CN113238642B

CN113238642B - Computer heat radiation module cooling device

Info

Publication number: CN113238642B
Application number: CN202110631967.XA
Authority: CN
Inventors: 杨勇; 罗程; 东志浩
Original assignee: Zhengzhou Jie Microelectronics Technology Co ltd
Current assignee: Zhengzhou Jie Microelectronics Technology Co ltd
Priority date: 2018-06-20
Filing date: 2018-06-20
Publication date: 2022-08-09
Anticipated expiration: 2038-06-20
Also published as: CN108762449A; CN113238642A; CN108762449B

Abstract

The invention discloses a computer heat dissipation module cooling device which comprises a case, wherein semiconductor refrigeration pieces are fixedly connected to two sides of the inner wall of the case, heat conducting rods are fixedly connected to opposite sides of the two semiconductor refrigeration pieces, elastic frames are fixedly connected to opposite ends of the two heat conducting rods, transverse plates are fixedly connected to the top and the bottom of the inner wall of the case, and fixing plates are fixedly connected to the top and the bottom of the elastic frames. This computer heat dissipation module heat sink, the equal fixedly connected with semiconductor refrigeration piece in both sides through quick-witted incasement wall, realized carrying out not only quick but also efficient heat dissipation to computer case to fine assurance the normal use of computer internal electrical components, movable groove has all been seted up through the both sides of quick-witted case, avoids the heat to condense the emergence that only can last the intensification condition in computer inside, can dispel the heat, improves the security.

Description

Computer heat radiation module cooling device

The patent application is divisional application, the application number of a parent application is 2018106335651, and the application date of the parent application is 2018, 06 and 20.

Technical Field

The invention relates to the technical field of computers, in particular to a cooling device of a computer heat dissipation module.

Background

The computer is commonly called computer, is a modern intelligent electronic equipment for high-speed calculation, can be used for making numerical calculation and logic calculation, also has memory function, can be run according to program and can automatically and high-speed process mass data, and is formed from hardware system and software system, and the computer without any software is called bare computer, and can be divided into five categories of super computer, industrial control computer, network computer, personal computer and embedded computer, and the more advanced computers are biological computer, photon computer and quantum computer, etc. and are one of the most advanced scientific and technological inventions in 20 th century, and can produce extremely important influence on human production activity and social activity, and can be quickly developed with strong vitality, and its application field can be extended from original military scientific research application to every field of society, the computer industry with huge scale has been formed, the technology progress in the global scope is driven, and therefore a profound social revolution is initiated, computers spread throughout general schools, enterprises and public institutions, enter common families and become necessary tools in the information society, the application of the computers is more and more common in China, the number of computer users in China is continuously increased, the application level is continuously improved, and particularly, the application in the fields of internet, communication, multimedia and the like obtains good results.

The computer is one of the most used electronic products at present, the operation of the computer is finished through a mainboard, the mainboard is easy to generate heat after long-time operation, the operation is slow or the fault is caused, the existing computer host is provided with a radiator, but the radiator effect is not ideal, a lot of dust is absorbed in the radiating process, the normal use of the computer is influenced for a long time, and the service life of the computer is greatly reduced.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides a cooling device of a computer cooling module, which solves the problems of poor cooling effect and shortened service life of a computer.

(II) technical scheme

In order to achieve the purpose, the invention is realized by the following technical scheme: the computer heat dissipation module cooling device comprises a case, wherein both sides of the inner wall of the case are fixedly connected with semiconductor refrigeration sheets, the opposite sides of the two semiconductor refrigeration sheets are fixedly connected with heat conducting rods, the opposite ends of the two heat conducting rods are fixedly connected with elastic frames, the top and the bottom of the inner wall of the case are fixedly connected with transverse plates, the top and the bottom of the outer side of each elastic frame are fixedly connected with fixed plates, both ends of each transverse plate in the length direction are movably connected with first movable rods, both ends of each fixed plate in the length direction are movably connected with second movable rods, a vertical plate is movably connected between the opposite ends of the first movable rods and the second movable rods, a hydraulic telescopic rod is fixedly connected between the opposite sides of the two vertical plates, and a first spring is fixedly connected between the opposite sides of the surfaces of the two first movable rods, and a second spring is fixedly connected between the opposite sides of the surfaces of the two second movable rods.

Preferably, movable grooves are formed in the two sides of the case, dust screens are fixedly connected between the top and the bottom of the inner walls of the movable grooves, and the number of the movable grooves is six.

Preferably, the back of the inner wall of the case is fixedly connected with four heat dissipation fans, and the elastic frame is internally provided with honeycomb heat dissipation holes.

Preferably, the bottom fixedly connected with bottom plate of quick-witted case, the top of bottom plate just is located the equal fixedly connected with oil tank in both sides of quick-witted case to one side that two oil tanks deviate from mutually all communicates there is the oiling pipe, the inside fixedly connected with electronic valve of oiling pipe.

Preferably, the top swing joint of oil tank has the montant, the bottom of montant runs through the oil tank and extends to the inside of oil tank, the montant extends to the inside one end fixedly connected with piston plate of oil tank to the top fixedly connected with handle of montant.

Preferably, the equal fixedly connected with slide bar in both sides at oil tank top to the surperficial sliding connection of slide bar has the slide, the surface of slide bar just is located fixedly connected with third spring between the bottom of slide and the top of oil tank, the top fixedly connected with dog of slide bar to the equal fixedly connected with plate heat exchanger in bottom of two oil tank inner walls.

Preferably, the connection box is fixedly connected to the back of the case, the back of the oil tank is communicated with a guide pipe, one end of the guide pipe penetrates through the connection box and extends into the connection box, and the surface of one end of the guide pipe extending into the connection box is fixedly connected with the inner wall of the connection box.

Preferably, the surface of the chassis is provided with three connecting holes.

(III) advantageous effects

The invention provides a cooling device for a computer cooling module. The method has the following beneficial effects:

(1) the cooling device of the computer radiating module comprises semiconductor refrigerating sheets fixedly connected with two sides of the inner wall of a case, heat conducting rods fixedly connected with one opposite sides of the two semiconductor refrigerating sheets, elastic frames fixedly connected with one opposite ends of the two heat conducting rods, transverse plates fixedly connected with the top and the bottom of the inner wall of the case, fixed plates fixedly connected with the top and the bottom of the elastic frames, first movable rods movably connected with two sides of the bottom of the transverse plates, second movable rods movably connected with two sides of the top of the fixed plates, vertical plates movably connected between the opposite ends of the first movable rods and the second movable rods, hydraulic telescopic rods fixedly connected between the opposite sides of the two vertical plates, first springs fixedly connected between the opposite sides of the surfaces of the two first movable rods, and second springs fixedly connected between the opposite sides of the surfaces of the two second movable rods, therefore, the service life of the electrical components in the computer case is greatly prolonged, the quick and efficient heat dissipation of the computer case is realized, and the normal use of the electrical components in the computer is well ensured.

(2) This computer heat dissipation module heat sink, movable groove has all been seted up through the both sides of quick-witted case, and fixedly connected with dust screen between the top of activity inslot wall and the bottom, the quantity in movable groove is six, machine incasement wall's back fixedly connected with heat dissipation fan, and the quantity of heat dissipation fan is four, the honeycomb louvre has been seted up to the inside of elasticity frame, can be fine transmit the heat, avoid the heat to condense the emergence that only can last the intensification condition in computer inside, can dispel the heat, the security is improved.

(3) This computer heat dissipation module heat sink, the equal fixedly connected with slide bar in both sides through the oil tank top, and the sliding surface connection of slide bar has the slide, fixedly connected with third spring between the surface of slide bar and the top that is located the bottom of slide and oil tank, the top fixedly connected with dog of slide bar, the back fixedly connected with connecting box of machine case, and the back intercommunication of oil tank has the pipe, the one end of pipe runs through the connecting box and extends to the inside of connecting box, the pipe extends to the surface of the inside one end of connecting box and the inner wall fixed connection of connecting box, can utilize the conduction oil to cool down, can utilize the mode of backward flow, continuously cool down the computer, the energy has been practiced thrift, the effect of cooling has also been reached.

(4) This computer heat dissipation module heat sink, the equal fixedly connected with semiconductor refrigeration piece in both sides through quick-witted incasement wall, and the equal fixedly connected with heat conduction stick in one side that two semiconductor refrigeration pieces are relative, the equal fixedly connected with elasticity frame of the equal one end that two heat conduction sticks are relative, the movable groove has all been seted up to the both sides of machine case, and fixedly connected with dust screen between the top of movable inslot wall and the bottom, quick-witted incasement wall's back fixedly connected with heat dissipation fan, and the quantity of heat dissipation fan is four, the honeycomb louvre has been seted up to the inside of elasticity frame, a plurality of heat sink's setting, the effect of cooling can be improved greatly, the security of computer use has been kept.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view of the structure of the present invention;

FIG. 3 is a side view of the structure of the present invention;

FIG. 4 is a cross-sectional view of the junction box structure of the present invention;

FIG. 5 is an enlarged view of a portion of the invention at A in FIG. 2;

fig. 6 is a partial enlarged view of the invention at B in fig. 2.

In the figure, 1 chassis, 2 semiconductor refrigeration piece, 3 heat conducting rod, 4 elastic frame, 5 transverse plate, 6 fixing plate, 7 first movable rod, 8 second movable rod, 9 vertical plate, 10 hydraulic telescopic rod, 11 first spring, 12 second spring, 13 movable groove, 14 dust screen, 15 heat dissipation fan, 16 honeycomb heat dissipation hole, 17 bottom plate, 18 oil tank, 19 oil injection pipe, 20 vertical rod, 21 piston plate, 22 handle, 23 slide rod, 24 slide plate, 25 third spring, 26 stop block, 27 connecting box, 28 conduit, 29 connecting hole, 30 plate heat exchanger.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-6, an embodiment of the present invention provides a technical solution: a cooling device of a computer cooling module comprises a case 1, wherein two sides of the case 1 are respectively provided with a movable groove 13, a dustproof net 14 is fixedly connected between the top and the bottom of the inner wall of each movable groove 13, the dustproof net 14 can prevent dust from entering and reduce dust in the case 1, the number of the movable grooves 13 is six, a cooling fan 15 is fixedly connected to the back of the inner wall of the case 1, the cooling fan 15 can accelerate air flow in the case 1 and promote cooling efficiency to be improved, so that the service life of electrical components in the computer case is greatly prolonged, quick and efficient cooling of the computer case is realized, normal use of the electrical components in the computer is well guaranteed, the number of the cooling fans 15 is four, honeycomb cooling holes 16 are formed in an elastic frame 4, heat can be well transferred, and the situation that heat is condensed in the computer and only can be continuously heated is avoided, the heat can be dissipated, the safety is improved, a bottom plate 17 is fixedly connected to the bottom of the case 1, oil tanks 18 are fixedly connected to the top of the bottom plate 17 and located on two sides of the case 1, vertical rods 20 are movably connected to the top of the oil tanks 18, the bottom ends of the vertical rods 20 penetrate through the oil tanks 18 and extend into the oil tanks 18, piston plates 21 are fixedly connected to one ends of the vertical rods 20 extending into the oil tanks 18, handles 22 are fixedly connected to the top ends of the vertical rods 20, sliding rods 23 are fixedly connected to two sides of the top of the oil tanks 18, sliding plates 24 are slidably connected to the surfaces of the sliding rods 23, third springs 25 are fixedly connected to the surfaces of the sliding rods 23 and located between the bottoms of the sliding plates 24 and the top of the oil tanks 18, when the sliding plates 24 move, the third springs 25 can play a good buffering effect, stoppers 26 are fixedly connected to the top ends of the sliding rods 23, and the stoppers 26 can prevent the sliding plates 24 from being separated from the sliding rods 23 when the sliding plates move upwards, the plate heat exchangers 30 are fixedly connected with the bottoms of the inner walls of the two oil tanks 18, the plate heat exchangers 30 are important devices for recovering exhaust energy of a large-scale air conditioning system, recovering waste heat of high-temperature flue gas and dissipating heat of a computer CPU, the structure comprises a vacuum liquid-filling end socket and a core body, the vacuum liquid-filling end socket is arranged at two sides of the vacuum liquid-filling channel, the vacuum liquid-filling end socket at one side is provided with a connecting pipe, the core body is formed by alternately overlapping a vacuum liquid-filling channel and a plurality of plate fin channels, the upper part and the lower part of the vacuum liquid-filling channel are provided with clapboards, two sides of the vacuum liquid-filling channel are provided with seals, fins can be arranged in the channels, the upper part and the lower part of each plate fin channel are provided with the clapboards, the two plate fin channels are divided into two parallel hot medium channels and cold medium channels by one seal, the whole body is horizontally arranged in an inclined mode or vertically arranged after being assembled, and one side, which is far away from the two oil tanks 18, is communicated with an oil filling pipe 19, the heat pump can utilize heat conduction oil to cool, can utilize a backflow mode, continuously cool a computer, saves energy and achieves the cooling effect, an electronic valve is fixedly connected inside the oil injection pipe 19, a connecting box 27 is fixedly connected on the back surface of the case 1, the back surface of the oil tank 18 is communicated with a guide pipe 28, one end of the guide pipe 28 penetrates through the connecting box 27 and extends into the connecting box 27, the surface of one end of the guide pipe 28 extending into the connecting box 27 is fixedly connected with the inner wall of the connecting box 27, connecting holes 29 are formed in the surface of the case 1, the number of the connecting holes 29 is three, semiconductor cooling sheets 2, also called thermoelectric cooling sheets are fixedly connected on two sides of the inner wall of the case 1, the heat pump has the advantages that no sliding part is arranged, the application is limited in some spaces, the reliability requirement is high, and no refrigerant pollution is caused, by utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so as to achieve the purpose of refrigeration, the refrigeration technology is a refrigeration technology for generating negative thermal resistance, and is characterized in that no moving part is arranged, the reliability is higher, in principle, a semiconductor refrigeration sheet is a heat transfer tool, when current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between two ends, the heat can be transferred from one end to the other end, so as to generate temperature difference to form a cold and hot end, but the semiconductor has resistance to generate heat when the current passes through the semiconductor, so as to influence the heat transfer, and the heat between two polar plates can also carry out reverse heat transfer through air and the semiconductor material, when the cold end and the hot end reach a certain temperature difference and the two heat transfer amounts are equal, a balance point is reached, the forward and reverse heat transfer amounts are mutually offset, the temperature of the cold end and the hot end can not be continuously changed, in order to reach lower temperature, the temperature of the hot end can be reduced by adopting the modes of heat dissipation and the like, one sides opposite to the two semiconductor refrigerating sheets 2 are fixedly connected with the heat conducting rods 3, one ends opposite to the two heat conducting rods 3 are fixedly connected with the elastic frames 4, the elastic frames 4 are soft and can accelerate the heat circulation when swinging, the honeycomb heat dissipation holes are formed in the elastic frames 4, the plurality of cooling devices are arranged, the cooling effect can be greatly improved, the use safety of a computer is kept, the top and the bottom of the inner wall of the case 1 are fixedly connected with the transverse plate 5, and the top and the bottom outside of the elastic frames 4 are fixedly connected with the fixing plates 6, and the equal swing joint in both ends of 5 length direction of diaphragm has first movable rod 7, the equal swing joint in both ends of 6 length direction of fixed plate has second movable rod 8, and swing joint has riser 9 between the relative one end of first movable rod 7 and second movable rod 8, fixedly connected with hydraulic telescoping rod 10 between the relative one side of two riser 9, and fixedly connected with first spring 11 between the relative one side in surface of two first movable rods 7, fixedly connected with second spring 12 between the relative one side in surface of two second movable rods 8.

When the cooling device is used, in the cooling process, the hydraulic telescopic rod 10 is started, the hydraulic telescopic rod 10 drives the vertical plate 9 to move oppositely or reversely, the elastic frame 4 is continuously pushed to move inwards or outwards, the heat in the case 1 is discharged through the honeycomb heat dissipation holes 16, the heat conducting rod 3 absorbs the heat in the elastic frame 4 and transfers the heat to the semiconductor refrigerating sheet 2, the semiconductor refrigerating sheet 2 is cooled, the hot air is also discharged through the movable groove 13, the heat conducting oil is injected into the oil tank 18 through the oil injection pipe 19 and then presses the vertical rod 20 downwards, the vertical rod 20 drives the piston plate 21 to move downwards, the heat conducting oil flows into the connecting box 27 from the conduit 28 and absorbs the heat, the vertical rod 20 is pulled upwards, the piston plate 21 moves upwards, and the heat conducting oil in the conduit 28 is sucked into the oil tank 18 again, the plate heat exchanger 30 cools the heat-conducting oil and then uses the heat-conducting oil, so that the case 1 can be cooled.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Computer heat dissipation module heat sink, including quick-witted case (1), its characterized in that: the refrigerator is characterized in that both sides of the inner wall of the cabinet (1) are fixedly connected with semiconductor refrigerating sheets (2), one opposite sides of the two semiconductor refrigerating sheets (2) are fixedly connected with heat conducting rods (3), one opposite ends of the two heat conducting rods (3) are fixedly connected with elastic frames (4), the top and the bottom of the inner wall of the cabinet (1) are fixedly connected with transverse plates (5), the top and the bottom of the outer side of each elastic frame (4) are fixedly connected with fixed plates (6), both ends of each transverse plate (5) in the length direction are movably connected with first movable rods (7), both ends of each fixed plate (6) in the length direction are movably connected with second movable rods (8), a vertical plate (9) is movably connected between the opposite ends of the first movable rods (7) and the second movable rods (8), and a hydraulic telescopic rod (10) is fixedly connected between the opposite sides of the two vertical plates (9), and a first spring (11) is fixedly connected between one opposite sides of the surfaces of the two first movable rods (7), a second spring (12) is fixedly connected between one opposite sides of the surfaces of the two second movable rods (8), a heat dissipation fan (15) is fixedly connected to the back of the inner wall of the case (1), the number of the heat dissipation fans (15) is four, a honeycomb heat dissipation hole (16) is formed in the elastic frame (4), movable grooves (13) are formed in both sides of the case (1), a dust screen (14) is fixedly connected between the top and the bottom of the inner wall of each movable groove (13), the number of the movable grooves (13) is six, a bottom plate (17) is fixedly connected to the bottom of the case (1), oil tanks (18) are fixedly connected to the top of the bottom plate (17) and both sides of the case (1), and oil filling pipes (19) are communicated with one side of the two oil tanks (18) which deviates from each other, and an electronic valve is fixedly connected inside the oil filling pipe (19).

2. The cooling device for a computer cooling module of claim 1, wherein: the top swing joint of oil tank (18) has montant (20), the bottom of montant (20) runs through oil tank (18) and extends to the inside of oil tank (18), montant (20) extend to the inside one end fixedly connected with piston plate (21) of oil tank (18) to the top fixedly connected with handle (22) of montant (20).

3. The cooling device for a computer cooling module of claim 1, wherein: the equal fixedly connected with slide bar (23) in both sides at oil tank (18) top to the surperficial sliding connection of slide bar (23) has slide (24), the surface of slide bar (23) just is located fixedly connected with third spring (25) between the bottom of slide (24) and the top of oil tank (18), the top fixedly connected with dog (26) of slide bar (23) to the equal fixedly connected with plate heat exchanger (30) in bottom of two oil tank (18) inner walls.

4. The cooling device for a computer cooling module of claim 1, wherein: the back of the case (1) is fixedly connected with a connecting box (27), the back of the oil tank (18) is communicated with a guide pipe (28), one end of the guide pipe (28) penetrates through the connecting box (27) and extends into the connecting box (27), and the surface of one end of the guide pipe (28) extending into the connecting box (27) is fixedly connected with the inner wall of the connecting box (27).

5. The cooling device for a computer cooling module of claim 1, wherein: the surface of the case (1) is provided with three connecting holes (29), and the number of the connecting holes (29) is three.