CN1306582C - Ball-grating array semiconductor device quality detecting system based on dual-eye machine vision - Google Patents
Ball-grating array semiconductor device quality detecting system based on dual-eye machine vision Download PDFInfo
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- CN1306582C CN1306582C CNB2004100184853A CN200410018485A CN1306582C CN 1306582 C CN1306582 C CN 1306582C CN B2004100184853 A CNB2004100184853 A CN B2004100184853A CN 200410018485 A CN200410018485 A CN 200410018485A CN 1306582 C CN1306582 C CN 1306582C
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Abstract
The present invention discloses system for detecting the quality of a semiconductor device of a ball grid array on the basis of binocular machine vision, which is composed of an optical imaging part and an image collecting part. A semiconductor device of a ball grid array to be tested is placed on an object stage, two CCD video cameras are respectively arranged right above an optical microscope and on the side of the device to be tested, and each CCD video camera is provided with a light source. Image information of the semiconductor device is collected by the two CCD video cameras in multiple angles, the image information is transferred to a computer through a high-speed image collecting card, various kinds of data required by device detection are obtained after the processing, and the quality of the device is evaluated. In the present invention, image collection is triggered and controlled by software signals, two CCD video cameras are used, a color image processing technology is adopted, high-speed, high-resolution and non-destructive detection of the quality of the semiconductor device of the ball grid array is realized, and the requirements of on-line real-time detection can be met.
Description
Technical field
The present invention relates to a kind of ball grid array (Ball Grid Array based on binocular machine vision, BGA) semiconductor device quality detection system, adopt software trigger signal controlling IMAQ, two ccd video camera multi-angles are caught and color image processing, realization belongs to the automated optical detection range to high speed, the high-resolution Non-Destructive Testing of ball grid array semiconductor device quality.
Background technology
China is chip manufacturing big country, but the core technology with independent intellectual property right seldom, and a lot of electronics manufacturing equipments and checkout equipment all are external imports.Cause the reason of this situation to be that the microelectronics manufacturing is a high-tech industry, and China is in the starting of electronics manufacture view evening, scientific research fund and condition shortage.From the mid-90 in 20th century, ball grid array semiconductor device is big because have lead spacing, highdensity I/O interface, and autoregistration characteristic height, good advantages such as electric property develop quite rapid.In order to control product quality, before ball grid array semiconductor device mounts printed circuit board, need detect following index: the reliability of package assembling; Hot matching with printed circuit board (PCB); The coplanarity of solder ball; Sensitiveness etc. to heat, moisture.It is pointed out that no matter the soldered ball on the ball grid array base plate is by high temperature soldered ball (90Pb/10Sn) conversion, still adopt ball to penetrate technology and form that soldered ball all might go out active, it is excessive or too small to be shaped, scolder bridge joint, defective such as damaged.Therefore, before carrying out surface mount, need some indexs wherein be detected.Excessive or too small, the scolder bridge joint lost, be shaped that might occur soldered ball, defective such as damaged, and the detection of the coplanarity of solder ball, the someone proposes to adopt the line-structured laser transducer to detect in conjunction with digital image processing techniques.But mainly there is following problem technically in the system based on line-structured light: detection speed is slow; Need specific motor to drive the workbench of mask placement device; The vibrations of workbench easily bring measure error etc.U.S.'s patent of invention (patent No. 6,134,013) a kind of " Optical ball grid array inspection system (ball grid array chip optical detection system) " disclosed, adopt directional light irradiation measured device, by measuring the angle of reflection ray and known axes, calculate the positional information of reflecting surface.Its major defect is the optical design complexity, and detection speed is not high.
Therefore be necessary to develop the system that a kind of mechanism is simple, detection speed is fast, accuracy of detection is high.To the retrieval of existing ball grid array semiconductor device quality detection system and correlation technique, also there is not to find to be similar to the patent that the present invention is used for addressing the above problem.
Summary of the invention
The objective of the invention is at the deficiencies in the prior art, a kind of ball grid array semiconductor device quality detection system based on binocular machine vision is proposed, high-resolution IMAQ be can pass through, high speed, Non-Destructive Testing realized the ball grid array semiconductor device quality.
For realizing such purpose, the ball grid array semiconductor device quality detection system based on binocular machine vision of the present invention comprises optical imagery and IMAQ two parts.Optical imaging system comprises light microscope, colourful CCD video camera and LED red light source, and all equipment are placed in the stuffing box to prevent the interference of ambient light line.Tested ball grid array semiconductor device is placed on the objective table, and two ccd video cameras are gathered the semiconductor device image information with measured device side multi-angle respectively directly over light microscope.IMAQ partly comprises desktop computer and image pick-up card, utilize software trigger signal images acquired frame by frame,, image information is sent to computer by high speed image acquisition board, obtain every data that device detects to be needed after treatment, carry out the evaluation of device quality.
The concrete structure of system of the present invention is described below:
Detection system of the present invention comprises optical imagery and IMAQ two parts, realizes picture catching, processing capacity respectively.Optical imagery partly comprises light microscope, colourful CCD video camera and LED red light source.Tested BGA device is placed on the objective table under the microscope, and an annular LED red light source is fixed on the below of micro objective, the illumination bga chip.A colourful CCD video camera directly is connected the microscope top by C type interface, gathers the semiconductor device image information of amplifying through microscope.Another colourful CCD video camera is installed in the side top of BGA device, this side ccd video camera camera lens optical axis and tested semiconductor device plane are angled, be roughly about 30～40 degree, regulated according to the measured device size, distance between the two is 20～30 times of BGA device size, to guarantee the image that acquisition is complete and to avoid distortion.The side ccd video camera is relative therewith, ring surface array red LED light source of configuration above tested BGA device opposite side, and the distance of itself and BGA device is 5～10 times of device size, the light source plane is parallel with side CCD optical axis.All equipment are placed in the stuffing box to prevent the interference of ambient light line.IMAQ partly comprises desktop computer and image pick-up card, the image that utilizes the software trigger signal that above-mentioned two ccd video cameras are caught collects computer in turn by image pick-up card, image processing software is by the analysis to image information, obtain every data that device detects to be needed, carry out the evaluation of device quality.
Optical imagery of the present invention partly is installed in the seal case, to avoid the influence of extraneous light, keeps the clean of equipment simultaneously.The stuffing box inwall is a white, and the bottom is the black diffuse-reflective material, makes the bottom light line reflection even as much as possible, to eliminate the interference that causes thus to greatest extent.
System of the present invention is each ccd video camera configuration one cover light source.When the top ccd video camera is caught image, close the side led light source, open the ring-type LED red light source that is fixed under the micro objective, the light of diffusion is radiated on the tested semiconductor device surface equably with low angle, for directly over ccd video camera illumination is provided.And when the side ccd video camera is caught image, open the side led light source, close the led light source that is fixed on the microscope.Two cover ccd video cameras and light source are worked by turns, and be independent mutually.
The operation principle that system carries out the ball height measurement is: at first according to the size of ball grid array semiconductor device and the requirement of measuring height, determine the extreme angles that the side ccd video camera is installed by optical imaging concept and geometrical relationship, as benchmark, setting angle is finely tuned.Principle be setting angle as much as possible near extreme angles, can obtain again each row soldered ball elevation information.Determine after the setting angle, carry out system calibrating.Side CCD is caught image information analyzes, by the geometrical correspondence of calibrating parameters and image and space measured device get final product the elevation information of soldered ball.
Adopt effect of the present invention to be: the quality that can check ball grid array semiconductor device accurately and effectively.By adopting two ccd video camera multi-angle acquisition methods, the image information of comprehensive seizure device.Through to the processing of top ccd video camera institute images acquired, can acquisition device on the information such as size, shape, position, spacing of soldered ball.Through processing to side CCD images acquired, by how much conversions, can from the two-dimensional signal of image, obtain the elevation information of each solder ball, the coplanarity of solder ball is evaluated.According to the size of measured device, accurately determine the setting angle of side ccd video camera, realize detection to each ball height.Native system provides independently light source for each ccd video camera, adopts the reasonable light source configuration, can obtain distinct image, is fit to the image preliminary treatment.System adopts the software trigger mode, and the control image-capture also can grasp image by outside level triggering signal control camera.Native system adopts the IMAQ of high-resolution (1024 * 1024), can satisfy the detection requirement of ball grid array semiconductor device quality.
Description of drawings
Fig. 1 is the overall structure schematic diagram of ball grid array semiconductor device quality detection system of the present invention.
Among the figure, 1 be directly over ccd video camera, 2 is light microscope, 3 be directly over the LED red light source, 4 is side LED red light source, 5 is microscope carrier, 7 is measured device, and 8 is the side ccd video camera, and 9 is the CCD fixed knob, 10 is the up-down adjustment knob, and 11 is support, and 12 is stuffing box, 13 is a whole set of optical imaging system, 14 is image pick-up card, and 15 is a whole set of image capturing system, and 16 is graphics processing unit.
Embodiment
Below in conjunction with accompanying drawing technical scheme of the present invention is further described.
Entire system structure of the present invention is made up of optical imaging system 13 and image capturing system 15 two parts as shown in Figure 1.
Ccd video camera 1 directly over optical imaging system 13 comprised, light microscope 2, LED red light source 3, side LED red light source 4, objective table 5, side ccd video camera 8, CCD fixed knob 9, up-down adjustment knob 10, support 11, stuffing box 12, all devices are placed in the stuffing box 12, to prevent the interference of ambient light line.Tested BGA device 7 is placed on the objective table 5 under the light microscope 2, and an annular LED red light source 3 is fixed on the below of microscope 2 object lens, and tested BGA device 7 throws light on.Colourful CCD video camera 1 is directly installed on the top of light microscope 2 by C type camera interface, gathers the semiconductor device image information of amplifying through microscope.Another colourful CCD video camera 8 is installed on the support 11 on tested BGA device 7 right sides, and the camera lens optical axis of ccd video camera 8 and measured device 7 planes are angled, is roughly 30～40 degree, and definite angle is adjusted with the measured device change in size.Video camera 8 can pass through adjusting knob 10 up-down adjustment, is carved with elevation information on the support 11, is accurate to millimeter.By the pointer on the adjusting knob 10, can obtain the elevation information of ccd video camera 8.Fixed knob 9 is fixed on ccd video camera 8 on the support 11, can adjust angle so that ccd video camera 8 rotates simultaneously in vertical plane.Side video camera 8 and measured device 7 maintain a certain distance, and are roughly 20～30 times of device size, to guarantee the acquisition complete image and to avoid distortion.Relative with side ccd video camera 8, ring surface array red LED light source 4 of configuration above the left side of tested BGA device 7, the distance of itself and BGA device 7 is 5～10 times of device size, the light source plane is parallel with the optical axis of side ccd video camera 8.
When directly over during ccd video camera 1 images acquired, close side led light source 4, the light source 3 directly over opening.And when side ccd video camera 8 images acquired, close the light source 3 directly over the device, open side led light source 4.The ccd video camera 1 and 8 that the present invention adopts can adopt colored 2/3 ' ccd video camera, and resolution is 1024 * 1024 pixels.Adopt the camera lens of manual focusing, focal length variations scope 8-48mm.
Image capturing system 15 comprises desktop computer 16 and image pick-up card 14.Image pick-up card 14 links to each other with two video cameras 1,8 respectively by digital cable, and successively the image information with two camera acquisitions is delivered to computer 16.The present invention adopts the software trigger signal, the image-capture of control measured device.Image capturing system does not have severe noise information, can satisfy the needs that successive image is handled.Image can obtain every data that device detects to be needed through the processing of software, carries out the evaluation of device quality.
Claims (2)
1, a kind of ball grid array semiconductor device quality detection system based on binocular machine vision, form by optical imagery and IMAQ two parts, it is characterized in that whole optics imaging moiety (13) is placed in the stuffing box (12), wherein measured device (7) is placed on the objective table (5) under the light microscope (2), an annular LED red light source (3) is fixed on the below of microscope (2) object lens, a colourful CCD video camera (1) is directly installed on the top of light microscope (2) by camera interface, the semiconductor device image information that collection is amplified through microscope, another colourful CCD video camera (8) is installed on the support (11) of measured device (7) one sides, and by the angle in fixed knob (9) the adjusting vertical plane, regulate upper-lower position by adjusting knob (10), the camera lens optical axis of side ccd video camera (8) becomes 30～40 degree angles with measured device (7) plane, distance is 20～30 times of measured device (7) size between side ccd video camera (8) and the measured device (7), relative with side ccd video camera (8), opposite side top configuration ring surface array red LED light source (4) at measured device (7), the distance of itself and measured device (7) is 5～10 times of device size, the light source plane of ring surface array red LED light source (4) is parallel with the optical axis of side ccd video camera (8), image pick-up card (14) in the IMAQ part by digital cable respectively with two ccd video cameras (1,8) link to each other, the image information of camera acquisition is delivered to computer (16).
2, according to the ball grid array semiconductor device quality detection system based on binocular machine vision of claim 1, it is characterized in that the inwall of described stuffing box (12) is white, the bottom is the black diffuse-reflective material.
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| CNB2004100184853A CN1306582C (en) | 2004-05-20 | 2004-05-20 | Ball-grating array semiconductor device quality detecting system based on dual-eye machine vision |
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| CNB2004100184853A CN1306582C (en) | 2004-05-20 | 2004-05-20 | Ball-grating array semiconductor device quality detecting system based on dual-eye machine vision |
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| CN1306582C true CN1306582C (en) | 2007-03-21 |
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Families Citing this family (15)
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|---|---|---|---|---|
| CN101441400B (en) * | 2007-11-20 | 2010-09-15 | 同方威视技术股份有限公司 | Elevating type radiation imaging apparatus |
| CN101610351B (en) * | 2008-06-18 | 2012-12-12 | 中国科学院自动化研究所 | Vision sensor of robot |
| CN101807061B (en) * | 2010-02-11 | 2012-01-11 | 东莞朗诚模具有限公司 | Vision detection control system and method for integrated circuit tendon-cut system |
| CN102384767B (en) * | 2011-11-17 | 2014-03-12 | 江苏大学 | Nondestructive detection device and method for facility crop growth information |
| CN102679876B (en) * | 2012-06-01 | 2014-08-06 | 吉林大学 | Unidirectional panoramic view optical collecting system for whole commercial vehicle |
| CN103344183A (en) * | 2013-07-25 | 2013-10-09 | 中国科学院自动化研究所 | Sugar size detection device and method |
| CN103344182B (en) * | 2013-07-25 | 2016-08-10 | 中国科学院自动化研究所 | A kind of confection physical dimension based on binocular vision measures system and method |
| CN103531139B (en) * | 2013-10-18 | 2016-08-17 | 台龙电子（昆山）有限公司 | CCD amplification detection instrument for LED display screen |
| CN103969567A (en) * | 2014-04-22 | 2014-08-06 | 四川虹视显示技术有限公司 | Method and device for detecting and analyzing defects of OLED device |
| CN104792281A (en) * | 2015-03-30 | 2015-07-22 | 智机科技（深圳）有限公司 | Terminal coplanarity measurement method |
| CN106932396A (en) * | 2017-02-08 | 2017-07-07 | 深圳市燕麦科技股份有限公司 | A kind of multidirectional control alignment method, system and computer-readable recording medium |
| CN110445964A (en) * | 2019-07-22 | 2019-11-12 | 广州供电局有限公司 | Photographic device and cable fault analyzing system |
| WO2021109012A1 (en) * | 2019-12-04 | 2021-06-10 | Yangtze Memory Technologies Co., Ltd. | Inspection system of semiconductor device and related inspection method |
| CN113686253A (en) * | 2021-09-18 | 2021-11-23 | 广州海普电子材料科技有限公司 | BGA solder ball detection method and system |
| CN114264277A (en) * | 2021-12-31 | 2022-04-01 | 英特尔产品（成都）有限公司 | Method and device for detecting flatness abnormality of chip substrate |
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| JP2000049203A (en) * | 1998-07-30 | 2000-02-18 | Hitachi Ltd | Method and apparatus for inspecting appearance and manufacture of semiconductor device |
| CN2445344Y (en) * | 2000-09-21 | 2001-08-29 | 上海大学 | Machine visual integral sensing device |
| JP2003077413A (en) * | 2001-09-06 | 2003-03-14 | Toshiba Corp | Electron beam system and semiconductor device manufacturing method using the same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000049203A (en) * | 1998-07-30 | 2000-02-18 | Hitachi Ltd | Method and apparatus for inspecting appearance and manufacture of semiconductor device |
| CN2445344Y (en) * | 2000-09-21 | 2001-08-29 | 上海大学 | Machine visual integral sensing device |
| JP2003077413A (en) * | 2001-09-06 | 2003-03-14 | Toshiba Corp | Electron beam system and semiconductor device manufacturing method using the same |
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