CN113270530A - Heat exchange channel type LED packaging structure - Google Patents
Heat exchange channel type LED packaging structure Download PDFInfo
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- CN113270530A CN113270530A CN202110362972.5A CN202110362972A CN113270530A CN 113270530 A CN113270530 A CN 113270530A CN 202110362972 A CN202110362972 A CN 202110362972A CN 113270530 A CN113270530 A CN 113270530A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims abstract description 110
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000000741 silica gel Substances 0.000 claims abstract description 76
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 76
- 238000010521 absorption reaction Methods 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 68
- 239000008367 deionised water Substances 0.000 claims description 32
- 229910021641 deionized water Inorganic materials 0.000 claims description 32
- 238000009413 insulation Methods 0.000 claims description 16
- 239000012528 membrane Substances 0.000 claims description 15
- 230000005389 magnetism Effects 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 239000011261 inert gas Substances 0.000 claims description 7
- 239000006249 magnetic particle Substances 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000012774 insulation material Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 33
- 230000009471 action Effects 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 description 12
- 230000032683 aging Effects 0.000 description 6
- 238000007885 magnetic separation Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000003679 aging effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a heat exchange channel type LED packaging structure, belonging to the technical field of LED packaging, the invention can isolate and package an LED chip through an inner silica gel layer, improve the structural stability of the whole body based on a heat control channel ball, simultaneously seal a heat dissipation channel, prevent external air from directly entering the interior, improve the heat dissipation effect of a heat dissipation substrate, protect the LED chip and the inner silica gel layer, absorb the heat on the inner silica gel layer in real time to realize cooling, trigger reverse deformation action by self after absorbing sufficient heat, convert the heat absorption of the inner silica gel layer into the heat dissipation to the outside, recover the initial shape after the heat dissipation, realize the high-efficiency heat absorption property of the heat control channel ball, further protect the inner silica gel layer at high temperature, and lead the air circulation in the heat dissipation channel while deforming the heat control channel ball, the radiating effect of the radiating substrate is improved in an auxiliary mode, and therefore the overall radiating efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a heat exchange channel type LED packaging structure.
Background
The Light-emitting diode (LED) has the characteristics of long service life, high luminous efficiency, good color rendering, safety, reliability, rich color and easy maintenance. Under the background of today's increasingly serious environmental pollution, climate warming and energy shortage, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21 st century. This is a major leap in the history of human lighting since gas lighting, incandescent lamps and fluorescent lamps, and has rapidly improved the lighting quality of human life.
The LED uses electrons and holes in a semiconductor material to combine with each other and release energy, so that the energy band level changes to emit light to display the released energy. The LED has the advantages of small volume, long service life, low driving voltage, low power consumption, high reaction rate, good shock resistance and the like, and is widely applied to the fields of signal indication, digital display and the like. With the continuous progress of the technology, the development of the ultra-bright LED is successful, especially the development of the white light LED is successful, so that the ultra-bright LED is increasingly used in the fields of colored lamp decoration and even illumination.
The high-power LED is used for occasions such as illumination and the like, the cost control is very important, the structural size of an external heat sink of the high-power LED lamp is not allowed to be too large, active heat dissipation in modes such as an electric fan and the like cannot be allowed, the safe junction temperature of the LED chip in work is within 110 ℃, if the junction temperature is too high, a series of problems such as light intensity reduction, spectrum deviation, color temperature rise, thermal stress increase, chip accelerated aging and the like can be caused, the service life of the LED is greatly shortened, and meanwhile, the accelerated aging of the packaging adhesive colloid filled on the chip can be caused, and the light transmission efficiency of the LED is influenced.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a heat exchange channel type LED packaging structure, which can isolate and package an LED chip through an inner silica gel layer, improve the structural stability of the whole body based on a heat control channel ball, and simultaneously seal a heat dissipation channel on a heat dissipation substrate to prevent outside air from directly entering the inside, thereby improving the heat dissipation effect of the heat dissipation substrate, simultaneously protecting the LED chip and the inner silica gel layer, the heat control channel ball can absorb the heat on the inner silica gel layer in real time to realize cooling, and after absorbing enough heat, the heat control channel ball triggers reverse deformation action to convert the heat absorption of the inner silica gel layer into the heat dissipation towards the outside, and recovers the initial shape after the heat dissipation, thereby realizing the high-efficiency heat absorption of the heat control channel ball which is always kept, further performing high-temperature protection on the inner silica gel layer, and in addition, the air circulation in the heat dissipation channel can be caused when the heat control channel ball deforms, the radiating effect of the radiating substrate is improved in an auxiliary mode, so that the overall radiating efficiency is greatly improved, and meanwhile, the LED chip and the inner silica gel layer are effectively protected.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
The utility model provides a heat transfer passageway formula LED packaging structure, includes the heat dissipation base plate, heat dissipation base plate skin weld has a plurality of evenly distributed's LED chip, set up a plurality of heat dissipation passageways that distribute with LED chip is crisscross on the heat dissipation base plate, heat dissipation base plate surface border region bonds and has thermal-insulated film, thermal-insulated film far away disperses hot base plate one end bond have with LED chip assorted interior silica gel layer, interior silica gel layer is kept away from heat dissipation base plate one end and is connected with outer silica gel layer, inlay between interior silica gel layer and the outer silica gel layer and be connected with a plurality of evenly distributed's hemisphere silica gel lens, and hemisphere silica gel lens and LED chip are corresponding, the inboard opening part of heat dissipation passageway is inlayed and is connected with assorted accuse hot passageway ball, and accuse hot passageway ball is close to interior silica gel layer one.
Further, it is adjacent to leave between interior silica gel layer and the heat dissipation base plate and be equipped with thermal-insulated clearance, thermal-insulated clearance intussuseption is filled with inert gas, avoids interior silica gel layer and heat dissipation base plate direct contact to lead to temperature rise, have the risk that causes the ageing inefficacy of interior silica gel layer, inert gas's packing can avoid oxygen to the ageing effect on interior silica gel layer.
Furthermore, the heat control channel ball is filled with deionized water, the deionized water is suspended with the water pressing ball, the deionized water can cool the heat absorbed by the heat control channel ball, and the deionized water can change after the water pressing ball moves, so that most of the deionized water is changed from heat absorption to heat dissipation after the deionized water is changed, and the efficient heat dissipation effect of the heat control channel ball is maintained.
Further, accuse hot passageway ball is including outer heat dissipation hemisphere, interior heat absorption hemisphere and thermal-insulated ring, outer heat dissipation hemisphere and interior heat absorption hemisphere symmetric distribution, and interior heat absorption hemisphere is located interior silica gel layer inboard, thermal-insulated ring connection is between outer heat dissipation hemisphere and interior heat absorption hemisphere, and accuse hot passageway ball mainly is connected with the radiating basal plate through thermal-insulated ring, both can realize fixed effect, can avoid the heat conduction on the radiating basal plate to interior silica gel layer simultaneously, and wherein outer heat dissipation hemisphere mainly plays the radiating effect to the external world, and interior heat absorption hemisphere plays the heat absorption effect to interior silica gel layer.
Furthermore, the outer heat-dissipation hemisphere and the inner heat-absorption hemisphere are both made of heat-conducting materials, and the heat-insulation ring is made of heat-insulation materials.
Furthermore, a plurality of fluid holes which are uniformly distributed are formed in the outer radiating hemisphere and the inner absorbing hemisphere, an outer expansion film is connected in the fluid holes in the outer radiating hemisphere, a shape control net and an inner expansion film are connected in the fluid holes in the inner absorbing hemisphere, the shape control net is positioned on the inner side of the inner expansion film, the inner end of the inner expansion film is connected with a magnet block, and the inner expansion film is in an outward expansion state in a normal state, so that the heat control channel ball can contain more deionized water, the contact area between the heat control channel ball and the inner silica gel layer is increased to improve the heat absorption effect, when the pressurized water ball moves into the inner absorbing hemisphere, the inner expansion film is forced to contract under the action of magnetic attraction force, and therefore, redundant deionized water can extrude the outer expansion film to expand, the heat dissipation effect of the outer radiating hemisphere is improved, and air in a heat dissipation channel is effectively caused to flow, the heat dissipation effect of the heat dissipation substrate is improved in an auxiliary mode.
Furthermore, be connected with many accuses between pressure water ball and the interior heat absorption hemisphere and act as go-between to, and the accuse is to acting as go-between and adopt inelastic flexible material to make, and the accuse is to acting as go-between and can be controlled the direction that sinks of pressure water ball, avoids it to rotate the direction under the magnetic attraction effect to guarantee that the pressure water ball is smoothly deformed after sinking, thereby refuel the interior deionized water that absorbs heat in the hemisphere of entering into outside heat dissipation hemisphere basically and carry out the heat and give off.
Further, press the water ball to include outer waterproof ball membrane, magnetism pressure hemisphere and setting hemisphere, the symmetric distribution between magnetism pressure hemisphere and the setting hemisphere, and magnetism pressure hemisphere and setting hemisphere all lie in outer waterproof ball membrane inboard, be connected with a plurality of evenly distributed's magnetism isolating plate on the outer waterproof ball membrane surface that the setting hemisphere corresponds, and in close contact with between the magnetism isolating plate, the continuous heat in the deionized water that absorbs of pressurized-water ball, then the regional outer waterproof ball membrane inflation that corresponds of setting hemisphere, and force the magnetism isolating plate dispersion no longer to form complete magnetic screen face, magnetism pressure hemisphere can carry out the magnetism cooperation with the magnet piece, thereby realize that the whole of pressing the water ball sinks, and trigger the deformation action after contacting interior heat absorption hemisphere, with the deionized water extrusion in the interior heat absorption hemisphere enter into in the outer heat dissipation hemisphere.
Furthermore, the magnetic pressure hemisphere adopts light elastic material to make solid construction, inlay in the magnetic pressure hemisphere and be connected with a plurality of evenly distributed's magnetic particle, the magnetic attraction between magnetic pressure hemisphere and the magnet piece forces it to continue to descend, until deformation enters into extrusion thermal expansion gas in the setting hemisphere to force its outer waterproof spherical membrane deformation that corresponds to adapt.
Furthermore, the shaping hemisphere is made of a hard breathable material and is of a hollow structure, thermal expansion gas is filled in the shaping hemisphere, and the thermal expansion gas expands and extrudes the outer waterproof sphere membrane after being heated, so that the magnetic shielding sheet is forced to be dispersed, and the magnetic shielding sheet is recovered after the temperature is reduced.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the scheme can isolate and package the LED chip through the inner silica gel layer, improve the whole structural stability based on the heat control channel ball, seal the heat dissipation channel on the heat dissipation substrate, prevent external air from directly entering the interior, improve the heat dissipation effect of the heat dissipation substrate, protect the LED chip and the inner silica gel layer simultaneously, absorb heat on the inner silica gel layer in real time to realize cooling, trigger reverse deformation action by self after absorbing sufficient heat, convert the heat absorption of the inner silica gel layer into heat dissipation towards the outside, recover the initial shape after heat dissipation, realize the high-efficiency heat absorption property of the heat control channel ball which is always kept, further carry out high-temperature protection on the inner silica gel layer, lead the air circulation in the heat dissipation channel while deforming the heat control channel ball, and assist in improving the heat dissipation effect of the heat dissipation substrate, thereby whole radiating efficiency promotes by a wide margin, effectively protects LED chip and interior silica gel layer simultaneously.
(2) The adjacent inner silica gel layer and the heat dissipation substrate are provided with heat insulation gaps, the heat insulation gaps are filled with inert gas, the inner silica gel layer is prevented from being in direct contact with the heat dissipation substrate, so that the temperature is increased, the risk of aging failure of the inner silica gel layer is caused, and the inert gas is filled to avoid the aging effect of oxygen on the inner silica gel layer.
(3) The ball intussuseption of accuse hot passageway is filled with deionized water, and the suspension has the pressure water ball in the deionized water, and the deionized water can cool down the absorptive heat of accuse hot passageway ball to after the pressure water ball removes, the deionized water also can change, thereby most remove from the normal water and change into the heat dissipation by the heat absorption behind the transition position, thereby keep the high-efficient radiating effect of accuse hot passageway ball.
(4) Thermal-control passageway ball includes outer heat dissipation hemisphere, interior heat absorption hemisphere and thermal-insulated ring, outer heat dissipation hemisphere and interior heat absorption hemisphere symmetric distribution, and interior heat absorption hemisphere is located interior silica gel layer inboard, thermal-insulated ring connects between outer heat dissipation hemisphere and interior heat absorption hemisphere, thermal-control passageway ball mainly is connected with the heat dissipation base plate through thermal-insulated ring, both can realize fixed effect, can avoid heat conduction on the heat dissipation base plate to interior silica gel layer simultaneously, wherein outer heat dissipation hemisphere mainly plays the radiating effect to the external world, interior heat absorption hemisphere plays the heat absorption effect on interior silica gel layer.
(5) A plurality of evenly distributed fluid holes are arranged on the outer radiating hemisphere and the inner absorbing hemisphere, an outer expansion film is connected in the fluid holes on the outer radiating hemisphere, a shape control net and an inner expansion film are connected in the fluid holes on the inner absorbing hemisphere, the shape control net is positioned at the inner side of the inner expansion film, the inner end of the inner expansion film is connected with a magnet block, the inner expansion film is in an outward expansion state under the normal state, therefore, the heat-control channel ball can contain more deionized water, and the contact area with the inner silica gel layer is increased to improve the heat absorption effect, when the pressurized water ball moves into the inner heat absorption hemisphere, the inner expansion membrane is forced to contract under the action of magnetic attraction, so that the redundant deionized water extrudes the outer expansion membrane to expand, therefore, the heat dissipation effect of the outer heat dissipation hemisphere is improved, air flow in the heat dissipation channel is effectively caused, and the heat dissipation effect of the heat dissipation substrate is improved in an auxiliary mode.
(6) Be connected with many accuses between pressurized-water ball and the interior heat absorption hemisphere and act as go-between to acting as go-between, and the accuse is to acting as go-between and adopt inelastic flexible material to make, and the accuse is to acting as go-between can controlling the direction that sinks of pressurized-water ball, avoids it to rotate the direction under the magnetic attraction effect to guarantee that pressurized-water ball is under the smooth deformation of back of sinking, thereby refuel the interior deionized water of heat absorption hemisphere and enter into outer heat dissipation hemisphere basically and carry out the heat and give off.
(7) The water pressing ball comprises an outer waterproof ball film, a magnetic pressing hemisphere and a shaping hemisphere, the magnetic pressing hemisphere and the shaping hemisphere are symmetrically distributed, the magnetic pressing hemisphere and the shaping hemisphere are located on the inner side of the outer waterproof ball film, a plurality of uniformly distributed magnetic separation sheets are connected to the outer surface of the outer waterproof ball film corresponding to the shaping hemisphere, the magnetic separation sheets are in close contact with each other, the water pressing ball continuously absorbs heat in deionized water, then the outer waterproof ball film corresponding to the shaping hemisphere region expands, the magnetic separation sheets are forced to disperse to form a complete magnetic shielding surface, the magnetic pressing hemisphere can be in magnetic cooperation with a magnet block, so that the water pressing ball sinks integrally, deformation action is triggered after the water pressing ball contacts the inner heat absorption hemisphere, and deionized water in the inner heat absorption hemisphere is extruded into the outer heat dissipation hemisphere.
(8) The magnetic pressure hemisphere is made of light elastic materials and is of a solid structure, a plurality of uniformly distributed magnetic particles are embedded and connected into the magnetic pressure hemisphere, the magnetic pressure hemisphere and the magnet block are forced to continuously descend under the action of magnetic attraction until the deformation enters the shaping hemisphere to extrude thermal expansion gas, and therefore the corresponding outer waterproof spherical membrane is forced to deform to adapt.
(9) The shaping hemisphere is made into a hollow structure by adopting a hard breathable material, thermal expansion gas is filled in the shaping hemisphere, and the thermal expansion gas expands and extrudes the outer waterproof sphere membrane after being heated, so that the magnetic separation sheet is forced to be dispersed and then recovered after the temperature is reduced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure at A in FIG. 1;
FIG. 3 is a schematic structural view of a heat control channel ball according to the present invention in a heat absorption state;
FIG. 4 is a schematic view of the structure of the water pressing ball of the present invention;
FIG. 5 is a schematic structural view of the heat control channel ball in a heat dissipation state according to the present invention.
The reference numbers in the figures illustrate:
the LED chip comprises a heat dissipation substrate 1, an LED chip 2, an inner silica gel layer 3, a hemispherical silica gel lens 4, an outer silica gel layer 5, a heat control channel ball 6, an outer heat dissipation hemisphere 61, an inner heat absorption hemisphere 62, a heat insulation ring 63, a shape control net 64, an inner expansion film 65, a magnet block 66, an outer expansion film 67, a heat insulation film 7, a water pressing ball 8, an outer waterproof ball film 81, a magnetic pressing hemisphere 82, magnetic particles 83, a shaping hemisphere 84, thermal expansion gas 85, a magnetic shielding sheet 86 and a direction control pull wire 9.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
please refer to fig. 1, a heat exchange channel type LED package structure, which includes a heat dissipation substrate 1, a plurality of LED chips 2 distributed uniformly are welded on the surface of the heat dissipation substrate 1, a plurality of heat dissipation channels distributed in a staggered manner with the LED chips 2 are disposed on the heat dissipation substrate 1, a heat insulation film 7 is bonded on the edge area of the surface of the heat dissipation substrate 1, an inner silica gel layer 3 matched with the LED chips 2 is bonded on one end of the heat insulation film 7 away from the heat dissipation substrate 1, one end of the inner silica gel layer 3 away from the heat dissipation substrate 1 is connected with an outer silica gel layer 5, a plurality of hemispherical silica gel lenses 4 distributed uniformly are embedded between the inner silica gel layer 3 and the outer silica gel layer 5, the hemispherical silica gel lenses 4 correspond to the LED chips 2, a heat control channel ball 6 matched with the opening on the inner side of the heat dissipation channel is embedded in the opening, and one end of the heat control channel ball 6 close to the inner silica gel layer 3 extends to the inner side.
Referring to fig. 2, a heat insulation gap is reserved between the adjacent inner silica gel layer 3 and the heat dissipation substrate 1, and the heat insulation gap is filled with inert gas, so that the inner silica gel layer 3 is prevented from being in direct contact with the heat dissipation substrate 1, thereby preventing the inner silica gel layer 3 from aging and failing due to temperature rise, and the inert gas is filled to prevent oxygen from aging the inner silica gel layer 3.
Referring to fig. 3, the heat control channel ball 6 is filled with deionized water, the water pressing ball 8 is suspended in the deionized water, the deionized water can cool the heat absorbed by the heat control channel ball 6, and the deionized water changes after the water pressing ball 8 moves, so that most of the deionized water is changed from heat absorption to heat dissipation after changing the position, and the efficient heat dissipation effect of the heat control channel ball 6 is maintained.
Thermal control passageway ball 6 includes outer heat dissipation hemisphere 61, interior heat absorption hemisphere 62 and thermal-insulated ring 63, outer heat dissipation hemisphere 61 and interior heat absorption hemisphere 62 symmetric distribution, and interior heat absorption hemisphere 62 is located interior silica gel layer 3 inboard, heat insulation ring 63 is connected between outer heat dissipation hemisphere 61 and interior heat absorption hemisphere 62, thermal control passageway ball 6 mainly is connected with heat dissipation base plate 1 through thermal-insulated ring 63, both can realize fixed effect, can avoid heat conduction on the heat dissipation base plate 1 to interior silica gel layer 3 simultaneously, wherein outer heat dissipation hemisphere 61 mainly plays the radiating effect to the external world, interior heat absorption hemisphere 62 plays the endothermic effect to interior silica gel layer 3.
The outer heat-dissipation hemisphere 61 and the inner heat-absorption hemisphere 62 are both made of heat conduction materials, and the heat-insulation ring 63 is made of heat insulation materials.
A plurality of fluid holes which are uniformly distributed are formed in the outer radiating hemisphere 61 and the inner radiating hemisphere 62, an outer expansion film 67 is connected in the fluid hole in the outer radiating hemisphere 61, a shape control net 64 and an inner expansion film 65 are connected in the fluid hole in the inner radiating hemisphere 62, the shape control net 64 is positioned on the inner side of the inner expansion film 65, the inner end of the inner expansion film 65 is connected with a magnet block 66, and the inner expansion film 65 is in an outward expansion state in a normal state, so that the heat control channel ball 6 can contain more deionized water, the contact area with the inner silica gel layer 3 is increased to improve the heat absorption effect, when the pressurized water ball 8 moves into the inner radiating hemisphere 62, the inner expansion film 65 is forced to contract by the action of magnetic attraction, and redundant deionized water extrudes the outer expansion film 67 to expand, thereby improving the heat dissipation effect of the outer radiating hemisphere 61 and effectively causing the air in the heat dissipation channel to flow, the heat dissipation effect of the heat dissipation substrate 1 is improved in an auxiliary manner.
Be connected with many accuses between pressure water ball 8 and the interior heat absorption hemisphere 62 and act as go-between 9, and the accuse is to acting as go-between 9 adoption inelastic flexible material and make, and the accuse is to acting as go-between 9 and can be controlled the direction of sinking of pressure water ball 8, avoids it to rotate the direction under the magnetic attraction effect to guarantee that pressure water ball 8 is under the smooth deformation of back that sinks, thereby refuels in the deionized water of heat absorption hemisphere 62 enters into outer heat dissipation hemisphere 61 basically and carries out the heat and give off.
Referring to fig. 4-5, the water pressing ball 8 includes an outer waterproof ball film 81, a magnetic pressing hemisphere 82 and a shaped hemisphere 84, the magnetic pressing hemisphere 82 and the shaped hemisphere 84 are symmetrically distributed, and the magnetic pressure hemisphere 82 and the shaped hemisphere 84 are both positioned at the inner side of the outer waterproof sphere film 81, the outer surface of the outer waterproof sphere film 81 corresponding to the shaped hemisphere 84 is connected with a plurality of uniformly distributed magnetism isolating sheets 86, and the magnetism isolating sheets 86 are closely contacted with each other, the water pressing ball 8 continuously absorbs the heat in the deionized water, the outer water-resistant spherical membrane 81 corresponding to the shaped hemisphere 84 area then expands and forces the magnetic shield 86 to disperse and no longer form a complete magnetic shield surface, the magnetic pressure hemisphere 82 can magnetically cooperate with the magnet block 66, therefore, the whole sinking of the water pressing ball 8 is realized, the deformation action is triggered after the water pressing ball contacts the inner heat absorption hemisphere 62, and the deionized water in the inner heat absorption hemisphere 62 is extruded into the outer heat dissipation hemisphere 61.
The magnetic pressure hemisphere 82 is made of light elastic materials and is of a solid structure, a plurality of uniformly distributed magnetic particles 83 are embedded and connected in the magnetic pressure hemisphere 82, the magnetic pressure hemisphere 82 and the magnet block 66 are forced to continuously descend under the action of magnetic attraction until the deformation enters the shaping hemisphere 84 to extrude thermal expansion gas 85, and therefore the corresponding outer waterproof spherical membrane 81 is forced to deform to adapt.
The shaped hemisphere 84 is made of a hard breathable material and is of a hollow structure, thermal expansion gas 85 which can be hydrogen or carbon dioxide is filled in the shaped hemisphere 84, and the thermal expansion gas 85 expands and extrudes the outer waterproof sphere film 81 after being heated, so that the magnetism isolating sheet 86 is forced to be dispersed and then restored after the temperature is reduced.
The invention can isolate and package the LED chip 2 through the inner silica gel layer 3, improve the whole structural stability based on the heat control channel ball 6, seal the heat dissipation channel on the heat dissipation substrate 1, avoid the outside air from directly entering the inside, improve the heat dissipation effect of the heat dissipation substrate 1, protect the LED chip 2 and the inner silica gel layer 3, and the heat control channel ball 6 can absorb the heat on the inner silica gel layer 3 in real time to realize temperature reduction, and after absorbing enough heat, trigger reverse deformation action by itself, convert the heat absorption of the inner silica gel layer 3 into the heat dissipation of the outside, and recover the initial shape after the heat dissipation, thus realizing the high-efficiency heat absorption of the heat control channel ball 6, further performing high-temperature protection on the inner silica gel layer 3, and in addition, the heat control channel ball 6 can cause the air circulation in the heat dissipation channel while deforming, the radiating effect of the radiating substrate 1 is improved in an auxiliary mode, so that the overall radiating efficiency is greatly improved, and meanwhile, the LED chip 2 and the inner silica gel layer 3 are effectively protected.
The above are merely preferred embodiments of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (10)
1. The utility model provides a heat transfer passageway formula LED packaging structure, includes heat dissipation base plate (1), its characterized in that: the surface of the heat dissipation substrate (1) is welded with a plurality of uniformly distributed LED chips (2), a plurality of heat dissipation channels which are distributed with the LED chips (2) in a staggered way are arranged on the heat dissipation substrate (1), the edge area of the surface of the heat dissipation substrate (1) is bonded with a heat insulation film (7), one end of the heat insulation film (7) far away from the heat dissipation substrate (1) is bonded with an inner silica gel layer (3) matched with the LED chip (2), one end of the inner silica gel layer (3) far away from the heat dissipation substrate (1) is connected with an outer silica gel layer (5), a plurality of uniformly distributed hemispherical silica gel lenses (4) are embedded and connected between the inner silica gel layer (3) and the outer silica gel layer (5), the hemispherical silica gel lens (4) corresponds to the LED chip (2), a heat control channel ball (6) matched with the opening at the inner side of the heat dissipation channel is embedded and connected with the opening at the inner side of the heat dissipation channel, and one end of the heat control channel ball (6) close to the inner silica gel layer (3) extends to the inner side thereof.
2. The heat exchange channel type LED packaging structure of claim 1, wherein: and a heat insulation gap is reserved between the adjacent inner silica gel layer (3) and the heat dissipation substrate (1), and the heat insulation gap is filled with inert gas.
3. The heat exchange channel type LED packaging structure of claim 1, wherein: deionized water is filled in the heat control channel ball (6), and a water pressing ball (8) is suspended in the deionized water.
4. The heat exchange channel type LED packaging structure according to claim 3, wherein: thermal control passageway ball (6) are including outer heat dissipation hemisphere (61), interior heat absorption hemisphere (62) and thermal-insulated ring (63), outer heat dissipation hemisphere (61) and interior heat absorption hemisphere (62) symmetric distribution, and interior heat absorption hemisphere (62) are located interior silica gel layer (3) inboard, it connects between outer heat dissipation hemisphere (61) and interior heat absorption hemisphere (62) to separate heat ring (63).
5. The heat exchange channel type LED packaging structure according to claim 4, wherein: the outer heat dissipation hemisphere (61) and the inner heat absorption hemisphere (62) are both made of heat conduction materials, and the heat insulation ring (63) is made of heat insulation materials.
6. The heat exchange channel type LED packaging structure according to claim 4, wherein: a plurality of evenly distributed fluid holes are formed in the outer radiating hemisphere (61) and the inner heat absorption hemisphere (62), an outer expansion film (67) is connected to the fluid holes in the outer radiating hemisphere (61), a shape control net (64) and an inner expansion film (65) are connected to the fluid holes in the inner heat absorption hemisphere (62), the shape control net (64) is located on the inner side of the inner expansion film (65), and a magnet block (66) is connected to the inner end of the inner expansion film (65).
7. The heat exchange channel type LED packaging structure of claim 6, wherein: a plurality of direction control pull wires (9) are connected between the water pressing ball (8) and the internal heat absorption hemisphere (62), and the direction control pull wires (9) are made of non-elastic flexible materials.
8. The heat exchange channel type LED packaging structure according to claim 3, wherein: press water ball (8) including outer waterproof ball membrane (81), magnetic pressure hemisphere (82) and design hemisphere (84), the symmetric distribution between magnetic pressure hemisphere (82) and design hemisphere (84), and magnetic pressure hemisphere (82) and design hemisphere (84) all are located outer waterproof ball membrane (81) inboard, be connected with a plurality of evenly distributed's magnetism sheet (86) that separate on outer waterproof ball membrane (81) surface that design hemisphere (84) correspond, and in close contact with between magnetism sheet (86).
9. The heat exchange channel type LED packaging structure of claim 8, wherein: the magnetic pressure hemisphere (82) is made of a light elastic material and is of a solid structure, and a plurality of uniformly distributed magnetic particles (83) are embedded and connected in the magnetic pressure hemisphere (82).
10. The heat exchange channel type LED packaging structure of claim 8, wherein: the shaped hemisphere (84) is made of hard breathable materials and is of a hollow structure, and thermal expansion gas (85) is filled in the shaped hemisphere (84).
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| CN202110362972.5A CN113270530A (en) | 2021-04-02 | 2021-04-02 | Heat exchange channel type LED packaging structure |
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| CN202110362972.5A CN113270530A (en) | 2021-04-02 | 2021-04-02 | Heat exchange channel type LED packaging structure |
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| CN113270530A true CN113270530A (en) | 2021-08-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113690775A (en) * | 2021-10-27 | 2021-11-23 | 江苏大师兄电气设备有限公司 | Independently ventilate heat exchange type switch board |
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| CN107833948A (en) * | 2017-11-28 | 2018-03-23 | 西安科锐盛创新科技有限公司 | LED encapsulation structure and its method |
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| CN208315591U (en) * | 2017-11-28 | 2019-01-01 | 西安科锐盛创新科技有限公司 | A kind of encapsulating structure of LED |
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| CN105405953A (en) * | 2015-12-31 | 2016-03-16 | 浙江唯唯光电科技有限公司 | Low-thermal resistance, high-luminous efficacy and high-power LED lamp bead |
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| CN113690775A (en) * | 2021-10-27 | 2021-11-23 | 江苏大师兄电气设备有限公司 | Independently ventilate heat exchange type switch board |
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Application publication date: 20210817 |