CN113252685A - Chip detector - Google Patents
Chip detector Download PDFInfo
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- CN113252685A CN113252685A CN202110485846.9A CN202110485846A CN113252685A CN 113252685 A CN113252685 A CN 113252685A CN 202110485846 A CN202110485846 A CN 202110485846A CN 113252685 A CN113252685 A CN 113252685A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8838—Stroboscopic illumination; synchronised illumination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8874—Taking dimensions of defect into account
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
Abstract
The invention belongs to the technical field of chip detection, and discloses a chip detector which is used for detecting the defects of a to-be-detected surface of a chip and comprises a camera, a first light source assembly and an optical projection assembly, wherein the camera is arranged opposite to a detection area of a detection device so as to collect images of the to-be-detected surface of the chip, the first light source assembly comprises four first strip light sources, the four first strip light sources are oppositely arranged in pairs around the optical axis of the camera and can emit light beams towards the to-be-detected surface of the chip, the camera acquires two-dimensional images of the to-be-detected surface of the chip, the optical projection assembly comprises more than two projection pieces, the more than two projection pieces are uniformly arranged around the optical axis of the camera and can project structured light towards the to-be-detected surface of the chip so as to acquire three-dimensional data of the to-be-detected surface of the chip, and the invention obtains the height of the solder balls of the semiconductor chip by analysis, the method can detect the defects of the surface to be detected of the chip and can measure the height of the solder ball of the semiconductor chip.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a chip detector.
Background
Various defects may be generated during the manufacturing process of the semiconductor chip. Common defects comprise surface defects of drops, dirt, scratches, dust and the like, so that the defects of the chip need to be detected, and in the prior art, a machine vision detection technology is generally adopted to detect the surface defects, namely, a detection camera is used to detect the defects of spots, pits, scratches, color differences, defects and the like on the surface of a workpiece.
The chip detector in the prior art generally comprises a collimation light source for emitting parallel light beams to the surface of a glass plate and a camera for acquiring an image of the surface of the chip, and various parameters of the image are obtained by analyzing the image captured by an area-array camera in real time so as to judge whether the chip is qualified or not. However, the current chip inspection machine can only process two-dimensional information, that is, can only detect defects without height information, and cannot accurately detect defects with height information, such as foreign matters, dirt, scratches and the like, which easily causes erroneous judgment. In addition, in the BGA (ball grid array) packaging process, solder balls are required to be welded on the surface of the chip, and the prior art cannot measure the height of the solder balls of the semiconductor chip.
Therefore, a chip tester is needed to solve the above problems.
Disclosure of Invention
The invention aims to provide a chip detector which can detect the defects of a surface to be detected with no height, can detect the defects of the surface to be detected with the height and can measure the height of a solder ball of a semiconductor chip.
In order to achieve the purpose, the invention adopts the following technical scheme:
a chip detection machine is used for detecting the defects of a surface to be detected of a chip, and comprises:
the camera is arranged opposite to the detection area of the detection device so as to acquire an image of the to-be-detected surface of the chip;
the first light source assembly comprises four first bar-shaped light sources, the four first bar-shaped light sources are oppositely arranged in pairs at the periphery of an optical axis of the camera, and can emit light beams towards the surface to be detected of the chip; and
the optical projection assembly comprises more than two projection pieces, the more than two projection pieces are uniformly arranged around the optical axis of the camera, and the projection pieces can project structured light towards the surface to be detected of the chip.
Preferably, the chip detector further comprises a second light source assembly, the second light source assembly and the first light source assembly are sequentially arranged along the optical axis of the camera, the second light source assembly comprises four second strip-shaped light sources, and the four second strip-shaped light sources are oppositely arranged at the periphery of the optical axis of the camera in pairs and can both face the to-be-detected surface of the chip to emit light beams.
Preferably, each of the first and second light source assemblies includes a mounting bracket to which the four first and second strip light sources are rotatably mounted.
Preferably, be provided with the mounting hole on the installing support, four first bar light source and four second bar light source all through wearing to locate pivot in the mounting hole rotationally connect in the installing support, still be provided with the bar hole on the installing support, the bar hole is followed first bar light source with the direction of rotation of second bar light source extends, first bar light source with equal spiro union has the bolt on the second bar light source, the bolt can the bar downthehole removal.
Preferably, the chip detector further comprises a third light source assembly, and a light beam emitted by the third light source assembly is parallel to the optical axis of the camera.
Preferably, the third light source assembly is a coaxial light source located between the camera and the second light source assembly.
Preferably, the four first bar light sources, the four second bar light sources and the coaxial light source are all capable of emitting red, green and blue light beams, and the light beams emitted to the chip are formed by combining the light beams emitted by the first light source component, the second light source component and the coaxial light source.
Preferably, the number of the projection parts is two, and the two projection parts are distributed on two sides of the coaxial light source.
Preferably, the chip detector further comprises an annular light source, the annular light source is located on one side, away from the camera, of the first light source assembly and is arranged coaxially with the camera, and an included angle between a light beam emitted by the annular light source and a surface to be detected of the chip is smaller than 45 degrees.
Preferably, the chip detector comprises a lifting module configured to lift the camera in a vertical direction to adjust a distance of the camera relative to the detection area.
The invention has the beneficial effects that: when the chip is positioned in the detection area, the four first strip-shaped light sources can emit light beams towards the surface to be detected of the chip, the camera acquires images of the surface to be detected of the chip and processes the images through the computer to obtain two-dimensional data of the surface to be detected of the chip, so that the defect that the surface to be detected of the chip does not have height is detected, the projection piece can emit structured light towards the surface to be detected of the chip, the structured light is projected to the surface to be detected of the chip and then modulated by the defect that the surface to be detected of the chip has height, the modulated structured light is collected through the camera and transmitted into the computer, three-dimensional data of the surface to be detected of the chip can be obtained after analysis and calculation, the height of a solder ball of the semiconductor chip can be detected through analysis of the three-dimensional data, and whether the chip is qualified or not can be judged. The invention can detect the surface defect to be detected with no height, can detect the surface defect to be detected with the height, and can measure the height of the solder ball of the semiconductor chip.
Drawings
FIG. 1 is a schematic structural diagram of a chip inspection machine according to an embodiment of the present invention;
fig. 2 is a side view of a mounting bracket in an embodiment of the invention.
In the figure:
1. a camera;
2. a first light source assembly; 21. a first bar light source; 22. mounting a bracket; 221. mounting holes; 222. a strip-shaped hole;
3. an optical projection assembly; 31. a projection;
4. a second light source assembly; 41. a second bar light source;
5. a third light source assembly;
6. an annular light source;
7. a lifting module; 71. a slider; 72. a slide rail;
8. and (7) mounting a seat.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
This embodiment provides a chip detection machine, this chip detection machine is used for detecting the chip and waits to detect the defect of face, please refer to fig. 1, chip detection machine includes camera 1, first light source subassembly 2 and optical projection subassembly 3, camera 1 is just to setting up with detection device's detection area, in order to gather the chip wait to detect the image of face, first light source subassembly 2 includes four first bar light sources 21, four first bar light sources 21 are two liang of relative settings all around the optical axis of camera 1, and all can be towards the chip wait to detect the face and shine the beam, optical projection subassembly 3 includes projection 31 more than two, projection 31 more than two are around the optical axis align to grid of camera 1, and can be towards the chip wait to detect the face and throw the structured light.
In this embodiment, when the chip is located in the detection area, the four first bar light sources 21 can emit light beams toward the surface to be detected of the chip, the camera 1 acquires images of the surface to be detected of the chip and transmits the images to the computer, two-dimensional data of the surface to be detected of the chip is obtained after the two-dimensional data is processed by the computer, so as to detect that the surface to be detected of the chip does not have height defects, the projection piece 31 can emit structured light toward the surface to be detected of the chip, the structured light is projected to the surface to be detected of the chip and then highly modulated by the surface to be detected of the chip, the modulated structured light is collected by the camera 1 and transmitted to the computer, three-dimensional data of the surface to be detected of the chip can be obtained after analysis and calculation, so as to detect that the surface to be detected of the chip has height defects, and by analyzing the three-dimensional data, the solder ball height of the semiconductor chip can be obtained, and whether the chip is qualified or not can be judged.
That is, the embodiment can successively control the opening and closing of the different first strip light source 21 and the projection piece 31 through the strobe controller according to the detection scheme preset by the computer, trigger the camera 1 to shoot simultaneously, transmit the image obtained by shooting by the camera 1 into the computer, and further judge the defect of the surface to be detected of the chip through analyzing the obtained image.
In this embodiment, the projection element 31 adopts a grating projection, and the structural grating projected by the projection head forms a collected image with a grating on the surface to be detected of the chip, so as to obtain three-dimensional data of the surface to be detected of the chip.
It can be understood that, this embodiment can classify the defect with height and the defect without height according to the image that camera 1 obtained, and then sorts the chip after detecting, is convenient for follow-up discernment have different defect's chip.
Meanwhile, because the four first bar-shaped light sources 21 are arranged in the embodiment, and the four first bar-shaped light sources 21 are arranged in a pairwise opposite manner around the optical axis of the camera 1, the surface to be detected of the chip can be fully irradiated from various angles, the condition that no non-irradiated area exists on the surface to be detected of the chip is ensured, and the detection accuracy is improved.
In order to ensure that the camera 1 can obtain a clear image, the height of the camera 1 needs to be adjusted before detection, and therefore, the chip detector in the embodiment includes the lifting module 7, and the lifting module 7 is configured to lift the camera 1 in the vertical direction to adjust the distance between the camera 1 and the detection area.
In this embodiment, the chip detector further includes a mounting base 8, the camera 1 is slidably connected to the mounting base 8 through the lifting module 7, the lifting module 7 includes a sliding block 71 and a sliding rail 72, wherein the sliding rail 72 is disposed on the mounting base 8, the camera 1 is connected to the sliding block 71 through a connecting plate, the sliding block 71 is slidably connected to the sliding rail 72, and then the distance between the camera 1 and the detection area is adjusted.
Further, the chip detection machine further comprises a second light source assembly 4, the second light source assembly 4 and the first light source assembly 2 are sequentially arranged along the optical axis of the camera 1, the second light source assembly 4 comprises four second strip-shaped light sources 41, the four second strip-shaped light sources 41 are oppositely arranged in two pairs around the optical axis of the camera 1, and the four second strip-shaped light sources can both face the chip to be detected to emit light beams. The first strip-shaped light source 21 and the second strip-shaped light source 41 can irradiate the to-be-detected surface of the chip from different heights, included angles between light beams emitted by the four first strip-shaped light sources 21 and the to-be-detected surface of the chip and included angles between light beams emitted by the four second strip-shaped light sources 41 and the horizontal plane are different, included angles between light beams emitted by the higher second light source component 4 and the horizontal plane are larger, and therefore reflected light is easily collected by the camera 1 after the light beams emitted by the second light source component 4 irradiate the to-be-detected surface of the chip which is horizontal or has a smaller included angle with the horizontal plane, namely the second light source component 4 is suitable for detecting the to-be-detected surface of the chip which is horizontal or has a smaller included angle with the horizontal plane, and for the to-be-detected surface which has a larger included angle with the horizontal plane on the chip, because the included angle between the light beams emitted by the lower second light source component 4 and the horizontal plane is smaller, and therefore reflected light after the light beams emitted by the first light source component 2 irradiate the to-be-detected surface of the chip which has a larger included angle with the horizontal plane is easily collected by the camera 1 First light source subassembly 2 is suitable for detecting the face of waiting to detect of the chip that has great contained angle with the horizontal plane promptly, through setting up second light source subassembly 4 and first light source subassembly 2, has further improved the accuracy that detects, has improved the suitability of chip detection machine simultaneously.
Wherein, the first light source assembly 2 and the second light source assembly 4 each include a mounting bracket 22, and the four first bar-shaped light sources 21 and the four second bar-shaped light sources 41 are rotatably mounted to the mounting bracket 22. Four first bar light sources 21 and four second bar light sources 41 pass through the installing support 22 installation, simultaneously, because four first bar light sources 21 and four second bar light sources 41 can rotate, four first bar light sources 21 and four second bar light sources 41 all can follow the angle of difference promptly and face the emission beam of waiting to detect of chip, have further improved the accuracy of detecting and the suitability of chip detector.
With the above structure, as shown in fig. 2, the mounting bracket 22 is provided with a mounting hole 221, the four first bar-shaped light sources 21 and the four second bar-shaped light sources 41 are rotatably connected to the mounting bracket 22 through a rotating shaft penetrating through the mounting hole 221, the mounting bracket 22 is provided with a bar-shaped hole 222, the bar-shaped hole 222 extends along the rotating direction of the first bar-shaped light source 21 and the second bar-shaped light source 41, the first bar-shaped light source 21 and the second bar-shaped light source 41 are both screwed with bolts, and the bolts can move in the bar-shaped hole 222. When the bolts are screwed down, the first bar-shaped light source 21 and the second bar-shaped light source 41 can be fixed on the mounting bracket 22, when the bolts are loosened, the first bar-shaped light source 21 and the second bar-shaped light source 41 can rotate around the rotating shaft, and after the lighting angle is adjusted, the bolts are screwed down to fix the first bar-shaped light source 21 and the second bar-shaped light source 41.
As shown in fig. 1, the chip detector further includes an annular light source 6, the annular light source 6 is located on one side of the first light source assembly 2 away from the camera 1 and is coaxial with the camera 1, and an included angle between a light beam emitted by the annular light source 6 and a to-be-detected surface of the chip is smaller than 45 degrees. Annular light source 6 can follow the less angle and shine the face of waiting to detect of chip, can also polish from the unable angle that shines of bar light source simultaneously, has both improved the more accuracy of waiting to detect of the face of waiting to detect of slope angle on the chip, has improved the homogeneity of polishing simultaneously.
Further, the chip detector further comprises a third light source assembly 5, and a light beam emitted by the third light source assembly 5 is parallel to the optical axis of the camera 1. The third light source component 5 can vertically irradiate the horizontal surface to be detected on the chip, ensures that the surface to be detected of the chip is fully irradiated, has better reflection effect, ensures that the surface to be detected of the chip does not have an area which is not irradiated, can obtain clearer images, and improves the accuracy of detection.
Preferably, the third light source assembly 5 is a coaxial light source, which is located between the camera 1 and the second light source assembly 4. The coaxial light source can provide more uniform illumination than conventional light sources, thus improving the accuracy of detection.
Further, there are two projection members 31, and the two projection members 31 are disposed on two sides of the coaxial light source. Two projection pieces 31 can be from the direction of difference towards the chip projection structured light, after computer analysis handles, can obtain clear three-dimensional image to detect the face of waiting to detect of chip and have the defect of height, be convenient for simultaneously accurate both sides chip tin ball's height has improved the detection precision.
Meanwhile, the two projection pieces 31 are arranged on two sides of the coaxial light source, so that the structure of the whole chip detector is more compact, and the space occupied by the chip detector is reduced. It will be appreciated that the coaxial light source, the first light source assembly 2 and the second light source assembly 4 can avoid the projection light of the projection member 31 to completely illuminate the entire chip.
In the present embodiment, the four first bar light sources 21, the four second bar light sources 41 and the coaxial light sources are all capable of emitting red, green and blue light beams, and the light beams emitted to the chip are formed by the combination of the light beams emitted by the first light source assembly 2, the second light source assembly 4 and the coaxial light sources. That is, the four first bar light sources 21, the four second bar light sources 41 and the coaxial light sources all adopt RGB three-color light sources, the coaxial light sources, the first line light sources and the second bar light sources 41 can generate different combinations of lighting modes, so as to meet the requirements of various types of chips for detecting and imaging defects, and the different types of defects adopt different combinations to obtain corresponding images, thereby ensuring the accuracy of detection.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, adaptations and substitutions will occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. The utility model provides a chip detects machine for detect the chip and wait to detect the defect of face, its characterized in that, chip detects machine includes:
the camera (1) is arranged opposite to the detection area of the detection device so as to acquire an image of the surface to be detected of the chip;
the first light source assembly (2) comprises four first strip-shaped light sources (21), the four first strip-shaped light sources (21) are arranged in a pairwise opposite mode around the optical axis of the camera (1) and can emit light beams towards the surface to be detected of the chip; and
the optical projection assembly (3) comprises more than two projection pieces (31), wherein the more than two projection pieces (31) are uniformly arranged around the optical axis of the camera (1) and can project structured light towards the surface to be detected of the chip.
2. The chip detector according to claim 1, further comprising a second light source assembly (4), wherein the second light source assembly (4) and the first light source assembly (2) are sequentially arranged along the optical axis of the camera (1), the second light source assembly (4) comprises four second bar-shaped light sources (41), and the four second bar-shaped light sources (41) are arranged in pairs around the optical axis of the camera (1) and can emit light beams towards the to-be-detected surface of the chip.
3. The chip detector according to claim 2, wherein each of the first light source assembly (2) and the second light source assembly (4) comprises a mounting bracket (22), and four of the first bar light sources (21) and four of the second bar light sources (41) are rotatably mounted to the mounting bracket (22).
4. The chip detector according to claim 3, wherein the mounting bracket is provided with a mounting hole (221), four first bar light sources (21) and four second bar light sources (41) are rotatably connected to the mounting bracket (22) through a rotating shaft penetrating through the mounting hole (221), the mounting bracket (22) is further provided with a bar hole (222), the bar hole (222) extends along the rotating direction of the first bar light sources (21) and the second bar light sources (41), the first bar light sources (21) and the second bar light sources (41) are respectively screwed with a bolt, and the bolt can move in the bar hole (222).
5. The machine according to claim 3, characterized in that it further comprises a third light source assembly (5), said third light source assembly (5) emitting a light beam parallel to the optical axis of said camera (1).
6. The chip detector according to claim 5, wherein the third light source assembly (5) is a coaxial light source, which is located between the camera (1) and the second light source assembly (4).
7. The machine according to claim 6, characterized in that said four first bar light sources (21), said four second bar light sources (41) and said coaxial light sources are each capable of emitting a red, a green and a blue light beam, the light beams directed towards said chip being formed by the combination of the light beams emitted by said first light source assembly (2), by said second light source assembly (4) and by said coaxial light sources.
8. The chip detector according to claim 7, wherein the number of the projection members (31) is two, and the two projection members (31) are distributed on two sides of the coaxial light source.
9. The chip detector according to claim 1, further comprising an annular light source (6), wherein the annular light source (6) is located on a side of the first light source assembly (2) away from the camera (1) and is coaxial with the camera (1), and an included angle between a light beam emitted by the annular light source (6) and the surface of the chip to be detected is less than 45 degrees.
10. The chip tester according to claim 1, characterized in that the chip tester comprises a lifting module (7), the lifting module (7) being configured to lift the camera (1) in a vertical direction to adjust the distance of the camera (1) with respect to the test area.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110485846.9A CN113252685A (en) | 2021-04-30 | 2021-04-30 | Chip detector |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110485846.9A CN113252685A (en) | 2021-04-30 | 2021-04-30 | Chip detector |
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| CN113252685A true CN113252685A (en) | 2021-08-13 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109406519A (en) * | 2018-11-28 | 2019-03-01 | 广州番禺职业技术学院 | A kind of detection device and method of the special-shaped irregular solder joint of inductance element pin |
| CN113751859A (en) * | 2021-10-13 | 2021-12-07 | 广东国玉科技有限公司 | Laser processing device adopting pseudo-coaxial vision system |
| CN114264277A (en) * | 2021-12-31 | 2022-04-01 | 英特尔产品（成都）有限公司 | Method and device for detecting flatness abnormality of chip substrate |
| CN115980072A (en) * | 2023-03-17 | 2023-04-18 | 中科慧远视觉技术(北京)有限公司 | Multi-station five-degree-of-freedom automatic detection device |
| CN117405691A (en) * | 2023-12-15 | 2024-01-16 | 深圳市什方智造科技有限公司 | Battery cell single body surface detection device |
| WO2024041393A1 (en) * | 2022-08-26 | 2024-02-29 | 宁德时代新能源科技股份有限公司 | Defect detection method, system and apparatus, device, storage medium and product |
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| WO2024041393A1 (en) * | 2022-08-26 | 2024-02-29 | 宁德时代新能源科技股份有限公司 | Defect detection method, system and apparatus, device, storage medium and product |
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| CN117405691A (en) * | 2023-12-15 | 2024-01-16 | 深圳市什方智造科技有限公司 | Battery cell single body surface detection device |
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