JPH01205410A - Manufacture of laminated ceramic capacitor - Google Patents
Manufacture of laminated ceramic capacitorInfo
- Publication number
- JPH01205410A JPH01205410A JP63029731A JP2973188A JPH01205410A JP H01205410 A JPH01205410 A JP H01205410A JP 63029731 A JP63029731 A JP 63029731A JP 2973188 A JP2973188 A JP 2973188A JP H01205410 A JPH01205410 A JP H01205410A
- Authority
- JP
- Japan
- Prior art keywords
- phosphate
- conductive paste
- binder
- flame retarder
- phosphorus base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims abstract description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 15
- 239000011574 phosphorus Substances 0.000 claims abstract description 15
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims abstract description 3
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 claims abstract 2
- YAFOVCNAQTZDQB-UHFFFAOYSA-N octyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC)OC1=CC=CC=C1 YAFOVCNAQTZDQB-UHFFFAOYSA-N 0.000 claims abstract 2
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 claims abstract 2
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000003063 flame retardant Substances 0.000 claims description 11
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 9
- 239000004254 Ammonium phosphate Substances 0.000 claims description 5
- 229910000148 ammonium phosphate Inorganic materials 0.000 claims description 5
- 235000019289 ammonium phosphates Nutrition 0.000 claims description 5
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 5
- 239000007983 Tris buffer Substances 0.000 claims description 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 3
- UJSSNDKVUQJEGE-UHFFFAOYSA-N dichloro propyl phosphate Chemical compound CCCOP(=O)(OCl)OCl UJSSNDKVUQJEGE-UHFFFAOYSA-N 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 abstract description 22
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000843 powder Substances 0.000 abstract description 14
- 238000002485 combustion reaction Methods 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 230000003197 catalytic effect Effects 0.000 abstract description 9
- 238000006243 chemical reaction Methods 0.000 abstract description 9
- 229910019142 PO4 Inorganic materials 0.000 abstract description 6
- 229910052763 palladium Inorganic materials 0.000 abstract description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract description 6
- 239000010452 phosphate Substances 0.000 abstract description 6
- 230000002159 abnormal effect Effects 0.000 abstract description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 15
- 230000032798 delamination Effects 0.000 description 12
- 238000010304 firing Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000000446 fuel Substances 0.000 description 3
- -1 triethyl bosphate Chemical compound 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007652 sheet-forming process Methods 0.000 description 2
- 101100313164 Caenorhabditis elegans sea-1 gene Proteins 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 125000002603 chloroethyl group Chemical group [H]C([*])([H])C([H])([H])Cl 0.000 description 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野１
この発明は、導電ペーストに起因する電極と誘電体との
剥離現象（デラミネーション）を防止した積層セラミッ
クコンデンサの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a method for manufacturing a multilayer ceramic capacitor that prevents delamination between an electrode and a dielectric caused by a conductive paste.
従来、積層セラミックコンデンサは、セラミックグリー
ンシート形成工程、内部電極パターン印刷工程、コンテ
ンサチンプの切断工程、バインダー燃焼工程、焼成工程
および外部電極の焼付は工程などを経て製造され、内部
電極パターン印刷工程では、セラミックグリーンシー１
−に導電ペーストを用いて電極パターンが印刷によって
形成され、グリーンチップが得られる。導電ペーストに
は、パラジウム（Ｐｄ）を単独またはパラジウム（Ｐｄ
）および白金（Ａｇ）の双方を微粒子に粉砕したメタル
パウダーに有機物からなるバインダーを混合したものが
用いられる。Conventionally, multilayer ceramic capacitors are manufactured through a ceramic green sheet forming process, an internal electrode pattern printing process, a content chimp cutting process, a binder combustion process, a firing process, and an external electrode baking process.In the internal electrode pattern printing process, ceramic green sea 1
- An electrode pattern is formed by printing using a conductive paste to obtain a green chip. The conductive paste contains palladium (Pd) alone or palladium (Pd).
) and platinum (Ag), both of which are ground into fine particles, are mixed with a binder made of an organic substance.
グリーンチップは、セラミンクグリーンシートに、内部
電極ペーストにおけるバインダーの粘着性によって付着
し、所望の電極パターンを形成したものである。しかし
、このグリーンチップ上のバインダーは、バインダー燃
焼工程ないし焼成工程の間で燃焼して除去され、電極パ
ターンは、セラミックパウダーおよびメタルパウダーの
焼結によって最終的な形を成している。The green chip is attached to a ceramic green sheet by the adhesiveness of the binder in the internal electrode paste to form a desired electrode pattern. However, the binder on this green chip is burnt and removed during the binder combustion process or firing process, and the electrode pattern takes its final shape by sintering the ceramic powder and metal powder.
〔発明が解決しようとする課題］
ところで、バインダー焼成工程では、導電ペース１に含
まれているパラジウムの触媒作用によって、急激な発熱
反応を起こし、発生する熟度は、バインターの燃焼に必
要な温度を遥かに越える高温となる。このような高温か
セラミッククリーンシーＩ・および導電ペースト間に作
用すると、燃焼によって形成された電極と、セラミック
クリーンシーＩ〜との間にデラミネーションを生しさ〜
口ることが知られている。[Problems to be Solved by the Invention] By the way, in the binder firing process, a rapid exothermic reaction occurs due to the catalytic action of palladium contained in the conductive paste 1, and the ripeness that occurs is equal to the temperature required for burning the binder. The temperature will be much higher than that. When such high temperatures act between Ceramic Clean Sheet I and the conductive paste, delamination occurs between the electrode formed by combustion and Ceramic Clean Sheet I.
known to speak.
すなわち、セラミックパウダーとメタルパウダーの焼結
において、セラミックパウダーに比較してメタルパウダ
ーは低温で焼結し、両者間には焼結上、温度差かある。That is, in sintering ceramic powder and metal powder, metal powder is sintered at a lower temperature than ceramic powder, and there is a temperature difference between the two in terms of sintering.
このような温度差は、両者の焼結収縮の差として現れ、
これがメタルパウダーの焼結収縮による内部ストレスを
ハユじさ−Ｕ、デラミネーションの原因になる。This temperature difference appears as a difference in sintering shrinkage between the two,
This causes internal stress due to sintering shrinkage of the metal powder and causes delamination.
また、焼結前にセラミックパウダーとメクルパウダーが
接触することは前提であるか、バインダー燃焼口Ｆ程の
際の象徴なバインダーの燃焼およびガス化したバインタ
ーの急激なチップ外への飛散かセラミンク、メタル間に
亀裂を起こさせ、これかセラミックとメタルの接触点を
減少さ−Ｈるため、デラミネーションの原因乙こなる。Also, is it a prerequisite that the ceramic powder and Mekuru powder come into contact before sintering, or is the symbolic combustion of the binder at the binder combustion port F and the rapid scattering of the gasified binder to the outside of the chip? This causes cracks between the metals and reduces the contact points between the ceramic and the metal, causing delamination.
そこで、この発明は、導電ペースト中のバインダーの燃
焼時の触媒作用による異常な温度へのト昇を抑制してデ
ラミネーションの発生を防止することを目的とする。Therefore, an object of the present invention is to prevent the occurrence of delamination by suppressing the abnormal temperature rise due to the catalytic action during combustion of the binder in the conductive paste.
１課題を解決するだめの手段〕
この発明の積層セラミンクコンデンザの製造方法は、内
部電極の形成るこ燐系難燃剤を添加した導電ペーストを
用いたことを特徴としている。A method for producing a laminated ceramic capacitor according to the present invention is characterized in that a conductive paste containing a phosphorous flame retardant is used to form internal electrodes.
（作 用］
導電ペーストに燐系難燃剤を添加ずれは、導電ペース１
−中に含まれるパラジウムなどのメタルパウダーの触媒
作用による急激な発熱反応に対して、燃１．ｉ’Ｌを緩
やかなものとし、象、１竣な異常温度への上昇を抑制す
ることが可能である。(Effect) The addition of phosphorus flame retardant to the conductive paste is due to conductive paste 1.
- In response to the rapid exothermic reaction caused by the catalytic action of the metal powder such as palladium contained therein, the flame 1. By making i'L gradual, it is possible to suppress a sudden rise in temperature to an abnormal temperature.
この発明の積層セラミックコンデンサの製造方法におい
て、燐系難燃剤は、リン酸アンモニウｌ１、Ｉ・リエチ
ルボスフェーＩ・、トリクレジルホスフェ−ｌ−、クレ
シルジフェニルホスフェ−１・、オクチルジフェニルホ
スフェ−１〜、Ｉ・リス（β−クロロエチル）ホスフェ
ート、Ｉ・リスシクロ【コプロビルホスフエートの何れ
かを用いれは、導電ペースト中に含まれるパラジウムな
とのメタルパウダーの触媒作用による急激な発熱反応に
対して、燃焼を緩やかにして急激な温度上昇および高温
化を阻止し、デラミネーションを抑制することができる
。In the method for manufacturing a multilayer ceramic capacitor of the present invention, the phosphorus-based flame retardants include ammonium phosphate l1, I-ethylbosphee I-, tricresyl phosphate-1-, cresyl diphenylphosphate-1-, and octyl When using diphenylphosphate-1~, I.lis(β-chloroethyl)phosphate, or I.liscyclo [coprovir phosphate], a sudden reaction occurs due to the catalytic action of the metal powder such as palladium contained in the conductive paste. For exothermic reactions, combustion can be slowed down to prevent rapid temperature rises and high temperatures, and delamination can be suppressed.
以下、この発明の積層セラミックコンデンサの製造方法
の実施例を説明する。Examples of the method for manufacturing a multilayer ceramic capacitor of the present invention will be described below.
積層セラミックコンデンサがセラミックグリーンシート
形成工程、内部電極パターン印刷工程、コンテンザチン
プの切断工程、バインダー燃焼工程、焼成工程および外
部電極の焼付は工程などを経て製造されることば従来の
製造方法と同様であるか、この発明では、内部電極パタ
ーン印刷工程においで、燐系難燃剤を添加した導電ペー
スＩ・を用いて内部電極パターンが形成されることを特
徴としている。そして、導電ペーストに添加された燐系
難燃剤には、リン酸アンモニウム、トリエチルホスフェ
−Ｉ・、トリクレジルホスフェ−Ｉ・、クレシルジフェ
ニルホスフェ＝１・、オクチルジフェニルホスフェ−１
・、ｌ・リス（β−クロロエチル）ホスフェ−１へ、ｌ
・リスシクロロプロピルボスフェ＝１・などが用いられ
る。Multilayer ceramic capacitors are manufactured through the following steps: ceramic green sheet forming process, internal electrode pattern printing process, contenza chimp cutting process, binder combustion process, firing process, and external electrode baking process. In other words, the present invention is characterized in that, in the internal electrode pattern printing step, the internal electrode pattern is formed using conductive paste I to which a phosphorous flame retardant is added. The phosphorus flame retardants added to the conductive paste include ammonium phosphate, triethyl phosphe-I, tricresyl phosphe-I, cresyl diphenyl phosphe-1, and octyldiphenyl phosphate-1.
・, to l.lis(β-chloroethyl)phosphate-1, l
・Liscyclopropylbosphe=1・ etc. are used.
第１表は、導電ペースＩ・の組成例を示す。実施例１〜
７は、比較例を基本組成とし、その内部に燐系難燃剤を
選択して１重量部を混入させたものである。Table 1 shows examples of the composition of conductive paste I. Example 1~
Sample No. 7 had the basic composition of Comparative Example, and 1 part by weight of a selected phosphorus flame retardant was mixed therein.
（この頁以下余白）
第 １ 表
内部電極パターン印刷工程では、予め形成したセラミン
ククリーンシート」二に、第１表の比較例および実施例
１〜７の導電ペースＩ・を用いて内部電極パターンを印
刷した。(Margins below this page) Table 1 In the internal electrode pattern printing process, the internal electrode pattern was printed using the preformed ceramic clean sheet. was printed.
次に、切断工程では、内部電極パターンが印刷されたセ
ラミックグリーンシートを所定の区画に切断し、クリー
ンチップを得る。Next, in the cutting step, the ceramic green sheet on which the internal electrode pattern has been printed is cut into predetermined sections to obtain clean chips.
次に、バインダー燃焼工程では、グ１ノーンチップを加
熱して電極パターンを成す導電ペースト中のバインクー
を燃焼させる。この場合、１°Ｃ／ｍｉｎの温度ステッ
プで２００〜２５０’Ｃに上昇させ、その温度を数時間
保持してバインターを燃焼させる。Next, in the binder combustion process, the binder chips are heated to burn the binder in the conductive paste forming the electrode pattern. In this case, the temperature is increased to 200-250'C in steps of 1°C/min and the temperature is maintained for several hours to burn the binder.
このようなバインターの燃焼において、導電ペースト中
に混入されている燐系難燃剤は、基本組成中のメタルパ
ウダーの触媒作用を緩やかにし、急激な発熱反応を抑制
する。In the combustion of such binder, the phosphorus-based flame retardant mixed in the conductive paste moderates the catalytic action of the metal powder in the basic composition and suppresses rapid exothermic reactions.
次に、焼成工程で焼成させ、次いで、外部電極を焼き付
けて積層セラミ・ツクコンチン′す〜が得られる。Next, it is fired in a firing step, and then the external electrodes are baked to obtain a laminated ceramic layer.
このような製造工程を経て得られた積層セラミノクコン
テンザについて、第１表の導電ペーストに対応するデラ
ミネーション発生数を第２表に示す。Table 2 shows the number of delamination occurrences corresponding to the conductive pastes in Table 1 for the laminated ceramic contenza obtained through such a manufacturing process.
（この頁以下余白）
第２表
比較例および実施例１〜７についての試作コンデンサは
、外形寸法を２＋ｎｏ＋Ｘ］、、２胴（厚さは積層数で
異なる）のものを各試料ごとに１０個ずつ作成し、デラ
ミネーションの発生を調べたものである。(Margins below this page) The prototype capacitors for Comparative Examples and Examples 1 to 7 in Table 2 have external dimensions of 2 + no + The results were created separately and the occurrence of delamination was investigated.
第２表の結果から明らかなように、基本組成のみからな
る比較例のコンデンサのデラミネーションの発生数が多
く、燐系Ｎ燃剤を含有させた導電ペーストを用いた実施
例１〜７のコンデンサでは、デラミネーションの発生が
皆無ないし極めて少な−〇 −
いことが判る。すなわち、バインターの燃焼において、
導電ペースト中に混入されている燐系難燃剤が、基本組
成中のメタルパウダーの触媒作用を緩やかにし、急激な
発熱反応を抑制し、デラミ矛−ンヨンの発生を抑制して
いることが判る。As is clear from the results in Table 2, the number of occurrences of delamination was high in the capacitors of comparative examples consisting only of the basic composition, and in the capacitors of Examples 1 to 7 using conductive pastes containing phosphorus-based N fuel. It can be seen that there is no or very little delamination. In other words, in the combustion of binder,
It can be seen that the phosphorus-based flame retardant mixed in the conductive paste moderates the catalytic action of the metal powder in the basic composition, suppresses rapid exothermic reactions, and suppresses the generation of delaminated particles.
なお、実施例では、燐系難燃剤にリン酸アンモニウム、
トリエチルボスフェート、トリクレジルホスフェート、
クレシルシフェニルポスフェ−１−、オクチルシフェニ
ルボスフェ−１・、トリス（β−クロ１コニチル）ホス
フェ−１・、トリスシクＩＪロブｌコピルホスフェート
などの１つを選択して用いたが、２以」−を選択し゛Ｃ
導電ペースト中に混入させてもよい。In addition, in the example, ammonium phosphate, phosphorus-based flame retardant,
triethyl bosphate, tricresyl phosphate,
Cresylphenyl phosphate-1-, octylciphenylbosphe-1-1, tris(β-chloro1conityl) phosphate-1, triscyc IJ locopyl phosphate, etc. were selected and used, but 2 Select "-C"
It may also be mixed into the conductive paste.
以上説明したように、この発明によれは、燐系Ｈ燃剤を
含有させた導電ペーストを用いたので、バインダー焼成
工程におけるバインターの触媒作用の象、激な発熱反応
を緩和でき、デラミネーションの発生を抑制することが
できる。As explained above, since the present invention uses a conductive paste containing a phosphorus-based H fuel, it is possible to alleviate the violent exothermic reaction caused by the catalytic action of the binder in the binder firing process, thereby reducing the occurrence of delamination. can be suppressed.
そして、燐系鮨燃剤δこリン酸アンモニウム、１リエチ
ルポスフェ−１・、１〜リクレシルホスフエーＩ・、タ
レシルジフェニルホスフェ−Ｉ・、オクヂルシフェニル
ポスフェ−１−、トリス（β−クロロエチル）ホスフェ
ート、１〜リスジクロロプロピルホスフェートなどを用
いれは、バインダーの象、激な発熱反応を効果的に抑制
することかでき、デラミネーションの発生防止とともに
、特性の優れた積層セラミックコンデンサを製造するこ
とかできる。And, the phosphorus-based sushi fuel δ ammonium phosphate, 1-ethyl phosphate-1, 1-recresyl phosphate I, thalesyl diphenyl phosphate-1, oxdyluciphenyl phosphate-1-, tris (β - By using chloroethyl) phosphate, 1-lith dichloropropyl phosphate, etc., it is possible to effectively suppress the violent exothermic reaction of the binder, prevent the occurrence of delamination, and manufacture multilayer ceramic capacitors with excellent characteristics. I can do something.
Claims (2)
ストを用いたことを特徴とする積層セラミックコンデン
サの製造方法。(1) A method for manufacturing a multilayer ceramic capacitor, characterized in that a conductive paste containing a phosphorous flame retardant is used to form internal electrodes.
チルホスフェート、トリクレジルホスフェート、クレジ
ルジフェニルホスフェート、オクチルジフェニルホスフ
ェート、トリス（β−クロロエチル）ホスフェート、ト
リスジクロロプロピルホスフェートの何れかを用いたこ
とを特徴とする請求項１記載の積層セラミックコンデン
サの製造方法。(2) The phosphorus flame retardant used is ammonium phosphate, triethyl phosphate, tricresyl phosphate, cresyl diphenyl phosphate, octyldiphenyl phosphate, tris (β-chloroethyl) phosphate, or tris dichloropropyl phosphate. The method for manufacturing a multilayer ceramic capacitor according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63029731A JP2615116B2 (en) | 1988-02-10 | 1988-02-10 | Manufacturing method of multilayer ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63029731A JP2615116B2 (en) | 1988-02-10 | 1988-02-10 | Manufacturing method of multilayer ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01205410A true JPH01205410A (en) | 1989-08-17 |
| JP2615116B2 JP2615116B2 (en) | 1997-05-28 |
Family
ID=12284249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63029731A Expired - Fee Related JP2615116B2 (en) | 1988-02-10 | 1988-02-10 | Manufacturing method of multilayer ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2615116B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120162855A1 (en) * | 2010-12-24 | 2012-06-28 | Samsung Electro-Mechanics Co., Ltd. | Conductive paste composition for internal electrode, multilayer ceramic capacitor comprising the same and method of manufacturing thereof |
| KR20160013809A (en) * | 2014-07-28 | 2016-02-05 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Conductive paste for internal electrode of multi-layer ceramic capacitor and production method thereof, and multi-layer ceramic capacitor |
| JP2019102393A (en) * | 2017-12-07 | 2019-06-24 | 住友金属鉱山株式会社 | Nickel paste for laminate ceramic capacitor |
| WO2020144746A1 (en) * | 2019-01-08 | 2020-07-16 | 住友金属鉱山株式会社 | Nickel paste for multilayer ceramic capacitors |
-
1988
- 1988-02-10 JP JP63029731A patent/JP2615116B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120162855A1 (en) * | 2010-12-24 | 2012-06-28 | Samsung Electro-Mechanics Co., Ltd. | Conductive paste composition for internal electrode, multilayer ceramic capacitor comprising the same and method of manufacturing thereof |
| KR20160013809A (en) * | 2014-07-28 | 2016-02-05 | 스미토모 긴조쿠 고잔 가부시키가이샤 | Conductive paste for internal electrode of multi-layer ceramic capacitor and production method thereof, and multi-layer ceramic capacitor |
| CN105321713A (en) * | 2014-07-28 | 2016-02-10 | 住友金属矿山株式会社 | Conductive paste for internal electrode of multi-layer ceramic capacitor and production method thereof and multi-layer ceramic capacitor |
| JP2016031994A (en) * | 2014-07-28 | 2016-03-07 | 住友金属鉱山株式会社 | Conductive paste for multilayer ceramic capacitor internal electrode and production method therefor, and multilayer ceramic capacitor |
| CN105321713B (en) * | 2014-07-28 | 2018-11-27 | 住友金属矿山株式会社 | Multi-layer ceramic capacitor internal electrode conductive paste and its manufacturing method and multi-layer ceramic capacitor |
| TWI663614B (en) * | 2014-07-28 | 2019-06-21 | 日商住友金屬礦山股份有限公司 | Conductive paste for internal electrode of multi-layer capacitor and production method thereof, and multi-layer ceramic capacitor |
| JP2019102393A (en) * | 2017-12-07 | 2019-06-24 | 住友金属鉱山株式会社 | Nickel paste for laminate ceramic capacitor |
| WO2020144746A1 (en) * | 2019-01-08 | 2020-07-16 | 住友金属鉱山株式会社 | Nickel paste for multilayer ceramic capacitors |
| CN113272919A (en) * | 2019-01-08 | 2021-08-17 | 住友金属矿山株式会社 | Nickel paste for multilayer ceramic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2615116B2 (en) | 1997-05-28 |
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