CN108126880A - Resin matrix substrate release materials and its manufacturing method - Google Patents
Resin matrix substrate release materials and its manufacturing method Download PDFInfo
- Publication number
- CN108126880A CN108126880A CN201711388070.9A CN201711388070A CN108126880A CN 108126880 A CN108126880 A CN 108126880A CN 201711388070 A CN201711388070 A CN 201711388070A CN 108126880 A CN108126880 A CN 108126880A
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- CN
- China
- Prior art keywords
- resin
- matrix substrate
- resin matrix
- release materials
- coating film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
- C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09D161/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
- C09D161/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/14—Paints containing biocides, e.g. fungicides, insecticides or pesticides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/20—Metallic substrate based on light metals
- B05D2202/25—Metallic substrate based on light metals based on Al
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Plant Pathology (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The present invention provides a kind of resin matrix substrate release materials and its manufacturing method, which can easily remove when for the manufacture of resin matrix substrate from resin matrix substrate, have excellent fissility.The resin matrix substrate of the present invention release materials (1A) that release materials are manufactures for resin matrix substrate, it is characterized in that, the release materials (1A) have aluminium foil (2) and resin coating film (3), above-mentioned resin coating film (3) is formed in the one or two sides of aluminium foil (2), it is made of epoxy system resin, melamine-based resins and silicone, resin coating film (3) is 1~200g/cm for the adhesion strength of resin matrix substrate.
Description
Technical field
The present invention relates to the resin matrix substrate release materials and its manufacturing method used when manufacturing resin matrix substrate.
Background technology
As one of resin matrix substrate, there is resin base printed base plate, manufacture following carry out.First, arrive resin impregnated
In glass cloth, paper etc., it is then dried the sheet material (hereinafter referred to as prepreg) that semi-solid preparation is made.By the prepreg, copper foil and
The minute surface plate laminated of stainless steel makes multiple thus obtained lamination object accumulations, then lower on it to set hot plate, goes forward side by side
Row pressurization.Then, hot plate, mirror board are removed, lamination object is dismantled, so as to produce by the prepreg after resin solidification and at it
The resin base printed base plate that the copper foil that surface bonds is formed.It should be noted that the at this point, flatness of resin base printed base plate
It is adjusted.In addition, the substrate of only prepreg manufactured under conditions of not lamination copper foil is also by as resin base printed base plate
It uses.
In above-mentioned manufacture, mirror board and prepreg (resin base printed base plate) are bonded by heating pressurization, are being dismantled
During lamination object, there are problems that mirror board is difficult to from manufactured resin base printed base plate stripping.In order to solve this problem, in mirror
Release materials are configured between panel and prepreg to form lamination object.In addition, in patent document 1, proposed as release materials
Following material：The material the one or two sides of aluminium foil be provided with silicone as remover is mixed in epoxy system resin and
The smears of formation or there is provided the smears for being further mixed with rough surface agent as needed and being formed.
Invention content
The present invention is to propose in order to solve the problems, and subject is to provide a kind of resin matrix substrate demoulding
Material and its manufacturing method, the resin matrix substrate release materials can be easily from trees when for the manufacture of resin matrix substrate
Aliphatic radical strippable substrate has excellent fissility.
To realize the above-mentioned technical purpose, the technical solution adopted by the present invention is as follows：
A kind of resin matrix substrate release materials, are used for the manufacture of resin matrix substrate,
It is characterized in that, the resin matrix substrate release materials have aluminium foil and resin coating film,
The resin coating film is formed in the one or two sides of the aluminium foil, by epoxy system resin, melamine-based resins and silicone
Composition,
The resin coating film is 1g/cm~200g/cm for the adhesion strength of the resin matrix substrate；
The melamine-based resins weight percent forms：Function powder 2-5%, inorganic antiseptic 2-5% and melamine tree
The sum of fat 90-96%, each component are 100%；The weight percent of the function powder forms：Tourmaline 7-35%, iron oxygen
Body 12-35%, kaolin 10-20%, silica 5-20%, aluminium oxide 5-20%, calcium oxide 5-20%, polyacrylic acid 2-5%
It is 100% with the sum of rare earth 1-5%, each component, average grain diameter≤1 micron of function powder；The inorganic antiseptic refers to receive
Rice silver system's antimicrobial powder or nano zine oxide.
It further limits, the film thickness of the resin coating film is 0.5 μm~5 μm.
It further limits, in the resin coating film, relative to 100 mass parts epoxy system resins, silicone is 0.07 mass parts
~3 mass parts.
It further limits, further contains selected from SiO2, MgO, Al2O3, BaSO4 and Mg (OH) 2 in the resin coating film
One or more of surface roughening particle.
It further limits, the grain size of the surface roughening particle is 15nm~4 μm.
It further limits, the resin matrix substrate is resin base printed base plate.
It further limits, this method includes following process：
Painting process, aluminium foil one or two sides coating by as host agent epoxy system resin, as the close of curing agent
Amine system resin and as remover silicone form cold coating, formed resin coating film；With
Sintering circuit implements the resin coating film at 125~240 DEG C the sintering processes of 0.5 second~60 seconds.
It further limits, in the painting process, the tree is coated with using one or two sides of the gravure coating process in aluminium foil
Grease coating material.
It further limits, this method includes following process：
Painting process is coated in the one or two sides of aluminium foil by the epoxy system resin as host agent；As the close of curing agent
Amine system resin；Silicone as remover；With the table selected from SiO2, MgO, Al2O3, BaSO4 and Mg (OH) one or more of 2
The cold coating of face roughening particle composition, forms resin coating film；With
Sintering circuit implements the resin coating film at 125~240 DEG C the sintering processes of 0.5 second~60 seconds.
It further limits, the resin matrix substrate is resin base printed base plate.
Specific embodiment
In order to make those skilled in the art that the present invention may be better understood, with reference to embodiment to the technology of the present invention
Scheme further illustrates.
A kind of resin matrix substrate release materials, are used for the manufacture of resin matrix substrate,
It is characterized in that, the resin matrix substrate release materials have aluminium foil and resin coating film,
The resin coating film is formed in the one or two sides of the aluminium foil, by epoxy system resin, melamine-based resins and silicone
Composition,
The resin coating film is 1g/cm~200g/cm for the adhesion strength of the resin matrix substrate；
The melamine-based resins weight percent forms：Function powder 2-5%, inorganic antiseptic 2-5% and melamine tree
The sum of fat 90-96%, each component are 100%；The weight percent of the function powder forms：Tourmaline 7-35%, iron oxygen
Body 12-35%, kaolin 10-20%, silica 5-20%, aluminium oxide 5-20%, calcium oxide 5-20%, polyacrylic acid 2-5%
It is 100% with the sum of rare earth 1-5%, each component, average grain diameter≤1 micron of function powder；The inorganic antiseptic refers to receive
Rice silver system's antimicrobial powder or nano zine oxide.
It further limits, the film thickness of the resin coating film is 0.5 μm~5 μm.
It further limits, in the resin coating film, relative to 100 mass parts epoxy system resins, silicone is 0.07 mass parts
~3 mass parts.
It further limits, further contains selected from SiO2, MgO, Al2O3, BaSO4 and Mg (OH) 2 in the resin coating film
One or more of surface roughening particle.
It further limits, the grain size of the surface roughening particle is 15nm~4 μm.
It further limits, the resin matrix substrate is resin base printed base plate.
It further limits, this method includes following process：
Painting process, aluminium foil one or two sides coating by as host agent epoxy system resin, as the close of curing agent
Amine system resin and as remover silicone form cold coating, formed resin coating film；With
Sintering circuit implements the resin coating film at 125~240 DEG C the sintering processes of 0.5 second~60 seconds.
It further limits, in the painting process, the tree is coated with using one or two sides of the gravure coating process in aluminium foil
Grease coating material.
It further limits, this method includes following process：
Painting process is coated in the one or two sides of aluminium foil by the epoxy system resin as host agent；As the close of curing agent
Amine system resin；Silicone as remover；With the table selected from SiO2, MgO, Al2O3, BaSO4 and Mg (OH) one or more of 2
The cold coating of face roughening particle composition, forms resin coating film；With
Sintering circuit implements the resin coating film at 125~240 DEG C the sintering processes of 0.5 second~60 seconds.
It further limits, the resin matrix substrate is resin base printed base plate.
Resin matrix substrate provided by the invention is described in detail with release materials and its manufacturing method above.Specifically
The explanation of embodiment is merely used to help understand the method and its core concept of the present invention.It should be pointed out that for the art
Those of ordinary skill for, without departing from the principle of the present invention, can also to the present invention carry out it is several improvement and repair
Decorations, these improvement and modification are also fallen within the protection scope of the claims of the present invention.
Claims (10)
1. a kind of resin matrix substrate release materials, are used for the manufacture of resin matrix substrate,
It is characterized in that, the resin matrix substrate release materials have aluminium foil and resin coating film,
The resin coating film is formed in the one or two sides of the aluminium foil, is made of epoxy system resin, melamine-based resins and silicone,
The resin coating film is 1g/cm~200g/cm for the adhesion strength of the resin matrix substrate；
The melamine-based resins weight percent forms：Function powder 2-5%, inorganic antiseptic 2-5% and melamine resin 90-
96%, the sum of each component is 100%；The weight percent of the function powder forms：Tourmaline 7-35%, ferrite 12-
35%th, kaolin 10-20%, silica 5-20%, aluminium oxide 5-20%, calcium oxide 5-20%, polyacrylic acid 2-5% and rare earth
The sum of 1-5%, each component is 100%, average grain diameter≤1 micron of function powder；The inorganic antiseptic refers to nano silver system
Antimicrobial powder or nano zine oxide.
2. resin matrix substrate release materials as described in claim 1, which is characterized in that the film thickness of the resin coating film is
0.5 μm~5 μm.
3. the resin matrix substrate release materials as described in claim 1 or claim 2, which is characterized in that the resin applies
In film, relative to 100 mass parts epoxy system resins, silicone is the mass parts of 0.07 mass parts~3.
4. the resin matrix substrate release materials as described in any one of claim 1 to claim 3, which is characterized in that institute
It states and further contains the rough surface selected from SiO2, MgO, Al2O3, BaSO4 and Mg (OH) one or more of 2 in resin coating film
Change particle.
5. resin matrix substrate release materials as claimed in claim 4, which is characterized in that the grain of the surface roughening particle
Diameter is 15nm~4 μm.
6. such as resin matrix substrate release materials according to any one of claims 1 to 5, which is characterized in that institute
Resin matrix substrate is stated as resin base printed base plate.
7. it is claim 1 to described in any one of claim 3 a kind of manufacturing method of resin matrix substrate release materials
Resin matrix substrate release materials manufacturing method, which is characterized in that
This method includes following process：
Painting process is coated in the one or two sides of aluminium foil by the epoxy system resin as host agent, the melamine system as curing agent
Resin and as remover silicone form cold coating, formed resin coating film；With
Sintering circuit implements the resin coating film at 125~240 DEG C the sintering processes of 0.5 second~60 seconds.
It is claim 4 or the resin base described in claim 5 8. a kind of manufacturing method of resin matrix substrate release materials
The manufacturing method of substrate release materials, which is characterized in that
This method includes following process：
Painting process is coated in the one or two sides of aluminium foil by the epoxy system resin as host agent；Melamine system as curing agent
Resin；Silicone as remover；With it is thick selected from the surface of SiO2, MgO, Al2O3, BaSO4 and Mg (OH) one or more of 2
The cold coating of roughening particle composition, forms resin coating film；With
Sintering circuit implements the resin coating film at 125~240 DEG C the sintering processes of 0.5 second~60 seconds.
9. such as claim 7 or the manufacturing method of resin matrix substrate release materials according to any one of claims 8, which is characterized in that
In the painting process, the cold coating is coated with using one or two sides of the gravure coating process in aluminium foil.
10. the manufacturing method of the resin matrix substrate release materials as described in any one of claim 7 to claim 9,
It is characterized in that, the resin matrix substrate is resin base printed base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711388070.9A CN108126880A (en) | 2017-12-20 | 2017-12-20 | Resin matrix substrate release materials and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711388070.9A CN108126880A (en) | 2017-12-20 | 2017-12-20 | Resin matrix substrate release materials and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108126880A true CN108126880A (en) | 2018-06-08 |
Family
ID=62391239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711388070.9A Withdrawn CN108126880A (en) | 2017-12-20 | 2017-12-20 | Resin matrix substrate release materials and its manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN108126880A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113231290A (en) * | 2021-06-10 | 2021-08-10 | 上海联净复合材料技术有限公司 | Support material for heat treatment of liquid crystal polymer film and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101565534A (en) * | 2009-03-24 | 2009-10-28 | 河北工业大学 | Melamine material, preparation method and application thereof |
| CN102476484A (en) * | 2010-11-25 | 2012-05-30 | 太阳铝株式会社 | Demoulding material for resin matrix substrate and method for producing the same |
| CN102762313A (en) * | 2010-02-26 | 2012-10-31 | 住友轻金属工业株式会社 | Conductive precoated aluminum alloy sheet |
| CN103320011A (en) * | 2013-06-17 | 2013-09-25 | 哈尔滨工业大学 | Coating for electroless copper plating pretreatment of carbon fiber reinforced resin matrix composite material and technology |
| CN107163771A (en) * | 2017-07-04 | 2017-09-15 | 江苏时代鑫新环保科技有限公司 | A kind of artificial stone release materials and its preparation method and application |
-
2017
- 2017-12-20 CN CN201711388070.9A patent/CN108126880A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101565534A (en) * | 2009-03-24 | 2009-10-28 | 河北工业大学 | Melamine material, preparation method and application thereof |
| CN102762313A (en) * | 2010-02-26 | 2012-10-31 | 住友轻金属工业株式会社 | Conductive precoated aluminum alloy sheet |
| CN102476484A (en) * | 2010-11-25 | 2012-05-30 | 太阳铝株式会社 | Demoulding material for resin matrix substrate and method for producing the same |
| CN103320011A (en) * | 2013-06-17 | 2013-09-25 | 哈尔滨工业大学 | Coating for electroless copper plating pretreatment of carbon fiber reinforced resin matrix composite material and technology |
| CN107163771A (en) * | 2017-07-04 | 2017-09-15 | 江苏时代鑫新环保科技有限公司 | A kind of artificial stone release materials and its preparation method and application |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113231290A (en) * | 2021-06-10 | 2021-08-10 | 上海联净复合材料技术有限公司 | Support material for heat treatment of liquid crystal polymer film and manufacturing method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180608 |
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| WW01 | Invention patent application withdrawn after publication |