiation temperature of the dielectric layer, and the stress generated between the dielectric layer and the internal electrode layer during sintering becomes smaller than that of the conventional nickel paste containing no phosphoric acid polyester, and the occurrence of delamination and cracks between the dielectric layer and the internal electrode layer during sintering can be suppressed, thereby completing the present invention.
That is, the nickel paste for forming internal electrodes of a multilayer ceramic capacitor of the present invention contains a nickel powder, a dispersant and an organic vehicle as main components, and the dispersant contains a phosphoric acid polyester. The content of the phosphoric polyester is preferably 0.3 to 3 parts by mass with respect to 100 parts by mass of the nickel powder. Further, in the nickel paste for forming internal electrodes of a multilayer ceramic capacitor of the present invention, dielectric powder as a constituent material of a green sheet may be added as an additive in order to bring the shrinkage behavior closer to that of the green sheet. In addition, an organic solvent may be further added for viscosity adjustment. The organic solvent to be added may be any of the common organic solvents used for conductive pastes, but it is preferable to use an organic solvent used for an organic vehicle.
Hereinafter, each constituent element in the nickel paste for a multilayer ceramic capacitor of the present invention will be described in detail.
1. Nickel powder
The nickel powder used in the nickel paste for a laminated ceramic capacitor of the present invention may be a general nickel powder used in a general conductive paste, but is preferably a nickel powder having a volume-cumulative median particle diameter D50 of 0.1 μm or more and 1 μm or less as measured by a laser diffraction scattering method.
If the median particle diameter D50 of the nickel powder used in the nickel paste for a laminated ceramic capacitor of the present invention is less than 0.1 μm, the viscosity of the nickel paste may become too high because a large amount of fine nickel powder less than 0.1 μm is contained, which is not preferable.
On the other hand, if the median particle diameter D50 of the nickel powder is larger than 1 μm, short-circuiting between conductive layers may easily occur in a laminated electronic component formed into a thin film, which is not preferable.
The content of the nickel powder in the nickel paste for a laminated ceramic capacitor of the present invention is preferably 30 mass% or more and 60 mass% or less with respect to 100 mass% of the nickel paste.
If the content of the nickel powder is less than 30 mass% based on 100 mass% of the nickel paste, the content of the nickel powder is too small to form a sufficient conductive path, which is not preferable.
On the other hand, if the content of the nickel powder is more than 60 mass% based on 100 mass% of the nickel paste, it may be difficult to form a thin electrode film, which is not preferable.
2. Dispersing agent
The dispersant used in the nickel paste for a multilayer ceramic capacitor of the present invention contains a phosphoric polyester. As described above, it is considered that when the phosphate polyester is contained in the nickel paste, the phosphate group is strongly adsorbed on the surface of the nickel powder in the nickel paste, and the long chain structure of the polyester linked to the phosphate group prevents aggregation of the nickel powder, thereby uniformly dispersing the nickel powder in the nickel paste. Further, it is considered that the phosphoric polyester has heat resistance and can maintain a state of preventing aggregation of the nickel powder particles even at a higher temperature, and therefore, bonding of the nickel powder particles is inhibited even at a higher temperature than a normal sintering temperature, and the sintering temperature of the nickel powder can be increased.
The dispersant used in the nickel paste for a laminated ceramic capacitor of the present invention may further contain a dispersant other than the phosphoric acid polyester in addition to the phosphoric acid polyester. As the dispersant other than the phosphoric acid polyester, which may be contained other than the phosphoric acid polyester, for example, a dispersant used for a general conductive paste, such as an acid-based dispersant such as a higher fatty acid or a polymer surfactant, or an alkali-based dispersant such as an amine salt-based dispersant, may be contained.
The content of the polyester phosphate in the nickel paste for a multilayer ceramic capacitor of the present invention is preferably 0.3 to 3 parts by mass with respect to 100 parts by mass of the nickel powder.
When the content of the phosphoric acid polyester is less than 0.3 parts by mass, the nickel powder may not be sufficiently diffused, and the effect of raising the sintering initiation temperature at the time of firing may not be exhibited, which is not preferable.
On the other hand, if the content of the phosphoric acid polyester is more than 3 parts by mass, the effect of raising the sintering initiation temperature may be saturated, and the viscosity of the nickel paste may become too high, which is not preferable.
In the nickel paste for a laminated ceramic capacitor of the present invention, the total content of the dispersant other than the phosphate polyester is preferably 0.09 mass% or more and 5 mass% or less with respect to 100 mass% of the nickel paste.
When the total content of the dispersants other than the phosphoric acid polyester is less than 0.09 mass%, the paste constituent material containing the nickel powder may not be dispersed sufficiently uniformly, which is not preferable.
On the other hand, if the total content of the dispersants other than the phosphoric acid polyester is more than 5% by mass, the viscosity of the nickel paste may become too high, which is not preferable.
3. Organic vehicle
As the organic vehicle used in the nickel paste for a laminated ceramic capacitor of the present invention, a general organic vehicle used in a conductive paste can be used. For example, an organic vehicle containing terpineol, butyl carbitol acetate, butyl carbitol, dihydroterpineol acetate, cellulose such as ethyl cellulose, and an organic binder such as polyvinyl butyral in a solvent such as a paraffinic hydrocarbon solvent can be used.
4. Additive agent
In order to make the shrinkage behavior of the nickel paste for a laminated ceramic capacitor of the present invention close to that of a ceramic green sheet, an additive may be contained. As the additive used in the nickel paste of the present invention, a ceramic powder generally used in a conductive paste can be used, but a dielectric material used in a green sheet is more preferably used. As a dielectric material which is often used for the green sheet, for example, barium titanate or the like can be cited.
5. Evaluation of shrinkage behavior
The sintering of the laminate using the nickel paste is started at a temperature of about 900 to 1000 ℃, and further, the sintering of the nickel and ceramic green sheets proceeds and shrinks by raising the temperature to about 1300 ℃. The shrinkage caused by this sintering is a shrinkage resulting from a combination of the following two shrinkage behaviors: starting sintering at a low temperature of about 900-1000 ℃, and rapidly performing shrinkage behavior of the nickel powder after sintering is started; and a shrinkage behavior of the ceramic green sheet in which the sintering is started at a relatively high temperature of about 1200 ℃ and the sintering is gradually progressed after the start of the sintering.
Here, it is considered that the sintering start temperature of the ceramic green sheet is hardly changed without being affected by the nickel paste forming the electric conductor, and therefore, the sintering start temperature of the nickel powder is low, and the difference from the sintering start temperature of the ceramic green sheet becomes larger when sintering is started at a lower temperature. When the difference between the sintering initiation temperature of the nickel powder and the sintering initiation temperature of the ceramic green sheet is large, shrinkage reaction due to sintering occurs in a wider temperature range. The total shrinkage amount of the ceramic compact and the nickel powder is not so much affected by the composition of the constituent elements (dispersant, organic vehicle, etc.) other than the nickel powder in the nickel paste. Therefore, it can be said that the higher the sintering initiation temperature of the nickel powder is, the closer the shrinkage behavior between the ceramic green sheet and the nickel powder is, and the structural defects are less likely to occur.
Therefore, in the following examples, the degree of closeness between the shrinkage behavior of the nickel powder and the shrinkage behavior of the ceramic green sheet was evaluated by evaluating the sintering initiation temperature of each evaluation sample of the nickel paste for a laminated ceramic capacitor having the constitution of the present invention and the conventionally used nickel paste for a laminated ceramic capacitor not having the constitution of the present invention.
6. Evaluation of continuity
The electrode film formed by the nickel paste printing is sintered by the heat treatment as described above. The dielectric layer and the electrode film can be made to have a more similar shrinkage behavior during firing treatment by the nickel paste for a multilayer ceramic capacitor of the present invention, but it is not clear whether or not the nickel paste for forming the electrode film contains various materials such as an organic vehicle and a dispersant in addition to the nickel powder, and whether or not the various materials have such an effect that the electrode film is broken during firing of the nickel powder when the firing initiation temperature of the nickel powder is increased.
Therefore, in the nickel paste for a laminated ceramic capacitor of the present invention in which the sintering initiation temperature of the nickel powder has been increased, in order to confirm that there is no adverse effect of various materials and the like at the time of forming an electrode film by firing, and that the interruption of the electrode film is effectively suppressed by the increase in the sintering initiation temperature of the nickel powder, continuity of the electrode film formed by sintering the evaluation sample of each of the nickel paste for a laminated ceramic capacitor having the configuration of the present invention and the conventionally used nickel paste for a laminated ceramic capacitor not having the configuration of the present invention in the examples described later was evaluated.
In this case, the comparative evaluation of the nickel paste was not known due to the influence of the material of the dielectric layer on the sintering of the nickel powder in the nickel paste, and to exclude this, the continuity of the electrode film was comparatively evaluated in terms of the firing behavior on the alumina substrate.
Examples
Hereinafter, examples of the present invention will be described in detail, but the present invention is not limited to the results of each test sample in the examples.
Evaluation sample 1
(preparation of evaluation sample)
A nickel paste of evaluation sample 1 was prepared by kneading together a raw material prepared in such a proportion that an organic vehicle composed of 6 parts by mass of ethylcellulose and 80 parts by mass of terpineol, 0.3 parts by mass of phosphoric polyester as a dispersant, and 20 parts by mass of barium titanate as an additive were present in an amount of 86 parts by mass, relative to 100 parts by mass of nickel powder (D50 average particle diameter 0.4 μm), using a 3-roll mill.
The nickel paste of the evaluation sample 1 thus obtained was dried at 120 ℃ for 40 minutes, and the dried nickel flakes thus obtained were pulverized to obtain a dried powder sample. 0.15g of the prepared dry powder sample was put into a cylindrical mold (bottom diameter: 0.5cm), and applied at 1000kgf/cm2The pellet for evaluation of shrinkage behavior was prepared under the above-mentioned pressure.
(evaluation of contraction behavior)
The thermal shrinkage onset temperature of the particles for evaluation of shrinkage behavior prepared above was measured by TMA (thermal mechanical analyzer). Here, the sample mounting load was 10.0g, the atmosphere was a mixed gas atmosphere of 2.0% hydrogen and nitrogen, the gas flow rate was 200 ml/min, the temperature increase rate was 5 ℃/min, and the measurement temperature range was 25 ℃ to 1300 ℃. The sintering initiation temperature at the time of firing of the evaluation sample 1 was determined from the measurement data. The evaluation results are shown in table 1.
(evaluation of continuity)
The nickel paste of evaluation sample 1 was printed on an alumina substrate by screen printing so that the fired film thickness became 0.8 μm, and the electrode film fired in an inactive atmosphere after drying was subjected to image analysis to determine the ratio of the nickel-coated area after firing to the electrode film printing area, and evaluated as the nickel effective electrode area.
In the case of evaluating the continuity on the alumina substrate, the alumina substrate did not shrink unlike the dielectric layer, and therefore the nickel-coated area was smaller than that on the actual dielectric layer. Therefore, in consideration of the general shrinkage ratio (about 20%) of the dielectric layer, the reference value of the effective electrode area where no break occurs in the electrode film on the alumina substrate is set to 50%, in the present evaluation, the value is good when the nickel effective electrode area is 55% or more, the value is Δ when 50% or more and less than 55%, and the value is x when less than 50%. The evaluation results are shown in table 1.
Evaluation sample 2
The nickel paste of evaluation sample 2 was obtained in the same manner as the nickel paste of evaluation sample 1 except that the content of the phosphate polyester was 0.5 parts by mass, and evaluation of shrinkage behavior and continuity were performed in the same manner as the nickel paste of evaluation sample 1. The evaluation results are shown in table 1.
Evaluation sample 3
The nickel paste of evaluation sample 3 was obtained in the same manner as the nickel paste of evaluation sample 1 except that the content of the phosphate polyester was 3 parts by mass, and evaluation of shrinkage behavior and continuity were performed in the same manner as the nickel paste of evaluation sample 1. The evaluation results are shown in table 1.
Evaluation sample 4
The nickel paste of evaluation sample 4 was obtained in the same manner as the nickel paste of evaluation sample 1 except that the content of the phosphate polyester was 4 parts by mass, and evaluation of shrinkage behavior and continuity were performed in the same manner as the nickel paste of evaluation sample 1. The evaluation results are shown in table 1.
Evaluation sample 5
The nickel paste of evaluation sample 5 was obtained in the same manner as the nickel paste of evaluation sample 1 except that the content of the phosphate polyester was 0.2 parts by mass, and evaluation of shrinkage behavior and continuity were performed in the same manner as the nickel paste of evaluation sample 1. The evaluation results are shown in table 1.
Evaluation sample 6
The same production as that of the nickel paste of the evaluation sample 1 was carried out except that the dispersant was oleic acid, and the nickel paste of the evaluation sample 6 was obtained, and the evaluation of shrinkage behavior and the evaluation of continuity were carried out in the same manner as the nickel paste of the evaluation sample 1. The evaluation results are shown in table 1. The sample using oleic acid as a dispersant corresponds to a conventionally used nickel paste for a multilayer ceramic capacitor.
[ Table 1]
In comparison with the nickel paste for evaluation sample corresponding to the conventional evaluation sample 6, the nickel paste for evaluation samples 1 to 3 had a higher sintering initiation temperature, and therefore it was estimated that the shrinkage behavior of the nickel powder and the ceramic green sheet was close. The results of evaluation of the continuity of the nickel paste for evaluation samples using evaluation samples 1 to 3 in the dielectric ceramic green sheet were good. From these results, it is inferred that when the content of the phosphoric acid polyester is within the preferable range in the present invention, interlayer peeling between the conductive layer of the nickel powder and the dielectric layer of the ceramic green sheet is less likely to occur, cracks are less likely to occur in the conductive layer due to the stress difference, and the internal electrode film is less likely to be broken.
The nickel paste for evaluation sample 4 having a content of the phosphoric acid polyester exceeding the preferable range in the present invention has a sintering initiation temperature as high as that of evaluation samples 1 to 3, but the continuity evaluation result of the nickel paste for evaluation sample 4 was Δ, as compared with the nickel paste for evaluation sample corresponding to the conventional product of evaluation sample 6. The reason for this is considered to be that the viscosity of the nickel paste becomes too high due to an excessive content of the dispersant, and a sufficiently uniform conductor is not formed at the time of printing.
The nickel paste for evaluation sample 5 having a phosphate polyester content less than the preferable range in the present invention is not so high in sintering initiation temperature as compared with the nickel paste for evaluation sample corresponding to the conventional product of evaluation sample 6, and therefore it is estimated that the shrinkage behavior of the nickel powder and the ceramic green sheet is not so close. The continuity evaluation result of the nickel paste for evaluation sample using the evaluation sample 5 was Δ. Therefore, in the case of the evaluation sample 5, the improvement effect of the structural defects such as the interlayer peeling, the crack, and the break of the internal electrode film is exhibited as compared with the conventional product, but the effect is hardly sufficient, and the applicable product is considered to be limited to some extent.
As a result of this evaluation, it can be said that the nickel paste for a multilayer ceramic capacitor according to the present invention can suppress the occurrence of structural defects due to a difference in shrinkage between the nickel paste and the dielectric layer without using noble metal powder or the like at low cost, and can particularly reduce the occurrence of defective products of a multilayer ceramic capacitor in which the size is reduced and the internal electrode layers and the dielectric layer are thinned.
Industrial applicability
The nickel paste for a multilayer ceramic capacitor of the present invention is particularly useful in the field of chip components for electronic devices such as mobile phones and digital devices, which are miniaturized, that is, internal electrodes of multilayer ceramic capacitors are required to be formed.
Claims (2)
1. A nickel paste for a multilayer ceramic capacitor, characterized by being a nickel paste for forming internal electrodes of a multilayer ceramic capacitor, which comprises a nickel powder, a dispersant and an organic vehicle as main components, wherein the dispersant contains a polyester phosphate.
2. The nickel paste for a laminated ceramic capacitor according to claim 1, wherein the content of the phosphoric polyester is 0.3 parts by mass or more and 3 parts by mass or less with respect to 100 parts by mass of the nickel powder.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/000252 WO2020144746A1 (en) | 2019-01-08 | 2019-01-08 | Nickel paste for multilayer ceramic capacitors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113272919A true CN113272919A (en) | 2021-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201980088188.0A Pending CN113272919A (en) | 2019-01-08 | 2019-01-08 | Nickel paste for multilayer ceramic capacitor |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20210109531A (en) |
| CN (1) | CN113272919A (en) |
| WO (1) | WO2020144746A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022084400A (en) * | 2020-11-26 | 2022-06-07 | 住友金属鉱山株式会社 | Conductive paste and laminated ceramic capacitor |
| JP2024008536A (en) * | 2022-07-08 | 2024-01-19 | 住友金属鉱山株式会社 | Conductive paste, dried film, internal electrode and layered ceramic capacitor |
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- 2019-01-08 WO PCT/JP2019/000252 patent/WO2020144746A1/en active Application Filing
- 2019-01-08 KR KR1020217018390A patent/KR20210109531A/en not_active Application Discontinuation
- 2019-01-08 CN CN201980088188.0A patent/CN113272919A/en active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020144746A1 (en) | 2020-07-16 |
| KR20210109531A (en) | 2021-09-06 |
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