CN113231290A - Support material for heat treatment of liquid crystal polymer film and manufacturing method thereof - Google Patents
Support material for heat treatment of liquid crystal polymer film and manufacturing method thereof Download PDFInfo
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- CN113231290A CN113231290A CN202110647557.4A CN202110647557A CN113231290A CN 113231290 A CN113231290 A CN 113231290A CN 202110647557 A CN202110647557 A CN 202110647557A CN 113231290 A CN113231290 A CN 113231290A
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- Prior art keywords
- release coating
- support material
- liquid crystal
- heat treatment
- crystal polymer
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- 239000000463 material Substances 0.000 title claims abstract description 31
- 238000010438 heat treatment Methods 0.000 title claims abstract description 25
- 229920000106 Liquid crystal polymer Polymers 0.000 title claims abstract description 22
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000000576 coating method Methods 0.000 claims abstract description 73
- 239000011248 coating agent Substances 0.000 claims abstract description 72
- 239000011888 foil Substances 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 35
- 239000004640 Melamine resin Substances 0.000 claims abstract description 34
- 239000003822 epoxy resin Substances 0.000 claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 33
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 15
- 239000011256 inorganic filler Substances 0.000 claims abstract description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- -1 butanol modified melamine Chemical class 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 150000007974 melamines Chemical class 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 8
- 239000013034 phenoxy resin Substances 0.000 claims description 8
- 229920006287 phenoxy resin Polymers 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000000454 talc Substances 0.000 claims description 5
- 229910052623 talc Inorganic materials 0.000 claims description 5
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical class NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 4
- 235000012211 aluminium silicate Nutrition 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 239000004927 clay Substances 0.000 claims description 4
- 229910052570 clay Inorganic materials 0.000 claims description 4
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 4
- 239000000347 magnesium hydroxide Substances 0.000 claims description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N Butanol Natural products CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 3
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000004843 novolac epoxy resin Substances 0.000 claims description 3
- 125000003944 tolyl group Chemical group 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 28
- 239000010409 thin film Substances 0.000 abstract description 2
- 230000004048 modification Effects 0.000 description 15
- 238000012986 modification Methods 0.000 description 15
- 238000001723 curing Methods 0.000 description 13
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000011247 coating layer Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical class NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 125000005041 acyloxyalkyl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
- C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09D161/32—Modified amine-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/20—Metallic substrate based on light metals
- B05D2202/25—Metallic substrate based on light metals based on Al
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2252/00—Sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2504/00—Epoxy polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2518/00—Other type of polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2518/00—Other type of polymers
- B05D2518/10—Silicon-containing polymers
- B05D2518/12—Ceramic precursors (polysiloxanes, polysilazanes)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2602/00—Organic fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
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- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K2003/2241—Titanium dioxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Abstract
The invention discloses a support material for heat treatment of a liquid crystal polymer film, which comprises a metal foil; at least one surface of the metal foil is provided with a release coating, and the release coating is composed of epoxy resin, melamine resin, silicone and inorganic filler. According to the invention, the film thickness of the release coating is 0.5-5 μm, the cost is not increased, the later-stage stripping property can be ensured, and a thin film cannot be formed because the release coating is too thin.
Description
Technical Field
The invention relates to the technical field of electron correlation, in particular to a support body material for heat treatment of a liquid crystal polymer film and a manufacturing method thereof.
Background
In recent years, as reduction in size and weight of machines is required in the fields of electronics and electrical industry, the demand for FPCs (flexible printed wiring boards) is increasing. In a general method for producing such an FPC, a metal foil such as a copper foil is laminated on at least one surface of a base film, and then an electric circuit is formed. As the base film, a polyethylene terephthalate film or the like is often used. However, since such a thin film has poor heat resistance, when a component is mounted on an FPC, problems such as air bubbles, peeling, and deformation are likely to occur when the FPC is immersed in a solder solution.
Therefore, we propose a support material for heat treatment of liquid crystal polymer film and its manufacturing method.
Disclosure of Invention
The invention aims to provide a support material for heat treatment of a liquid crystal polymer film and a manufacturing method thereof, which aim to solve the problems in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a support material for heat treatment of liquid crystal polymer film and its manufacturing method, including metal foil; at least one surface of the metal foil is provided with a release coating, and the release coating is composed of epoxy resin, melamine resin, silicone and inorganic filler.
Preferably, the metal foil is aluminum foil, and the aluminum foil is an alloy species with the elastic limit of 140-270 MPa.
Preferably, the thickness of the aluminum foil is less than 200 μm.
Preferably, the thickness of the aluminum foil is 10 to 75 μm.
Preferably, one surface of the release coating layer, which is positioned on the metal foil, is set to be a rough surface, the roughness of the rough surface is 1.0-10um, and the thickness of the release coating layer is 0.5-5 μm.
Preferably, the roughness of the rough surface is 2.0 to 5.0 μm.
Preferably, the epoxy resin is one or more of bisphenol a epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, brominated epoxy resin, amine epoxy resin, flexible epoxy resin, hydrogenated bisphenol a epoxy resin, phenoxy resin, and brominated phenoxy resin.
Preferably, the melamine resin is one or more of methyl etherified melamine resin, butylated urea melamine resin, butylated melamine resin, methylated melamine resin and butanol modified melamine resin.
Preferably, the silicone is one or more of methyl phenyl polysiloxane, methyl hydrogen polysiloxane, dimethyl polysiloxane and modified dimethyl polysiloxane.
Preferably, the inorganic filler is one or more of calcium carbonate, kaolin, talc, clay, titanium dioxide, zinc oxide, silica, alumina, magnesium hydroxide and aluminum hydroxide.
Preferably, the method for manufacturing the support material for heat treatment of the liquid crystal polymer film comprises the following steps:
s1: unreeling: selecting a metal foil with the thickness of 50 mu m, and guiding the metal foil through a guide roller when the metal foil is unreeled;
s2: coating: coating the metal foil with a release coating by a coating mechanism through a coating roller;
s3: and (3) curing: curing the metal foil coated with the release coating through an oven when the metal foil passes through an oven guide roller to continuously obtain the support body material with the release coating;
s4: winding: and winding the obtained support body material with the release coating through a winding mechanism.
Preferably, the release coatingThe coating weight of (2) is 1.8g/m2The release coating comprises epoxy resin serving as film-forming resin and silicone additive accounting for 5-35% of the mass of the epoxy resin, and the metal foil coated with the release coating is subjected to continuous heating curing treatment in a hot air circulation type oven.
Compared with the prior art, the invention has the beneficial effects that:
1. the coating is easy to peel and not easy to deform;
2. the film thickness of the release coating is 0.5-5 μm, so that the later-stage stripping performance can be ensured without increasing the cost, and a film cannot be formed because the release coating is too thin;
3. the number average molecular weight of the epoxy resin is preferably 2000-3000, and the number average molecular weight of the melamine resin is preferably 500-1000; by having such a number average molecular weight, it is possible to form a coating of the resin and to easily adjust the adhesive strength of the resin coating film to a predetermined range.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of the double-sided release coating of the present invention.
FIG. 3 is a schematic view showing a process for coating a metal foil according to the present invention.
FIG. 4 is a flow chart of the present invention.
In the figure: 1. a metal foil; 2. a release coating; 3. a support material with a release coating; 101. a guide roller; 102. a coating roll; 103. a coating mechanism; 104. a drying oven guide roller; 105. and (5) an oven.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1-4, in an embodiment of the present invention, a support material for heat treatment of a liquid crystal polymer film includes a metal foil 1; at least one surface of the metal foil 1 is provided with a release coating 2, and the release coating 2 is composed of epoxy resin, melamine resin, silicone and inorganic filler; the metal foil 1 adopts aluminum foil, and the aluminum foil adopts alloy species with the elastic limit of 140-270 MPa; the thickness of the aluminum foil is less than 200 mu m; the thickness of the aluminum foil is 10-75 μm; one surface of the release coating 2, which is positioned on the metal foil 1, is set to be a rough surface, the roughness of the rough surface is 1.0-10um, and the thickness of the release coating 2 is 0.5-5 μm; the roughness of the rough surface is 2.0-5.0 μm; the epoxy resin is one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, brominated epoxy resin, amine epoxy resin, flexible epoxy resin, hydrogenated bisphenol A epoxy resin, phenoxy resin and brominated phenoxy resin; the melamine resin is one or more of methyl etherified melamine resin, butylated urea melamine resin, butylated melamine resin, methylated melamine resin and butanol modified melamine resin; the silicone is one or more of methyl phenyl polysiloxane, methyl hydrogen polysiloxane, dimethyl polysiloxane and modified dimethyl polysiloxane; the inorganic filler is one or more of calcium carbonate, kaolin, talc, clay, titanium dioxide, zinc oxide, silicon dioxide, aluminum oxide, magnesium hydroxide and aluminum hydroxide.
A method for manufacturing a support material for heat treatment of a liquid crystal polymer film comprises the following steps:
s1: unreeling: selecting a metal foil 1 with the thickness of 50 mu m, and guiding the metal foil 1 by a guide roller 101 when the metal foil 1 is unreeled;
s2: coating: the metal foil passes through an application roller 102, and a release coating is applied to the metal foil by an application mechanism 103;
s3: and (3) curing: curing the metal foil coated with the release coating through an oven 105 when the metal foil passes through an oven guide roller 104 to continuously obtain the support body material 3 with the release coating;
s4: winding: and winding the obtained support body material 3 with the release coating by a winding mechanism.
Preferably, the coating weight of the release coating is 1.8g/m2The release coating comprises epoxy resin serving as film-forming resin and silicone additive accounting for 5-35% of the mass of the epoxy resin, and the metal foil coated with the release coating is subjected to continuous heating curing treatment in a hot air circulation type oven.
The release coating is composed of an epoxy resin as a main agent, a melamine resin as a curing agent, silicone as a release agent and an inorganic filler as surface roughening particles; examples of the epoxy resin include bisphenol a type epoxy resins, bisphenol F type epoxy resins, novolac type epoxy resins, brominated epoxy resins, amine type epoxy resins, flexible epoxy resins, hydrogenated bisphenol a type epoxy resins, phenoxy resins, and brominated phenoxy resins.
Examples of the melamine-based resin include methyl etherified melamine resin, butylated urea melamine resin, butylated melamine resin, methylated melamine resin, butanol-modified melamine resin, and the like; the melamine resin may be a mixed resin of the above resin and a butylated urea resin, a butylated benzoguanamine resin, or the like.
Examples of the silicone include methylphenylpolysiloxane, methylhydrogenpolysiloxane, dimethylpolysiloxane, modified dimethylpolysiloxane, and a mixture thereof; examples of the modification include epoxy modification, alkyl modification, amino modification, alcohol modification, fluorine modification, alkyl aralkyl polyether modification, epoxy polyether modification, alkyl higher alcohol ester modification, polyester modification, acyloxyalkyl modification, halogenated alkyl modification, aminodiol modification, and thio modification.
Examples of the inorganic filler include fine particles of calcium carbonate, kaolin, talc, clay, titanium dioxide, zinc oxide, silica, alumina, magnesium hydroxide, aluminum hydroxide and the like, and among these inorganic fine particles, silica, calcium carbonate and talc are preferred because specific surface area and particle diameter thereof are easily defined to a predetermined size as described below; these microparticles must be porous; that is, the specific surface area of the fine particles is 1 to 1OOOm2In the range of/g; the specific surface area is preferably 10-50Om2In particular, more preferably 100 to 2OOm2(ii)/g; the average particle size of the particle size is in the range of 1-6 μm; the particle size is preferably 2 to 5 μm, more preferably 2.5 to 3.5. mu.m.
The number average molecular weight of the epoxy resin is preferably 2000-3000, and the number average molecular weight of the melamine resin is preferably 500-1000; by having such a number average molecular weight, it is possible to form a coating of the resin and to easily adjust the adhesive strength of the resin coating film to a predetermined range.
The peel strength is a strength obtained by fixing a film layer of a laminate having a width of 1.5cm to a flat plate and peeling off a support at a speed of 50mm/min by a 180 ° method;
the film thickness of the release coating is preferably 0.5-5 μm; when the film thickness is less than 0.5 μm, the release coating film is too thin to be easily formed, and thus productivity is easily lowered; in addition, when the film thickness exceeds 5 μm, further improvement in releasability of the release coating film cannot be observed, and the production cost of the release coating layer tends to increase; in the method for producing a release coating layer described later, the film thickness of the release coating layer is realized by applying a release coating material in a predetermined application amount;
preparing a release coating: preparing 45-60% by mass of an epoxy resin and 40-55% by mass of a melamine resin as resin components; melamine resin functions as a curing agent; preparing a resin release coating by mixing these using methyl ethyl ketone as a solvent;
the release coating of the present invention can be produced by coating the release coating on a support material and curing the coating; as the coating method, there are no particular limitations, and a size press, a blade coater, an air knife coater, a web coater, a brush coater, a curtain coater, a bar coater, a gravure coater, a slit coater, a sprayer, or the like; the curing method and temperature are not particularly limited, and natural curing, a hot air circulating furnace, a hot roller, a ceramic heater, etc. can be mentioned, and the drying temperature is preferably 80-280 ℃, more preferably 100-250 ℃, and particularly preferably 120-200 ℃; and a curing step of curing the resin coating film at 200-330 ℃ for a period of time which varies depending on the thickness of the support, but is preferably in the range of 5 to 60 seconds, more preferably 10 to 30 seconds.
The working principle of the invention is as follows: the film thickness of the release coating is 0.5-5 μm, so that the later-stage stripping performance can be ensured without increasing the cost, and a film cannot be formed because the release coating is too thin; the number average molecular weight of the epoxy resin is preferably 2000-3000, and the number average molecular weight of the melamine resin is preferably 500-1000; by having such a number average molecular weight, it is possible to form a coating of the resin and to easily adjust the adhesive strength of the resin coating film to a predetermined range.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (12)
1. A support material for heat treatment of a liquid crystal polymer film comprises a metal foil (1); the method is characterized in that: at least one surface of the metal foil (1) is provided with a release coating (2), and the release coating (2) is composed of epoxy resin, melamine resin, silicone and inorganic filler.
2. The support material for heat treatment of a liquid crystal polymer film according to claim 1, wherein: the metal foil (1) adopts aluminum foil, and the aluminum foil adopts alloy species with the elastic limit of 140-270 MPa.
3. The support material for heat treatment of a liquid crystal polymer film according to claim 2, wherein: the thickness of the aluminum foil is less than 200 mu m.
4. The support material for heat treatment of a liquid crystal polymer film according to claim 3, wherein: the thickness of the aluminum foil is 10-75 μm.
5. The support material for heat treatment of a liquid crystal polymer film according to claim 1, wherein: one surface of the release coating (2) positioned on the metal foil (1) is set to be a rough surface, the roughness of the rough surface is 1.0-10um, and the thickness of the release coating (2) is 0.5-5 mu m.
6. The support material for heat treatment of a liquid crystal polymer film according to claim 5, wherein: the roughness of the rough surface is 2.0-5.0 μm.
7. The support material for heat treatment of a liquid crystal polymer film according to claim 1, wherein: the epoxy resin is one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, brominated epoxy resin, amine epoxy resin, flexible epoxy resin, hydrogenated bisphenol A epoxy resin, phenoxy resin and brominated phenoxy resin.
8. The support material for heat treatment of a liquid crystal polymer film according to claim 1, wherein: the melamine resin is one or more of methyl etherified melamine resin, butylated urea melamine resin, butylated melamine resin, methylated melamine resin and butanol modified melamine resin.
9. The support material for heat treatment of a liquid crystal polymer film according to claim 1, wherein: the silicone is one or more of methyl phenyl polysiloxane, methyl hydrogen polysiloxane, dimethyl polysiloxane and modified dimethyl polysiloxane.
10. The support material for heat treatment of a liquid crystal polymer film according to claim 1, wherein: the inorganic filler is one or more of calcium carbonate, kaolin, talc, clay, titanium dioxide, zinc oxide, silicon dioxide, aluminum oxide, magnesium hydroxide and aluminum hydroxide.
11. The method for producing a support material for heat treatment of a liquid crystal polymer film according to claim 1, wherein: the method comprises the following steps:
s1: unreeling: selecting a metal foil (1) with the thickness of 50 mu m, and guiding the metal foil (1) through a guide roller (101) when unreeling;
s2: coating: the metal foil (1) passes through an application roller (102), and a release coating is applied on the metal foil (1) through an application mechanism (103);
s3: and (3) curing: when the metal foil (1) coated with the release coating passes through an oven guide roller (104), the metal foil is cured through an oven (105), and the support material (3) with the release coating is continuously obtained;
s4: winding: and winding the obtained support body material (3) with the release coating through a winding mechanism.
12. The method for producing a support material for heat treatment of a liquid crystal polymer film according to claim 11, wherein: the coating weight of the release coating is 1.8g/m2Said release coating comprising a functional group acting asEpoxy resin of the film forming resin and silicone additive accounting for 5-35% of the mass of the epoxy resin, and the metal foil coated with the release coating are subjected to continuous heating and curing treatment in a hot air circulating oven.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102476484A (en) * | 2010-11-25 | 2012-05-30 | 太阳铝株式会社 | Demoulding material for resin matrix substrate and method for producing the same |
| CN108126880A (en) * | 2017-12-20 | 2018-06-08 | 贺州宝兴新材料有限公司 | Resin matrix substrate release materials and its manufacturing method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102476484A (en) * | 2010-11-25 | 2012-05-30 | 太阳铝株式会社 | Demoulding material for resin matrix substrate and method for producing the same |
| CN108126880A (en) * | 2017-12-20 | 2018-06-08 | 贺州宝兴新材料有限公司 | Resin matrix substrate release materials and its manufacturing method |
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Application publication date: 20210810 |